WO2012050307A3 - Appareil et procédé de sciage d'un lingot monocristallin - Google Patents
Appareil et procédé de sciage d'un lingot monocristallin Download PDFInfo
- Publication number
- WO2012050307A3 WO2012050307A3 PCT/KR2011/006874 KR2011006874W WO2012050307A3 WO 2012050307 A3 WO2012050307 A3 WO 2012050307A3 KR 2011006874 W KR2011006874 W KR 2011006874W WO 2012050307 A3 WO2012050307 A3 WO 2012050307A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- single crystal
- sawing
- crystal ingot
- ingot
- sawing single
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11832694.1A EP2627488A2 (fr) | 2010-10-12 | 2011-09-16 | Appareil et procédé de sciage d'un lingot monocristallin |
CN2011800486457A CN103153564A (zh) | 2010-10-12 | 2011-09-16 | 用于锯切单晶锭的设备和方法 |
JP2013533759A JP2013539923A (ja) | 2010-10-12 | 2011-09-16 | 単結晶インゴット切断装置及び単結晶インゴットの切断方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100099111A KR20120037576A (ko) | 2010-10-12 | 2010-10-12 | 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법 |
KR10-2010-0099111 | 2010-10-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012050307A2 WO2012050307A2 (fr) | 2012-04-19 |
WO2012050307A3 true WO2012050307A3 (fr) | 2012-06-07 |
Family
ID=45924143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/006874 WO2012050307A2 (fr) | 2010-10-12 | 2011-09-16 | Appareil et procédé de sciage d'un lingot monocristallin |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120085333A1 (fr) |
EP (1) | EP2627488A2 (fr) |
JP (1) | JP2013539923A (fr) |
KR (1) | KR20120037576A (fr) |
CN (1) | CN103153564A (fr) |
WO (1) | WO2012050307A2 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101279681B1 (ko) * | 2010-09-29 | 2013-06-27 | 주식회사 엘지실트론 | 단결정 잉곳 절단장치 |
EP2711978A1 (fr) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Méthode de fabrication de plaquettes |
EP2944444A1 (fr) | 2014-05-16 | 2015-11-18 | Meyer Burger AG | Procédé de traitement de plaque |
CN109421185B (zh) * | 2017-09-05 | 2021-05-28 | 上海新昇半导体科技有限公司 | 一种晶棒的切割方法及切割装置 |
KR102149091B1 (ko) * | 2019-01-09 | 2020-08-27 | 에스케이실트론 주식회사 | 와이어 쏘잉 장치용 정온 배쓰 및 이를 포함하는 와이어 쏘잉 장치 |
CN110733139B (zh) * | 2019-10-14 | 2021-05-28 | 西安奕斯伟硅片技术有限公司 | 一种晶棒切割装置及方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100184046A1 (en) * | 2008-11-12 | 2010-07-22 | Caris Mpi, Inc. | Methods and systems of using exosomes for determining phenotypes |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2673544B2 (ja) * | 1988-06-14 | 1997-11-05 | 株式会社日平トヤマ | 脆性材料の切断方法 |
JP2666436B2 (ja) * | 1988-11-29 | 1997-10-22 | 住友金属工業株式会社 | ワイヤソーによる切断加工方法 |
JP2516717B2 (ja) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | ワイヤソ―及びその切断方法 |
JPH07266331A (ja) * | 1994-03-30 | 1995-10-17 | Hitachi Chem Co Ltd | 単結晶の切断方法 |
JP2885270B2 (ja) * | 1995-06-01 | 1999-04-19 | 信越半導体株式会社 | ワイヤーソー装置及びワークの切断方法 |
JPH0985737A (ja) * | 1995-09-22 | 1997-03-31 | Toray Eng Co Ltd | ワイヤ式切断装置 |
JPH09200734A (ja) * | 1996-01-12 | 1997-07-31 | Fuji Photo Film Co Ltd | 監視装置 |
JPH1085737A (ja) * | 1996-07-23 | 1998-04-07 | Mitsuhiro Fujiwara | 浮遊物除去装置 |
JPH10217036A (ja) * | 1997-01-29 | 1998-08-18 | Komatsu Electron Metals Co Ltd | 半導体結晶棒の切断装置及び切断方法 |
JP3637740B2 (ja) * | 1997-08-25 | 2005-04-13 | 三菱住友シリコン株式会社 | ワイヤソーおよびインゴット切断方法 |
DE19841492A1 (de) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Abtrennen einer Vielzahl von Scheiben von einem sprödharten Werkstück |
JP3734018B2 (ja) * | 1999-01-20 | 2006-01-11 | 信越半導体株式会社 | ワイヤソーおよび切断方法 |
DE19959414A1 (de) * | 1999-12-09 | 2001-06-21 | Wacker Chemie Gmbh | Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück |
DE60033574T2 (de) * | 2000-05-31 | 2007-11-15 | Memc Electronic Materials S.P.A. | Drahtsäge und verfahren zum gleichzeitigen schneiden von halbleiterbarren |
DE10055286A1 (de) * | 2000-11-08 | 2002-05-23 | Freiberger Compound Mat Gmbh | Vorrichtung und Verfahren zum Trennen von Werkstoffen |
JP3767382B2 (ja) * | 2001-01-09 | 2006-04-19 | 株式会社デンソー | ワイヤソーによる切断方法およびそれに用いる切断装置 |
DE10122628B4 (de) * | 2001-05-10 | 2007-10-11 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
JP2003159650A (ja) * | 2001-11-22 | 2003-06-03 | Takatori Corp | ワイヤソー用スラリータンク |
US6889684B2 (en) * | 2002-11-06 | 2005-05-10 | Seh America, Inc. | Apparatus, system and method for cutting a crystal ingot |
US7306508B2 (en) * | 2003-10-27 | 2007-12-11 | Mitsubishi Denki Kabushiki Kaisha | Multi-wire saw |
US7878883B2 (en) * | 2006-01-26 | 2011-02-01 | Memc Electronics Materials, Inc. | Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control |
JP2007301687A (ja) * | 2006-05-12 | 2007-11-22 | Naoetsu Electronics Co Ltd | ワーク切断装置 |
JP4965949B2 (ja) * | 2006-09-22 | 2012-07-04 | 信越半導体株式会社 | 切断方法 |
DE102006060358A1 (de) * | 2006-12-20 | 2008-06-26 | Siltronic Ag | Vorrichtung und Verfahren zum Zersägen eines Werkstücks |
JP4816511B2 (ja) * | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | 切断方法およびワイヤソー装置 |
JP5003294B2 (ja) * | 2007-06-08 | 2012-08-15 | 信越半導体株式会社 | 切断方法 |
WO2009078130A1 (fr) * | 2007-12-19 | 2009-06-25 | Shin-Etsu Handotai Co., Ltd. | Scie à fil et procédé de découpe d'une pièce par scie à fil |
JP2010029955A (ja) * | 2008-07-25 | 2010-02-12 | Shin Etsu Handotai Co Ltd | ワイヤソーの運転再開方法及びワイヤソー |
-
2010
- 2010-10-12 KR KR1020100099111A patent/KR20120037576A/ko not_active Application Discontinuation
-
2011
- 2011-09-16 JP JP2013533759A patent/JP2013539923A/ja active Pending
- 2011-09-16 EP EP11832694.1A patent/EP2627488A2/fr not_active Withdrawn
- 2011-09-16 CN CN2011800486457A patent/CN103153564A/zh active Pending
- 2011-09-16 WO PCT/KR2011/006874 patent/WO2012050307A2/fr active Application Filing
- 2011-10-12 US US13/272,161 patent/US20120085333A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100184046A1 (en) * | 2008-11-12 | 2010-07-22 | Caris Mpi, Inc. | Methods and systems of using exosomes for determining phenotypes |
Non-Patent Citations (4)
Title |
---|
CAI ET AL.: "ETV1 is a novel androgen receptor-regulated gene that mediates prostate cancer cell invasion.", MOL ENDOCRINOL, vol. 21, no. 8, August 2007 (2007-08-01), pages 1835 - 1846, XP008162981 * |
CHI ET AL.: "ETV1 is a lineage-specific survival factor in GIST and cooperates with KIT in oncogenesis.", NATURE, vol. 467, no. 7317, 3 October 2010 (2010-10-03), pages 849 - 853, XP008163039 * |
KWON ET AL.: "Changes in the structure and function of ICC networks in ICC hyperplasia and gastrointestinal stromal tumors.", GASTROENTEROLOGY, vol. 136, no. 2, February 2009 (2009-02-01), pages 630 - 639, XP025999268 * |
RUBIN.: "Bioinformatic mining of gene expression datasets identifies ETV1 as a critical regulator of oncogenesis in gastrointestinal stromal tumors.", CANCER CELL, vol. 18, no. 5, 16 November 2010 (2010-11-16), pages 407 - 408, XP008163038 * |
Also Published As
Publication number | Publication date |
---|---|
KR20120037576A (ko) | 2012-04-20 |
CN103153564A (zh) | 2013-06-12 |
EP2627488A2 (fr) | 2013-08-21 |
JP2013539923A (ja) | 2013-10-28 |
US20120085333A1 (en) | 2012-04-12 |
WO2012050307A2 (fr) | 2012-04-19 |
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