WO2012049939A1 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
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- WO2012049939A1 WO2012049939A1 PCT/JP2011/070964 JP2011070964W WO2012049939A1 WO 2012049939 A1 WO2012049939 A1 WO 2012049939A1 JP 2011070964 W JP2011070964 W JP 2011070964W WO 2012049939 A1 WO2012049939 A1 WO 2012049939A1
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- WIPO (PCT)
- Prior art keywords
- adhesive
- mass
- semi
- meth
- temperature increase
- Prior art date
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- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
- C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
- C08G18/6225—Polymers of esters of acrylic or methacrylic acid
- C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
- C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
- C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
- C08G18/8029—Masked aromatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a method for manufacturing an electronic component including dicing a wafer using an adhesive sheet.
- One method of manufacturing electronic components includes a bonding step of attaching an electronic component assembly having a plurality of circuit patterns formed on a wafer or an insulating substrate to an adhesive sheet, and dicing the electronic component assembly with a dicing blade.
- a dicing process for forming a semiconductor chip, a pick-up process for picking up the cut chip from the adhesive sheet after reducing the adhesive force between the adhesive sheet and the electronic component assembly by irradiating ultraviolet rays from the adhesive sheet side, and the picked-up chip There is known a manufacturing method having a fixing step of fixing a chip to a lead frame or the like with an adhesive after applying an adhesive to the bottom surface of the substrate.
- Patent Documents 1 and 2 A method using an adhesive sheet (adhesive layer or die attach film integrated sheet) has been proposed (Patent Documents 1 and 2).
- a paste-like adhesive is applied to the semiconductor wafer side in advance, and this paste-like adhesive is semi-cured into a sheet by irradiation or heating to form an adhesive semi-cured layer, which is then applied to the adhesive sheet.
- a method of obtaining a chip with an adhesive semi-cured layer attached by performing a dicing process is also known.
- the adhesive application process after dicing can be omitted, and the thickness control of the adhesive part and the suppression of protrusion can be easily performed. There is an advantage of being.
- the photopolymerization initiator which is a low molecular weight component contained in the adhesive constituting the adhesive layer is In some cases, the chip migrates to the adhesive semi-cured layer side, and the chip causes poor adhesion to the lead frame or the like. Specifically, when the chip with the adhesive semi-cured layer obtained after the dicing process and the pick-up process is bonded to a lead frame, molded with a sealing resin, and heated at around 260 ° C., the lead frame and the adhesive Peeling occurs between the semi-cured layer, and as a result, the yield may be reduced in the semiconductor manufacturing process.
- This invention is made
- this invention relates to the manufacturing method of the following electronic component.
- An adhesive semi-cured layer forming step in which a paste-like adhesive is applied to the entire back surface of the wafer (i.e., a non-circuit-formed surface) and irradiated or heated to semi-cur the paste-like adhesive into a sheet, formed on the wafer
- Adhesion process to attach and fix the adhesive semi-cured layer and ring frame to the adhesive layer of the adhesive sheet, dicing process to dice the wafer together with the adhesive semi-cured layer with a dicing blade to make a semiconductor chip
- a pressure-sensitive adhesive comprising a pick-up process for picking up a chip with a semi-cured adhesive layer from an adhesive layer, wherein the adhesive sheet has a base film and an adhesive layer laminated on one surface of the base film, and constitutes an adhesive layer
- the mass after the temperature increase represents the mass of the photopolymerization initiator at each temperature when the temperature was increased from 23 ° C. to 500 ° C. at a temperature increase rate of 10 ° C./min
- Photoinitiator is ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime), 2,4,6-trimethylbenzoyl -Diphenyl-phosphine oxide and 2-hydroxy-1- ⁇ 4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl ⁇ -2-methyl-propan-1-one; (1) The manufacturing method of the electronic component as described. (3).
- the pressure-sensitive adhesive is 100 parts by weight of a (meth) acrylic acid ester polymer, 5 parts by weight or more and 200 parts by weight or less of an ultraviolet polymerizable compound, 0.5 part by weight or more and 20 parts by weight or less of a polyfunctional isocyanate curing agent, and a photopolymerization initiator 0. having 1 part by mass or more and 20 parts by weight, (1) or (2) method of manufacturing an electronic component according. (4).
- the anti-contamination property for the adhesive semi-cured layer formed on the semiconductor wafer side is improved by setting the adhesive constituting the adhesive layer of the adhesive sheet to a specific composition.
- poor adhesion between the chip and the lead frame or the like can be suppressed.
- a monomer unit means a structural unit derived from a monomer. “Parts” and “%” are based on mass.
- (Meth) acrylate is a general term for acrylate and methacrylate.
- a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.
- the method for manufacturing an electronic component according to the present invention includes the following procedures (1) to (4).
- An adhesive semi-cured layer forming step in which a paste-like adhesive is applied to the entire back surface of the wafer and irradiated or heated to semi-cur the paste-like adhesive into a sheet;
- Affixing step of adhering and fixing the adhesive semi-cured layer and ring frame formed on the wafer to the adhesive layer of the adhesive sheet;
- a pickup step of picking up the chip with the adhesive semi-cured layer from the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet after irradiation with radiation.
- the adhesive semi-cured layer is typically formed by applying a paste adhesive on the back surface of a wafer, that is, a non-circuit-forming surface for bonding with a lead frame or a circuit board, and irradiating or heating the paste adhesive. It can be formed by semi-curing into a sheet.
- Paste adhesives constituting the adhesive semi-cured layer include (meth) acrylic acid ester, polyamide, polyethylene, polysulfone, epoxy resin, polyimide, polyamic acid, silicone resin, phenol resin, rubber, fluoro rubber, and fluoro resin. There are a single substance, a mixture thereof, and a copolymer. It is preferable to contain an epoxy resin and / or a (meth) acrylic acid ester from the viewpoint of reliability of bonding with the chip. You may add a photoinitiator, a heat polymerization initiator, an antistatic agent, a crosslinking agent, a crosslinking accelerator, a filler, etc. to a paste adhesive.
- the method of applying the paste adhesive on the entire back surface of the wafer is not particularly limited.
- a gravure coater, comma coater, bar coater, knife coater, roll coater, letterpress printing, intaglio printing, planographic printing, flexographic printing, offset printing, Screen printing, spraying, spin coating, etc. can be adopted.
- a method of forming a semi-cured adhesive layer by applying a paste-like adhesive and then semi-curing is irradiation or heating.
- the kind of radiation is not specifically limited, A well-known thing can be used.
- the ultraviolet light source is not particularly limited, and known ones can be used. Examples of the ultraviolet light source include black light, low pressure mercury lamp, high pressure mercury lamp, super high pressure mercury lamp, metal halide lamp, and excimer lamp. Irradiation light amount of the ultraviolet is not particularly limited, can be appropriately selected by the design of the paste adhesive, typically 100 mJ / cm 2 or more 5000 mJ / cm less than 2 are preferred.
- the heating temperature is not particularly limited and can be appropriately selected depending on the design of the paste adhesive, but generally 60 ° C. or more and less than 250 ° C. is preferable. If the heating temperature is too low, curing of the paste adhesive will be insufficient and the pick-up property tends to be inferior. If the heating temperature is too high, the curing of the paste adhesive will progress too much and the adhesive strength will decrease. is there.
- the heating time is not particularly limited and can be appropriately selected depending on the design of the paste-like adhesive. In general, it is preferably 10 seconds or more and less than 30 minutes.
- the thickness of the adhesive semi-cured layer is preferably 3 ⁇ m to 100 ⁇ m, and particularly preferably 5 ⁇ m to 20 ⁇ m.
- the affixing step is a step of adhering and fixing the adhesive semi-cured layer and the ring frame formed on the wafer to the adhesive layer of the adhesive sheet, and can generally be performed using a tape mounter device equipped with a roller. it can.
- the pressure-sensitive adhesive sheet used in the attaching step has a base film and a pressure-sensitive adhesive layer laminated on one surface of the base film.
- the base film is not particularly limited, and a known resin material can be used. Specifically, polyvinyl chloride, polyethylene terephthalate, ethylene-vinyl acetate copolymer, ethylene-acrylic acid-acrylic acid ester film, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, propylene copolymer, ethylene- Examples include acrylic acid copolymers and ionomer resins obtained by crosslinking ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid- (meth) acrylic acid ester copolymers, etc. with metal ions. .
- the base film may be a mixture, copolymer or laminate of these resins.
- a propylene copolymer is preferable as the base film.
- a propylene-based copolymer By employing a propylene-based copolymer, chips generated when the semiconductor wafer is cut can be suppressed.
- the propylene-based copolymer include a random copolymer of propylene and other components, a block copolymer of propylene and other components, and an alternating copolymer of propylene and other components.
- other components include ⁇ -olefins such as ethylene, 1-butene, 1-pentene, 1-hexene and 1-heptene, copolymers composed of at least two kinds of ⁇ -olefins, and styrene-diene copolymers. Can be mentioned. Of these, 1-butene is preferred.
- Examples of the method for polymerizing the propylene-based copolymer include a solvent polymerization method, a bulk polymerization method, a gas phase polymerization method, a sequential polymerization method, and the like.
- a homopolymer of ⁇ -olefin or a random copolymer of propylene with a small amount of ethylene and / or ⁇ -olefin is produced in the second and subsequent stages.
- a stepwise sequential polymerization process is preferred.
- the base film is preferably subjected to antistatic treatment.
- the antistatic treatment includes (1) a treatment for adding an antistatic agent to the composition constituting the base film, (2) a treatment for applying the antistatic agent to the adhesive layer side surface of the base film, (3) There is a charging process by corona discharge.
- Antistatic agents include quaternary amine salt monomers.
- Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p-dimethyl.
- the adhesive layer is formed by applying an adhesive on the base film.
- the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer contains a (meth) acrylic acid ester copolymer, an ultraviolet polymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator.
- the (meth) acrylic acid ester copolymer is a copolymer of only a monomer of (meth) acrylic acid ester, or a copolymer of a monomer of (meth) acrylic acid ester and a vinyl compound monomer. It is.
- Examples of the (meth) acrylic acid ester monomer include butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2- Ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl ( (Meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acryl
- a functional group having one or more functional groups such as a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, or a (phosphite) ester group Contains monomers.
- Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
- Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
- Examples of the monomer having an amide group include (meth) acrylamide.
- Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.
- Examples of the monomer having a methylol group include N-methylolacrylamide.
- Methods for producing the (meth) acrylic acid ester copolymer include emulsion polymerization and solution polymerization).
- UV polymerizable compound examples include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene.
- Glycol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, cyanuric acid triethyl acrylate, commercially available oligoester acrylate, and the like are used.
- Urethane acrylate oligomers can also be used as the ultraviolet polymerizable compound.
- Urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylene diisocyanate, 1,4-
- the terminal isocyanate urethane prepolymer obtained by reacting xylene diisocyanate, diphenylmethane 4,4-diisocyanate, trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate and the like is used for (meth) acrylate having a hydroxy group, (Meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate, pentaerythr
- UV-polymerizable compound urethane acrylate oligomer having 4 or more vinyl groups can sufficiently cure the UV-curable adhesive by UV irradiation, and the adhesive sheet and the adhesive semi-cured layer can be easily peeled, It is preferable because good pickup properties can be obtained.
- the blending amount of the ultraviolet polymerizable compound is preferably 5 parts by mass or more and 200 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer. If the blending amount of the UV-polymerizable compound is too small, the adhesive semi-cured layer is difficult to peel off from the pressure-sensitive adhesive sheet after irradiation, and a problem relating to the pick-up property of the semiconductor chip is likely to occur. If the amount of the UV-polymerizable compound is too large, picking up of the glue during dicing is likely to cause pick-up failure, and a minute adhesive residue due to a reaction residue is generated and the adhesive semi-cured layer is contaminated. After bonding the semiconductor chip to which the hardened layer is adhered on the lead frame, adhesion failure during heating is likely to occur.
- the polyfunctional isocyanate curing agent has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.
- Aromatic polyisocyanates include, for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6- Tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 ”-Triphenylmethane triisocyanate, ⁇ , ⁇ ′-diisocyanate-1,3-dimethylbenzene, ⁇ , ⁇ ′-diisocyanate-1,4-dimethylbenzene, ⁇ , ⁇ ′-diisocyanate-1,4-diethylbenzene
- aliphatic polyisocyanate examples include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2 4,4-trimethylhexamethylene diisocyanate.
- Examples of the alicyclic polyisocyanate include 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2, There are 4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylene bis (cyclohexyl isocyanate), 1,4-bis (isocyanate methyl) cyclohexane and 1,4-bis (isocyanate methyl) cyclohexane.
- the blending ratio of the polyfunctional isocyanate curing agent is preferably 0.5 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester copolymer, and the lower limit is 1.0 part by mass or more and the upper limit is Is more preferably 10 parts by mass or less. If the polyfunctional isocyanate curing agent is 0.5 parts by mass or more, since the adhesive strength is not too strong, the occurrence of pickup failure can be suppressed. If the polyfunctional isocyanate curing agent is 20 parts by mass or less, the adhesive strength is not too low, so that the retention of the semiconductor chip is maintained during dicing.
- the temperature at which the mass reduction rate is 10% is 250 ° C.
- the chip with the adhesive semi-cured layer obtained after dicing and picking up is bonded to the lead frame, molded with sealing resin, and around 260 ° C.
- the adhesion failure between the lead frame and the adhesive semi-cured layer can be suppressed.
- the blending amount of the photopolymerization initiator is preferably 0.1 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic acid ester polymer. If the amount is too small, the adhesive semi-cured layer cannot be easily peeled off from the pressure-sensitive adhesive sheet after irradiation, and the pick-up property of the semiconductor chip tends to be lowered. If this ratio is too high, contamination of the adhesive semi-cured layer cannot be suppressed by bleeding out to the surface of the adhesive layer, and after mounting the semiconductor chip with the adhesive semi-cured layer on the lead frame, it adheres when heated. It tends to cause defects.
- Additives such as release-imparting agents represented by silicone polymers, softeners, anti-aging agents, fillers, UV absorbers and light stabilizers are added to the pressure-sensitive adhesive as long as they do not affect other materials. can do.
- the thickness of the adhesive layer is preferably 3 ⁇ m or more and 100 ⁇ m, and particularly preferably 5 ⁇ m or more and 20 ⁇ m or less.
- the dicing process is a process of cutting the silicon wafer together with the semi-cured adhesive layer into a semiconductor chip by rotating a dicing blade containing diamond abrasive grains at high speed using a dicing apparatus.
- a dicing apparatus and dicing conditions that are generally used can be used.
- the pick-up step reduces the adhesive force between the adhesive layer and the adhesive semi-cured layer by irradiating the adhesive layer of the adhesive sheet with radiation, and peels the semiconductor chip to which the adhesive semi-cured layer is attached from the adhesive layer. It is a process.
- the kind of radiation is not specifically limited, A well-known thing can be used.
- examples of the ultraviolet ray source include black light, low pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, metal halide lamp, and excimer lamp.
- Irradiation light amount of the ultraviolet is not particularly limited, it can be appropriately selected according to the design of the pressure-sensitive adhesive, in general preferably less than 5 mJ / cm 2 or more 1000 mJ / cm 2. This is because when the amount of irradiation light is small, the curing of the pressure-sensitive adhesive is insufficient and the pick-up property tends to be inferior, and when the amount of irradiation light is large, workability deteriorates due to the prolonged UV irradiation time.
- a pickup device or a die bonding device is generally used.
- the method for manufacturing an electronic component according to this embodiment uses the above-described pressure-sensitive adhesive sheet, contamination of the adhesive semi-cured layer can be reduced, resulting in poor adhesion between the chip and the lead frame and the like.
- the semiconductor chip with an adhesive semi-cured layer can be easily peeled off and picked up from the pressure-sensitive adhesive sheet in the above (4) pick-up process, and the occurrence of chip skipping is reduced in the above-mentioned (3) dicing process. can do.
- the base film used was a propylene copolymer (product number: X500F) manufactured by Sun Allomer in all of the Examples and Comparative Examples.
- This film has an MFR (melt flow rate) value of 7.5 g / 10 min, a density of 0.89 g / cm 3 , and a thickness of 80 ⁇ m.
- the pressure-sensitive adhesive layer was formed using a pressure-sensitive adhesive containing a (meth) acrylic acid ester copolymer, an ultraviolet polymerizable compound, a polyfunctional isocyanate curing agent and a photopolymerization initiator described below.
- A-1 SK Dyne 1496 manufactured by Soken Chemical Co., Ltd .; a copolymer of 96% 2-ethylhexyl acrylate and 4% 2-hydroxyethyl acrylate, which can be obtained by solution polymerization.
- A-2 Acrylic rubber AR53L manufactured by Nippon Zeon Co., Ltd .; a copolymer of 40% ethyl acrylate, 23% butyl acrylate, and 37% methoxyethyl acrylate, and is obtained by emulsion polymerization.
- B-1 UN-3320HS manufactured by Negami Kogyo Co., Ltd .: Diphoretaerythritol pentaacrylate was reacted with isophorone diisocyanate trimer, and the number of vinyl groups was 15.
- B-2 Shin-Nakamura Chemical Co., Ltd.
- A-TMPT trimethylolpropane triacrylate, having 3 vinyl groups.
- C-1 Coronate L-45E manufactured by Nippon Polyurethane; Trimethylolpropane adduct of 2,4-tolylene diisocyanate.
- D-1 IRGACURE OXE02 manufactured by BASF Japan; ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime).
- the temperature at which the mass reduction rate is 10% is 320 ° C.
- D-2 LUCIRIN TPO manufactured by BASF Japan; 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.
- the temperature at which the mass reduction rate becomes 10% is 270 ° C.
- D-3 IRGACURE127 manufactured by BASF Japan; 2-hydroxy-1- ⁇ 4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl ⁇ -2-methyl-propan-1-one. The temperature at which the mass reduction rate is 10% is 275 ° C.
- D-4 IRGACURE 379 manufactured by BASF Japan; 2-dimethylamino-2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-one. The temperature at which the mass reduction rate becomes 10% is 265 ° C.
- D-5 IRGACURE651 manufactured by BASF Japan Ltd .; benzyldimethyl ketal. The temperature at which the mass reduction rate becomes 10% is 185 ° C.
- the pressure-sensitive adhesive was coated on a polyethylene terephthalate separator film so that the thickness of the pressure-sensitive adhesive layer after drying was 10 ⁇ m.
- This pressure-sensitive adhesive layer was laminated on a base film and aged at 40 ° C. for 7 days to obtain a pressure-sensitive adhesive sheet with a separator film.
- Adhesive semi-cured layer forming step Paste adhesive mainly composed of epoxy resin and acrylic ester is screened on the back surface of a silicon wafer having a diameter of 8 inches and a thickness of 0.1 mm on which a dummy circuit pattern is formed. The entire surface was applied by printing, irradiated with ultraviolet rays at an irradiation light quantity of 1000 mJ / cm 2 and semi-cured into a sheet having a thickness of 30 ⁇ m.
- Affixing step The adhesive semi-cured layer and the ring frame formed on the back surface of the silicon wafer were affixed and fixed to the adhesive layer of the adhesive sheet.
- Dicing step The silicon wafer was cut into 9 mm ⁇ 9 mm semiconductor chips together with the adhesive semi-cured layer with a dicing blade.
- the dicing process was performed with the following apparatus and conditions.
- Dicing machine DAD341 manufactured by DISCO Dicing blade: NBC-ZH205O-27HEEE made by DISCO Dicing blade shape: outer diameter 55.56 mm, blade width 35 ⁇ m, inner diameter 19.05 mm
- Dicing blade feed rate 50 mm / sec.
- Cutting depth into adhesive sheet 15 ⁇ m Cutting water temperature: 25 ° C
- Cutting water volume 1.0 L / min (4)
- Pickup process 150 mJ / cm 2 of ultraviolet light was irradiated with a high-pressure mercury lamp, and a chip with an adhesive semi-cured layer was picked up from the adhesive layer. The pickup process was performed with the following equipment and conditions.
- Pickup device CAP-300II manufactured by Canon Machinery Needle pin shape: 250 ⁇ mR Needle pin push-up height: 0.5mm Expanding amount: 8mm
- Chip retention was evaluated by the residual ratio of the semiconductor chips held on the adhesive sheet after the dicing process. ⁇ (excellent): Chip skipping is less than 5%. ⁇ (Good): Chip skipping is 5% or more and less than 10%. X (impossible): Chip jump is 10% or more.
- the outgas amount of the adhesive semi-cured layer was measured.
- the adhesive semi-cured layer was attached to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. After storage for 2 weeks, the adhesive semi-cured layer was peeled off from the pressure-sensitive adhesive sheet after irradiation with 500 mJ / cm 2 of ultraviolet light with a high-pressure mercury lamp. It was assessed outgassing from the photopolymerization initiator that generates from the peel adhesive semi-cured layer.
- the amount of outgas was measured by sealing 3 mg of the peeled adhesive semi-cured layer in an outgas measurement vial, holding it at 250 ° C. for 30 minutes using a headspace sampler, and then introducing it into GC-MS.
- Table 1 shows the composition and evaluation results of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer.
- the numerical value representing the composition of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is part by mass.
- the anti-contamination property for the adhesive semi-cured layer formed on the semiconductor wafer side can be improved, Excellent chip retention and pick-up performance.
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Abstract
Description
一方、予め半導体ウエハ側にペースト状接着剤を塗布し、このペースト状接着剤を放射線照射又は加熱によりシート状に半硬化させて接着剤半硬化層を形成しておき、これを粘着シートに貼り合わせてダイシング工程を行い、接着剤半硬化層が付着したチップを得る方法も知られている。
多層粘着シート、もしくは、予め接着剤半硬化層を形成した半導体ウエハを用いることにより、ダイシング後の接着剤の塗布工程を省略することができるとともに、接着剤部分の厚み制御やはみ出し抑制が容易であるという利点がある。
(1).ウエハの裏面(すなわち回路非形成面)にペースト状接着剤を全面塗布して放射線照射又は加熱してペースト状接着剤をシート状に半硬化させる接着剤半硬化層形成工程、ウエハに形成された接着剤半硬化層とリングフレームを粘着シートの粘着層に貼り付けて固定する貼付工程、ダイシングブレードでウエハを接着剤半硬化層ごとダイシングして半導体チップにするダイシング工程、放射線を照射した後に接着剤半硬化層付きチップを粘着層からピックアップするピックアップ工程を含み、粘着シートが基材フィルムと、基材フィルムの一方の面に積層された粘着層とを有し、粘着層を構成する粘着剤が(メタ)アクリル酸エステル共重合体と紫外線重合性化合物と多官能イソシアネート硬化剤と光重合開始剤を有し、
光重合開始剤が、次式:
質量減少率={(昇温前質量-昇温後質量)/(昇温前質量)}×100(%)
(式中、
昇温前質量は25℃における光重合開始剤の質量を表し、
昇温後質量は昇温速度10℃/分で23℃から500℃まで昇温させた際の各温度における光重合開始剤の質量を表す)
により算出した質量減少率が10%となる温度が250℃以上のものである、電子部品の製造方法。
(2).光重合開始剤がエタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド、及び2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]-フェニル}-2-メチル-プロパン-1-オンである、(1)記載の電子部品の製造方法。
(3).粘着剤が(メタ)アクリル酸エステル重合体100質量部と紫外線重合性化合物5質量部以上200質量部以下と多官能イソシアネート硬化剤0.5質量部以上20質量部以下と光重合開始剤0.1質量部以上20質量部以下を有する、(1)又は(2)記載の電子部品の製造方法。
(4).接着剤半硬化層形成工程におけるペースト状接着剤が少なくともエポキシ樹脂及び/又は(メタ)アクリル酸エステルを有する(1)ないし(3)のいずれか一項に記載の電子部品の製造方法。
単量体単位とは単量体に由来する構造単位を意味する。「部」及び「%」は質量基準である。(メタ)アクリレートとはアクリレート及びメタアクリレートの総称である。(メタ)アクリル酸等の(メタ)を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。
本発明に係る電子部品の製造方法は、次の手順(1)~(4)を含む。
(1)ウエハの裏面にペースト状接着剤を全面塗布して放射線照射又は加熱してペースト状接着剤をシート状に半硬化させる接着剤半硬化層形成工程、
(2)ウエハに形成された接着剤半硬化層とリングフレームを粘着シートの粘着層に貼り付けて固定する貼付工程、
(3)ダイシングブレードでウエハを接着剤半硬化層ごとダイシングして半導体チップにするダイシング工程、
(4)放射線を照射した後に接着剤半硬化層付きチップを粘着シートの粘着層からピックアップするピックアップ工程。
以下、各工程について説明する。
接着剤半硬化層は、典型的には、ウエハの裏面、すなわちリードフレーム又は回路基板と接着させるための回路非形成面に、ペースト状接着剤を全面塗布し、これを放射線照射又は加熱してシート状に半硬化させることによって形成できる。
貼付工程は、ウエハに形成された接着剤半硬化層とリングフレームを粘着シートの粘着層に貼り付けて固定する工程であり、一般的にはローラーを備えたテープマウンター装置を用いて行うことができる。貼付工程において使用する粘着シートは、基材フィルムと、基材フィルムの一方の面に積層された粘着層とを有する。
基材フィルムは、特に限定されるものではなく公知の樹脂材料を用いることができる。具体的には、ポリ塩化ビニル、ポリエチレンテレフタレート、エチレン-酢酸ビニル共重合体、エチレン-アクリル酸-アクリル酸エステルフィルム、エチレン-エチルアクリレート共重合体、ポリエチレン、ポリプロピレン、プロピレン系共重合体、エチレン-アクリル酸共重合体、及び、エチレン-(メタ)アクリル酸共重合体やエチレン-(メタ)アクリル酸-(メタ)アクリル酸エステル共重合体等を金属イオンで架橋したアイオノマ樹脂を挙げることができる。基材フィルムは、これら樹脂の混合物、共重合体又はこれらの積層物であっても良い。
粘着層は、基材フィルム上に粘着剤を塗布して形成される。粘着層を構成する粘着剤は、(メタ)アクリル酸エステル共重合体と紫外線重合性化合物と多官能イソシアネート硬化剤と光重合開始剤を含有する。
(メタ)アクリル酸エステル共重合体は、(メタ)アクリル酸エステルの単量体のみの共重合体、又は、(メタ)アクリル酸エステルの単量体とビニル化合物単量体との共重合体である。
紫外線重合性化合物としては、例えば、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、1,4-ブチレングリコールジアクリレート、1,6-ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、シアヌル酸トリエチルアクリレート、市販のオリゴエステルアクリレートなどが用いられる。
ウレタンアクリレートオリゴマは、ポリエステル型又はポリエーテル型などのポリオール化合物と、多価イソシアネート化合物、例えば2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、1,3-キシレンジイソシアネート、1,4-キシレンジイソシアネート、ジフェニルメタン4,4-ジイソシアネート、トリメチルヘキサメチレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネートなどを反応させて得られる末端イソシアネートウレタンプレポリマに、ヒドロキシ基を有する(メタ)アクリレート、例えば2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、ペンタエリスリトールトリアクリレート、グリシドールジ(メタ)アクリレート、ジペンタエリスリトールモノヒドロキシペンタアクリレートなどを反応させて得られる。
多官能イソシアネート硬化剤は、イソシアネート基を2個以上有するものであり、例えば芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環族ポリイソシアネートがある。
光重合開始剤は、温度23℃から、10℃/分の昇温速度で500℃まで昇温させた場合に、昇温前質量(25℃における光重合開始剤の質量)に対する質量減少率が10%となる温度が250℃以上のものである。このような光重合開始剤としては、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)(BASFジャパン社製、製品名IRGACURE OXE02)、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(BASFジャパン社製、製品名LUCIRIN TPO)、及び2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]-フェニル}-2-メチル-プロパン-1-オン(BASFジャパン社製、製品名IRGACURE127)、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1(BASFジャパン社製、製品名IRGACURE369)、2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モルフォリンー4-イル-フェニル)-ブタン-1-オン(BASFジャパン社製、製品名IRGACURE379)、ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(BASFジャパン社製、製品名IRGACURE819)等が挙げられる。特に、質量減少率が10%となる温度が270℃以上である、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)(BASFジャパン社製、製品名IRGACURE OXE02)、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(BASFジャパン社製、製品名LUCIRIN TPO)、及び2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]-フェニル}-2-メチル-プロパン-1-オン(BASFジャパン社製、製品名IRGACURE127)が好ましい。質量減少率が10%となる温度が250℃以上であることにより、ダイシング、ピックアップ後に得られた接着剤半硬化層付きのチップをリードフレームに接着し、封止樹脂でモールディングし、260℃前後で加温工程を行う際に、リードフレームと接着剤半硬化層との間の接着不良を抑制することができる。
ダイシング工程は、ダイシング装置を用い、ダイヤモンド砥粒を含有するダイシングブレ―ドを高速回転させることにより、シリコンウエハを接着剤半硬化層ごと半導体チップに切断する工程である。ダイシング装置及びダイシング条件は一般に用いられているものを使用することができる。
ピックアップ工程は、粘着シートの粘着層に放射線を照射することにより粘着層と接着剤半硬化層との間の粘着力を低下させ、接着剤半硬化層が付着した半導体チップを粘着層から剥離する工程である。放射線の種類は特に限定されず、公知のものが使用できる。紫外線により粘着力を低下させる場合は、紫外線源として、ブラックライト、低圧水銀灯、高圧水銀灯、超高圧水銀灯、メタルハライドランプ、エキシマランプ等が挙げられる。
基材フィルムは、実施例及び比較例の全てにおいて、サンアロマー社製プロピレン系共重合体(品番:X500F)を用いた。このフィルムのMFR(メルトフローレート)値は7.5g/10分、密度は0.89g/cm3、厚さは80μmである。
粘着層は、以下に記載する(メタ)アクリル酸エステル共重合体、紫外線重合性化合物、多官能イソシアネート硬化剤及び光重合開始剤を含有する粘着剤を用いて形成した。
A-1:綜研化学社製SKダイン1496;2-エチルヘキシルアクリレート96%、2-ヒドロキシエチルアクリレート4%の共重合体であり、溶液重合により得られる。
A-2:日本ゼオン社製アクリルゴムAR53L;エチルアクリレート40%、ブチルアクリレート23%、メトキシエチルアクリレート37%の共重合体であり、乳化重合により得られる。
〔紫外線重合性化合物〕
B-1:根上工業社製UN-3320HS;イソホロンジイソシアネートの三量体にジペタエリスリトールペンタアクリレートを反応させたものであり、ビニル基の数が15個。
B-2:新中村化学社製A-TMPT;トリメチロールプロパントリアクリレート、ビニル基の数が3個。
〔多官能イソシアネート硬化剤〕
C-1:日本ポリウレタン社製コロネートL-45E;2,4-トリレンジイソシアネートのトリメチロールプロパンアダクト体。
〔光重合開始剤〕
D-1:BASFジャパン社製IRGACURE OXE02;エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)。質量減少率が10%となる温度は320℃。
D-2:BASFジャパン社製LUCIRIN TPO;2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド。質量減少率が10%となる温度は270℃。
D-3:BASFジャパン社製IRGACURE127;2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]-フェニル}-2-メチル-プロパン-1-オン。質量減少率が10%となる温度は275℃。
D-4:BASFジャパン社製IRGACURE379;2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モルフォリンー4-イル-フェニル)-ブタン-1-オン。質量減少率が10%となる温度は265℃。
D-5:BASFジャパン社製IRGACURE651;ベンジルジメチルケタール。質量減少率が10%となる温度は185℃。
光重合開始剤の質量減少率は、25℃の環境下で光重合開始剤の質量(昇温前質量)を測定した後、光重合開始剤を、示差熱・熱重量同時測定装置[TG/DTA同時測定装置、セイコー製、TG/DTA220]を用いて、昇温速度10℃/分で23℃から500℃まで昇温し、各温度における光重合開始剤の質量(昇温後質量)を測定し、次式により算出した。各光重合開始剤について質量減少率が10%となる温度を調べた。
質量減少率={(昇温前質量-昇温後質量)/(昇温前質量)}×100(%)
粘着剤を、ポリエチレンテレフタレート製のセパレータフィルム上に、乾燥後の粘着層の厚みが10μmとなるように塗工した。この粘着層を基材フィルムに積層し、40℃で7日間熟成させ、セパレータフィルム付き粘着シートを得た。
以下の工程(1)~(4)により、シリコンウエハに接着剤半硬化層を形成し、上記の粘着シートを用いてシリコンウエハを固定し、ダイシングし、半導体チップをピックアップして、チップ保持性、ピックアップ性及び汚染防止性について評価を行った。
(2)貼付工程:シリコンウエハの裏面に形成された接着剤半硬化層とリングフレームを粘着シートの粘着層に貼り付けて固定した。
(3)ダイシング工程:ダイシングブレードでシリコンウエハを接着剤半硬化層ごと9mm×9mmの半導体チップに切断した。ダイシング工程は以下の装置及び条件で行った。
ダイシング装置:DISCO社製DAD341
ダイシングブレード:DISCO社製NBC-ZH205O-27HEEE
ダイシングブレード形状:外径55.56mm、刃幅35μm、内径19.05mm
ダイシングブレード回転数:40,000rpm
ダイシングブレード送り速度:50mm/秒
粘着シートへの切り込み量:15μm
切削水温度:25℃
切削水量 :1.0L/分
(4)ピックアップ工程:高圧水銀灯にて紫外線を150mJ/cm2照射し、接着剤半硬化層付きチップを粘着層からピックアップした。ピックアップ工程は以下の装置及び条件で行った。
ピックアップ装置:キヤノンマシナリー社製CAP-300II
ニードルピン形状:250μmR
ニードルピン突き上げ高さ:0.5mm
エキスパンド量:8mm
チップ保持性は、ダイシング工程後において、粘着シートに保持されている半導体チップの残存率で評価した。
◎(優):チップ飛びが5%未満。
○(良):チップ飛びが5%以上10%未満。
×(不可):チップ飛びが10%以上。
ピックアップ性は、ピックアップ工程においてピックアップできたチップの比率で評価した。
◎(優):95%以上のチップがピックアップできた。
○(良):80%以上95%未満のチップがピックアップできた。
×(不可):80%未満のチップがピックアップできた。
汚染防止性を評価するために、接着剤半硬化層のアウトガス量を測定した。粘着シートの粘着層に接着剤半硬化層を貼り付けて、2週間保管後に高圧水銀灯で紫外線を500mJ/cm2照射した後、粘着シートから接着剤半硬化層を剥離した。この剥離した接着剤半硬化層から発生する光重合開始剤由来のアウトガス量を評価した。アウトガス量は、剥離した接着剤半硬化層3mgをアウトガス測定用のバイアルに封入し、ヘッドスペースサンプラーを用いて250℃で30分間保持したのち、GC-MSに導入して測定した。
◎(優):光重合開始剤由来のアウトガス量200μg/g未満。
○(良):光重合開始剤由来のアウトガス量200μg/g以上800μg/g未満。
×(不可):光重合開始剤由来のアウトガス量800μg/g以上。
Claims (5)
- ウエハの裏面にペースト状接着剤を全面塗布して放射線照射又は加熱してペースト状接着剤をシート状に半硬化させる接着剤半硬化層形成工程、ウエハに形成された接着剤半硬化層とリングフレームを粘着シートの粘着層に貼り付けて固定する貼付工程、ダイシングブレードでウエハを接着剤半硬化層ごとダイシングして半導体チップにするダイシング工程、放射線を照射した後に接着剤半硬化層付きチップを粘着層からピックアップするピックアップ工程を含み、
粘着シートが基材フィルムと、基材フィルムの一方の面に積層された粘着層とを有し、
粘着層を構成する粘着剤が(メタ)アクリル酸エステル共重合体と紫外線重合性化合物と多官能イソシアネート硬化剤と光重合開始剤を有し、
光重合開始剤が、次式:
質量減少率={(昇温前質量-昇温後質量)/(昇温前質量)}×100(%)
(式中、
昇温前質量は25℃における光重合開始剤の質量を表し、
昇温後質量は昇温速度10℃/分で23℃から500℃まで昇温させた際の各温度における光重合開始剤の質量を表す)
により算出した質量減少率が10%となる温度が250℃以上のものである、電子部品の製造方法。 - 光重合開始剤がエタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド、及び2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]-フェニル}-2-メチル-プロパン-1-オンである、請求項1記載の電子部品の製造方法。
- 粘着剤が(メタ)アクリル酸エステル重合体100質量部と紫外線重合性化合物5質量部以上200質量部以下と多官能イソシアネート硬化剤0.5質量部以上20質量部以下と光重合開始剤0.1質量部以上20質量部以下を有する、請求項1又は2記載の電子部品の製造方法。
- 接着剤半硬化層形成工程におけるペースト状接着剤が少なくともエポキシ樹脂及び/又は(メタ)アクリル酸エステルを有する請求項1ないし3のいずれか一項に記載の電子部品の製造方法。
- ウエハの裏面に形成された接着剤半硬化層に貼り付けて用いられる電子部品製造用粘着シートであって、
基材フィルムと、基材フィルムの一方の面に積層された粘着層とを有し、
粘着層を構成する粘着剤が(メタ)アクリル酸エステル共重合体と紫外線重合性化合物と多官能イソシアネート硬化剤と光重合開始剤を有し、
光重合開始剤が、次式:
質量減少率={(昇温前質量-昇温後質量)/(昇温前質量)}×100(%)
(式中、
昇温前質量は25℃における光重合開始剤の質量を表し、
昇温後質量は昇温速度10℃/分で23℃から500℃まで昇温させた際の各温度における光重合開始剤の質量を表す)
により算出した質量減少率が10%となる温度が250℃以上のものである、電子部品製造用粘着シート。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5678228B1 (ja) * | 2014-06-27 | 2015-02-25 | 積水化学工業株式会社 | 回路基板の処理方法及び硬化型接着剤組成物 |
JP2017088817A (ja) * | 2015-11-17 | 2017-05-25 | 日東電工株式会社 | 粘着シート |
JP2017119795A (ja) * | 2015-12-28 | 2017-07-06 | 三星エスディアイ株式会社Samsung SDI Co. | 粘着剤組成物および粘着シート |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5468523B2 (ja) * | 2010-11-11 | 2014-04-09 | 電気化学工業株式会社 | 粘着剤、粘着シート及び電子部品の製造方法。 |
JP2014003156A (ja) * | 2012-06-19 | 2014-01-09 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
JP2014033177A (ja) * | 2012-07-12 | 2014-02-20 | Denso Corp | 半導体装置の製造方法 |
JP6028459B2 (ja) * | 2012-08-24 | 2016-11-16 | 日立化成株式会社 | 半導体装置の製造方法及び半導体装置 |
JP6506756B2 (ja) * | 2014-07-14 | 2019-04-24 | デンカ株式会社 | 粘着シート、電子部品の製造方法 |
JP6088701B1 (ja) * | 2016-10-06 | 2017-03-01 | 株式会社きもと | レーザーダイシング用補助シート |
JP2018117049A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社ディスコ | パッケージデバイスの製造方法 |
JP7091696B2 (ja) * | 2018-02-20 | 2022-06-28 | 株式会社デンソー | 物理量センサおよび半導体装置 |
JP7401580B2 (ja) | 2022-02-25 | 2023-12-19 | 株式会社安川電機 | 端子台、電気機器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006264296A (ja) * | 2005-02-23 | 2006-10-05 | Nitto Denko Corp | 多層シートとその製造方法及びこの多層シートを用いた粘着シート |
JP2007246633A (ja) * | 2006-03-15 | 2007-09-27 | Denki Kagaku Kogyo Kk | 多層粘着シート、多層粘着シート用の粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
JP2008001817A (ja) * | 2006-06-23 | 2008-01-10 | Denki Kagaku Kogyo Kk | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
JP2009141009A (ja) * | 2007-12-04 | 2009-06-25 | Hitachi Chem Co Ltd | 半導体装置及びその製造方法 |
JP2010100686A (ja) * | 2008-10-21 | 2010-05-06 | Nitto Denko Corp | 自発巻回性粘着シート |
JP2010219293A (ja) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070003758A1 (en) * | 2004-04-01 | 2007-01-04 | National Starch And Chemical Investment Holding Corporation | Dicing die bonding film |
JP4776189B2 (ja) | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP4749751B2 (ja) * | 2005-04-07 | 2011-08-17 | 電気化学工業株式会社 | 部材の仮固定方法 |
CN101184783B (zh) * | 2005-05-31 | 2011-11-30 | 电气化学工业株式会社 | 能量射线固化性树脂组合物及使用该组合物的粘接剂 |
CN101842455A (zh) * | 2007-10-16 | 2010-09-22 | 电气化学工业株式会社 | 粘合剂、粘合片、多层粘合片以及生产电子部件的方法 |
JP2009147201A (ja) * | 2007-12-17 | 2009-07-02 | Denki Kagaku Kogyo Kk | ダイシングシート、その製造方法、および電子部品の製造方法 |
-
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- 2011-09-14 CN CN201180045834.9A patent/CN103155108B/zh active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006264296A (ja) * | 2005-02-23 | 2006-10-05 | Nitto Denko Corp | 多層シートとその製造方法及びこの多層シートを用いた粘着シート |
JP2007246633A (ja) * | 2006-03-15 | 2007-09-27 | Denki Kagaku Kogyo Kk | 多層粘着シート、多層粘着シート用の粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
JP2008001817A (ja) * | 2006-06-23 | 2008-01-10 | Denki Kagaku Kogyo Kk | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いた多層粘着シート、及び多層粘着シートを用いた電子部品の製造方法。 |
JP2009141009A (ja) * | 2007-12-04 | 2009-06-25 | Hitachi Chem Co Ltd | 半導体装置及びその製造方法 |
JP2010100686A (ja) * | 2008-10-21 | 2010-05-06 | Nitto Denko Corp | 自発巻回性粘着シート |
JP2010219293A (ja) * | 2009-03-17 | 2010-09-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5678228B1 (ja) * | 2014-06-27 | 2015-02-25 | 積水化学工業株式会社 | 回路基板の処理方法及び硬化型接着剤組成物 |
JP2016012631A (ja) * | 2014-06-27 | 2016-01-21 | 積水化学工業株式会社 | 回路基板の処理方法及び硬化型接着剤組成物 |
JP2017088817A (ja) * | 2015-11-17 | 2017-05-25 | 日東電工株式会社 | 粘着シート |
JP2017119795A (ja) * | 2015-12-28 | 2017-07-06 | 三星エスディアイ株式会社Samsung SDI Co. | 粘着剤組成物および粘着シート |
Also Published As
Publication number | Publication date |
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JP5161284B2 (ja) | 2013-03-13 |
SG188959A1 (en) | 2013-05-31 |
JP2012084759A (ja) | 2012-04-26 |
KR101811190B1 (ko) | 2017-12-21 |
KR20130142111A (ko) | 2013-12-27 |
US20130183812A1 (en) | 2013-07-18 |
CN103155108A (zh) | 2013-06-12 |
MY160731A (en) | 2017-03-15 |
TWI502638B (zh) | 2015-10-01 |
CN103155108B (zh) | 2016-02-10 |
US8652942B2 (en) | 2014-02-18 |
TW201216346A (en) | 2012-04-16 |
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