WO2012011491A1 - Film conducteur - Google Patents

Film conducteur Download PDF

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Publication number
WO2012011491A1
WO2012011491A1 PCT/JP2011/066435 JP2011066435W WO2012011491A1 WO 2012011491 A1 WO2012011491 A1 WO 2012011491A1 JP 2011066435 W JP2011066435 W JP 2011066435W WO 2012011491 A1 WO2012011491 A1 WO 2012011491A1
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WO
WIPO (PCT)
Prior art keywords
conductor pattern
conductive
receiving layer
conductive paste
substrate
Prior art date
Application number
PCT/JP2011/066435
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English (en)
Japanese (ja)
Inventor
桑原　真
Original Assignee
パナソニック電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック電工株式会社 filed Critical パナソニック電工株式会社
Priority to JP2012525409A priority Critical patent/JP5406991B2/ja
Publication of WO2012011491A1 publication Critical patent/WO2012011491A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Definitions

  • the present invention relates to a conductive film provided with a conductor pattern that can be used as an electrode of a touch panel, various displays, or the like, or as an electromagnetic wave shield pattern.
  • a conductive pattern used for an electrode of a touch panel or the like is printed with a conductive paste containing conductive particles and a binder resin on a substrate such as a polyethylene terephthalate (PET) film in a grid shape, and the like. It is formed by drying at a temperature of about ° C. And in order to improve the permeability of the substrate, it is conceivable to narrow the conductor width of the conductor pattern, but in this case it is necessary to miniaturize the conductive particles contained in the conductive paste.
  • PET polyethylene terephthalate
  • FIG. 7 is a graph showing the relationship between the average particle size (D50) of the conductive particles contained in the conductive paste and the specific resistance of the conductor pattern.
  • the conductor pattern in this graph is formed by simply drying the conductive paste printed on the substrate, and neither plating nor sintering nor pressing is performed as described later.
  • D50 average particle size
  • the specific resistance of the conductor pattern is increased. It is considered that this is because the binder resin covers the surface of the conductive particles as the conductive particles become finer, and the contact between the conductive particles is hindered by the binder resin.
  • a method of manufacturing a sheet member for an electromagnetic wave shield which includes a step of forming a mesh pattern by printing using a conductive paste on a transparent substrate and a pressing step (see, for example, Patent Document 2) ).
  • the base material is also heated to a high temperature, so that any base material having very high heat resistance can not be used.
  • the present invention has been made in view of the above-mentioned point, and there is no disconnection, and it is possible to achieve both the miniaturization of the conductor width and the reduction of resistance, and the conductor pattern is in close contact regardless of the type of the substrate. It is an object of the present invention to provide a highly conductive film.
  • the conductive film according to the present invention comprises a substrate, a receiving layer provided on the substrate, and a conductive paste containing conductive particles and a binder resin having an average particle diameter (D50) of 2 ⁇ m or less. And a conductor pattern having a conductor width of 30 ⁇ m or less formed by printing on at least a part of the conductor pattern in the thickness direction of the conductor pattern. .
  • the conductor thickness of the conductor pattern is embedded in the receiving layer.
  • the conductor pattern is preferably formed by heat pressing the conductive paste printed on the receiving layer.
  • the thickness of the receiving layer is preferably 0.1 to 300 ⁇ m.
  • the step between the top of the conductor pattern and the surface of the receiving layer is preferably 10 ⁇ m or less.
  • the conductive particles preferably have an average particle size (D50) of 1 nm or more.
  • the glass transition temperature (Tg) of the binder resin is preferably ⁇ 10 to 250 ° C.
  • the receiving layer is formed of a thermoplastic resin, and the glass transition temperature (Tg) of the thermoplastic resin is ⁇ 10 to 250 ° C.
  • the receiving layer is formed of a thermosetting resin, and a curing temperature of the thermosetting resin is 60 to 350 ° C.
  • the receiving layer is preferably formed of an electron beam curable resin.
  • the present invention it is possible to form a fine conductor pattern without disconnection by using a conductive paste containing fine conductive particles.
  • the adhesion can be greatly improved.
  • the conductive film according to the present invention is formed to include a base 1, a receiving layer 6 and a conductor pattern 3.
  • the substrate 1 is not particularly limited as long as it has insulating properties, but when it is used for applications in the optical field, those having transparency in at least the visible light region are preferable.
  • a polyethylene terephthalate (PET) film an acrylic resin typified by polymethyl methacrylate, a polyester resin such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and the like, as JRE stock
  • a sheet-like or plate-like material such as a glass substrate, an epoxy resin base material described in Japanese Patent Application Laid-Open No.
  • the conductive paste 2 is continuously printed by the gravure printing machine 10 as shown in FIG. 4 described later while delivering the base material 1, or as shown in FIG. 5 or 6 described later. After printing the paste 2, it can be continuously pressed by the roll 30 or the like.
  • the substrate 1 may be in the form of being cut into a predetermined shape such as a rectangular shape in advance.
  • the thickness of the substrate 1 is preferably 1 ⁇ m to 20 mm, more preferably 10 ⁇ m to 1 mm, and most preferably 25 ⁇ m to 200 ⁇ m.
  • the receiving layer 6 is provided on the surface of the substrate 1.
  • the receiving layer 6 preferably has transparency at least in the visible light region.
  • the receiving layer 6 is prepared, for example, by mixing a thermoplastic resin, a thermosetting resin or an electron beam curing resin, and a solvent as needed to prepare a solution for forming a receiving layer, and this solution is applied to the surface of the substrate 1 It can be formed by coating and heat drying it or irradiating it with an electron beam.
  • thermoplastic resin a thermosetting resin, or an electron beam curable resin
  • an epoxy resin a vinyl resin, a polyester resin, an acrylic resin, a derivative of these resins, a cellulose such as carboxymethyl cellulose, acetyl cellulose, cellulose acetate butyrate A derivative etc.
  • an epoxy resin a vinyl resin
  • a polyester resin an acrylic resin
  • a derivative of these resins a cellulose such as carboxymethyl cellulose, acetyl cellulose, cellulose acetate butyrate A derivative etc.
  • a cellulose such as carboxymethyl cellulose, acetyl cellulose, cellulose acetate butyrate A derivative etc.
  • the solvent examples include methanol, ethanol, isopropyl alcohol (IPA), methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), toluene, ethyl acetate, cyclohexanone, xylene, diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, -(2-Methoxy-2-methylethoxy) -2-propanol, propylene glycol monomethyl ether acetate, water and the like can be used alone or as a mixed solvent mixed in an arbitrary ratio.
  • IPA isopropyl alcohol
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • the glass transition temperature (Tg) of the thermoplastic resin is preferably -10 to 250.degree.
  • the glass transition temperature (Tg) of the thermoplastic resin is ⁇ 10 ° C. or more, the solution for forming a receptor layer can be easily made into a paste.
  • the glass transition temperature (Tg) of the thermoplastic resin is 250 ° C. or less, the receptive layer 6 is softened without damaging the substrate 1 by heat at the time of heat pressing, and the width of the conductive paste 2 after printing This conductive paste 2 can be easily embedded in the receiving layer 6 without spreading the
  • the viscosity at 25 ° C. of the solution for forming the receptive layer is preferably 0.5 to 1,000,000 cps, and the curing temperature of the thermosetting resin is 60 to 350 ° C. Is preferred.
  • the curing temperature of the thermosetting resin is 60 ° C. or higher, it is possible to suppress that the curing reaction spontaneously starts to progress during normal use (particularly when used in summer). Further, by setting the curing temperature of the thermosetting resin to 350 ° C. or less, it is possible to expand the range of selection of usable substrates 1 except for the substrate 1 having extremely low heat resistance.
  • the receiving layer 6 can be formed with an electron beam curable resin.
  • the receiving layer 6 can be formed by irradiating the receiving layer forming solution coated on the surface of the substrate 1 with an electron beam such as ultraviolet light, so that it is not necessary to heat the substrate 1 in particular. Damage can be suppressed.
  • the thickness of the receptive layer 6 is preferably 0.1 to 300 ⁇ m, and more preferably 0.5 to 50 ⁇ m.
  • the thickness of the receptive layer 6 is set to a suitable thickness in consideration of the practical dimension of the conductor pattern 3 in which the conductor width is miniaturized to 30 ⁇ m or less.
  • the thickness of the receptive layer 6 exceeds 300 ⁇ m, the thickness is too large in view of the role of embedding the conductor pattern 3, and it is not preferable in consideration of the influence on the performance of the substrate 1.
  • the conductive pattern 3 is printed with the conductive paste 2 on the surface of the receiving layer 6, and at least a part of the printed conductive paste 2 is embedded in the receiving layer 6.
  • the conductive paste 2 one containing conductive particles and a binder resin is used.
  • the conductive particles those having an average particle diameter (D50) of 2 ⁇ m or less are used. Those having an average particle diameter (D50) of preferably 1 nm or more and 2 ⁇ m (2000 nm) or less, more preferably 10 nm or more and 800 nm or less, from the viewpoint of easily forming a highly conductive conductor pattern 3 Use a certain one.
  • the average particle diameter (D50) of the conductive particles means a particle diameter at which the cumulative mass is 50% in the particle diameter distribution of the conductive particles measured by the laser diffraction method or the like. When the average particle diameter (D50) of the conductive particles is less than 1 nm, the viscosity becomes too high when pasted, and it becomes difficult to use for printing.
  • the average particle size (D50) of the conductive particles exceeds 2 ⁇ m, the specific resistance of the conductor pattern 3 can be lowered to improve the conductivity, but a fine conductor pattern having a conductor width of 30 ⁇ m or less It becomes difficult to form three.
  • conductive particles having an average particle diameter (D50) of 800 nm or less are used, generation of chipping in the conductor pattern 3 after hot pressing can be suppressed.
  • the conductive particles are not particularly limited as long as they have an average particle diameter (D50) of 2 ⁇ m or less, and for example, metal particles, metal oxides, graphite, carbon black, etc. may be used.
  • D50 average particle diameter
  • metal particles for example, those selected from silver particles, copper particles, nickel particles, aluminum particles, iron particles, magnesium particles, alloy particles thereof, and those metal particles coated with one or more layers of different metals are selected.
  • metal oxide one selected from antimony-tin oxide, indium-tin oxide and the like can be used.
  • it is 10.0-99.9 mass% with respect to the conductive paste 2 whole quantity, and, as for content of such a conductive particle, it is more preferable that it is 50.0-99.9 mass%. Preferably, it is 60.0 to 98.0% by mass.
  • the binder resin one having a glass transition temperature (Tg) of preferably ⁇ 10 to 250 ° C., more preferably 0 to 200 ° C. is used.
  • Tg glass transition temperature
  • the glass transition temperature (Tg) of the binder resin is ⁇ 10 ° C. or more, it can be easily made into a paste.
  • the glass transition temperature (Tg) of the binder resin is 250 ° C. or less, the conductive paste 2 becomes easy to flow and easily dissolve in a solvent as described later.
  • binder resin examples include, but are not particularly limited to, vinyl resins, polyester resins, acrylic resins, etc., derivatives of these resins having -COC- skeleton, -COO- skeleton, etc., carboxy Cellulose derivatives such as methyl cellulose, acetyl cellulose and cellulose acetate butyrate can be used.
  • the conductive paste 2 can be prepared by blending the conductive particles and the binder resin as described above, but may further be blended with additives, solvents and the like.
  • an antifoaming agent and a leveling agent such as "BYK 333 (silicon oil)” manufactured by Big Chemie Japan Co., Ltd. can be used. It is preferably 10% by mass.
  • the solvent for example, methanol, ethanol, isopropyl alcohol (IPA), methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), toluene, ethyl acetate, cyclohexanone, xylene, diethylene glycol monoethyl ether acetate, dipropylene glycol monomethyl ether, 1- (2-methoxy-2-methylethoxy) -2-propanol, propylene glycol monomethyl ether acetate, water and the like can be used alone or as a mixed solvent mixed in an arbitrary ratio.
  • the solvent is preferably blended so that the viscosity of the conductive paste 2 is 50 to 5000 dPa ⁇ s.
  • a conductive film can be manufactured as follows.
  • the receiving layer 6 is formed on the surface of the substrate 1 to obtain a substrate with a receiving layer.
  • the conductive paste 2 is printed on the surface of the receiving layer 6 in a predetermined shape.
  • the shape to be printed on the receiving layer 6 of the substrate 1 is not particularly limited, and examples thereof include a lattice shape or a mesh shape (mesh shape) as shown in FIG.
  • the conductive paste 2 is preferably printed in advance to have a width of 25 to 30 ⁇ m. The reason why the width of the conductive paste 2 is set to 30 ⁇ m or less as described above is that the width may be slightly increased by a press described later.
  • the conductive paste 2 In the case of pressing at a temperature higher than the glass transition temperature (Tg) of the binder resin, since the printed conductive paste 2 can be pressed without expanding the width, the conductive paste 2 with a width of at most 30 ⁇ m in advance. Can be printed.
  • the thickness of the printed conductive paste 2 is preferably 0.01 to 30 ⁇ m.
  • the printing method is not particularly limited, and, for example, screen printing, gravure printing, offset printing and the like can be used. Among them, the gravure printing will be described.
  • FIG. 4 shows an example of the gravure printing machine 10, which is formed by providing the plate cylinder 12 and the impression cylinder 13 in a cylindrical shape.
  • the conductive paste 2 is supplied and filled in the concave portion 15 on the outer surface thereof, and the excess conductive paste 2 is scraped off by the pressure of the doctor 16.
  • the base material 1 on which the conductor pattern 3 is formed passes between the plate cylinder 12 and the impression cylinder 13 by the impression cylinder 13 rotating in the opposite direction to the plate cylinder 12, and the pressure of the impression cylinder 13
  • the conductive paste 2 is transferred onto the surface of the receiving layer 6 of the substrate 1 and printed.
  • the conductive paste 2 printed on the surface of the receiving layer 6 of the substrate 1 is dried by heating under the conditions of 50 to 150 ° C., 0.1 to 180 minutes, and then at least a part of the conductive paste 2
  • the conductor pattern 3 can be formed by immersing the receptive layer 6 by heat pressing as shown in FIG. 1 (c). In FIG.
  • H is the height of the line of the conductor pattern 3 (height of the part protruding from the surface of the receiving layer 6)
  • D is the depth of penetration of the conductor pattern 3 (from the surface of the receiving layer 6
  • T indicates the overall thickness (conductor thickness) of the conductor pattern 3
  • W indicates the line width of the conductor pattern 3 (conductor width).
  • at least a part of the conductor pattern 3 is embedded in the receptor layer 6 in the thickness direction of the conductor pattern 3 (that is, D> 0).
  • the conductor thickness T of the conductor pattern 3 is embedded in the receptive layer 6.
  • 0.1 T ⁇ D ( ⁇ T) and the adhesion of the conductor pattern 3 to the receiving layer 6 can be further increased.
  • the step H between the top of the conductor pattern 3 and the surface of the receiving layer 6 is preferably 10 ⁇ m or less.
  • the above-described step H is preferably 2 ⁇ m or less.
  • the conductor pattern 3 as shown in FIG. 1 (c) can be formed by printing the conductive paste 2 on the surface of the receiving layer 6 and drying it, followed by heat pressing.
  • the receiving layer 6 is provided on the surface of the substrate 1 as shown in FIG. 2A and the conductive paste 2 is printed on the surface of the receiving layer 6 in a predetermined shape as shown in FIG.
  • a conductive film as shown in FIG. 2D can be manufactured.
  • the conductor thickness of the conductor pattern 3 of the conductive film thus obtained is preferably 0.005 to 29.9 ⁇ m, and it is preferable that 10% or more (the upper limit is 100%) thereof be embedded in the receptor layer 6 . Thereby, the adhesion of the conductor pattern 3 to the receiving layer 6 can be enhanced.
  • the heating and pressing device 4 it is possible to use one provided with a pair of hot platens 4 a and 4 b which are close and separated, and the opposing surface is formed flat.
  • the binder resin present between the conductive particles is pushed out and eliminated by being compressed by a press, and the contact area between the conductive particles increases, so even if the conductor width is made. Even if it is 30 ⁇ m or less, the specific resistance is low and the conductivity is high.
  • the pressing is preferably performed at 50 to 150 ° C., 0.01 to 200 kgf / cm 2 (0.98 kPa to 19.6 MPa), and 0.1 to 180 minutes.
  • the release sheet 5 is interposed between the substrate 1 on which the conductive paste 2 is printed and the heating plates 4a and 4b of the heating and pressing device 4. You may make it As the release sheet 5, a polyester film, a polyester film coated with a release agent such as a silicone resin to provide a release agent layer, a known polarizing plate or the like can be used.
  • the conductor pattern 3 as shown in FIG. 1C can be formed by printing the conductive paste 2 and pressing as follows.
  • the receptive layer 6 is provided on the surface of the base material 1, and the conductive paste 2 is printed on the surface of the receptive layer 6 in a predetermined shape as shown in FIG. Thereafter, conductive paste 2 is heated and dried under the conditions of 50 to 150 ° C., 0.1 to 180 minutes, and further heated at a temperature of 120 to 150 ° C. by hot air or far infrared (IR) etc.
  • the conductive film as shown in FIG. 5 (d) is manufactured by pressing with the roll 30 using the roll press device 31 as shown in FIG. 5 (c) in a state where the receptive layer 6 and the conductive paste 2 are warmed. can do.
  • each roll 30 is not particularly limited, but is preferably a heating roll formed of a rubber roll, a steel roll or the like.
  • the press by the roll 30 can be performed by conveying continuously the elongate base material 1 with which the conductive paste 2 was printed between two rolls 30.
  • the substrate 1 on which the conductive paste 2 is printed is 60 to 400 ° C. (more preferably 70 to 200 ° C.), 0.5 seconds to 1 hour (more preferably 5 seconds to 30) It is preferable to heat and warm under the conditions of the minute).
  • the temperature of heating by the roll 30 is 60 to 400 ° C. (more preferably 70 to 200 ° C.), and the pressure of pressurization is 0.1 to 400 kgf / cm 2 (0.01 to 39.2 MPa) (more preferably 0).
  • the speed at which the substrate 1 is passed between the two rolls 30 is preferably set to 0.5 to 30 m / min., 0.5 to 200 kgf / cm 2 (0.05 to 19.6 MPa)). If the temperature of heating by the roll 30 is less than 60 ° C., the conductive paste 2 may not be sufficiently cured, and conversely, if the temperature exceeds 400 ° C., the substrate 1 may be thermally damaged. . If the pressure applied by the roll 30 is less than 0.5 kgf / cm 2 (0.05 MPa), the surface resistance of the conductor pattern 3 may not be reduced sufficiently.
  • the pressure is 400 kgf / If it exceeds cm 2 (39.2 MPa), the conductor width of the conductor pattern 3 is too wide, and there is a possibility that adjacent conductor patterns 3 may be in contact with each other when insulation must be ensured.
  • the speed at which the substrate 1 is passed between the two rolls 30 is less than 0.5 m / min, the conductor pattern 3 may not be formed quickly, and conversely, the speed is 30 m / min. If the value of f is exceeded, the pressing time may be too short, and the surface resistance of the conductor pattern 3 may not be sufficiently lowered.
  • the clearances of the two rolls 30 may be appropriately adjusted so that they can be pressurized by the above pressure.
  • the conductor pattern 3 formed as mentioned above has the surface compared with the conventional conductor pattern.
  • the resistance is low and the conductivity is high.
  • the press in this case is not intermittently performed by the batch-type heating and pressurizing device 4 as shown in FIG. 2, but is performed continuously by the continuous-type roll press device 31. It can be formed quickly, and as a result, the manufacturing speed of a printed wiring board, an electromagnetic wave shielding material, etc. can be increased.
  • a release sheet (not shown) may be interposed between the base 1 on which the conductive paste 2 is printed and the roll 30.
  • a polyester film, a polyester film coated with a release agent such as a silicone resin to provide a release agent layer, a known polarizing plate or the like can be used.
  • the conductor pattern 3 as shown in FIG. 1 (c) can be formed by printing the conductive paste 2 and pressing as shown in FIG.
  • the multi-stage roll press apparatus 32 is used to press the roll 30 a plurality of times.
  • the multi-stage roll press apparatus 32 for example, three rolls 30 consisting of a rotatable first roll 30a, a second roll 30b and a third roll 30c are used, and the first roll 30a and the second roll 30b are used.
  • the second roller 30 b and the third roller 30 c may be disposed in parallel to face each other.
  • the dimensions and the material of each roll 30 are not particularly limited, but it is preferable that each roll 30 be a heating roll.
  • the long base material 1 on which the conductive paste 2 is printed is wound about a half turn around the first roll 30a, passed between the first roll 30a and the second roll 30b as it is, It can be carried out by winding around a half turn around the 2 roll 30b, passing it as it is between the second roll 30b and the third roll 30c, and continuously winding it around a half turn around the third roll 30c.
  • the base material 1 is wound around the first roll 30a so that the surface opposite to the surface on which the conductive paste 2 is printed is in contact with the outer peripheral surface of the first roll 30a.
  • the base 1 is wound around the second roll 30 b so that the surface on which the conductive paste 2 is printed is in contact with the outer peripheral surface of the second roll 30 b.
  • the winding is performed such that the surface on which the conductive paste 2 is printed is in contact with the opposite surface.
  • the temperature of heating by each roll 30 is 60 to 400 ° C.
  • the speed at which the substrate 1 is passed between the two rolls 30 is preferably set to 0.5 to 30 m / min. If the temperature of heating by each roll 30 is less than 60 ° C., the conductive paste 3 may not be sufficiently cured. Conversely, if the temperature exceeds 400 ° C., the substrate 1 may be thermally damaged. is there. When the pressure applied by each roll 30 is less than 0.1 kgf / cm 2 (0.01 MPa), the surface resistance of the conductor pattern 3 may not be reduced sufficiently, and conversely, the pressure is 400 kgf.
  • the conductor width of the conductor pattern 3 is too wide, and there is a possibility that adjacent conductor patterns 3 may be in contact with each other when insulation must be ensured.
  • the speed at which the substrate 1 is passed between the two rolls 30 is less than 0.5 m / min, the conductor pattern 3 may not be formed quickly, and conversely, the speed is 30 m / min.
  • the pressing time may be too short, and the surface resistance of the conductor pattern 3 may not be sufficiently lowered.
  • the clearances of the two rolls 30 may be appropriately adjusted so that they can be pressurized by the above pressure.
  • the number of rolls 30 is not limited to three, and may be four or more.
  • the press by the roll 30 is performed twice, once between the first roll 30a and the second roll 30b and once between the second roll 30b and the third roll 30c. become.
  • the conductor pattern 3 thus formed is compressed once by the roll 30 because the contact area between the conductive fine particles such as metal powder is further increased by being compressed by the roll 30 a plurality of times.
  • the surface resistance is further lowered and the conductivity is increased.
  • the press in this case is not intermittently performed by the batch-type heating and pressing device 4 as shown in FIG. 2, but is performed continuously by the continuous multi-stage roll pressing device 32.
  • a release sheet (not shown) may be interposed between the base 1 on which the conductive paste 2 is printed and the roll 30.
  • a polyester film, a polyester film coated with a release agent such as a silicone resin to provide a release agent layer, a known polarizing plate or the like can be used.
  • the conductor thickness of the conductor pattern 3 be embedded in the receptive layer 6.
  • 10% or more (upper limit is 100%) of the conductor thickness of the conductor pattern 3 be embedded in the receptive layer 6.
  • the surface of the conductive film approaches smooth, and the difference in level between the top of the conductive pattern 3 and the surface of the receptive layer 6 is reduced.
  • the conductive film and the functional film or function are used. It becomes hard to produce problems, such as a bubble entering between layers. And especially the conductive film obtained as mentioned above can be conveniently used in the device using organic semiconductors, such as an organic electroluminescent element.
  • the conductive paste 2 containing fine conductive particles by using the conductive paste 2 containing fine conductive particles, it is possible to form the fine conductor pattern 3 without disconnection.
  • the adhesion can be greatly improved.
  • the conductor pattern 3 can be formed by heat-pressing the conductive paste 2 printed on the receiving layer 6, but when hot-pressing at a temperature higher than the glass transition temperature (Tg) of the receiving layer 6 at this time
  • Tg glass transition temperature
  • the conductive pattern 3 is embedded in the receptive layer 6 simply by pressing the conductive paste 2 and formed with high adhesiveness, so that the base 1 is not overloaded, and the type of the base 1 used There is no particular concern with Therefore, the substrate 1 is difficult to form the conductor pattern 3 by plating or the like because of low chemical resistance, and the substrate 1 is difficult to form the conductor pattern 3 by sintering or the like because the heat resistance is low. Even in the case of producing the conductive film according to the present invention, it can be used.
  • the surface of the base 1 on which the conductor pattern 3 is formed may be covered with a cover sheet.
  • a cover sheet those formed of ethylene vinyl acetate copolymer (EVA), amorphous PET (PET-G), PET with a transparent adhesive layer, etc. can be used.
  • Example 1 As conductive particles, silver particles obtained as follows were used. First, 175 ml of 25% ammonia water was added to 2000 ml of a silver nitrate aqueous solution having a silver ion concentration of 10 g / l to obtain a silver ammine complex salt aqueous solution. Next, the solution temperature of this aqueous solution was adjusted to 20 ° C., and 23 ml of a 37% formalin aqueous solution was added over 30 seconds while stirring to precipitate silver particles to obtain a silver particle-containing slurry. Next, 1% by mass of oleic acid based on the total amount of silver particles was added to the slurry and stirred for 10 minutes.
  • this slurry was filtered by a Buchner funnel, washed with water, and then dried in a vacuum atmosphere at 60 ° C. for 24 hours to obtain silver particles.
  • the average particle size (D50) of the silver particles thus obtained was 0.7 ⁇ m.
  • cellulose acetate butyrate CAB-551-0.2 glass transition temperature (Tg) 101 ° C.
  • the conductive paste 2 contains 80% by mass of the above-mentioned conductive particles, 5% by mass of the above-mentioned binder resin, 3% by mass of "carbon black # 2350" manufactured by Mitsubishi Chemical Corporation, 10 of methyl isobutyl ketone (MIBK) It prepared by mix
  • the viscosity of this conductive paste 2 was 400 dPa ⁇ s.
  • a PET film with a receiving layer obtained as follows was used.
  • an 8% by mass solution for receiving layer formation was prepared by dissolving cellulose acetate butyrate ("CAB-381-20" manufactured by EASTMAN) having a number average molecular weight of 70,000 in methyl isobutyl ketone (MIBK).
  • MIBK methyl isobutyl ketone
  • this solution was applied to the surface of a PET film "Cosmo Shine A4300" (100 ⁇ m thick) manufactured by Toyobo Co., Ltd. This application was performed using a microgravure coater under the conditions of a gravure plate # 70, a rotational speed of 115 rpm, and a conveying speed of a PET film of 1.5 m / min.
  • the PET film coated with the solution for forming a receptor layer was passed through the inside of a warm air drying oven having a temperature of 120 ° C. and a length of 12 m and dried by heating to obtain a PET film with a receptor layer.
  • the thickness of the receptive layer 6 of the substrate 1 was 5.1 ⁇ m when cross-sectional measurement was performed using a digital microscope made by Keyence Corporation.
  • the conductive paste 2 is formed in a grid or mesh as shown in FIG. 3 on the surface of the receiving layer 6 of the substrate 1.
  • the conductive paste 2 printed on the surface of the receiving layer 6 of the substrate 1 was dried by heating at 120 ° C. for 30 minutes.
  • the base material 1 on which the conductive paste 2 is printed is pressed under the conditions of 115 ° C., 2.54 kgf / cm 2 (249 kPa) for 50 minutes using the heating and pressing device 4 as shown in FIG.
  • the conductor pattern 3 was formed.
  • Example 2 Silver particles "AG-2-1” manufactured by Dowa Electronics Co., Ltd. having an average particle diameter (D50) of 1.2 ⁇ m are used as conductive particles, and the mass ratio of methyl isobutyl ketone (MIBK) and diethylene glycol monoethyl ether acetate is changed.
  • the conductive pattern 3 was formed in the same manner as in Example 1 except that the blending amount of these was reduced to adjust the viscosity of the conductive paste 2 to 650 dPa ⁇ s.
  • Example 3 As conductive particles, silver particles “AG-2-1” manufactured by Dowa Electronics Co., Ltd. having an average particle diameter (D50) of 1.2 ⁇ m were used, and the viscosity of the conductive paste 2 was adjusted to 400 dPa ⁇ s, except for Conductor pattern 3 was formed in the same manner as in Example 1.
  • Example 4 As conductive particles, silver particles “AG-2-1” manufactured by Dowa Electronics Co., Ltd. having an average particle diameter (D50) of 1.2 ⁇ m are used, and “cellulose acetate butyrate CAB-551-0. A conductor pattern 3 was formed in the same manner as in Example 1 except that 01 "(glass transition temperature (Tg) 85 ° C.) was used. The viscosity of the conductive paste 2 was 400 dPa ⁇ s.
  • Example 2 The same procedure as in Example 1 was followed, except that "Cosmo Shine A4300" (100 ⁇ m thick) manufactured by Toyobo Co., Ltd., which is a PET film, was used as the substrate 1 and no receptor layer 6 was provided on the substrate 1.
  • the conductor pattern 3 was formed.
  • the above line heights H 0 and H before and after pressing mean the heights of the portions protruding from the surface of the receiving layer 6 to the outside, and the above-mentioned inset depths D 0 and D before and after pressing are the receiving layer 6 It means the depth of the part embedded from the surface of the inside. Therefore, the sum of the line height H 0 and embedment depth D 0 before pressing, the thickness T 0 next to the entire conductive paste 2 after printing, the sum of the line height H and embedment depth D after pressing, is formed It becomes thickness T of the whole conductor pattern 3 later.
  • the thickness of the entire conductor pattern 3 after formation as compared to the thickness T 0 of the whole conductive paste 2 after printing T is thicker (that is, T 0 ⁇ T). This is because the width of the portion embedded from the surface of the receptive layer 6 to the inside becomes thinner than the width of the portion protruding to the outside from the surface of the receptive layer 6 by the press, and the portion is embedded deeper accordingly It is from.
  • the line widths W 0 and W before and after the above-mentioned pressing mean the width of the widest portion.
  • the specific resistance was calculated as follows. That is, in Examples 1 to 4 and Comparative Example 1, the conductor pattern 3 of 5 mm ⁇ 30 mm is formed on the surface of the receiving layer 6 of the substrate 1 and the resistance value of this end portion is measured. The volume was determined to calculate the specific resistance. Moreover, about the comparative example 2, the conductor pattern 3 of 5 mm x 30 mm was directly formed in the surface of the base material 1, and while measuring the resistance value of this edge part, the volume of this conductor pattern 3 was calculated
  • the surface resistance was measured by resistance measurement (JIS K 7194) according to the four-point probe method for the conductor pattern 3 formed by printing in a mesh shape so that the line (L) / pitch (P) would be 23 ⁇ m / 250 ⁇ m. .
  • the adhesion of the conductor pattern 3 was evaluated by a crosscut adhesion test (cross-cut tape peeling test) in accordance with JIS D0202-1988.
  • the results are shown in the following Tables 1 to 3 in the form of (the number of grids remaining without peeling) / (the total number of grids formed in the conductor pattern forming portion). For example, in the case of 80/100, 80 grids of 100 grids remain without peeling. The closer to 100/100, the better the adhesion.
  • the conductor pattern of Example 1 has high adhesion to the receptive layer because there are no breakage or breakage as shown in FIG. It was confirmed that resistance can be compatible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Film conducteur qui, sans déconnexions de câblage, permet d'obtenir une précision pour ce qui est de la largeur du conducteur et une résistance réduite, et où le tracé de conduction est formé avec une grande adhérence, sans prise en compte particulière du type de substrat. Le film conducteur comprend : un substrat ; une couche réceptrice comprenant ledit substrat ; et un tracé conducteur dont la largeur conductrice ne dépasse pas 30 µm et qui est formé par impression sur la couche réceptrice susmentionnée d'une pâte conductrice contenant une résine liante et de particules conductrices d'une taille moyenne (D50) de 2 µm maximum. Considéré dans le sens de son épaisseur, ce tracé conducteur comporte au moins une partie qui est noyée dans la couche réceptrice susmentionnée.
PCT/JP2011/066435 2010-07-22 2011-07-20 Film conducteur WO2012011491A1 (fr)

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JP2014006865A (ja) * 2012-05-28 2014-01-16 Fujifilm Corp 導電フィルムおよびタッチパネル
WO2015040916A1 (fr) * 2013-09-17 2015-03-26 株式会社村田製作所 Pâte électroconductrice et composant électronique en céramique
JP2015528753A (ja) * 2012-06-05 2015-10-01 昭和電工株式会社 基材フィルム及び加熱焼成方法
CN111083936A (zh) * 2018-08-20 2020-04-28 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法
KR102686719B1 (ko) * 2019-04-08 2024-07-18 주식회사 엘지화학 투명 기판, 매립형 전극 기판 및 이의 제조방법

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Publication number Priority date Publication date Assignee Title
JP7005092B2 (ja) 2018-03-14 2022-01-21 エルジー・ケム・リミテッド 埋め込み型透明電極基板およびその製造方法

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JPS63118114U (fr) * 1987-01-27 1988-07-30
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JP2007108717A (ja) * 2005-09-13 2007-04-26 Canon Inc 画像形成システム及び画像形成方法及び画質向上方法
JP2010067947A (ja) * 2008-09-09 2010-03-25 Samsung Electro-Mechanics Co Ltd 印刷回路基板及びその製造方法
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JP2014006865A (ja) * 2012-05-28 2014-01-16 Fujifilm Corp 導電フィルムおよびタッチパネル
JP2015528753A (ja) * 2012-06-05 2015-10-01 昭和電工株式会社 基材フィルム及び加熱焼成方法
WO2015040916A1 (fr) * 2013-09-17 2015-03-26 株式会社村田製作所 Pâte électroconductrice et composant électronique en céramique
JP5971506B2 (ja) * 2013-09-17 2016-08-17 株式会社村田製作所 導電性ペーストおよびセラミック電子部品
US9765225B2 (en) 2013-09-17 2017-09-19 Murata Manufacturing Co., Ltd. Conductive paste and ceramic electronic component
CN111083936A (zh) * 2018-08-20 2020-04-28 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法
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CN111083936B (zh) * 2018-08-20 2023-11-07 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法
KR102686719B1 (ko) * 2019-04-08 2024-07-18 주식회사 엘지화학 투명 기판, 매립형 전극 기판 및 이의 제조방법

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JP5406991B2 (ja) 2014-02-05
TWI466139B (zh) 2014-12-21
JPWO2012011491A1 (ja) 2013-09-09

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