WO2011122603A1 - 表面担持触媒の製造方法 - Google Patents
表面担持触媒の製造方法 Download PDFInfo
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- WO2011122603A1 WO2011122603A1 PCT/JP2011/057756 JP2011057756W WO2011122603A1 WO 2011122603 A1 WO2011122603 A1 WO 2011122603A1 JP 2011057756 W JP2011057756 W JP 2011057756W WO 2011122603 A1 WO2011122603 A1 WO 2011122603A1
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- Prior art keywords
- carrier
- catalyst
- support
- organic compound
- hydrophobic organic
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- 239000003054 catalyst Substances 0.000 title claims abstract description 139
- 238000004519 manufacturing process Methods 0.000 title description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 82
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 69
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 65
- 239000007864 aqueous solution Substances 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 45
- 150000003839 salts Chemical class 0.000 claims abstract description 38
- 238000001035 drying Methods 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 48
- 230000003197 catalytic effect Effects 0.000 claims description 26
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000008096 xylene Substances 0.000 claims description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 4
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 2
- 239000011224 oxide ceramic Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 12
- 150000003057 platinum Chemical class 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- 230000009467 reduction Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- -1 basic metal salt Chemical class 0.000 description 6
- 238000006555 catalytic reaction Methods 0.000 description 6
- 238000011068 loading method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000012266 salt solution Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004453 electron probe microanalysis Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 150000002941 palladium compounds Chemical class 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229910052714 tellurium Inorganic materials 0.000 description 3
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 150000000703 Cerium Chemical class 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 229910052728 basic metal Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 150000002258 gallium Chemical class 0.000 description 1
- 150000002290 germanium Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002471 indium Chemical class 0.000 description 1
- 150000002503 iridium Chemical class 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- OVARTBFNCCXQKS-UHFFFAOYSA-N propan-2-one;hydrate Chemical compound O.CC(C)=O OVARTBFNCCXQKS-UHFFFAOYSA-N 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000003283 rhodium Chemical class 0.000 description 1
- 150000003303 ruthenium Chemical class 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003497 tellurium Chemical class 0.000 description 1
- 150000003498 tellurium compounds Chemical class 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
- B01J35/396—Distribution of the active metal ingredient
- B01J35/397—Egg shell like
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- B01J23/02—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the alkali- or alkaline earth metals or beryllium
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- B01J23/08—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of gallium, indium or thallium
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- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
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- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
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- B01J37/0009—Use of binding agents; Moulding; Pressing; Powdering; Granulating; Addition of materials ameliorating the mechanical properties of the product catalyst
- B01J37/0018—Addition of a binding agent or of material, later completely removed among others as result of heat treatment, leaching or washing,(e.g. forming of pores; protective layer, desintegrating by heat)
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Definitions
- the present invention relates to a method for supporting a catalytic metal on the surface of a support.
- the present invention relates to a method of controlling the catalyst component loading depth within an appropriate range.
- a supported catalyst in which a catalyst component is supported on the surface of a carrier having a large specific surface area is widely used industrially due to the economic reason that the amount of the catalyst component can be reduced by supporting the catalyst component with a high degree of dispersion. It has become.
- Patent Document 1 As one of the methods, as shown in Patent Document 1, a porous carrier is impregnated with an acetone solution or an acetone-water mixed solution of a palladium compound, and palladium metal or a palladium compound is supported on the surface of the porous carrier. There is. According to this method, 97% of the palladium catalyst can be deposited within 0.2 mm from the support surface (Patent Document 1, Example 1).
- a carrier carrying a basic metal salt component of at least one kind of metal of Group 1 metal and / or Group 2 metal of the periodic table is heated to a temperature of 60 ° C. or higher and 100 ° C. or lower.
- the amount of palladium and tellurium supported on the surface layer portion from the outer surface of the carrier to a depth of 20% of the radius with respect to the center are 70% or more of the total supported amount of palladium and 50% of the total supported amount of tellurium, respectively.
- the above-described phenyl ester synthesis catalyst can be produced (Patent Document 2, Claim 1).
- Patent Document 3 In contrast to such a conventional technique, the inventors of the present application disclose a method shown in Patent Document 3. In this method, before contacting the catalyst metal salt with the carrier, the carrier is impregnated with a specific liquid compound in advance and diffused into the carrier, and then the compound is solidified inside the carrier (Patent Document 3: Claim). Item 1). According to this method, it is possible to prevent the catalyst component from diffusing into the carrier, and the catalyst component can be supported only on the surface of the carrier and in the vicinity thereof.
- the above method by the present inventors is excellent in that the catalyst component is supported only on the extreme surface of the support.
- this method requires that the impregnated compound is solidified inside the carrier, and after the catalyst component on the carrier surface is fixed, the solidified compound needs to be removed from the inside of the carrier. Therefore, the process becomes somewhat complicated as a method for producing a supported catalyst.
- the loading state of the catalyst component on the carrier affects the manufacturing cost and the catalyst activity.
- it is required to be able to control the supporting state of the catalyst component (supporting depth and presence / absence of diffusion of the catalyst component).
- An object of the present invention is to solve this problem and to provide a simpler method for producing a supported catalyst having high catalytic activity.
- the present inventors diligently studied on the optimal loading state of the catalyst component and its control means. As a result, the following two improvements were assumed.
- the catalyst component loading depth it is not preferable that the catalyst component is too deep.
- the catalyst component is supported on the surface (the outermost surface of the carrier). Is preferably set. This is because the catalyst carrying the catalyst component on the outermost surface may be worn due to contact between the catalysts in the course of use, and there is a concern about loss of the catalyst component.
- the support depth specified by the present inventors is preferably set to 50 ⁇ m or more and 500 ⁇ m or less (more preferably 70 ⁇ m or more and 300 ⁇ m or less), and the control of the support depth is regarded as important.
- the second improvement is elimination of the concentration gradient of the catalyst component.
- This is a phenomenon observed in the above-mentioned Patent Document 3, but there is an intermediate region where the catalyst component concentration is low at the boundary between the support surface region where the catalyst component is supported and the internal region where the catalyst component is not supported. .
- Such an intermediate region can be said to have a low contribution to the catalytic reaction, but this occurs when the support is first filled with water (ice) and then impregnated with an aqueous solution of the catalyst component. It is thought to be caused by melting of ice and diluting the aqueous solution. Therefore, it can be said that a preferable form of the supported state is preferably a state where the contrast with and without the catalyst component is clear.
- the inventors of the present invention have made a study based on the above improvements, and as a result, before contacting the catalytic metal salt, the support is impregnated with a liquid hydrophobic organic compound in advance and diffused into the support, and then the support is supported.
- the present inventors have found a method in which only the hydrophobic organic compound on the surface is volatilized and then the support is brought into contact with an aqueous catalytic metal salt solution (hydrophilic).
- the application of the hydrophobic organic compound can prevent the catalyst component from diffusing into the inside of the carrier due to the relationship between the hydrophobicity and the hydrophilicity, and can make the contrast of the presence or absence of the catalyst component clear. . Further, it was considered that the support depth can be easily controlled by taking advantage of its volatility.
- the present invention relates to a method in which a catalytic metal salt aqueous solution is brought into contact with a porous carrier, and the catalyst metal is supported on the surface of the carrier. And impregnating the carrier, drying the impregnated carrier to volatilize the hydrophobic organic compound on the surface of the carrier, contacting the carrier with an aqueous catalyst metal salt solution, and then bringing the reducing agent into contact with the catalyst metal salt on the surface of the carrier. And a step of supporting the catalyst metal on the surface of the support, characterized in that the catalyst component is supported at a depth of 50 ⁇ m or more and 500 ⁇ m or less from the support surface.
- the characteristics of the method for supporting the catalytic metal on the surface of the porous carrier according to the present invention will be described in detail.
- the features of the present invention can be roughly divided into two steps.
- the first is to prepare for contacting the catalyst metal with the support, a step of impregnating the porous support in a liquid state with a hydrophobic organic compound, and a hydrophobic organic compound on the surface of the support by drying. Is a step of volatilizing.
- the second is to support the catalyst metal on the surface of the carrier. Following the first step, the step of bringing the carrier into contact with the catalytic metal salt aqueous solution and the step of reducing the catalyst metal salt on the surface of the carrier. .
- the porous compound is impregnated with a predetermined compound in order to prevent the catalyst metal from diffusing inside the carrier by filling the gap inside the carrier in advance.
- the compound impregnated in the carrier is a liquid hydrophobic organic compound. This is because the carrier can be impregnated at room temperature (15 to 45 ° C.) and atmospheric pressure without providing any special equipment if it is liquid. By using a hydrophobic organic compound, it becomes easy to prevent the hydrophilic catalytic metal salt aqueous solution from diffusing inside the carrier.
- the liquid hydrophobic organic compound preferably has a molecular weight of 70 to 200. This is because if the molecular weight is within this range, the hydrophobic organic compound does not become a gas or a solid under normal temperature (15 to 45 ° C.) and a normal pressure condition and maintains a liquid state, so that the support can be impregnated.
- the upper limit of the molecular weight is preferably about 200.
- the vapor pressure of the hydrophobic organic compound at 25 ° C. is preferably 1.0 mmHg to 520 mmHg.
- the vapor pressure of the hydrophobic organic compound at 25 ° C. is preferably 1.0 mmHg to 520 mmHg.
- the catalyst penetrates not only to the surface of the carrier but also to the inside of the carrier where the catalytic activity cannot be exhibited.
- the vapor pressure is preferably within the above range.
- the boiling point of the hydrophobic organic compound is preferably 35 ° C. to 180 ° C. This is because when the hydrophobic organic compound is boiled when it is brought into contact with the support, it becomes difficult to handle, and, as with the reason for limiting the vapor pressure, it is necessary to consider the volatility characteristics. is there. If the boiling point is within the above range, the catalyst can be effectively supported on the support surface.
- the hydrophobic organic compound preferably has a water solubility of 0 g / 100 ml to 10 g / 100 ml. This is because when the solubility in water is high, the catalytic metal salt aqueous solution is dissolved in the organic compound, and the catalyst component penetrates into the support. In the present invention, if the solubility in water is a hydrophobic organic compound within the above range, the catalyst can be effectively supported on the support surface.
- hydrophobic organic compound examples include those containing at least one of pentane, hexane, heptane, octane, nonane, decane, toluene, xylene, and ethyl acetate. It corresponds to a liquid hydrophobic organic compound that satisfies the conditions such as solubility of.
- Hexane, heptane, octane, toluene, xylene, and ethyl acetate are particularly preferable among the organic compounds.
- Hexane, heptane, and ethyl acetate have a low boiling point and a high vapor pressure, so that the volatilization rate is moderately high, so that the supporting depth of about 300 ⁇ m can be easily controlled. Since octane has a slightly lower volatilization rate than the former, it is suitable for a supporting depth of around 150 ⁇ m.
- xylene and toluene have a slower volatilization rate, shallow and dense support depth control around 100 ⁇ m is possible. In this way, the carrying depth can be designed by properly using the chemical solution.
- Xylene and toluene may be used for a loading depth of 300 ⁇ m or more, but the volatilization rate is slow, so that the volatility varies depending on the location, and there is a possibility that the carrying depth may be slightly uneven. Therefore, it is preferable to use different organic compounds depending on the loading depth.
- Examples of the method of impregnating the carrier with the hydrophobic organic compound include a method of immersing the carrier in a container containing the hydrophobic organic compound, a method of spraying, and the like.
- the amount of the hydrophobic organic compound to be impregnated is preferably 50% by mass to 100% by mass of the oil absorption amount of the carrier, and if about 80% by mass is used as a guide, the catalyst metal is prevented from diffusing inside the carrier. Therefore, it can be impregnated with a sufficient hydrophobic organic compound.
- the carrier is immersed in a container containing a hydrophobic organic compound, it can be impregnated with a liquid having an oil absorption of 80% by mass or more by immersion for about 2 hours.
- the amount of oil absorption referred to in the present invention is the difference between the mass of the carrier when the dry organic carrier is impregnated with the hydrophobic organic compound and becomes saturated, and the mass of the dry carrier.
- the oil absorption amount in this way, it is possible to calculate how much the hydrophobic organic compound is impregnated in the carrier. For example, when the amount of the hydrophobic organic compound impregnated in the carrier is 100% by mass of the oil absorption, the hydrophobic organic compound penetrates all the voids of the absolutely dry carrier and is saturated. Refers to cases.
- the impregnated carrier is dried and the process proceeds to a step of volatilizing the hydrophobic organic compound on the surface of the carrier.
- the hydrophobic organic compound inside the carrier is preferentially volatilized from the surface of the carrier in contact with the outside air. Utilizing this property, in this step, it is possible to control the thickness of the catalyst metal support layer by adjusting the drying conditions.
- the method for drying the carrier can be any method as long as it can volatilize the hydrophobic organic compound on the surface of the carrier. Examples thereof include a method in which the carrier is allowed to stand for a predetermined time under normal temperature (15 to 45 ° C.), normal pressure conditions and heating conditions, and a method in which warm air is applied to the carrier.
- 10% by mass to 75% by mass of the hydrophobic organic compound impregnated in the carrier is volatilized by drying the carrier by the method as described above. This is because, by volatilizing the hydrophobic organic compound within this range, the catalyst metal can be supported only on the surface of the carrier and its vicinity without impregnating the inside of the carrier.
- volatilization amount is less than 10% by mass, volatilization is not sufficient, and the hydrophobic organic compound partially remains on the surface of the carrier, and the catalyst may not be supported on the entire surface of the carrier.
- the volatilization amount exceeds 75% by mass the catalyst is supported up to the inside of the carrier, which affects the production cost and the catalyst activity.
- the catalyst preferably exerts its effect by being supported in a region from the surface of the carrier to a depth of about 300 ⁇ m.
- a spherical carrier having a diameter of about 2 mm to 4 mm is used.
- the support has a diameter of 2 mm, 39% by mass to It is necessary to volatilize 68% by mass, 27% by mass to 50% by mass in the case of 3 mm, and 20% by mass to 40% by mass in the case of 4 mm. In this case, it is more preferable to volatilize 20% by mass to 68% by mass of the hydrophobic organic compound impregnated on the carrier in order to effectively carry the catalyst.
- the catalyst metal salt is reduced to insolubilize it.
- a reduction step involves insolubilizing the water-soluble catalyst metal salt into a pure metal, oxide or hydroxide complex or compound, so that the catalyst metal is dissolved in the catalyst metal salt aqueous solution or the liquid inside the carrier, thereby supporting the carrier. This is to prevent the catalyst metal from flowing out from the surface, whereby the catalyst metal can be fixed to the support surface.
- the reduction method may be liquid phase reduction or gas phase reduction as long as the catalyst metal can be fixed. For example, there is a method of immersing a carrier in an aqueous ammonia solution as a liquid phase reduction, and a hydrogen heat treatment by heating as a gas phase reduction.
- a reducing compound such as ammonia, hydrazine or sodium borohydride, a reducing gas such as hydrogen, or a basic compound such as sodium hydroxide is used.
- a specific method of the reduction step there is a precipitation method by adding an alkali to an acid catalyst metal salt.
- heat treatment may be performed after the step of reducing the catalyst metal salt on the surface of the carrier.
- the heat treatment is a step of reducing the catalyst metal that has become an oxide or hydroxide complex or compound by the above-described reduction step to a pure metal, or removing impurities.
- the reduction by the gas phase may also serve as a heat treatment step.
- the heat treatment may be performed under conditions generally known in the art.
- the heat treatment may be performed at 500 ° C. for 2 hours.
- the porous carrier is preferably an oxide ceramic.
- the oxide-based ceramic is chemically stable and has been widely used as a material suitable for supporting a catalytic metal.
- it preferably contains at least one of alumina, silica, zeolite, zirconia, ceria, titania, carbon, and diatomaceous earth, and more preferably alumina, silica, zirconia, and zeolite. preferable.
- the shape of the porous carrier is preferably spherical, rod-shaped, cylindrical, or hollow cylindrical.
- a catalyst with a large specific surface area for example, a fine powdery form
- a carrier is a carrier that fixes (supports) the catalyst, and a carrier having the above shape has been used.
- the spherical shape, rod shape, columnar shape, and hollow columnar shape include those having a circular or elliptical cross section.
- the catalytic metal salt aqueous solution may be an aqueous solution containing a metal salt capable of reduction or hydroxide formation, such as a platinum salt aqueous solution, a rhodium salt aqueous solution, a palladium salt aqueous solution, a ruthenium salt aqueous solution, an iridium salt aqueous solution, etc.
- a metal salt capable of reduction or hydroxide formation such as a platinum salt aqueous solution, a rhodium salt aqueous solution, a palladium salt aqueous solution, a ruthenium salt aqueous solution, an iridium salt aqueous solution, etc.
- Platinum group metal salt aqueous solution silver salt aqueous solution, gold salt aqueous solution, transition metal salt aqueous solution, boron salt aqueous solution, aluminum salt aqueous solution, silicon salt aqueous solution, gallium salt aqueous solution, germanium salt aqueous solution, indium salt aqueous solution, tin salt aqueous solution, antimony
- Examples thereof include a salt aqueous solution, a tellurium salt aqueous solution, a bismuth salt aqueous solution, a zinc aqueous solution and a cerium salt aqueous solution, a rare earth salt aqueous solution, an alkali metal salt aqueous solution, an alkaline earth metal salt aqueous solution and the like.
- aqueous solution but what dissolved the catalyst metal salt in the organic solvent can also be used.
- these catalytic metal salt aqueous solutions can be used alone or in combination.
- These catalytic metal salt aqueous solutions are conventionally used because of their high catalytic activity and high bonding strength with oxide-based ceramics as carriers.
- the catalyst metal salt aqueous solution When the catalyst metal is supported on the support, the catalyst metal salt aqueous solution generally has a metal concentration of 0.1% by mass to 15% by mass, and the metal concentration is also used in the present invention. The thing of the said range can be used.
- a spherical alumina carrier having a diameter of 4 mm in an absolutely dry state was immersed in a beaker containing toluene. After dipping until the total amount of the oil absorption of the carrier (100% by mass) is impregnated with toluene, the carrier is pulled up from the beaker and allowed to stand so that the carriers do not contact each other at normal temperature (20 ° C.) and normal pressure. The toluene on the surface of the carrier was volatilized by drying for a predetermined time.
- the toluene has a molecular weight of 92, a vapor pressure of 22 mmHg (20 ° C.), a boiling point of 110.6 ° C., and a solubility of 0.47 mg / 100 ml.
- the volatilization rate is defined as the oil absorption is the difference between the carrier mass when the hydrophobic organic compound is impregnated in an absolutely dry carrier and becomes saturated, and then the saturated mass.
- the difference between the carrier mass and the carrier mass after drying for a predetermined time (referred to as A) was calculated by calculating the ratio of the oil absorption amount in units of mass% (Equation 1). Table 1 shows the relationship between the drying time of the carrier, the volatilization amount, and the thickness of the support layer.
- the support layer thickness is 300 ⁇ m or less, and it was found that the catalyst metal can be effectively supported on the surface of the support and the vicinity thereof.
- Second Embodiment Using the hydrophobic organic compound shown in Table 2, the same treatment as in the first embodiment was performed.
- the volatilization rate was calculated, and the support layer thickness was determined by observing the cross section of the carrier with EPMA.
- Table 3 shows the relationship between the drying time of the carrier, the volatilization rate, and the thickness of the support layer.
- the thickness of the support layer increased as the drying time increased.
- the carrying layer thickness is influenced by the volatilization rate of the hydrophobic organic compound, the same tendency as the result of the first embodiment was recognized in the relationship between the volatilization rate and the carrying layer thickness. From the above results, the control effect of the support layer thickness does not depend on the type of the hydrophobic organic compound, and a constant control effect was recognized even when these differ.
- FIG. 1 shows the relationship between the drying time and the thickness of the support layer when various hydrophobic organic compounds are used in the first embodiment and the second embodiment. Although the volatilization characteristics of the hydrophobic organic compounds are different from each other, it is possible to control the catalyst on the surface of the support and its vicinity by controlling the drying time regardless of which hydrophobic organic compound is used. It can be seen that it can be carried effectively.
- Third Embodiment Using the oxide-based ceramic and the catalyst metal salt shown in Table 4, the same treatment as in the first embodiment was performed, and then the catalyst support layer thickness was measured.
- Comparative Example A carrier similar to that in the first embodiment was immersed in a beaker containing toluene, and immersed until toluene of the entire amount (100% by mass) of the oil absorption amount of the carrier was impregnated. Thereafter, without performing a drying treatment for volatilizing toluene on the surface of the carrier, it was immediately immersed in a beaker containing an aqueous platinum salt solution, and then the carrier was immersed in an aqueous ammonia solution.
- a carrier similar to that of the first embodiment is immersed in a beaker containing a platinum salt aqueous solution for a predetermined time under normal temperature (20 ° C.) and normal pressure conditions without any pretreatment, and the carrier is in a full state. It was. Thereafter, the carrier was quickly lifted from the beaker and immersed in an aqueous ammonia solution to precipitate a platinum salt on the surface of the carrier. After precipitation of the platinum salt, the support was dried at 120 ° C. for 12 hours to remove water inside the support.
- the support that had been treated in the same manner as in Examples 1 to 17 was heat-treated at 200 ° C. to 600 ° C. for 2 hours, so that the support and the catalyst metal were bonded. As a result, it was confirmed that there was no change in the support layer thickness before and after the heat treatment, and that the heat treatment did not affect the support layer thickness.
- the evaluation targets were the catalyst having a support layer thickness of 70 ⁇ m, 300 ⁇ m, and 560 ⁇ m in Example 1, and the catalyst having a support layer thickness of 15 ⁇ m in Example 7 and having no support depth adjustment in the conventional example.
- 50 g of catalyst was charged into a fixed bed reactor, and air mixed with 1000 ppm of organic substances (benzene, toluene, cyclohexane) was passed through (SV30000h ⁇ 1 ), and the purification rate was measured with a total hydrocarbon meter. did.
- the purification rate at each temperature was measured by changing the heating temperature of the catalyst.
- Tables 6 to 8 The test results are shown in Tables 6 to 8.
- the purification rate is improved at the same activation temperature for the catalyst with adjusted support layer thickness (support depth). Further, it is considered that the support layer thickness should be set to 50 ⁇ m or more and 500 ⁇ m or less, preferably 70 ⁇ m or more and 300 ⁇ m or less.
- the present invention relates to a method for supporting a catalytic metal on the surface of a support.
- the catalyst metal can be effectively supported on the surface of the carrier and the vicinity thereof, whereby a surface-supported catalyst having a high catalytic activity can be produced at low cost and more simply. .
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Abstract
Description
Claims (5)
- 多孔質状の担体に触媒金属塩水溶液を接触させ、前記担体の表面に触媒金属を担持させる方法において、
触媒金属塩水溶液を接触させる前に、液状の疎水性有機化合物を担体に含浸させ、
含浸させた担体を乾燥して担体表面の疎水性有機化合物を揮発させた後、
触媒金属塩水溶液に担体を接触させる工程と、
その後担体表面の触媒金属塩に還元剤を接触させ、触媒金属塩を還元して不溶化処理する工程と、
を含み、触媒成分を担体表面から50μm以上500μm以下の深さに担持させることを特徴とする担体の表面に触媒金属を担持させる方法。 - 含浸させる疎水性有機化合物の量は、担体の吸油量の50質量%~100質量%であり、含浸させた疎水性有機化合物のうち、10質量%~75質量%を乾燥により揮発させる請求項1記載の担体の表面に触媒金属を担持させる方法。
- 液状の疎水性有機化合物は、ペンタン、ヘキサン、ヘプタン、オクタン、ノナン、デカン、トルエン、キシレン、酢酸エチルの少なくとも1種類以上を含む請求項1又は請求項2に記載の担体の表面に触媒金属を担持させる方法。
- 担体が酸化物系セラミックである請求項1~請求項3のいずれか1項に記載の担体の表面に触媒金属を担持させる方法。
- 担体の形状が球状、棒状、円柱状、中空円柱状の何れかである請求項1~請求項4のいずれか1項に記載の担体の表面に触媒金属を担持させる方法。
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WO2017140583A1 (de) * | 2016-02-19 | 2017-08-24 | Dürr Systems Ag | Verfahren zur herstellung eines porösen funktionskörpers |
JP2018158279A (ja) * | 2017-03-22 | 2018-10-11 | 岩谷産業株式会社 | 炭化水素合成触媒、炭化水素合成触媒の製造方法、炭化水素製造装置、炭化水素製造方法 |
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CN113856739A (zh) * | 2020-06-30 | 2021-12-31 | 中国石油化工股份有限公司 | 具有脱氢功能的催化剂及其制备方法和应用以及低碳烷烃脱氢生成低碳烯烃的方法 |
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