WO2011118652A1 - Dispositif et procédé de formation de film - Google Patents

Dispositif et procédé de formation de film Download PDF

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Publication number
WO2011118652A1
WO2011118652A1 PCT/JP2011/057028 JP2011057028W WO2011118652A1 WO 2011118652 A1 WO2011118652 A1 WO 2011118652A1 JP 2011057028 W JP2011057028 W JP 2011057028W WO 2011118652 A1 WO2011118652 A1 WO 2011118652A1
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WO
WIPO (PCT)
Prior art keywords
substrate
solution
film forming
droplet
head
Prior art date
Application number
PCT/JP2011/057028
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English (en)
Japanese (ja)
Inventor
博彰 宮浦
唯史 塩崎
宏晃 新畑
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP2012507042A priority Critical patent/JP5492289B2/ja
Priority to CN201180015412.7A priority patent/CN102821869B/zh
Publication of WO2011118652A1 publication Critical patent/WO2011118652A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/21—Ink jet for multi-colour printing
    • B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
    • B41J2/2139—Compensation for malfunctioning nozzles creating dot place or dot size errors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/52—Two layers

Definitions

  • the present invention relates to a film forming apparatus and a film forming method, and more particularly to a film forming apparatus and a film forming method for applying a solution to a substrate by an ink jet method. Furthermore, the present invention relates to a film forming apparatus and a film forming method for forming an alignment film or the like of a liquid crystal panel by an ink jet method. Note that this application claims priority based on Japanese Patent Application No. 2010-73423 filed on March 26, 2010, the entire contents of which are incorporated herein by reference. .
  • a liquid crystal panel which is a component of a liquid crystal display device, has a structure in which a pair of substrates are opposed to each other with a predetermined gap secured. A liquid crystal layer containing liquid crystal molecules is sealed in the gap between the substrates. In addition, an alignment film for aligning liquid crystal molecules is formed on the surfaces of both substrates on the liquid crystal layer side.
  • This alignment film is formed by applying a solution containing polyimide onto the surface of the substrate.
  • a solution containing polyimide onto the surface of the substrate.
  • an inkjet method has been proposed in addition to the spin coating method and the spray method (for example, Patent Document 1).
  • FIGS. 1A and 1B show an ink jet coating apparatus (film forming apparatus) 1000 used when forming an alignment film by an ink jet method.
  • a film forming apparatus 1000 shown in FIGS. 1A and 1B is disclosed in Patent Document 1.
  • FIG. 1A shows a side surface of the film forming apparatus 1000
  • FIG. 1B shows a front surface of the film forming apparatus 1000.
  • FIGS. 1A and 1B includes a base 101 having legs 102 and an attachment plate 103 provided on the upper surface of the base 101.
  • the film forming apparatus 1000 shown in FIGS. A guide member 104 is provided on the mounting plate 103, and a substantially rectangular plate-shaped transfer table 105 is slidably held on the upper surface of the guide member 104 via an inverted U-shaped slide member 106. Has been.
  • the conveyance table 105 is connected to a driving device (not shown). By operating this driving device, the transport table 105 can be driven along the guide member 104.
  • a substrate W such as a glass substrate is detachably held on the upper surface of the transfer table 105.
  • the substrate W is held on the upper surface of the transfer table 105 and transferred along the longitudinal direction of the base 101.
  • a gate-shaped support body 107 is erected in the middle of the longitudinal direction of the base 101 so as to straddle the pair of guide members 104.
  • Mounting members 108 are installed horizontally on the upper sides of the support 107.
  • the attachment member 108 is provided with a head table 131 that is driven along a direction orthogonal to the transport table 105.
  • the head table 131 is driven by a drive source 132.
  • FIGS. 2 (a) and 2 (b) On one side of the head table 131, a plurality of inkjet heads 109 are arranged in a line with respect to the transport direction of the substrate W.
  • the head 109 has a structure as shown in FIGS. 2 (a) and 2 (b).
  • 2A is a cross-sectional view of the head 109
  • FIG. 2B is a bottom view of the head 109.
  • Each head 109 includes a head body 111.
  • the head main body 111 has an opening 112 that communicates from the upper surface side to the lower surface side, and the lower surface opening is closed by a flexible plate 113.
  • the flexible plate 113 is covered with a nozzle plate 114, whereby a liquid chamber 115 is formed between the flexible plate 113 and the nozzle plate 114 on the lower surface side of the head body 111.
  • a supply hole 117 communicating with the liquid chamber 115 is formed at one end of the head body 111 in the longitudinal direction. From the supply hole 117, a solution for forming a functional thin film such as an alignment film or a resist is supplied to the liquid chamber 115 through a supply pipe 117a. Thereby, the liquid chamber 115 is filled with the solution.
  • a nozzle plate 114 as shown in FIG. 2B, a plurality of nozzles 116 are arranged at predetermined intervals along substantially the center in the width direction orthogonal to the longitudinal direction of the head main body 111.
  • a piezoelectric element 118 is provided on the upper surface of the flexible plate 113 so as to face the nozzle 116.
  • the plurality of heads 109 are arranged such that the nozzles 116 are spaced at regular intervals along the width direction orthogonal to the transport direction of the substrate W.
  • the spraying of the solution is executed a plurality of times (here, four times) while changing the spraying position in the width direction.
  • a thin film is formed on the surface of the substrate W by spray application of a solution from the nozzle 116 while moving the substrate W a plurality of times (for example, four times or two times). be able to.
  • all the nozzles 116 in the film forming apparatus 1000 may not reliably inject the solution every time.
  • a thin film for example, an alignment film
  • a region 220 that is not satisfactorily applied may occur on the surface of the substrate 200. . This is because there is a problem in the injection from the nozzle 116 and a region 220 in which the thin film 210 is not formed well is generated.
  • the present invention has been made in view of the above points, and a main object thereof is to provide a film forming apparatus or a film forming method capable of alleviating or suppressing the generation of an unapplied region in an application method using an inkjet method. There is to do.
  • a film forming apparatus is a film forming apparatus for applying a solution to a substrate by an inkjet method, a head unit including a nozzle for discharging the solution to the substrate, a stage for holding the substrate, and the head unit And a control device that controls the movement of the moving device, and the head portion has a length that crosses the substrate placed on the stage.
  • the control device includes a first step (a) for disposing the head portion above a central region of the substrate, and the moving device moves the head portion above the substrate in a first direction.
  • the substrate is a mother glass substrate for a liquid crystal panel
  • the solution includes a material constituting an alignment film.
  • the shape of the substrate is a rectangle having a long side and a short side, and the first direction is a direction along a direction in which the long side extends.
  • the ink ejected in the second step (b) in the region of the substrate where the movement of the head portion overlaps, the ink ejected in the second step (b) is used.
  • the head unit is moved while discharging the solution in the third step (c) so as to overlap at least part of the solution.
  • the ink ejected in the third step (c) in the region of the substrate where the movement of the head portion overlaps, the ink ejected in the third step (c)
  • the head unit is moved while discharging the solution in the fourth step (d) so as to overlap at least part of the solution.
  • a film forming method is a film forming method in which a solution is applied to a substrate by an ink jet method, and a head portion including a nozzle for discharging the solution to the substrate is disposed above a central region of the substrate.
  • the substrate is a mother glass substrate for a liquid crystal panel
  • the solution includes a material constituting an alignment film
  • the shape of the substrate is a rectangle having a long side and a short side.
  • the first direction is a direction along the direction in which the long side extends.
  • the head portion in the third step (c), the head portion is moved while discharging the solution so as to overlap at least a part of the solution discharged in the second step (b).
  • the head portion is moved while discharging the solution so as to overlap at least part of the solution discharged in the third step (c).
  • the head portion is moved to the first end portion of the substrate in the first direction, and then the head is moved to the second end portion of the substrate in the second direction. Then, the head is moved to the central region of the substrate in the first direction. Accordingly, when the head portion is moved from the end of the substrate, the solution discharged (leveling) is smoothed (leveled) even in the vicinity of the first end or the second end where the solution is likely to be smoothed (leveling). A second discharge can be performed before proceeding. As a result, even if there is a portion where the second discharge is not executed, it is possible to suppress or alleviate the occurrence of the thin film formation uneven region.
  • (A) And (b) is the side view and front view of the inkjet coating apparatus 1000, respectively.
  • (A) And (b) is sectional drawing and the bottom view which show the structure of the head 109, respectively. It is a figure which shows the board
  • (A) to (c) is a diagram showing droplets ejected by a two-scan coating method.
  • (A) to (d) are process top views for explaining a film forming method according to an embodiment of the present invention. It is a top view for demonstrating the film-forming method which concerns on embodiment of this invention.
  • (A) And (b) is a figure which shows the state of a droplet.
  • (A) to (d) are process cross-sectional views for explaining a film forming method according to an embodiment of the present invention.
  • (A) to (d) is a process sectional view for explaining a film forming method as a comparative example. It is a figure which shows typically the bottom face of the head part 50 which concerns on embodiment of this invention. It is a top view for demonstrating an example of the movement of the board
  • FIG. 4 shows a process of forming a thin film on the surface of the substrate 200 by moving the head unit 250 including a nozzle for discharging a solution (droplet).
  • 5A to 5C show a state in which the droplets ejected from the nozzles in the head unit 250 are applied on the substrate 200.
  • the head unit 250 including a nozzle moves from one end (not shown) of the substrate 200 to the other end 205b of the substrate 200 while discharging droplets from the nozzle (one scan 201).
  • the head unit 250 is folded and moved while discharging droplets from the nozzle from the other end 205b of the substrate 200 toward one end (not shown) (two scans 202).
  • the droplets 211 ejected from the nozzles are arranged on the surface of the substrate 200.
  • the droplet 212 is ejected to a region located between the droplets 211.
  • a predetermined cause for example, a nozzle failure such as pressure failure or the presence of foreign matter
  • the droplet 212 is positioned between the droplets 211 on the surface of the substrate 200, and almost the entire surface of the substrate 200 is applied.
  • the portion (215) where the droplet 212 was not ejected in the two scans 202 becomes a region (thin film formation unevenness) 221 that was not properly applied, resulting in uneven formation of the thin film 210 in FIG.
  • the region 220 (or the region where the thin film 210 is not formed) 220 becomes.
  • the two movements of one scan 201 and two scans 202 have been described, the same applies to three or more movements (for example, four movements in Patent Document 1).
  • the inventor of the present application is examining the cause of the liquid droplets not being ejected from the nozzles (for example, the presence of foreign matter around the nozzles) so that the formation uneven region 220 of the thin film 210 as described above does not occur, and countermeasures therefor Is done every day.
  • the size of a mother glass for a liquid crystal panel is 1 meter or more on one side. In particular, in the 10th generation mother glass, the size is about 3 meters (for example, 2880 mm ⁇ 3130 mm) on one side.
  • the number of discharge holes (orifices) of the nozzle is enormous (for example, several thousand), and it is technical that all the holes discharge liquid droplets each time (that is, no single non-discharge occurs). It is extremely difficult.
  • the inventor of the present application diligently studied a method that can suppress or alleviate the occurrence of uneven formation of the thin film by spreading the droplets satisfactorily on the surface of the substrate 200 even if the non-ejection of the droplets occurs.
  • the present invention has been achieved.
  • the film forming apparatus 100 of this embodiment is an apparatus (inkjet coating apparatus) that applies a solution to a substrate by an inkjet method.
  • the film forming apparatus 100 of this embodiment includes a head unit 50 including a nozzle (not shown) that discharges a solution to the substrate 20 and a stage 10 that holds the substrate 20. Yes.
  • a plurality of inkjet heads are housed and arranged in the head cover 50 in the head cover.
  • a plurality of nozzles are formed in one inkjet head.
  • the surface (discharge surface) from which the solution is discharged from the nozzle is disposed to face the surface of the substrate 20.
  • an alignment film is formed on the surface of the substrate 20 by discharging a solution (coating liquid) from the head unit 50.
  • the film forming apparatus 100 of the present embodiment is provided with a moving device 30 that relatively moves the head unit 50 and the stage 10.
  • the head unit 50 is fixed and the stage 10 is movable.
  • the stage 10 can be fixed and the head unit 50 can be movable.
  • a pipe (not shown) for supplying an inkjet coating solution is connected to the head unit 50, there is a technical advantage in that the head unit 50 has a fixed configuration.
  • the substrate 20 before coating is placed on the stage 10 from a transport device (not shown) that transports the substrate 20 from the previous process, and the substrate 20 after coating is moved to the subsequent process. Therefore, there is also a technical advantage in keeping the stage 10 in a movable configuration.
  • a control device 35 that controls the movement of the moving device 30 is connected to the moving device 30 of the present embodiment.
  • the control device 35 is, for example, a personal computer (PC), for example, a storage device (for example, a hard disk, a semiconductor memory, an optical disc, etc.) in which a program (stage control program) that can control the movement of the moving device 30 is stored, An arithmetic circuit (CPU) and input / output devices (display, keyboard, mouse, etc.) are included.
  • the stage 10 holding the substrate 20 can be moved in the XY direction under the control of the control device 35.
  • the control device 35 of the present embodiment can also control the discharge of the solution from the head unit 50.
  • the height control (control in the Z direction) of the head unit 50 can be performed.
  • the substrate 20 of the present embodiment is, for example, a glass substrate, and the substrate 20 of the present embodiment is a glass substrate for a liquid crystal panel.
  • the substrate 20 is a mother glass before being cut out to the dimensions of the liquid crystal panel.
  • the size of the mother glass as the substrate 20 is 1 meter or more on one side. Specifically, when the substrate 20 is a 10th generation mother glass, the size is 2880 mm (W) ⁇ 3130 mm (L).
  • the substrate 20 is not limited to the mother glass before being cut out to the dimensions of the liquid crystal panel, but may be glass having the size of the liquid crystal panel after being cut out.
  • the substrate 20 may be an array substrate on which a thin film transistor (TFT) is manufactured (or a product in the middle of the fabrication), or a CF substrate on which a color filter (CF) is formed (or a product in the middle of the fabrication). It may be.
  • the substrate 20 may be a glass substrate, a resin substrate, or another thin plate such as a wafer.
  • the substrate 20 is not limited to the liquid crystal panel 20 and may be a thin substrate for manufacturing a PDP, an organic EL panel, and other flat panel displays.
  • the head unit 50 of the present embodiment has a length that crosses the substrate 20 placed on the stage 10.
  • the longitudinal direction of the head portion 50 extends in the Y direction.
  • the length in the longitudinal direction (length extending in the Y direction) of the head unit 50 is about 3 meters or more.
  • the film forming apparatus 100 of the present embodiment operates as follows. First, as shown in FIG. 6A, the head unit 50 is disposed above the central region 21 of the substrate 20. Specifically, the moving device 30 controlled by the control device 35 moves the stage 10 to position the central region 21 of the substrate 20 below the head unit 50.
  • the central region 21 of the substrate 20 is a portion located between one end (left end) 25a and the other end (right end) 25b of the substrate 20. Specifically, centered on a center line 25c (an imaginary line at the position of L / 2) located between one end 25a and the other end 25b of the substrate 20, L / 4 on each of the one end 25a side and the other end 25b side. This is an area that has been expanded.
  • the central region 21 of the substrate 20 is set to the center line 25 c, that is, the head unit 50 may be disposed above the center line 25 c of the substrate 20.
  • the head unit 50 is moved to the first end (left end) 25a of the substrate 20 in the first direction.
  • the moving device 30 moves the stage 10 in the direction of arrow 11 (right direction). That is, the substrate 20 is moved to the right side.
  • the head unit 50 is moved leftward ( ⁇ X direction) with respect to the substrate 20.
  • the region 22 in this example, the left half of the left half where the first droplet was applied to the surface of the substrate 20 that was located below the head unit 50 during the movement. Area
  • the head unit 50 is moved to the second end (right end) 25b of the substrate 20 in the second direction.
  • the moving device 30 moves the stage 10 in the direction of the arrow 12 (left direction). That is, the substrate 20 is moved to the left side.
  • the head unit 50 is moved to the right (+ X direction) with the substrate 20 as a reference.
  • the region 22 (left half region) was given a second droplet.
  • a region 23 to which the first droplet is applied (in this example, the region on the right half) is generated.
  • the head unit 50 is moved again to the central region 21 (here, the center line 25c) of the substrate 20 in the first direction.
  • the moving device 30 moves the stage 10 in the direction of the arrow 13 (right direction). That is, the substrate 20 is moved to the right side.
  • the head unit 50 is moved to the left ( ⁇ X direction) with respect to the substrate 20.
  • both the region 22 (the left half region) and the region 23 (the right half region) have a second droplet on the surface of the substrate 20.
  • FIG. 7 is a diagram for explaining a process of forming a thin film on the surface of the substrate 20 by moving the head unit 50 having a nozzle for discharging a solution.
  • the head unit 50 moves relative to the substrate 20 as indicated by the arrow 11 (one scan), reaches the one end 25a of the substrate 20, and then turns back and moves as indicated by the arrow 12. (2 scans).
  • the head unit 50 is not moved from the central region 21 of the substrate 20 first, but the head unit 50 is first moved from one end of the substrate 20 to the other. Consider the case of reaching the end of the (comparative example).
  • the state of the surface of the substrate 20 at that time is as shown in FIG. become. That is, the shape of the droplet 211 ejected at the first time is deformed as compared with the time immediately after the ejection because the head portion 50 takes a long time to return (because the head portion 50 reciprocates the mother glass 20 once). is doing. More specifically, the droplet 211 wets and spreads with time, in other words, changes from a substantially spherical shape to a substantially conical shape (mountain shape) due to leveling (smoothing) due to the surface tension of the droplet 211. .
  • the droplet 212 discharged for the second time is directed on the substantially conical droplet 211. Further, here, there is a portion of the droplet 215 that is not ejected, and the second droplet does not reach the substrate 20 at this location.
  • the head unit 50 is first moved from the central region 21 of the substrate 20, so the state of the surface of the substrate 20 around the one end 25 a of the substrate 20 is as shown in FIG. As shown. That is, the droplet 51 ejected for the first time has not changed much from the shape immediately after ejection since almost no time has passed while the head unit 50 returns. This is because even if the size of the mother glass 20 is large (for example, 3 meters), the head portion 50 only reciprocates around the one end 25a. More specifically, leveling (smoothing) due to the surface tension of the droplet 51 does not occur much compared to the droplet 211 of FIG.
  • the droplet 51 discharged for the first time has a substantially spherical shape.
  • the droplet 52 discharged for the second time is directed on the substantially spherical droplet 51.
  • FIGS. 9A to 9D are process cross-sectional views for explaining the coating process of this embodiment.
  • droplets 51 (51a and the like) are formed on the surface of the substrate 20 by the first discharge.
  • the droplet 51 is ejected for the second time while the droplet 51 is substantially spherical, and a droplet 52 (such as 52 a) is dropped on the droplet 51.
  • a droplet 52 (such as 52 a) is dropped on the droplet 51.
  • the droplet 52b was supposed to be ejected to the portion 55 located above the droplet 51b, but was not actually ejected.
  • the droplet 52 hits the droplet 51, and the droplet 52 bounces around the droplet 51 as indicated by an arrow 53.
  • the droplet 52b did not come from above the droplet 51b, here, the portion 53a where the droplet 52a bounces and the portion 53c where the droplet 52c bounces are introduced around the droplet 51b.
  • the portion 53 where the droplet 52 bounces becomes the portion 54 that fills the region between the droplets 51.
  • the portions 54a and 54c are positioned around the droplet 51b, the influence of the droplet 52b not being ejected (thin film formation unevenness) can be suppressed or alleviated.
  • the liquid droplet 51 and the part 54 are integrated with each other as the liquid droplet 51 becomes familiar with the part 54 generated from the liquid droplet 52 over time. Therefore, the problem of uneven formation of the thin film is further alleviated.
  • FIGS. 10A to 10D are process cross-sectional views for explaining a coating process of a comparative example.
  • droplets 211 (211a and the like) are formed on the surface of the substrate 20 by the first discharge.
  • the droplet 211 has a substantially conical shape (mountain shape) due to leveling over time.
  • a second discharge is performed to drop a droplet 212 (212a or the like) on the mountain-shaped droplet 211.
  • the droplet 212b was to be discharged to the location 215 located above the droplet 211b, but was not actually discharged.
  • the droplet 212 hits the droplet 211, and the droplet 212 bounces around the droplet 211 as indicated by an arrow 213.
  • the shape of the droplet 211 is not a substantially spherical shape but is a leveled shape (mountain shape)
  • the momentum (arrow 213) that the droplet 211 bounces and spreads is the momentum (arrow arrow) shown in FIG. 53). Therefore, the amount of the portion 213a where the droplet 212a bounces and the portion 213c where the droplet 212c bounces is introduced around the droplet 211b does not increase.
  • the portion 213 where the droplet 212 bounces becomes the portion 214 that fills the region between the droplets 211, but the thin film formation unevenness around the droplet 211b. Region 225 will result. Thereafter, even if the droplet 211 becomes familiar with the portion 214 generated from the droplet 212 with time, the thin film formation uneven region 225 may remain around the droplet 211b. And it becomes the area
  • the head unit 50 is disposed above the central region 21 (for example, the center line 25c) of the substrate 20 (see FIG. 6A)
  • the head unit is arranged. 50 is moved to the first end portion 25a (see FIG. 6B), then the head portion 50 is moved to the second end portion 25b (FIG. 6C), and then the head portion is moved to the central region 21. 50 is moved (see FIG. 6D). Therefore, the second droplet 52 can be applied to the droplet 51 before the leveling of the droplet 51 discharged from the head unit 50 for the first time proceeds (see FIG. 9).
  • the non-ejection (52b) of the droplet 52 occurs, it is possible to suppress or alleviate the occurrence of a thin film formation uneven region.
  • the second discharge can be performed in about half the time compared to the one-way application method (two-scan method) in which the discharge is started from the one end 25a of the substrate 20.
  • the discharge since the discharge is started from the central region 21 (or the center line 25c) of the substrate 20 and the second discharge is performed for each half surface (22, 23), it is compared with the one-way application method (two-scan method).
  • the time difference between the first discharge and the second discharge can be shortened. Thereby, it is possible to reduce the influence of the uneven formation of the thin film at the location where the discharge is lost.
  • the method of starting discharge from the central region 21 of the substrate 20 in this embodiment has a slightly longer application time than the one-way application method (two-scan method) in which discharge is started from one end 25a of the substrate 20.
  • the application time is short compared to the method of applying by performing two reciprocating (or more) discharges.
  • a short coating time is preferable because throughput can be improved in the liquid crystal panel production line.
  • the ability of the present embodiment to suppress or alleviate the occurrence of thin film formation uneven regions can suppress the generation of defective liquid crystal panels (that is, improve yield) or in the thin film correction process.
  • the loss of the manufacturing process time loss and cost loss) can be reduced.
  • an alignment film is formed on the surface of the substrate 20 by discharging a solution (coating liquid) from the head unit 50.
  • the solution (coating liquid) is, for example, a polyimide liquid or a polyamic film.
  • the solution supplied to the head unit 50 can be changed by a film (functional film) formed on the substrate 20.
  • the film (functional film) formed on the substrate 20 include a resist film, a conductive film, and an insulating film, and a necessary solution for the film is used. What is necessary is just to select the suitable discharge amount of the solution discharged from the head part 50 according to various manufacturing conditions. The ejection amount can be adjusted by changing the voltage of the piezo element, for example.
  • FIG. 11 shows the configuration of the bottom surface of the head unit 50 in the film forming apparatus 100 of the present embodiment.
  • a plurality of inkjet heads 70 are arranged in the head unit 50. For example, several tens of inkjet heads 70 are accommodated in the head unit 50.
  • Each ink jet head 70 is formed with a plurality of nozzles 72 from which a solution is discharged. For example, hundreds of nozzles 72 are formed in one inkjet head 70.
  • the arrangement of the nozzles 72 shown in FIG. 11 is a staggered shape, the nozzles 72 may be arranged in a line. Alternatively, the arrangement of the nozzles 72 is not limited to a two-stage staggered shape, but may be another arrangement (for example, a three-stage oblique arrangement).
  • the substrate 20 is moved along the direction in which the long side (L) or the short side (W) of the rectangular substrate 20 extends. However, as shown in FIG. It is also possible to move the substrate 20 at an angle (arrows 11, 12, 13). By moving the substrate 20 obliquely, depending on the pattern of the substrate 20 (for example, an array substrate), the solution (coating liquid) from the head unit 50 exhibits a predetermined wet spread, and as a result, a specific part of the substrate 20 This is because there is a case where it is possible to alleviate the phenomenon that it is difficult to get wet.
  • the central region 21 or the center line 25c may be defined with reference to the vertices 27a and 27b farthest from the center of the substrate 20.
  • FIG. 13 shows an example of the configuration of the film forming apparatus 100 of the present embodiment.
  • the inkjet head 70 and the nozzle 72 located on the bottom surface of the head unit 50 are represented.
  • the inkjet heads 70 are not arranged in a line but are arranged so as to be diagonally arranged, but not limited thereto, other arrangements may be adopted. .
  • the inkjet head 70 of the head unit 50 is connected to a solution supply unit (for example, a polyimide supply tank) 80 and a waste liquid unit (for example, a waste liquid tank) 82.
  • a solution supply unit for example, a polyimide supply tank
  • a waste liquid unit for example, a waste liquid tank
  • each inkjet head 70 is connected to a supply pipe 85 via a branch pipe 87 and a waste liquid pipe 86 via a branch pipe 89.
  • the supply pipe 85 is connected to the solution supply unit 80, while the waste liquid pipe 86 is connected to the waste liquid part 82.
  • the solution in the solution supply unit 80 advances through the supply pipe 85 as indicated by an arrow 81, and is supplied to the inkjet head 70 through the branch pipe 87.
  • the waste liquid in the inkjet head 70 passes through the branch pipe 89, travels through the waste liquid pipe 86 as indicated by an arrow 83, and moves to the waste liquid portion 82.
  • the valve 88 88a, 88b
  • a film forming apparatus or a film forming method capable of alleviating or suppressing the occurrence of an unapplied region in a method of applying by an ink jet method.

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  • Coating Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Selon l'invention, l'apparition de zones non couvertes lors d'une couverture par jet d'encre, est limitée. Plus précisément, l'invention concerne un dispositif de formation de film (100) qui couvre un substrat (20) d'une solution par jet d'encre, et qui est équipé : d'une partie tête (50) contenant une buse qui décharge une solution sur le substrat (20); d'une platine (10) qui maintient le substrat (20); et d'un dispositif de commande (35). La partie tête (50) possède une longueur appropriée pour traverser le substrat (20). Le dispositif de commande (35) est configuré de sorte à exécuter : une première étape (a) dans laquelle la partie tête (50) est disposée au dessus d'une zone centrale (21) du substrat (20); une seconde étape (b) dans laquelle la partie tête (50) est déplacée selon une première direction jusqu'à une première partie extrémité (25a) du substrat (20); une troisième étape (c) dans laquelle la partie tête (50) est déplacée selon une seconde direction jusqu'à une seconde partie extrémité (25b); et une quatrième étape (d) dans laquelle la partie tête (50) est déplacée selon la première direction jusqu'à la zone centrale (21) du substrat (20).
PCT/JP2011/057028 2010-03-26 2011-03-23 Dispositif et procédé de formation de film WO2011118652A1 (fr)

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JP2012507042A JP5492289B2 (ja) 2010-03-26 2011-03-23 成膜装置および成膜方法
CN201180015412.7A CN102821869B (zh) 2010-03-26 2011-03-23 成膜装置和成膜方法

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JP2016518675A (ja) * 2013-03-13 2016-06-23 カティーバ， インコーポレイテッド 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2016178086A (ja) * 2012-11-30 2016-10-06 カティーバ， インコーポレイテッド ガスエンクロージャアセンブリおよびシステム
US10262881B2 (en) 2014-11-26 2019-04-16 Kateeva, Inc. Environmentally controlled coating systems
US10309665B2 (en) 2008-06-13 2019-06-04 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US10500880B2 (en) 2008-06-13 2019-12-10 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
US10519535B2 (en) 2008-06-13 2019-12-31 Kateeva Inc. Method and apparatus for load-locked printing
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US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
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US10851450B2 (en) 2008-06-13 2020-12-01 Kateeva, Inc. Method and apparatus for load-locked printing
US11034176B2 (en) 2008-06-13 2021-06-15 Kateeva, Inc. Gas enclosure assembly and system
US11802331B2 (en) 2008-06-13 2023-10-31 Kateeva, Inc. Method and apparatus for load-locked printing
US10900678B2 (en) 2008-06-13 2021-01-26 Kateeva, Inc. Gas enclosure assembly and system
US10309665B2 (en) 2008-06-13 2019-06-04 Kateeva, Inc. Gas enclosure assembly and system
US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US10500880B2 (en) 2008-06-13 2019-12-10 Kateeva, Inc. Gas enclosure systems and methods utilizing an auxiliary enclosure
US10519535B2 (en) 2008-06-13 2019-12-31 Kateeva Inc. Method and apparatus for load-locked printing
US11926902B2 (en) 2008-06-13 2024-03-12 Kateeva, Inc. Method and apparatus for load-locked printing
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US10654299B2 (en) 2008-06-13 2020-05-19 Kateeva, Inc. Low-particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
US11230757B2 (en) 2008-06-13 2022-01-25 Kateeva, Inc. Method and apparatus for load-locked printing
JP2016178086A (ja) * 2012-11-30 2016-10-06 カティーバ， インコーポレイテッド ガスエンクロージャアセンブリおよびシステム
JP2018041744A (ja) * 2013-03-13 2018-03-15 カティーバ， インコーポレイテッド 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2016518675A (ja) * 2013-03-13 2016-06-23 カティーバ， インコーポレイテッド 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US10262881B2 (en) 2014-11-26 2019-04-16 Kateeva, Inc. Environmentally controlled coating systems
US12040203B2 (en) 2021-07-26 2024-07-16 Kateeva, Inc. Techniques for thermal treatment of electronic devices

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JPWO2011118652A1 (ja) 2013-07-04
CN102821869A (zh) 2012-12-12
CN102821869B (zh) 2015-06-24
JP5492289B2 (ja) 2014-05-14

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