WO2011115100A1 - 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 - Google Patents
光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 Download PDFInfo
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- WO2011115100A1 WO2011115100A1 PCT/JP2011/056034 JP2011056034W WO2011115100A1 WO 2011115100 A1 WO2011115100 A1 WO 2011115100A1 JP 2011056034 W JP2011056034 W JP 2011056034W WO 2011115100 A1 WO2011115100 A1 WO 2011115100A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Definitions
- the present invention is a photocurable thermosetting resin composition that can be developed with an aqueous alkali solution, in particular, a solder resist composition that is photocured by ultraviolet exposure or laser exposure, its dry film and cured product, and these.
- the present invention relates to a printed wiring board having a cured film.
- the current alkali development type photo solder resist still has problems in terms of durability. That is, the alkali resistance, water resistance, heat resistance and the like are inferior to those of conventional thermosetting type and solvent developing type.
- the alkali-developable photo solder resist is mainly composed of a hydrophilic group in order to enable alkali development, and it is easy for chemicals, water, water vapor, etc. to permeate, resulting in reduced chemical resistance and resist film. This is thought to reduce the adhesion between copper and copper.
- the alkali resistance as chemical resistance is weak, especially in semiconductor packages such as BGA (Ball Grid Array) and CSP (Chip Scale Package), especially PCT resistance (pressure cooker test resistance) that should be called moisture heat resistance.
- Patent Document 1 discloses a photosensitive resin obtained by adding an acid anhydride to a reaction product of a novolak type epoxy compound and an unsaturated monobasic acid, a photopolymerization initiator, and a diluent. And a solder resist composition comprising an epoxy compound has been reported. Japanese Patent Laid-Open No.
- Patent Document 2 adds (meth) acrylic acid to an epoxy resin obtained by reacting a reaction product of salicylaldehyde with a monohydric phenol with epichlorohydrin. Furthermore, a solder resist composition comprising a photosensitive resin obtained by reacting a polybasic carboxylic acid or its anhydride, a photopolymerization initiator, an organic solvent, and the like is disclosed.
- the epoxy acrylate-modified resin as described above has a problem that many hydroxyl groups derived from epoxy acrylate remain and water resistance is originally poor.
- the present invention has been made in view of the above-described problems of the prior art, and its main purpose is a solder resist for semiconductor packages that requires a high temperature thermal history, and is important PCT resistance and HAST resistance.
- An object of the present invention is to provide a photocurable thermosetting resin composition capable of forming a cured film having electroless gold plating resistance and cold shock resistance. Furthermore, the object of the present invention is to provide a dry film and a cured product excellent in various properties as described above obtained by using such a photocurable thermosetting resin composition, and a solder resist using the dry film and the cured product.
- An object of the present invention is to provide a printed wiring board on which a cured film such as the above is formed.
- a carboxyl group-containing resin (excluding a carboxyl group-containing resin starting from an epoxy resin), a photopolymerization initiator, and a naphthalene-containing epoxy resin are contained.
- a photocurable thermosetting resin composition that can be developed with an aqueous alkali solution is provided.
- the carboxyl group-containing resin preferably has a photosensitive group.
- a photocurable thermosetting dry film obtained by applying and drying the photocurable thermosetting resin composition on a carrier film, and the photocurable thermosetting resin composition
- a cured product obtained by photocuring a product or a dry film, preferably by photocuring in a pattern with a light source having a wavelength of 350 nm to 410 nm.
- the photocurable thermosetting resin composition or the dry film is photocured in a pattern by irradiation with active energy rays, preferably by direct drawing of ultraviolet rays, and then thermally cured.
- a printed wiring board having the resulting cured film is also provided.
- the photo-curable thermosetting resin composition of the present invention contains a carboxyl group-containing resin that does not use an epoxy resin as a starting material as a component that can be developed with an alkaline aqueous solution, and contains a naphthalene-containing epoxy resin in combination with this. Therefore, not only the toughness and heat resistance of the cured coating film are improved, but also there is little change in physical properties after the thermal history of the coating film and during overcuring. Surprisingly, it has been found that even if the heat curing temperature is low, the resin has good curability, and even when a heat history is applied at a higher temperature, the physical properties are not changed and the good characteristics are maintained. Therefore, by using the photocurable thermosetting resin composition of the present invention, it is possible to form a cured film having PCT resistance, HAST resistance, electroless gold plating resistance, and excellent heat resistance, which are important as a solder resist for semiconductor packages. .
- the photocurable thermosetting resin composition of the present invention is characterized by containing a carboxyl group-containing resin not using an epoxy resin as a starting material, a photopolymerization initiator, and a naphthalene-containing epoxy resin.
- a carboxyl group-containing resin various conventionally known carboxyl group-containing resins can be used as long as the carboxyl group-containing resin does not use an epoxy resin as a starting material. Among them, a carboxyl having an ethylenically unsaturated double bond in the molecule.
- a group-containing photosensitive resin is preferable in terms of photocurability and development resistance.
- the unsaturated double bond is preferably derived from acrylic acid, methacrylic acid or derivatives thereof.
- carboxyl group-containing resin that can be used in the present invention, compounds listed below (any of oligomers and polymers) may be preferable.
- compounds listed below (any of oligomers and polymers) may be preferable.
- (1) 2 or more per molecule such as bisphenol A, bisphenol F, bisphenol S, novolac type phenol resin, poly-p-hydroxystyrene, condensate of naphthol and aldehydes, condensate of dihydroxynaphthalene and aldehydes
- a carboxyl group-containing photosensitive resin obtained by reacting a product with a polybasic acid anhydride such as maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyromelli
- An unsaturated group-containing monocarboxylic acid is reacted with a reaction product obtained by reacting a compound having two or more phenolic hydroxyl groups in one molecule with a cyclic carbonate compound such as ethylene carbonate or propylene carbonate.
- a carboxyl group-containing photosensitive resin obtained by reacting the resulting reaction product with a polybasic acid anhydride.
- Diisocyanate compounds such as aliphatic diisocyanate, branched aliphatic diisocyanate, alicyclic diisocyanate, aromatic diisocyanate, polycarbonate polyol, polyether polyol, polyester polyol, polyolefin polyol, acrylic polyol, bisphenol A type A terminal carboxyl group-containing urethane resin obtained by reacting an acid anhydride with a terminal of a urethane resin by a polyaddition reaction of a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- a carboxyl group-containing urethane resin obtained by adding a compound having two isocyanate groups and one or more (meth) acryloyl groups, and then terminally (meth) acrylating.
- a carboxyl group-containing resin obtained by copolymerization of an unsaturated carboxylic acid such as (meth) acrylic acid and an unsaturated group-containing compound such as styrene, ⁇ -methylstyrene, lower alkyl (meth) acrylate, and isobutylene.
- a polyfunctional oxetane resin as described later is reacted with a dicarboxylic acid such as adipic acid, phthalic acid, hexahydrophthalic acid, etc., and the resulting primary hydroxyl group is reacted with phthalic anhydride, tetrahydrophthalic anhydride, hexahydroanhydride
- a carboxyl group-containing polyester resin to which a dibasic acid anhydride such as phthalic acid is added is added to one epoxy group and one or more at least one molecule such as glycidyl (meth) acrylate and ⁇ -methylglycidyl (meth) acrylate.
- a carboxyl group-containing photosensitive resin obtained by adding a compound having a (meth) acryloyl group.
- a carboxyl group-containing photosensitive resin obtained by adding a compound having a cyclic ether group and a (meth) acryloyl group in one molecule to the carboxyl group-containing resins (1) to (7).
- (meth) acrylate is a term that collectively refers to acrylate, methacrylate, and mixtures thereof, and the same applies to other similar expressions.
- the carboxyl group-containing resin used in the present invention does not use an epoxy resin as a starting material, it has a feature that the halide content is very low.
- the chloride ion content of the carboxyl group-containing resin used in the present invention is 0 to 100 ppm, more preferably 0 to 50 ppm, and still more preferably 0 to 30 ppm.
- the carboxyl group-containing resin used in the present invention can easily obtain a resin containing no hydroxyl group.
- the presence of a hydroxyl group has excellent characteristics such as improved adhesion by hydrogen bonding, but it is known to significantly reduce moisture resistance.
- the superior point of the carboxyl group-containing resin of the present invention compared to the epoxy acrylate-based modified resin used in a general solder resist will be described.
- a phenol novolak resin free from chlorine can be easily obtained.
- Resin that has no hydroxyl group in the range of double bond equivalent 300-550, acid value 40-120 mgKOH / g by partial acrylation of phenol resin modified with alkyl oxide and introduction of acid anhydride It is possible to obtain
- the acid value becomes very large with a double bond equivalent of 400 to 500.
- Even after exposure, a coating film having development resistance cannot be obtained.
- the acid value is high, the water resistance is poor, and the insulation reliability and PCT resistance are significantly reduced. That is, it is very difficult to completely eliminate the hydroxyl group from an epoxy acrylate-based modified resin derived from a similar phenol novolac type epoxy resin.
- the conventional epoxy acrylate-based modified resin inevitably has a hydroxyl group, but the presence of the hydroxyl group affects not only the water absorption viewpoint but also the reactivity between the epoxy resin and the acid. That is, it is known that the hydroxyl group promotes the reaction between the acid and the epoxy group, but the presence of the hydroxyl group has a high promoting effect until the cured product forms a gel, but after the reaction system has gelled, The promotion effect is expected to be weak. That is, it is considered that the reaction of acid and epoxy in a system having a large number of hydroxyl groups is delayed in the end point of the reaction instead of earlier in the reaction start.
- the reaction starts quickly, it is not preferable from the viewpoint of the working life of the composition and the development life until the solvent is dried and developed, and further, the gelation is formed at an early stage, so that the reaction is completed for a long time at a high temperature. Is required. Since the composition of the present invention is a reaction in the absence of a hydroxyl group, it can be said that the reaction is mild. As a result, the life until development is long and the reaction is considered to be easily completed. As a result, it is considered that excellent reliability was obtained. This phenomenon was remarkably observed when a naphthalene ring-containing epoxy resin described later was used. This is considered to be because the naphthalene ring of the naphthalene ring-containing epoxy resin has a planar structure and thus has a low melt viscosity and high reactivity.
- urethane resin can also synthesize
- a preferred resin is an isocyanate compound not using phosgene as a starting material and a carboxyl group-containing resin having a chlorine ion impurity amount of 0 to 30 ppm synthesized from a raw material not using epihalohydrin, and more preferably so as not to theoretically contain a hydroxyl group. It is a synthesized resin. From this point of view, the carboxyl group-containing resins (1) to (5) previously shown as specific examples can be particularly preferably used.
- 3,4-epoxy is used as a compound having a cyclic ether group and a (meth) acryloyl group in one molecule.
- a carboxyl group-containing photosensitive resin obtained by reacting cyclohexylmethyl methacrylate can also be suitably used because it uses alicyclic epoxy and has few chlorine ion impurities.
- the carboxyl group-containing resin (6) is obtained by reacting glycidyl methacrylate as a compound having a cyclic ether group and a (meth) acryloyl group in one molecule, or copolymerizing glycidyl methacrylate as an unsaturated group-containing compound.
- glycidyl methacrylate as a compound having a cyclic ether group and a (meth) acryloyl group in one molecule
- an epoxy acrylate modified raw material can also be used as a diol compound in the synthesis of a urethane resin.
- chlorine ion impurities enter, it can be used from the viewpoint that the amount of chlorine ion impurities can be controlled.
- the acid value of the carboxyl group-containing resin is desirably in the range of 40 to 150 mgKOH / g, more preferably in the range of 40 to 130 mgKOH / g.
- the acid value of the carboxyl group-containing resin is less than 40 mgKOH / g, alkali development becomes difficult.
- it exceeds 150 mgKOH / g dissolution of the exposed area by the developing solution proceeds, so that the line becomes thinner than necessary.
- the exposed portion and the unexposed portion are not distinguished from each other by dissolution and peeling with a developer, which makes it difficult to draw a normal resist pattern.
- the weight-average molecular weight of the carboxyl group-containing resin varies depending on the resin skeleton, but is generally within the range of 2,000 to 150,000, more preferably 5,000 to 100,000. If the weight average molecular weight is less than 2,000, the tack-free performance may be inferior, the moisture resistance of the coated film after exposure may be poor, the film may be reduced during development, and the resolution may be greatly inferior. On the other hand, when the weight average molecular weight exceeds 150,000, developability may be remarkably deteriorated, and storage stability may be inferior.
- the blending amount of such a carboxyl group-containing resin is 20 to 60% by mass, preferably 30 to 50% by mass in the total composition.
- the amount is less than the above range, the coating strength is lowered, which is not preferable.
- the amount is larger than the above range, the viscosity becomes high and the coating property and the like deteriorate, which is not preferable.
- a photopolymerization initiator can be blended.
- Preferred initiators include one or more photopolymerizations selected from the group consisting of oxime ester photopolymerization initiators having an oxime ester group, ⁇ -aminoacetophenone photopolymerization initiators, and acylphosphine oxide photopolymerization initiators. Initiators can be used.
- oxime ester-based photopolymerization initiator examples include CGI-325, Irgacure (registered trademark) OXE01, Irgacure OXE02 manufactured by Ciba Japan, N-1919, NCI-831 manufactured by Adeka, and the like as commercially available products. .
- numerator can also be used suitably, Specifically, the oxime ester compound which has a carbazole structure represented with the following general formula is mentioned.
- X is a hydrogen atom, an alkyl group having 1 to 17 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, a phenyl group, a phenyl group (an alkyl group having 1 to 17 carbon atoms, an alkoxy group having 1 to 8 carbon atoms) Group, an amino group, an alkylamino group having an alkyl group having 1 to 8 carbon atoms or a dialkylamino group), a naphthyl group (an alkyl group having 1 to 17 carbon atoms, an alkoxy group having 1 to 8 carbon atoms),
- Y and Z are each a hydrogen atom, an alkyl group having 1 to 17 carbon atoms, or a carbon atom having 1 carbon atom, substituted with an alkyl group having 1 to 8 carbon atoms or a dialkylamino group.
- Anthryl group, pyridyl group, benzofuryl group, benzothienyl group, Ar is a bond or alkylene having 1 to 10 carbon atoms, vinylene, phenylene, biphenylene, pyridylene, naphthylene, thiophene, Anthrylene, thienylene, furylene, 2,5-pyrrole-diyl
- X and Y are each a methyl group or an ethyl group
- Z is methyl or phenyl
- n is 0, and Ar is a bond, phenylene, naphthylene, thiophene or thienylene. It is preferable.
- the blending amount of such an oxime ester photopolymerization initiator is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. If it is less than 0.01 parts by mass, the photocurability is insufficient, the coating film is peeled off, and the coating properties such as chemical resistance are lowered. On the other hand, when the amount exceeds 5 parts by mass, light absorption on the surface of the coating film becomes intense, and the deep curability tends to decrease. More preferably, it is 0.5 to 3 parts by mass.
- ⁇ -aminoacetophenone photopolymerization initiators include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N , N-dimethylaminoacetophenone and the like.
- Examples of commercially available products include Irgacure 907, Irgacure 369, and Irgacure 379 manufactured by Ciba Japan.
- acylphosphine oxide photopolymerization initiators include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and bis (2,6-dimethoxy). And benzoyl) -2,4,4-trimethyl-pentylphosphine oxide.
- Commercially available products include Lucilin TPO manufactured by BASF, Irgacure 819 manufactured by Ciba Japan.
- the blending amount of these ⁇ -aminoacetophenone photopolymerization initiator and acylphosphine oxide photopolymerization initiator is preferably 0.01 to 15 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. If it is less than 0.01 parts by mass, the photo-curability on copper is similarly insufficient, the coating film peels off, and the coating properties such as chemical resistance deteriorate. On the other hand, when the amount exceeds 15 parts by mass, the effect of reducing the outgas cannot be obtained, the light absorption on the surface of the coating film becomes intense, and the deep curability tends to decrease. More preferably, it is 0.5 to 10 parts by mass.
- photopolymerization initiators, photoinitiator assistants, and sensitizers that can be suitably used in the resin composition of the present invention include benzoin compounds, acetophenone compounds, anthraquinone compounds, thioxanthone compounds, ketal compounds, benzophenone compounds, 3 A class amine compound, a xanthone compound, etc. can be mentioned.
- benzoin compound examples include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether.
- acetophenone compound examples include acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, and the like.
- anthraquinone compound examples include 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone and the like.
- thioxanthone compound examples include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone, and the like.
- ketal compound examples include acetophenone dimethyl ketal and benzyl dimethyl ketal.
- benzophenone compound examples include benzophenone, 4-benzoyldiphenyl sulfide, 4-benzoyl-4′-methyldiphenyl sulfide, 4-benzoyl-4′-ethyldiphenyl sulfide, and 4-benzoyl-4′-propyldiphenyl. And sulfides.
- the tertiary amine compound include an ethanolamine compound and a compound having a dialkylaminobenzene structure, such as 4,4′-dimethylaminobenzophenone (Nisso Cure MABP manufactured by Nippon Soda Co., Ltd.), Dialkylaminobenzophenones such as 4′-diethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co.), 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one (7- (diethylamino) -4-methylcoumarin), etc.
- 4,4′-dimethylaminobenzophenone Non-dimethylaminobenzophenone
- Dialkylaminobenzophenones such as 4′-diethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co.), 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one (7- (die
- a dialkylamino group-containing coumarin compound ethyl 4-dimethylaminobenzoate (Kayacure (registered trademark) EPA manufactured by Nippon Kayaku Co., Ltd.), ethyl 2-dimethylaminobenzoate (Quantacure DMB manufactured by International Bio-Synthetics), -Dimethylaminobenzoic acid (n-butoxy) ethyl (Quantacure BEA manufactured by International Bio-Synthetics), p-dimethylaminobenzoic acid isoamyl ethyl ester (Nippon Kayaku Co., Ltd.
- Kayacure DMBI 4-dimethylaminobenzoic acid 2 -Ethylhexyl (Esolol 507 manufactured by Van Dyk), 4,4'-diethylaminobenzophenone (EAB manufactured by Hodogaya Chemical Co.), and the like.
- thioxanthone compounds and tertiary amine compounds are preferred.
- the inclusion of a thioxanthone compound is preferable from the viewpoint of deep curability.
- thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone are preferably included.
- the compounding amount of such a thioxanthone compound is preferably 20 parts by mass or less with respect to 100 parts by mass of the carboxyl group-containing resin.
- the blending amount of the thioxanthone compound exceeds 20 parts by mass, the thick film curability is lowered and the cost of the product is increased. More preferably, it is 10 parts by mass or less.
- a compound having a dialkylaminobenzene structure is preferable, and among them, a dialkylaminobenzophenone compound, a dialkylamino group-containing coumarin compound having a maximum absorption wavelength of 350 to 450 nm, and ketocoumarins are particularly preferable.
- dialkylaminobenzophenone compound 4,4′-diethylaminobenzophenone is preferable because of its low toxicity.
- the dialkylamino group-containing coumarin compound has a maximum absorption wavelength of 350 to 410 nm in the ultraviolet region, so it is less colored and uses a colored pigment as well as a colorless and transparent photosensitive composition, and reflects the color of the colored pigment itself.
- a membrane can be provided.
- 7- (diethylamino) -4-methyl-2H-1-benzopyran-2-one is preferred.
- the blending amount of such a tertiary amine compound is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin.
- amount of the tertiary amine compound is less than 0.1 parts by mass, a sufficient sensitizing effect tends not to be obtained. If it exceeds 20 parts by mass, the deep curability tends to decrease. More preferably, it is 0.1 to 10 parts by mass.
- photopolymerization initiators can be used alone or as a mixture of two or more.
- the total amount of such photopolymerization initiator, photoinitiator assistant, and sensitizer is preferably 35 parts by mass or less with respect to 100 parts by mass of the carboxyl group-containing resin. When it exceeds 35 parts by mass, the deep curability tends to decrease due to light absorption.
- these photopolymerization initiators, photoinitiator assistants, and sensitizers absorb a specific wavelength, the sensitivity may be lowered in some cases, and may function as an ultraviolet absorber. However, they are not used only for the purpose of improving the sensitivity of the composition. Absorbs light of a specific wavelength as needed to enhance surface photoreactivity, and changes the line shape and opening of the coating to vertical, tapered, or inversely tapered, as well as processing the line width and opening diameter Accuracy can be improved.
- photopolymerization initiators described above particularly preferred are selected from the group consisting of an oxime ester photopolymerization initiator having an oxime ester group, an ⁇ -aminoacetophenone photopolymerization initiator, and an acylphosphine oxide photopolymerization initiator.
- One or more photopolymerization initiators are selected from the group consisting of an oxime ester photopolymerization initiator having an oxime ester group, an ⁇ -aminoacetophenone photopolymerization initiator, and an acylphosphine oxide photopolymerization initiator.
- One or more photopolymerization initiators are selected from the group consisting of an oxime ester photopolymerization initiator having an oxime ester group, an ⁇ -aminoacetophenone photopolymerization initiator, and an acylphosphine oxide photopolymerization initiator.
- One or more photopolymerization initiators are selected from the group consist
- the naphthalene ring-containing epoxy resin used in the photo-curable thermosetting resin composition of the present invention has high reactivity and high heat resistance against heat history, in addition to having good reactivity and rapid completion of reaction as previously described.
- the cured film obtained is very effective for stress relaxation during solder resist curing.
- naphthalene ring-containing epoxy resins for example, HP-4032 (manufactured by DIC Corporation), HP-4700 (manufactured by DIC Corporation), ESN-355 (manufactured by Toto Kasei Co., Ltd.), ESN-375 (manufactured by Tokyo Metropolitan Government) Kasei Co., Ltd.) and NC-7300 (Nippon Kayaku Co., Ltd.).
- Particularly preferred examples include polyfunctional epoxy having a naphthalene skeleton and an aralkyl structure, and derivatives thereof.
- the blending amount of the naphthalene ring-containing epoxy resin is suitably 5 parts by mass to 60 parts by mass, more preferably 10 parts by mass to 50 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. . If the amount is less than 5 parts by mass, the effect of the naphthalene ring-containing epoxy resin is not confirmed. On the other hand, if it exceeds 60 parts by mass, the tackiness of the coating film may be deteriorated and the development may be poor.
- thermosetting component can be added to the photocurable thermosetting resin composition of the present invention in order to impart heat resistance.
- thermosetting components used in the present invention include block isocyanate compounds, amino resins, maleimide compounds, benzoxazine resins, carbodiimide resins, cyclocarbonate compounds, polyfunctional epoxy compounds, polyfunctional oxetane compounds, episulfide resins, and melamine derivatives.
- Conventional thermosetting resins can be used.
- a preferable thermosetting component is a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups (hereinafter abbreviated as cyclic (thio) ether groups) in one molecule.
- cyclic (thio) ether groups There are many commercially available thermosetting components having a cyclic (thio) ether group, and various properties can be imparted depending on the structure.
- thermosetting component having two or more cyclic (thio) ether groups in the molecule is either one of the three-, four- or five-membered cyclic ether groups in the molecule, or the cyclic thioether group, or two of them.
- a compound having at least two epoxy groups in the molecule that is, a polyfunctional epoxy compound, a compound having at least two oxetanyl groups in the molecule, that is, a polyfunctional compound.
- examples include oxetane compounds, compounds having two or more thioether groups in the molecule, that is, episulfide resins.
- Examples of the polyfunctional epoxy compound include jER (registered trademark) 828, jER834, jER1001, and jER1004 manufactured by Japan Epoxy Resin, Epicron (registered trademark) 840, Epicron 850, Epicron 1050, Epicron 1050, and Toto, manufactured by DIC Corporation.
- Bisphenol A type epoxy resin such as 664 (all trade names); jERYL903 manufactured by Japan Epoxy Resin, Epicron 152, Epicron 165 manufactured by DIC, Epototo YDB-400, YDB-500 manufactured by Tohto Kasei Co., Ltd., Dow Chemical D. E. R. 542, Araldide 8011 manufactured by Ciba Japan, Sumi-epoxy ESB-400, ESB-700 manufactured by Sumitomo Chemical Co., Ltd. E. R. 711, A.I. E. R. 714 (both trade names) brominated epoxy resin; jER152, jER154 manufactured by Japan Epoxy Resin, D.C. E. N. 431, D.D. E. N.
- Novolak type epoxy resins such as ECN-235, ECN-299, etc. (both trade names); Epicron 830 manufactured by DIC, jER807 manufactured by Japan Epoxy Resin, Epotote YDF-170, YDF-175, YDF-175 manufactured by Toto Kasei 2004, Bisphenol F type epoxy resin such as Araldide XPY306 manufactured by Ciba Japan Co., Ltd. (all trade names); Hydrogenated bisphenol such as Epototo ST-2004, ST-2007, ST-3000 (trade names) manufactured by Tohto Kasei Co., Ltd.
- Type A epoxy resin jER604 manufactured by Japan Epoxy Resin, Epototo YH-434 manufactured by Tohto Kasei Co., Ltd., Araldide MY720 manufactured by Ciba Japan, Sumi-epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd. ) Glycidylamine type epoxy resin; Hydantoin type epoxy resin such as Araldide CY-350 (trade name) manufactured by Bread; Celoxide (registered trademark) 2021 manufactured by Daicel Chemical Industries, Araldide CY175, CY179 manufactured by Ciba Japan (all trade names) Alicyclic epoxy resin: YL-933 manufactured by Japan Epoxy Resin Co., Ltd. E. N.
- EPPN-501, EPPN-502, etc. trihydroxyphenylmethane type epoxy resin
- Xylenol type or biphenol type epoxy resins or mixtures thereof bisphenol S type epoxy resins such as Nippon Kayaku EBPS-200, ADEKA EPX-30, DIC EXA-1514 (trade name); Japan epoxy resin Bisphenol A novolac type epoxy resin such as jER157S (trade name) manufactured by KK; tetraphenylolethane type epoxy resin such as jERYL-931 manufactured by Japan Epoxy Resin, Araldide 163 manufactured by Ciba Japan Co., Ltd.
- CTBN modified epoxy resin e.g., Tohto Kasei Co. YR-102, YR-450, etc.
- CTBN modified epoxy resin e.g., Tohto Kasei Co. YR-102, YR-450, etc.
- These epoxy resins can be used alone or in combination of two or more.
- novolak-type epoxy resins, modified novolak-type epoxy resins, heterocyclic epoxy resins, bixylenol-type epoxy resins or mixtures thereof are particularly preferable.
- polyfunctional oxetane compound examples include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxetanylmethoxy) methyl] ether, 1,4-bis [(3-methyl -3-Oxetanylmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, (3-methyl-3-oxetanyl) methyl acrylate, (3-ethyl-3-oxetanyl)
- polyfunctional oxetanes such as methyl acrylate, (3-methyl-3-oxetanyl) methyl methacrylate, (3-ethyl-3-oxetanyl) methyl methacrylate and oligomers or copolymers thereof, oxetane alcohol and novolak resin, Poly (p-hydroxystyrene
- Examples of the episulfide resin having two or more cyclic thioether groups in the molecule include YL7000 (bisphenol A type episulfide resin) manufactured by Japan Epoxy Resin Co., Ltd. and YSLV-120TE manufactured by Toto Kasei Co., Ltd. Moreover, episulfide resin etc. which replaced the oxygen atom of the epoxy group of the novolak-type epoxy resin with the sulfur atom using the same synthesis method can be used.
- the amount of the thermosetting component having two or more cyclic (thio) ether groups in the molecule is preferably 0.6 to 2.5 equivalents relative to 1 equivalent of the carboxyl group of the carboxyl group-containing resin. More preferably, it is in the range of 0.8 to 2.0 equivalents.
- the amount of the thermosetting component having two or more cyclic (thio) ether groups in the molecule is less than 0.6, carboxyl groups remain in the solder resist film, and heat resistance, alkali resistance, electrical insulation, etc. Is unfavorable because it decreases.
- the amount exceeds 2.5 equivalents the low molecular weight cyclic (thio) ether group remains in the dry coating film, which is not preferable because the strength of the coating film decreases.
- thermosetting components examples include melamine derivatives and benzoguanamine derivatives.
- examples include methylol melamine compounds, methylol benzoguanamine compounds, methylol glycoluril compounds, and methylol urea compounds.
- the alkoxymethylated melamine compound, the alkoxymethylated benzoguanamine compound, the alkoxymethylated glycoluril compound and the alkoxymethylated urea compound have the methylol group of the respective methylolmelamine compound, methylolbenzoguanamine compound, methylolglycoluril compound and methylolurea compound. Obtained by conversion to an alkoxymethyl group.
- the type of the alkoxymethyl group is not particularly limited and can be, for example, a methoxymethyl group, an ethoxymethyl group, a propoxymethyl group, a butoxymethyl group, or the like.
- a melamine derivative having a formalin concentration which is friendly to the human body and the environment is preferably 0.2% or less.
- thermosetting component can be used individually or in combination of 2 or more types.
- the photocurable thermosetting resin composition of the present invention includes two or more isocyanate groups or blocked isocyanate groups in one molecule in order to improve the curability of the composition and the toughness of the resulting cured film.
- a compound having can be added.
- Such a compound having two or more isocyanate groups or blocked isocyanate groups in one molecule is a compound having two or more isocyanate groups in one molecule, that is, a polyisocyanate compound, or two or more in one molecule.
- a compound having a blocked isocyanate group that is, a blocked isocyanate compound.
- polyisocyanate compound for example, aromatic polyisocyanate, aliphatic polyisocyanate or alicyclic polyisocyanate is used.
- aromatic polyisocyanate include 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, o-xylylene diisocyanate, m- Examples include xylylene diisocyanate and 2,4-tolylene dimer.
- aliphatic polyisocyanate examples include tetramethylene diisocyanate, hexamethylene diisocyanate, methylene diisocyanate, trimethylhexamethylene diisocyanate, 4,4-methylenebis (cyclohexyl isocyanate), and isophorone diisocyanate.
- alicyclic polyisocyanate examples include bicycloheptane triisocyanate.
- adduct bodies, burette bodies, and isocyanurate bodies of the isocyanate compounds listed above may be mentioned.
- the blocked isocyanate group contained in the blocked isocyanate compound is a group in which the isocyanate group is protected by reaction with a blocking agent and temporarily deactivated. When heated to a predetermined temperature, the blocking agent is dissociated to produce isocyanate groups.
- the blocked isocyanate compound an addition reaction product of an isocyanate compound and an isocyanate blocking agent is used.
- the isocyanate compound that can react with the blocking agent include isocyanurate type, biuret type, and adduct type.
- aromatic polyisocyanate, aliphatic polyisocyanate, or alicyclic polyisocyanate is used, for example.
- Specific examples of the aromatic polyisocyanate, aliphatic polyisocyanate, and alicyclic polyisocyanate include the compounds exemplified above.
- isocyanate blocking agent for example, phenol blocking agents such as phenol, cresol, xylenol, chlorophenol and ethylphenol; lactam blocking agents such as ⁇ -caprolactam, ⁇ -palerolactam, ⁇ -butyrolactam and ⁇ -propiolactam; Active methylene blocking agents such as ethyl acetoacetate and acetylacetone; methanol, ethanol, propanol, butanol, amyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, propylene glycol monomethyl ether, benzyl Ether, methyl glycolate, butyl glycolate, diacetone alcohol, lactic acid Alcohol-based blocking agents such as chill and ethyl lactate; oxime-based blocking agents such as formaldehyde oxime, acetaldoxime, acetoxi
- the blocked isocyanate compounds may be commercially available, for example, Sumidur (registered trademark) BL-3175, BL-4165, BL-1100, BL-1265, Desmodur (registered trademark) TPLS-2957, TPLS-2062.
- the compounds having two or more isocyanate groups or blocked isocyanate groups in one molecule can be used singly or in combination of two or more.
- the compounding amount of the compound having two or more isocyanate groups or blocked isocyanate groups in one molecule is 1 to 100 parts by mass, more preferably 2 to 100 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. A proportion of 70 parts by weight is appropriate. When the amount is less than 1 part by mass, sufficient toughness of the coating film cannot be obtained, which is not preferable. On the other hand, when it exceeds 100 parts by mass, the storage stability is lowered, which is not preferable.
- a urethanization catalyst can be added to the photocurable thermosetting resin composition of the present invention in order to accelerate the curing reaction of hydroxyl groups, carboxyl groups and isocyanate groups.
- the urethanization catalyst it is possible to use one or more urethanization catalysts selected from the group consisting of tin-based catalysts, metal chlorides, metal acetylacetonate salts, metal sulfates, amine compounds, and / or amine salts. preferable.
- tin catalyst examples include organic tin compounds such as stannous octoate and dibutyltin dilaurate, and inorganic tin compounds.
- the metal chloride is a metal chloride made of Cr, Mn, Co, Ni, Fe, Cu, or Al, and examples thereof include cobalt chloride, ferrous nickel chloride, and ferric chloride.
- the metal acetylacetonate salt is a metal acetylacetonate salt made of Cr, Mn, Co, Ni, Fe, Cu or Al, for example, cobalt acetylacetonate, nickel acetylacetonate, iron acetylacetonate, etc. Is mentioned.
- the metal sulfate is a metal sulfate composed of Cr, Mn, Co, Ni, Fe, Cu, or Al, and examples thereof include copper sulfate.
- Examples of the amine compound include conventionally known triethylenediamine, N, N, N ′, N′-tetramethyl-1,6-hexanediamine, bis (2-dimethylaminoethyl) ether, N, N, N ′.
- N ′′, N ′′ -pentamethyldiethylenetriamine N-methylmorpholine, N-ethylmorpholine, N, N-dimethylethanolamine, dimorpholinodiethyl ether, N-methylimidazole, dimethylaminopyridine, triazine, N′- (2-hydroxyethyl) -N, N, N′-trimethyl-bis (2-aminoethyl) ether, N, N-dimethylhexanolamine, N, N-dimethylaminoethoxyethanol, N, N, N′-trimethyl-N '-(2-hydroxyethyl) ethylenediamine, N- (2-hydroxy Chill) -N, N ′, N ′′, N ′′ -tetramethyldiethylenetriamine, N- (2-hydroxypropyl) -N, N ′, N ′′, N ′′ -tetramethyldiethylenetriamine, N, N, N′-trimethyl
- Examples of the amine salt include an organic acid salt amine salt of DBU (1,8-diaza-bicyclo [5,4,0] undecene-7).
- the compounding amount of the urethanization catalyst is sufficient in a usual quantitative ratio, for example, preferably 0.1 to 20 parts by mass, more preferably 0.5 parts per 100 parts by mass of the carboxyl group-containing resin (A). Is 10.0 parts by mass.
- thermosetting component having two or more cyclic (thio) ether groups in the molecule
- thermosetting catalysts include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole.
- Imidazole derivatives such as 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N -Amine compounds such as dimethylbenzylamine and 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; and phosphorus compounds such as triphenylphosphine.
- Examples of commercially available products include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (both trade names of imidazole compounds) manufactured by Shikoku Kasei Kogyo Co., Ltd. and U-CAT (registered by San Apro). Trademarks) 3503N, U-CAT3502T (all are trade names of blocked isocyanate compounds of dimethylamine), DBU, DBN, U-CATSA102, U-CAT5002 (all are bicyclic amidine compounds and salts thereof), and the like.
- thermosetting catalyst for epoxy resins or oxetane compounds or a catalyst that promotes the reaction of epoxy groups and / or oxetanyl groups with carboxyl groups, either alone or in combination of two or more. Can be used.
- thermosetting catalysts is sufficient in the usual quantitative ratio, for example, with respect to 100 parts by mass of the carboxyl group-containing resin or thermosetting component having two or more cyclic (thio) ether groups in the molecule.
- the amount is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 15.0 parts by mass.
- the photocurable resin composition of the present invention can contain a colorant.
- a colorant conventionally known colorants such as red, blue, green and yellow can be used, and any of pigments, dyes and dyes may be used. Specific examples include those with the following color index numbers (CI; issued by The Society of Dyers and Colorists). However, it is preferable not to contain a halogen from the viewpoint of reducing the environmental burden and affecting the human body.
- Red colorant examples include monoazo, diazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone.
- -Indexes (CI; issued by The Society of Dyers and Colorists) are listed.
- Monoazo Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151 , 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269.
- Disazo Pigment Red 37, 38, 41.
- Monoazo lakes Pigment Red 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57 : 1, 58: 4, 63: 1, 63: 2, 64: 1,68.
- Benzimidazolone series Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208.
- Perylene series Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red 194, Pigment Red 224.
- Diketopyrrolopyrrole series Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272.
- Condensed azo series Pigment Red 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221 and Pigment Red 242.
- Anthraquinone series Pigment Red 168, Pigment Red 177, Pigment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, Solvent Red 207.
- Kinacridone series Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red 209.
- Blue colorant examples include phthalocyanine and anthraquinone, and pigments include compounds classified as Pigment, specifically, Pigment Blue 15 and Pigment Blue 15 : 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4, Pigment Blue 15: 6, Pigment Blue 16, and Pigment Blue 60.
- the dye systems include Solvent Blue 35, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 122, Solvent Blue 136, Solvent Blue 67, Solvent Blue 70 etc. can be used.
- a metal-substituted or unsubstituted phthalocyanine compound can also be used.
- Green colorant examples include phthalocyanine, anthraquinone, and perylene. Specifically, Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28, etc. are used. be able to. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.
- Yellow colorant examples include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, anthraquinone, and the like.
- Anthraquinone series Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, Pigment Yellow 202.
- Isoindolinone type Pigment Yellow 110, Pigment Yellow 109, Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185.
- Condensed azo series Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Yellow 166, Pigment Yellow 180.
- Benzimidazolone series Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181.
- Monoazo Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116 , 167, 168, 169, 182, 183.
- Disazo Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198.
- a colorant such as purple, orange, brown, or black may be added for the purpose of adjusting the color tone.
- the blending ratio of the colorant as described above is not particularly limited, but is preferably 0 to 10 parts by weight, particularly preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the carboxyl group-containing resin. It is enough.
- the compound having two or more ethylenically unsaturated groups in the molecule used in the photocurable thermosetting resin composition of the present invention is photocured by irradiation with active energy rays, and the carboxyl group-containing resin is obtained. It helps insolubilize or insolubilize in an alkaline aqueous solution.
- a compound conventionally known polyester (meth) acrylate, polyether (meth) acrylate, urethane (meth) acrylate, carbonate (meth) acrylate, epoxy (meth) acrylate, and the like can be used.
- Hydroxyalkyl acrylates such as 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate; Diacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, propylene glycol; N, N-dimethylacrylamide, N-methylolacrylamide Acrylamides such as N, N-dimethylaminopropyl acrylamide; N, N-dimethylaminoethyl acrylate, N, N-dimethylaminopropyl Aminoalkyl acrylates such as acrylates; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, tris-hydroxyethyl isocyanurate, or their ethylene oxide adducts, propylene oxide adducts, or ⁇ -caprolactone Polyvalent acrylates such as adducts; polyvalent
- an epoxy acrylate resin obtained by reacting acrylic acid with a polyfunctional epoxy resin such as a cresol novolac type epoxy resin, and further, a hydroxy acrylate such as pentaerythritol triacrylate and a diisocyanate such as isophorone diisocyanate on the hydroxyl group of the epoxy acrylate resin.
- a polyfunctional epoxy resin such as a cresol novolac type epoxy resin
- a hydroxy acrylate such as pentaerythritol triacrylate
- a diisocyanate such as isophorone diisocyanate
- the compounding amount of the compound having two or more ethylenically unsaturated groups in the molecule is 5 to 100 parts by mass, more preferably 1 to 70 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. Is the ratio.
- the blending amount is less than 5 parts by mass, photocurability is lowered, and pattern formation becomes difficult by alkali development after irradiation with active energy rays, which is not preferable.
- the amount exceeds 100 parts by mass the solubility in an alkaline aqueous solution is lowered, and the coating film becomes brittle.
- the photo-curable thermosetting resin composition of the present invention can be blended with a filler as necessary in order to increase the physical strength of the coating film.
- a filler known and commonly used inorganic or organic fillers can be used.
- barium sulfate, spherical silica and talc are preferably used.
- metal hydroxides such as titanium oxide, metal oxides, and aluminum hydroxide can be used as extender pigment fillers.
- the amount of these fillers is preferably 200 parts by mass or less, more preferably 0.1 to 150 parts by mass, and particularly preferably 1 to 100 parts by mass with respect to 100 parts by mass of the carboxyl group-containing resin. When the blending amount of the filler exceeds 200 parts by mass, the viscosity of the composition becomes high, the printability is lowered, and the cured product becomes brittle.
- the photocurable thermosetting resin composition of the present invention can use a binder polymer for the purpose of improving dryness to touch and improving handling properties.
- a binder polymer for the purpose of improving dryness to touch and improving handling properties.
- polyester polymers, polyurethane polymers, polyester urethane polymers, polyamide polymers, polyester amide polymers, acrylic polymers, cellulose polymers, polylactic acid polymers, phenoxy polymers, and the like can be used.
- These binder polymers can be used alone or as a mixture of two or more.
- the photocurable thermosetting resin composition of the present invention can use a hydroxyl group-containing elastomer or other elastomers for the purpose of imparting flexibility and improving the brittleness of the cured product.
- a polyester elastomer, a polyurethane elastomer, a polyester urethane elastomer, a polyamide elastomer, a polyesteramide elastomer, an acrylic elastomer, or an olefin elastomer can be used.
- resins in which a part or all of epoxy groups of epoxy resins having various skeletons are modified with carboxylic acid-modified butadiene-acrylonitrile rubber at both ends can be used.
- epoxy-containing polybutadiene elastomers, acrylic-containing polybutadiene elastomers, and the like can also be used. These elastomers can be used alone or as a mixture of two or more.
- the photocurable thermosetting resin composition of the present invention uses an organic solvent for the synthesis of the carboxyl group-containing resin and the adjustment of the composition, or for the adjustment of the viscosity for application to a substrate or a carrier film.
- organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like.
- ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, Esters such as propylene glycol butyl ether acetate; ethanol, propano , Ethylene glycol, alcohols such as propylene glycol; octane
- the photocurable thermosetting resin composition of the present invention includes In order to prevent oxidation, (1) radical scavengers that invalidate the generated radicals and / or (2) peroxidation that decomposes the generated peroxides into harmless substances and prevents the generation of new radicals. Antioxidants such as product decomposing agents can be added.
- antioxidant that acts as a radical scavenger
- hydroquinone 4-t-butylcatechol, 2-t-butylhydroquinone, hydroquinone monomethyl ether, 2,6-di-t-butyl-p- Cresol, 2,2-methylene-bis (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3, 5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, 1,3,5-tris (3 ′, 5′-di-t-butyl-4) -Hydroxybenzyl) -S-triazine-2,4,6- (1H, 3H, 5H) trione and other phenolic compounds, quinone compounds such as metaquinone and benzoquinone, bis (2,2,6, - tetramethyl-4-piperidyl) -
- the radical scavenger may be commercially available, for example, ADK STAB (registered trademark) AO-30, ADK STAB AO-330, ADK STAB AO-20, ADK STAB LA-77, ADK STAB LA-57, ADK STAB LA-67, ADK STAB LA-68, ADK STAB LA-87 (trade name, manufactured by ADEKA), IRGANOX (registered trademark) 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, TINUVIN (registered trademark) 111FDL, TINUVIN 123, TINUVIN 144, TINUVIN 152 TINUVIN 292, TINUVIN 5100 (trade name, manufactured by Ciba Japan Co., Ltd.) and the like.
- antioxidant that acts as a peroxide decomposer
- phosphorus compounds such as triphenyl phosphite, pentaerythritol tetralauryl thiopropionate, dilauryl thiodipropionate, distearyl 3,3 ′.
- -Sulfur compounds such as thiodipropionate.
- the peroxide decomposing agent may be commercially available, for example, ADK STAB TPP (manufactured by ADEKA, trade name), Mark AO-412S (manufactured by Adeka Argus Chemical Co., trade name), Sumilyzer (registered trademark) TPS. (Trade name, manufactured by Sumitomo Chemical Co., Ltd.).
- Said antioxidant can be used individually by 1 type or in combination of 2 or more types.
- the polymer material absorbs light, which causes decomposition / degradation. Therefore, the photo-curing thermosetting resin composition of the present invention has the above-mentioned antioxidant in order to take a countermeasure against stabilization against ultraviolet rays.
- an ultraviolet absorber can be used.
- ultraviolet absorber examples include benzophenone derivatives, benzoate derivatives, benzotriazole derivatives, triazine derivatives, benzothiazole derivatives, cinnamate derivatives, anthranilate derivatives, dibenzoylmethane derivatives, and the like.
- benzophenone derivative examples include 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octoxybenzophenone, 2,2′-dihydroxy-4-methoxybenzophenone, and 2,4-dihydroxybenzophenone. Is mentioned.
- benzoate derivatives include 2-ethylhexyl salicylate, phenyl salicylate, pt-butylphenyl salicylate, 2,4-di-t-butylphenyl-3,5-di-t. -Butyl-4-hydroxybenzoate and hexadecyl-3,5-di-t-butyl-4-hydroxybenzoate.
- benzotriazole derivative examples include 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2 -(2'-hydroxy-3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-t-butylphenyl) -5 -Chlorobenzotriazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2'-hydroxy-3 ', 5'-di-t-amylphenyl) benzotriazole and the like.
- the triazine derivative include hydroxyphenyl triazine, bisethylhexyloxyphenol methoxyphenyl triazine, and the like.
- Ultraviolet absorbers may be commercially available, for example, TINUVIN PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 1130, TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 479 (above, manufactured by Ciba Japan, trade name) and the like.
- Said ultraviolet absorber can be used individually by 1 type or in combination of 2 or more types, The molded product obtained from the photocurable thermosetting resin composition of this invention by using together with the said antioxidant. Can be stabilized.
- thermosetting resin composition of the present invention known and commonly used N-phenylglycines, phenoxyacetic acids, thiophenoxyacetic acids, mercaptothiazole, and the like can be used as chain transfer agents in order to improve sensitivity. .
- chain transfer agents include, for example, chain transfer agents having a carboxyl group such as mercaptosuccinic acid, mercaptoacetic acid, mercaptopropionic acid, methionine, cysteine, thiosalicylic acid and derivatives thereof; mercaptoethanol, mercaptopropanol, mercaptobutanol Chain transfer agents having a hydroxyl group such as 1-butanethiol, butyl-3-mercaptopropionate, methyl-3-mercaptopropionate, 2,2 -(Ethylenedioxy) diethanethiol, ethanethiol, 4-methylbenzenethiol, dodecyl mercaptan, propanethiol, butanethiol, pentanethiol, 1-octanethiol, cyclo Ntanchioru, cyclohexane thiol, thioglycerol, 4,4-thiobisbenzene
- Polyfunctional mercaptan compounds can be used and are not particularly limited.
- hexane-1,6-dithiol, decane-1,10-dithiol, dimercaptodiethyl ether, dimercaptodiethylsulfide Aliphatic thiols such as xylylene dimercaptan, 4,4′-dimercaptodiphenyl sulfide, aromatic thiols such as 1,4-benzenedithiol; ethylene glycol bis (mercaptoacetate), polyethylene glycol bis (mercaptoacetate), Propylene glycol bis (mercaptoacetate), glycerin tris (mercaptoacetate), trimethylolethane tris (mercaptoacetate), trimethylolpropane tris (mercaptoacetate), pentaerythrito Poly (mercaptoacetate) polyhydric alcohols such as rutetrakis (mercaptoacetate) and dipentaerythri
- Examples of these commercially available products include BMPA, MPM, EHMP, NOMP, MBMP, STMP, TMMP, PEMP, DPMP, and TEMPIC (above, manufactured by Sakai Chemical Industry Co., Ltd.), Karenz (registered trademark) MT-PE1, Karenz MT-BD1, Karenz-NR1 (above, manufactured by Showa Denko KK) and the like can be mentioned.
- heterocyclic compound having a mercapto group acting as a chain transfer agent examples include mercapto-4-butyrolactone (also known as 2-mercapto-4-butanolide), 2-mercapto-4-methyl-4-butyrolactone, 2-mercapto.
- heterocyclic compound having a mercapto group that is a chain transfer agent that does not impair the developability of the photocurable thermosetting resin composition mercaptobenzothiazole, 3-mercapto-4-methyl-4H-1,2, 1,4-triazole, 5-methyl-1,3,4-thiadiazole-2-thiol, 1-phenyl-5-mercapto-1H-tetrazole are preferred.
- chain transfer agents can be used alone or in combination of two or more.
- an adhesion promoter can be used in order to improve the adhesion between layers or the adhesion between the photosensitive resin layer and the substrate.
- Specific examples include, for example, benzimidazole, benzoxazole, benzothiazole, 2-mercaptobenzoimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole (trade name: Axel M manufactured by Kawaguchi Chemical Industry Co., Ltd.) 3-morpholinomethyl-1-phenyl-triazole-2-thione, 5-amino-3-morpholinomethyl-thiazole-2-thione, 2-mercapto-5-methylthio-thiadiazole, triazole, tetrazole, benzotriazole, carboxybenzo Examples include triazole, amino group-containing benzotriazole, and silane coupling agent.
- the photocurable thermosetting resin composition of the present invention may further contain a thixotropic agent such as finely divided silica, organic bentonite, montmorillonite, hydrotalcite, etc., if necessary.
- a thixotropic agent such as finely divided silica, organic bentonite, montmorillonite, hydrotalcite, etc.
- Organic bentonite and hydrotalcite are preferred as the thixotropic agent over time, and hydrotalcite is particularly excellent in electrical characteristics.
- thermal polymerization inhibitors silicone-based, fluorine-based, polymer-based antifoaming agents and / or leveling agents, imidazole-based, thiazole-based, triazole-based silane coupling agents, rust preventives, and bisphenols
- Known and conventional additives such as copper damage prevention agents such as those based on triazine and triazine thiols can be blended.
- the thermal polymerization inhibitor can be used to prevent thermal polymerization or temporal polymerization of the polymerizable compound.
- the thermal polymerization inhibitor include 4-methoxyphenol, hydroquinone, alkyl or aryl-substituted hydroquinone, t-butylcatechol, pyrogallol, 2-hydroxybenzophenone, 4-methoxy-2-hydroxybenzophenone, cuprous chloride, phenothiazine, Chloranil, naphthylamine, ⁇ -naphthol, 2,6-di-tert-butyl-4-cresol, 2,2′-methylenebis (4-methyl-6-tert-butylphenol), pyridine, nitrobenzene, dinitrobenzene, picric acid, 4-Toluidine, methylene blue, copper and organic chelating agent reactant, methyl salicylate, and phenothiazine, nitroso compound, chelate of nitroso compound and Al, and the like.
- the photocurable thermosetting resin composition of the present invention is adjusted to a viscosity suitable for the coating method with, for example, the organic solvent, and on the substrate, a dip coating method, a flow coating method, a roll coating method, a bar coater method,
- a tack-free coating film can be formed by applying the organic solvent contained in the composition at a temperature of about 60 to 100 ° C. by volatile drying (temporary drying) at a temperature of about 60 to 100 ° C.
- the contact pattern (or non-contact pattern) is selectively exposed with an active energy ray through a photomask on which a pattern is formed, or directly exposed with a pattern using a laser direct exposure machine.
- a resist pattern is formed by development with a 3 to 3% sodium carbonate aqueous solution.
- a composition containing a thermosetting component for example, by heating to a temperature of about 130 to 180 ° C. and thermosetting, the carboxyl group of the carboxyl group-containing resin and two or more in the molecule
- a thermosetting component having a cyclic ether group and / or a cyclic thioether group reacts to form a cured coating film having excellent characteristics such as heat resistance, chemical resistance, moisture absorption resistance, adhesion, and electrical characteristics. Can do.
- thermosetting even when it does not contain a thermosetting component, by performing heat treatment, the ethylenically unsaturated bond of the photocurable component remaining in an unreacted state at the time of exposure undergoes thermal radical polymerization, and the coating film characteristics are improved. Therefore, heat treatment (thermosetting) may be performed depending on the purpose and application.
- the base material examples include printed circuit boards and flexible printed circuit boards that are pre-formed with a circuit, paper-phenol resin, paper-epoxy resin, glass cloth-epoxy resin, glass-polyimide, glass cloth / non-woven cloth-epoxy resin. , Glass cloth / paper-epoxy resin, synthetic fiber-epoxy resin, copper-clad laminates of all grades (FR-4 etc.) using polyimide, polyethylene, PPO, cyanate ester, etc., polyimide film, PET A film, a glass substrate, a ceramic substrate, a wafer plate, or the like can be used.
- Volatile drying performed after applying the photocurable thermosetting resin composition of the present invention is performed using a hot air circulation drying furnace, an IR furnace, a hot plate, a convection oven, or the like (equipped with an air heating heat source using steam). And a method in which hot air in the dryer is brought into countercurrent contact and a method in which the hot air in the dryer is blown onto the support from the nozzle).
- the obtained coating film is exposed (irradiated with active energy rays).
- the exposed portion (the portion irradiated by the active energy ray) is cured.
- a direct drawing apparatus for example, a laser direct imaging apparatus that directly draws an image with a laser using CAD data from a computer
- an exposure apparatus equipped with a metal halide lamp and an (ultra) high pressure mercury lamp.
- either a gas laser or a solid laser may be used as long as laser light having a maximum wavelength in the range of 350 to 410 nm is used.
- the exposure amount varies depending on the film thickness and the like, but can generally be in the range of 5 to 500 mJ / cm 2 , preferably 10 to 300 mJ / cm 2 .
- the direct drawing apparatus for example, those manufactured by Nippon Orbotech, Pentax, etc. can be used, and any apparatus may be used as long as it oscillates laser light having a maximum wavelength of 350 to 410 nm. .
- the developing method can be a dipping method, a shower method, a spray method, a brush method or the like, and as a developer, potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, Alkaline aqueous solutions such as ammonia and amines can be used.
- the photo-curable thermosetting resin composition of the present invention is not a liquid and directly applied to a substrate, but also a dry resist layer formed by applying and drying a solder resist on a film of polyethylene terephthalate or the like in advance. It can also be used in the form of a film.
- the case where the photocurable thermosetting resin composition of this invention is used as a dry film is shown below.
- the dry film has a structure in which a carrier film, a solder resist layer, and a peelable cover film used as necessary are laminated in this order.
- the solder resist layer is a layer obtained by applying and drying an alkali-developable photocurable thermosetting resin composition on a carrier film or a cover film. After forming a solder resist layer on the carrier film, a cover film is laminated thereon, or a solder resist layer is formed on the cover film, and this laminate is laminated on the carrier film to obtain a dry film.
- the carrier film a thermoplastic film such as a polyester film having a thickness of 2 to 150 ⁇ m is used.
- the alkali-developable photo-curable thermosetting resin composition is uniformly applied to a carrier film or cover film with a thickness of 10 to 150 ⁇ m using a blade coater, lip coater, comma coater, film coater, etc., and dried. Formed.
- the cover film a polyethylene film, a polypropylene film, or the like can be used, but a cover film having a smaller adhesive force than the solder resist layer is preferable.
- a protective film permanent protective film
- peel off the cover film layer the solder resist layer and the substrate on which the circuit is formed, and bond them together using a laminator, etc.
- a solder resist layer is formed on the formed substrate. If the formed solder resist layer is exposed, developed, and heat cured in the same manner as described above, a cured coating film can be formed.
- the carrier film may be peeled off either before exposure or after exposure.
- Synthesis example 1 A novolac-type cresol resin (manufactured by Showa Polymer Co., Ltd., trade name “Shonol CRG951”, OH equivalent: 119.4) 119. 4 parts, 1.19 parts of potassium hydroxide and 119.4 parts of toluene were charged, the system was purged with nitrogen while stirring, and the temperature was raised. Next, 63.8 parts of propylene oxide was gradually added dropwise and reacted at 125 to 132 ° C. and 0 to 4.8 kg / cm 2 for 16 hours. Thereafter, the reaction solution was cooled to room temperature, and 1.56 parts of 89% phosphoric acid was added to and mixed with the reaction solution to neutralize potassium hydroxide.
- the nonvolatile content was 62.1% and the hydroxyl value was 182.2 g / eq.
- a novolak-type cresol resin propylene oxide reaction solution was obtained. This was an average of 1.08 moles of alkylene oxide added per equivalent of phenolic hydroxyl group.
- 293.0 parts of an alkylene oxide reaction solution of the obtained novolac-type cresol resin, 43.2 parts of acrylic acid, 11.53 parts of methanesulfonic acid, 0.18 part of methylhydroquinone and 252.9 parts of toluene were added to a stirrer.
- varnish A-1 332.5 parts of the obtained novolak acrylate resin solution and 1.22 parts of triphenylphosphine were charged into a reactor equipped with a stirrer, a thermometer and an air blowing tube, and air was supplied at a rate of 10 ml / min. While blowing and stirring, 60.8 parts of tetrahydrophthalic anhydride was gradually added and reacted at 95 to 101 ° C. for 6 hours. A resin solution of a carboxyl group-containing photosensitive resin having a solid acid value of 88 mgKOH / g and a nonvolatile content of 71% was obtained. Hereinafter, this is referred to as varnish A-1.
- Synthesis example 2 Into a 5 liter separable flask equipped with a thermometer, a stirrer and a reflux condenser, 1,245 parts of polycaprolactone diol (PLACCEL 208, molecular weight 830, manufactured by Daicel Chemical Industries, Ltd.) as a polymer polyol, dihydroxyl having a carboxyl group
- the compound is 201 parts of dimethylolpropionic acid, 777 parts of isophorone diisocyanate as a polyisocyanate, 119 parts of 2-hydroxyethyl acrylate as a (meth) acrylate having a hydroxyl group, p-methoxyphenol and di-t-butyl-hydroxy 0.5 parts each of toluene was added.
- varnish A-2 The mixture was heated to 60 ° C. with stirring and stopped, and 0.8 part of dibutyltin dilaurate was added. When the temperature in the reaction vessel starts to decrease, the mixture is heated again and stirred at 80 ° C. to confirm that the isocyanate group absorption spectrum (2280 cm ⁇ 1 ) has disappeared in the infrared absorption spectrum. A viscous liquid urethane acrylate compound was obtained. The volatile content was adjusted to 50% by mass using carbitol acetate. A resin solution of a urethane (meth) acrylate compound having a carboxyl group having a solid acid value of 47 mgKOH / g and a nonvolatile content of 50% was obtained. Hereinafter, this is referred to as varnish A-2.
- Synthesis example 3 In a 2 liter separable flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel and nitrogen introduction tube, 900 parts of diethylene glycol dimethyl ether as a solvent and t-butylperoxy 2-ethylhexanoate (as a polymerization initiator) 21.4 parts of Nippon Oil & Fats Co., Ltd., trade name: Perbutyl O) was added and heated to 90 ° C.
- varnish A-3 33.9 parts of 3,4-epoxycyclohexylmethyl acrylate (manufactured by Daicel Chemical Industries, Ltd., trade name: Cyclomer A200) and dimethylbenzylamine as a ring-opening catalyst were added to the obtained carboxyl group-containing copolymer resin. 3.6 parts, 1.80 parts of hydroquinone monomethyl ether was added as a polymerization inhibitor, heated to 100 ° C., and stirred to carry out an epoxy ring-opening addition reaction. After 16 hours, a resin solution having a solid content acid value of 108.9 mgKOH / g, a weight average molecular weight of 25,000, and a solid content of 54% was obtained. Hereinafter, this is referred to as varnish A-3.
- Synthesis example 4 670 parts of diethylene glycol monoethyl ether acetate and 1070 parts of orthocresol novolac type epoxy resin (manufactured by DIC Corporation, EPICLON N-695, softening point 95 ° C., epoxy equivalent 214, average functional group number 7.6) (number of glycidyl groups (aromatic ring) Total number): 5.0 moles), 360 parts (5.0 moles) of acrylic acid, and 1.5 parts of hydroquinone were charged, heated and stirred at 100 ° C., and uniformly dissolved. Next, 4.3 parts of triphenylphosphine was added, heated to 110 ° C.
- varnish R-2 To the obtained reaction liquid, 415 parts of aromatic hydrocarbon (Sorvesso 150) and 456.0 parts (3.0 mol) of tetrahydrophthalic anhydride were reacted, and reacted at 110 ° C. for 4 hours. After cooling, solid acid A resin solution having a value of 89 mg KOH / g and a solid content of 65% was obtained. Hereinafter, this is referred to as varnish R-2.
- reaction solution was cooled to 60 ° C., charged with 13.8 parts of triphenylphosphine, heated to 100 ° C., and allowed to react for about 32 hours to obtain a reaction product having an acid value of 0.5 mg KOH / g.
- 364.7 parts of tetrahydrophthalic anhydride, 137.5 parts of carbitol acetate, and 58.8 parts of solvent naphtha were added to this, heated to 95 ° C., reacted for about 6 hours, cooled, and solid acid value
- a resin solution of a carboxyl group-containing photosensitive resin having 40 mg KOH / g and a nonvolatile content of 65% was obtained.
- varnish R-3 this is referred to as varnish R-3.
- Synthesis example 7 After dissolving 925 parts of epichlorohydrin and 462.5 parts of dimethyl sulfoxide in 400 parts of bisphenol F type solid epoxy resin having an epoxy equivalent of 800 and a softening point of 79 ° C., 81.2 parts of 98.5% NaOH at 70 ° C. with stirring. Added over 100 minutes. After the addition, the reaction was further performed at 70 ° C. for 3 hours. Next, most of the excess unreacted epichlorohydrin and dimethyl sulfoxide are distilled off under reduced pressure, the reaction product containing the by-product salt and dimethyl sulfoxide is dissolved in 750 parts of methyl isobutyl ketone, and 10 parts of 30% NaOH is further added.
- the reaction was carried out at 70 ° C. for 1 hour. After completion of the reaction, washing was performed twice with 200 parts of water. After the oil / water separation, methyl isobutyl ketone was recovered by distillation from the oil layer to obtain 370 parts of an epoxy resin (a-1) having an epoxy equivalent of 290 and a softening point of 62 ° C. 2900 parts (10 equivalents) of the obtained epoxy resin (a-1), 720 parts (10 equivalents) of acrylic acid, 2.8 parts of methylhydroquinone and 1950 parts of carbitol acetate were charged, heated to 90 ° C., stirred and reacted. The mixture was dissolved.
- reaction solution was cooled to 60 ° C., charged with 16.7 parts of triphenylphosphine, heated to 100 ° C., and reacted for about 32 hours to obtain a reaction product having an acid value of 1.0 mgKOH / g.
- 786 parts (7.86 mol) of succinic anhydride and 423 parts of carbitol acetate were added to this, heated to 95 ° C., reacted for about 6 hours, solid content acid value 100 mg KOH / g, solid content 65% A resin solution was obtained.
- varnish R-4 this is referred to as varnish R-4.
- Examples 1 to 13 and Comparative Examples 1 to 3 Using the resin solution of the above synthesis example, blended in the proportions (parts by mass) shown in Table 1 together with various components shown in Table 1 below, premixed with a stirrer, kneaded with a three-roll mill, A photosensitive resin composition was prepared. Here, it was 15 micrometers or less when the dispersion degree of the obtained photosensitive resin composition was evaluated by the particle size measurement by the grindometer by Eriksen.
- ⁇ Developability> The photocurable thermosetting resin compositions of the examples and comparative examples were applied to a solid copper substrate by a screen printing method so that the film thickness after drying was about 25 ⁇ m, and a hot air circulation drying oven at 80 ° C. For 30 minutes. After drying, development was performed with a 1 wt% sodium carbonate aqueous solution, and the time until the dried coating film was removed was measured with a stopwatch.
- ⁇ Maximum development life> The compositions of Examples and Comparative Examples were applied on the entire surface of a patterned copper foil substrate by screen printing, dried at 80 ° C., taken out every 20 minutes from 20 to 80 minutes, and allowed to cool to room temperature. .
- the substrate was developed with a 1 wt% sodium carbonate aqueous solution at 30 ° C. under a spray pressure of 0.2 MPa for 60 seconds, and the maximum allowable drying time in which no residue remained was defined as the maximum development life.
- ⁇ Acid resistance> The evaluation substrate was immersed in a 10 vol% H 2 SO 4 aqueous solution at room temperature for 30 minutes, and the penetration and the dissolution of the coating film were visually confirmed. Further, peeling by tape beer was confirmed. ⁇ : No change is observed. ⁇ : Slightly changed. X: The coating film has swelling or swelling dropping.
- ⁇ Electroless gold plating resistance> Using a commercially available electroless nickel plating bath and electroless gold plating bath, plating is performed under the conditions of nickel 5 ⁇ m and gold 0.05 ⁇ m, and tape peeling is used to check whether the resist layer has been peeled off or plating has penetrated. After the evaluation, the presence or absence of peeling of the resist layer was evaluated by tape peeling. The judgment criteria are as follows. ⁇ : Slight penetration was confirmed after plating, but there was no peeling after tape peeling. ⁇ : Slight penetration was confirmed after plating, and peeling was also observed after tape peeling. X: There is peeling after plating.
- ⁇ PCT resistance> The evaluation substrate on which the solder resist cured coating film was formed was treated for 168 hours under the conditions of 121 ° C., saturation, and 0.2 MPa using a PCT apparatus (HAST SYSTEM TPC-412MD manufactured by ESPEC Corporation), and the state of the coating film Evaluated.
- the judgment criteria are as follows. ⁇ : No swelling, peeling, discoloration or elution. ⁇ : Some swelling, peeling, discoloration, and elution. X: Swelling, peeling, discoloration, and elution are often observed.
- Example 13 and Comparative Example 1 were applied onto the patterned copper foil substrate by screen printing, dried at 80 ° C. for 30 minutes, and allowed to cool to room temperature. Using this exposure apparatus equipped with a high-pressure mercury lamp on this substrate, the solder resist pattern is exposed at an optimum exposure amount, and developed with a 1 wt% sodium carbonate aqueous solution at 30 ° C. under a spray pressure of 0.2 MPa for 90 seconds. Thus, Example 14 and Comparative Example 4 were obtained.
- This substrate was irradiated with ultraviolet rays under a condition of an integrated exposure amount of 1000 mJ / cm 2 in a UV conveyor furnace, and then heated at 130 ° C., 140 ° C., 150 ° C., 160 ° C., 170 ° C., 180 ° C., or 190 ° C. for 60 minutes. And cured.
- the characteristics of the obtained printed circuit board (evaluation board) were evaluated as follows. The results are shown in Tables 3 and 4.
- ⁇ Tg measurement> A 3mm x 10mm size cured film is subjected to a tensile test in the temperature range of 0 ° C to 260 ° C at a constant temperature increase rate while applying a load of 10g with TMA6100 manufactured by Seiko Instruments Inc., and extrapolation points are calculated. The glass transition temperature Tg was calculated.
- ⁇ CTE measurement> A tensile test was performed on a cured film having a size of 3 mm ⁇ 10 mm in a temperature range of 0 ° C. to 260 ° C. at a constant temperature increase rate while applying a load of 10 g with TMA6100 manufactured by Seiko Instruments Inc.
- the linear thermal expansion coefficient CTE was calculated from the amount of elongation of the cured film with respect to temperature.
- ⁇ Dry film evaluation> The cover film is peeled off from the dry film obtained as described above, the film is thermally laminated on the patterned copper foil substrate, and then, under the same conditions as the substrate used for the coating film property evaluation of the above example. Exposed. After the exposure, the carrier film was peeled off, and a 1 wt% sodium carbonate aqueous solution at 30 ° C. was developed for 90 seconds under a spray pressure of 0.2 MPa to obtain a resist pattern. This substrate was irradiated with ultraviolet rays under a condition of an integrated exposure amount of 1000 mJ / cm 2 in a UV conveyor furnace, and then cured by heating at 150 ° C. for 60 minutes. About the test substrate which has the obtained cured film, the evaluation test of each characteristic was done with the test method and evaluation method which were mentioned above. The results are shown in Table 5.
- ⁇ Dry film evaluation> The cover film is peeled off from the dry film obtained as described above using the composition of Example 1 and Comparative Example 1, and the film is heat-laminated on the patterned copper foil substrate. The film was exposed under the same conditions as those of the substrate used for the evaluation of coating film properties. After the exposure, the carrier film was peeled off, and a 1 wt% sodium carbonate aqueous solution at 30 ° C. was developed for 90 seconds under the condition of a spray pressure of 0.2 MPa to obtain resist patterns, which were referred to as Example 23 and Comparative Example 8, respectively.
- This substrate was irradiated with ultraviolet rays under a condition of an integrated exposure amount of 1000 mJ / cm 2 in a UV conveyor furnace, and then heated at 130 ° C., 140 ° C., 150 ° C., 160 ° C., 170 ° C., 180 ° C., or 190 ° C. for 60 minutes. And cured. About the test substrate which has the obtained cured film, the evaluation test of each characteristic was done with the test method and evaluation method which were mentioned above. The results are shown in Tables 6 and 7.
- the photo-curable thermosetting resin composition of the present invention has the PCT resistance, the thermal shock resistance, the HAST characteristics (electrical characteristics) required for the solder resist for semiconductor packages. ) was found to be useful as a photocurable thermosetting resin composition.
- thermosetting resin composition of the present invention By using the photo-curable thermosetting resin composition of the present invention, a cured film excellent in PCT resistance, HAST resistance, electroless gold plating resistance, heat resistance, etc. can be formed.
- This solder resist can be suitably used for forming a solder resist for a semiconductor package.
Abstract
Description
さらに本発明の目的は、このような光硬化性熱硬化性樹脂組成物を用いることによって得られる上記のような諸特性に優れたドライフィルム及び硬化物、並びに該ドライフィルムや硬化物によりソルダーレジスト等の硬化皮膜が形成されてなるプリント配線板を提供することにある。
上記カルボキシル基含有樹脂は、感光性基を有することが好ましい。
さらにまた、本発明によれば、前記光硬化性熱硬化性樹脂組成物又はドライフィルムを、活性エネルギー線の照射、好ましくは紫外線の直接描画によりパターン状に光硬化させた後、熱硬化して得られる硬化皮膜を有するプリント配線板も提供される。
上記カルボキシル基含有樹脂としては、エポキシ樹脂を出発原料としていないカルボキシル基含有樹脂であれば従来公知の各種カルボキシル基含有樹脂使用できるが、その中でも、分子中にエチレン性不飽和二重結合を有するカルボキシル基含有感光性樹脂が、光硬化性や耐現像性の面から好ましい。そして、その不飽和二重結合は、アクリル酸もしくはメタアクリル酸又はそれらの誘導体由来のものが好ましい。尚、エチレン性不飽和二重結合を有さないカルボキシル基含有樹脂のみを用いる場合、組成物を光硬化性とするためには、後述するような分子中に1個以上のエチレン性不飽和基を有する化合物(感光性モノマー)を併用する必要がある。
(1)ビスフェノールA、ビスフェノールF、ビスフェノールS、ノボラック型フェノール樹脂、ポリ-p-ヒドロキシスチレン、ナフトールとアルデヒド類の縮合物、ジヒドロキシナフタレンとアルデヒド類との縮合物などの1分子中に2個以上のフェノール性水酸基を有する化合物と、エチレンオキシド、プロピレンオキシドなどのアルキレンオキシドとを反応させて得られる反応生成物に、(メタ)アクリル酸等の不飽和基含有モノカルボン酸を反応させ、得られる反応生成物に無水マレイン酸、テトラヒドロ無水フタル酸、無水トリメリット酸、無水ピロメリット酸、アジピン酸等の多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂。
なお、本明細書において、(メタ)アクリレートとは、アクリレート、メタクリレート及びそれらの混合物を総称する用語で、他の類似の表現についても同様である。
一方、類似のフェノールノボラック樹脂より合成されたエポキシ樹脂のエポキシ基を全てアクリル化し、全ての水酸基に酸無水物を導入すると、二重結合等量400~500で酸価が非常に大きくなってしまい、露光後でも耐現像性を有する塗膜が得られなくなる。さらには、酸価が高いことから、耐水性に劣り、絶縁信頼性、PCT耐性を著しく低下させる。即ち、類似のフェノールノボラック型エポキシ樹脂より誘導されたエポキシアクリレート系変性樹脂から完全に水酸基を無くすことは非常に困難である。
このような観点から、先に具体例として示したカルボキシル基含有樹脂(1)~(5)が特に好ましく用いることができる。
また、上記カルボキシル基含有樹脂の酸価は、40~150mgKOH/gの範囲が望ましく、より好ましくは40~130mgKOH/gの範囲である。カルボキシル基含有樹脂の酸価が40mgKOH/g未満であるとアルカリ現像が困難となり、一方、150mgKOH/gを超えると現像液による露光部の溶解が進むために、必要以上にラインが痩せたり、場合によっては、露光部と未露光部の区別なく現像液で溶解剥離してしまい、正常なレジストパターンの描画が困難となるので好ましくない。
このような光重合開始剤、光開始助剤、及び増感剤の総量は、前記カルボキシル基含有樹脂100質量部に対して35質量部以下であることが好ましい。35質量部を超えると、これらの光吸収により深部硬化性が低下する傾向にある。
上記熱硬化成分は単独又は2種以上を併用することができる。
このような1分子中に2個以上のイソシアネート基又はブロック化イソシアネート基を有する化合物の配合量は、前記カルボキシル基含有樹脂100質量部に対して、1~100質量部、より好ましくは、2~70質量部の割合が適当である。前記配合量が、1質量部未満の場合、十分な塗膜の強靭性が得られず、好ましくない。一方、100質量部を超えた場合、保存安定性が低下するので好ましくない。
赤色着色剤としてはモノアゾ系、ジズアゾ系、アゾレーキ系、ベンズイミダゾロン系、ペリレン系、ジケトピロロピロール系、縮合アゾ系、アントラキノン系、キナクリドン系などがあり、具体的には以下のようなカラ-インデックス(C.I.;ザ ソサイエティ オブ ダイヤーズ アンド カラリスツ(The Society of Dyers and Colourists)発行)番号が付されているものが挙げられる。
モノアゾ系:Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269。
ジスアゾ系:Pigment Red 37, 38, 41。
モノアゾレーキ系:Pigment Red 48:1, 48:2, 48:3, 48:4, 49:1, 49:2, 50:1, 52:1, 52:2, 53:1, 53:2, 57:1, 58:4, 63:1, 63:2, 64:1,68。
ベンズイミダゾロン系:Pigment Red 171、Pigment Red 175、Pigment Red 176、Pigment Red 185、Pigment Red 208。
ぺリレン系:Solvent Red 135、Solvent Red 179、Pigment Red 123、Pigment Red 149、Pigment Red 166、Pigment Red 178、Pigment Red 179、Pigment Red 190、Pigment Red 194、Pigment Red 224。
ジケトピロロピロール系:Pigment Red 254、Pigment Red 255、Pigment Red 264、Pigment Red 270、Pigment Red 272。
縮合アゾ系:Pigment Red 220、Pigment Red 144、Pigment Red 166、Pigment Red 214、Pigment Red 220、Pigment Red 221、Pigment Red 242。
アンスラキノン系:Pigment Red 168、Pigment Red 177、Pigment Red 216、Solvent Red 149、Solvent Red 150、Solvent Red 52、Solvent Red 207。
キナクリドン系:Pigment Red 122、Pigment Red 202、Pigment Red 206、Pigment Red 207、Pigment Red 209。
青色着色剤としてはフタロシアニン系、アントラキノン系があり、顔料系はピグメント(Pigment)に分類されている化合物、具体的には、下記のようなものを挙げることができる:Pigment Blue 15、Pigment Blue 15:1、Pigment Blue 15:2、Pigment Blue 15:3、Pigment Blue 15:4、Pigment Blue 15:6、Pigment Blue 16、Pigment Blue 60。
染料系としては、Solvent Blue 35、Solvent Blue 63、Solvent Blue 68、Solvent Blue 70、Solvent Blue 83、Solvent Blue 87、Solvent Blue 94、Solvent Blue 97、Solvent Blue 122、Solvent Blue 136、Solvent Blue 67、Solvent Blue 70等を使用することができる。上記以外にも、金属置換もしくは無置換のフタロシアニン化合物も使用することができる。
緑色着色剤としては、同様にフタロシアニン系、アントラキノン系、ペリレン系があり、具体的にはPigment Green 7、Pigment Green 36、Solvent Green 3、Solvent Green 5、Solvent Green 20、Solvent Green 28等を使用することができる。上記以外にも、金属置換もしくは無置換のフタロシアニン化合物も使用することができる。
黄色着色剤としてはモノアゾ系、ジスアゾ系、縮合アゾ系、ベンズイミダゾロン系、イソインドリノン系、アントラキノン系等があり、具体的には以下のものが挙げられる。
アントラキノン系:Solvent Yellow 163、Pigment Yellow 24、Pigment Yellow 108、Pigment Yellow 193、Pigment Yellow 147、Pigment Yellow 199、Pigment Yellow 202。
イソインドリノン系:Pigment Yellow 110、Pigment Yellow 109、Pigment Yellow 139、Pigment Yellow 179、Pigment Yellow 185。
縮合アゾ系:Pigment Yellow 93、Pigment Yellow 94、Pigment Yellow 95、Pigment Yellow 128、Pigment Yellow 155、Pigment Yellow 166、Pigment Yellow 180。
ベンズイミダゾロン系:Pigment Yellow 120、Pigment Yellow 151、Pigment Yellow 154、Pigment Yellow 156、Pigment Yellow 175、Pigment Yellow 181。
モノアゾ系:Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62:1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116, 167, 168, 169, 182, 183。
ジスアゾ系:Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198。
具体的に例示すれば、Pigment Violet 19、23、29、32、36、38、42、Solvent Violet 13、36、C.I.ピグメントオレンジ1、C.I.ピグメントオレンジ5、C.I.ピグメントオレンジ13、C.I.ピグメントオレンジ14、C.I.ピグメントオレンジ16、C.I.ピグメントオレンジ17、C.I.ピグメントオレンジ24、C.I.ピグメントオレンジ34、C.I.ピグメントオレンジ36、C.I.ピグメントオレンジ38、C.I.ピグメントオレンジ40、C.I.ピグメントオレンジ43、C.I.ピグメントオレンジ46、C.I.ピグメントオレンジ49、C.I.ピグメントオレンジ51、C.I.ピグメントオレンジ61、C.I.ピグメントオレンジ63、C.I.ピグメントオレンジ64、C.I.ピグメントオレンジ71、C.I.ピグメントオレンジ73、C.I.ピグメントブラウン23、C.I.ピグメントブラウン25、C.I.ピグメントブラック1、C.I.ピグメントブラック7等がある。
このような有機溶剤としては、ケトン類、芳香族炭化水素類、グリコールエーテル類、グリコールエーテルアセテート類、エステル類、アルコール類、脂肪族炭化水素、石油系溶剤などを挙げることができる。より具体的には、メチルエチルケトン、シクロヘキサノン等のケトン類;トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類;セロソルブ、メチルセロソルブ、ブチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールジエチルエーテル、トリエチレングリコールモノエチルエーテル等のグリコールエーテル類;酢酸エチル、酢酸ブチル、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールメチルエーテルアセテート、プロピレングリコールエチルエーテルアセテート、プロピレングリコールブチルエーテルアセテートなどのエステル類;エタノール、プロパノール、エチレングリコール、プロピレングリコール等のアルコール類;オクタン、デカン等の脂肪族炭化水素;石油エーテル、石油ナフサ、水添石油ナフサ、ソルベントナフサ等の石油系溶剤などである。このような有機溶剤は、単独で又は2種以上の混合物として用いられる。
上記の酸化防止剤は、1種を単独で又は2種以上を組み合わせて用いることができる。
上記の紫外線吸収剤は、1種を単独で又は2種以上を組み合わせて用いることができ、前記酸化防止剤と併用することで本発明の光硬化性熱硬化性樹脂組成物より得られる成形物の安定化が図れる。
これらの市販品としては、例えばBMPA、MPM、EHMP、NOMP、MBMP、STMP、TMMP、PEMP、DPMP、及びTEMPIC(以上、堺化学工業(株)製)、カレンズ(登録商標)MT-PE1、カレンズMT-BD1、及びカレンズ-NR1(以上、昭和電工(株)製)等を挙げることができる。
上記活性エネルギー線照射に用いられる露光機としては、直接描画装置(例えばコンピューターからのCADデータにより直接レーザーで画像を描くレーザーダイレクトイメージング装置)、メタルハライドランプを搭載した露光機、(超)高圧水銀ランプを搭載した露光機、水銀ショートアークランプを搭載した露光機、もしくは(超)高圧水銀ランプなどの紫外線ランプを使用した直接描画装置を用いることができる。活性エネルギー線としては、最大波長が350~410nmの範囲にあるレーザー光を用いていればガスレーザー、固体レーザーどちらでもよい。また、その露光量は膜厚等によって異なるが、一般には5~500mJ/cm2、好ましくは10~300mJ/cm2の範囲内とすることができる。上記直接描画装置としては、例えば日本オルボテック社製、ペンタックス社製等のものを使用することができ、最大波長が350~410nmのレーザー光を発振する装置であればいずれの装置を用いてもよい。
ソルダーレジスト層は、アルカリ現像性光硬化性熱硬化性樹脂組成物をブレードコーター、リップコーター、コンマコーター、フィルムコーター等でキャリアフィルム又はカバーフィルムに10~150μmの厚さで均一に塗布し乾燥して形成される。
カバーフィルムとしては、ポリエチレンフィルム、ポリプロピレンフィルム等を使用することができるが、ソルダーレジスト層との接着力が、キャリアフィルムよりも小さいものが良い。
温度計、窒素導入装置兼アルキレンオキシド導入装置及び撹拌装置を備えたオートクレーブに、ノボラック型クレゾール樹脂(昭和高分子(株)製、商品名「ショーノールCRG951」、OH当量:119.4)119.4部、水酸化カリウム1.19部及びトルエン119.4部を仕込み、撹拌しつつ系内を窒素置換し、加熱昇温した。次に、プロピレンオキシド63.8部を徐々に滴下し、125~132℃、0~4.8kg/cm2で16時間反応させた。その後、室温まで冷却し、この反応溶液に89%リン酸1.56部を添加混合して水酸化カリウムを中和し、不揮発分62.1%、水酸基価が182.2g/eq.であるノボラック型クレゾール樹脂のプロピレンオキシド反応溶液を得た。これは、フェノール性水酸基1当量当りアルキレンオキシドが平均1.08モル付加しているものであった。
次いで、得られたノボラック型クレゾール樹脂のアルキレンオキシド反応溶液293.0部、アクリル酸43.2部、メタンスルホン酸11.53部、メチルハイドロキノン0.18部及びトルエン252.9部を、撹拌機、温度計及び空気吹き込み管を備えた反応器に仕込み、空気を10ml/分の速度で吹き込み、撹拌しながら、110℃で12時間反応させた。反応により生成した水は、トルエンとの共沸混合物として、12.6部の水が留出した。その後、室温まで冷却し、得られた反応溶液を15%水酸化ナトリウム水溶液35.35部で中和し、次いで水洗した。その後、エバポレーターにてトルエンをジエチレングリコールモノエチルエーテルアセテート118.1部で置換しつつ留去し、ノボラック型アクリレート樹脂溶液を得た。次に、得られたノボラック型アクリレート樹脂溶液332.5部及びトリフェニルホスフィン1.22部を、撹拌器、温度計及び空気吹き込み管を備えた反応器に仕込み、空気を10ml/分の速度で吹き込み、撹拌しながら、テトラヒドロフタル酸無水物60.8部を徐々に加え、95~101℃で6時間反応させた。固形物の酸価88mgKOH/g、不揮発分71%のカルボキシル基含有感光性樹脂の樹脂溶液を得た。以下、これをワニスA-1と称す。
温度計、撹拌機及び環流冷却器を備えた5リットルのセパラブルフラスコに、ポリマーポリオールとしてポリカプロラクトンジオール(ダイセル化学工業(株)製PLACCEL208、分子量830)1,245部、カルボキシル基を有するジヒドロキシル化合物としてジメチロールプロピオン酸201部、ポリイソシアナートとしてイソホロンジイソシアナート777部及びヒドロキシル基を有する(メタ)アクリレートとして2-ヒドロキシエチルアクリレート119部、さらにp-メトキシフェノール及びジ-t-ブチル-ヒドロキシトルエンを各々0.5部ずつ投入した。攪拌しながら60℃まで加熱して停止し、ジブチル錫ジラウレート0.8部を添加した。反応容器内の温度が低下し始めたら再度加熱して、80℃で攪拌を続け、赤外線吸収スペクトルでイソシアナート基の吸収スペクトル(2280cm-1)が消失したことを確認して反応を終了し、粘稠液体のウレタンアクリレート化合物を得た。カルビトールアセテートを用いて不揮発分=50質量%に調整した。固形物の酸価47mgKOH/g、不揮発分50%のカルボキシル基を有するウレタン(メタ)アクリレート化合物の樹脂溶液を得た。以下、これをワニスA-2と称す。
攪拌機、温度計、還流冷却器、滴下ロート及び窒素導入管を備えた2リットルのセパラブルフラスコに、溶媒としてジエチレングリコールジメチルエーテル900部、及び重合開始剤としてt-ブチルパーオキシ2-エチルヘキサノエート(日本油脂(株)製、商品名;パーブチルO)21.4部を加えて90℃に加熱した。加熱後、ここに、メタクリル酸309.9部、メタクリル酸メチル116.4部、及びラクトン変性2-ヒドロキシエチルメタクリレート(プラクセルFM1:ダイセル化学工業(株)製)109.8部を、重合開始剤であるビス(4-t-ブチルシクロヘキシル)パーオキシジカーボネート(日本油脂(株)製、商品名;パーロイルTCP)21.4部と共に3時間かけて滴下して加え、さらに6時間熟成することにより、カルボキシル基含有共重合樹脂を得た。なお、反応は、窒素雰囲気下で行った。
次に、得られたカルボキシル基含有共重合樹脂に、3,4-エポキシシクロヘキシルメチルアクリレート(ダイセル化学工業(株)製、商品名;サイクロマーA200)363.9部、開環触媒としてジメチルベンジルアミン3.6部、重合抑制剤としてハイドロキノンモノメチルエーテル1.80部を加え、100℃に加熱し、攪拌することによりエポキシの開環付加反応を行った。16時間後、固形分酸価が108.9mgKOH/g、重量平均分子量が25,000、固形分54%の樹脂溶液を得た。以下、これをワニスA-3と称す。
ジエチレングリコールモノエチルエーテルアセテート650部にオルソクレゾールノボラック型エポキシ樹脂(DIC(株)製、EPICLON N-695、軟化点95℃、エポキシ当量214、平均官能基数7.6)1070部(グリシジル基数(芳香環総数):5.0モル)、アクリル酸360部(5.0モル)、及びハイドロキノン1.5部を仕込み、100℃に加熱攪拌し、均一溶解した。次いで、トリフェニルホスフィン4.3部を仕込み、110℃に加熱して2時間反応後、更にトリフェニルホスフィン1.6部を追加し、120℃に昇温してさらに12時間反応を行った。得られた反応液に芳香族系炭化水素(ソルベッソ150)525部、テトラヒドロ無水フタル酸608部(4.0モル)を仕込み、110℃で4時間反応を行った。さらに、得られた反応液にグリシジルメタクリレート142.0部(1.0モル)を仕込み、115℃で4時間反応を行い、固形分酸価77mgKOH/g、固形分65%の樹脂溶液を得た。以下、これをワニスR-1と称す。
ジエチレングリコールモノエチルエーテルアセテート600部にオルソクレゾールノボラック型エポキシ樹脂(DIC(株)製、EPICLON N-695、軟化点95℃、エポキシ当量214、平均官能基数7.6)1070部(グリシジル基数(芳香環総数):5.0モル)、アクリル酸360部(5.0モル)、及びハイドロキノン1.5部を仕込み、100℃に加熱攪拌し、均一溶解した。次いで、トリフェニルホスフィン4.3部を仕込み、110℃に加熱して2時間反応後、120℃に昇温してさらに12時間反応を行った。得られた反応液に芳香族系炭化水素(ソルベッソ150)415部、テトラヒドロ無水フタル酸456.0部(3.0モル)を仕込み、110℃で4時間反応を行い、冷却後、固形分酸価89mgKOH/g、固形分65%の樹脂溶液を得た。以下、これをワニスR-2と称す。
クレゾールノボラック型エポキシ樹脂(日本化薬(株)製、EOCN-104S、軟化点92℃、エポキシ当量220)2200部、ジメチロールプロピオン酸134部、アクリル酸648.5部、メチルハイドロキノン4.6部、カルビトールアセテート1131部及びソルベントナフサ484.9部を仕込み、9 0℃に加熱し撹拌し、反応混合物を溶解した。次いで、反応液を60℃まで冷却し、トリフェニルフォスフィン13.8部を仕込み、100℃に加熱し、約32時間反応させ、酸価が0.5mgKOH/gの反応物を得た。次に、これにテトラヒドロ無水フタル酸364.7部、カルビトールアセテート137.5部及びソルベントナフサ58.8部を仕込み、95℃に加熱し、約6時間反応させ、冷却し、固形分酸価40mgKOH/g、不揮発分65%のカルボキシル基含有感光性樹脂の樹脂溶液を得た。以下、これをワニスR-3と称す。
エポキシ当量800、軟化点79℃のビスフェノールF型固型エポキシ樹脂400部をエピクロルヒドリン925部とジメチルスルホキシド462.5部を溶解させた後、攪拌下70℃で98.5%NaOH 81.2部を100分かけて添加した。添加後さらに70℃で3時間反応を行なった。次いで、過剰の未反応エピクロルヒドリン及びジメチルスルホキシドの大半を減圧下に留去し、副生塩とジメチルスルホキシドを含む反応生成物をメチルイソブチルケトン750部に溶解させ、さらに30%NaOH 10部を加え、70℃で1時間反応させた。反応終了後、水200部で2回水洗を行った。油水分離後、油層よりメチルイソブチルケトンを蒸留回収して、エポキシ当量290、軟化点62℃のエポキシ樹脂(a-1)370部を得た。得られたエポキシ樹脂(a-1)2900部(10当量)、アクリル酸720部(10当量)、メチルハイドロキノン2.8部、カルビトールアセテート1950部を仕込み、90℃に加熱、攪拌し、反応混合物を溶解した。次いで、反応液を60℃に冷却し、トリフェニルフォスフィン16.7部を仕込み、100℃に加熱し、約32時間反応し、酸価が1.0mgKOH/gの反応物を得た。次に、これに無水コハク酸786部(7.86モル)、カルビトールアセテート423部を仕込み、95℃に加熱し、約6時間反応を行い、固形分酸価100mgKOH/g、固形分65%の樹脂溶液を得た。以下、これをワニスR-4と称す。
上記合成例の樹脂溶液を用い、下記表1に示す種々の成分と共に表1に示す割合(質量部)にて配合し、攪拌機にて予備混合した後、3本ロールミルで混練し、ソルダーレジスト用感光性樹脂組成物を調製した。ここで、得られた感光性樹脂組成物の分散度をエリクセン社製グラインドメータによる粒度測定にて評価したところ、15μm以下であった。
<最適露光量>
銅厚18μmの回路パターン基板を銅表面粗化処理(メック(株)製メックエッチボンドCZ-8100)後、水洗し、乾燥した後、前記実施例及び比較例の光硬化性熱硬化性樹脂組成物をスクリーン印刷法により全面に塗布し、80℃の熱風循環式乾燥炉で60分間乾燥させた。乾燥後、高圧水銀灯搭載の露光装置を用いてステップタブレット(Kodak No.2)を介して露光し、現像(30℃、0.2MPa、1wt%炭酸ナトリウム水溶液)を60秒で行った際残存するステップタブレットのパターンが7段の時を最適露光量とした。
前記実施例及び比較例の光硬化性熱硬化性樹脂組成物を、銅ベタ基板上にスクリーン印刷法により乾燥後の膜厚が約25μmになるように塗布し、80℃の熱風循環式乾燥炉で30分間乾燥させた。乾燥後、1wt%炭酸ナトリウム水溶液によって現像を行い、乾燥塗膜が除去されるまでの時間をストップウォッチにより計測した。
前記実施例及び比較例の組成物を、パターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃で乾燥し20分から80分まで10分おきに基板を取り出し、室温まで放冷した。この基板に30℃の1wt%炭酸ナトリウム水溶液をスプレー圧0.2MPaの条件で60秒間現像を行い、残渣が残らない最大許容乾燥時間を最大現像ライフとした。
前記実施例及び比較例の組成物を、パターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃の熱風循環式乾燥炉で30分間乾燥させ、室温まで放冷した。この基板にPET製ネガフィルムを当て、ORC社製HMW-GW20で1分間減圧条件下で圧着させ、その後、ネガフィルムを剥がしたときのフィルムの張り付き状態を、以下の基準で評価した。
○:フィルムを剥がすときに、全く抵抗が無く、塗膜に跡が残らない。
△:フィルムを剥がす時に、僅かに抵抗があり、塗膜に跡が少しついている。
×:フィルムを剥がす時に、抵抗があり、塗膜にはっきり跡がついている。
前記実施例及び比較例の組成物を、パターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃で30分乾燥し、室温まで放冷した。この基板に高圧水銀灯を搭載した露光装置を用いて最適露光量でソルダーレジストパターンを露光し、30℃の1wt%炭酸ナトリウム水溶液をスプレー圧0.2MPaの条件で90秒間現像を行い、レジストパターンを得た。この基板を、UVコンベア炉にて積算露光量1000mJ/cm2の条件で紫外線照射した後、150℃で60分加熱して硬化した。得られたプリント基板(評価基板)に対して以下のように特性を評価した。
評価基板を10vol%H2SO4水溶液に室温で30分間浸漬し、染み込みや塗膜の溶け出しを目視にて確認し、さらにテープビールによる剥がれを確認した。
○:変化が認められないもの。
△:ほんの僅か変化しているもの。
×:塗膜に膨れあるいは膨潤脱落があるもの。
評価基板を10vol%NaOH水溶液に室温で30分間浸漬し、染み込みや塗膜の溶け出しを目視にて確認し、さらにテープビールによる剥がれを確認した。
○:変化が認められないもの。
△:ほんの僅か変化しているもの。
×:塗膜に膨れあるいは膨潤脱落があるもの。
ロジン系フラックスを塗布した評価基板を、予め260℃に設定したはんだ槽に浸漬し、変性アルコールでフラックスを洗浄した後、目視によるレジスト層の膨れ・剥がれについて評価した。判定基準は以下のとおりである。
○:10秒間浸漬を3回以上繰り返しても剥がれが認められない。
△:10秒間浸漬を3回以上繰り返すと少し剥がれる。
×:10秒間浸漬を3回以内にレジスト層に膨れ、剥がれがある。
市販品の無電解ニッケルめっき浴及び無電解金めっき浴を用いて、ニッケル5μm、金0.05μmの条件でめっきを行い、テープピーリングにより、レジスト層の剥がれの有無やめっきのしみ込みの有無を評価した後、テープピーリングによりレジスト層の剥がれの有無を評価した。判定基準は以下のとおりである。
○:めっき後に僅かなしみ込みが確認されるが、テープピール後の剥がれはない。
△:めっき後に僅かなしみ込みが確認され、テープピール後に剥がれも見られる。
×:めっき後に剥がれがある。
ソルダーレジスト硬化塗膜を形成した評価基板を、PCT装置(エスペック(株)製HAST SYSTEM TPC-412MD)を用いて、121℃、飽和、0.2MPaの条件で168時間処理し、塗膜の状態を評価した。判定基準は以下のとおりである。
○:膨れ、剥がれ、変色、溶出のないもの。
△:若干の膨れ、剥がれ、変色、溶出があるもの。
×:膨れ、剥がれ、変色、溶出が多く見られるもの。
□抜き、○抜きパターンを形成したソルダーレジスト硬化塗膜を有する評価基板を作製した。得られた評価基板を冷熱衝撃試験器(エタック(株)製)で-55℃/30分~150℃/30分を1サイクルとして1000サイクルの耐性試験を行った。試験後、処理後の硬化膜を目視により観察し、クラックの発生状況を下記の基準にて判断した。
○:クラック発生率30%未満。
△:クラック発生率30~50%。
×:クラック発生率が50%を超える。
クシ型電極(ライン/スペース=50ミクロン/50ミクロン)が形成されたBT基板に、ソルダーレジスト硬化塗膜を形成し、評価基板を作成した。この評価基板を、130℃、湿度85%の雰囲気下の高温高湿槽に入れ、電圧12Vを荷電し、168時間、槽内HAST試験を行った。168時間経過時の槽内絶縁抵抗値を下記の判断基準に従い評価した。
○:108Ωを超える。
△:106~108Ω。
×:106Ω未満。
前記実施例13及び比較例1の組成物を、パターン形成された銅箔基板上にスクリーン印刷で全面塗布し、80℃で30分乾燥し、室温まで放冷した。この基板に高圧水銀灯を搭載した露光装置を用いて最適露光量でソルダーレジストパターンを露光し、30℃の1wt%炭酸ナトリウム水溶液をスプレー圧0.2MPaの条件で90秒間現像を行い、レジストパターンを得、それぞれ実施例14及び比較例4とした。この基板を、UVコンベア炉にて積算露光量1000mJ/cm2の条件で紫外線照射した後、130℃、140℃、150℃、160℃、170℃、180℃、又は190℃で60分加熱して硬化した。得られたプリント基板(評価基板)に対して以下のように特性を評価した。結果を表3及び表4に示す。
3mm×10mmのサイズの硬化皮膜を、セイコーインスツールメンツ社製TMA6100にて10gの荷重を加えながら一定の昇温速度で0℃-260℃の温度範囲で引張り試験を行い、外挿点を計算しガラス転移温度Tgを算出した。
3mm×10mmのサイズの硬化皮膜を、セイコーインスツールメンツ社製TMA6100にて10gの荷重を加えながら一定の昇温速度で0℃-260℃の温度範囲で引張り試験を行った。温度に対する硬化皮膜の伸び量から線熱膨張係数CTEを算出した。
表1に示す配合割合で調製した実施例1、3、4、6、7、8、9、11及び比較例1、2、3の各組成物をメチルエチルケトンにて希釈し、PETフィルム上に塗布して80℃で30分乾燥し、厚さ20μmの感光性樹脂組成物層を形成した。さらにその上にカバーフィルムを貼り合わせてドライフィルムを作製し、それぞれを実施例15~22、比較例5~7とした。
上記のようにして得られたドライフィルムからカバーフィルムを剥がし、パターン形成された銅箔基板に、フィルムを熱ラミネートし、次いで、前記実施例の塗膜特性評価に用いた基板と同様の条件で露光した。露光後、キャリアフィルムを剥がし、30℃の1wt%炭酸ナトリウム水溶液をスプレー圧0.2MPaの条件で90秒間現像を行い、レジストパターンを得た。この基板を、UVコンベア炉にて積算露光量1000mJ/cm2の条件で紫外線照射した後、150℃で60分加熱して硬化した。得られた硬化皮膜を有する試験基板について、前述した試験方法及び評価方法にて、各特性の評価試験を行った。結果を表5に示す。
前記実施例1及び比較例1の組成物を用いて上記のようにして得られたドライフィルムからカバーフィルムを剥がし、パターン形成された銅箔基板に、フィルムを熱ラミネートし、次いで、前記実施例の塗膜特性評価に用いた基板と同様の条件で露光した。露光後、キャリアフィルムを剥がし、30℃の1wt%炭酸ナトリウム水溶液をスプレー圧0.2MPaの条件で90秒間現像を行い、レジストパターンを得、それぞれ実施例23及び比較例8とした。この基板を、UVコンベア炉にて積算露光量1000mJ/cm2の条件で紫外線照射した後、130℃、140℃、150℃、160℃、170℃、180℃、又は190℃で60分加熱して硬化した。得られた硬化皮膜を有する試験基板について、前述した試験方法及び評価方法にて、各特性の評価試験を行った。結果を表6及び表7に示す。
Claims (6)
- カルボキシル基含有樹脂(但し、エポキシ樹脂を出発原料とするカルボキシル基含有樹脂を除く)、
光重合開始剤、及び
ナフタレン環を有するエポキシ樹脂
を含有することを特徴とするアルカリ水溶液により現像可能な光硬化性熱硬化性樹脂組成物。 - 前記カルボキシル基含有樹脂がフェノール樹脂を出発原料としていることを特徴とする請求項1に記載の光硬化性熱硬化性樹脂組成物。
- 前記カルボキシル基含有樹脂が感光性基を有することを特徴とする請求項1に記載の光硬化性熱硬化性樹脂組成物。
- 前記請求項1乃至3のいずれか一項に記載の光硬化性熱硬化性樹脂組成物を、キャリアフィルムに塗布・乾燥して得られる光硬化性熱硬化性のドライフィルム。
- 前記請求項1乃至3のいずれか一項に記載の光硬化性熱硬化性樹脂組成物、又は該光硬化性熱硬化性樹脂組成物をキャリアフィルムに塗布・乾燥して得られるドライフィルムを、光硬化して得られる硬化物。
- 前記請求項1乃至3のいずれか一項に記載の光硬化性熱硬化性樹脂組成物、又は該光硬化性熱硬化性樹脂組成物をキャリアフィルムに塗布・乾燥して得られるドライフィルムを、活性エネルギー線の照射によりパターン状に光硬化させた後、熱硬化して得られる硬化皮膜を有するプリント配線板。
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