WO2011102239A1 - 光導波路、光集積回路及び光導波路の製造方法 - Google Patents

光導波路、光集積回路及び光導波路の製造方法 Download PDF

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Publication number
WO2011102239A1
WO2011102239A1 PCT/JP2011/052345 JP2011052345W WO2011102239A1 WO 2011102239 A1 WO2011102239 A1 WO 2011102239A1 JP 2011052345 W JP2011052345 W JP 2011052345W WO 2011102239 A1 WO2011102239 A1 WO 2011102239A1
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WIPO (PCT)
Prior art keywords
optical waveguide
molding material
optical
layer
forming
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/052345
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English (en)
French (fr)
Japanese (ja)
Inventor
聡彦 星野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of WO2011102239A1 publication Critical patent/WO2011102239A1/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Definitions

  • the present invention relates to an optical waveguide, an optical integrated circuit, and an optical waveguide manufacturing method.
  • optical transmission systems have become widely used due to demands for large capacity and high speed information processing in optical communication systems and computers.
  • optical transmission systems an optical wiring technique using an optical waveguide for signal transmission within a semiconductor chip or between chips has been proposed (see, for example, Patent Document 1).
  • Optical waveguides are in high demand as basic components of optical devices and optical integrated circuits (optical ICs) for realizing large-capacity information transmission and optical computers, for example.
  • Advantages of using optical wiring using optical waveguides for signal transmission include high resistance to electromagnetic interference (EMI) and wiring delay (RC delay) that is particularly seen in electrical wiring in long-distance transmission. Not to mention.
  • EMI electromagnetic interference
  • RC delay wiring delay
  • an optical waveguide can be freely wired in a two-dimensional region only in a direction parallel to the substrate, whereas it is free in a three-dimensional region including a direction perpendicular to the substrate. It cannot be wired. Even if the lower optical waveguide that is horizontal to the substrate and the upper optical waveguide that is also horizontal are connected by an optical waveguide that is perpendicular to the substrate, the light cannot be bent at a right angle, This is because it proceeds with a curvature R corresponding to the refractive index of light. In fact, if light is bent at a right angle, light leaks out of the core layer, which is the optical path.
  • the object of the present invention is to provide a new and improved light transmission capable of three-dimensional optical transmission including not only a horizontal direction but also a vertical direction with respect to a substrate.
  • Another object of the present invention is to provide an optical waveguide, an optical integrated circuit, and a method for manufacturing the optical waveguide.
  • an optical waveguide formed on a substrate, the first optical waveguide having an optical path formed in a horizontal direction with respect to the substrate, and the first optical waveguide.
  • a third optical waveguide having an optical path formed in a horizontal direction with respect to the substrate.
  • the second optical waveguide in which an optical path is formed in an oblique direction between the first optical waveguide and the third optical waveguide formed in a step difference with respect to the first optical waveguide. Connected at Thereby, the light transmitted through the first optical waveguide travels to the third optical waveguide while reflecting the wall of the optical path formed obliquely by the second optical waveguide. Thereby, not only light can be transmitted in a horizontal direction (two-dimensional direction) with respect to the substrate, but also light can be transmitted in a direction perpendicular to the substrate (three-dimensional direction) using reflection of light. .
  • the interlayer optical wiring between the first optical waveguide and the third optical waveguide can be realized without using the semiconductor laser diode LD or the photodiode PD, the cost can be greatly reduced.
  • using such an optical waveguide capable of three-dimensional optical transmission it becomes possible to inspect a wafer or IC chip thinned for 3DI in a non-contact manner with light.
  • Each of the first to third optical waveguides includes a clad layer as a reflective layer for reflecting light and a core layer serving as the optical path, and the second optical waveguide transmits the first optical waveguide.
  • the transmitted light may be transmitted to the third optical waveguide by being transmitted to the third optical waveguide while being reflected by the cladding layer of the second optical waveguide.
  • the refractive index n 1 of the material forming the core layer may be smaller than the refractive index n 2 of the material forming the cladding layer.
  • the oblique angle of the second optical waveguide may be determined according to a ratio between the refractive index n 1 of the core layer and the refractive index n 2 of the cladding layer.
  • the optical waveguide formed on a substrate, a light emitting element that emits signal light to the optical waveguide, and the optical waveguide are transmitted.
  • An optical integrated circuit including a light receiving element that detects signal light is provided.
  • a first film forming step of forming a clad layer having a refractive index n 2 and a molding material on which an oblique pattern is formed include A first imprint process for transferring an oblique pattern of the molding material to the clad layer by pressure-bonding to the clad layer formed in the first film formation process; and after the first imprint process a second film forming step of forming a core layer with a refractive index n 1, by a molding material diagonal pattern is formed is bonded to the core layer which is formed by the second film formation step A second imprint process for transferring an oblique pattern of the molding material to the core layer; and a third film formation process for forming a clad layer having a refractive index n 2 after the second imprint process; A method for manufacturing an optical waveguide is provided.
  • an oblique pattern of the molding material is formed on the molding material by pressing the molding material on which the oblique pattern is formed to the molding material.
  • a pressing step a transfer step of transferring a reversal pattern of the molding material to the molding material by curing the molding material by heating or light irradiation, and the molding material is cured by the transfer step.
  • a release step of peeling the molding material from the molding material.
  • the mold release step includes a separation step of separating the molding material in a direction opposite to the pressing direction of the molding material, and a pressing step of pressing the molding material in the same direction as the pressing direction of the molding material. May be.
  • the manufacturing method of can be provided.
  • FIG. 2 is a plan view and a longitudinal sectional view (1-1 sectional view) of an optical waveguide according to the same embodiment. It is the figure which showed an example of the nanoimprint process used for manufacture of the optical waveguide which concerns on the same embodiment. It is the figure which showed the example of improvement of the nanoimprint process used for manufacture of the optical waveguide which concerns on the embodiment. It is a longitudinal cross-sectional view of the optical waveguide which concerns on the modification of this invention.
  • a first imprint process for forming an oblique pattern is performed. Specifically, in the first imprint process, a mold 100 as a molding material on which an oblique pattern is formed is pressure-bonded to the lower cladding layer 20 formed in the first film formation process. Thereby, the oblique pattern of the mold 100 is transferred to the lower cladding layer 20, and a tapered shape 20 a is formed at the end of the lower cladding layer 20.
  • the second composition for forming the core layer 30 having a refractive index n 1 (where n 1 ⁇ n 2 ) is formed.
  • a membrane process is performed.
  • a core layer 30 having a refractive index n 1 is formed in a region embossed in the first imprint process.
  • a core layer 30 having a refractive index n 1 is formed on the entire surface including the upper portion of the cladding layer 20.
  • a core forming material is applied on the lower clad layer 20 and dried or prebaked to form the core layer 30.
  • a polymer may be applied as a core forming material.
  • the core layer 30 may be formed by filling the embossed region or the like with an epoxy ultraviolet photocurable resin and irradiating the ultraviolet ray to cure the photocurable resin.
  • the core layer 30 may be formed by embedding a resin whose refractive index is changed by irradiating the embossed region with ultraviolet rays.
  • a second imprint process using the mold 100 is performed. That is, the oblique pattern of the mold 100 is transferred to the core layer 30 by pressing the mold 100 to the core layer 30 having the refractive index n 1 formed in the second film formation step. As a result, a tapered shape 20 b is formed in the core layer 30.
  • the taper shape 20b of the core layer 30 is inclined at substantially the same angle as the taper shape 20a of the lower cladding layer 20 formed in the first imprint process. Oblique angle is optimized in accordance with the ratio between the refractive index n 2 of the refractive index n 1 and a cladding layer 20 of the core layer 30.
  • the third film forming step of forming an upper cladding layer 40 of refractive index n 2 is executed. Specifically, an upper clad layer forming material is applied to the surface of the core layer 30 and dried or prebaked to form an upper clad layer thin film.
  • the upper cladding layer 40 is formed as shown in FIG. 1 by curing the upper cladding layer thin film by irradiating it with ultraviolet rays or the like.
  • the optical waveguide 200 formed on the substrate 10 is completed by executing all the above steps.
  • the upper part of FIG. 2 is a plan view of the optical waveguide 200, and the lower part of FIG. 2 is a longitudinal sectional view of the optical waveguide 200 obtained by cutting the upper part of FIG.
  • the optical waveguide 200 communicates with the first optical waveguide in the lower layer in which the optical path is formed in the horizontal direction (XY direction) with respect to the substrate 10, and communicates with the substrate 10.
  • Each of the first to third optical waveguides includes a clad layer and a core layer.
  • the core layer 30 forms an optical path composed of the core layer while being sandwiched between the lower clad layer 20 and the upper clad layer 40.
  • the lower cladding layer 20 and the upper cladding layer 40 reflect light.
  • the lower cladding layer 20 and the upper cladding layer 40 transmit light without reflecting it. .
  • light cannot be transmitted in the vertical direction of the substrate 10 through the second optical waveguide. Therefore, it is necessary to select a material in which the refractive index n 2 of the material forming the lower cladding layer 20 and the upper cladding layer 40 is larger than the refractive index n 1 of the material forming the core layer 30. Thereby, light can be reflected by the lower cladding layer 20 and the upper cladding layer 40.
  • the material for forming the core layer 30 may be a member that is transparent to the wavelength of the signal light.
  • a material for forming the lower cladding layer 20 and the upper cladding layer 40 if the signal light is infrared light, it is preferable to select a material having a high refractive index with respect to infrared, for example, silicon (Si), Examples thereof include silicon nitride (SiN), germanium (Ge), potassium bromide (KBr), thallium bromoiodide (KRS-5), and thallium bromochloride (KRS-6).
  • a material such as quartz (SiO 2 ), polymethyl methacrylate resin (PMMA), polymer, or the like is used as a material for forming the lower cladding layer 20 and the upper cladding layer 40. Can be used.
  • the optical waveguide 200 manufactured by the above process light is transmitted as follows. That is, in the first optical waveguide, light travels straight through the core layer 30 in the horizontal direction (XY direction). In the second optical waveguide, light travels through the core layer 30 of the second optical waveguide, is reflected by the tapered surface of the lower clad layer 20, and travels straight in a substantially vertical direction (Z direction) while changing the transmission direction. Further, the light is reflected by the tapered surface of the upper clad layer 40 of the second optical waveguide, and travels straight with the transmission direction changed substantially in the horizontal direction (XY direction). In the third optical waveguide, the light again travels straight in the horizontal direction (XY direction). According to the optical waveguide 200 according to the present embodiment having such a configuration, by utilizing light reflection, three-dimensional optical transmission including not only a horizontal direction but also a vertical direction with respect to the substrate 10 can be performed with a simple structure. It becomes possible.
  • the interlayer optical wiring can be realized without using the semiconductor laser diode LD or the photodiode PD, the cost can be greatly reduced. Further, by using such an optical waveguide 200 capable of three-dimensional optical transmission, it becomes possible to inspect a wafer or IC chip thinned for 3DI in a non-contact manner with light.
  • optical waveguide 200 described above can be used for interchip wiring and intrachip wiring.
  • an optical integrated circuit optical IC including an element including a three-dimensional optical waveguide 200, a light emitting element that emits signal light to the optical waveguide 200, and a light receiving element that detects signal light transmitted through the optical waveguide 200.
  • Optical integrated circuits have the same advantages as semiconductor integrated circuits, that is, high-performance devices can be commercialized compactly, functions can be reduced in cost, reliability is high, and the number of components is low. Can be obtained.
  • the mold 100 is peeled from the lower clad layer 20 cured in the transfer step.
  • the mold release step the mold 100 is pulled away in the direction opposite to the pressing direction of the lower clad layer (here, the mold lowering direction). Thereby, the mold 100 is peeled from the lower clad layer 20, and the whole process is completed.
  • the tapered shape can be formed more easily than the case where the tapered shape is formed by etching into the tapered shape by the etching process.
  • the tapered shape may be produced by etching without using the nanoimprint method.
  • the ⁇ crimping step> shown on the upper side of FIG. 4 is executed. Since the crimping process is the same as the basic example of the nanoimprint process, description thereof is omitted. In this step, an inclined pattern of the mold 100 is formed on the lower cladding layer 20.
  • ⁇ mold release step peeling step> shown in the lower center of FIG. 4 is performed.
  • the mold 100 is peeled from the lower clad layer 20 cured in the transfer step.
  • the mold releasing step is performed in addition to the operation of separating the mold 100 in the direction opposite to the pressing direction of the lower cladding layer 20 (here, the mold lowering direction) (the releasing step), and the lower cladding layer 20 is bonded to the mold 100.
  • An operation of pressing in the same direction as the direction (pressing step) is performed.
  • the mold 100 is peeled from the lower cladding layer 20 by raising the mold 100 in the direction opposite to the pressing direction of the lower cladding layer 20 as described above.
  • the mold 100 is not easily peeled off. This has been the main factor that slows down the processing speed of pattern formation by the nanoimprint method.
  • a pressing process is provided together with a separating process. This is executed by pressing a plurality of pins 50 against the lower cladding layer 20 through the through holes 100 a provided in the mold 100.
  • the timing of lowering the pin 50 may be after the lower clad layer 20 is cured, or during irradiation with UV light. However, the timing at which the pin 50 is brought into contact with the lower cladding layer 20 must be after the lower cladding layer 20 is cured. Thus, the separation step and the pressing step are performed in conjunction with each other after the lower cladding layer 20 is cured. The separating step and the pressing step may be performed almost simultaneously.
  • the mold 100 is pressed in the pressing direction of the lower cladding layer 20 while pressing the lower cladding layer 20 in the same direction as the pressing direction by the pins 50. Pull away in the opposite direction. Thereby, the lower clad layer 20 and the mold 100 can be peeled reliably and rapidly, and the throughput can be improved.
  • optical waveguide according to modification A modification of the optical waveguide 200 described above is shown in FIG.
  • the optical waveguide 200 according to this modification is different from the configuration of the optical waveguide 200 according to the above-described embodiment in that a dielectric separation layer 60 is formed as an intermediate layer adjacent to the lower cladding layer 20 and the upper cladding layer 40.
  • the dielectric isolation layer 50 is not limited to a dielectric, and any material such as a conductor may be used.
  • the three-dimensional optical waveguide 200 can be manufactured even when the step between the first optical waveguide and the third optical waveguide is large.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
PCT/JP2011/052345 2010-02-16 2011-02-04 光導波路、光集積回路及び光導波路の製造方法 Ceased WO2011102239A1 (ja)

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JP2010-031416 2010-02-16
JP2010031416A JP2011169971A (ja) 2010-02-16 2010-02-16 光導波路、光集積回路及び光導波路の製造方法

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JP6650396B2 (ja) * 2014-07-04 2020-02-19 技術研究組合光電子融合基盤技術研究所 光デバイスの製造方法及び光デバイス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003222750A (ja) * 2002-01-31 2003-08-08 Toshiba Corp 光デバイスの製造方法
JP2006011274A (ja) * 2004-06-29 2006-01-12 Bridgestone Corp 光導波路の製造方法
JP2007010760A (ja) * 2005-06-28 2007-01-18 Sumitomo Electric Ind Ltd 樹脂体を形成する方法、光導波路のための構造を形成する方法、および光学部品を形成する方法
JP2007223169A (ja) * 2006-02-23 2007-09-06 Fujifilm Corp 樹脂成形品の製造方法、並びにインクジェットヘッドの製造方法及びそれにより得られるインクジェットヘッド

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
JPH07128531A (ja) * 1993-09-10 1995-05-19 Nippon Telegr & Teleph Corp <Ntt> 光集積回路およびその作製方法
JP2008016444A (ja) * 2006-06-09 2008-01-24 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003222750A (ja) * 2002-01-31 2003-08-08 Toshiba Corp 光デバイスの製造方法
JP2006011274A (ja) * 2004-06-29 2006-01-12 Bridgestone Corp 光導波路の製造方法
JP2007010760A (ja) * 2005-06-28 2007-01-18 Sumitomo Electric Ind Ltd 樹脂体を形成する方法、光導波路のための構造を形成する方法、および光学部品を形成する方法
JP2007223169A (ja) * 2006-02-23 2007-09-06 Fujifilm Corp 樹脂成形品の製造方法、並びにインクジェットヘッドの製造方法及びそれにより得られるインクジェットヘッド

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