WO2011070813A1 - 複合樹脂材料粒子及びその製造方法 - Google Patents
複合樹脂材料粒子及びその製造方法 Download PDFInfo
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- WO2011070813A1 WO2011070813A1 PCT/JP2010/062108 JP2010062108W WO2011070813A1 WO 2011070813 A1 WO2011070813 A1 WO 2011070813A1 JP 2010062108 W JP2010062108 W JP 2010062108W WO 2011070813 A1 WO2011070813 A1 WO 2011070813A1
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- Prior art keywords
- resin material
- material particles
- composite resin
- conductive
- composite
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- 239000002245 particle Substances 0.000 title claims abstract description 215
- 239000002131 composite material Substances 0.000 title abstract description 3
- 238000000034 method Methods 0.000 title description 9
- 239000000463 material Substances 0.000 claims abstract description 230
- 239000011347 resin Substances 0.000 claims abstract description 150
- 229920005989 resin Polymers 0.000 claims abstract description 150
- 239000002086 nanomaterial Substances 0.000 claims abstract description 122
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000000805 composite resin Substances 0.000 claims description 133
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 96
- 239000006185 dispersion Substances 0.000 claims description 57
- 239000001569 carbon dioxide Substances 0.000 claims description 48
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 48
- 239000002904 solvent Substances 0.000 claims description 42
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 41
- 238000004519 manufacturing process Methods 0.000 claims description 36
- 239000007788 liquid Substances 0.000 claims description 34
- 239000002041 carbon nanotube Substances 0.000 claims description 23
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002270 dispersing agent Substances 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000006230 acetylene black Substances 0.000 claims description 4
- 229910003472 fullerene Inorganic materials 0.000 claims description 4
- 239000003273 ketjen black Substances 0.000 claims description 4
- 239000002070 nanowire Substances 0.000 claims description 4
- 230000001902 propagating effect Effects 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000002134 carbon nanofiber Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 239000002082 metal nanoparticle Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002116 nanohorn Substances 0.000 claims description 3
- 239000002055 nanoplate Substances 0.000 claims description 3
- 239000002073 nanorod Substances 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 239000004431 polycarbonate resin Substances 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 7
- 229920000515 polycarbonate Polymers 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 3
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000013504 Triton X-100 Substances 0.000 description 2
- 229920004890 Triton X-100 Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- PBAYDYUZOSNJGU-UHFFFAOYSA-N chelidonic acid Natural products OC(=O)C1=CC(=O)C=C(C(O)=O)O1 PBAYDYUZOSNJGU-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
- B01F31/80—Mixing by means of high-frequency vibrations above one kHz, e.g. ultrasonic vibrations
- B01F31/87—Mixing by means of high-frequency vibrations above one kHz, e.g. ultrasonic vibrations transmitting the vibratory energy by means of a fluid, e.g. by means of air shock waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/02—Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type
- B29B7/06—Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type with movable mixing or kneading devices
- B29B7/08—Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type with movable mixing or kneading devices shaking, oscillating or vibrating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/80—Component parts, details or accessories; Auxiliary operations
- B29B7/88—Adding charges, i.e. additives
- B29B7/90—Fillers or reinforcements, e.g. fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/043—Carbon nanocoils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/044—Carbon nanohorns or nanobells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/045—Fullerenes
Definitions
- the present invention relates to a composite resin material to which an additive for adding functionality to a resin is added, and more particularly to a conductive composite resin material to which conductivity is added by adding a conductor to the resin.
- Conductive resin is used in applications such as antistatic members and plastic electrical members in electrical products, etc., and is particularly used when sufficient performance cannot be obtained by adding a metal film or the like to the resin surface. Since the plasticization of electronic parts has progressed and new applications of electronic parts have been pioneered every day, the development of conductive resins is industrially and commercially important.
- the resin having conductivity itself there is polyacetylene or the like.
- a conductive resin often does not exhibit sufficient performance during use.
- a conductive material such as carbon black is added to a non-conductive resin such as fluorine resin to conduct conductivity. It is necessary to add sex.
- the conductivity of the conductive material to be added is required to be high.
- a highly conductive material there is a carbon nanomaterial such as a carbon nanotube.
- these carbon nanomaterials contain a large amount of free electrons, they have excellent conductivity.
- the carbon nanomaterial is hydrophobic, it has a high affinity with the resin. Therefore, the carbon nanomaterial is easily dispersed in the resin and is firmly fixed in the resin. Therefore, the carbon nanomaterial has excellent properties as an additive for adding conductivity to the resin.
- these carbon nanomaterials are expensive, in order to keep the price of the conductive resin produced low, it is necessary to further reduce the amount of carbon nanomaterial added.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-100147
- Patent Document 2 Japanese Patent Application Laid-Open No. 2003-192914
- Patent Document 3 Japanese Patent Application Laid-Open No. 2003-221510
- nano metal As another example of the conductive material that can add conductivity by being added to the resin, there is a nano metal.
- Such nanometals are ultrafine metal particles having a diameter or outer diameter of 1 to 100 nm.
- nanometals produced from noble metals such as gold and silver have excellent electrical conductivity and corrosion resistance. These nanometals can add high conductivity to the resin with a small addition amount.
- Nano metal itself does not have hydrophobicity, but by applying coating to the nano metal, hydrophobicity can be added without impairing conductivity, and affinity with the resin can be increased.
- Such coatings can also be used to add corrosion resistance to nanometals made from base metals such as copper. Therefore, such a nano base metal can also be used as a conductive material for adding to the resin.
- the raw material is expensive when a noble metal is used as the nano metal, and the processing such as coating is expensive when a base metal is used. That is, it is expensive in any case. Therefore, in order to keep the price of the conductive resin to be manufactured low, it is necessary to further reduce the amount of nanometal added.
- Patent Document 4 Japanese Patent Application Laid-Open No. 2003-315531
- Patent Document 5 Japanese Patent Application Laid-Open No. 2004-87427
- the present invention has been made to solve the above problems.
- the composite resin material particle of the present invention is characterized in that a conductive material is dispersedly mixed in the surface of the resin material particle.
- the conductive material is firmly embedded in the surface of the resin material particle, the conductive material is difficult to peel off.
- These conductive materials form a conductive layer in the composite resin material particles.
- the composite resin material particles are molded to produce a molded body, the resin material in the composite resin material particles melts and fuses to form a strong molded body.
- floating of the conductive material is prevented by the viscosity of the molten resin material liquid, so that the conductive layer maintains continuity. Accordingly, a conductive net having continuity and conductivity is formed inside the molded body, and conductivity is added to the molded body.
- the method for producing composite resin material particles according to the present invention comprises mixing a conductive material using ultrasonic waves on the surface of resin material particles swollen and softened in carbon dioxide in a subcritical or supercritical state. It is characterized by forming.
- the conductive material is distributed over almost the entire surface of the resin material particles and is firmly embedded from the surface of the resin particles toward the inside. Therefore, the conductive material is stably and firmly distributed on the surface of the resin material particles, is difficult to peel off, and can form a dispersed mixed layer having high conductivity.
- the first aspect of the present invention is: It has resin material particles that are raw materials for producing resin molded bodies, and conductive nanomaterials, A dispersion mixed layer obtained by mixing conductive nanomaterials in a dispersed manner from the surface of the resin material particles toward the inside thereof is formed at least on the entire surface or a part of the surface of the resin material particles, In the dispersion mixed layer, the conductive nanomaterial is dispersed and mixed in the resin material of the resin material particles, The entire dispersion mixed layer is composite resin material particles forming a conductive layer.
- the dispersed mixed layer has a predetermined mixed thickness and is formed on the entire surface of the composite resin material particle, and is disposed inside the composite resin material particle surrounded by the dispersed mixed layer.
- the composite resin material particles according to the first embodiment wherein a single resin region formed only from the resin material exists.
- a third aspect of the present invention is the composite resin material particles according to the second aspect, wherein the dispersion thickness of the dispersion mixed layer is 0.1 ⁇ m to 10 ⁇ m.
- a fourth aspect of the present invention is the composite resin material particle according to the first aspect in which the entire interior of the composite resin material particle is formed only from the dispersion mixed layer.
- the fifth aspect of the present invention is the composite resin material particles according to any one of the first to fourth aspects, which are pellets having a diameter of 100 ⁇ m or more.
- the sixth aspect of the present invention is the composite resin material particle according to any one of the first to fourth aspects, which is a powder having a diameter of 100 ⁇ m or less.
- the conductive nanomaterial is a carbon nanotube, carbon nanofiber, carbon nanocoil, carbon nanotwist, carbon nanohorn, fullerene, carbon black, ketjen black, acetylene black, metal nanoparticle,
- the eighth aspect of the present invention is the composite resin material according to any one of the first to seventh aspects, wherein the conductive nanomaterial has a cylindrical shape having an outer diameter of 150 nm or less and a length of 500 nm or more. Particles.
- the resin material is selected from the group consisting of a fluorine resin, a polycarbonate resin, an olefin resin, a polyether ether ketone resin, a formalin resin, an ester resin, and a styrene resin.
- the tenth aspect of the present invention is Fill the pressure vessel with at least resin material particles, conductive nanomaterial, solvent for propagating ultrasonic waves and liquid carbon dioxide, Maintaining the inside of the pressure vessel at a temperature and pressure at which the liquid carbon dioxide can maintain a subcritical or supercritical state, Mixing the conductive nanomaterial in a dispersed manner from the surface of the resin material particles to the inside using ultrasonic waves,
- the composite resin material particles are obtained by evaporating the liquid carbon dioxide by reducing the pressure later and further evaporating the solvent at the same time or with a time difference to obtain composite resin material particles having a dispersion mixed layer formed on the surface of the resin material particles. It is a manufacturing method.
- the eleventh aspect of the present invention is the method for producing composite resin material particles according to the tenth aspect, wherein the solvent is a highly volatile solvent at normal temperature and normal pressure.
- the composite resin material particle according to the eleventh aspect wherein the solvent is at least one selected from the group consisting of alcohols, ketones, esters, ethers, organic chlorides, and organic fluorides. It is a manufacturing method.
- a thirteenth aspect of the present invention is the method for producing composite resin material particles according to any one of the tenth to twelfth aspects, wherein a weight ratio of the solvent to the conductive nanomaterial is 20 or more.
- a fourteenth aspect of the present invention is the method for producing composite resin material particles according to any one of the tenth to thirteenth aspects, wherein the weight ratio of the liquid carbon dioxide: the solvent is 0.05: 1 to 20: 1. is there.
- a fifteenth aspect of the present invention is a method for producing composite resin material particles according to any one of the tenth to fourteenth aspects, wherein a dispersant and / or a surfactant is added to the pressure vessel.
- a sixteenth aspect of the present invention is the method for producing composite resin material particles according to the tenth to fifteenth aspects, wherein the temperature is higher than 25 ° C. and lower than the melting point temperature of the resin material.
- the seventeenth aspect of the present invention is the method for producing composite resin material particles according to the tenth to sixteenth aspects, wherein the maximum pressure in the pressure vessel is 100 MPa.
- the eighteenth aspect of the present invention is the method for producing composite resin material particles according to the tenth to seventeenth aspects, wherein the ultrasonic wave generator is a horn type of 150 W or more.
- a nineteenth aspect of the present invention is a method for producing composite resin material particles according to any one of the tenth to eighteenth aspects, wherein the conductive nanomaterial is oxidized.
- At least the conductive nanomaterial is mixed with the solvent, and the dispersion is filled in the pressure vessel together with the liquefied carbon dioxide and the resin material particles. It is a manufacturing method of any composite resin material particle of the form.
- the twenty-first aspect of the present invention is the method for producing composite resin material particles according to the twentieth aspect, wherein the dispersion contains a dispersant and / or a surfactant.
- the conductive nanomaterial is firmly embedded in the dispersion mixed layer in the composite resin material particles, so that the conductive mixed nanomaterial is formed. It is fixed inside from the surface of the composite resin material particles and does not peel off.
- the dispersion mixed layer includes a dispersion implantation layer in which the conductive nanomaterial is implanted into the resin material particle surface, a dispersion kneading layer in which the conductive nanomaterial is incorporated into the resin material particle surface, and the conductive nanomaterial. It is an expression including all layers such as a dispersion embedding layer embedded in the surface of the resin material.
- the composite material particle can be ensured in conductivity, so that it is not necessary to use a large amount of conductive nanomaterial, and the composite resin material particle Can be manufactured at low cost.
- the composite resin material particles are molded to form a molded body, a conductive net derived from the conductive nanomaterial is formed inside the molded body, so that a molded body having high conductivity can be obtained.
- the composite resin material particles lose their shape by melting and liquefying, but the viscosity of the molten resin material liquid prevents the conductive nanomaterial from floating, and maintains the continuity of the dispersed implantation layer. .
- the conductive network formed from the conductive nanomaterial in the dispersed implant layer is also continuous and conductive.
- the resin material of the melted composite resin material particles is fused at the time of molding, a strong and sturdy molded body can be obtained.
- the dispersed mixed layer does not need to be formed on the entire surface of the composite resin material particles, and may be a partial surface.
- the smaller the coating of the dispersed mixed layer on the composite resin material particles the lower the continuity of the formed conductive network and the lower the conductivity of the conductive network. Therefore, the larger the coating of the dispersion mixed layer, the better.
- the inventor has confirmed that the conductivity of the molded body to be molded is sufficiently high when the coverage of the dispersed mixed layer is 60% or more. Further, when the dispersion mixed layer was formed in an island shape, it was confirmed that the conductivity of the molded body to be molded was sufficiently increased when the distance between the island dispersion mixed layers was within 500 nm.
- the conductive nanomaterial is dispersed by the action of ultrasonic waves from the swollen and softened surface of the resin material particles as the raw material to the inside. To be mixed.
- the particle diameter of the resin material particles is sufficiently small and the melting point of the resin material is sufficiently low, the entire resin material particles are swollen and softened. Therefore, if the amount of the conductive nanomaterial and the production time of the produced composite resin material particles are sufficient, the conductive nanomaterial is mixed in the entire resin material particles.
- the dispersed mixed layer is formed on the entire surface of the composite resin material particles having a predetermined mixed thickness, and the composite resin material particles surrounded by the dispersed mixed layer. Since there is a single resin region formed only from the resin material inside, there is no need to add conductive nanomaterials throughout the composite resin material particles, so there is high continuity and high inside the molded body during molding. A conductive net having conductivity is obtained. Accordingly, a conductive nanomaterial can be saved and a molded body having high conductivity can be obtained. Moreover, it leads to the cost reduction and performance improvement of a composite resin material particle and a molded object formed from it.
- the mixed thickness of the dispersed mixed layer is 0.1 ⁇ m to 10 ⁇ m, it is possible to ensure a mixed thickness that can secure the conductivity of the dispersed mixed layer, and at the same time, the conductive nanomaterial As a result, it is possible to secure a thin mixing thickness that can prevent waste. Therefore, it leads to improvement in the low cost and performance of the composite resin material particles and the molded body formed therefrom.
- the composite resin material particles in which the conductive nanomaterial is uniformly distributed throughout the composite resin material particles Is obtained.
- the composite resin material particles are pellets having a diameter of 100 ⁇ m or more, it is possible to obtain composite resin material particles having high conductivity at low cost.
- the composite resin material particles in this embodiment since the diameter is relatively large, the surface area is relatively small. Therefore, a small amount of conductive nanomaterial for forming the dispersed mixed layer is required, leading to a reduction in the price of the composite resin material particles.
- the diameter of the composite resin material particles in this embodiment is preferably 2 to 5 mm.
- the composite resin material particles are powder having a diameter of 100 ⁇ m or less, a high-density conductive net can be formed in the molded body at the time of molding. Therefore, high conductivity of the molded body can be ensured.
- the composite resin material particles in this embodiment have a relatively large surface area because of their relatively small diameter. Accordingly, when a molded body is produced from the composite resin material particles, a conductive net derived from the dispersed mixed layer is densely formed, and a highly conductive molded body is obtained.
- the particle diameter of the composite resin material particles in this embodiment is preferably 5 ⁇ m or less.
- the lower limit value of the diameter in the present embodiment is not particularly limited, and the minimum diameter for implementing the present invention is the lower limit value. For example, the lower limit of the diameter is 1 ⁇ m, preferably 5 ⁇ m.
- the conductive nanomaterial carbon nanotube, carbon nanofiber, carbon nanocoil, carbon nanotwist, carbon nanohorn, fullerene, carbon black, ketjen black, acetylene black, metal nano Since at least one selected from the group consisting of particles, metal nanoplates, metal nanorods, and metal nanowires can be used, it is possible to select a conductive nanomaterial according to the application when producing composite resin material particles. it can. Since carbon nanomaterials such as carbon nanotubes have high corrosion resistance and hydrophobicity and high conductivity, they are optimal for forming a dispersed mixed layer on composite resin material particles. The higher the aspect ratio, the higher the conductivity of the dispersed mixed layer.
- Nanometals such as metal nanowires, are very conductive and are useful in forming highly conductive dispersed mixed layers. The higher the aspect ratio, the higher the conductivity of the dispersed mixed layer. However, even when a material with a low aspect ratio such as metal nanoparticles is used, high conductivity can be obtained.
- the conductive nanomaterial has a shape having an outer diameter of 150 nm or less and a length of 500 nm or more.
- a functional material can be produced.
- the higher the aspect ratio of the conductive nanomaterial the higher the entanglement between the conductive nanomaterials in the dispersion mixed layer.
- conductivity is increased. Therefore, the conductivity of the dispersion mixed layer is increased.
- the conductive nanomaterial in this embodiment preferably has an outer diameter of 80 nm or less and a length of 1000 ⁇ m or more. Note that specific shapes of the conductive nanomaterial include a cylindrical shape and a columnar shape.
- the resin material of the composite resin material particles includes a fluorine resin, a polycarbonate resin, an olefin resin, a polyether ether ketone resin, a formalin resin, an ester resin, and a styrene resin. Since one or more selected from the group can be used, practicality can be enhanced by using an optimum resin in practical use, and conductivity can be imparted to various types of resins. Moreover, since these resin materials are easily swollen by liquid carbon dioxide, they are suitable for forming a dispersion mixed layer according to the tenth aspect of the present invention.
- the conductive nanomaterial is mixed in a dispersed manner from the surface to the inside of the resin material particles.
- the conductive nanomaterial is embedded in the surface of the resin material particle. Therefore, deposition of the conductive nanomaterial in an unmixed state on the resin material particles is prevented, and the conductive nanomaterial is firmly fixed from the surface of the composite resin material particles and does not peel off.
- the conductive nanomaterial is dispersed by ultrasonic waves, the conductive nanomaterial is prevented from being biased in the direction of gravity on the resin material particles, and a dispersed mixed layer is formed on almost the entire surface of the resin material particles. Can be formed.
- the ultrasonic wave here cannot propagate in liquid carbon dioxide because cavitation cannot occur in liquid carbon dioxide, but propagates by the solvent added at the same time.
- the carbon dioxide in a subcritical state or a supercritical state is used as the swelling liquid, the carbon dioxide can be completely removed by reducing the pressure after the preparation of the dispersion mixed layer. Can be simplified.
- the solvent for propagating ultrasonic waves can be volatilized after the carbon dioxide evaporation. When the volatility of the solvent is sufficiently high, it can be volatilized simultaneously with the evaporation of carbon dioxide. Furthermore, when the volatility of the solvent is higher than the volatility of carbon dioxide, the solvent can be volatilized first.
- the supercritical state refers to a material state at a temperature and pressure above the critical point.
- the supercritical state indicates a state where the temperature is 31.1 ° C. or higher and the pressure is 72.8 atm or higher.
- a subcritical state refers to a state at a pressure above the critical point and a temperature below the critical point. Even in this state, carbon dioxide can efficiently swell the resin. Therefore, the formation of the dispersed mixed layer can be promoted.
- the conductive nanomaterial is mixed in a dispersed manner by the action of ultrasonic waves from the swelling and softening surface of the resin material particles toward the inside.
- the particle diameter of the resin material particles is sufficiently small, the entire resin material particles are swollen and softened. Therefore, if the amount of the conductive nanomaterial and the production time of the composite resin material particles are sufficient, the conductive nanomaterial is mixed in the entire resin material particles.
- the conductive nanomaterial floats in the dispersion-implanted layer due to the viscosity of the molten resin material liquid. And the continuity of the dispersed implant layer is maintained. Therefore, a continuous conductive net can be formed in the molded body. Therefore, by using the composite resin material particles in this embodiment, a conductive molded body can be produced using a small amount of conductive nanomaterial. Further, since the composite resin material particles melt and fuse at the time of molding, a strong and strong molded body can be produced.
- the formation of the dispersion mixed layer in the tenth aspect leads to simplification of solvent removal, and the composite resin material particles can be easily formed. Can be manufactured.
- alcohol, ketone, ester, ether, chlorinated organic substance, and fluorinated organic substance can be used as the solvent, so that a highly volatile organic solvent that has already been widely marketed can be used, This leads to a decrease in the price of the composite resin material particles.
- the weight ratio of the solvent to the conductive nanomaterial is 20 or more, the conductive nanomaterial can be dispersed in the solvent before the addition, and the conductive The dispersibility of the nanomaterial in the pressurized container can be improved. Therefore, composite resin material particles in which the conductive nanomaterial is highly dispersed and mixed can be obtained.
- the weight ratio of the liquid carbon dioxide: the solvent is 0.05: 1 to 20: 1, the ratio of the liquid carbon dioxide and the solvent can be selected almost arbitrarily. And the flexibility of the process can be increased.
- the fifteenth aspect of the present invention since a dispersant and / or a surfactant is added into the pressure resistant container, even when a conductive nanomaterial that is relatively difficult to disperse is used, It is possible to obtain composite resin material particles having a high dispersibility of the conductive nanomaterial.
- a dispersant Exepearl PE-MO and Trimex N-08 manufactured by Kao Corporation can be used.
- the surfactant Triton X-100 manufactured by Acros Organics, Targetol NR-7 manufactured by Sigma-Aldrich, sodium dodecyl sulfate (SDS), sodium dodecyl benzene sulfonate (SDBS), and the like can be used.
- the dispersion mixed layer formation temperature exceeds 25 ° C. and is lower than the melting point temperature of the resin material, the liquid carbon dioxide is maintained in the subcritical state or the supercritical state.
- the dispersion mixed layer formation temperature is a temperature of 50 ° C. or higher and lower than the melting point temperature of the resin material, and the resin material particles can be reliably swollen above this temperature. .
- the maximum pressure in the pressure vessel is 100 MPa, composite resin material particles can be produced without destroying the pressure vessel.
- the ultrasonic generator is a horn type having a power of 150 W or more, it is possible to obtain a powerful ultrasonic wave necessary for forming a dispersion mixed layer.
- the ultrasonic waves in the present invention and this embodiment preferably have a frequency of 15 kHz or more and an amplitude of 20 ⁇ m or more.
- the conductive nanomaterial in the dispersion mixed layer is used even when the conductive nanomaterial that is relatively difficult to disperse is used.
- the composite resin material particles having a high dispersibility can be obtained.
- the oxidation treatment here include a treatment of immersing the conductive nanomaterial in one or more selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, or phosphoric acid, and a treatment of immersing in an ozone aqueous solution.
- the conductive nanomaterial in this embodiment needs to be a material that is not destroyed by the oxidation treatment, and is preferably a carbon nanomaterial.
- the conductive nanomaterial is dispersed and mixed into the resin material particles in a uniformly dispersed state using a dispersion liquid of the conductive nanomaterial prepared in advance, the conductive The dispersion of the nanomaterial in the dispersed mixed layer is reliably performed, and the uniformity of the conductive nanomaterial in the dispersed mixed layer can be improved. Therefore, the conductivity of the composite resin material particles to be produced and the molded product molded therefrom can be increased.
- the present inventor has found that the dispersibility in the dispersion mixed layer of the conductive nanomaterial is lowered when the resin material particles have low fluidity.
- the shape and properties of the resin material particles having low fluidity include elongated particles such as fiber shapes, particles having a low bulk density, and particles having a high compressibility. These particles are easily entangled with each other by being stirred or stressed, and flow is easily prevented.
- the reason why the dispersibility of the conductive nanomaterial in the dispersed mixed layer formed due to the low fluidity of the resin material particles is considered as follows.
- the resin particles of these materials inhibit the diffusion movement and uniform dispersion of each other, and also inhibit the diffusion movement and uniform dispersion of the conductive nanomaterial. Therefore, the conductive nanomaterial dispersed and mixed is biased to a limited portion of the resin material particles. Further, the resin material particles are entangled with each other, so that they partially overlap, and these portions are shielded from the liquid carbon dioxide and the conductive nanomaterial.
- the conductive nanomaterial When the conductive nanomaterial is dispersed in a solvent in advance and dispersed and mixed with the resin material particles in the state of a dispersion, the conductive nanomaterial can be prevented from being biased on the resin material particles.
- the dispersibility of the conductive nanomaterial in the mixed layer can be increased.
- the conductive nanomaterial is mixed with the solvent.
- other substances may be mixed in the solvent together with the conductive nanomaterial. Examples of other substances include dispersants, surfactants and liquid carbon dioxide.
- the conductive nanomaterial or the like may be mixed with a solvent and then stirred. If the conductive nanomaterial is not sufficiently dispersed by stirring, the dispersibility may be increased by ultrasonic treatment or the like.
- the dispersion contains a dispersant and / or a surfactant
- the dispersibility of the conductive nanomaterial in the dispersion is increased, and the conductivity in the dispersion mixed layer is increased.
- the dispersibility of nanomaterials increases accordingly.
- conductive nanomaterials that are difficult to disperse in a solvent can also be dispersed in the solution. For this reason, the electroconductivity of the composite resin material particle manufactured and the molded object shape
- Triton X-100 manufactured by Acros Organics
- Targetol NR-7 manufactured by Sigma-Aldrich
- SDS sodium dodecyl sulfate
- SDBS sodium benzenesulfonate
- FIG. 1 is a schematic view showing an example of a method for producing composite resin material particles.
- the pressure resistant container 3 is filled with the resin material particles 1 and the conductive nanomaterial 2 together with at least liquid carbon dioxide 21 and a solvent 22 for propagating ultrasonic waves.
- the pressure vessel is heated by water 6 in the water tank 5.
- the ultrasonic transmitter 4 is installed in the lower part of the water tank 5 and propagated by the water 6 in the water tank 5. However, the transmitter 4 may be installed directly on the pressure vessel 3.
- FIG. 2A to 2C are schematic diagrams showing a process in which the conductive nanomaterial 2 is dispersed and mixed on the surface of the resin material particles 1.
- FIG. FIG. 2A shows a state before the resin material particles 1 swell. Since the resin material particles 1 are not swollen, the surface remains in a cured state. In this state, the conductive nanomaterial 2 cannot be dispersed and mixed.
- FIG. 2B shows a state where the resin material particles 1 are swollen. In this state, since the surface is softened, the conductive nanomaterial 2 is easily mixed. However, in a state where ultrasonic irradiation is not performed, the conductive nanomaterial 2 is not mixed from the surface of the resin material particle 1 into the inside.
- FIG. 2C shows a state in which the conductive nanomaterial 2 is mixed from the surface to the inside by the action of the ultrasonic wave 7. It is presumed that bubbles are generated by the action of the ultrasonic wave 7, and the conductive nanomaterial 2 is mixed with the resin material particles 1 by an impact generated by the burst of the bubbles. Further, since the conductive nanomaterial 2 is distributed almost uniformly on the surface of the resin material particle 1 by the ultrasonic wave 7, the conductive nanomaterial 2 is deflected in the direction of gravity and unmixed on the resin material particle 1. The deposition of the conductive nanomaterial 2 in the state is prevented. Since the liquid carbon dioxide 21 does not cause cavitation even in the subcritical state and the supercritical state, it does not propagate ultrasonic waves.
- the solvent 22 that propagates ultrasonic waves is essential.
- composite resin material particles 8 are formed.
- the dispersed mixed layer 9 of the composite resin material particles 8 has a mixed thickness d. Since the conductive nanomaterial 2 in the dispersion mixed layer 9 is embedded in the surface of the composite resin material particle 8 and firmly fixed, the conductive nanomaterial 2 is not peeled unless the dispersion mixed layer 9 is scraped off.
- FIG. 3 is a system diagram showing the piping of the pressure vessel 3. After the material, liquid carbon dioxide and solvent are filled, the valves 10 and 11 are closed and sealed. The temperature and pressure in the pressure vessel 3 are measured by a thermometer 12 and a pressure gauge 13. When the pressure in the pressure vessel 3 exceeds the design upper limit of the pressure vessel 3, the pressure is released by the safety valve 23.
- FIG. 4 is a phase diagram of carbon dioxide.
- the critical point 14 of carbon dioxide exists at a critical temperature of 31.1 ° C. and a critical pressure of 72.8 atmospheres.
- the supercritical state 15 refers to a state in which carbon dioxide has a temperature and pressure of the critical point 14 or higher. In this state, carbon dioxide has a high property of swelling the resin, and therefore promotes the formation of the dispersed mixed layer.
- Subcritical state 16 refers to a state in which carbon dioxide has a pressure above critical point 14 and a temperature below critical point 14. Even in this state, carbon dioxide can swell the resin and thus promote the formation of the dispersed mixed layer. By sufficiently reducing the pressure of carbon dioxide, the carbon dioxide can be rapidly vaporized and carbon dioxide can be quickly removed from the composite resin material particles.
- FIG. 5A and 5B are schematic views showing the configuration of the dispersion mixed layer 9 in the composite resin material particles 8.
- the dispersed mixed layer 9 has a predetermined mixed thickness d, and the single resin region 17 exists inside.
- the composite resin material particle 8 has high conductivity even though it contains a small amount of the conductive nanomaterial 2.
- the composite resin material particles 8 in FIG. 5B are entirely formed of only the dispersion mixed layer 9.
- Such composite resin material particles 8 have a sufficiently small particle size of the resin material particles 1 as a raw material, a sufficiently low melting point of the resin material particles 1, a sufficiently large amount of the conductive nanomaterial 2, and the above-mentioned It is obtained when the production time of the composite resin material particles 8 is sufficiently long.
- a molded body having a conductive net inside can be produced.
- these composite resin material particles 8 lose their shape by melting and liquefying, the conductive nanomaterial 2 in the dispersion mixed layer 9 is prevented from floating due to the viscosity of the molten resin material liquid. Therefore, since the dispersive mixed layer 9 is maintained in continuity, the conductive net derived from the dispersive mixed layer 9 also has continuity and high conductivity. Therefore, a molded body having high conductivity can be obtained by the melt fusion. Further, since the resin material in the composite resin material particles 8 is melted and fused, the obtained molded body is strong and sturdy.
- Example 1 Production of composite resin material particles
- 170 kg of polycarbonate (PC) pellets with an average particle diameter of 3 mm, 5 g of a carbon nanotube (CNT) concentration 0.3 wt% dispersion using ethanol as a solvent, and 48 g of liquid carbon dioxide are held in a pressure vessel and maintained at 65 ° C. Immerse it in a water tank filled with warm water, and supersonically disperse ultrasonic waves for 10 hours using an ultrasonic transmitter (GSD-600AT manufactured by Ginsen Co., Ltd.) went.
- Two types of CNTs were used: Baytubes C150P (average diameter ⁇ 11 nm) manufactured by Bayer Co., Ltd. and VGCF-S (average diameter ⁇ 80 nm) manufactured by Showa Denko Co., Ltd.
- FIGS. 6A and 6B are SEM photographs of the surface and cross section of a PC pellet modified with CNT.
- 6A is a SEM photograph of the surface
- FIG. 6B is a SEM photograph of the cross section. It was confirmed that CNT was uniformly dispersed and mixed on the surface, and a dispersed mixed layer having a mixed thickness d of about 1 ⁇ m in depth was confirmed in the cross section.
- Example 2 Production of molded body
- 24 g of liquid carbon dioxide was charged so that the ratio of the liquid carbon dioxide to the solvent was 1.
- Two types of CNTs were used: Baytubes C150P (average diameter ⁇ 11 nm) manufactured by Bayer Co., Ltd. and VGCF-S (average diameter ⁇ 80 nm) manufactured by Showa Denko Co., Ltd.
- This pressure vessel is immersed in a water tank filled with warm water maintained at 65 ° C., and an ultrasonic transmitter (ultrasonic generator is GSD-600AT manufactured by Ginsen Co., Ltd.) provided at the bottom of the water tank is used for 10 Supercritical ultrasonic dispersion of time was performed. After the treatment, the pressure vessel was opened, the liquid carbon dioxide was evaporated, and the ethanol was volatilized by treating at 105 ° C. for 24 hours using an atmospheric electric furnace to obtain a PFTE powder in which CNTs were dispersed and mixed. . When observed by SEM, it was observed that the resin and CNT were uniformly mixed in both types of CNTs.
- the surface resistance of these molded products was measured with a surface resistance measuring instrument (MEGARESTA-HO709 manufactured by Sisid Electric Co., Ltd.).
- the surface resistance of the molded product 3 produced by the commercially available PC containing CNTs was 4.1 ⁇ 10 8 ⁇ / cm 2
- the surface resistance of the molded products 1 and 2 was 1.0 ⁇ 10 ⁇ / cm 2. 2 to 3.0 ⁇ 10 ⁇ / cm 2 .
- the raw materials of molded products 1 and 2 are PFTE having a low CNT concentration and a high insulating property, they exhibit a low electrical resistance value compared to commercially available CNT-containing PCs, and can mold a highly conductive material. It was.
- composite resin material particles having high conductivity can be easily obtained using a small amount of conductive nanomaterial.
- carbon dioxide and the solvent are easily vaporized, so that the process can be simplified. Since this composite resin material particle can be used to form a molded product having a highly conductive network, a molded product having high conductivity can be obtained by using a small amount of conductive nanomaterial. Therefore, this invention contributes to obtaining the resin molding which has high electroconductivity by a cheap and highly industrial method.
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Abstract
Description
本願は、2009年12月12日に、日本に出願された特願2009-282320号に基づき優先権を主張し、その内容をここに援用する。
本発明の複合樹脂材料粒子は、樹脂材料粒子の表面内に導電性材料が分散状に混合されていることを特徴とする。この複合樹脂材料粒子においては、導電性材料が強固に樹脂材料粒子の表面内に埋め込まれているので、前記導電性材料が剥離し難い。これらの導電性材料が複合樹脂材料粒子において導電層を形成する。この複合樹脂材料粒子を成型して成型体を作製する際に、複合樹脂材料粒子内における樹脂材料が溶融して融合することにより強固な成型体を形成する。更に、前記複合樹脂材料粒子の溶融融合時において、前記導電性材料の浮遊が、溶融した前記樹脂材料液体の粘性により阻止されるので、前記導電層が連続性を保つ。従って、前記成型体の内部において連続性且つ導電性を有する導電性網を形成し、前記成型体に導電性を付加する。
樹脂成型体を製造する為の原料である樹脂材料粒子と、導電性ナノ材料を有し、
前記樹脂材料粒子の表面からその内側に向かって導電性ナノ材料を分散状に混合してなる分散混合層が、前記樹脂材料粒子の全表面又は一部表面に少なくとも形成され、
前記分散混合層においては前記導電性ナノ材料が前記樹脂材料粒子の樹脂材料中に分散混合され、
前記分散混合層の全体が導電層を形成する複合樹脂材料粒子である。
少なくとも樹脂材料粒子、導電性ナノ材料、超音波を伝播させる為の溶媒及び液体二酸化炭素を耐圧容器に充填し、
前記耐圧容器の内部を前記液体二酸化炭素が亜臨界又は超臨界状態を維持できる温度及び圧力に保持し、
超音波を用いて前記導電性ナノ材料を前記樹脂材料粒子の表面からその内側に向かって分散状に混合し、
後に減圧により前記液体二酸化炭素を蒸発させ、更に同時に又は時間差を設けて前記溶媒を揮発させることにより、前記樹脂材料粒子表面に分散混合層が形成された複合樹脂材料粒子を得る複合樹脂材料粒子の製造方法である。
なお、本形態における直径の下限値は特に制限されず、本発明が実施できるための最小の直径が下限値となる。例えば、直径の下限値として、1μm、好ましくは5μmが挙げられる。
カーボンナノチューブ等のカーボンナノ物質は、耐食性及び疎水性が高く、また導電性も高いので、複合樹脂材料粒子上に分散混合層を形成するのに最適である。アスペクト比が高い程、分散混合層の導電性が高くなるが、フラーレン等の低アスペクト比を有する材料を使用しても、充分な導電性が得られる。
カーボンブラック、ケッチェンブラック及びアセチレンブラックなどの従来型の導電性添加剤は、導電性は低いが、従来において広範囲に使用され、実績に富むので、本発明の複合樹脂材料粒子を確実に製造できる。
金属ナノワイヤ等のナノ金属は、導電性が非常に高いので、高導電性の分散混合層を形成するのに有用である。アスペクト比が高い程、分散混合層の導電性が高くなるが、金属ナノ粒子などのアスペクト比が低い材料を使用しても、高い導電性が得られる。
なお、導電性ナノ材料の具体的な形状としては、円筒形状及び円柱形状が挙げられる。
図2Aにおいては樹脂材料粒子1が膨潤する以前の状態を示す。樹脂材料粒子1は膨潤していないので、表面が硬化状態のままであり、この状態では導電性ナノ材料2の分散混合はできない。
図2Bにおいては、樹脂材料粒子1が膨潤した状態を示す。この状態においては、表面が軟化するので、導電性ナノ材料2が混合されやすくなる。しかし、超音波照射を行わない状態においては、導電性ナノ材料2が樹脂材料粒子1の表面から内部へ混合されない。
図2Cにおいては、導電性ナノ材料2が超音波7の作用により表面から内部へ混合される状態を示す。超音波7の作用により、気泡が生じ、この気泡が急激に破裂して発生する衝撃により導電性ナノ材料2が樹脂材料粒子1に混合されると推測される。又、超音波7により導電性ナノ材料2が樹脂材料粒子1の表面にほぼ均一に分布されて分散混合されるので、重力方向における導電性ナノ材料2の偏向及び樹脂材料粒子1上における未混合状態の導電性ナノ材料2の堆積が防止される。
液体二酸化炭素21は亜臨界状態及び超臨界状態においてもキャビテーションを起こさないので、超音波を伝播しない。従って、図2A~図2Cに示される工程においては、超音波を伝播する溶媒22が必須となる。この工程により、複合樹脂材料粒子8が形成される。この複合樹脂材料粒子8の分散混合層9は、混合厚dを有する。分散混合層9内の導電性ナノ材料2は、複合樹脂材料粒子8の表面内に埋め込まれ、強固に固定される為、分散混合層9を削り取らない限り、導電性ナノ材料2は剥離されない。
耐圧容器内に平均粒径3mmのポリカーボネート(PC)ペレットを170mg、溶媒にエタノールを用いたカーボンナノチューブ(CNT)濃度0.3wt%分散液を5g、液体二酸化炭素を48g充填し、65℃に保持された温水を満たした水槽の中に浸漬し、水槽下部に設けられた超音波発信子(超音波発生装置はギンセン(株)製GSD-600AT)を用いて10時間の超臨界超音波分散を行った。CNTは、Bayer(株)製BaytubesC150P(平均径φ11nm)及び昭和電工(株)製VGCF-S(平均径φ80nm)の2種類を用いた。
耐圧容器内に平均粒径5μmのポリテトラフルオロエチレン(PTFE)粉末を16g、溶媒にエタノールを用いたカーボンナノチューブ(CNT)濃度1.0wt%分散液をCNT重量がPFTEに対し3wt%になるように48g充填し、液体二酸化炭素を当該液体二酸化炭素の溶媒に対する比が1になるように48g充填した。CNTとしては、Bayer(株)製BaytubesC150P(平均径φ11nm)及び昭和電工(株)製VGCF-S(平均径φ80nm)の2種類を用いた。
2 導電性ナノ材料
3 耐圧容器
4 超音波発信子
5 水槽
6 水
7 超音波
8 複合樹脂材料粒子
9 分散混合層
10 バルブ
11 バルブ
12 温度計
13 圧力計
14 臨界点
15 超臨界状態
16 亜臨界状態
17 樹脂単体領域
21 液体二酸化炭素
22 溶媒
23 安全弁
Claims (21)
- 樹脂成型体を製造する為の原料である樹脂材料粒子と、導電性ナノ材料を有し、
前記樹脂材料粒子の表面からその内側に向かって導電性ナノ材料を分散状に混合してなる分散混合層が、前記樹脂材料粒子の全表面又は一部表面に少なくとも形成され、
前記分散混合層においては前記樹脂材料粒子の樹脂材料中に前記導電性ナノ材料が分散混合され、
前記分散混合層の全体が導電層を形成する複合樹脂材料粒子。 - 前記分散混合層は所定の混合厚を有して前記複合樹脂材料粒子の全表面に形成され、前記分散混合層に囲まれた前記複合樹脂材料粒子の内部に前記樹脂材料のみから形成される樹脂単体領域が存在する請求項1に記載の複合樹脂材料粒子。
- 前記分散混合層の混合厚が0.1μm~10μmである請求項2に記載の複合樹脂材料粒子。
- 前記複合樹脂材料粒子の内部全体が前記分散混合層のみから形成された請求項1に記載の複合樹脂材料粒子。
- 前記複合樹脂材料粒子は、直径が100μm以上のペレットである請求項1に記載の複合樹脂材料粒子。
- 前記複合樹脂材料粒子は、直径が100μm以下の粉体である請求項1に記載の複合樹脂材料粒子。
- 前記導電性ナノ材料が、カーボンナノチューブ、カーボンナノファイバー、カーボンナノコイル、カーボンナノツイスト、カーボンナノホーン、フラーレン、カーボンブラック、ケッチェンブラック、アセチレンブラック、金属ナノ粒子、金属ナノプレート、金属ナノロッド、及び金属ナノワイヤからなる群から選択される1種以上である請求項1に記載の複合樹脂材料粒子。
- 前記導電性ナノ材料が、外径が150nm以下であり、且つ長さが500nm以上である形状を有する、請求項1に記載の複合樹脂材料粒子。
- 前記樹脂材料が、フッ素系樹脂、ポリカーボネート樹脂、オレフィン系樹脂、ポリエーテルエーテルケトン樹脂、ホルマリン系樹脂、エステル樹脂、及びスチレン系樹脂からなる群から選択される1種以上である請求項1に記載の複合樹脂材料粒子。
- 少なくとも樹脂材料粒子、導電性ナノ材料、超音波を伝播させる為の溶媒及び液体二酸化炭素を耐圧容器に充填し、
前記耐圧容器の内部を前記液体二酸化炭素が亜臨界又は超臨界状態を維持できる温度及び圧力に保持し、
超音波を用いて前記導電性ナノ材料を前記樹脂材料粒子の表面からその内側に向かって分散状に混合し、
後に減圧により前記液体二酸化炭素を蒸発させ、
更に同時に又は時間差を設けて前記溶媒を揮発させることにより、前記樹脂材料粒子表面に分散混合層が形成された複合樹脂材料粒子を得る複合樹脂材料粒子の製造方法。 - 前記溶媒が常温及び常圧において高揮発性溶媒である請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記溶媒が、アルコール、ケトン、エステル、エーテル、塩化有機物、及びフッ化有機物からなる群から選択される1種以上である請求項11に記載の複合樹脂材料粒子の製造方法。
- 前記導電性ナノ材料に対する前記溶媒の重量比が20以上である請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記液体二酸化炭素:前記溶媒の重量比が0.05:1~20:1である請求項10に記載の樹脂複合材料原料の製造方法。
- 分散剤及び/又は界面活性剤を前記耐圧容器内に添加する請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記温度が25℃を超え、且つ前記樹脂材料の融点温度未満である請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記耐圧容器内の最大圧力が100MPaである請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記超音波の発生装置が150W以上のホーン式である請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記導電性ナノ材料が酸化処理されている請求項10に記載の複合樹脂材料粒子の製造方法。
- 少なくとも前記導電性ナノ材料が前記溶媒に混合され、分散された分散液を、前記液化二酸化炭素及び前記樹脂材料粒子と共に前記耐圧容器に充填する請求項10に記載の複合樹脂材料粒子の製造方法。
- 前記分散液は分散剤及び/又は界面活性剤を含有する請求項20に記載の複合樹脂材料粒子の製造方法。
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