WO2011013437A1 - 積層コイル部品 - Google Patents
積層コイル部品 Download PDFInfo
- Publication number
- WO2011013437A1 WO2011013437A1 PCT/JP2010/058738 JP2010058738W WO2011013437A1 WO 2011013437 A1 WO2011013437 A1 WO 2011013437A1 JP 2010058738 W JP2010058738 W JP 2010058738W WO 2011013437 A1 WO2011013437 A1 WO 2011013437A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ferrite
- inner conductor
- acid
- coil component
- laminated
- Prior art date
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 139
- 239000004020 conductor Substances 0.000 claims abstract description 104
- 239000008139 complexing agent Substances 0.000 claims abstract description 31
- 150000003839 salts Chemical class 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000010304 firing Methods 0.000 claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- -1 lactone compound Chemical class 0.000 claims abstract description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 6
- 238000005204 segregation Methods 0.000 claims description 39
- 239000011148 porous material Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 15
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- PHOQVHQSTUBQQK-SQOUGZDYSA-N D-glucono-1,5-lactone Chemical compound OC[C@H]1OC(=O)[C@H](O)[C@@H](O)[C@@H]1O PHOQVHQSTUBQQK-SQOUGZDYSA-N 0.000 claims description 8
- 235000012209 glucono delta-lactone Nutrition 0.000 claims description 8
- 229960003681 gluconolactone Drugs 0.000 claims description 8
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- VIVCRCODGMFTFY-JPRIQSOUSA-N (4s,5s)-3,4-dihydroxy-5-[(1r,2r)-1,2,3-trihydroxypropyl]oxolan-2-one Chemical compound OC[C@@H](O)[C@@H](O)[C@@H]1OC(=O)C(O)[C@@H]1O VIVCRCODGMFTFY-JPRIQSOUSA-N 0.000 claims description 3
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004471 Glycine Substances 0.000 claims description 3
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 3
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 235000003704 aspartic acid Nutrition 0.000 claims description 3
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- 235000013922 glutamic acid Nutrition 0.000 claims description 3
- 239000004220 glutamic acid Substances 0.000 claims description 3
- WSHYKIAQCMIPTB-UHFFFAOYSA-M potassium;2-oxo-3-(3-oxo-1-phenylbutyl)chromen-4-olate Chemical compound [K+].[O-]C=1C2=CC=CC=C2OC(=O)C=1C(CC(=O)C)C1=CC=CC=C1 WSHYKIAQCMIPTB-UHFFFAOYSA-M 0.000 claims description 3
- 229940005657 pyrophosphoric acid Drugs 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 2
- 235000002639 sodium chloride Nutrition 0.000 claims description 2
- 239000011800 void material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 57
- 239000000243 solution Substances 0.000 description 36
- 239000007864 aqueous solution Substances 0.000 description 20
- 238000005259 measurement Methods 0.000 description 18
- 239000000919 ceramic Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 238000013507 mapping Methods 0.000 description 10
- YASYEJJMZJALEJ-UHFFFAOYSA-N Citric acid monohydrate Chemical compound O.OC(=O)CC(O)(C(O)=O)CC(O)=O YASYEJJMZJALEJ-UHFFFAOYSA-N 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 229960002303 citric acid monohydrate Drugs 0.000 description 8
- 238000007654 immersion Methods 0.000 description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229960004106 citric acid Drugs 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910002794 Si K Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Definitions
- the present invention has a structure in which a spiral coil is disposed inside a ferrite element, which is formed by firing a ceramic laminate in which a ferrite layer and an inner conductor for coil formation mainly composed of Ag are laminated.
- the present invention relates to a laminated coil component having
- the internal stress generated due to the difference in thermal expansion coefficient between the ferrite layer and the inner conductor layer reduces the magnetic properties of the ferrite, resulting in the laminated coil.
- the impedance value of the component is reduced or varied.
- the sintered ferrite element is dipped in an acidic plating solution, and a gap is provided between the ferrite layer and the inner conductor layer, whereby the inner conductor layer is used.
- a multilayer impedance element has been proposed in which the influence of stress on the ferrite layer is avoided to eliminate the decrease or variation in impedance value (Patent Document 1).
- the ferrite element of Patent Document 1 is immersed in the plating solution, and the plating solution penetrates into the inside from the portion where the inner conductor layer is exposed on the surface of the ferrite element. Since a discontinuous gap is formed between the inner conductor layers, the inner conductor layer and the gap are formed between the ferrite layers, and the inner conductor layer is thinned and the inner conductor layer occupies between the ferrite layers. The actual situation is that the ratio of inevitably becomes smaller.
- the ferrite layer thin when the product is a small product such as a product of 1.0 mm ⁇ 0.5 mm ⁇ 0.5 mm or a product of 0.6 mm ⁇ 0.3 mm ⁇ 0.3 mm. Since it becomes difficult to form a thick inner conductor layer while providing both an inner conductor layer and a gap between ferrite layers, it is not only possible to reduce the DC resistance, but also the inner conductor due to a surge or the like. There is a problem that the disconnection of the layer is likely to occur, and sufficient reliability cannot be ensured.
- the laminated coil component laminated chip inductor
- a corrosive solution to corrode the surface of the inner conductor
- a corrosive solution such as an aqueous solution containing a halide, an aqueous solution containing hydrohalic acid, an aqueous solution containing sulfuric acid, an aqueous solution containing oxalic acid, or an aqueous solution containing nitric acid is used. Therefore, not only the interface with the internal electrode but also the interface with the external electrode is corroded, and there is a problem that the adhesion strength of the external electrode is reduced and the external electrode is peeled off in some cases.
- the present invention solves the above-mentioned problem, and without firing a conventional gap between the ferrite layer and the inner conductor layer constituting the laminated coil component, firing between the ferrite layer and the inner conductor layer.
- the inventors have conducted various studies and found that the segregation rate of Cu at the interface between the inner conductor and ferrite is related to the bonding strength between the inner conductor and the surrounding ferrite.
- the invention was completed through further experiments and examinations.
- the laminated coil component of the present invention is A spiral coil formed by firing a laminate formed by laminating a ferrite layer mainly composed of ferrite containing Cu, and formed by interconnecting internal conductors mainly composed of Ag for coil formation
- Cu in the case of “Cu segregation rate” is a concept that includes not only metallic copper (Cu) but also copper oxide (CuO). That is, “Cu” in the case of “Cu segregation rate” means Cu or CuO when the segregating substance is either Cu or CuO, and both Cu and CuO are precipitated. In this case, the concept means both Cu and CuO.
- the pore area ratio of the ferrite constituting the side gap portion which is a region between the side portion of the inner conductor and the side surface of the ferrite element of the ferrite element is 6 to 20%. It is desirable to be in the range.
- the manufacturing method of the laminated coil component of the present invention Firing a laminate comprising a plurality of ferrite green sheets mainly composed of ferrite containing Cu, and a plurality of internal conductor patterns for forming a coil mainly composed of Ag and laminated via the ferrite green sheets. And forming a ferrite element having a spiral coil therein, From the side surface of the ferrite element, the complexing agent solution reaches the interface between the inner conductor and the surrounding ferrite through a side gap portion that is a region between the side portion of the inner conductor and the side surface of the ferrite element.
- a solution containing at least one selected from the group consisting of aminocarboxylic acids and salts thereof, oxycarboxylic acids and salts thereof, amines, phosphoric acid and salts thereof, and lactone compounds is used. It is said.
- the aminocarboxylic acid and a salt thereof are at least one selected from the group consisting of glycine, glutamic acid, aspartic acid, and salts thereof;
- the oxycarboxylic acid and its salt are at least one selected from the group consisting of citric acid, tartaric acid, gluconic acid, glucoheptonic acid, glycolic acid, and salts thereof,
- the amine is at least one selected from the group consisting of triethanolamine, ethylenediamine, and ethylenediaminetetraacetic acid;
- Phosphoric acid and its salt are at least one selected from pyrophosphoric acid and its salt; It is desirable that the lactone compound is at least one selected from gluconolactone and glucoheptonolactone.
- the pore area ratio of the ferrite constituting the side gap portion that is a region between the side portion of the inner conductor and the side surface of the ferrite element is in the range of 6 to 20%. It is desirable to form a certain ferrite element.
- the segregation rate of Cu at the interface between the inner conductor and the surrounding ferrite is 5% or less, there should be a gap at the interface between the inner conductor and the surrounding ferrite. Therefore, it is possible to sufficiently dissociate the interface between the inner conductor and the ferrite. As a result, it is possible to suppress and prevent stress from being applied to the ferrite around the inner conductor, and to suppress and prevent disconnection of the inner conductor due to surge etc. with low impedance and high impedance value, low characteristic variation In addition, it is possible to provide a highly reliable laminated coil component. By setting the segregation rate of Cu to the interface between the inner conductor and ferrite to 3% or less, it becomes possible to dissociate the interface between the inner conductor and ferrite more surely, thus making the present invention more effective. be able to.
- the pore area ratio of the ferrite constituting the side gap portion which is the region between the side portion of the inner conductor and the side surface of the ferrite element, is in the range of 6 to 20%. Therefore, the complexing agent solution can reliably and efficiently reach the interface between the inner conductor and the ferrite from the side gap portion. Further, the pore area ratio of the side gap portion is set to 6 to 20% by considering the combination of the ferrite green sheet and the conductive paste for forming the inner conductor, which is used in the manufacturing process of the ordinary laminated coil component. It can be realized efficiently.
- the method for manufacturing a laminated coil component according to the present invention includes a complexing agent solution and an inner conductor through a side gap that is a region between the side of the inner conductor and the side of the ferrite element from the side of the ferrite element.
- the interface between the inner conductor and the surrounding ferrite is dissociated, and as the complexing agent solution, aminocarboxylic acid and its salt, oxycarboxylic acid and its salt And a solution containing at least one selected from the group consisting of amines, phosphoric acid and salts thereof, and lactone compounds, so that Cu at the interface between the inner conductor and the surrounding ferrite is dissolved and removed. Therefore, the segregation rate of Cu can be made 5% or less (more preferably 3% or less), and the internal conductor and the surrounding ferrite can be confirmed. It can be dissociated in.
- the complexing agent solution used in the present invention is less corrosive to ferrite and electrodes than the acidic solution used in the above-described conventional method, and obtains a laminated coil component with good characteristics. be able to.
- aminocarboxylic acid and a salt thereof at least one selected from the group consisting of glycine, glutamic acid, aspartic acid, and a salt thereof, the oxycarboxylic acid and a salt thereof, citric acid, tartaric acid, gluconic acid, Using at least one selected from the group consisting of glucoheptonic acid, glycolic acid, and salts thereof, and using at least one selected from the group consisting of triethanolamine, ethylenediamine, and ethylenediaminetetraacetic acid as the amines, phosphorus
- the inner conductor and its surroundings Ferrite The segregation ratio of Cu to the interface as a 5% or less, it is possible to more reliably dissociate and ferrite surrounding the inner conductor.
- the pore area ratio of the ferrite constituting the side gap portion is in the range of 6 to 20%, whereby the complexing agent solution is passed from the side gap portion to the inner conductor. It is possible to reliably reach the interface with the ferrite, and the present invention can be made more effective.
- FIG. 1 It is front sectional drawing which shows the structure of the laminated coil component concerning Example 1 of this invention. It is a disassembled perspective view which shows the manufacturing method of the laminated coil component concerning Example 1 of this invention. It is side surface sectional drawing which shows the structure of the laminated coil component concerning Example 1 of this invention. It is a figure which shows the mapping image of Cu by WDX for demonstrating the measuring method of Cu segregation rate. It is a figure explaining the measuring method of the pore area ratio of the laminated coil components of Example 1 of this invention and a comparative example.
- (a) is a figure which shows the mapping image of Cu by WDX when the immersion time to the complexing agent solution of a sample is 12 hours
- (b) is before immersing a sample in a complexing agent solution
- It is a figure which shows the mapping image of Cu by WDX before performing a stress relaxation process.
- FIG. 1 is a front sectional view showing a configuration of a laminated coil component (a laminated impedance element in this embodiment 1) according to an embodiment (Example 1) of the present invention
- FIG. 2 is an exploded perspective view showing a manufacturing method thereof.
- 3 is a side sectional view showing the configuration of the laminated coil component of FIG.
- the laminated coil component 10 is manufactured through a step of firing a laminated body in which a ferrite layer 1 and an inner conductor 2 for forming a coil mainly composed of Ag are laminated.
- a spiral coil 4 is provided inside the ferrite element 3.
- a pair of external electrodes 5 a and 5 b are disposed at both ends of the ferrite element 3 so as to be electrically connected to both ends 4 a and 4 b of the spiral coil 4.
- the inner conductor 2 and the ferrite 11 are configured to be dissociated at the interface.
- the side gap portion 8 which is a region between the ferrite element 3 and the side surface 3a is made of porous ferrite having a pore area ratio of 6 to 20% (14% in the laminated coil component of the first embodiment).
- the interface between the internal conductor 2 and the ferrite 11 is dissociated in the state where there is no gap at the interface between the internal conductor 2 and the ferrite 11, it is added to the ferrite around the internal conductor without thinning the internal conductor.
- the laminated coil component 10 in which stress is relaxed can be obtained. Therefore, it is possible to obtain a highly reliable laminated coil component that has little variation in characteristics, can reduce DC resistance, and is less likely to cause disconnection of the internal conductor due to a surge or the like.
- a magnetic material was weighed in a proportion of 48.0 mol% Fe 2 O 3 , 29.5 mol% ZnO, 14.5 mol% NiO, and 8.0 mol% CuO, and was prepared in a ball mill for 48 hours. Wet mixing was performed. Next, the wet-mixed slurry was dried with a spray dryer and calcined at 700 ° C. for 2 hours. Then, the obtained calcined powder was preliminarily pulverized to obtain a ceramic (ferrite) raw material used in the next step (2).
- the ceramic slurry produced in the above (2) was formed into a sheet shape to produce a ceramic (ferrite) green sheet having a thickness of 12 ⁇ m.
- a conductive paste for forming an inner conductor is screen-printed on the surface of the ferrite green sheet to form a coil pattern having a thickness of 16 ⁇ m (inner conductor pattern ) Was formed.
- a conductive paste having an impurity content of 0.1 wt% or less, Ag powder, varnish, and a solvent, and an Ag content of 85 wt% was used.
- a plurality of ferrite green sheets 21 having an inner conductor pattern (coil pattern) 22 formed thereon are laminated and pressure-bonded, and coil patterns are formed on both upper and lower surfaces thereof.
- the laminate (unfired ferrite element) 23 was obtained by pressure bonding at 1000 kgf / cm 2 . There are no particular restrictions on the method of laminating each ferrite green sheet.
- This unfired ferrite element 23 has a laminated spiral coil in which each internal conductor pattern (coil pattern) 22 is connected by a via hole 24 inside. The number of turns of the coil was 19.5 turns.
- the laminated body 23 was cut into a predetermined size, removed from the binder, and then sintered at 870 ° C. to obtain a ferrite element having a spiral coil therein.
- a conductive paste for forming an external electrode is applied to both ends of a ferrite element (sintered element) 3 provided with a spiral coil 4 inside by an immersion method, dried, and then baked at 750 ° C.
- external electrodes 5a and 5b (see FIG. 1) were formed.
- the conductive paste for forming the external electrode Ag powder having an average particle diameter of 0.8 ⁇ m, B-Si—K-based glass frit having an average particle diameter of 1.5 ⁇ m and varnish having excellent plating resistance are used. A conductive paste blended with a solvent was used. And the external electrode formed by baking this electroconductive paste was a precise
- a 0.2 mol / L aqueous solution of citric acid monohydrate (manufactured by Nacalai Tesque) was used, and immersed in this for 3, 6, 12, 24 hours. After stress relaxation treatment for dissociating the interface with the surrounding ferrite, ultrasonic cleaning was performed in water for 15 minutes.
- a 0.2 mol / L aqueous solution of citric acid monohydrate is used as the complexing agent solution, but the concentration is not limited to this, and various conditions are taken into consideration. Appropriate concentrations are possible. In addition to water solubility, it is also possible to use a solution dissolved in a solvent other than water.
- the laminated coil component (laminated impedance element) 10 having a structure as shown in FIG. 1 is obtained.
- the laminated impedance element 10 has a target value of impedance (
- a complexing agent or hydrochloric acid
- at100Mz) value was examined.
- and the Cu segregation rate at the interface between the inner conductor 2 and the surrounding ferrite 11 was examined. Further, for each sample, the bending strength was examined, and the pore area ratio of the side gap portion was examined.
- the pore area ratio of the side gap portion 8 between the side portion 2 s of the inner conductor 2 and the side surface 3 a of the ferrite element 3 in FIG. 3 was measured by the following method.
- a cross section (hereinafter referred to as “WT plane”) defined by the width direction and thickness direction of the laminated impedance element (sample) is mirror-polished, and the surface subjected to focused ion beam processing (FIB processing) is scanned by an electron microscope (SEM). And the pore area ratio in the magnetic ceramic was measured.
- FIB equipment FIB 200TEM manufactured by FEI FE-SEM (scanning electron microscope): JSM-7500FA manufactured by JEOL WINROOF (image processing software): manufactured by Mitani Corporation, Ver. 5.6
- the pore area ratio was determined by the following method. a) Determine the measurement range. If it is too small, an error due to the measurement location occurs. (In this example, it was 22.85 ⁇ m ⁇ 9.44 ⁇ m) b) If the magnetic ceramic and the pore are difficult to distinguish, adjust the brightness and contrast. c) Perform binarization and extract only pores. If the “color extraction” of the image processing software WINROOF is not complete, it is manually compensated. d) If a part other than the pore is extracted, the part other than the pore is deleted. e) The total area, the number, the area ratio of the pores, and the area of the measurement range are measured by “total area / number measurement” of the image processing software.
- the pore area ratio in the present invention is a value measured as described above.
- the immersion time in the complexing agent solution (citrate monohydrate 0.2 mol / L aqueous solution) was 3 hours or more, and the target It was confirmed that 1000 ⁇ (at 100 MHz) that is
- FIG. 6 (a) is a diagram showing a Cu mapping image by WDX when the immersion time is 12 hours. From this mapping image, it was determined that the Cu segregation rate was 1.7%.
- FIG. 6B shows a Cu mapping image by WDX before the sample is immersed in a complexing agent solution (citric acid monohydrate 0.2 mol / L aqueous solution) (ie, before stress relaxation treatment). From this mapping image, it can be seen that the Cu segregation rate is a high value exceeding 5% before the stress relaxation treatment.
- a complexing agent solution citric acid monohydrate 0.2 mol / L aqueous solution
- Example 1 the pore area ratio of the side gap of the multilayer impedance element is as large as 14% as shown in Table 2, and the complexing agent solution passes through the side gap and the inner conductor and the surrounding ferrite. This is also because stress relaxation was performed efficiently because the interface reliably reached the interface.
- the external electrode peeled off after ultrasonic cleaning, and
- the laminated impedance element (sample) immersed for 3 hours and 6 hours in order to analyze the Cu segregation rate, when the sample is broken with a nipper, it is shattered and the Cu segregation rate can be measured. There wasn't. As described above, it was confirmed that the strength was remarkably reduced when a 0.2 mol / L hydrochloric acid aqueous solution was used.
- Example 2 Instead of the complexing agent solution (citric acid monohydrate 0.2 mol / L aqueous solution) used in the stress relaxation step (8) in Example 1 above, 0.2 mol of gluconolactone (manufactured by Nacalai Tesque) Except that the laminated impedance element (sample) was immersed in this gluconolactone 0.2 mol / L aqueous solution for 3, 6, 12, 24 hours and subjected to stress relaxation treatment, using a / L aqueous solution. A laminated impedance element (sample) was produced in the same manner as in the case.
- the complexing agent solution citric acid monohydrate 0.2 mol / L aqueous solution
- a gluconolactone 0.2 mol / L aqueous solution is used as the complexing agent solution, but the concentration is not limited to this, and an appropriate concentration is considered in consideration of various conditions. Is possible. In addition to water solubility, it is also possible to use a solution dissolved in a solvent other than water.
- the immersion time in the complexing agent solution is 6 hours or more, and the target
- Example 2 the time required for stress relaxation is longer than that in Example 1, but this is the case when a gluconolactone 0.2 mol / L aqueous solution is used as the complexing agent solution. As shown in FIG. 1, it is considered that the elution of Cu is lower than that in the case of using a 0.2 mol / L aqueous solution of citric acid monohydrate.
- Example 2 In order to investigate the influence of the pore area ratio of the side gap portion on the stress relaxation effect, the firing temperature of (6) in Example 1 was changed in the range of 840 to 900 ° C., and the pore area ratio of the side gap portion was 26 to A 3% laminated impedance element (sample) was prepared, and stress relaxation treatment was performed using a 0.2 mol / L aqueous solution of citric acid monohydrate as a complexing agent solution. In other respects, the same method and conditions as in Example 1 were used.
- the pore area ratio of the side gap portion is in the range of 6 to 20%, and the Cu segregation ratio is also 5% or less (1.5 to 1. 8%), and it was confirmed that a target
- the pore area ratio is as high as 26%, the strength is extremely low, and when the sample is broken with a nipper, it is shattered and the Cu segregation rate is analyzed. I could not. Also,
- the pore area ratio of the side gap portion is low (3%), so that the complexing agent solution (citric acid monohydrate 0.2 mol / L aqueous solution) It was not possible to sufficiently penetrate into the interior and satisfactory stress relaxation could not be performed. Therefore,
- the laminated coil component of the present invention is used for forming a ferrite slurry and an internal conductor.
- These conductive pastes are prepared, and these can be manufactured by a so-called sequential printing method in which printing is performed so as to form a laminate having the configuration shown in each example.
- it is formed by, for example, transferring a ceramic layer formed by printing (coating) a ceramic slurry on a carrier film onto a table and printing (coating) an electrode paste on the carrier film. It is also possible to manufacture by a so-called sequential transfer method in which the electrode paste layer is transferred and this is repeated to form a laminated body having the configuration as shown in each example.
- the laminated coil component of the present invention can be manufactured by other methods, and the specific manufacturing method is not particularly limited.
- the laminated coil component is a laminated impedance element
- the present invention can be applied to various laminated coil components such as a laminated inductor and a laminated transformer.
- the present invention is not limited to the above-described examples in other respects as well.
- the type of complexing agent used in the complexing agent solution, the concentration of the complexing agent in the complexing agent solution, and the complexing agent are dissolved.
- Various applications and modifications can be made within the scope of the invention with respect to the type of solvent, the thickness of the internal conductor, the thickness of the ferrite layer, the dimensions of the product, the firing conditions of the laminate (ferrite element), and the like.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
すなわち、本発明の積層コイル部品は、
Cuを含むフェライトを主たる成分とするフェライト層を積層してなる積層体を焼成することにより形成され、コイル形成用のAgを主成分とする内部導体を層間接続させることにより形成された螺旋状コイルをその内部に有する積層コイル部品であって、
前記内部導体とその周囲のフェライトとの界面には空隙が存在せず、
前記内部導体と前記フェライトとの界面が解離し、
前記内部導体とその周囲のフェライトとの界面へのCuの偏析率が5%以下であること
を特徴としている。
内部導体とその周囲のフェライトとの界面へのCuの偏析率は3%以下であることがさらに望ましい。
なお、本発明で「Cuの偏析率」という場合の「Cu」は、金属銅(Cu)に限らず、酸化銅(CuO)も含む概念である。
すなわち、「Cuの偏析率」という場合の「Cu」は、偏析している物質がCuとCuOのいずれか一方である場合において、CuまたはCuOを意味し、CuとCuOの両方が析出している場合には、CuとCuOの両方を意味する概念である。
Cuを含むフェライトを主たる成分とする複数のフェライトグリーンシートと、前記フェライトグリーンシートを介して積層された、Agを主成分とするコイル形成用の複数の内部導体パターンとを備えた積層体を焼成して、螺旋状コイルを内部に備えたフェライト素子を形成する工程と、
前記フェライト素子の側面から、前記内部導体の側部と前記フェライト素子の側面との間の領域であるサイドギャップ部を経て、錯化剤溶液を前記内部導体とその周囲のフェライトとの界面に到達させることにより、前記内部導体とその周囲のフェライトとの界面を解離させる工程と
を備え、
前記錯化剤溶液として、アミノカルボン酸およびその塩、オキシカルボン酸およびその塩、アミン類、りん酸およびその塩、およびラクトン化合物からなる群より選ばれる少なくとも1種を含む溶液を用いること
を特徴としている。
前記アミノカルボン酸およびその塩が、グリシン、グルタミン酸、アスパラギン酸、およびそれらの塩からなる群より選ばれる少なくとも一種であり、
前記オキシカルボン酸およびその塩が、くえん酸、酒石酸、グルコン酸、グルコヘプトン酸、グリコール酸、およびそれらの塩からなる群より選ばれる少なくとも1種であり、
前記アミン類が、トリエタノールアミン、エチレンジアミン、およびエチレンジアミン四酢酸からなる群より選ばれる少なくとも1種であり、
りん酸およびその塩が、ピロりん酸およびその塩から選ばれる少なくとも1種であり、
ラクトン化合物が、グルコノラクトンおよびグルコヘプトノラクトンから選ばれる少なくとも1種であること
が望ましい。
なお、内部導体とフェライトとの界面へのCuの偏析率を3%以下とすることにより、さらに確実に内部導体とフェライトとの界面を解離させることが可能になり、本発明をより実効あらしめることができる。
また、サイドギャップ部のポア面積率を6~20%にすることは、通常の積層コイル部品の製造工程で用いられる、フェライトグリーンシートと内部導体形成用の導電性ペーストの組み合わせを考慮することにより効率よく実現することが可能である。
また、フェライト素子3の両端部には、螺旋状コイル4の両端部4a,4bと導通するように一対の外部電極5a,5bが配設されている。
また、図3に示されているように、フェライト素子3の、上側最外層の内部導体2aと下側最外層の内部導体2b間に位置する中央領域7の、内部導体2の側部2sと、フェライト素子3の側面3aとの間の領域であるサイドギャップ部8は、ポア面積率が6~20%(この実施例1の積層コイル部品では14%)のポーラスなフェライトから構成されている。
なお、この実施例の積層コイル部品10の寸法は、長さ寸法L=0.6mm、厚み寸法T=0.3mm、幅方向寸法W=0.3mmである。
(1)Fe2O3を48.0mol%、ZnOを29.5mol%、NiOを14.5mol%、CuOを8.0mol%の比率で秤量した磁性体原料を調製し、ボールミルにて48時間の湿式混合を行った。次に、湿式混合したスラリーをスプレードライヤーにより乾操し、700℃にて2時間仮焼した。それから、得られた仮焼粉を予備粉砕して、次の(2)の工程で使用するセラミック(フェライト)原料とした。
なお、上記導電性ペーストとしては、不純物元素が0.1重量%以下のAg粉末と、ワニスと、溶剤とを配合してなり、Ag含有率が85重量%の導電性ペーストを用いた。
この未焼成のフェライト素子23は、その内部に、各内部導体パターン(コイルパターン)22がビアホール24により接続されてなる積層型の螺旋状コイルを備えている。なお、コイルのターン数は19.5ターンとした。
なお、外部電極形成用の導電性ペーストとしては、平均粒径が0.8μmのAg粉末と耐めっき性に優れたB-Si-K系の平均粒径が1.5μmのガラスフリットとワニスと溶剤とを配合した導電性ペーストを用いた。そして、この導電性ペーストを焼き付けることにより形成された外部電極は、以下のめっき工程でめっき液によって侵食されにくい緻密なものであった。
なお、この実施例では、錯化剤溶液として、くえん酸一水和物の0.2mol/L水溶液を用いているが、その濃度はこれに限られるものではなく、種々の条件を考慮して適切な濃度とすることが可能である。また、水溶性に限らず、水以外の溶剤に溶解させた溶液を用いることも可能である。
上述のように、浸漬時間を3、6、12、24時間の条件で、錯化剤(または塩酸)溶液に浸漬する工程を経て作製した、実施例および比較例の積層インピーダンス素子(試料)について、内部導体と、その周囲のフェライトとの界面のCu偏析率を調べるとともに、インピーダンス(|Z|at100Mz)の値を調べた。そして、|Z|の値と、内部導体2と、その周囲のフェライト11との界面のCu偏析率の関係について検討した。さらに、各試料について、抗折強度を調べるとともに、サイドギャップ部のポア面積率を調べた。
1)チップをニッパで破断し、内部電極/フェライト界面を剥離させる。
2)次に、WDX(波長分散型X線分析マイクロアナライザー)により、フェライト表面のCuについてマッピング分析を行う。
装置名 : 日本電子 JXA8800R
分析条件 : 加速電圧 15kV
照射電流 :100nA
ピクセル数(画素数):256×256
ピクセルサイズ(1画素の大きさ):0.64μm
Dwell Time(1つの画素での取り込み時間):50ms
深さ方向の分析領域:約1~2μm
所定の測定点のカウント数が(測定点全体のカウント数の平均値+1σ)以上である時、その測定点をCu偏析とする。
そして、任意の測定エリアについて、Cu偏析数をその測定エリアの全測定点の数で割って100をかけた値をCu偏析率とする。
なお、図4のCuのマッピング像、および、表1のマッピング分析結果を用いて説明すると以下のようになる。
また、図4の領域(1)(内部導体接触部)では、測定点数が4225である場合に、Cu偏析数が72であることから、Cu偏析率は、(72/4225)×100=1.7%となる。
また、図4の領域(2)(コイルの内側の内部導体不接触部)では、測定点数が4225である場合に、Cu偏析数が367であることから、Cu偏析率は、(367/4225)×100=8.7%となる。
50個の試料について、インピーダンスアナライザ(ヒューレット・パッカード社製HP4291A)を用いてインピーダンスの測定を行い平均値(n=50pcs)を求めた。
50個の試料について、EIAJ-ET-7403に規定の試験方法にて測定を行い、ワイブルプロットした場合における破壊確率=1%のときの強度を抗折強度とした(n=50pcs)。
図3の内部導体2の側部2sと、フェライト素子3の側面3aとの間のサイドギャップ部8のポア面積率は、以下の方法で測定した。
積層インピーダンス素子(試料)の幅方向と厚み方向で規定される断面(以下、「W-T面」という)を鏡面研磨し、収束イオンビーム加工(FIB加工)した面を走査電子顕微鏡(SEM)により観察し、磁性体セラミック中のポア面積率を測定した。
FIB装置 :FEI製FIB200TEM
FE-SEM(走査電子顕微鏡) :日本電子製JSM-7500FA
WINROOF(画像処理ソフト):三谷商事株式会社製、Ver.5.6
図5に示すように、上述の方法で鏡面研磨した試料の研磨面に対し、入射角θ=5°でFIB加工を行った。
SEM観察は、以下の条件で行った。
加速電圧 :15kV
試料傾斜 :0゜
信号 :二次電子
コーティング :Pt
倍率 :5000倍
ポア面積率は、以下の方法で求めた。
a)計測範囲を決める。小さすぎると測定箇所による誤差が生じる。
(この実施例では、22.85μm×9.44μmとした)
b)磁性体セラミックとポアが識別しにくければ明るさ、コントラストを調節する。 c)2値化処理を行い、ポアのみを抽出する。画像処理ソフトWINROOFの「色抽出」では完全でない場合には手動で補う。
d)ポア以外を抽出した場合はポア以外を削除する。
e)画像処理ソフトの「総面積・個数計測」で総面積、個数、ポアの面積率、計測範囲の面積を測定する。
本発明におけるポア面積率は、上述のようにして測定した値である。
この結果から、Cu偏析率が5%以下になると、十分な応力緩和効果が得られることがわかる。
その結果を表3に示す。
この結果より、Cu偏析率が5%以下(より望ましくは3%以下)になると、十分な応力緩和効果が得られることがわかる。
その結果を表4に示す。
また、試料をニッパで破断した際に、内部電極とフェライトの界面で剥離せず、Cu偏析率を測定することはできなかった。
2 内部導体
2a 上側最外層の内部導体
2b 下側最外層の内部導体
2s 内部導体の側部
3 フェライト素子
3a フェライト素子の側面
4 螺旋状コイル
4a,4b 螺旋状コイルの両端部
5a,5b 外部電極
7 中央領域
8 サイドギャップ部
10 積層コイル部品(積層インピーダンス素子)
11 フェライト
21 中央領域用のフェライトグリーンシート
21a 外層領域用のフェライトグリーンシート
22 内部導体パターン(コイルパターン)
23 積層体(未焼成のフェライト素子)
24 ビアホール
Claims (5)
- Cuを含むフェライトを主たる成分とするフェライト層を積層してなる積層体を焼成することにより形成され、コイル形成用のAgを主成分とする内部導体を層間接続させることにより形成された螺旋状コイルをその内部に有する積層コイル部品であって、
前記内部導体とその周囲のフェライトとの界面には空隙が存在せず、
前記内部導体と前記フェライトとの界面が解離し、
前記内部導体とその周囲のフェライトとの界面へのCuの偏析率が5%以下であること
を特徴とする積層コイル部品。 - 前記フェライト素子の、前記内部導体の側部と、前記フェライト素子の側面との間の領域であるサイドギャップ部を構成するフェライトのポア面積率が6~20%の範囲にあることを特徴とする請求項1記載の積層コイル部品。
- Cuを含むフェライトを主たる成分とする複数のフェライトグリーンシートと、前記フェライトグリーンシートを介して積層された、Agを主成分とするコイル形成用の複数の内部導体パターンとを備えた積層体を焼成して、螺旋状コイルを内部に備えたフェライト素子を形成する工程と、
前記フェライト素子の側面から、前記内部導体の側部と前記フェライト素子の側面との間の領域であるサイドギャップ部を経て、錯化剤溶液を前記内部導体とその周囲のフェライトとの界面に到達させることにより、前記内部導体とその周囲のフェライトとの界面を解離させる工程と
を備え、
前記錯化剤溶液として、アミノカルボン酸およびその塩、オキシカルボン酸およびその塩、アミン類、りん酸およびその塩、およびラクトン化合物からなる群より選ばれる少なくとも1種を含む溶液を用いること
を特徴とする積層コイル部品の製造方法。 - 前記アミノカルボン酸およびその塩が、グリシン、グルタミン酸、アスパラギン酸、およびそれらの塩からなる群より選ばれる少なくとも一種であり、
前記オキシカルボン酸およびその塩が、くえん酸、酒石酸、グルコン酸、グルコヘプトン酸、グリコール酸、およびそれらの塩からなる群より選ばれる少なくとも1種であり、
前記アミン類が、トリエタノールアミン、エチレンジアミン、およびエチレンジアミン四酢酸からなる群より選ばれる少なくとも1種であり、
りん酸およびその塩が、ピロりん酸およびその塩から選ばれる少なくとも1種であり、
ラクトン化合物が、グルコノラクトンおよびグルコヘプトノラクトンから選ばれる少なくとも1種であること
を特徴とする請求項3記載の積層コイル部品の製造方法。 - 前記フェライト素子を形成する工程において、前記内部導体の側部と、前記フェライト素子の側面との間の領域であるサイドギャップ部を構成するフェライトのポア面積率が6~20%の範囲にあるフェライト素子を形成することを特徴とする請求項3または4記載の積層コイル部品の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080033668.6A CN102741949B (zh) | 2009-07-31 | 2010-05-24 | 层叠线圈器件 |
JP2011524698A JP5382123B2 (ja) | 2009-07-31 | 2010-05-24 | 積層コイル部品 |
KR1020137007875A KR101530453B1 (ko) | 2009-07-31 | 2010-05-24 | 적층 코일 부품 |
KR1020127001931A KR101271901B1 (ko) | 2009-07-31 | 2010-05-24 | 적층 코일 부품 |
US13/357,582 US8410886B2 (en) | 2009-07-31 | 2012-01-24 | Multilayer coil component |
US13/776,237 US9147525B2 (en) | 2009-07-31 | 2013-02-25 | Method of manufacturing multilayer coil component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009178516 | 2009-07-31 | ||
JP2009-178516 | 2009-07-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/357,582 Continuation US8410886B2 (en) | 2009-07-31 | 2012-01-24 | Multilayer coil component |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011013437A1 true WO2011013437A1 (ja) | 2011-02-03 |
Family
ID=43529102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/058738 WO2011013437A1 (ja) | 2009-07-31 | 2010-05-24 | 積層コイル部品 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8410886B2 (ja) |
JP (1) | JP5382123B2 (ja) |
KR (2) | KR101271901B1 (ja) |
CN (1) | CN102741949B (ja) |
TW (1) | TWI402867B (ja) |
WO (1) | WO2011013437A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118395A (ja) * | 2007-09-14 | 2013-06-13 | Murata Mfg Co Ltd | 積層コイル部品 |
JP2014179570A (ja) * | 2013-03-15 | 2014-09-25 | Taiyo Yuden Co Ltd | コモンモードチョークコイル |
JP2022055915A (ja) * | 2020-09-29 | 2022-04-08 | 株式会社村田製作所 | フェライト焼結体およびコイル部品 |
WO2022163140A1 (ja) * | 2021-02-01 | 2022-08-04 | 株式会社村田製作所 | 電子部品 |
WO2022163141A1 (ja) * | 2021-02-01 | 2022-08-04 | 株式会社村田製作所 | 電子部品 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437414A (zh) * | 2011-08-04 | 2012-05-02 | 瑞声声学科技(深圳)有限公司 | 射频识别天线的制作方法 |
CN102263327A (zh) * | 2011-08-04 | 2011-11-30 | 瑞声声学科技(深圳)有限公司 | 射频识别天线的制作方法 |
KR101396656B1 (ko) * | 2012-09-21 | 2014-05-16 | 삼성전기주식회사 | 적층형 파워 인덕터 및 이의 제조방법 |
JP6507027B2 (ja) * | 2015-05-19 | 2019-04-24 | 新光電気工業株式会社 | インダクタ及びその製造方法 |
JP6558329B2 (ja) * | 2016-09-01 | 2019-08-14 | 株式会社村田製作所 | 電子部品 |
KR102609134B1 (ko) | 2018-05-14 | 2023-12-05 | 삼성전기주식회사 | 인덕터 및 이를 구비하는 인덕터 모듈 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883715A (ja) * | 1994-09-09 | 1996-03-26 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2001052930A (ja) * | 1999-08-06 | 2001-02-23 | Tdk Corp | 積層インダクタとその製造方法 |
WO2007049456A1 (ja) * | 2005-10-28 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
JP2007242715A (ja) * | 2006-03-06 | 2007-09-20 | Tdk Corp | セラミック電子部品の製造方法 |
WO2009034824A1 (ja) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4918421A (en) * | 1986-03-20 | 1990-04-17 | Lawless William N | Nonlinear resistor for low temperature operation |
JP2871845B2 (ja) | 1990-11-26 | 1999-03-17 | 太陽誘電株式会社 | 積層チップインダクタの製造方法 |
JP3635412B2 (ja) | 1993-05-24 | 2005-04-06 | Tdk株式会社 | 磁性フェライトの製造方法 |
GB2348205B (en) * | 1999-03-25 | 2001-06-27 | Murata Manufacturing Co | Paste composition green sheet and multilayer substrate |
JP2002100508A (ja) | 2000-09-21 | 2002-04-05 | Tdk Corp | 耐電圧部品および積層型フェライト部品 |
JP2004022798A (ja) | 2002-06-17 | 2004-01-22 | Nec Tokin Corp | 積層型インピーダンス素子、及びその製造方法 |
US6855222B2 (en) * | 2002-06-19 | 2005-02-15 | Murata Manufacturing Co., Ltd. | Method for manufacturing laminated multilayer electronic components |
JP4640377B2 (ja) * | 2007-05-30 | 2011-03-02 | Tdk株式会社 | 積層インダクタ部品 |
WO2010035559A1 (ja) * | 2008-09-24 | 2010-04-01 | 株式会社村田製作所 | 積層コイル部品 |
-
2010
- 2010-05-21 TW TW099116270A patent/TWI402867B/zh active
- 2010-05-24 KR KR1020127001931A patent/KR101271901B1/ko active IP Right Grant
- 2010-05-24 WO PCT/JP2010/058738 patent/WO2011013437A1/ja active Application Filing
- 2010-05-24 JP JP2011524698A patent/JP5382123B2/ja active Active
- 2010-05-24 KR KR1020137007875A patent/KR101530453B1/ko active IP Right Grant
- 2010-05-24 CN CN201080033668.6A patent/CN102741949B/zh active Active
-
2012
- 2012-01-24 US US13/357,582 patent/US8410886B2/en active Active
-
2013
- 2013-02-25 US US13/776,237 patent/US9147525B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883715A (ja) * | 1994-09-09 | 1996-03-26 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2001052930A (ja) * | 1999-08-06 | 2001-02-23 | Tdk Corp | 積層インダクタとその製造方法 |
WO2007049456A1 (ja) * | 2005-10-28 | 2007-05-03 | Murata Manufacturing Co., Ltd. | 積層型電子部品およびその製造方法 |
JP2007242715A (ja) * | 2006-03-06 | 2007-09-20 | Tdk Corp | セラミック電子部品の製造方法 |
WO2009034824A1 (ja) * | 2007-09-14 | 2009-03-19 | Murata Manufacturing Co., Ltd. | 積層コイル部品およびその製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013118395A (ja) * | 2007-09-14 | 2013-06-13 | Murata Mfg Co Ltd | 積層コイル部品 |
JP2013118394A (ja) * | 2007-09-14 | 2013-06-13 | Murata Mfg Co Ltd | 積層コイル部品 |
JP2013118396A (ja) * | 2007-09-14 | 2013-06-13 | Murata Mfg Co Ltd | 積層コイル部品 |
JP2014179570A (ja) * | 2013-03-15 | 2014-09-25 | Taiyo Yuden Co Ltd | コモンモードチョークコイル |
JP2022055915A (ja) * | 2020-09-29 | 2022-04-08 | 株式会社村田製作所 | フェライト焼結体およびコイル部品 |
WO2022163140A1 (ja) * | 2021-02-01 | 2022-08-04 | 株式会社村田製作所 | 電子部品 |
WO2022163141A1 (ja) * | 2021-02-01 | 2022-08-04 | 株式会社村田製作所 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20130042651A (ko) | 2013-04-26 |
US20120119867A1 (en) | 2012-05-17 |
CN102741949A (zh) | 2012-10-17 |
US9147525B2 (en) | 2015-09-29 |
KR101530453B1 (ko) | 2015-06-22 |
US20130168350A1 (en) | 2013-07-04 |
JPWO2011013437A1 (ja) | 2013-01-07 |
KR20120033339A (ko) | 2012-04-06 |
TW201108268A (en) | 2011-03-01 |
JP5382123B2 (ja) | 2014-01-08 |
US8410886B2 (en) | 2013-04-02 |
CN102741949B (zh) | 2014-08-06 |
TWI402867B (zh) | 2013-07-21 |
KR101271901B1 (ko) | 2013-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5382123B2 (ja) | 積層コイル部品 | |
JP5195758B2 (ja) | 積層コイル部品およびその製造方法 | |
US10256029B2 (en) | Electronic component and method for manufacturing the same | |
JP5195904B2 (ja) | 積層コイル部品 | |
JP5229317B2 (ja) | 積層コイル部品およびその製造方法 | |
JP2010040860A (ja) | 積層コイル部品およびその製造方法 | |
JP5229323B2 (ja) | 積層コイル部品およびその製造方法 | |
JP7444146B2 (ja) | コイル部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080033668.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10804185 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011524698 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20127001931 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10804185 Country of ref document: EP Kind code of ref document: A1 |