WO2010150824A1 - 光半導体装置用リードフレーム、光半導体装置用リードフレームの製造方法、および光半導体装置 - Google Patents
光半導体装置用リードフレーム、光半導体装置用リードフレームの製造方法、および光半導体装置 Download PDFInfo
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- WO2010150824A1 WO2010150824A1 PCT/JP2010/060671 JP2010060671W WO2010150824A1 WO 2010150824 A1 WO2010150824 A1 WO 2010150824A1 JP 2010060671 W JP2010060671 W JP 2010060671W WO 2010150824 A1 WO2010150824 A1 WO 2010150824A1
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- Prior art keywords
- silver
- optical semiconductor
- lead frame
- alloy
- semiconductor device
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Definitions
- the present invention relates to an optical semiconductor device lead frame, a manufacturing method thereof, and an optical semiconductor device.
- Lead frames for optical semiconductor devices are widely used as constituent members of various display / illumination light sources that use light emitting elements, which are optical semiconductor elements such as LED (Light Emitting Diode) elements, as light sources.
- a lead frame is arranged on a substrate, and after the light emitting element is mounted on the lead frame, the deterioration of the light emitting element and its peripheral parts due to external factors such as heat, moisture, and oxidation are prevented.
- the light emitting element and its periphery are sealed with resin.
- the reflective material of the lead frame is required to have a high reflectance (for example, a reflectance of 80% or more) in the entire visible light wavelength range (400 to 700 nm).
- LED elements have also been used as light sources for measuring / analyzing instruments using ultraviolet rays, and the reflective material has been required to have a high reflectance in the near ultraviolet region (wavelength 340 to 400 nm). . Therefore, in an optical semiconductor device used as a light source for illumination or as a light source for the measuring / analyzing instrument, the reflection characteristic of the reflecting material is an extremely important factor that affects the product performance.
- a technique for realizing an LED that emits white light a technique in which three chips emitting all colors of red (R), green (G), and blue (B) are arranged, a yellow phosphor on a blue LED chip, and so on.
- R red
- G green
- B blue
- a layer (film) made of silver or a silver alloy is formed on the lead frame on which the LED element is mounted, particularly for the purpose of improving the light reflectance in the visible light region (hereinafter referred to as reflectance). ) Is often formed.
- the silver film has a high reflectance in the visible light region.
- a silver plating layer is formed on the reflective surface (Patent Document 1), or 200 or after the silver or silver alloy film is formed. It is known that a heat treatment is performed at a temperature of not lower than 30 ° C. for 30 seconds or more, and the crystal grain size of the film is 0.5 ⁇ m to 30 ⁇ m (Patent Document 2).
- the maximum height Ry defined in Japanese Industrial Standard (JIS B 0601) is 0.5 ⁇ m or more as the surface roughness of the base. If the surface roughness (maximum height) Ry is 0.5 ⁇ m or more, the roughness of the surface of the silver or silver alloy coated on the underlying surface (maximum) The height) also tends to be 0.5 ⁇ m or more. In that case, in order to completely cover the unevenness by plating, it is necessary to take measures such as increasing the thickness of the coating, resulting in a decrease in mass productivity and an increase in cost. In addition, the roughness of the reflective layer greatly affects regular reflection and diffuse reflection in light reflection. On the other hand, what is important for the optical characteristics of the lead frame for optical semiconductors is that the surface roughness of the reflective layer makes it impossible to define the optical characteristics of the reflective layer simply by defining the roughness of the underlying layer.
- the present invention has a good reflectivity in the near ultraviolet region (wavelength 340 to 400 nm) and an appropriate adjustment of the diffuse reflectance in an optical semiconductor device lead frame used for an LED, photocoupler, photointerrupter, etc. Accordingly, it is an object of the present invention to provide a lead frame for an optical semiconductor device and a method for manufacturing the same that can realize good light directivity for a light source particularly in illumination applications and measurement / analysis applications including the near ultraviolet region.
- the inventors of the present invention are an optical semiconductor device lead frame in which a reflective layer made of silver or a silver alloy is formed on the outermost surface of a conductive substrate, and the reflective layer
- the intensity ratio of the (200) plane is 20% or more of the total count
- the surface roughness of the reflection layer is set to 0.05 to 0.30 ⁇ m in arithmetic average height Ra, so that the balance of directivity characteristics particularly in lighting applications is good.
- the inventors have found that a lead frame can be obtained.
- An optical semiconductor device lead frame in which a reflective layer made of silver or a silver alloy is formed on the outermost surface on a conductive substrate, wherein the reflective layer has a thickness of 0.2 to 5.0 ⁇ m,
- the lead frame for an optical semiconductor device is characterized in that when the silver or silver alloy of the reflective layer is measured by an X-ray diffraction method, the intensity ratio of the (200) plane is 20% or more of the total count number.
- the silver or silver alloy forming the reflective layer is silver, silver-tin alloy, silver-indium alloy, silver-rhodium alloy, silver-ruthenium alloy, silver-gold alloy, silver-palladium alloy, silver-nickel
- At least one or more intermediate layers made of a metal or alloy selected from the group consisting of nickel, nickel alloy, cobalt, cobalt alloy, copper and copper alloy are provided between the conductive substrate and the reflective layer.
- An optical semiconductor device comprising the optical semiconductor device lead frame according to any one of (1) to (7) and an optical semiconductor element, wherein at least the optical semiconductor element is mounted.
- the reflective layer made of silver or a silver alloy is formed with a thickness of 0.2 to 5.0 ⁇ m, and the reflective layer is measured by the X-ray diffraction method.
- the intensity ratio of the (200) plane is set to 20% or more of the total count, so that the reflectance in the near ultraviolet region of 340 to 400 nm is improved. Good reflectivity is obtained in the LED.
- the surface roughness Ra of the reflective layer is preferably 0.05 to 0.30 ⁇ m, a lead frame having a good balance of directivity characteristics particularly in illumination applications can be obtained.
- the lead frame for an optical semiconductor device has excellent reflection characteristics over a wide range from near ultraviolet light to visible light, and excellent directivity characteristics in illumination and measurement / analysis applications including the near ultraviolet range. Can be provided.
- FIG. 1 is a schematic cross-sectional view of a first embodiment of a lead frame for an optical semiconductor device according to the present invention.
- FIG. 2 is a schematic sectional view of a second embodiment of the lead frame for an optical semiconductor device according to the present invention.
- FIG. 3 is a schematic sectional view of a third embodiment of the lead frame for an optical semiconductor device according to the present invention.
- FIG. 4 is a schematic cross-sectional view of a fourth embodiment of the lead frame for optical semiconductor devices according to the present invention.
- FIG. 5 is a schematic sectional view of a fifth embodiment of a lead frame for an optical semiconductor device according to the present invention.
- FIG. 6 is a schematic sectional view of a sixth embodiment of a lead frame for an optical semiconductor device according to the present invention.
- FIG. 7 is a schematic cross-sectional view for explaining the arithmetic average height Ra in each of the embodiments of the lead frame for an optical semiconductor device according to the present invention.
- the lead frame of the present invention has a reflective layer made of silver or a silver alloy on the outermost surface on a conductive substrate, the reflective layer has a thickness of 0.2 to 5.0 ⁇ m, and the reflective layer
- the silver or silver alloy of the layer was measured by the X-ray diffraction method based on “Japanese X-ray diffraction analysis general rules” of JIS K 0131, the intensity ratio of the (200) plane was 20 % Or more.
- the reflectance in the near-ultraviolet region (wavelength 340 to 400 nm) can be sufficiently improved, particularly in an LED mounted on an optical semiconductor chip whose emission wavelength includes a near-ultraviolet wavelength. Reflectance is obtained.
- the orientation of the (200) plane is less than 20%, the orientation of the (111) plane is preferentially strengthened. As a result, the reflectance at a wavelength of 340 to 400 nm is less than 60% and the characteristics are deteriorated.
- the total count means the total count when measured by the thin film method in the X-ray diffraction method.
- ⁇ (200) surface count ⁇ / (total count) ⁇ 100 (%) This is the value calculated in.
- the upper limit of the (200) plane orientation is not particularly limited, for example, when formed by electroplating, the maximum value is about 40%.
- the thickness of the reflective layer made of silver or a silver alloy is 0.2 ⁇ m or more. This thickness is the minimum necessary to adjust the intensity ratio of the (200) surface without being affected by the above, and this ensures a highly reliable and stable reflectance and ensures long-term reliability. Can do.
- the thickness of the reflective layer is 5.0 ⁇ m or less, the cost can be reduced without using a precious metal more than necessary, and an environmentally friendly lead frame can be provided. The effect of long-term reliability is due to saturation when the thickness of the reflective layer exceeds 5.0 ⁇ m.
- the arithmetic average height Ra specified in Japanese Industrial Standard is controlled to 0.05 to 0.30 ⁇ m, so that it can be used for illumination and measurement. -Good directional characteristics can be achieved for use as an analytical application, and a wide area can be illuminated uniformly and brightly.
- Ra the ratio of the diffuse reflectance to the total reflectance can be controlled, and in particular, the directivity balance in lighting applications can be made favorable. If Ra is too small, the specular reflection component becomes too strong and it becomes difficult to uniformly illuminate the whole when mounted on the LED. Conversely, if Ra is too large, the diffuse reflection component is strong and the amount of light that can be extracted decreases.
- the ratio of the diffuse reflectance to the total reflectance is adjusted to 45 to 85% at a wavelength of 340 to 400 nm, and good directivity characteristics can be obtained for lighting applications.
- the lead frame for an optical semiconductor device of the present invention has a good reflectance characteristic and is easy to form a film by making the base body copper or copper alloy, iron or iron alloy, aluminum or aluminum alloy, Lead frames that can contribute to cost reduction can be provided.
- the lead frame based on these metals has excellent heat dissipation characteristics, and heat energy generated when the light emitter emits light can be smoothly discharged to the outside through the lead frame. Long life and long-term stabilization of reflectance characteristics are expected. This depends on the conductivity of the substrate IACS (International Annealed Copper Standard), and the higher the conductivity, the better the heat dissipation. For this reason, the conductivity is preferably at least 10% or more, more preferably 50% or more. The upper limit of the conductivity is not particularly limited as long as it is a value usually obtained.
- the silver or silver alloy forming the reflective layer in the lead frame for optical semiconductor devices of the present invention is silver, silver-tin alloy, silver-indium alloy, silver-rhodium alloy, silver-ruthenium alloy, silver-gold alloy, By using a material selected from the group consisting of silver-palladium alloy, silver-nickel alloy, silver-selenium alloy, silver-antimony alloy, silver-platinum alloy, a lead frame with good reflectivity and good productivity can be obtained. .
- the lead frame for an optical semiconductor device of the present invention is selected from the group consisting of nickel, nickel alloy, cobalt, cobalt alloy, copper, and copper alloy between the conductive substrate and the reflective layer made of silver or silver alloy. Since at least one intermediate layer made of a metal or an alloy is formed, the material constituting the conductive substrate diffuses into the reflective layer due to the heat generated when the light emitting element emits light, and the reflectance characteristics deteriorate. Thus, the reflectance characteristics are stable over a long period of time, and the adhesion between the substrate and the reflective layer made of silver or a silver alloy is improved.
- the thickness of the intermediate layer is determined in consideration of pressability, cost, productivity, heat resistance, and the like.
- the total thickness of the intermediate layer is preferably 0.2 to 2.0 ⁇ m, more preferably 0.5 to 2.0 ⁇ m.
- the intermediate layer may be formed of a plurality of layers, it is usually preferable to have two or less layers in consideration of productivity.
- each layer is formed from the same material as each other if the respective layers are formed from the metal or alloy (interlayer constituent material) and the total layer thickness is within the above range. May be formed from different materials, and their thicknesses may be the same or different.
- the lead frame for optical semiconductor devices of the present invention is preferably formed by electroplating.
- electroplating As other forming methods, there are a clad method and a sputtering method. However, in these methods, it is difficult to control the thickness and the cost becomes high.
- An electroplating method is excellent as a manufacturing method for appropriately controlling the thickness on the order of micrometers.
- the plating current density is set to 0.005 to 1.0 A / dm 2 . It is preferable. This is because the (200) plane orientation of the reflective layer can be easily adjusted to 20% or more of the total count number by producing the current density in the range of 1.0 A / dm 2 or less, and the surface roughness is also appropriate. This is because it can be adjusted within a wide range.
- the current density is preferably 0.05 to 1.0 A / dm 2 , more preferably 0.05 to 0.5 A / dm 2 .
- the current density has a depth of at least 0.2 ⁇ m or more from the outermost surface of the reflective layer. By forming the portion, the desired orientation can be obtained and the reflectance can be improved. Forming a thickness of 0.2 ⁇ m or more from the outermost surface at the current density is the minimum necessary thickness to adjust the strength ratio of the (200) plane without being affected by the orientation of the lower layer. Because there is.
- the thickness formed at the current density from the outermost surface is too thin, it will be affected by the orientation of the lower layer of the intermediate layer or the reflective layer formed in the lower layer, so the reflectivity in the near ultraviolet region (340 to 400 nm) is The possibility of being below 60% increases.
- the optical semiconductor device of the present invention can obtain good reflectance characteristics effectively at low cost by using the lead frame of the present invention at least at a place where the optical semiconductor element is mounted. This is because the reflectance characteristics are sufficiently effective by forming a reflective layer made of silver or a silver alloy only on the mounting portion of the optical semiconductor element.
- the reflective layer made of silver or a silver alloy may be formed partially, for example, by partial plating such as stripe plating or spot plating. Manufacturing a lead frame in which the reflective layer is partially formed can reduce the amount of metal used in the portion where the reflective layer is not formed, so that the optical semiconductor device has a low environmental impact and is low in cost. it can.
- FIG. 1 is a schematic cross-sectional view of a first embodiment of a lead frame for an optical semiconductor device according to the present invention.
- a reflective layer 2 made of silver or a silver alloy is formed on a conductive substrate 1, and an optical semiconductor element 3 is mounted on a part of the surface of the reflective layer 2.
- the intensity ratio of the (200) plane measured by the X-ray diffraction method of the reflective layer 2 is 20% or more of the total count, and the near ultraviolet to visible light region.
- the surface roughness of the reflective layer 2 is an arithmetic average height Ra of 0.05 to 0.30 ⁇ m, and the lead frame for an optical semiconductor having an excellent balance of light directivity is obtained.
- FIG. 2 is a schematic sectional view of a second embodiment of the lead frame for an optical semiconductor device according to the present invention.
- the lead frame of the embodiment shown in FIG. 2 is different from the lead frame shown in FIG. 1 in that an intermediate layer 4 is formed between the conductive substrate 1 and the reflective layer 2.
- Other points are the same as those of the lead frame shown in FIG.
- FIG. 3 is a schematic sectional view of a third embodiment of the lead frame for an optical semiconductor device according to the present invention.
- the reflective layer 2 is formed only in a portion where the optical semiconductor element 3 is mounted and in the vicinity thereof. The area other than this area does not contribute to the reflection of light, and is a part covered with, for example, a mold resin.
- the reflective layer 2 it is also possible to form the reflective layer 2 made of silver or a silver alloy only in a portion that contributes to light reflection.
- the intermediate layer 4 is formed on the entire surface of the conductive substrate 1, but may be partially formed as long as it is interposed between the conductive substrate 1 and the reflective layer 2. .
- FIG. 4 is a schematic cross-sectional view of a fourth embodiment of the lead frame for optical semiconductor devices according to the present invention.
- the reflective layer 2 is formed only in and near the portion where the optical semiconductor element 3 is mounted, as in the case of FIG. 3, but the reflective layer 2 includes the lower layer 2-1 and the upper layer. It has a two-layer structure (surface layer) 2-2.
- the upper layer 2-2 of the reflective layer is a layer formed with an intensity ratio of the (200) plane of 20% or more of the total count number, and its thickness is at least 0.2 ⁇ m or more.
- the first layer (lower layer) 2-1 of the reflective layer is formed with a relatively high current density, for example, 1.5 A / dm 2 , and thereafter
- Plating current density can be 0.005 to 1.0 A / dm 2 .
- the manufacturing time is less than when the thickness of all the reflective layers is 0.005 to 1.0 A / dm 2 . This is effective because it can be shortened.
- FIG. 5 is a schematic sectional view of a fifth embodiment of the lead frame for optical semiconductor devices according to the present invention.
- a concave portion is provided in the conductive substrate 1, and the optical semiconductor element 3 is mounted inside the concave portion.
- the lead frame for an optical semiconductor device of the present invention can be applied to a lead frame shape in which a concavity is provided to improve the light collecting property.
- FIG. 6 is a schematic sectional view of a sixth embodiment of the lead frame for optical semiconductor devices according to the present invention.
- a concave portion is provided in the conductive substrate 1, and the optical semiconductor element 3 is mounted inside the concave portion, and the reflective layer 2 is formed only in the concave portion.
- the reflective layer 2 can be provided only in a portion that contributes to reflection of light emitted from the optical semiconductor element.
- FIG. 7 is a schematic cross-sectional view for explaining the arithmetic average height Ra in the embodiment of the lead frame for an optical semiconductor device according to the present invention.
- FIG. 7 shows a state in which the arithmetic average height Ra of the reflective layer 2 is 0.05 to 0.30 ⁇ m in the lead frame on which the conductive substrate 1, the intermediate layer 4, and the reflective layer 2 are formed. Yes.
- Ra the ratio of the diffuse reflectance with respect to the total reflectance by controlling Ra, the above-described excellent effect can be obtained, and the directivity balance particularly in illumination applications becomes good.
- the Ra value can be controlled appropriately.
- the optimum concentration and current density differ depending on the type of additive used in the plating solution.
- the surface roughness can be increased by lowering the additive concentration or increasing the current density.
- a reflective layer can be obtained.
- a reflective layer having a smaller Ra value as the surface roughness can be obtained by increasing the concentration of the additive or decreasing the current density.
- the reflective layer 2 (single layer or each of a plurality of layers) made of silver or a silver alloy and the intermediate layer 4 are each electroplated. It is preferable to form by a method.
- Example 1 As Example 1, the conductive substrate shown in Table 1 having a thickness of 0.3 mm and a width of 50 mm was subjected to the following pretreatment and then subjected to the following electroplating treatment, whereby the invention shown in Table 1 was formed. Lead frames of Examples 1 to 25, Reference Example 1, Conventional Example 1, and Comparative Example 1 were prepared. Before forming the reflective layer, silver strike plating was performed to a thickness of 0.01 ⁇ m.
- C19400 Cu—Fe alloy material: Cu-2.3Fe—0.03P—0.15Zn
- C52100 phosphor bronze: Cu-8Sn—P
- C26000 brass: Cu-30Zn
- C72500 Cu—Ni—Sn alloy material: Cu-9Ni-2.4Sn
- CDA Indicates the type according to the Copper Development Association
- the unit of the numerical value before each element is mass%.
- “A1100”, “A2014”, “A3003”, and “A5052” represent aluminum or aluminum alloy bases, and their components are defined in Japanese Industrial Standards (JIS H 4000: 2006, etc.), respectively.
- “SPCC” and “SUS304” represent an iron-based substrate, and “SUS304” is a stainless steel defined by Japanese Industrial Standard (JIS G 4305: 2005) (containing 18 mass% of chromium and 8 mass% of nickel, “SPCC” represents a cold-rolled steel sheet stipulated by Japanese Industrial Standard (JIS G 3141: 2009).
- Example 1 The plating solution composition and plating conditions for each plating used in Example 1 are shown below.
- the current density was adjusted appropriately from 0.008 to 1.0 A / dm 2 to adjust the orientation.
- the current density was set to 1.5 A / dm 2 which is a regular plating condition.
- Example Plating solution KCN 100 g / liter, NaOH 50 g / liter, AgCN 10 g / liter, K 2 Sn (OH) 6 80 g / liter Plating condition: current density 1A / Dm 2 , temperature 40 ° C
- Example Plating solution KAg (CN) 2 20 g / liter, PdCl 2 25 g / liter, K 4 O 7 P 2 60 g / liter, KSCN 150 g / liter plating condition : Current density 0.25 A / dm 2 , temperature 40 ° C
- the reflection layers of the samples obtained in this example are all one layer, and the surface roughness was measured using a contact surface roughness meter (SE-30H: product name, manufactured by Kosaka Laboratory Ltd.). Then, when the average value of three arbitrary positions was measured at a measurement distance of 4 mm, Ra was 0.13 to 0.15 ⁇ m in all samples.
- the optical semiconductor device does not require heat dissipation in the optical semiconductor lead frame, the reflectance is excellent. It can be easily assumed that it can be suitably used.
- the inventive examples maintain a reflectance of 70% or more and a diffuse reflectance of 45 to 85% in all the inventive examples not only in the near ultraviolet region but also in the visible light region, and are excellent in high luminance and directivity. Can be suitably used for an optical semiconductor lead frame having an excellent balance.
- Example 2 As Example 2, after the same pretreatment as in Example 1 and a nickel undercoat of 0.5 ⁇ m and a silver strike plating of 0.01 ⁇ m were formed on a conductive substrate made of a C19400 copper alloy having a thickness of 0.3 mm and a width of 50 mm, Furthermore, 2.0 ⁇ m of electrosilver plating was formed as a reflective layer, and lead frames of Invention Examples 26 to 32 and Reference Examples 2 and 3 were prepared. In order to adjust the surface roughness of the reflective layer, the concentration of the plating solution additive was changed, or the current density during plating was appropriately adjusted. In the lead frames of Reference Examples 2 and 3, a reflective layer having a value outside the predetermined surface roughness value defined in the present invention was formed.
- a reflective layer having a small Ra value as the surface roughness was obtained by setting the concentration of the following sodium thiosulfate as an additive to 5 g / liter and the current density to 0.1 A / dm 2 .
- a reflective layer having a large Ra value as the surface roughness was obtained by setting the following sodium thiosulfate concentration as the additive to 0.1 g / liter and the current density to 1 A / dm 2 . .
- the plating solution composition of electrosilver plating is as follows. [Ag plating] Plating solution: AgCN 50 g / liter, KCN 100 g / liter, K 2 CO 3 30 g / liter, additive (sodium thiosulfate 0 to 10 g / liter) Plating conditions: current density 0.01 to 1.0 A / dm 2 , temperature 30 ° C.
- the LED lead frame used for illumination can be provided with an optical semiconductor lead frame that is excellent in reflectivity in the near ultraviolet region and has a good directivity balance.
- the inventive examples maintain a reflectance of 70% or more and a diffuse reflectance of 45 to 85% in all the inventive examples not only in the near ultraviolet region but also in the visible light region, and are excellent in high luminance and directivity. Can be suitably used for an optical semiconductor lead frame having an excellent balance.
- Example 3 As Example 3, pretreatment, nickel base plating, and silver strike plating were formed on a conductive substrate made of a C19400 copper alloy having a thickness of 0.3 mm and a width of 50 mm in the same thickness as that of Invention Example 13 of Example 1. Then, after forming a first layer of silver electroplating as a reflective layer at 1.84 ⁇ m and 1.5 A / dm 2 , a second layer of silver electroplating is formed at 0.21 ⁇ m and 0.49 A / dm 2. A lead frame of Invention Example 33 having a total thickness of two reflective layers of 2.05 ⁇ m was produced.
- the second layer is formed at 0.18 ⁇ m and 0.49 A / dm 2 , and the total thickness of the two reflective layers
- the lead frame of Comparative Example 2 having a thickness of 2.02 ⁇ m was produced.
- the plating time when the second layer of the reflective layer was formed was shorter than that of Invention Example 33.
- the plating when forming the second layer (surface layer) of the reflective layer in Invention Example 33 was performed.
- the time 0.7 minutes was changed to 0.6 minutes in Comparative Example 2.
- the surface roughness Ra of the reflective layer in these lead frame samples was measured in the same manner as described above, both were Ra ⁇ 0.15 ⁇ m.
- the (200) plane intensity ratio, total reflectance, heat dissipation, and productivity were evaluated by the same method as in Example 1. The results are shown in Table 4.
- a surface layer of at least 0.2 ⁇ m from the surface is within the range of 0.005 to 1.0 A / dm 2.
- the strength ratio of the (200) plane is increased to 20% or more while being influenced by the first layer of the reflective layer formed at a lower current density of 1.5 A / dm 2.
- the total reflectance can be maintained at 60% or more in the near ultraviolet region of 340 to 400 nm.
- time is shortened about 60% compared with the invention example 13, and it turns out that it is effective as a method excellent in productivity.
- Comparative Example 2 where the second layer of the reflective layer is less than 0.2 ⁇ m, the (200) plane intensity ratio is less than 20%, and the reflectance is inferior to 60% or less at 340 nm.
- the orientation of the lower layer of the two reflective layers is changed.
- a method of manufacturing a lead frame for an optical semiconductor that can effectively increase the orientation strength ratio of the (200) plane as a whole reflecting layer based on the surface layer without being affected, and has excellent reflectivity and improved productivity. It turns out that it is useful.
- inventive examples maintain a reflectance of 70% or more and a diffuse reflectance of 45 to 85% in all the inventive examples not only in the near ultraviolet region but also in the visible light region, and are excellent in high luminance and directivity. Can be suitably used for an optical semiconductor lead frame having an excellent balance.
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Abstract
Description
(1)導電性基体上の最表面に銀または銀合金からなる反射層が形成された光半導体装置用リードフレームであって、前記反射層の厚さが0.2~5.0μmであり、かつ、前記反射層の銀または銀合金をX線回折法で測定した際に、(200)面の強度比が総カウント数の20%以上であることを特徴とする、光半導体装置用リードフレーム。
(2)さらに前記反射層の表面粗度が、算術平均高さRaで0.05~0.30μmであることを特徴とする、(1)記載の光半導体装置用リードフレーム。
(3)前記導電性基体は、銅、銅合金、鉄、鉄合金、アルミニウムまたはアルミニウム合金からなることを特徴とする、(1)または(2)記載の光半導体装置用リードフレーム。
(4)前記導電性基体の導電率がIACS(International Annealed Copper Standard)で10%以上であることを特徴とする、(3)記載の光半導体装置用リードフレーム。
(5)前記反射層を形成する銀または銀合金は、銀、銀-錫合金、銀-インジウム合金、銀-ロジウム合金、銀-ルテニウム合金、銀-金合金、銀-パラジウム合金、銀-ニッケル合金、銀-セレン合金、銀-アンチモン合金、および銀-白金合金からなる群から選ばれた材料からなることを特徴とする、(1)~(4)のいずれか1項に記載の光半導体装置用リードフレーム。
(6)前記導電性基体と前記反射層との間に、ニッケル、ニッケル合金、コバルト、コバルト合金、銅および銅合金からなる群から選ばれた金属または合金からなる中間層が、少なくとも1層以上形成されていることを特徴とする、(1)~(5)のいずれか1項に記載の光半導体装置用リードフレーム。
(7)前記中間層の厚さは、総厚で0.2~2.0μmであることを特徴とする、(6)記載の光半導体用リードフレーム。
(8)前記(1)~(7)のいずれか1項に記載の半導体装置用リードフレームを製造する方法であって、少なくとも前記反射層を電気めっき法で形成することを特徴とする、光半導体装置用リードフレームの製造方法。
(9)前記反射層を、前記電気めっき法で形成する際の電流密度が0.005~1A/dm2であることを特徴とする、(8)記載の光半導体用リードフレームの製造方法。
(10)前記(1)~(7)のいずれか1項に記載の光半導体装置用リードフレームと、光半導体素子とを備えた光半導体装置であって、少なくとも前記光半導体素子が搭載される箇所に前記反射層が設けられていることを特徴とする光半導体装置。
本発明の上記及び他の特徴及び利点は、適宜添付の図面を参照して、下記の記載からより明らかになるであろう。
{(200)面のカウント数}/(全カウント数)×100 (%)
で算出した値となる。なお、(200)面の配向の上限は特に制限されるものではないが、例えば電気めっき法で形成した場合は、最大値がおよそ40%となる。
本実施形態において、中間層4は導電性基体1の全面に形成されているが、導電性基体1と反射層2との間に介在する形態であれば、部分的に形成されていてもよい。
実施例1として、厚さ0.3mm、幅50mmの表1に示す導電性基体に以下に示す前処理を行った後、以下に示す電気めっき処理を施すことにより、表1に示す構成の発明例1~25、参考例1、従来例1、および比較例1のリードフレームを作成した。なお、反射層を形成する前に、銀ストライクめっきを厚さ0.01μm施した。
導電性基体として用いられた材料のうち、「C19400(Cu-Fe系合金材料:Cu-2.3Fe-0.03P-0.15Zn)」、「C52100(リン青銅:Cu-8Sn-P)」、「C26000(黄銅:Cu-30Zn)」、および「C72500(Cu-Ni-Sn系合金材料:Cu-9Ni-2.4Sn)」は銅合金の基体を表し、Cの後の数値はCDA(Copper Development Association)規格による種類を示す。なお、各元素の前の数値の単位は質量%である。
また、「A1100」、「A2014」、「A3003」、および「A5052」はアルミニウムまたはアルミニウム合金の基体を表し、それぞれ日本工業規格(JIS H 4000:2006 など)にその成分が規定されている。
また、「SPCC」、および「SUS304」は鉄系基体を表し、「SUS304」は日本工業規格(JIS G 4305:2005)規定のステンレス鋼(クロムを18質量%、ニッケルを8質量%含有し、残部が鉄と不可避不純物からなる鉄基合金)、「SPCC」は日本工業規格(JIS G 3141:2009)規定の冷間圧延鋼板を表す。
[電解脱脂]
脱脂液:NaOH 60g/リットル
脱脂条件:2.5A/dm2、温度60℃、脱脂時間60秒、陰極脱脂
[酸洗]
酸洗液:10%硫酸
酸洗条件:30秒 浸漬、室温
[亜鉛置換]基体がアルミニウムの時に使用
亜鉛置換液:NaOH 500g/リットル、ZnO 100g/リットル、酒石酸(C4H6O6) 10g/リットル、FeCl2 2g/リットル
処理条件:30秒 浸漬、室温
[Agストライクめっき]被覆厚0.01μm
めっき液:KAg(CN)2 5g/リットル、KCN 60g/リットル、
めっき条件:電流密度 2A/dm2、めっき時間 4秒、温度 25℃
(めっき条件)
[Agめっき] 発明例1~15と18~25、参考例1および比較例1での反射層形成条件
めっき液:AgCN 50g/リットル、KCN 100g/リットル、K2CO3 30g/リットル
めっき条件:電流密度 0.008~1.0A/dm2、温度 30℃
[Agめっき] 従来例1での反射層形成条件
めっき液:AgCN 50g/リットル、KCN 100g/リットル、K2CO3 30g/リットル
めっき条件:電流密度 1.5A/dm2、温度 30℃
[Ag-Sn合金めっき] 発明例16での反射層形成条件
めっき液:KCN 100g/リットル、NaOH 50g/リットル、AgCN 10g/リットル、K2Sn(OH)6 80g/リットル
めっき条件:電流密度 1A/dm2、温度 40℃
[Ag-Pd合金めっき] 発明例17での反射層形成条件
めっき液:KAg(CN)2 20g/リットル、PdCl2 25g/リットル、K4O7P2 60g/リットル、KSCN 150g/リットル
めっき条件:電流密度 0.25A/dm2、温度 40℃
めっき液:Ni(SO3NH2)2・4H2O 500g/リットル、NiCl2 30g/リットル、H3BO3 30g/リットル
めっき条件:電流密度 5A/dm2、温度 50℃
[Coめっき] 中間層形成条件
めっき液:Co(SO3NH2)2・4H2O 500g/リットル、CoCl2 30g/リットル、H3BO3 30g/リットル
めっき条件:電流密度 5A/dm2、温度 50℃
[Cuめっき] 中間層形成条件
めっき液:CuSO4・5H2O 250g/リットル、H2SO4 50g/リットル、NaCl 0.1g/リットル
めっき条件:電流密度 6A/dm2、温度 40℃
上記のようにして得られた、表1の発明例、参考例、従来例および比較例のリードフレームについて、下記試験および基準により評価を行った。その結果を表2に示す。
(1A)反射率測定:分光光度計(U-4100(商品名、(株)日立ハイテクノロジーズ製))において、全反射率を300nm~800nmにかけて連続測定を実施した。このうち、340nm、および400nmにおける全反射率(%)を表2に示す。ここで、340nmでの反射率を60%以上、および400nmにおける反射率が70%以上のものが、近紫外域を含む光半導体装置用のリードフレームとして適しているものと判断した。
(1B)放熱性(熱伝導性):導電性基体の導電率がIACS(International Annealed Copper Standard)で10%以上であるものを放熱性(熱伝導性)が高く、「良」であるとして「○」印とし、10%未満であるものを放熱性(熱伝導性)が低く、「不良」であるとして「×」印とし、表2に示した。これは、導電率と熱伝導性はほぼ比例関係にあり、IACSで10%以上の導電率があるものは熱伝導性がよく放熱性も高いと判断されるためである。
(1C)生産性検討:参考までに、生産性を検討するために各めっき被覆厚形成時にかかる時間(分)を電流効率が95%として算出し、表2に示した。
さらに、電流密度を0.005~1.0A/dm2、生産性の観点から好ましくは0.05~1.0A/dm2で製造することで、容易に配向の割合を制御できていることが分かり、有効な製造手段であることが分かる。
なお、参考例1は、基体の導電率が2%であるため放熱性に優れないが、光半導体用リードフレームに放熱性を必要としない光半導体装置であれば、反射率は優れているので好適に使用できることは容易に想定されるものである。
また、本発明例は、近紫外域だけでなく可視光域においても、すべての発明例で反射率70%以上、および拡散反射率45~85%を保っており、高輝度に優れ、指向性のバランスに優れた光半導体用リードフレームに好適に使用できる。
実施例2として、厚さ0.3mm、幅50mmのC19400銅合金からなる導電性基体に実施例1と同様の前処理およびニッケル下地めっき0.5μm、銀ストライクめっきを0.01μm形成した後、さらに反射層として電気銀めっき2.0μmを形成して、発明例26~32、参考例2および3のリードフレームを作成した。なお、反射層の表面粗度の調整のために、めっき液添加剤の濃度を変えるか、またはめっき時の電流密度の大小を適宜調整した。参考例2と3のリードフレームでは、本発明で規定する所定の表面粗度値を外れた値を有する反射層を形成した。参考例2では、添加剤として以下のチオ硫酸ナトリウムの濃度を5g/リットル、電流密度を0.1A/dm2とすることによって、表面粗度として小さなRa値を有する反射層を得た。また、参考例3では、添加剤として以下のチオ硫酸ナトリウムの濃度を0.1g/リットル、電流密度を1A/dm2とすることによって、表面粗度として大きなRa値を有する反射層を得た。
[Agめっき]
めっき液:AgCN 50g/リットル、KCN 100g/リットル、K2CO3 30g/リットル、添加剤(チオ硫酸ナトリウム 0~10g/リットル)
めっき条件:電流密度 0.01~1.0A/dm2、温度 30℃
上記のようにして得られた、発明例および参考例のリードフレームについて、下記試験および基準により評価を行った。その結果を表3に示す。
(2A)表面粗度測定:接触式表面粗さ計(SE-30H(商品名、(株)小坂研究所製))により、任意の3点について算術平均高さRaを測定し、その平均値を表3に示した。
(2B)拡散反射率比率測定:分光光度計(U-4100(商品名、(株)日立ハイテクノロジーズ製))により、全反射率及び拡散反射率を300nm~800nmにかけて連続測定を実施した。このうち、波長340nmおよび400nmにおける拡散反射率の全反射率に対する割合(拡散反射率比率:%)を算出し、表3に示した。
また、本発明例は、近紫外域だけでなく可視光域においても、すべての発明例で反射率70%以上、および拡散反射率45~85%を保っており、高輝度に優れ、指向性のバランスに優れた光半導体用リードフレームに好適に使用できる。
実施例3として、厚さ0.3mm、幅50mmのC19400銅合金からなる導電性基体に、実施例1の発明例13と同様の厚さで前処理およびニッケル下地めっき、銀ストライクめっきを形成した後、さらに反射層として1層目の電気銀めっきを1.84μm、1.5A/dm2で形成後、さらに2層目の電気銀めっきを0.21μm、0.49A/dm2で形成し、2層の反射層の合計厚さとしては2.05μmの発明例33のリードフレームを作製した。また、1層目の電気銀めっきを1.84μm、1.5A/dm2で形成後、2層目を0.18μm、0.49A/dm2で形成し、2層の反射層の合計厚さとしては2.02μmの比較例2のリードフレームを作製した。比較例2においては、前記発明例33よりも反射層の2層目を形成した際のめっき時間を短く、具体的には、発明例33での反射層2層目(表層)形成時のめっき時間0.7分を比較例2では0.6分に変更した。これらのリードフレーム試料における反射層の表面粗度Raについて上記と同様にして測定したところ、双方ともRa≒0.15μmであった。
なお、(200)面強度比、全反射率、放熱性、生産性の評価方法は、実施例1と同様の手法で評価を行った。その結果を表4に示した。
これに対して、反射層の2層目が0.2μmに満たない比較例2では、(200)面の強度比が20%未満であり、反射率も340nmで60%以下と劣った結果となったことが分かる。
このように、反射層の表面から少なくとも0.2μm以上を所定の電流密度である0.005~1.0A/dm2にて被覆形成することで、反射層2層の内の下層の配向の影響を受けずに表層に基づいて、反射層全体としては(200)面の配向強度比を有効に高めることができ、反射率に優れかつ生産性が向上された光半導体用リードフレームの製造方法として有用であることが分かる。
また、本発明例は、近紫外域だけでなく可視光域においても、すべての発明例で反射率70%以上、および拡散反射率45~85%を保っており、高輝度に優れ、指向性のバランスに優れた光半導体用リードフレームに好適に使用できる。
2 反射層
2-1 反射層の下層
2-2 反射層の表層
3 光半導体素子
4 中間層
Claims (10)
- 導電性基体上の最表面に銀または銀合金からなる反射層が形成された光半導体装置用リードフレームであって、前記反射層の厚さが0.2~5.0μmであり、かつ、前記反射層の銀または銀合金をX線回折法で測定した際に、(200)面の強度比が総カウント数の20%以上であることを特徴とする、光半導体装置用リードフレーム。
- さらに前記反射層の表面粗度が、算術平均高さRaで0.05~0.30μmであることを特徴とする、請求項1記載の光半導体装置用リードフレーム。
- 前記導電性基体は、銅、銅合金、鉄、鉄合金、アルミニウムまたはアルミニウム合金からなることを特徴とする、請求項1または2記載の光半導体装置用リードフレーム。
- 前記導電性基体の導電率がIACS(International Annealed Copper Standard)で10%以上であることを特徴とする、請求項3記載の光半導体装置用リードフレーム。
- 前記反射層を形成する銀または銀合金は、銀、銀-錫合金、銀-インジウム合金、銀-ロジウム合金、銀-ルテニウム合金、銀-金合金、銀-パラジウム合金、銀-ニッケル合金、銀-セレン合金、銀-アンチモン合金、および銀-白金合金からなる群から選ばれた材料からなることを特徴とする、請求項1~4のいずれか1項に記載の光半導体装置用リードフレーム。
- 前記導電性基体と前記反射層との間に、ニッケル、ニッケル合金、コバルト、コバルト合金、銅および銅合金からなる群から選ばれた金属または合金からなる中間層が、少なくとも1層以上形成されていることを特徴とする、請求項1~請求項5のいずれか1項に記載の光半導体装置用リードフレーム。
- 前記中間層の厚さは、総厚で0.2~2.0μmであることを特徴とする、請求項6記載の光半導体用リードフレーム。
- 請求項1~請求項7のいずれか1項に記載の半導体装置用リードフレームを製造する方法であって、少なくとも前記反射層を電気めっき法で形成することを特徴とする、光半導体装置用リードフレームの製造方法。
- 前記反射層を、前記電気めっき法で形成する際の電流密度が0.005~1A/dm2であることを特徴とする、請求項8記載の光半導体用リードフレームの製造方法。
- 請求項1~請求項7のいずれか1項に記載の光半導体装置用リードフレームと、光半導体素子とを備えた光半導体装置であって、少なくとも前記光半導体素子が搭載される箇所に前記反射層が設けられていることを特徴とする光半導体装置。
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US13/380,762 US20120168800A1 (en) | 2009-06-24 | 2010-06-23 | Lead frame for optical semiconductor device, method of producing the same, and optical semiconductor device |
KR1020117031468A KR20120089567A (ko) | 2009-06-24 | 2010-06-23 | 광반도체 장치용 리드 프레임, 광반도체 장치용 리드 프레임의 제조방법, 및 광반도체 장치 |
JP2010539085A JPWO2010150824A1 (ja) | 2009-06-24 | 2010-06-23 | 光半導体装置用リードフレーム、光半導体装置用リードフレームの製造方法、および光半導体装置 |
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TW201108377A (en) | 2011-03-01 |
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