WO2010140595A1 - Method for grinding plate-like body - Google Patents
Method for grinding plate-like body Download PDFInfo
- Publication number
- WO2010140595A1 WO2010140595A1 PCT/JP2010/059286 JP2010059286W WO2010140595A1 WO 2010140595 A1 WO2010140595 A1 WO 2010140595A1 JP 2010059286 W JP2010059286 W JP 2010059286W WO 2010140595 A1 WO2010140595 A1 WO 2010140595A1
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- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- polishing tool
- truing
- plate
- tool
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
Definitions
- the present invention relates to a method for polishing a plate-like body, and more particularly to a method for polishing a plate-like body in which a glass substrate for FPD (Flat Panel Display) used for a liquid crystal display or the like is polished by a polishing apparatus.
- FPD Full Panel Display
- the glass substrate for FPD used for liquid crystal displays and the like is formed by forming a molten glass into a plate shape by a glass manufacturing method called a float method, and this is performed by a continuous polishing apparatus disclosed in Patent Document 1 or the like. By polishing and removing fine irregularities and undulations on the surface, a thin plate having a thickness of about 0.4 to 1.1 mm satisfying the flatness required for a glass substrate for a liquid crystal display is produced.
- a glass substrate is generally polished with a polishing pad (polishing tool) that rotates and revolves.
- the glass substrate is conveyed while the surface opposite to the surface to be polished is adsorbed and held on the adsorption sheet adhered to the table, and continuously conveyed by the conveying device that conveys the table.
- the surface to be polished is sequentially polished by the polishing pads of a plurality of polishing machines installed above the path.
- the polishing pad is rotated around a predetermined rotation center by a rotation / revolution mechanism and polishes the glass substrate while being revolved around the predetermined rotation center.
- a rectangular polishing pad is used, only revolving motion is performed.
- a continuous polishing apparatus that uses a rectangular polishing pad
- a continuous polishing apparatus that consists of only a rectangular polishing pad and a continuous polishing apparatus that combines a rectangular polishing pad and a circular polishing pad that rotates and revolves.
- the polishing rate of the glass substrate decreases with the lapse of the polishing time, and if the polishing rate falls below a predetermined threshold, it is necessary to truing or dressing the polishing pad. There was a problem that could not be raised. In addition, even when there is no need for truing or dressing of the polishing tool in the conventional polishing apparatus, the polishing rate decreases with the lapse of the polishing time, so continuous polishing with a substantially constant polishing rate cannot be performed. There was also a problem that the polishing time was long.
- the present invention has been made in view of such circumstances, and an object of the present invention is to provide a plate-like polishing method capable of polishing a plate-like body by controlling the polishing rate to be substantially constant.
- the present invention provides a polishing method for a plate-like body in which the plate-like body is polished by a rotating polishing tool while moving the plate-like body in a predetermined direction, wherein the rotation direction of the polishing tool is reversed at a predetermined timing.
- a plate-like body polishing method is provided.
- the fluff that actually polishes the plate-like body has directionality by polishing, truing, or the like. That is, the fluff has a directionality inclined from the upstream side to the downstream side in the polishing direction. If polishing is continued in such a direction, the rotational resistance of the fluff with respect to the plate-like body decreases, so that the polishing rate decreases as the polishing time elapses.
- the polishing tool is reversed at that timing. Then, since the fluff has directionality in the direction opposite to the reverse direction, the plate-like body is polished while receiving a large rotational resistance from the plate-like body. The fluff eventually tries to change its direction to the reverse direction, but during polishing in which the fluff is subjected to a predetermined rotational resistance, that is, during polishing in which the rotational resistance of the fluff exceeds a predetermined value, the fluff The polishing rate is increased by the rotational resistance.
- the present invention is characterized in that the polishing tool is inverted when the rotational resistance of the polishing tool relative to the plate-like body becomes equal to or lower than the predetermined rotational resistance. Accordingly, when the polishing tool is inverted, the polishing rate increases and the polishing rate gradually decreases. However, when the rotational resistance of the polishing tool becomes a predetermined value or less, the polishing tool is inverted again to increase the polishing rate. . In this way, by repeating the reversal of the polishing tool based on the rotational resistance of the polishing tool received from the plate-like body, the polishing rate does not increase or decrease significantly, and therefore the polishing rate can be controlled to be substantially constant for polishing. .
- the rotating direction of the polishing tool may be repeatedly reversed at a predetermined cycle.
- a lower limit value related to a load current value of a motor for rotating the polishing tool is determined in advance, a change in the load current at the time of polishing is monitored, and the rotation direction of the polishing tool is determined at a timing when the load current value reaches the lower limit value. It is good also as a structure reversed.
- the load current value of the motor correlated with the polishing rate is measured, and when the load current value falls below a predetermined value, that is, the rotational resistance of the polishing tool
- the rotation direction of the polishing tool is reversed when is below a predetermined value.
- the polishing rate can be controlled to be substantially constant.
- the direction of rotation of the polishing tool can be reversed at regular intervals.
- the present invention may be configured such that the polishing tool revolves around a predetermined center of revolution, and the revolution direction is reversed simultaneously with the reversal of the rotation direction.
- the revolving direction is reversed simultaneously with the reversal of the rotation direction from the balance relationship between the torque that rotates the revolving shaft and the torque that rotates the revolving shaft.
- a plurality of the polishing tools may be arranged along the moving direction of the plate-like body.
- the polishing tool of the present invention is suitable for a continuous polishing apparatus.
- the present invention includes a truing step of pressing the polishing tool against a truing member and reshaping the polishing tool by rotating the polishing tool and the truing member relatively, and the plate performed after the truing step It is good also as a structure by which the autorotation direction of the said grinding
- the present invention relates to truing of an abrasive tool.
- the polishing tool is periodically trued by the truing member during the polishing of the plate-like body, but the polishing tool rotates in the direction of rotation during the truing process when the plate-like body is polished after the truing process. And set it in the opposite direction.
- the fluff of the polishing tool has a direction that is inclined from the upstream side to the downstream side in the truing direction due to the relative rotation of the polishing tool and the truing member.
- the polishing tool by rotating the polishing tool in the reverse direction with respect to the direction of fluff inclination generated during truing, the plate-like body is polished, so that the fluff polishes the plate-like body while receiving a large rotational resistance. Therefore, the polishing rate of the plate-like body is increased by the rotational resistance of the fluff.
- the present invention may be configured such that the relative rotation direction of the truing member and the polishing tool during the truing process is set in the same direction as the rotation direction of the polishing tool immediately before the truing process.
- the fluff of the polishing tool immediately before the truing process has a characteristic that it is inclined in the rotation direction of the polishing tool immediately before the truing process.
- the fluff of the polishing tool immediately before the truing process by setting the relative rotation direction of the truing member and the polishing tool to be the same as the direction of rotation of the polishing tool immediately before the truing process, it is given to the fluff of the polishing tool during truing.
- the directionality can be further emphasized. That is, since the fluff inclination angle can be further increased, the rotational resistance of the fluff during polishing performed after the truing process can be further increased, and the polishing rate of the plate-like body can be significantly increased.
- truing is a work to remove the deflection of the working surface of the polishing tool by pressing the working surface of the polishing tool against the surface of a truing member such as a diamond grindstone, and rotating the truing member and the polishing tool relatively. This refers to the work of correcting the shape of the working surface of the polishing tool used over time.
- the rotation direction of the polishing tool is reversed at a predetermined timing, so that the polishing rate of the plate-like body can be controlled to be substantially constant.
- FIG. 1 is a plan view of the main part of the polishing apparatus shown in FIG.
- FIG. 1 shows a bird's-eye view of a polishing apparatus 10 to which a plate-like polishing method according to an embodiment is applied.
- FIG. 2 is a schematic plan view of the polishing apparatus 10 shown in FIG. 1, in which the contents relating to the shape, arrangement position, and operation of the polishing tool 12 are shown.
- the polishing apparatus 10 according to the embodiment includes a plurality of circular polishing units arranged along a conveyance path while continuously conveying a glass substrate G for liquid crystal display having a size of, for example, 2200 mm (width) ⁇ 2600 mm (length) or more. This is an apparatus for continuously polishing the glass substrate G with the tools 12, 12.
- the glass substrate G to be polished is held on the suction sheet (not shown) adhered to the table 14 by suction and holds the surface opposite to the surface to be polished, as indicated by an arrow X in FIGS.
- the table 14 is continuously transported by a transport device to be described later.
- the surface to be polished has a flatness required by the glass substrate G for liquid crystal display by each of the polishing tools 12, 12... Of the plurality of polishing machines installed above the transfer path during transfer of the table 14. Polished.
- the polished glass substrate G is cleaned by the cleaning device 16.
- the polishing tools 12, 12... are configured with a diameter D smaller than the width W of the glass substrate G, and are rotated around a predetermined rotation center by a rotation / revolution mechanism of a polishing machine described later. At the same time, the glass substrate G is polished while being revolved around a predetermined revolution center.
- circles indicated by solid lines indicate the current postures of the polishing tools 12, 12...
- circles indicated by two-dot chain lines indicate that the glass substrate G is the polishing tools 12, 12.
- the edge part of the contact part is shown. As can be seen from these circles, the polishing tools 12, 12,... Are revolved around a predetermined revolution center.
- polishing tools 12, 12... are arranged in pairs with respect to the movement center line L of the glass substrate G, and are arranged in a zigzag pattern shifted in the moving direction. It arrange
- a plurality of small polishing tools 12 having a diameter D smaller than the width W of the glass substrate G are arranged, and these polishing tools 12, 12. Are arranged in pairs on the left and right with respect to the moving center line L, and the polishing tool 12, 12... Polishes the glass substrate G beyond the center line L, thereby polishing the entire surface of the glass substrate G. it can.
- FIG. 3 is a sectional structural view of the polishing machine 20.
- the polishing machine 20 is installed so as to straddle the table 14.
- a pair of guide blocks 22, 22 are provided at the lower part of the table 14, and the guide blocks 22, 22 are arranged on a base 24. , 26 are slidably engaged.
- a rack 28 is fixed to the lower center portion of the table 14 along the longitudinal direction of the table 14, and the rack 28 is engaged with a pinion 29.
- the pinion 29 is rotatably supported by the base 24, is connected to an output shaft of a motor (not shown), and is rotated by the driving force of the motor. Thereby, the rack 28 is sent to the pinion 29, and the table 14 is conveyed at a predetermined speed in the X direction shown in FIGS.
- the glass substrate G held on the suction sheet on the table 14 sequentially passes below the polishing machines 20, 20..., And the polishing tools 12, 12 of the polishing machines 20, 20. Polished by small amounts. And finally, the thing of the flatness requested
- the transport speed of the table 14 is controlled so that it can be changed depending on the polishing situation.
- the polishing tool 12 a foamed polyurethane pad, a suede pad, or the like is applied, and the slurry supplied at the time of polishing contains free abrasive grains such as cerium oxide or zirconium oxide.
- the polishing machine 20 has a main shaft 30 that is provided above the table 14 and orthogonal to the table 14.
- the main shaft 30 is rotatably supported by a main body casing 34 via bearings 32, 32 arranged up and down, and the main body casing 34 is fixed to a pair of posts 36, 36 arranged on both sides thereof.
- pistons 40 of hydraulic jacks 38 installed on the base 24 are connected to the lower portions of the posts 36 and 36, respectively. Therefore, when the pistons 40 and 40 are simultaneously expanded and contracted, the main body casing 34 is moved up and down via the posts 36 and 36. As a result, the polishing head 42 provided with the polishing tool 12 is moved forward and backward with respect to the table 14.
- the main shaft 30 is formed with an insertion hole 30 ⁇ / b > A having a central axis O 2 eccentric with respect to the central axis O 1 of the main shaft 30.
- the insertion hole 30A is inserted the output shaft 44, output shaft 44, as the center axis thereof coincides with the axis O 2, rotatably on the main shaft 30 via a bearing 46, 46 disposed above and below It is supported.
- a gear 48 is provided on the upper peripheral portion of the main shaft 30.
- a gear 50 is engaged with the gear 48, and a gear 54 is connected to the gear 50 via a shaft 52.
- An output gear 58 is engaged with the gear 54 via an idle gear 56, and the output gear 58 is fixed to the motor output shaft 62 of the revolution motor 60.
- the driving force of the motor 60 is decelerated via the gears 58, 56, 54, 50 and 48 and transmitted to the main shaft 30, so that the main shaft 30 is rotated at a predetermined rotational speed.
- the output shaft 44 revolves along a circumference around the axis O 1 of the main shaft 30. That is, the polishing tool 12 revolves around the axis O 1 .
- a polishing head 42 formed in a circular shape is connected to a lower end portion of the output shaft 44 via a rotary joint 64.
- the polishing head 42 includes an upper surface plate 66, a polishing surface plate 68, a polishing tool 12, and air springs 70, 70.
- the upper surface plate 66 is made of stainless steel having high rigidity for the purpose of preventing chatter.
- the polishing surface plate 68 has a high rigidity structure made of cast iron or stainless steel, and is connected to the upper surface plate 66 via air springs 70, 70. These air springs 70, 70... Are disposed at a predetermined interval on the circumference centering on the axis O 2 of the polishing head 42, and an air passage (not shown) formed in the upper surface plate 66. And it is connected to an air pump (not shown) via a rotary joint 64. Therefore, when the compressed air from the air pump is supplied to the air springs 70, 70... Via the rotary joint 64 and the air passage, the air springs 70, 70.
- the spring force of the air springs 70, 70... is transmitted to the polishing tool 12 via the polishing surface plate 68, so that polishing pressure is applied to the polishing tool 12.
- the polishing pressure is adjusted by controlling the air pressure supplied to the air springs 70, 70.
- the upper end portion of the output shaft 44 is connected to the output shaft 76 of the motor 74 for rotation through a universal joint 72. Accordingly, the output shaft 44 rotates about the axis O 2 by the driving force of the motor 74. That is, the polishing tool 12 rotates about the axis O 2 . Even if the output shaft 44 is revolving around the axis O 1 , the output shaft 44 is connected to the output shaft 76 of the motor 74 via the universal joint 72, so that the polishing tool 12 rotates without trouble. Exercise.
- the main body casing 34 is moved up and down by expanding and contracting the piston 40 of the hydraulic jack 38 of the polishing machine 20 to adjust the height position of the polishing head 42 with respect to the table 14. Then, the amount of air supplied to the air spring 70 is adjusted, and the polishing pressure is set for each of the polishing machines 20, 20.
- the table 14 is transported in the transport direction. Then, at the same time, by driving the revolving motor 60 and the self-rotating motor 74 of the grinding machine 20, respectively, the polishing tool 12 as shown in FIG. 4, with revolving motion around the axis O 1, axis O 2
- the glass substrate G that has been transported by the table 14 is polished while rotating around the center.
- the glass substrate G is polished while the polishing tool 12 rotates and revolves. Therefore, the glass substrate G is polished along a combined locus of the revolution locus and the rotation locus of the polishing tool 12. Therefore, according to the continuous polishing apparatus 10 configured by arranging a plurality of polishing machines 20 side by side, the polishing efficiency can be improved without increasing the revolution speed of the polishing tool 12. Moreover, since it is not necessary to raise the polishing pressure of the polishing tool 12 more than necessary, the flatness of the polished surface of the glass substrate G is also improved.
- the polishing rate of the glass substrate decreases as the polishing time elapses.
- the polishing rate falls below a predetermined threshold, the polishing pad is trued.
- the polishing rate decreases with the lapse of the polishing time, so that the polishing rate cannot be made constant at a constant rate.
- the polishing apparatus 10 according to the embodiment is for the purpose of eliminating the disadvantages of the conventional polishing apparatus and polishing the glass substrate by controlling the polishing rate to be substantially constant. That is, in the polishing method by the polishing apparatus 10 of the embodiment, the rotation direction of the polishing tool 12 is reversed at a predetermined timing.
- polishing rate can be controlled to be substantially constant by reversing the polishing tool 12.
- the fluff 12B that actually polishes the glass substrate G is as follows. It has directionality by polishing or truing. That is, as shown in FIG. 5B, the fluff 12B is inclined in the direction opposite to the grinding direction when viewed from the polishing tool in the direction of the glass substrate G. If polishing is continued in such a direction, the rotational resistance of the fluff 12B with respect to the glass substrate G decreases, so the polishing rate decreases with the lapse of polishing time.
- the rotational resistance of the fluff 12B with respect to the glass substrate G becomes equal to or less than a predetermined value, that is, when polishing with the fluff 12B cannot be performed satisfactorily, the rotation direction of the polishing tool 12 is reversed at that timing. Then, as shown in FIG. 5C, the fluff 12B has a direction opposite to the reverse direction, so that the glass substrate G is polished while receiving a large resistance (resistance ⁇ increases) from the glass substrate G. Become. As shown in FIG.
- the fluff 12B tries to change its direction in the reverse direction, but during the polishing in which the fluff 12B is subjected to a predetermined rotational resistance, that is, the rotational resistance of the fluff 12B is predetermined. During polishing exceeding the value, the polishing rate increases due to the rotational resistance of the fluff 12B.
- the polishing method of the embodiment is configured so that when the rotational resistance of the polishing tool 12 with respect to the glass substrate G becomes equal to or less than the predetermined resistance, the rotation direction of the polishing tool 12 is normal rotation (normal rotation). ) To reverse. As a result, when the polishing tool 12 is inverted, the polishing rate increases and the polishing rate gradually decreases. However, when the rotational resistance of the polishing tool 12 becomes a predetermined value or less, the polishing tool 12 is turned on again. Invert to increase the polishing rate.
- the polishing rate does not increase or decrease significantly, and therefore the polishing rate is controlled to be substantially constant and polished. Can do.
- the polishing apparatus 10 includes a control unit that reverses the rotation direction of the polishing tool 12 when the load current value of the motor 74 (see FIG. 3) becomes a predetermined value (TH value) or less.
- the polishing rate may be directly measured during the polishing of the glass substrate G, and the rotational direction of the polishing tool 12 may be reversed based on the polishing rate. However, the polishing rate may be directly measured during the polishing of the glass substrate G. Since it is difficult, the rotation current value of the motor 74 having a correlation with the polishing rate is measured, and the polishing tool 12 is inverted based on the current value.
- the horizontal axis is the time axis
- the right vertical axis indicates the rotation current value of the motor 74.
- This autorotation current value is also referred to as a load current value because it can vary depending on the state of the load when the motor is driven at a predetermined voltage.
- the left vertical axis shows the polishing rate (unit: ⁇ m / min).
- the threshold value of the rotation current value for switching the rotation direction of the motor 74 is set to a predetermined lower limit value (TH value in the figure).
- the rotation current value threshold is preferably 65% of the rotation current value immediately after reversal. A current value of 70% is more preferable, and a current value of 80% is particularly preferable.
- the shortest time required from the time immediately after the reversal to the threshold value of the rotation current value can be set as the reversal interval.
- this experimental example is carried out by setting the rotation speed, revolution speed, pressure of the polishing tool 12 against the glass substrate G, and the slurry supply amount to predetermined values, respectively.
- the motor drive control is set so that the motor 74 reverses from normal rotation to reverse rotation and from reverse rotation to normal rotation when the autorotation current value becomes equal to or less than the TH value. Therefore, as shown in the graph of the same figure, the rotation current value (polishing rate) increases, and the rotation current value (polishing rate) decreases with the lapse of the polishing time. Then, when the autorotation current becomes equal to or less than the TH value again, the motor 74 reverses and the autorotation current value (polishing rate) increases again.
- the autorotation current value and the polishing rate have a positive correlation.
- a threshold value (TH value) of the rotation current value that can be directly controlled is set, and the rotation direction of the polishing tool 12 by the motor 74 is reversed based on the threshold value.
- the control unit described above also controls the motor 60 to reverse the revolution direction of the polishing tool 12 simultaneously with the reversal of the rotation direction of the polishing tool 12.
- torque for rotating the rotation shaft (output shaft 44: see FIG. 3) and revolution shaft (main shaft 30: see FIG. 3). ) Is preferably reversed at the same time as the rotation direction is reversed.
- the continuous polishing apparatus 10 in which a plurality of polishing machines 20 are arranged side by side has been described.
- the polishing method of the present invention is applied to a polishing apparatus including one polishing machine 20.
- the polishing machine 20 in which the polishing tool 12 rotates and revolves has been described.
- the polishing method of the present invention may be applied to a polishing apparatus in which the polishing tool 12 only rotates.
- the polishing method of the embodiment includes a truing process.
- the truing process is a process of reshaping the polishing tool 12 by pressing the polishing tool 12 against the truing member 80 and rotating or revolving the polishing tool 12 and the truing member 80 relatively as shown in FIG. 7A.
- the polishing tool 12 is rotated or revolved in the direction of arrow A with respect to the fixed truing member 80 to perform truing.
- the polishing tool 12 is fixed and the truing member 80 is rotated or rotated. It may be revolved, and both the polishing tool 12 and the truing member 80 may be rotated.
- a diamond grindstone configured in a disk shape or a rectangular shape can be exemplified.
- the rotation direction indicated by the arrow B of the polishing tool 12 at the time of polishing the glass substrate G performed after the truing process is rotated by the rotation indicated by the arrow A in the truing process shown in FIG. 7A.
- the direction is set opposite to the direction.
- the polishing tool 12 is periodically trued by the truing member 80 during polishing of the glass substrate G.
- the rotation direction of the polishing tool 12 is changed to the rotation during the truing process. Set in the opposite direction to the direction.
- the fluff 12B of the polishing tool 12 is inclined (inclination angle ⁇ 2 ) from the upstream side to the downstream side in the truing direction due to the relative rotation of the polishing tool 12 and the truing member 80. Has the direction. Therefore, the glass substrate G is polished by rotating the polishing tool 12 in the reverse direction with respect to the inclination direction of the fluff 12B generated during truing. Accordingly, as shown in FIG. 7B, the fluff 12B polishes the glass substrate G while receiving a large rotational resistance. Therefore, the polishing rate of the glass substrate G is increased by the rotational resistance of the fluff 12B.
- the horizontal axis t of the graph in the figure is the time axis, and the left vertical axis indicates the polishing rate (unit: ⁇ m / min).
- the glass substrate G is polished by repeating the normal rotation and inversion of the polishing tool 12, and the truing of the polishing tool 12 is performed as shown in FIG. 7A at the timing (A) of the polishing process.
- the direction of rotation of the polishing tool 12 is set to be opposite to the direction during truing, and the polishing of the glass substrate G is continued.
- the peak value (a) of the polishing rate after truing is significantly higher than the peak value (b) of the polishing rate due to normal normal rotation and reversal operations.
- the rotation direction of the polishing tool 12 during truing is the same as the rotation direction of the polishing tool 12 immediately after truing.
- the peak value of the polishing rate immediately after truing increases from the b value to the c value by reshaping the polishing tool 12 by truing at the timing (A), but the increase amount (c value ⁇ b value) ) Is smaller than the amount of increase (a value ⁇ b value) of the embodiment shown in FIG.
- the polishing tool 12 is rotated in the direction of arrow A during truing, and the polishing tool 12 is inverted in the direction of arrow B as shown in FIG.
- the fluff 12B of the polishing tool 12 inclines along the polishing direction, and as a result, the polishing rate decreases.
- FIG. 10D even if truing is performed in the direction of arrow A thereafter, the wrinkles of the fluff 12B returned by polishing cannot be returned to the state shown in FIG. 10A. Therefore, it becomes impossible to increase the polishing rate of polishing performed immediately after that.
- the relative rotation direction of the truing member and the polishing tool 12 during the truing process is set to the same direction as the rotation direction of the polishing tool 12 immediately before the truing process.
- the fluff 12B of the polishing tool 12 immediately before the truing process has a characteristic that it is inclined in the rotation direction of the polishing tool 12 immediately before the truing process.
- the relative rotation direction of the truing member and the polishing tool 12 is set to be the same as the direction of rotation of the polishing tool 12 immediately before the truing process, so that the polishing tool 12 is true during truing.
- the directionality given to the fluff 12B can be further emphasized. That is, as shown in FIG. 11A, the inclination angle ⁇ 1 of the fluff 12B can be made larger than the inclination angle ⁇ 2 shown in FIG.
- polishing tool 12 is inverted after the truing process as shown in FIG. 11B. It is possible to further increase the rotational resistance of the fluff 12B when it is made to move. Therefore, the polishing rate of the glass substrate G can be significantly increased.
- FIG. 11A the truing direction is indicated by an arrow B
- FIG. 11B the polishing direction is indicated by an arrow A. That is, an example is shown in which the truing direction is reversed with respect to FIGS. 7A and 7B and FIGS. 10A to 10D, and the rotation direction of the polishing tool 12 performed immediately thereafter is also reversed.
- the horizontal axis t of the graph in the figure is the time axis, and the left vertical axis indicates the polishing rate (unit: ⁇ m / min).
- the glass substrate G is polished by repeating the normal rotation and inversion of the polishing tool 12, and the truing shown in FIG. 7A is performed at the timings (A) and (B) of the polishing process. Then, at the subsequent timing (C), after performing the truing shown in FIG. 11A, the polishing tool 12 is inverted as shown in FIG. 11B and the polishing is continued.
- the truing performed at timings (D) and (E) thereafter is the truing shown in FIGS. 7A and 7B. That is, the truing shown in FIG. 11A may be performed for each truing, but is preferably performed intermittently when the polishing rate falls below a predetermined value or when necessary.
- the object to be polished by the plate polishing apparatus of the present invention is not limited to a glass substrate for FPD, and may be a general glass plate for building materials, mirrors, etc. It may be a target.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
12…研磨具
12A…研磨具ベース
12B…毛羽
14…テーブル
16…洗浄装置
20…研磨機
22…ガイドブロック
24…基台
28…ラック
29…ピニオン
30…主軸
32…ベアリング
34…本体ケーシング
36…ポスト
38…油圧ジャッキ
40…ピストン
42…研磨ヘッド
44…出力軸
46…ベアリング
48…ギヤ
50…ギヤ
52…軸
54…ギヤ
56…アイドルギヤ
58…出力ギヤ
60…公転用モータ
62…モータ出力軸
64…ロータリージョイント
66…上定盤
70…空気ばね
72…ユニバーサルジョイント
74…自転用モータ
76…出力軸
80…ツルーイング部材 DESCRIPTION OF
Claims (7)
- 板状体を所定の方向に移動させながら、自転する研磨具によって板状体を研磨する板状体の研磨方法において、
前記研磨具の自転方向を所定のタイミングで反転させることを特徴とする板状体の研磨方法。 In the method for polishing a plate-like body in which the plate-like body is polished by a rotating polishing tool while moving the plate-like body in a predetermined direction,
A polishing method for a plate-like body, wherein the rotation direction of the polishing tool is reversed at a predetermined timing. - 前記研磨具の回転方向を所定の周期で、繰り返し反転させる請求項1に記載の板状体の研磨方法。 The method for polishing a plate-like body according to claim 1, wherein the rotating direction of the polishing tool is repeatedly reversed at a predetermined cycle.
- 前記研磨具を回転させるモータの負荷電流値に関する下限値を予め定め、研磨時における負荷電流の変化をモニターし、その負荷電流値が下限値に達したタイミングで前記研磨具の自転方向を反転させる請求項1に記載の板状体の研磨方法。 A lower limit value related to the load current value of the motor that rotates the polishing tool is determined in advance, a change in the load current during polishing is monitored, and the rotation direction of the polishing tool is reversed when the load current value reaches the lower limit value. The method for polishing a plate-like body according to claim 1.
- 前記研磨具は所定の公転中心を中心に公転し、公転方向が自転方向の反転と同時に反転される請求項1又は2に記載の板状体の研磨方法。 The method for polishing a plate-like body according to claim 1 or 2, wherein the polishing tool revolves around a predetermined revolution center and the revolution direction is reversed simultaneously with the reversal of the rotation direction.
- 前記研磨具は、板状体の移動方向に沿って複数台配置されている請求項1~3のいずれか1項に記載の板状体の研磨方法。 The method for polishing a plate according to any one of claims 1 to 3, wherein a plurality of the polishing tools are arranged along a moving direction of the plate.
- 前記研磨具をツルーイング部材に押し付けるとともに前記研磨具及び前記ツルーイング部材を相対的に回転させて前記研磨具を形直しするツルーイング工程が備えられ、
前記ツルーイング工程後に行われる前記板状体の研磨時の前記研磨具の自転方向が、前記ツルーイング工程時の回転方向に対して逆方向に設定される請求項1~5のいずれか1項に記載の板状体の研磨方法。 A truing step of pressing the polishing tool against a truing member and reshaping the polishing tool by relatively rotating the polishing tool and the truing member;
The rotating direction of the polishing tool during polishing of the plate-like body performed after the truing process is set in a direction opposite to the rotation direction during the truing process. Polishing method for plate-like body. - 前記ツルーイング工程時における前記ツルーイング部材と前記研磨具との相対的な回転方向が、ツルーイング工程直前の前記研磨具の自転方向と同方向に設定されている請求項6に記載の板状体の研磨方法。 The polishing of the plate-shaped body according to claim 6, wherein a relative rotation direction of the truing member and the polishing tool during the truing process is set in the same direction as a rotation direction of the polishing tool immediately before the truing process. Method.
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CN201080024409.7A CN102458766B (en) | 2009-06-04 | 2010-06-01 | Method for grinding plate-like body |
JP2011518459A JP5527622B2 (en) | 2009-06-04 | 2010-06-01 | Method for polishing plate |
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JP2009135108 | 2009-06-04 | ||
JP2009-135108 | 2009-06-04 |
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PCT/JP2010/059286 WO2010140595A1 (en) | 2009-06-04 | 2010-06-01 | Method for grinding plate-like body |
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JP (1) | JP5527622B2 (en) |
KR (1) | KR101616595B1 (en) |
CN (1) | CN102458766B (en) |
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WO (1) | WO2010140595A1 (en) |
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WO2013121718A1 (en) * | 2012-02-15 | 2013-08-22 | 信越半導体株式会社 | Method for polishing both surfaces of wafer |
JP2013215817A (en) * | 2012-04-05 | 2013-10-24 | Mitsubishi Electric Corp | Machining method and machining device |
US20150004882A1 (en) * | 2013-06-28 | 2015-01-01 | Samsung Display Co., Ltd. | Apparatus for grinding a surface of substrate |
JP2015223666A (en) * | 2014-05-28 | 2015-12-14 | 株式会社ディスコ | Griding device and grinding method for rectangular substrate |
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JP6489973B2 (en) * | 2015-07-30 | 2019-03-27 | 株式会社ディスコ | Grinding equipment |
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Also Published As
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KR101616595B1 (en) | 2016-04-28 |
JPWO2010140595A1 (en) | 2012-11-22 |
KR20120023741A (en) | 2012-03-13 |
CN102458766A (en) | 2012-05-16 |
JP5527622B2 (en) | 2014-06-18 |
TW201107077A (en) | 2011-03-01 |
CN102458766B (en) | 2014-04-02 |
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