KR101616595B1 - Method for grinding plate-like body - Google Patents

Method for grinding plate-like body Download PDF

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Publication number
KR101616595B1
KR101616595B1 KR1020117028925A KR20117028925A KR101616595B1 KR 101616595 B1 KR101616595 B1 KR 101616595B1 KR 1020117028925 A KR1020117028925 A KR 1020117028925A KR 20117028925 A KR20117028925 A KR 20117028925A KR 101616595 B1 KR101616595 B1 KR 101616595B1
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South Korea
Prior art keywords
polishing
truing
tool
polishing tool
rotation
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KR1020117028925A
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Korean (ko)
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KR20120023741A (en
Inventor
다쯔로 고찌
아쯔시 기야마
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아사히 가라스 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

The present invention relates to a plate-shaped body polishing method for polishing a plate-shaped body by rotating an oscillating tool while moving the plate-shaped body in a predetermined direction, wherein the rotating direction of the polishing tool is reversed at a predetermined timing.

Description

METHOD FOR GRINDING PLATE-LIKE BODY BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a polishing method of a plate-like body, and more particularly to a polishing method of a plate-shaped body for polishing a glass substrate for an FPD (Flat Panel Display) used for a liquid crystal display or the like by a polishing apparatus.

BACKGROUND ART A glass substrate for an FPD used for a liquid crystal display or the like is produced by forming a molten glass into a plate shape by a glass manufacturing method called a float method and polishing the surface with minute concavities and convexities by a continuous grinding apparatus disclosed in Patent Document 1 To a thin plate having a thickness of about 0.4 to 1.1 mm, which satisfies the flatness required in a glass substrate for a liquid crystal display.

In such a continuous polishing apparatus, polishing of a glass substrate is generally carried out by a polishing pad (polishing pad) that rotates and revolves as described in Patent Document 2.

In the conventional continuous polishing apparatus, the glass substrate is adsorbed and held on the adsorption sheet adhered to the table on the opposite side to the object surface to be polished, and is continuously conveyed by the conveying device for conveying the table, The polishing target surfaces are successively polished by the polishing pads of a plurality of polishing machines. The polishing pad is rotated around a predetermined rotation center by a rotation / revolving mechanism and polishes the glass substrate while revolving around a predetermined revolution center. When a rectangular polishing pad is used, only idle motion is performed. As a continuous polishing apparatus using a rectangular polishing pad, there is a continuous polishing apparatus comprising only a rectangular polishing pad or a continuous polishing apparatus in which a rectangular polishing pad and a circular polishing pad for rotating and rotating are combined.

Japanese Patent Application Laid-Open No. 2007-190657 Japanese Patent Application Laid-Open No. 2001-293656

Conventional polishing apparatuses require the polishing pad to be trued or dressed when the polishing rate of the glass substrate is lowered with the lapse of the polishing time and the polishing rate is lower than the predetermined threshold value, There was a problem that it could not be raised. Further, in the conventional polishing apparatus, even when there is no necessity of truing or dressing of the polishing tool, the polishing rate is lowered with the lapse of the polishing time, so that it is impossible to carry out continuous polishing with a substantially constant polishing rate, There was also a problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a polishing method of a plate-like body capable of polishing a plate-shaped body by controlling the polishing rate to be substantially constant.

A polishing method for a plate-shaped body polishing a plate-shaped body by rotating a rotating tool while moving the plate-shaped body in a predetermined direction, characterized in that the direction of rotation of the polishing tool is reversed at a predetermined timing And a method of polishing a plate-like body.

Considering that the polishing tool is macroscopically separated into a main body (hard portion) and a nap (soft portion), the napping actually polishing the plate-like body has directionality by polishing or truing. That is, the nap is inclined toward the downstream side from the upstream side in the polishing direction. If polishing is continued in such a directional state, the rotation resistance of the napkin to the plate-shaped body is lowered, and the polishing rate is lowered with the lapse of the polishing time. Therefore, when the rotational resistance of the nap each other with respect to the plate-shaped body becomes less than a predetermined value, that is, when the napping can not be performed satisfactorily, the trailing edge is reversed at that timing. Then, the nappy has directionality in a direction opposite to the inversion direction, and this time, the plate-shaped body is polished while receiving a large rotational resistance from the plate-shaped body. During the polishing in which the napping is subjected to a predetermined rotational resistance, that is, during the polishing in which the napping rotational resistance exceeds a predetermined value, the napping speed is raised by the rotation resistance of the napping .

Based on this verification result, the present invention is characterized in that, when the rotational resistance of the polishing tool with respect to the plate-shaped body becomes equal to or less than the predetermined rotational resistance, the polishing tool is reversed. As a result, the polishing speed is increased and the polishing speed is gradually lowered when the polishing tool is reversed. When the rotation resistance of the polishing tool becomes a predetermined value or less, the polishing tool is again inverted to raise the polishing speed. By repeating the inversion of the polishing tool based on the rotational resistance of the polishing tool received from the plate-like body in this way, the polishing rate is not greatly increased and decreased, and polishing can be performed by controlling the polishing speed at a substantially constant value.

That is, in the present invention, the rotating direction of the polishing tool may be reversed repeatedly at a predetermined cycle.

A lower limit value relating to the load current value of the motor for rotating the polishing tool is determined in advance and a change in the load current during polishing is monitored to reverse the rotational direction of the polishing tool at the timing when the load current value reaches the lower limit value .

Since it is difficult to directly measure the polishing rate during polishing, the load current value of the motor correlated with the polishing rate is measured. When the load current value becomes a predetermined value or less, that is, when the rotational resistance of the polishing pad is below a predetermined value The direction of rotation of the polishing pad is reversed. Thus, according to the present invention, the polishing rate can be controlled to be substantially constant. In addition, it is also possible to invert the direction of rotation of the polishing pad every predetermined time.

Further, in the present invention, the polishing tool may be configured such that the polishing tool revolves around a predetermined revolving center, and the revolving direction is reversed at the same time when the revolving direction is reversed. In the case of a polishing tool that revolves or revolves, it is preferable to reverse the revolving direction simultaneously with the reversal of the revolving direction from the balance between the torque for rotating the revolving shaft and the torque for rotating the revolving shaft.

Further, in the present invention, it is also possible to arrange a plurality of pieces of the abrasive mat along the moving direction of the plate-shaped body. The polishing tool of the present invention is suitable for a continuous polishing apparatus.

Further, the present invention provides a truing process for pressing the truing member against a truing member and for correcting the shape of the truching unit by relatively rotating the truing member and the truing member, wherein after the truing process May be configured such that the rotating direction of the polishing tool at the time of polishing the plate-shaped body is set to be opposite to the rotating direction at the truing step.

The present invention relates to the truing of an abrasive tool. The grinding tool is trued regularly by the truing member at the time of polishing the plate-shaped body, but the direction of rotation of the polishing tool at the time of polishing of the plate-like body performed after the truing step is reversed with respect to the direction of rotation at the truing step . The fluff of the polishing tool at the time of truing has a directional inclination from the upstream side toward the downstream side in the truing direction due to the relative rotation of the polishing tool and the truing member. Therefore, by polishing the plate-shaped body by rotating the polishing tool in the opposite direction with respect to the direction of inclination of the napping occurring during truing, the nappy polishes the plate-shaped body while receiving a large rotational resistance. Therefore, the polishing speed of the plate-shaped body is raised by the rotation resistance of the napkin.

Further, the present invention may be configured such that the relative rotation direction of the truing member and the polishing ball in the truing process is set to the same direction as the rotating direction of the polishing ball just before the truing process.

According to the present invention, the napping of the polishing tool just before the truing process has the property of tilting in the direction of rotation of the polishing tool just before the truing process. In the truing of such a polishing tool, by setting the relative rotation direction of the truing member and the polishing tool in the same direction as the rotating direction of the polishing tool just before the truing process, the directionality imparted to the nappy of the polishing tool at the time of truing is further emphasized can do. That is, since the angle of inclination of the nap each other can be further increased, the rotational resistance of the nap each time polishing is performed after the truing step can be further increased, and the polishing speed of the plate-like body can be greatly increased.

Truing refers to an operation of pressing a working face of a polishing tool against the surface of a truing member such as a diamond grindstone to relatively rotate the truing member and the polishing tool to thereby correct the deviation of the polishing tool action surface, This is the work of modifying the shape of the working surface.

As described above, according to the polishing method of the present invention, since the direction of rotation of the polishing tool is reversed at a predetermined timing, the polishing speed of the plate-like body can be controlled substantially constant.

1 is a bird's-eye view of a glass substrate polishing apparatus according to an embodiment.
2 is a plan view of a main portion of the polishing apparatus shown in Fig.
3 is a longitudinal sectional view for explaining the structure of the polishing machine of the polishing apparatus shown in Fig.
Fig. 4 is a view showing the revolution locus of the polishing tool of the polishing machine shown in Fig. 3; Fig.
5A is a view showing a rotation resistance of a polishing tool against a glass substrate;
5B is a view showing a rotation resistance of a polishing tool with respect to a glass substrate;
5C is a view showing the rotation resistance of the polishing tool with respect to the glass substrate;
5D is a view showing a rotation resistance of a polishing pad against a glass substrate;
6 is a graph showing the relationship between the rotating current value of the motor and the polishing speed.
FIG. 7A is an explanatory view showing a rotation relationship between a polishing tool and a truing member showing a first example in which the polishing rate is increased; FIG.
FIG. 7B is an explanatory view showing a rotation relationship between a polishing member and a truing member, showing a first example in which the polishing rate is increased; FIG.
8 is a graph showing the change in polishing rate when the glass substrate is polished by reversing the torsion bar after truing.
9 is a graph showing the change in polishing rate when the glass substrate is polished without reversing the torsion bars after truing.
10A is an explanatory diagram showing the directionality of fluff by continuous use of a polishing tool
Fig. 10B is an explanatory view showing the directionality of the nap each other by continuous use of the polishing tool
FIG. 10C is an explanatory view showing the directionality of fluff by continuous use of a polishing tool
10D is an explanatory diagram showing the directionality of the nap each other by continuous use of the polishing tool
11A is an explanatory view showing a rotation relationship between a polishing member and a truing member showing a second example of increasing the polishing rate.
Fig. 11B is an explanatory view showing a rotation relationship between the polishing member and the truing member, which shows a second example of increasing the polishing rate. Fig.
12 is a graph showing changes in the polishing speed when the relative rotational direction of the truing member and the polishing tool is set to the same direction as the rotational direction of the polishing tool just before the truing process at the truing step.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a plate-shaped body polishing method according to the present invention will be described with reference to the accompanying drawings.

Fig. 1 shows a bird's-eye view of a polishing apparatus 10 to which a polishing method for a plate-like body according to the embodiment is applied. Fig. 2 is a schematic plan view of the polishing apparatus 10 shown in Fig. 1, and Fig. 2 shows the shape, arrangement position and operation of the polishing tool 12. The polishing apparatus 10 according to the embodiment is configured to continuously transport a glass substrate G for a liquid crystal display having a size of 2200 mm (width) x 2600 mm (length) or more, for example, 12, 12, ...) for continuous grinding of the glass substrate (G).

1, the surface of the glass substrate G to be polished is adsorbed and held on a surface of the adsorbing sheet (not shown) adhered to the table 14 on the opposite side to the surface to be polished, The table 14 is continuously conveyed by the conveying device described below. During the transportation of the table 14, the polishing target surfaces are polished to a desired flatness on the glass substrate G for a liquid crystal display by the polishing openings 12, 12... Of each of a plurality of polishing machines provided above the conveying path. The polished glass substrate G is cleaned by the cleaning device 16.

As shown in Fig. 2, the polishing spots 12, 12 ... have a diameter D smaller than the width W of the glass substrate G and are rotated by a rotation / And the glass substrate G is polished while revolving around a predetermined center of revolution. 2, the circle indicated by the solid line represents the current attitude of the swinging cores 12, 12 ..., and the plurality of circles indicated by the chain double-dashed line indicate that the glass substrate G is in contact with the swinging cores 12, And the edge portion of the contact portion is shown. As can be seen from these figures, the swaging noses 12, 12 ... are revolved around a predetermined revolution center.

12 are arranged in pairs in reference to the moving center line L of the glass substrate G and are disposed in a zigzag shape shifted in position in the moving direction so as to form the swing openings 12, ... are arranged to abrade the glass substrate (G) beyond the movement center line (L).

The continuous type polishing apparatus 10 configured as described above is provided with a plurality of small polishing ports 12 having a diameter D smaller than the width W of the glass substrate G. The polishing spots 12, Are arranged in pairs on the left and right with respect to the moving center line L of the glass substrate G and the glass substrate G is polished by exceeding the center line L of the polishing tips 12, The entire surface of the substrate G can be polished.

3 is a cross-sectional structural view of the abrasive machine 20. Fig. The polishing machine 20 is installed so that the table 14 is lifted.

A pair of guide blocks 22 and 22 are provided below the table 14 and the guide blocks 22 and 22 are arranged on the base 24 And is slidably coupled to a pair of guide rails 26, A rack 28 is fixed along the longitudinal direction of the table 14 and the rack 28 is engaged with the pinion 29 at the center of the lower portion of the table 14. [ The pinion 29 is rotatably supported on the base 24 and connected to an output shaft of a motor (not shown) and rotated by the driving force of the motor. Thereby, the rack 28 is sent to the pinion 29, and the table 14 is transported at a predetermined speed in the X direction shown in Figs. 1 and 2.

The glass substrate G held on the adsorption sheet on the table 14 sequentially passes under the polishers 20, 20 ... by the conveyance of the table 14, Are polished in small amounts by the polishing spots 12, 12 .... Finally, the flatness required for a glass substrate for a liquid crystal display is finally produced. Further, the conveying speed of the table 14 is controlled so as to be changeable depending on the polishing condition. As the polishing tool 12, a foamed polyurethane pad, a suede pad or the like is applied, and the slurry to be supplied at the time of polishing contains glass abrasive such as cerium oxide or zirconium oxide.

The polishing machine 20 is provided above the table 14 and has a main shaft 30 orthogonal to the table 14. [ The main shaft 30 is rotatably supported on the main body casing 34 through bearings 32 and 32 arranged vertically and the main body casing 34 has a pair of posts 36 and 36 As shown in Fig. The pistons 40 of the hydraulic jacks 38 provided on the base 24 are connected to the lower portions of the posts 36 and 36, respectively. Thus, when the pistons 40, 40 are simultaneously expanded and contracted, the main casing 34 is lifted and lowered through the posts 36, 36. Thereby, the polishing head 42 including the polishing tool 12 is moved back and forth in the vertical direction with respect to the table 14. [

On the other hand, the main shaft 30 is provided with an insertion through hole 30A having a central axis O 2 eccentric to the axis O 1 of the main shaft 30 as a central axis. The through hole (30A), the output shaft 44 is inserted through the output shaft 44 through a bearing (46, 46) arranged vertically so as to conform to the its central axis the central axis (O 2) the main shaft (30) As shown in Fig.

A gear 48 is provided on the upper peripheral portion of the main shaft 30. The gear 50 is meshed with the gear 48 and the gear 54 is connected to the gear 50 through the shaft 52. The output gear 58 is engaged with the gear 54 through the idle gear 56 and the output gear 58 is fixed to the motor output shaft 62 of the spare motor 60. The driving force of the motor 60 is reduced through the gears 58, 56, 54, 50 and 48 and transmitted to the main shaft 30 so that the main shaft 30 is rotated at a predetermined rotational speed. When the spindle 30 rotates in this manner, the output shaft 44 revolves around the circumference centered on the central axis O 1 of the main shaft 30. That is, the soft harness 12 to be orbitally moves around the central axis (O 1).

A circular-shaped polishing head 42 is connected to the lower end of the output shaft 44 through a rotary joint 64. The polishing head 42 is composed of an upper platen 66, a polishing platen 68, a polishing tool 12, air springs 70, 70, and the like.

The phase plate 66 is made of stainless steel having high rigidity for the purpose of preventing unevenness. The polishing platen 68 has a high rigidity structure made of cast iron or stainless steel and is connected to the upper platen 66 through air springs 70, 70 .... These air springs 70 are arranged at predetermined intervals on a circumference centered on the axis O 2 of the polishing head 42 and are arranged on the upper surface plate 66, And is connected to an air pump (not shown) through a joint 64. Therefore, when the compressed air from the air pump is supplied to the air springs 70, 70 ... via the rotary joint 64 and the air passage, the air springs 70, 70 ... expand. The spring force of the air springs 70 is transmitted to the polishing spout 12 through the polishing spindle 68 so that polishing pressure is applied to the polishing spout 12. Further, this polishing pressure is adjusted by controlling the air pressure supplied to the air springs 70, 70 ....

The upper end of the output shaft 44 is connected to the output shaft 76 of the motor 74 via the universal joint 72. Therefore, the output shaft 44 rotates about the axis O 2 by the driving force of the motor 74. That is, the polishing tool 12 rotates about the axis O 2 . Further, the output shaft 44, the axial center (O 1), even if the center and orbital movement with the output shaft 44 is so connected to an output shaft 76 of the motor 74 through the universal joint 72, a harness, open (12 ) Rotates without hindrance.

Next, the operation of the polishing machine 20 will be described.

The piston 40 of the hydraulic jack 38 of the polishing machine 20 is expanded and contracted to move the main body casing 34 up and down to adjust the height position of the polishing head 42 with respect to the table 14. [ Then, the amount of air supplied to the air spring 70 is adjusted, and the polishing pressure is set for each of the polishing machines 20, 20 ....

Then, the table 14 is transported in the transport direction. At the same time, the excitation motor 12 and the excitation motor 12 of the grinding machine 20 are driven and the excitation motor 12 is revolved around the axis O 1 as shown in FIG. 4 The glass substrate G transferred from the table 14 is polished while rotating around the axis O 2 .

Since the polishing apparatus 20 polishes the glass substrate G while rotating the polishing tool 12, the glass substrate G is polished by the composite locus of the revolution locus and the rotation locus of the polishing tool 12 . Therefore, according to the continuous polishing apparatus 10 constructed by arranging a plurality of the polishing machines 20 in parallel, the polishing efficiency can be improved without raising the revolution speed of the polishing tool 12. Further, since the polishing pressure of the polishing tool 12 does not need to be raised more than necessary, the flatness of the polishing surface of the glass substrate G is also improved.

However, in the conventional polishing apparatus, since the rotation direction of the polishing tool is set to either the clockwise direction or the counterclockwise direction, the polishing rate of the glass substrate decreases with the lapse of the polishing time. If the polishing rate is below a predetermined threshold value, the polishing pad is trued. Further, in the conventional polishing apparatus, even when there is no necessity of torsion tugging, the polishing rate is lowered with the lapse of the polishing time, so that the continuous polishing can not be carried out with a substantially constant polishing rate.

The polishing apparatus 10 of the embodiment is intended to solve the drawbacks of the conventional polishing apparatus and polish the glass substrate by controlling the polishing rate to be substantially constant. That is, in the polishing method using the polishing apparatus 10 according to the embodiment, the rotating direction of the polishing tool 12 is reversed at a predetermined timing.

The reason why the polishing speed can be controlled to be substantially constant by reversing the polishing tool 12 will be described.

As shown in FIG. 5A, when the polishing tool 12 is macroscopically considered and separated into a soft base (hard portion) 12A and a fluff (soft portion) 12B, The nappy 12B to be actually polished has a directionality by polishing, truing, or the like. That is, as shown in FIG. 5B, the nappy 12B is inclined in a direction opposite to the grinding direction when viewed in the direction of the glass substrate G from the polishing tool. If polishing is continued in such a directional state, the rotation resistance of the nap each other with respect to the glass substrate G is lowered, so that the polishing rate is lowered with the lapse of the polishing time. Therefore, when the rotational resistance of the nap 12B with respect to the glass substrate G becomes less than the predetermined value, that is, when the nap 12B can not satisfactorily perform polishing, Inverts the direction of rotation. The napkin 12B has a directional direction opposite to the inversion direction as shown in FIG. 5C, and this time, the glass substrate G is polished while receiving resistance increases from the glass substrate G. As shown in FIG. 5D, the nappy 12B attempts to change its direction in the final reversed direction. During the polishing in which the nappy 12B is subjected to a predetermined rotational resistance, the rotational resistance of the nappy 12B becomes a predetermined value During the excess polishing, the polishing speed is raised by the rotation resistance of the napkin 12B.

Based on this verification result, in the polishing method of the embodiment, when the rotational resistance of the polishing tool 12 with respect to the glass substrate G becomes equal to or less than the predetermined resistance, the rotational direction of the polishing tool 12 is rotated forward normal rotation) and reverse. The polishing rate is gradually lowered. When the rotational resistance of the polishing tool 12 becomes a predetermined value or less, the polishing tool 12 is rotated again Reverse the polishing rate. By repeating the reversal of the polishing tool 12 based on the rotational resistance of the polishing tool 12 received from the glass substrate G in this way, the polishing rate is not significantly increased or decreased, .

6, the load current value of the motor 74 (see FIG. 3) for rotating the polishing tool 12 is set to a predetermined value (TH value ), The direction of rotation of the polishing tool 12 is reversed. That is, the polishing apparatus 10 of the embodiment has a control section for reversing the rotating direction of the polishing tool 12 when the load current value of the motor 74 (see FIG. 3) becomes a predetermined value (TH value) . The polishing speed may be directly measured during polishing of the glass substrate G and the rotation direction of the polishing tool 12 may be reversed based on the polishing speed. However, directly measuring the polishing speed during polishing of the glass substrate G It is difficult to measure the value of the rotation current of the motor 74 which is correlated with the polishing speed, and the polishing tool 12 is inverted based on the current value.

6, the axis of abscissa is time axis, and the axis of ordinate on the right side represents the value of the rotation current of motor 74. Fig. This value of the rotating electric current is also referred to as a load current value since it may fluctuate depending on the state of the load when the motor is driven with a predetermined voltage. The left ordinate indicates the polishing rate (unit: mu m / min). 6, the threshold value of the rotating current value for switching the rotation direction of the motor 74 is set to a predetermined lower limit value (TH value in the figure).

The threshold value of the rotating current value is preferably a current value that is 65% of the rotating current value immediately after the inversion. A current value of 70% is more preferable, and a current value of 80% is particularly preferable.

When the direction of rotation of the polishing tool is inverted every predetermined time, it is possible to set the interval for inverting the shortest time required from the time immediately after the reversal to the threshold value of the rotating current value. By setting the inversion time in this manner, the polishing rate can be made substantially constant even if there is a difference in the time required from the time immediately after the inversion until the threshold value of the rotating current value becomes equal to the threshold value.

In this experiment, the rotation speed, the revolving speed, the pressure of the polishing tool 12 to the glass substrate G, and the slurry supply amount were set to predetermined values, respectively.

As shown in FIG. 6, in the present invention, the motor drive control is set so that the motor 74 reverses from forward rotation to reverse rotation and reverse rotation to forward rotation when the rotation current value becomes less than the TH value. As a result, as shown in the graph of FIG. 6, the value of the rotating current (polishing rate) increases and the value of the rotating current (polishing rate) decreases with the lapse of the polishing time. When the rotating electric current is again lower than the TH value, the motor 74 is reversed, so that the rotating electric current value (polishing speed) rises again. Thus, the value of the rotating current has a positive correlation with the polishing rate. Then, a threshold value (TH value) of the rotating current value that can be directly controlled is set, and the direction of rotation of the drill bit 12 by the motor 74 is reversed based on the threshold value. With this configuration, the degree of vertical variation (bar graph) of the polishing rate shown in Fig. 6 can be suppressed, and the polishing can be performed by controlling the polishing rate substantially constant.

Further, according to the polishing method of the embodiment, the above-described control unit also controls the motor 60 so that the revolving direction of the polishing tool 12 is reversed and the revolving direction of the polishing tool 12 is also reversed. In the case of a device for rotating and revolving the polishing tool 12 as in the case of the polishing machine 20 of the embodiment, the torque for rotating the rotation axis (the output shaft 44: see FIG. 3) 3), it is preferable to reverse the revolving direction simultaneously with the reversal of the rotating direction.

In the embodiment, the continuous polishing apparatus 10 in which a plurality of polishing machines 20 are provided is described. However, the polishing method of the present invention may be applied to a polishing apparatus composed of one polishing machine 20, The polishing apparatus 20 according to the present invention may be applied to a polishing apparatus in which the polishing tool 12 only rotates.

In the above embodiment, the example in which the rotation direction of the polishing tool 12 and the revolution direction are reversed at a predetermined timing to control the polishing speed of the glass substrate G to be substantially constant has been described. On the other hand, in the truing of the polishing tool 12 which is performed regularly, the direction of rotation of the polishing tool 12 immediately after the truing and the direction of rotation of the polishing tool 12 just before the truing are observed, The polishing rate can be increased.

That is, the polishing method of the embodiment has a truing step. The truing process is a process in which the truing member 12 is pressed against the truing member 80 and the truing member 12 and the truing member 80 are rotated or rotated relative to each other And the shape of the polishing tool 12 is corrected. 7A, although the truing is performed by rotating or tilting the polishing tool 12 in the direction of the arrow A with respect to the fixed truing member 80, the truing member 12 is fixed, The rotating shaft 80 may rotate or rotate, and both the swinging member 12 and the truing member 80 may be rotated. As the truing member 80, a diamond grindstone having a disc shape or a rectangular shape can be exemplified.

As an example of increasing the polishing speed, the direction of rotation indicated by the arrow B of the polishing tool 12 at the time of polishing the glass substrate G, which is performed after the truing step, as shown in Fig. 7B, Is set in the reverse direction with respect to the rotation direction indicated by the arrow (A).

The polishing tool 12 is trued regularly by the truing member 80 at the time of polishing of the glass substrate G but at the time of polishing the glass substrate G to be performed after the truing step, Is set in the reverse direction with respect to the rotating direction at the truing step.

7A, the nappy 12B of the polishing tool 12 at the time of truing is moved from the upstream side in the truing direction to the downstream side in the truing direction by the relative rotation of the truing mouth 12 and the truing member 80 (Inclination angle [theta] 2 ) toward the rear surface of the substrate. Therefore, the glass substrate G is polished by rotating the polishing tool 12 in the opposite direction with respect to the inclination direction of the nap 12B generated during truing. As a result, the nappy 12B polishes the glass substrate G while receiving a large rotational resistance as shown in Fig. 7B. Therefore, the polishing speed of the glass substrate G is raised by the rotation resistance of the napkin 12B.

8 will be described in detail with reference to a graph shown in FIG. 8 schematically.

The abscissa (t) of the graph in FIG. 8 is the time axis, and the left ordinate represents the polishing rate (unit: μm / minute). As shown in the graph, the glass substrate G is polished by repeatedly rotating and inverting the polishing tool 12 at the timing A of the polishing step, and the truing of the polishing tool 12 is performed as shown in FIG. 7A Conduct. Thereafter, as shown in Fig. 7B, the rotating direction of the polishing tool 12 is set in the reverse direction with respect to the direction of truing, and the polishing of the glass substrate G is continued. As shown in the graph of Fig. 8, it can be seen that the peak value (a) of the polishing rate after truing greatly increases with respect to the peak value (b) of the polishing rate by the normal forward and reverse operations.

A comparative example will be described using the graph of Fig.

In this comparative example, the rotating direction of the truing swag 12 is the same as the rotating direction of the swirling vortex 12 immediately after truing. According to this comparative example, the peak value of the polishing rate immediately after the truing rises from the b value to the c value due to the modification of the shape of the polishing tool 12 due to the truing of the timing (A) Value-b value) is smaller than the ascending amount (a value-b value) of the embodiment shown in Fig.

However, in the embodiment of Figs. 7A and 7B, a great effect can be obtained in a state where the polishing tool 12 is new or immediately after the dressing. However, if the polishing tool 12 is continuously used for a long time, the direction of the nap 12B returned to the polishing can not be sufficiently restored by truing, and the polishing rate can not be increased significantly.

10A, when tilting, the polishing tool 12 is rotated in the direction of the arrow A, and at the time of polishing immediately after the polishing, the polishing tool 12 is moved in the direction of arrow B ) Direction. When polishing is continued in this state, the napkin 12B of the polishing tool 12 is inclined along the polishing direction as shown in Fig. 10C, and as a result, the polishing rate is lowered. 10D, even if the truing is performed in the direction of the arrow A thereafter, the direction of the nappy 12B returned to the polishing can not be returned to the state as shown in Fig. 10A. Therefore, it is impossible to increase the polishing rate of polishing performed immediately thereafter.

In this case, the relative rotating direction of the truing member and the swarf 12 is set to the same direction as the rotating direction of the swarf 12 immediately before the truing process at the truing step.

The nappy 12B of the polishing tool 12 just before the truing process has a tilting characteristic in the rotating direction of the polishing tool 12 just before the truing process. In the truing of the swarf 12, by setting the relative rotating direction of the truing member and the swarf 12 to the same direction as the rotating direction of the swarf 12 immediately before the truing process, It is possible to further emphasize the directionality imparted to the nappy 12B by the bristle 12. That is, as shown in Fig. 11A, since the tilt angle? 1 of the nappy 12B can be made larger than the tilt angle? 2 shown in Fig. 7A, The rotation resistance of the napkin 12B can be further increased. Therefore, the polishing rate of the glass substrate G can be greatly increased.

11A, the truing direction is indicated by an arrow B and the polishing direction is indicated by an arrow A in Fig. 11B. That is, an example is shown in which the truing direction is reversed with respect to Figs. 7A and 7B and Figs. 10A to 10D, and the direction of rotation of the swing 12 is also reversed.

12 will be described in detail with reference to a graph shown in FIG. 12 schematically.

The abscissa (t) in the graph of Fig. 12 is the time axis, and the ordinate on the left represents the polishing rate (unit: mu m / minute). As shown in the graph, the glass substrate G is polished by repeating forward rotation and reverse rotation of the polishing tool 12, and the truing shown in Fig. 7A is performed at the timings (A) and (B) do. At the subsequent timing (C), after the truing shown in Fig. 11A is performed, the polishing tool 12 is reversed as shown in Fig. 11B to continue polishing. As a result, as shown in the graph of Fig. 12, it can be seen that the peak value d of the polishing rate after truing in Fig. 11A greatly increases with respect to the immediately preceding polishing rate value e. The truing performed at the timings (D) and (E) thereafter is the truing shown in Figs. 7A and 7B. That is, the truing shown in Fig. 11A may be performed at every truing, but it is preferable to perform the truing intermittently when the polishing rate is lower than the predetermined value, or when necessary.

While the present application has been described in detail with reference to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. The present application is based on Japanese Patent Application (Japanese Patent Application No. 2009-135108) filed on June 4, 2009, the contents of which are incorporated herein by reference.

The object to be polished by the plate-shaped polishing apparatus of the present invention is not limited to the glass substrate for FPD, and may be a general glass plate such as a building material or mirror, or a metal plate-like body.

10 ... Abrasive device
12 ... Open mouth
12A ... Wound ball base
12B ... fluff
14 ... table
16 ... Cleaning device
20 ... Grinding machine
22 ... Guide block
24 ... Base
28 ... Rack
29 ... Pinion
30 ... principal axis
32 ... bearing
34 ... Body casing
36 ... Post
38 ... Hydraulic jack
40 ... piston
42 ... Polishing head
44 ... Output shaft
46 ... bearing
48 ... Gear
50 ... Gear
52 ... shaft
54 ... Gear
56 ... Idle gear
58 ... Output gear
60 ... Ball motor
62 ... Motor output shaft
64 ... Rotary joint
66 ... Upper plate
70 ... Air spring
72 ... Universal joint
74 ... Self-propelled motor
76 ... Output shaft
80 ... Truing member

Claims (7)

A method of polishing a plate-shaped body by moving a plate-shaped body in a predetermined direction and polishing the plate-
A polishing step of reversing the direction of rotation of the polishing tool at a predetermined timing,
A truing process for pressing the truing member against the truing member and relatively rotating the truching and truing member to correct the shape of the truching unit
Respectively,
The direction of rotation of the polishing tool in the polishing step performed after the truing step is set to be opposite to the relative rotation direction of the polishing tool viewed from the truing element in the truing step,
The relative rotation direction of the polishing tool viewed from the truing member at the time of the truing process is set to be the same direction as the rotation direction of the polishing tool at the time of the polishing process just before the truing process A method of polishing a plate - like body. The polishing method according to claim 1, wherein the rotating direction of the polishing tool in the polishing step is repeatedly reversed at a predetermined cycle. The polishing apparatus according to claim 1, wherein a lower limit value relating to a load current value of a motor for rotating the polishing tool in the polishing step is determined in advance, a change in the load current is monitored during polishing, and the load current value reaches a lower limit value And reversing the direction of rotation of the polishing tool at one timing. The polishing method according to claim 1 or 2, wherein the polishing tool in the polishing step is revolving around a predetermined revolution center, and the revolving direction is reversed at the same time when the revolution direction is reversed. The polishing method according to any one of claims 1 to 3, wherein a plurality of the polishing balls in the polishing step are arranged along the moving direction of the plate-shaped body.

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KR1020117028925A 2009-06-04 2010-06-01 Method for grinding plate-like body KR101616595B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-135108 2009-06-04
JP2009135108 2009-06-04

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CN102458766A (en) 2012-05-16
TW201107077A (en) 2011-03-01
JP5527622B2 (en) 2014-06-18
JPWO2010140595A1 (en) 2012-11-22
CN102458766B (en) 2014-04-02
WO2010140595A1 (en) 2010-12-09

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