JP4862404B2 - Method and apparatus for polishing glass substrate for FPD - Google Patents

Method and apparatus for polishing glass substrate for FPD Download PDF

Info

Publication number
JP4862404B2
JP4862404B2 JP2006012772A JP2006012772A JP4862404B2 JP 4862404 B2 JP4862404 B2 JP 4862404B2 JP 2006012772 A JP2006012772 A JP 2006012772A JP 2006012772 A JP2006012772 A JP 2006012772A JP 4862404 B2 JP4862404 B2 JP 4862404B2
Authority
JP
Japan
Prior art keywords
glass substrate
polishing
fpd
mm
circular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006012772A
Other languages
Japanese (ja)
Other versions
JP2007190657A (en
Inventor
康成 生田
健雄 鈴木
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to JP2006012772A priority Critical patent/JP4862404B2/en
Publication of JP2007190657A publication Critical patent/JP2007190657A/en
Application granted granted Critical
Publication of JP4862404B2 publication Critical patent/JP4862404B2/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • B24B7/244Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass continuous
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/247Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass using reciprocating grinding tools

Description

  TECHNICAL FIELD The present invention relates to a plate-like body polishing method and apparatus, and more particularly to a plate-like polishing method for polishing a glass substrate for an FPD (Flat Panel Display) used for a liquid crystal display or the like by a continuous polishing apparatus and the like. Relates to the device.

  In particular, a glass substrate for an FPD (Flat Panel Display) used for a liquid crystal display or the like is formed by forming a molten glass into a plate shape by a glass manufacturing method called a float process, and this is disclosed in Patent Document 1 or the like. By polishing and removing fine irregularities and undulations on the surface with a polishing apparatus of the type, it is manufactured into a thin plate shape with a thickness of 0.4 to 1.1 mm that satisfies the flatness required for a glass substrate for liquid crystal display .

  In such a continuous polishing apparatus, as described in Patent Document 1, it is common to polish the entire width of the glass substrate at once with a polishing tool having a diameter larger than the width of the glass substrate and rotating and revolving. Has been done.

FIG. 5 is an explanatory view showing a state in which the glass substrate G is polished by a conventional continuous polishing apparatus. The glass substrate G is held by suction on the suction sheet 1 bonded to a table (not shown), and the surface opposite to the surface to be polished is sucked and held continuously by a transport device (not shown) as indicated by an arrow A in the figure. Then, the surface to be polished is polished by the polishing tools 2 and 3 of the polishing machine installed above the conveyance path. As shown in the figure, the polishing tools 2 and 3 have a diameter larger than the width of the glass substrate G, are rotated around a predetermined rotation center by a rotation / revolution mechanism (not shown), and have a predetermined revolution. The entire width of the glass substrate G is polished at once while revolving around the center. In FIG. 5, circles indicated by solid lines indicate the current postures of the polishing tools 2 and 3, and many circles indicated by two-dot chain lines indicate that the glass substrate G is in contact with the polishing tools 2 and 3. The edge of the part is shown. As can be seen from these circles, the polishing tools 2 and 3 are revolved around a predetermined revolution center.
JP 2001-293656 A

  However, the continuous polishing apparatus shown in Patent Document 1 and FIG. 5 is good for polishing a glass substrate having a small size, but it is difficult to cope with polishing a glass substrate having a large size exceeding 2200 mm in width, for example. . Because, when trying to polish such a large-sized glass substrate, the size of the polishing tool (about φ2400 mm) becomes too large, so it is necessary to secure the polishing tool material, maintain the polishing apparatus and polishing tool processing assembly accuracy, replacement work, This is because a problem occurs in handling and maintenance of polishing accuracy.

  This invention is made | formed in view of such a situation, and it aims at providing the grinding | polishing method and apparatus of a plate-shaped body which can grind | polish a large sized plate-shaped body accurately.

In order to achieve the above object, the method invention according to claim 1 continuously polishes the glass substrate for FPD with a plurality of rotating and revolving circular polishing tools while moving the glass substrate for FPD in a predetermined direction. in the glass substrate polishing method for FPD, the circular polishing tool diameter is smaller than the width of the glass substrate for the FPD, while arranged in pairs relative to the moving center line of the glass substrate for the FPD, the circular polishing tool, the radius of revolution R is set to 50 mm ≦ R ≦ 100 mm, along said direction of movement of the glass substrate for FPD at least staggered in two pairs placed, before Kien shaped grinding tool exceeds the moving center line The glass substrate for FPD is polished.

In order to achieve the above object, the apparatus invention according to claim 5 continuously polishes the glass substrate for FPD with a plurality of rotating and revolving circular polishing tools while moving the glass substrate for FPD in a predetermined direction. in the polishing apparatus for a glass substrate for FPD, the diameter of the circular polishing tool, along with being set smaller than the width of the glass substrate for the FPD, they are arranged in pairs relative to the moving center line of the glass substrate for the FPD The revolution radius R of the circular polishing tool is set to 50 mm ≦ R ≦ 100 mm, and two pairs of the circular polishing tools are arranged in a staggered manner along the moving direction of the glass substrate for FPD. The glass substrate for FPD is polished beyond the center line.

According to the first and fifth aspects of the invention, instead of using one large polishing tool, a plurality of small circular polishing tools having a diameter smaller than the width of the glass substrate for FPD are arranged, and these circular polishing tools are arranged. The polishing tool is arranged in pairs with respect to the movement center line of the FPD glass substrate , and the circular polishing tool polishes the FPD glass substrate beyond the center line, so that the entire polishing surface of the FPD glass substrate is obtained. To polish. Further, according to the present invention, since the diameter of the polishing tool is reduced, it is possible to solve problems such as securing the polishing tool material, maintaining the polishing apparatus and polishing tool processing and assembly accuracy, exchanging work, handling and maintaining the polishing accuracy. it can.

According to invention of Claim 1 , 5 , the arrangement | sequence of a circular polishing tool makes a pair with respect to the movement centerline of the glass substrate for FPD, and arrange | positions in parallel at equal intervals. Further, circular polishing tools may be arranged in a staggered manner in the moving direction of the glass substrate for FPD, for example, and may be arranged in parallel at the same position. It is preferable in that it has a large degree of freedom.

Method invention according to claim 2, Oite to claim 1, wherein the circular polishing tool, the overhang A from the FPD glass substrate one end of the FPD glass substrate moving direction during polishing, 20 mm ≦ A ≦ 250 mm is set, and the glass substrate for FPD is polished.

The apparatus invention described in claim 6 is the apparatus according to claim 5 , wherein the circular polishing tool is set such that an overhang amount A from one end of the FPD glass substrate in the moving direction of the FPD glass substrate is 20 mm ≦ A ≦ 250 mm. It is characterized by being.

According to the inventions of claims 2 and 6 , since the edge of the glass substrate for FPD is usually not chamfered, if the overhang amount A of the polishing tool is less than 20 mm, the edge is easily damaged, and the edge When the hang amount A exceeds 250 mm, the polishing tool tends to tilt and it may be difficult to polish uniformly. In order to improve this point, the overhang amount A is preferably 20 mm ≦ A ≦ 250 mm.

According to the inventions described in claims 1 and 5 , when the revolution radius R is less than 50 mm, the change in the direction of synthesis of the revolution of the polishing tool increases, and the polishing pattern attached to the FPD glass substrate may be noticeable. is there. Further, if the revolution radius R exceeds 100 mm, the support device becomes large, so that rigidity is required and an initial cost is required. In addition, the device may easily vibrate. Accordingly, the revolution radius R is preferably 50 ≦ R ≦ 100 mm.

According to a third aspect of the present invention, there is provided a method invention according to any one of the first and second aspects, wherein one of the circular polishing tools and the other of the circular polishing tools arranged in pairs with respect to the movement center line of the FPD glass substrate . The overlapping amount at the time of polishing is at least 100 mm or more, and when the minimum value of the protruding amount from the moving center line at the time of polishing of the circular polishing tool is B and the maximum value is C, 25 mm ≦ B ≦ 100 mm, The glass substrate for FPD is polished under the condition of 175 mm ≦ C ≦ 250 mm.

According to a seventh aspect of the present invention, there is provided an apparatus invention according to any one of the fifth and sixth aspects, wherein one circular polishing tool and the other circular polishing tool arranged in pairs with respect to the movement center line of the FPD glass substrate . The overlapping amount at the time of polishing is at least 100 mm or more, and when the minimum value of the protruding amount from the moving center line at the time of polishing of the circular polishing tool is B and the maximum value is C, 25 mm ≦ B ≦ 100 mm, The condition is that 175 mm ≦ C ≦ 250 mm.

By the way, in the polishing method and the polishing apparatus of the present invention, a part of the vicinity including the center line in the moving direction of the glass substrate for FPD is polished by a plurality of polishing tools arranged across the moving center line. In some cases, uneven polishing may occur at the joints (edges) of the respective polishing tools. Therefore, in order to suppress polishing unevenness at the seam, it is preferable to optimize the part (referred to as a polymerization polishing portion), whereby high-precision polishing of a large FPD glass substrate can be achieved.

Further, in the inventions according to claims 3 and 7 , the overlapping amount at the time of polishing between one circular polishing tool and the other circular polishing tool, that is, the overlapping polishing portion is set to at least 100 mm or more, and circular polishing is performed. When the minimum value of the amount of protrusion from the moving center line during polishing of the tool is B and the maximum value is C, 25 mm ≦ B ≦ 100 mm and 175 mm ≦ C ≦ 250 mm are set. When the polymerized polishing portion is less than 100 mm, when B is less than 25 or more than 100 mm, and when C is less than 175 mm or more than 250 mm, polishing unevenness may occur.

According to a fourth aspect of the present invention, in the first to third aspects, the FPD glass substrate is polished by setting the polishing pressure of the circular polishing tool from the center of the circular polishing tool to the outer periphery. .

The apparatus invention according to claim 8 is characterized in that, in claims 5 to 7 , the polishing pressure of the circular polishing tool is set to be divided from the center of the circular polishing tool to the outer periphery.

In the inventions described in claims 4 and 8 , a plurality of air springs serving as a polishing pressure generator are built in the polishing tool, and the air springs are divided into three in the circumferential direction: inner, intermediate, and outer. Then, the polishing pressure is divided and controlled in the circumferential direction by setting different air pressures for the respective air springs. As a result, it is possible to perform uniform polishing without changing the position of the polishing tool mainly by adjusting the polishing pressure outside the polishing tool. Furthermore, both the adjustment of the polishing pressure and the position adjustment of the polishing tool can be performed. By carrying out, the setting of the polishing conditions can be performed more finely.

  According to the polishing method and apparatus for a plate-like body according to the present invention, a plurality of small circular polishing tools having a diameter smaller than the width of the plate-like body are arranged, and these circular polishing tools are moved along the moving center line of the plate-like body. Are arranged in pairs, and the entire surface of the plate-like body can be polished by the circular polishing tool polishing the plate-like body beyond the center line. Further, according to the present invention, since the diameter of the polishing tool is reduced, problems such as securing the polishing tool material, maintaining the polishing apparatus and the processing and assembly accuracy of the polishing tool, replacement work, and handling can be solved. Polishing accuracy can be improved.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method and apparatus for polishing a plate-like body comprising a glass substrate according to the present invention will be described in detail below with reference to the accompanying drawings.

  FIG. 1 shows a plan view of a polishing apparatus 10 according to the embodiment. FIG. 1 also shows the contents relating to the shape, arrangement, and operation of the polishing tool 12 in the continuous polishing apparatus 10 for a liquid crystal glass substrate G having a size of 2200 mm (width) × 2600 mm (length) or more.

  According to FIG. 1, the glass substrate G to be polished is held on the suction sheet 12 adhered to a table (not shown) by suction to hold the surface opposite to the surface to be polished, as shown by the arrow X in the figure. It is continuously conveyed by the illustrated conveying device. And the surface to be polished is polished to the flatness required for the glass substrate for a liquid crystal display by a plurality of circular polishing tools 14, 14... Of a polishing machine installed above the transfer path during transfer.

  As shown in the figure, the circular polishing tools 14, 14... Are configured with a diameter D smaller than the width W of the glass substrate G, and are rotated around a predetermined rotation center by a rotation / revolution mechanism (not shown). At the same time, the glass substrate G is polished while being revolved around a predetermined revolution center. In FIG. 1, circles indicated by solid lines indicate the current postures of the polishing tools 14, 14..., And many circles indicated by two-dot chain lines indicate that the glass substrate G is the polishing tools 14, 14. The edge part of the contact part is shown. As can be seen from these circles, the polishing tools 14, 14... Are revolved around a predetermined revolution center.

  Further, the polishing tools 14, 14... Are arranged in pairs with respect to the movement center line L of the glass substrate G, and are arranged in a staggered manner in which the positions are shifted in the movement direction, and the circular polishing tools 14, 14. Is disposed so as to polish the glass substrate G beyond the moving center line L.

  According to the polishing apparatus 10 configured in this way, a single large polishing tool is not used, but a plurality of small circular polishing tools 14 having a diameter D smaller than the width W of the glass substrate G are arranged. Are arranged in pairs on the left and right with respect to the movement center line L of the glass substrate G, and the circular polishing tools 14, 14... Polish the glass substrate G beyond the center line L. As a result, the entire surface of the glass substrate G can be polished.

  Further, according to the polishing apparatus 10, since the polishing tool 14 is reduced in size and diameter, problems such as securing the material of the polishing tool 14, maintaining processing and assembly accuracy, replacement work, and handling can be solved. Further, since the circular polishing tools 14, 14... Are arranged at least in a staggered manner along the moving direction of the glass substrate G, the plate-like body can be polished evenly and accurately.

  By the way, the polishing tool 14 of the embodiment has a problem due to an increase in the size of the polishing tool 14 (problems in securing the polishing tool material, maintaining the polishing apparatus and polishing tool processing and assembly accuracy, replacement work, handling, and maintaining the polishing accuracy). , And restrictions (general door size width is 1800 mm, container width is 2250 mm, material general-purpose size is 1800 mm).

  As an example, the width of the glass substrate G is 2200 mm, the size of the polishing tool 14 is φ1290 mm, the revolution radius is 75 mm, and the revolution center is a position 600 mm away from the moving center line L in the right and left directions.

  In the above specification, in the polishing apparatus 10 of the embodiment, the overhang amount A from one end of the glass substrate G at the time of polishing the circular polishing tool 14 is set to 20 mm ≦ A ≦ 250 mm as shown in FIG.

  Since the edge of the glass substrate G to be polished is usually not chamfered, the edge tends to be damaged when the overhang amount A of the polishing tool 14 is less than 20 mm, and the polishing tool when the overhang amount A exceeds 250 mm. 14 tends to tilt, and uniform polishing may be difficult. Therefore, it is preferable to set the overhang amount A in a range of 20 mm ≦ A ≦ 250 mm.

  Furthermore, in the above specifications, the revolution radius R of the polishing tool 14 is set to 50 mm ≦ R ≦ 100 mm as shown in FIG.

  When the revolution radius R is less than 50 mm, the change in the direction of rotation of the polishing tool 14 is increased, and the polishing pattern on the glass substrate G may be noticeable. On the other hand, when the revolution radius R exceeds 100 mm, the support device becomes large and rigidity is required. In addition, the device may easily vibrate. Thereby, it is preferable to set the revolution radius R to 50 ≦ R ≦ 100 mm.

  Furthermore, in the above specifications, the overlap amount P during polishing between one circular polishing tool 14 and the other circular polishing tool 14 arranged in pairs with respect to the movement center line L of the glass substrate G as shown in FIG. Is at least 100 mm, and when the minimum value of the protruding amount from the moving center line L during polishing of the polishing tool 14 is B and the maximum value is C, 25 mm ≦ B ≦ 100 mm, 175 mm ≦ C ≦ 250 mm A certain condition is set.

  In the polishing apparatus 10 according to the embodiment, four polishing tools in which a part of the vicinity including the center line in the moving direction of the glass substrate G is arranged in a staggered manner with the moving center line L interposed therebetween. 14, 14..., So that polishing unevenness may occur at the joints (edges) of the respective polishing tools 14, 14. Therefore, in order to suppress polishing unevenness at the seam, it is preferable to optimize the part (polymerization polishing portion), and thereby, the large glass substrate G can be polished with high accuracy.

Therefore, the polishing apparatus 10 of the embodiment sets the overlap amount at the time of polishing between one polishing tool 14 and the other circular polishing tool 14 as shown in FIG. 4, that is, the overlap polishing portion is set to at least 100 mm or more, and When the minimum value of the amount of protrusion from the movement center line L during polishing of the polishing tool 14 is B and the maximum value is C, 25 mm ≦ B ≦ 100 mm and 175 mm ≦ C ≦ 250 mm are set.

This causes uneven polishing when the polymerized polishing portion is less than 100 mm, when B is less than 25 or more than 100 mm, and when C is less than 175 mm or more than 250 mm.

  Further, the polishing tool 14 includes a plurality of air springs serving as polishing pressure generators, and the air spring is divided into an inner side, an intermediate side, and an outer side in the outer circumferential direction from the center of the polishing tool. And by setting different air pressure to each air spring, the polishing pressure is divided and controlled from the center of the polishing tool to the outer peripheral direction. Thereby, it is possible to perform uniform polishing without changing the position of the polishing tool mainly by adjusting the polishing pressure outside the polishing tool, and both the adjustment of the polishing pressure and the position adjustment of the polishing tool 14 are possible. By carrying out the above, the polishing conditions can be set more finely.

  In the polishing apparatus 10 of the embodiment, the example in which the polishing tools 14 are arranged in two rows in the glass substrate width direction has been described. Theoretically, the polishing tools 14 are distributed in three rows or more in the glass substrate width direction. It is also possible. However, it is easier to ensure polishing quality by minimizing the number of polishing seams by a plurality of polishing tools 14, 14... And the number of polishing heads (polishing surface plates) to which the polishing tools are attached is also reduced. As a result, two rows are advantageous as in the embodiment.

  Further, as a method of adjusting the arrangement distance of the polishing tools 14, 14, a spindle motor mounting seat for driving the polishing tool 14 is made a slidable structure, and this is pushed and pulled by a moving device such as a jack bolt or a ball screw. Position. When the polishing allowance of the seam is too large, the gap between the polishing tools 14 and 14 is widened, and when the polishing allowance is too small, the gap between the polishing tools 14 and 14 is narrowed to make the glass substrate width direction uniform. Can be polished.

  The plate-like polishing apparatus of the present invention can also be applied to general glass plates for building materials and mirrors, and can be applied regardless of the material of the plate-like body such as metal.

Plan view of glass substrate polishing apparatus of embodiment Explanatory drawing which showed the arrangement | positioning relationship of the polishing tool in the glass substrate polishing apparatus shown in FIG. Explanatory drawing which showed the revolution radius of the polishing tool in the glass substrate polishing apparatus shown in FIG. Explanatory drawing which showed the arrangement | positioning relationship of the polishing tool in the glass substrate polishing apparatus shown in FIG. Plan view showing a conventional glass substrate polishing apparatus

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Polishing apparatus, 12 ... Adsorption sheet, 14 ... Polishing tool, G ... Glass substrate

Claims (8)

  1. In the method for polishing an FPD glass substrate , the FPD glass substrate is continuously polished by a plurality of rotating and revolving circular polishing tools while moving the FPD glass substrate in a predetermined direction.
    It said circular polishing tool diameter is smaller than the width of the glass substrate for the FPD, while arranged in pairs relative to the moving center line of the glass substrate for the FPD,
    The circular polishing tool has its revolution radius R set to 50 mm ≦ R ≦ 100 mm, and is arranged in two pairs at least in a staggered manner along the moving direction of the glass substrate for FPD,
    Polishing method of a glass substrate for FPD, wherein the pre-Kien type polishing tool to polish a glass substrate for the FPD beyond the moving center line.
  2. 2. The circular polishing tool polishes an FPD glass substrate by setting an overhang amount A from one end of the FPD glass substrate in the direction of movement of the FPD glass substrate during polishing to 20 mm ≦ A ≦ 250 mm. A method for polishing a glass substrate for FPD as described in 1 above.
  3. The overlap amount at the time of polishing between one circular polishing tool and the other circular polishing tool arranged in pairs with respect to the moving center line of the glass substrate for FPD is at least 100 mm or more, and the circular polishing The FPD glass substrate is polished under the conditions of 25 mm ≦ B ≦ 100 mm and 175 mm ≦ C ≦ 250 mm, where B is the minimum value of the amount of protrusion from the moving center line during polishing of the tool, and C is the maximum value. Item 3. A method for polishing an FPD glass substrate according to Item 1 or 2.
  4. 4. The method for polishing an FPD glass substrate according to claim 1, wherein the FPD glass substrate is polished by setting the polishing pressure of the circular polishing tool in a circumferential direction from the center of the circular polishing tool. 5.
  5. In a polishing apparatus for an FPD glass substrate that continuously polishes an FPD glass substrate with a plurality of rotating and revolving circular polishing tools while moving the FPD glass substrate in a predetermined direction,
    The diameter of the circular polishing tool is set smaller than the width of the glass substrate for FPD, and is arranged in pairs with respect to the movement center line of the glass substrate for FPD,
    The revolution radius R of the circular polishing tool is set to 50 mm ≦ R ≦ 100 mm, and the circular polishing tools are arranged in at least two staggered forms along the moving direction of the glass substrate for FPD. An apparatus for polishing an FPD glass substrate, wherein the FPD glass substrate is polished beyond a center line.
  6. 6. The polishing of a glass substrate for FPD according to claim 5, wherein the circular polishing tool has an overhang amount A from one end of the glass substrate for FPD in the moving direction of the glass substrate for FPD set to 20 mm ≦ A ≦ 250 mm. apparatus.
  7. The overlap amount at the time of polishing between one circular polishing tool and the other circular polishing tool arranged in pairs with respect to the moving center line of the glass substrate for FPD is at least 100 mm or more, and the circular polishing The condition is set such that 25 mm ≦ B ≦ 100 mm and 175 mm ≦ C ≦ 250 mm, where B is the minimum value of the amount of protrusion from the moving center line during polishing of the tool, and C is the maximum value. 7. A polishing apparatus for a glass substrate for FPD as described in 6.
  8. The polishing apparatus for a glass substrate for FPD according to claim 5, 6 or 7, wherein the polishing pressure of the circular polishing tool is set to be divided from the center of the circular polishing tool to the outer peripheral direction.
JP2006012772A 2006-01-20 2006-01-20 Method and apparatus for polishing glass substrate for FPD Active JP4862404B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006012772A JP4862404B2 (en) 2006-01-20 2006-01-20 Method and apparatus for polishing glass substrate for FPD

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006012772A JP4862404B2 (en) 2006-01-20 2006-01-20 Method and apparatus for polishing glass substrate for FPD
CN200680051523.2A CN101360584B (en) 2006-01-20 2006-11-17 Method and device for polishing plate-like body
KR1020087010821A KR101143290B1 (en) 2006-01-20 2006-11-17 Method and device for polishing plate-like body
KR1020117031579A KR101273729B1 (en) 2006-01-20 2006-11-17 Method and device for polishing plate-like body
PCT/JP2006/323020 WO2007083438A1 (en) 2006-01-20 2006-11-17 Method and device for polishing plate-like body
TW95143579A TWI331068B (en) 2006-01-20 2006-11-24

Publications (2)

Publication Number Publication Date
JP2007190657A JP2007190657A (en) 2007-08-02
JP4862404B2 true JP4862404B2 (en) 2012-01-25

Family

ID=38287397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006012772A Active JP4862404B2 (en) 2006-01-20 2006-01-20 Method and apparatus for polishing glass substrate for FPD

Country Status (5)

Country Link
JP (1) JP4862404B2 (en)
KR (2) KR101143290B1 (en)
CN (1) CN101360584B (en)
TW (1) TWI331068B (en)
WO (1) WO2007083438A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458766B (en) 2009-06-04 2014-04-02 旭硝子株式会社 Method for grinding plate-like body
JPWO2011004764A1 (en) * 2009-07-06 2012-12-20 旭硝子株式会社 Plate-like body polishing apparatus and plate-like body polishing method
JP5605554B2 (en) * 2009-09-17 2014-10-15 旭硝子株式会社 Glass plate local polishing apparatus, glass plate local polishing method, glass product manufacturing apparatus, and glass product manufacturing method
CN102666010A (en) * 2009-12-18 2012-09-12 旭硝子株式会社 Method and apparatus for polishing plate-like material
JP5762721B2 (en) * 2010-11-04 2015-08-12 株式会社東芝 Reactor control rod surface treatment equipment
JP5316910B2 (en) * 2011-06-02 2013-10-16 旭硝子株式会社 Plate-like body polishing apparatus and plate-like body polishing method
KR101377654B1 (en) * 2013-09-09 2014-03-25 주식회사 엘지화학 Large scale plate and method for uniform polishing of the same
JP6027664B2 (en) * 2015-01-29 2016-11-16 株式会社松田製作所 Polishing equipment
CN109759955A (en) * 2019-03-11 2019-05-17 佛山市南海区卓迪机械有限公司 A kind of slabstone polissoir

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097851B (en) * 1951-10-16 1961-01-19 Saint Gobain Od apparatus for polishing wafers of glass. Ae. materials
US3050913A (en) * 1959-08-11 1962-08-28 Pittsburgh Plate Glass Co Glass manufacture
JPS5775767A (en) * 1980-10-30 1982-05-12 Kawasaki Steel Corp Method of grinding scale of hot rolled steel strip
JPH0414224B2 (en) * 1985-01-22 1992-03-12 Takenaka Komuten Co
JPH05253821A (en) * 1992-03-11 1993-10-05 Nippon Steel Corp Grinding method of stainless steel strip
JPH06246623A (en) * 1993-02-26 1994-09-06 Asahi Glass Co Ltd Method and device for continuous polishing of plate-shaped body
JP3334817B2 (en) * 1993-12-24 2002-10-15 日本電気硝子株式会社 Method of polishing a glass plate
JP2001293656A (en) * 2000-04-17 2001-10-23 Asahi Glass Co Ltd Continuous-type polishing device of plate-like body, and its method
US6585572B1 (en) * 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
JP2002239894A (en) * 2001-02-20 2002-08-28 Ebara Corp Polishing device
JP3965969B2 (en) * 2001-11-02 2007-08-29 株式会社ニコン Polishing apparatus, polishing method, semiconductor device, and semiconductor device manufacturing method
JP2004195601A (en) * 2002-12-19 2004-07-15 Toppan Printing Co Ltd Polishing method of color filter for liquid crystal display
DE20319366U1 (en) * 2003-12-13 2004-03-11 Jakob Löwer Inh. von Schumann GmbH & Co. KG Continuous grinding machine for processing a flat workpiece surface

Also Published As

Publication number Publication date
JP2007190657A (en) 2007-08-02
KR20080075497A (en) 2008-08-18
TWI331068B (en) 2010-10-01
WO2007083438A1 (en) 2007-07-26
TW200728019A (en) 2007-08-01
CN101360584B (en) 2014-01-01
CN101360584A (en) 2009-02-04
KR101143290B1 (en) 2012-05-11
KR101273729B1 (en) 2013-06-12

Similar Documents

Publication Publication Date Title
TWI461376B (en) And a cutter retainer mounting structure for the scribing device
KR101394947B1 (en) Brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel
CN100548575C (en) Device for machining edges of sheet material
US7758402B2 (en) Wafer grinding method
GB2301544A (en) Surface polishing
JP3969956B2 (en) Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine
CN105328514B (en) Edge polishing equipment
US20050112999A1 (en) Method of truing chamfering grindstone and chamfering device
JP3566417B2 (en) Polishing equipment
JP5020603B2 (en) Glass substrate chamfering equipment
JPH08197402A (en) Polishing method and device for glass substrate
JP4037169B2 (en) Side processing method of hard brittle plate
JP2006326785A (en) End surface machining device for glass substrate and end surface machining method
KR101209271B1 (en) Apparatus for double side polishing and Carrier for double side polishing apparatus
US9211631B2 (en) Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
KR20030080190A (en) Large-Sized Substrate and Method of Producing the Same
US20080293336A1 (en) Methods and apparatus to control substrate bevel and edge polishing profiles of films
US20090247050A1 (en) Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
JP3628538B2 (en) Substrate chamfering device
JP2000052233A (en) Polishing device
US8021212B2 (en) Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate
KR20100092873A (en) Processing method and grinding apparatus for lens
CN101939136A (en) Work duplex-head grinding apparatus, and work duplex-head grinding method
JP4744250B2 (en) Double-side polishing apparatus and double-side polishing method for square substrate
EP1917121B1 (en) Method for subsequently treating glass panes

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081211

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110719

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110916

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111011

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111024

R151 Written notification of patent or utility model registration

Ref document number: 4862404

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141118

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141118

Year of fee payment: 3

R154 Certificate of patent or utility model (reissue)

Free format text: JAPANESE INTERMEDIATE CODE: R154

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250