JP4514014B2 - Substrate grinding method - Google Patents

Substrate grinding method Download PDF

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Publication number
JP4514014B2
JP4514014B2 JP2002075548A JP2002075548A JP4514014B2 JP 4514014 B2 JP4514014 B2 JP 4514014B2 JP 2002075548 A JP2002075548 A JP 2002075548A JP 2002075548 A JP2002075548 A JP 2002075548A JP 4514014 B2 JP4514014 B2 JP 4514014B2
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JP
Japan
Prior art keywords
grinding
grindstone
substrate
outer diameter
chamfering
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JP2002075548A
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Japanese (ja)
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JP2003266304A (en
Inventor
裕之 竹部
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Nakamura Tome Precision Industry Co Ltd
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Nakamura Tome Precision Industry Co Ltd
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、液晶基板、ガラス基板等の端部の面取り研削加工、方形コーナー部の研削加工、外径寸法を調整する外形整形研削加工等、多種類の研削を一台の研削装置にて精度高く、効率良く行うのに効果的なマルチ砥石及びこれを用いた研削装置に関する。
【0002】
【従来の技術】
液晶基板、ガラス基板等は、ブレーク加工等により、所定の大きさに切断されて使用に供される。
基板のこの切断面が、エッヂ状になっているので従来から、端面の面取り研削加工、方形基板のコーナー部の研削加工が施されている。
また、方形基板の外径寸法をねらい寸法に調整するために、外形調整研削加工等も広く実施されている。
【0003】
ここで、基板の面取り加工は、例えば、図6に示すように基板7の表裏2面の稜角部に対して、表面7aから端面方向7cに向けて回転w1する砥石104と、これとは逆に、裏面7bから端面方向7cに向けて回転w2する砥石105をそれぞれ、この稜角部に摺接させながら、基板と一対の砥石とを相対移動させる方法が採用されている。
この場合に砥石を荒研削用、中研削用、仕上げ用等にて分けて段階的に研削されている。
また、カップ状の砥石を稜角部に沿ってならうように回転摺接させる方法も採用されている。
【0004】
方形基板のコーナー部は、図7に示すように回転する砥石162の刃先に基板7のコーナー部と軽く接触させるようにして研削されている。
【0005】
基板の外径寸法をねらい寸法に調整する外形整形研削は、図8に示すように回転する砥石161の刃先に、基板の端面を摺接させて研削する方法が採用されている。
【0006】
以上説明したように、基板の面取り研削、方形コーナー研削、外形整形研削それぞれ研削方法が異なるので従来は、それぞれ目的に応じて複数の研削装置を並設して順次研削加工していた。
従って、複数の研削加工装置の間に、ワークを移載する搬送装置が必要になり、ライン構成が長く複雑になるだけでなく、研削装置毎にワークをセッティングし直さなければならないので、それだけバラツキが大きくなり、加工精度の作り込みが大変であった。
また、ライン構成が長くなるだけ、その間に投入される半完成製品も多くなり、生産タクトが長くなるという技術的課題が内在していた。
【0007】
一方、一台の研削装置で、従来、これらの多種類の用途の研削方法に対応しようとすると、それぞれに応じた複数種類の砥石が必要になるだけでなく、砥石の交換段取り工数がかかり、その間、ラインが停止する。
また、半完成製品がライン内に滞留することになり、ライン構成が複雑になるとともに、品質の作り込みが困難になるという技術的課題が内在していた。
【0008】
【発明が解決しようとする課題】
本発明は、上記従来技術に内在する技術的課題に鑑みて、簡単な構造の一種類のマルチ砥石にて面取り研削、方形コーナー研削、外形調整研削等の複数の研削が可能であり、ワークの前進、後退の往復研削ができる方形基板の研削方法の提供を目的とする。
【0009】
【課題を解決するための手段】
本発明に係る方形基板の研削方法は、中央部の仕上げ用砥石単板の外径寸法を最も大きくし、当該中央部砥石単板の軸方向両側に、それぞれ端部に向けて中削り用又は荒削り用の砥石単板の外径寸法が小さくなるように複数枚の砥石単板を所定の間隔を設けて平行に配置し、且つ、最も外側端部に配置される砥石単板の外形形状を回転軸延長方向外側に向けて外径寸法が小さくなるようなテーパー形状としたマルチ砥石を用いて
方形基板の一の辺をマルチ砥石の軸方向と平行に摺接前進させて当該一の辺の稜辺の面取り又は外形整形研削を行う研削と、方形基板を旋回して他の辺をマルチ砥石に摺接後退させて他の辺の稜辺の面取り又は外形整形研削を行う研削と、端部に配置した砥石単板のテーパー形状にて方形基板のコーナー研削を行う研削とを、前記同じマルチ砥石を用いてすることを特徴とする。
【0010】
ここで、中央部側砥石単板の外径寸法をその外側に配置される砥石単板の外径寸法より大きく設定したのは、砥石単板にそれぞれ、刃先が形成されていて、砥石の回転方向において中央部の砥石単板の外径を最も大きくし、その左右両端に向けて砥石単板の刃先外径寸法を小さくすることにより、ワークの前進方向のみならず、後退方向においても研削ができるように作用する。
従って、平行に単板を配設したマルチ砥石の両サイドの砥石単板は、荒削り用に使用され、それらの内側に向けて中削り用又は仕上げ用砥石が配置される。
なお、砥石の種類は要求品質に応じて選定される。
【0011】
また、上記マルチ砥石において、最も外側の両サイドの砥石の外形形状を外側に向かって外径寸法が小さくなるテーパー形状としたことにより、このテーパー部を利用して方形形材のコーナー研削が可能になる。
【0012】
マルチ砥石を用いて一台の研削装置にて多種類の研削を可能にするには、研削加工される基板を載置固定するテーブルに、前後方向(Y軸方向)移動制御手段を備え、基板の進行方向サイド側端面に摺接又は当接するように、請求項1記載のマルチ砥石を上下一対配設し、当該マルチ砥石に少なくともX軸方向及びY軸方向の移動制御手段を備えた基板の研削装置するとよい
【0013】
ここで、マルチ砥石を上下に一対として配設したことにより、この上下一対のマルチ砥石にて基板のサイド方向の稜角部に挟持するように相対摺接させることにより、面取り研削が出来る。
また、マルチ砥石は基板載置テーブルを上下方向(Z軸方向)に移動させ、基板の単面が砥石と接線方向に接触するように配設することにより、基板の外形整形研削及び方形コーナー部研削が可能になる。
【0014】
【発明の実施の形態】
図1に本発明に係る研削装置1の要部構成図を示す。
研削装置本体2の上部に、基板載置テーブル3が備えられている。
この基板載置テーブル3には、真空ポンプ等で減圧吸引する吸着手段6等が備えられていて、研削される液晶基板等が吸着固定され、前進及び後退移動制御(Y軸方向)される。
この基板の進行方向サイドに、マルチ砥石4、5が上下一対備えられている。
図1には、基板の進行方向に対して右側サイドのみに一対の砥石を表示したが、これを一組として、左側サイドにも同様に上下一対の砥石を設けて、二組の砥石を門構えのように構成することにより、一回の進行により方形基板の両側の稜辺の面取り、コーナー研削、外形整形研削等が出来る。
また、マルチ砥石4、5は、後述するように往復研削が可能になっているので、基板載置テーブル3に旋回機能を設け、前進完了後に基板を90°旋回し、二組の砥石のX軸方向の間隔を基板の寸法に合わせて調整し、後退するときに他の二辺の面取り等が実施出来る。
図1には、分かりやすくするために、マルチ砥石4、5のみ模式的に表現してあるが、実際にはマルチ砥石を装着軸支する手段、回転駆動手段、上下方向(Z軸方向)にストロークする機構、上下の砥石の間隔調整機構、左右方向(X軸方向)移動制御手段が備えられている。
これらの機構は、従来から広く採用されている各種方法が採用されるので図示を省略したものである。
【0015】
図2に本発明に係るマルチ砥石4の例を示す。
なお、マルチ砥石5も同様の構造になっているので説明を省略する(図面の符号はマルチ砥石4に対応させて記載してある)。
図2に示す例は、砥石単板を6枚平行に備えた例を示すが、荒削り、中削り、仕上げの各種組み合わせにて、必要に応じて枚数を選定使用することが可能である。
中央の砥石43a、43bの外径寸法が、その外側に位置する42a、42bの外径寸法より大きくなっている。
さらに、42a、42bの砥石の外径寸法は、その外側の砥石41a、41bの外径寸法より大きくなっている。
そして、最も外側の砥石41a、41bの外側は、テーパー形状になっていて方形基板のコーナー研削用に使用する。
また、砥石41a、41bの外側テーパー部は他の砥石と研削条件が異なり、外周部の摩耗速度も異なる。そこで摩耗状況により、この砥石単板を取り替え交換できるような構造になっている。
その構造例を図2にて説明する。
マルチ砥石を回転駆動する主軸8には中央にタップが切ってあり、主軸面に回り止めピン4eが設けられている。
各砥石単板は砥石母材4bの外周に砥石部分4aが形成されている。
また、各砥石単板は嵌め込み構造4cになっていて、ボルト4d等で連結され、砥石41aの側面に設けられた切り欠き凹部と主軸面の回り止めピン4eと嵌合させて中央部の取付孔からボルト4fを挿入して主軸のタップに取り付ける。
なお、砥石42と43の外径寸法の差は、研削量に合わせて設定され、最終面取り幅が0.2〜0.4mm程度であれば、上記砥石の外径寸法差は、0.1〜0.2mm程度になるが、図2は、分かりやすくするためにその差を非常に大きく表現してある。
【0016】
図3に基板の稜辺を面取り研削する場合の模式図を示す。
上側のマルチ砥石4と下側のマルチ砥石5がそれぞれ、相互に砥石の単板の間に入り込むように配置されている。
上側の砥石4が基板7の表面7aから端面7cに向けて回転w1している。
一方、下側の砥石5は、基板7の裏面7bから端面7cに向けて逆方向に回転w2している。
基板7の進行方向に対して、外側の砥石42(42a、42b)、43(43a、43b)にて順次研削され仕上げられる(図3は紙面の手前から奥に向けて基板7が進行する状態を示す)。
従って、本発明におけるマルチ砥石にては、中央部の砥石の刃先外径寸法がその外側の両サイドの砥石より大きくなっているので往復研削が可能である。
【0017】
図4に示すように、基板の端面の外形整形研削する場合には、砥石の上下ストロークを調整又は基板テーブル3の上下位置を調整することにより、基板の端面が砥石の回転外径円接線接触するように摺接する。
【0018】
図5に示すように、方形基板のコーナー研削する場合には、基板7のコーナー部とマルチ砥石の最も外側の砥石、図2の例では、41a、41bの砥石のテーパー部に軽く当接させることで研削できる。
【0019】
【発明の効果】
本発明においては、マルチ砥石の構造を中央の砥石単板の刃先外径寸法をその外側の砥石単板の刃先外径寸法よりそれぞれ大きく設定したので、往復研削が可能であり、最も外側の砥石単板の刃先形状をテーパー状にし、砥石上下ストロークを従来より大きく設定したので方形基板コーナー研削ができる。
同様に、砥石ストロークを大きく設定したので、基板の端面に砥石用接線接触が可能になり、外形整形研削も可能になる。
【0020】
即ち、本発明における研削装置においては、上記の構成を採用したことにより、一台の研削装置で各種研削加工が可能になり、ライン構成が簡単になり、従来の加工装置間の移載装置も不要になり、一回の基板のセンタリングにて一連の研削加工が可能になる。
従って、品質の作り込みが容易になる。
また、ライン途中の半完成製品も一掃される。
【図面の簡単な説明】
【図1】本発明に係る研削装置の要部構成図を示す。
【図2】本発明に係るマルチ砥石の例を示す。
【図3】面取り方法の模式図を示す。
【図4】外形整形研削の模式図を示す。
【図5】方形基板コーナー研削の模式図を示す。
【図6】従来の面取り方法を示す。
【図7】従来の方形基板コーナー研削の例を示す。
【図8】従来の外形整形研削の例を示す。
【符号の説明】
1 研削装置
2 研削装置本体
3 基板載置テーブル
4 上側マルチ砥石
5 下側マルチ砥石
6 吸着手段
7 基板
8 主軸
[0001]
BACKGROUND OF THE INVENTION
The present invention is capable of performing a wide variety of grinding operations with a single grinding machine, such as chamfering grinding of edges of liquid crystal substrates, glass substrates, etc., grinding of rectangular corners, and external shape grinding that adjusts the outer diameter. The present invention relates to a multi-grinding wheel that is high and effective for performing efficiently and a grinding apparatus using the same.
[0002]
[Prior art]
A liquid crystal substrate, a glass substrate, etc. are cut | disconnected for a predetermined | prescribed magnitude | size by a break process etc. and are used.
Since this cut surface of the substrate has an edge shape, conventionally, chamfering grinding of the end surface and grinding of the corner portion of the rectangular substrate are performed.
Further, in order to adjust the outer diameter dimension of the rectangular substrate to a target dimension, outer shape adjustment grinding and the like are widely performed.
[0003]
Here, the chamfering of the substrate is opposite to the grindstone 104 that rotates w1 from the front surface 7a toward the end surface direction 7c with respect to the ridge corners of the front and back surfaces of the substrate 7, as shown in FIG. In addition, a method is adopted in which the grindstone 105 rotating w2 from the back surface 7b toward the end surface direction 7c is moved relative to the substrate and the pair of grindstones while being in sliding contact with the ridges.
In this case, the grindstone is divided in stages for rough grinding, medium grinding, finishing, and the like.
Further, a method of rotating and sliding the cup-shaped grindstone so as to follow the ridge corner portion is also employed.
[0004]
The corner portion of the rectangular substrate is ground so as to lightly contact the corner portion of the substrate 7 with the cutting edge of a rotating grindstone 162 as shown in FIG.
[0005]
As shown in FIG. 8, the external shape grinding for adjusting the outer diameter of the substrate to a target size employs a method in which the end surface of the substrate is slidably brought into contact with the cutting edge of a rotating grindstone 161 for grinding.
[0006]
As described above, since chamfering grinding, square corner grinding, and external shape grinding are different in grinding methods, conventionally, a plurality of grinding devices are arranged in parallel according to each purpose and are sequentially ground.
Therefore, a transfer device for transferring the workpiece is required between the plurality of grinding processing devices, and not only the line configuration becomes long and complicated, but also the workpiece must be set again for each grinding device. As a result, the machining accuracy was difficult to build.
In addition, as the line configuration becomes longer, the number of semi-finished products that are introduced in the meantime increases, and the technical problem that the production tact becomes longer is inherent.
[0007]
On the other hand, when trying to cope with these various types of grinding methods with a single grinding machine, not only a plurality of types of grinding stones corresponding to each of them are required, but also a grinding stone replacement setup man-hour is required. Meanwhile, the line stops.
In addition, the semi-finished product stays in the line, and there is a technical problem that the line configuration becomes complicated and it is difficult to build quality.
[0008]
[Problems to be solved by the invention]
In view of the technical problems inherent in the above-described conventional technology, the present invention can perform a plurality of grinding operations such as chamfering grinding, square corner grinding, and external shape adjustment grinding with a single type of multi-grinding stone having a simple structure. It is an object of the present invention to provide a method for grinding a square substrate capable of forward and backward reciprocating grinding .
[0009]
[Means for Solving the Problems]
The method for grinding a square substrate according to the present invention maximizes the outer diameter of the finishing grindstone veneer at the central portion, and is used for medium cutting toward the ends on both axial sides of the central grindstone veneer. A plurality of grindstone single plates are arranged in parallel at a predetermined interval so that the outer diameter size of the roughing grindstone single plate is small, and the outer shape of the grindstone single plate arranged at the outermost end is Using a multi-grinding wheel with a tapered shape that the outer diameter dimension decreases toward the outside in the direction of rotation axis extension,
Grinding by chamfering or contouring the edge of the one side by sliding one side of the square substrate parallel to the axial direction of the multi-grinding stone, and turning the square substrate to make the other side multi-grinding Grinding for chamfering the edge of the other side by crushing or retreating to the edge or grinding for external shaping and grinding for corner grinding of a rectangular substrate with a tapered shape of a single grindstone plate arranged at the end are performed as described above. It is characterized by using a grindstone .
[0010]
Here, the outer diameter dimension of the center side grindstone veneer was set larger than the outer diameter dimension of the grindstone veneer arranged on the outer side of the grindstone veneer. In the direction, the outer diameter of the grinding wheel single plate at the center is maximized, and the cutting edge outer diameter of the grinding stone single plate is reduced toward the left and right ends, so that grinding is possible not only in the forward direction of the workpiece but also in the backward direction. Act as you can.
Accordingly, the grindstone single plates on both sides of the multi grindstone in which the single plates are arranged in parallel are used for roughing, and the medium grinding or finishing grindstone is arranged toward the inside thereof.
In addition, the kind of grindstone is selected according to required quality.
[0011]
Also, in the above multi-grinding wheel, the outer shape of the grinding wheel on both sides is tapered so that the outer diameter decreases toward the outside. become.
[0012]
To enable multiple types of grinding in a single grinding device with a multi-grinding stone, a table for placing and fixing the substrate to be grinding, comprising a front-back direction (Y axis direction) movement control means, the substrate A pair of upper and lower multi-grinding stones according to claim 1 are arranged so as to be in sliding contact with or abutting against the side end surface in the direction of travel of the substrate. A grinding device may be used .
[0013]
Here, by arranging the multi-grinding stones as a pair vertically, chamfering grinding can be performed by making a relative sliding contact so that the multi-grinding stones are sandwiched between the ridge corners in the side direction of the substrate.
Also, the multi-grinding wheel moves the substrate mounting table in the vertical direction (Z-axis direction), and is arranged so that the single surface of the substrate is in contact with the grinding wheel in the tangential direction. Grinding becomes possible.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a configuration diagram of a main part of a grinding apparatus 1 according to the present invention.
A substrate mounting table 3 is provided on the upper part of the grinding apparatus body 2.
The substrate mounting table 3 is provided with suction means 6 for suctioning with a vacuum pump or the like, and a liquid crystal substrate or the like to be ground is suction-fixed and controlled to move forward and backward (Y-axis direction).
A pair of upper and lower multi-grinding stones 4 and 5 are provided on the traveling direction side of the substrate.
In FIG. 1, a pair of grindstones are displayed only on the right side with respect to the traveling direction of the substrate. However, a pair of upper and lower grindstones are similarly provided on the left side, and two pairs of grindstones are provided on the gate. With such a configuration, chamfering of the ridges on both sides of the rectangular substrate, corner grinding, external shape grinding, and the like can be performed by a single progression.
In addition, since the multi-grinding stones 4 and 5 are capable of reciprocating grinding as will be described later, the substrate mounting table 3 is provided with a turning function, and the substrate is turned 90 ° after the completion of the advancement. The axial distance can be adjusted according to the dimensions of the substrate, and the other two sides can be chamfered when retreating.
In FIG. 1, only the multi-grinding stones 4 and 5 are schematically represented for the sake of clarity, but actually, the means for supporting the multi-grinding wheel, the rotation driving means, and the vertical direction (Z-axis direction). A stroke mechanism, an upper and lower grindstone interval adjusting mechanism, and a left-right (X-axis direction) movement control means are provided.
These mechanisms are not shown because various methods that have been widely used are employed.
[0015]
FIG. 2 shows an example of the multi-grinding stone 4 according to the present invention.
Since the multi-grinding wheel 5 has the same structure, the description thereof is omitted (the reference numerals in the drawing are described corresponding to the multi-grinding stone 4).
The example shown in FIG. 2 shows an example in which six grindstone single plates are provided in parallel, but the number of sheets can be selected and used as necessary in various combinations of rough cutting, medium cutting, and finishing.
The outer diameter dimension of the central grindstones 43a and 43b is larger than the outer diameter dimension of 42a and 42b located on the outer side.
Furthermore, the outer diameter dimensions of the grindstones 42a and 42b are larger than the outer diameter dimensions of the outer grindstones 41a and 41b.
The outer sides of the outermost grindstones 41a and 41b are tapered and used for corner grinding of a square substrate.
Further, the outer tapered portions of the grindstones 41a and 41b are different in grinding conditions from the other grindstones, and the wear speed of the outer peripheral portion is also different. Therefore, the grindstone single plate can be replaced or replaced depending on the wear state.
An example of the structure will be described with reference to FIG.
The main shaft 8 that rotationally drives the multi-grinding wheel is tapped at the center, and a non-rotating pin 4e is provided on the main shaft surface.
Each grindstone plate has a grindstone portion 4a formed on the outer circumference of a grindstone base material 4b.
Each grindstone single plate has a fitting structure 4c and is connected by a bolt 4d or the like, and is fitted with a notch recess provided on the side surface of the grindstone 41a and a non-rotating pin 4e on the main shaft surface. A bolt 4f is inserted from the hole and attached to the tap of the main shaft.
The difference in the outer diameter between the grindstones 42 and 43 is set according to the grinding amount. If the final chamfer width is about 0.2 to 0.4 mm, the difference in the outer diameter between the grindstones is 0.1. Although it is about 0.2 mm, FIG. 2 expresses the difference very greatly for easy understanding.
[0016]
FIG. 3 shows a schematic diagram when chamfering the edge of the substrate.
The upper multi-grinding stone 4 and the lower multi-grinding stone 5 are respectively arranged so as to enter between the single plates of the grindstone.
The upper grindstone 4 rotates w1 from the surface 7a of the substrate 7 toward the end surface 7c.
On the other hand, the lower grindstone 5 rotates w2 in the reverse direction from the back surface 7b of the substrate 7 toward the end surface 7c.
With respect to the traveling direction of the substrate 7, the outer grindstones 42 (42 a, 42 b) and 43 (43 a, 43 b) are sequentially ground and finished (FIG. 3 shows a state in which the substrate 7 proceeds from the front of the paper toward the back. Showing).
Therefore, in the multi-grinding wheel according to the present invention, the outer diameter of the cutting edge of the grindstone at the center is larger than that of the grindstones on both sides of the grindstone, so that reciprocal grinding is possible.
[0017]
As shown in FIG. 4, in the case of external shaping grinding of the end face of the substrate, the end face of the substrate is in contact with the rotating outer diameter circular tangent of the grindstone by adjusting the vertical stroke of the grindstone or adjusting the vertical position of the substrate table 3. Make sliding contact.
[0018]
As shown in FIG. 5, when corner-grinding a square substrate, the corner portion of the substrate 7 and the outermost grindstone of the multi-grinding stone are lightly brought into contact with the tapered portions of the grindstones 41a and 41b in the example of FIG. Can be ground.
[0019]
【The invention's effect】
In the present invention, the structure of the multi-grinding wheel is set so that the outer diameter of the cutting edge of the central grindstone plate is larger than the outer diameter of the cutting edge of the outer grindstone plate. Since the cutting edge shape of a single plate is tapered and the vertical stroke of the grinding wheel is set larger than before, square substrate corner grinding can be performed.
Similarly, since the grindstone stroke is set large, tangential contact for the grindstone can be made with the end face of the substrate, and external shape grinding can also be performed.
[0020]
That is, in the grinding apparatus according to the present invention, by adopting the above-described configuration, various grinding processes can be performed with one grinding apparatus, the line configuration is simplified, and a transfer apparatus between conventional processing apparatuses is also provided. This eliminates the need for a series of grinding operations with a single centering of the substrate.
Therefore, it is easy to build quality.
Also, semi-finished products in the middle of the line will be wiped out.
[Brief description of the drawings]
FIG. 1 shows a configuration diagram of a main part of a grinding apparatus according to the present invention.
FIG. 2 shows an example of a multi-grinding wheel according to the present invention.
FIG. 3 shows a schematic diagram of a chamfering method.
FIG. 4 is a schematic diagram of external shape grinding.
FIG. 5 shows a schematic diagram of square substrate corner grinding.
FIG. 6 shows a conventional chamfering method.
FIG. 7 shows an example of conventional square substrate corner grinding.
FIG. 8 shows an example of conventional external shape grinding.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Grinding device 2 Grinding device main body 3 Substrate mounting table 4 Upper multi-grinding stone 5 Lower multi-grinding stone 6 Adsorption means 7 Substrate 8 Spindle

Claims (1)

中央部の仕上げ用砥石単板の外径寸法を最も大きくし、当該中央部砥石単板の軸方向両側に、それぞれ端部に向けて中削り用又は荒削り用の砥石単板の外径寸法が小さくなるように複数枚の砥石単板を所定の間隔を設けて平行に配置し、且つ、最も外側端部に配置される砥石単板の外形形状を回転軸延長方向外側に向けて外径寸法が小さくなるようなテーパー形状としたマルチ砥石を用いて
方形基板の一の辺をマルチ砥石の軸方向と平行に摺接前進させて当該一の辺の稜辺の面取り又は外形整形研削を行う研削と、
方形基板を旋回して他の辺をマルチ砥石に摺接後退させて他の辺の稜辺の面取り又は外形整形研削を行う研削と、
端部に配置した砥石単板のテーパー形状にて方形基板のコーナー研削を行う研削とを、
前記同じマルチ砥石を用いてすることを特徴とする方形基板の研削方法。
The outer diameter dimension of the grinding stone veneer for finishing at the center is maximized, and the outer diameter dimension of the grinding stone veneer for intermediate cutting or roughing toward the ends on both sides in the axial direction of the central grinding wheel veneer. A plurality of grindstone single plates are arranged in parallel with a predetermined interval so as to be smaller, and the outer diameter of the grindstone single plate arranged at the outermost end is directed outward in the direction of rotation axis extension. Using a multi-grinding wheel with a tapered shape that reduces the
Grinding one side of the square substrate in parallel with the axial direction of the multi-grinding wheel to perform chamfering of the edge of the one side or external shaping grinding;
Grinding by turning a square substrate and sliding the other side to the multi-grinding wheel to retreat and chamfering the edge of the other side or external shaping grinding,
Grinding with corner grinding of a square substrate with the tapered shape of a single grindstone plate placed at the end,
A method for grinding a rectangular substrate, wherein the same multi-grinding stone is used .
JP2002075548A 2002-03-19 2002-03-19 Substrate grinding method Expired - Lifetime JP4514014B2 (en)

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CN102101258B (en) * 2009-12-18 2015-03-11 中村留精密工业株式会社 Side edge processing device of workpiece
SE536487C2 (en) * 2012-05-09 2013-12-17 Sandvik Intellectual Property Milling tools for hobbing
CN106736977A (en) * 2017-01-20 2017-05-31 京东方科技集团股份有限公司 Grinding mechanism and milling apparatus

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