JP3003929B1 - Plane polishing machine - Google Patents

Abstract

An object of the present invention is to provide a plane polishing machine capable of polishing a work larger than a conventional machine with a machine smaller than the conventional machine. A carrier 1 that holds a work WK and is rotated around a rotation center O1, and a surface plate that is arranged to face the carrier 1 and is rotated about the rotation center O2 while being in contact with the surface of the work WK. While the carrier 1 and the platen 2U are rotating, the rotation center O1 is
In order to perform a circular motion having a radius Δ around the center 2, a turntable 4 that rotates around a rotation center O2 is provided, and the carrier 1 is arranged on the turntable 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plane polishing machine, and more particularly to a plane polishing machine suitable for polishing a large workpiece.

[0002]

2. Description of the Related Art Conventionally, small pieces of microchips have been used as workpieces requiring high-precision planar polishing. However, in recent years, IC packages (TABs, lead frames), thermal print heads, Photomask materials such as FDP and build-up substrates (MCM, BGA)
In FDP, mother glass for PDP / LCD, mask material for ITO electrode, etc. are being targeted. In particular, large-sized materials such as photomasks with a size of 1100 mm x 1550 mm are subject to planar polishing. Is becoming noticeable.

[0003] Conventional polishing machines suitable for polishing small pieces include various types such as an Oscar method for polishing each side of a work, a lap master method, and a Hopman method for simultaneously polishing both sides of a work with a planetary carrier table. Machines of this type are known.

[0004] The basic structure of a general plane polishing machine is as follows. In other words, the work is held and the rotation center O1
And a rotation center O, which is arranged to face the carrier and is in contact with the surface of the work.
And a platen rotated about the rotation center 2 so that the rotation center O1 makes a circular motion with a radius Δ about the rotation center O2 while the carrier and the platen are rotating. The surface is polished by the surface plate being swept by a cycloid curve by the surface plate.

[0005] An example of the Hopman method is described below as a conventional polishing machine as a planar polishing machine according to such a method. 14 and 15, four carriers 101, 102, 103, and 104 made of the same gear are meshed with the center gear 105 and the internal gear 106 in common. Each of the four carriers 101 to 104 is provided with a hole corresponding to the outer shape of the work WK having a rectangular plate shape in this example, and the work WK is fitted into the hole.

The thickness of each of the carriers 101 to 104 is made smaller than that of the work WK by a dimension in which a margin is added to the polishing allowance.
1, 102 can be exposed from the upper surface and the lower surface. A disk-shaped lower surface plate 110D that is in common contact with the upper surfaces of the four workpieces WK has a rotation center O common to the center of the internal gear 106.
2 is provided so as to be rotatable. Carrier 1
01 to 104 and the work WK are mounted on the lower platen 110D by its own weight. An upper surface plate 110U rotatable about a common rotation center O2 with the lower surface plate 110D is in contact with the workpiece WK at a predetermined polishing pressure. Each rotation center O1 of the carriers 101 to 104 is located at a position away from the rotation center O2 by Δ.

In such a configuration, when the center gear 105 is driven to rotate in the direction of the arrow, the carriers 101 to 104 are rotated by the center gear 105 while the internal gear 1 is rotated.
Revolves along 06. During this revolution, the upper surface plate 110U,
When the lower surface plate 110D is reversed around the rotation center O2,
The rotation center O1 makes a circular motion with a radius Δ about the rotation center O2, and the surface of the work WK is moved between the upper and lower platens 110U, 11
0D sweeps the cycloid curve.

In FIG. 15, cycloid curves starting from arbitrary points S1, S2, and S3 on the work WK on the carrier 101 are illustrated by reference numerals C1, C2, and C3, respectively.

Under these circumstances, by supplying an abrasive between the work WK and the upper and lower stools 110U and 110D, both surfaces of the work WK can be polished to a parallel, flat surface.

As described above, in the method of rotating the carrier around the center gear and rotating and revolving the carrier,
The floor area of the polisher is roughly determined by the size of the internal gear 106, and the diameter of the internal gear 106 is (radius Δ + carrier 1
(Radius of 01) × 2. For this reason, when the size of the work WK increases, the floor area tends to increase dramatically.

[0011] In the above-mentioned conventional type surface polishing machine, since the rotating direction of the carrier rotated while being in contact with the surface plate is always constant, the surface of the surface plate which is initially flat is gradually changed over time as shown in FIG. ), So-called reverse polishing is performed on the concave surface, or reverse polishing is performed on the convex surface as illustrated in FIG.

For this reason, it is necessary to correct the surface plate to be flat at any time. In each case, the surface plate is detached from the plane polishing machine and attached to a jig for correction (a dedicated machine for correction) to perform reverse polishing. The correction must be performed using a rotation member for correction that rotates in the opposite direction to the rotation direction of the carrier.

As a method of correction, for example, FIG.
There is a method as shown in FIG.
In FIG. 16A, the lower platen 101D is driven to rotate clockwise, and the rotating member 112 for correction is also driven to rotate clockwise in response to power transmission from the drive system to perform correction. .

In FIG. 16C, the lower platen 101D is driven to rotate clockwise, and the rotating member 112 for correction is reversed in the counterclockwise direction.

Whether the surface state of the upper stool 101U is convex or concave depends on various conditions, and it cannot be said unconditionally, but it is clear that either state is obtained.
Therefore, when the surface plate becomes concave or convex, using the rotating member 112 for correction set to rotate in the opposite direction to the rotational direction of the carrier during work processing,
The surface of the surface plate is corrected in one of the states shown in FIG. 16A or FIG. 16B.

[0016]

With respect to the above, there is a demand in the market to process a workpiece without increasing the size of a plane polishing machine that can be enlarged as much as possible in accordance with the enlargement of the workpiece. As for the above, since the conventional work of correcting the surface plate is complicated, a simple correcting means is required.

The present invention meets these problems, and when working on workpieces of the same size, it is possible to perform planar polishing with a significantly smaller machine than conventional planar polishing machines. The purpose is to provide a machine. It is another object of the present invention to provide a surface polishing machine that does not burden the operator in correcting the flatness of the surface plate.

[0018]

A carrier that holds a work and is rotated about a rotation center O1 and a carrier that is arranged to face the carrier and rotates about the rotation center O2 while being in contact with the surface of the work. A rotating table O. The rotating center O1 makes a circular motion with a radius Δ about the rotating center O2 while the carrier and the rotating table are rotating, and the surface of the workpiece is cycloidally rotated by the rotating table. In a plane polishing machine in which plane polishing is performed by sweeping a curve, a rotating table that rotates about the rotation center O2 is provided, and the carrier is mounted on the rotating table and the rotation center O1 is moved from the rotation center O2 to the radius. Δ is set at a distance equal to Δ, and the stool is arranged above and below the upper stool and the lower stool which are opposed to each other so as to sandwich the carrier from above and below. It consisted of two surface plates (claim 1).

[0019]

(2). (1) In the planar polishing machine described in (1), the carrier includes two rotating bodies that are rotated in opposite directions.

(3). (2) In the planar polishing machine described in (2), the two rotating bodies include two gears that mesh with each other (claim 3).

(4). (1) In the surface polishing machine according to (2) or (3), the carrier is formed of gears, and is rotated while being supported by the gears supported by the rotary table and meshed at at least three points on a pitch circle of the gears. It is possible (claim 4).

(5). (1), (2), (3) or (4), wherein the lower platen is supported by a rotating table, and the upper platen is displaced by a rocking means. It is possible to switch between a polishing state in which the work is pressurized and an exchange state in which the work table can be exchanged between the lower platen and a space where the work can be exchanged (claim 5).

(6). (5) In the planar polishing machine according to (5), the swinging means includes a swinging member pivotally supported by a stationary member,
A drive source for the rocking member and a joint for rotatably supporting the upper platen are provided.

(7). (6) In the plane polishing machine described in (6), the joint is a universal joint that gives a free inclination to the surface of the upper surface plate at least when the upper surface plate is in the polishing position. ).

(8). (1), (2), (3),
(4) In the planar polishing machine according to (5), (6) or (7), the rotation directions of the upper platen and the lower platen are opposite to each other, and the rotation speed of the lower platen is lower than the rotation speed of the upper platen. The rotation speed was increased (increased) (claim 8).

(9). (5), (6), (7) or (8), wherein the rotary table is rotatably fitted to a base and supported at the bottom by a rotary wheel. Is attached, and the turntable is provided with a lower turntable driving means for driving the lower turntable and a carrier drive means for driving the carrier, and the swing means drives the upper turntable. An upper surface plate driving means is provided (claim 9).

[0028]

Embodiments of the present invention will be described below. The principle of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 1 denotes a carrier that holds a work and is rotated around a rotation center O1. The manner in which the carrier 1 holds the work conforms to the contents described with reference to FIG.

A lower surface plate 2D is provided so as to be rotated under the carrier 1 so as to rotate about the rotation center O2 while being in contact with both surfaces of the work in a manner in which the carrier 1 and the work are placed. I have. The work held by the carrier 1 is not shown in order to avoid complication of the drawing.

While the carrier 1 and the lower platen 2D are rotating, the rotation center O1 moves circularly on the circle 3 having the radius Δ around the rotation center O2. In order to make a circular motion on the circle 3, a turntable 4 that rotates around the rotation center O2 is provided, and the carrier 1 is placed on the turntable 4 as shown in FIG.
The rotation center O2 and the rotation center O1 are arranged so that the distance between them becomes Δ .

With this configuration, by providing an appropriate speed difference between the lower surface plate 2D and the carrier 1, the surface of the work is swept by the lower surface plate 2D with a cycloid curve, and the surface is polished. The hatching shown in FIG. 1 is for convenience of clarifying the boundary between members, and does not show a cross section.

In the example shown in FIG. 1, only the lower platen 2D is shown as the platen. However, only the upper platen may be used, or the carrier 1 may be sandwiched between the upper and lower platens. You can also.

In FIG. 2, a work on the carrier 1 is indicated by a symbol WK, and arbitrary points S4, S5, S
The cycloid curves starting from No. 6 are denoted by C, respectively.
4, C5 and C6. These cycloid curves have different shapes depending on the relative speed between the lower platen 2D and the carrier 1, as described above. Here, the size of the lower surface plate 2D is set to a size such that a part of the curve goes out of the surface plate in relation to the cycloid curve in order to prevent uneven wear of the surface plate.

Next, referring to FIGS. 3 to 8, a specific example of the configuration of the plane polishing machine according to the present invention will be described. In FIG.
Reference numeral 2U denotes an upper surface plate, and the upper surface plate driving means (not shown) is driven to rotate around the rotation center O2 in the direction of the arrow.

The lower platen 2D facing the upper platen 2U is also driven to rotate about the rotation center O2 in the direction of the arrow opposite to the upper platen 2U by the lower platen driving means (not shown). Has become.

Below the lower surface plate 2D, a turntable 4 driven by a turntable driving means (not shown) around a rotation center O2 is located. Upper surface plate 2U, lower surface plate 2D,
The turntable 4 has a common center of rotation, but the shafts supporting them are independent of the drive means, and the rotation speed and direction are not necessarily the same.

A disc-shaped carrier 1 is located between the upper surface plate 2U and the lower surface plate 2D which are arranged opposite to each other, and the carrier 1 is mounted on the lower surface plate 2D by its own weight. The carrier 1 is composed of a gear having teeth formed on the outer periphery, and as shown in FIG.
The work WK is fitted and supported in the work support hole 1h.

As described above, the thickness of the carrier 1 is thinner than the thickness of the work WK by a margin plus a margin for polishing, and as shown in FIG. The lower surface plate 2D comes in contact with the lower surfaces of the plate 2U and the work WK. In particular, the upper surface plate 2U is pressed downward at an appropriate processing pressure along the rotation center O2.

The upper surface plate 2U is configured to be able to move away from the lower surface plate 2D so that the work WK and the carrier 1 can be easily exchanged. Further, as shown in FIG.
Rotation center O1 of the carrier 1 is adapted to rotate vital about a center of rotation O2 being maintained Δ away from the rotation center O 2, the carrier 1 itself is also rotated in the direction of the arrow.

In order to carry out such a movement of the carrier 1, in this embodiment, three gears G1 and G3 are meshed at three points on a pitch circle of a gear formed on the outer periphery of the carrier 1.
2, G3 was provided. The gear G3 located at the position corresponding to the vertex of the triangle connecting these three points also
It is supported by gears G4, G5 meshing at points. That is, it is supported by the carrier 1 and the three gears G4 and G5.

Of these gears, gears G1, G2, G
4, G5 are supported by a shaft implanted on the turntable 4. At least one of these gears is driven by carrier driving means to drive the carrier 1 to rotate in the direction of the arrow. Since the gear G3 is centerless, together with the carrier 1 that is replaced according to the size and shape of the work,
Since it is easy to replace and there is no need to provide a support shaft, the configuration is correspondingly simplified.

[0042] With this configuration, around the carrier 1 is rotated around O2, revolve while rotating around the rotational center O 1, simultaneously polishing the upper surface of the workpiece WK, the lower surface is swept by the cycloid by platen And processed into parallel, flat surfaces.

Next, with reference to FIGS. 6 and 7, an example of the configuration of the entire surface polishing machine will be described. In these drawings, the same reference numerals are given to members common to the members described in FIG. The main part of this plane polishing machine is set up on a base 5 in a set. A circular fitting hole 6 is formed in a part of the upper surface of the base 5. On the other hand, at a portion corresponding to the bottom of the turntable 4,
A cylindrical shaft portion 4a is formed, and the shaft portion 4a is rotatably fitted in the fitting hole 6.

The bottom surface of the shaft 4a is rotatably supported by four rotating wheels 7. The centers of the shaft portion 4a and the fitting hole 6 coincide with the rotation center O2, and the turntable 4 can rotate about the rotation center O2. Although four rotating wheels 7 are provided in the illustrated example, this is an example, and an appropriate number of rotating wheels are provided as appropriate according to the weight of the turntable 4.

Teeth are formed on the outer peripheral surface of the shaft portion 4a. A motor M1 is fixed on the base 5, and a pulley P1 having teeth is provided on a shaft of the motor M1. A belt 8 having teeth meshing with the above-described teeth is wound around the shaft portion 4a and the pulley P1.

The motor M1, the belt 8, the shaft 4a,
The pulley P1 and the like are main members of the turntable driving means. By driving the motor M1, the turntable 4 moves the rotation center O2.
Is rotated around.

On the upper part of the turntable 4, a shaft 9 is supported by bearings 10 and 11 at two upper and lower positions and is rotatable about a rotation center 02. A lower surface plate 2D is fixed to the upper end of the shaft 9 via a support member. A pulley P <b> 2 is provided integrally with the shaft 9 at a position between the bearing 10 and the bearing 11 on the shaft 9.

A motor M2 is fixed on the turntable 4, and a pulley P3 is integrally provided on a shaft of the motor M2. A belt 12 is wound around the pulleys P2 and P3. These motor M2, pulleys P2, P3, etc. are the main members of the lower platen driving means.
By driving the motor M2, the lower stool 2D is rotated about the rotation center O2.

A motor M3 is fixed on the turntable 4, and a pulley P4 is integrally provided on a shaft of the motor M3. On the turntable 4, two shafts 13, 14 are supported at intervals. The shaft 13 has a pulley P5
However, a pulley P6 is fixed to the shaft 14, respectively. A belt 15 is wound between the pulley P4 and the pulley P5, and a belt 1 is mounted between the pulley 4 and the pulley P6.
6 are wound around each.

A carrier driving gear G2 is provided at the upper end of the shaft 13, and a carrier driving gear G1 is provided at the upper end of the shaft 14.
Are respectively provided integrally with the shaft. These axes 1
The shaft 17 is placed on the turntable 4 so as to face the shafts 3 and 14.
A gear G5 is supported at the upper end of the shaft 17 and a gear G6 is supported at the upper end of the shaft 18, respectively.

The positions of these gears G1, G2, G4, G5 are as described with reference to FIG. 3, and the shaft supporting these gears is assumed to correspond to the position of each of these gears. Motor M3, pulleys P4, P5, P6, belt 1
Reference numerals 5, 16 and the like constitute main members of carrier driving means for driving the carrier 1.

On the base 5 as an immovable member, a support 20
A rocking member 21 is supported on an upper part of the support so as to be able to rock around a shaft 22. Prop 2
0 is provided with a mount 23 integrally therewith.
A main body of the air cylinder 23 and a piston combined with the air cylinder 23 are supported between one end of the swing member 21 and the mount 23.

By controlling the supply of air to the main body of the air cylinder 23, the piston can be protruded or retracted. Both operations can be performed quickly by switching the valve. The state of the air cylinder when the piston is projected is air cylinder on,
Further, if the state of the air cylinder when the piston is retracted is referred to as air cylinder off, the swing member is swung by switching between the air cylinder on and the air cylinder off, and the swing member is swung. The position after the movement can be maintained. The air cylinder 24 is a drive source for swinging the swing member 21.

A shaft 25 having an upper surface plate 2U provided at the other end of the swinging member 21 via a joint 27 is supported at the other end of the swing member 21 with a support portion provided by the shaft 22 therebetween. I have.
The upper end of the shaft 25 is a pulley P 8 is fixed.

A motor M4 is fixed on the swinging member 21, and a pulley P7 is integrally provided on a shaft of the motor M4. A belt 26 is wrapped around between the pulleys P 8 and the pulley P7. By driving the motor M4, the upper surface plate 2U is driven to rotate. Motor M4, the pulleys P 8, P7 constitute a major portion of upper platen driving means.

When the air cylinder is turned off from the air cylinder off, the swinging member 21 is swung and the upper surface plate 2
U is displaced so as to approach the lower surface plate 2D. When the upper surface plate 2U is in the polishing state in contact with the upper surface of the work WK, the rotation center of the upper surface plate 2U, that is, the center of the shaft 25 is the rotation center O2.
Ideally,

However, since the swinging member 21 swings, the center of the shaft 25 is strictly at an angle to the rotation axis O2 depending on the swinging degree. Therefore, axis 25
And the upper surface plate 2U are connected by a joint 27. The joint 27 is a universal joint that can transmit a driving force while giving the surface of the upper surface plate 2U a freedom of inclination at least when the upper surface plate 2U is in the polishing state.

With the air cylinder on, the upper surface plate 2U is brought into pressure contact with the work WK (or the carrier 1), and at this time, the center line of the shaft 25 is
If the arrangement of the shaft 25 with respect to the swing member 21 and the position of the upper stool 2U on the shaft 25 are determined so that 2 coincides, even if the inclination of the swing member slightly changes in the polishing process, The driving force is transmitted to the upper stool 2U without difficulty, and polishing can be performed. When the air cylinder is off, the upper surface plate 2U is moved downward as shown by a two-dot chain line in FIG.
The carrier 1, the work WK, and the like are largely separated and located above.

The oscillating member 21, the air cylinder 24, the joint 27, and the like constitute oscillating means. The oscillating means includes a polishing state in which the upper platen 2U is brought into pressure contact with the work WK,
The position and posture of the upper stool 2U are switched so that the upper stool 2U can take an exchange position separated from the lower stool 2D in a required space where a work, a carrier or the like can be exchanged.

FIG. 8A shows an example of the structure of the joint 27.
This will be described with reference to FIG. In these figures, the joint 27 is composed of a spline shaft portion 27a formed on the shaft end side on the shaft 25 side and a spherical portion 27b formed on the shaft end side. And a connecting member 28 fixed to the board 2U. A step 27c is formed above the spherical portion 27b.

The connecting member 28 includes a spline hole 28a that engages with the spline shaft 27a, a spherical seat 28b that can abut the spherical portion 27b, and a stopper 28c that can abut the step 27c. The concave portion 28d formed in the center portion of the spherical seat 28c is for improving the contact between the spherical surfaces of the spherical portion 27b and the spherical member 28c.

When the air cylinder is off, as shown in FIG. 8B, the step portion 27c is in contact with the stopper portion 28c, and the upper platen 2U is in a state of being lifted by the shaft 25.

When the air cylinder is turned on, as shown in FIG.
b is pressed against the spherical seat 28b and has freedom of swing by sliding between the spherical surfaces. In this state, the swinging of the fitting portion between the spline shaft 27a and the spline hole 28a is hindered, but the swing of the loosened fitting is possible. The grinding allowance for this machine is small, and a sufficient amount of swing can be obtained with the amount of looseness of the fitting. In FIG. 6, a reference symbol W indicates a guard member that collects the abrasive and prevents scattering.

In the polishing machine having such a configuration, the diameter of the upper platen 2U and the lower platen is 150 cm, the diameter of the carrier 1 is 132 cm, the rotation speed of the upper platen 2U is 10 rpm,
The rotation speed of the lower platen 2D can be 30 rpm, the rotation speed of the carrier 1 can be 3 rpm, and the processing pressure can be 5 to 100 g / cm ² .

In this case, based on experience, the upper surface plate 2U and the lower surface plate 2
The rotation directions of D are set to be opposite to each other, and it is necessary to increase the rotation speed of the lower surface plate 2D to be higher than the rotation speed of the upper surface plate 2U. It is better to set the conditions as follows. The supply of the abrasive is performed according to a known example.

In the polishing machine having such a configuration, the number of works that can be polished at one time is one because the number of the carriers is one. However, the carrier revolves around the center of rotation of the platen while rotating. With this configuration, the size of the polishing machine can be significantly reduced as compared with a conventional Hopman-type polishing machine, as can be seen from a simple comparison between the moving regions of the carriers.

In the example described above, there is one carrier, and this carrier is configured to always revolve while rotating in a fixed direction with respect to the surface plate. Therefore, as described with reference to FIG. Is a flat surface of the surface plate,
There is a tendency for the concave or convex surface to be reverse polished over time.

As means for automatically correcting the surface plate that has been back-polished in this way, as shown in FIG.
32 was composed of two rotating bodies so as to rotate in opposite directions. Reference numeral 30 denotes a surface plate, and these carriers 31,
An upper platen and a lower platen may be provided so as to sandwich the platen 32 from above and below, or only one of the upper platen and the lower platen may be provided.

The carriers 31 and 32 are composed of a kind of gear having teeth on the outer periphery, and are engaged with each other at the position of the rotation center O2 of the surface plate 30. In addition, carrier 3
Reference numeral 1 denotes a meshless support at three points by meshing with the gears G10 and G11, and a centerless support that can rotate without providing a shaft at the center. Similarly, the carrier 32 is supported at three points by the gears G12 and G13 and the carrier 31.

The carrier 31, the gears G10 and G11, and the carrier 32, the gears G12 and G13
2, the distance between the rotation center O2 and the rotation centers O1 of the carriers 31 and 32 is set to Δ. The method of driving the carriers 31, 32, the surface plate 30, the turntable, and the like conforms to the above-described example.

In the example shown in FIG. 9, the carriers 31, 32
Is composed of gears, and is configured to rotate in the opposite direction to each other, so that the surface of the surface plate 30 becomes concave or convex due to the carrier 31 and the work, and even if the surface is reversely polished by the carrier or the work, It is automatically corrected by one carrier, for example, the carrier 31 rotating in the opposite direction to the carrier 31, for example, the carrier 32. Therefore, it is advantageous in that a complicated work such as removing the back-polished surface plate from the plane polishing machine, attaching it to a dedicated shaft, and performing correction as in the related art is not required.

In the case of this example, the size of the work is smaller than in the case of the above-described example in which one carrier is provided because the two carriers 31 and 32 are located on the surface plate 31. Therefore, if the workpieces have the same size, the size of the grinder is large, but the degree is small, and the size of the grinder is still smaller than that of the conventional 4-carrier planetary gear type grinder by the Hopman system. It should be noted that the carriers 31 and 32 are not formed by gears as in the above example,
It is also possible to adopt a configuration in which the motor is supported on a turntable and rotated in opposite directions by a driving means.

In order to visually understand that the polishing machine according to the present invention can be miniaturized, the sizes of main members of various polishing machines when the size of the work WK is equal will be compared below. FIG. 13 shows a configuration of a main part of a conventional four-carrier planetary gear type polishing machine (hereinafter simply referred to as a conventional machine) by the Hopman system, and FIG. 10 shows a main part of a one-carrier type polishing machine according to the present invention. 11 (based on the configuration shown in FIG. 1), and FIG. 11 shows the configuration of the main part of the two-carrier type polishing machine according to the present invention (based on the configuration shown in FIG. 9).

In FIG. 10, FIG. 11, and FIG.
The size of each work WK is the same, and if a work of the same size is polished, the size of the work WK is smaller than that of the configuration shown in FIG.
It can be seen from a comparison between these figures that the polishing machine having the configuration of the present invention shown in FIGS.

FIG. 12 shows a single-carrier type polishing machine (according to the configuration shown in FIG. 1) according to the present invention.
FIG. 14 shows the largest work WK that can be mounted when using a surface plate 2D having the same size as the surface plate 110U in the conventional machine shown in FIG. From comparison between FIG. 13 and FIG. 12, if the polishing machine has the same machine size (floor area), the polishing machine according to the present invention grinds a work approximately four times as large as the conventional machine. It is presumed that it can be done.

A rough comparison shows that the height is 720 cm × width 12
The floor area and total weight of a grinding machine for grinding a work of 0 cm × thickness of several mm are 30 tons in a conventional machine of 3 m in length × 2.6 m in width × 4.6 m in height. 6, the polishing machine according to the present invention as illustrated in FIG.
There is a trial calculation that it can be 3 tons with 1.6 m width x 2 m height, and it can be seen how the polishing machine of the present invention is remarkably reduced in size and weight.

Although the conventional machine is efficient because four workpieces are simultaneously machined, if one workpiece is damaged due to some trouble, the other three workpieces cooperating with each other are similarly processed. There is an advantage that the polishing machine according to the present invention requires only one workpiece, while the four workpieces are damaged in succession due to damage.

The objects to be processed by the above-described plane polishing machine according to the present invention widely include stones, ceramics, glass materials, metals, and other materials in addition to the various large-sized substrate materials described at the beginning.

[0079]

According to the first aspect of the present invention, the size of the polishing machine can be reduced as compared with the conventional machine, and if the machine is of the same scale, a large work can be polished and a large capital investment can be made. In addition, various mask materials, hard disk materials, and other materials required by the times can be polished, and a parallel flat surface can be obtained using the upper and lower platens.

[0080]

According to the second aspect of the present invention, it is possible to automatically correct the tendency of the surface of the surface plate to a concave surface or a convex surface over time by using two carriers that rotate in opposite directions. According to the third aspect of the invention, reverse rotation of the carrier can be obtained with a simple configuration. According to the fourth aspect of the present invention, the carrier can be rotatably and stably supported with a simple configuration.

According to the fifth aspect of the present invention, the upper platen is displaced by the swinging means, so that the upper platen can be easily changed to an exchangeable position for exchanging a work and a polishing position suitable for polishing. Can be switched. According to the sixth aspect of the invention, by using the air cylinder as the driving source, it is possible to maintain the exchange state and the polishing state with time, and the switching can be quickly performed.

According to the seventh aspect of the present invention, the upper platen can be stably pressurized, and a certain tolerance can be given to the positional accuracy of the upper platen in the polishing position.
According to the invention described in claim 8, good polishing can be realized empirically. According to the ninth aspect, a polishing machine can be specifically constructed.

[Brief description of the drawings]

FIG. 1 is a plan view schematically illustrating a configuration of a main part of a plane polishing machine according to the present invention.

FIG. 2 is a diagram exemplifying a cycloid curve drawn by a work by the plane polishing machine according to the present invention.

FIG. 3 is a perspective view illustrating a configuration of a main part of the plane polishing machine according to the present invention.

FIG. 4 is a perspective view illustrating a manner in which a work is mounted on a carrier.

FIG. 5 is a partial front view illustrating a state of a carrier and a workpiece during polishing.

FIG. 6 is an overall front view for explaining an example of a plane polishing machine according to the present invention.

FIG. 7 is a partial plan view illustrating a positional relationship of main members in FIG.

8 (a) is a partial sectional view of the joint in a polishing position, and FIG. 8 (b) is a partial sectional view of the joint in an exchange position.

FIG. 9 is a diagram illustrating an example of a configuration in a case where two carriers are used in the plane polishing machine according to the present invention.

FIG. 10 is a diagram showing, for comparison with a conventional machine, the size of a main configuration of a polishing machine according to the present invention of one carrier when a work of a fixed size is used.

FIG. 11 is a diagram showing the size of a main configuration of a two-carrier polishing machine according to the present invention when a work of a certain size is used, for comparison with a conventional machine.

FIG. 12 is a diagram showing the size of a work when a surface plate having a fixed size is used, for comparison with a conventional machine.

FIG. 13 is a diagram showing, for comparison with the machine according to the present invention, the size of a main configuration of a polishing machine according to a conventional machine when a work of a certain size is used.

FIG. 14 is an exploded perspective view illustrating a configuration of a main part of a conventional polishing machine.

FIG. 15 is a diagram exemplifying a cycloid curve drawn by a work by a conventional plane polishing machine.

16 (a) is a view for explaining a method of rotating a rotating member for correcting the surface plate in the direction of an arrow, and FIG. 16 (b) is a cross section when the surface of the surface plate is concave. FIG. 16
FIG. 16C is a diagram illustrating a method of rotating a rotating member for correcting the surface plate in the direction of an arrow, and FIG. 16D is a cross-sectional view when the surface of the surface plate is convex.

[Explanation of symbols]

 1 Carrier 2D Lower surface plate 2U Upper surface plate 4 Turntable

Claims (9)

(57) [Claims] 1. A carrier that holds a work and is rotated about a rotation center O1 and a surface plate that is disposed to face the carrier and is rotated about the rotation center O2 while being in contact with the surface of the work. During the rotation of the carrier and the surface plate, the center of rotation O1 makes a circular motion with a radius Δ about the center of rotation O2, and the surface of the work is swept by a cycloid curve by the surface plate. In a flat-surface polishing machine for performing flat polishing, a rotating table that rotates about the rotation center O2 is provided, and the carrier is placed on the rotating table, and the rotation center O1 is rotated by the rotation center O1.
The upper surface plate and the lower surface plate are disposed so as to be separated from the center of rotation O2 by a distance equal to the radius [Delta ]. Surface grinding machine, characterized in that more configuration panel. 2. A plane polishing machine according to claim 1, wherein said carrier comprises two rotating bodies which are rotated in opposite directions. 3. The plane polishing machine according to claim 2, wherein said two rotating bodies comprise two gears meshing with each other. 4. A flat grinding machine according to claim 1, wherein said carrier comprises a gear, and is supported by said gear supported by said rotary table and meshed at at least three points on a pitch circle of said gear. A plane polishing machine characterized by being rotatable. 5. The flat polishing machine according to claim 1, wherein said lower platen is pivotally supported by a turntable, and said upper platen is displaced by a rocking means, and said work piece is moved. A flat polishing machine characterized in that it can be switched so as to be able to take between a polishing state in which pressure is applied to the substrate and an exchange position in which the work table can be exchanged and separated from the lower platen in a space where the work can be exchanged. 6. A flat polishing machine according to claim 5, wherein said oscillating means rotatably supports an oscillating member pivotally supported by an immovable member, a driving source for said oscillating member, and said upper platen. A flat grinding machine characterized by comprising a joint that performs the following. 7. A flat polishing machine according to claim 6, wherein said joint is a universal joint which gives a free inclination to a surface of said upper surface plate when said upper surface plate is in said polishing position. Characteristic flat grinding machine. 8. The flat polishing machine according to claim 1, wherein the upper platen and the lower platen are rotated in opposite directions, and the upper platen is rotated at a rotational speed. A rotating speed of the lower platen is higher than that of the lower polishing plate. 9. The flat-surface polishing machine according to claim 5, wherein the turntable is rotatably fitted to a base and supported at the bottom by a rotary wheel. A rotating table driving means for driving; the rotating table is equipped with a lower platen driving means for driving the lower platen and a carrier driving means for driving the carrier; and the swinging means is for driving the upper platen. A plane polishing machine characterized by mounting a platen driving means.