JP2000218521A - Surface plate correction carrier for double-surface polishing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To carry out simultaneous correction polishing of upper and lower surface plates by providing a surface correction carrier for double-surface polishing with a hole on one surface of the carrier and a hole on the other surface thereof which have different areas from each other, and a hole communicating with the hole. SOLUTION: This carrier 1 has a gear 1g at its circumference and is in a disc shape. On a carrier center 1c, at one surface, e.g. at an upper surface 2, an upper surface hole 2p is formed while at the other surface, e.g. at a lower surface, a lower surface hole 3p having a different area from that of the former is formed. A stepped part 1d is formed between both hole parts 2p, 3p to cummunicates them with each other. To correct the shape of upper and lower surface plates, for example, the carrier 1 is removed from a double-surface polishing apparatus, the carrier 1 is pressure held between the upper and lower surface plates with the upper surface 2 thereof turned upside, and the gear 1g is meshed with a sun gear and an internal gear. Then, the carrier 1 is press held and is rotated at a specified rotational frequency while a polishing material is fed, and the upper and lower surface plates brought into press contact with the carrier 1 are polished flat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for repairing a platen for double-side polishing used for repairing upper and lower platens of a double-side polishing apparatus. Regarding the board correction carrier.

[0002]

2. Description of the Related Art In order to manufacture a semiconductor wafer for an electronic device, a semiconductor wafer (substrate) sliced to a predetermined thickness by a multi-wire saw or the like is used to remove uneven saw marks present on the surface of the semiconductor wafer. Polishing is performed using alumina abrasive grains or the like for smoothing, uniforming the depth of processing strain, and uniforming the thickness within and between wafers.

Polishing is generally performed by using a carrier 21 as shown in FIGS. 9 and 10, incorporated in a double-side polishing apparatus 22, and provided with a semiconductor wafer W stored in a plurality of storage holes 21p on a central drive shaft 23. A so-called planetary gear that rotates the internal gear 26, the upper platen 27, and the lower platen 25 provided on the outer periphery of the provided sun gear 24 and lower platen 25 to rotate the carrier 21 around the sun gear 24 while revolving around the sun gear 24. The semiconductor wafer W is polished by moving the upper and lower stools 27 and 25 in opposite directions.

[0004] By repeating such a lapping process, the upper and lower stools 27 and 25 are worn, and the upper and lower stools 27 and 25 become convex as shown in FIG. The surface of the surface plates 27, 25 may have a shape having irregularities in the plane, or the upper and lower surface plates 27, 25 as shown in FIG.
Becomes concave.

When such various forms of wear occur, a platen correction carrier for correcting the upper and lower platens having a shape corresponding to the worn shape is used.

For example, as shown in FIG.
In the case where the projections 7 and 25 have a convex shape, as shown in FIG. 14, a gear 29g is provided around the circumference, and one surface 29s and the other surface 29r have the same shape. A surface plate correction carrier 29 having different contact portions 29m and through holes 29p provided offset from the center 29c is used. Further, as shown in FIG. 12, in the case where the upper and lower platens 27 and 25 have a shape having irregularities on the surface, as shown in FIG. Having a shape and a center 30
A platen correction carrier 30 having a through hole 30p centered at c and a contact portion 30m provided in a ring shape so as to surround the through hole 30p and projecting in a planar shape is used.
Further, when the upper and lower stools 27 and 25 have a concave shape as shown in FIG. 13, a gear 31g is provided around the periphery, and one surface 31s and the other surface 31r have the same shape as shown in FIG.
A substantially petal-shaped through-hole 31p centered on the center 31c;
Surface plate correction carrier 3 having a planar contact portion 31m
1 is used.

As described above, in the conventional platen repair carrier, a large number of platen repair carriers must be prepared and placed in order to change the platen repair carrier in accordance with the wear shape of the upper and lower platens 27 and 25. Also, the replacement work was complicated.

The upper platen 27 and the lower platen 25 have different shapes such that the upper platen 27 has a concave shape as shown in FIG. 13 and the lower platen 25 has a convex shape as shown in FIG. It often happens.

Therefore, when the upper surface plate 27 and the lower surface plate 25 in such a worn state are subjected to correction polishing using the surface plate correction carrier 29 as shown in FIG. 14, the lower surface plate 25 is appropriately polished. However, the upper platen 27 has a more severe concave shape. Therefore, conventionally, when correcting the surface plate when the upper and lower surface plates 27 and 25 have different irregularities, the shape of one side is allowed to be further deteriorated, and then the upper and lower surface plates 27 and 25 are directly connected to each other. Actually, the so-called co-rubbing is performed, and the surface of the platen is modified and polished.

In this conventional correction method, the surface plate is significantly worn, and cost and time are wasted, which is uneconomical.

[0011]

Therefore, there is a need for a carrier for repairing a platen for double-side polishing, which can efficiently and economically correct the upper and lower platens, and the present invention has been made in view of the above circumstances. It is an object of the present invention to provide a double-side polishing surface plate repair carrier capable of efficiently and economically repairing the upper and lower surface plates.

[0012]

SUMMARY OF THE INVENTION In order to achieve the above object, according to the first aspect of the present invention, a workpiece is stored and held in a storage hole formed in a carrier, and both surfaces of the workpiece are upper and lower plates. In a double-side polishing apparatus for polishing both surfaces of a workpiece by supplying a slurry in a state of being pressed against a plate, and rotating and revolving the carrier between upper and lower platens,
A double-sided polishing platen correction carrier used to correct the flatness of the upper and lower platens by sliding, a hole provided on one surface of the carrier, and an area different from the hole provided on the other surface of the carrier. And a hole that is in communication with the hole.

In the invention of claim 2 of the present application, one of the holes provided on one surface or the other surface of the carrier is offset from the center of the carrier.
The point is that the carrier is a carrier for correcting a surface plate for double-side polishing described in (1).

According to the third aspect of the present invention, the hole carrier provided on one surface and the other surface of the carrier is offset from the center of the carrier. The gist is that

[0015]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a carrier for repairing a platen for double-side polishing according to the present invention.

As shown in FIG. 1, the surface-repair carrier 1 for double-side polishing is provided with a peripheral gear 1g and has a disk shape.
One surface, for example, the upper surface 2, an upper surface hole 2 p, and the other surface, for example, the lower surface 3
A lower surface hole 3p having an area different from that of the upper surface hole 2p is formed.

The upper hole 2p and the lower hole 3p
Are formed on the carrier center 1c.
A step 1d is formed between p and 3p, and further communicates with each other.

As shown in FIG. 2, the upper surface 2 has a ring-shaped planar contact portion 2m formed so as to surround the hole 2p, and a groove 2b extending in a cross shape from the hole 2p. I have.

As shown in FIG. 3, a groove 3b extending in a cross shape from the hole 3p is formed in the lower surface 3 of the surface plate correction carrier 1.

Next, the modification of the upper and lower platens of the double-side polishing apparatus using the double-side polishing platen repair carrier 1 according to the present invention will be described.

First, as shown in FIGS. 9 and 10, the carrier 21 is incorporated in the double-side polishing apparatus 22, and the semiconductor wafer W stored in the plurality of storage holes 21p is moved to the central drive shaft 2.
The carrier 21 is rotated while revolving around the sun gear 24 by rotating the sun gear 24 provided on the base 3 and the internal gear 26, the upper surface plate 27, and the lower surface plate 25 provided on the outer periphery of the lower surface plate 25. The upper and lower platens 27 and 25 are rotated in the same or opposite directions to perform lapping of the semiconductor wafer W.

By repeating such a lapping process, the upper and lower stools 27 and 25 are worn, and the upper and lower stools 27 and 25 become convex as shown in FIG. The surface of the surface plates 27, 25 may have a shape having irregularities in the plane, or the upper and lower surface plates 27, 25 as shown in FIG.
Becomes concave. Upper and lower surface plate 2 due to such wear
The various shapes 7 and 25 are corrected using the surface plate correction carrier 1.

For example, a double-side polishing apparatus 2 as shown in FIG.
2, the platen correction carrier 1 is pressed and sandwiched between the lower platen 25 and the upper platen 27 with the upper surface 2 up as shown in FIG. 2 and the lower surface 3 shown in FIG. Gear 1
g is engaged with the sun gear 24 and the internal gear 26.

Thereafter, the platen correction carrier 1 is pressed and held between the lower platen 25 and the upper platen 27, and the platen correction carrier 1 is rotated in a planetary manner at a predetermined rotation speed while supplying an abrasive.
The lower platen 25 and the upper platen 27 that are pressed against the platen correction carrier 1 are polished flat by the planetary rotation of the platen correction carrier 1.

As described above, the lower platen 25 and the upper platen 27 are simultaneously formed by performing correction using the platen correction carrier 1 having the holes 2p and the holes 3p having different areas on the upper surface 2 and the lower surface 3 as described above. Since the modified polishing can be performed, a polishing time and a polishing loss of the expensive upper and lower stools 27 and 25 can be avoided, and the modification can be performed efficiently and economically.

Note that, even when the unevenness of the upper and lower platens is opposite to that described above, it is geometrically clear. What is necessary is just to make it change so that it may become equivalent.

As shown in FIG. 4, a hole 32p provided on one surface 32 of the surface plate correction carrier 31 is centered on the center 31c.
And the hole 33p may be formed so as to be centered on the hole 33p. Further, as shown in FIG.
The hole 35p provided on one surface 35 of the fourth surface 4 and the hole 36p provided on the other surface 36 may be formed so as to be offset from the center 31c.

Further, the positions of the holes on at least one of the upper surface and the lower surface of the surface plate correction carrier are deviated as shown in FIG. 4, and the contact portions are further deviated to remove finer irregularities. Good, furthermore, at least one side of the through-hole shape may be a petal shape as shown in FIG.
Further, an arc portion for chamfering may be formed in order to prevent the accumulation of abrasive grains in the step portion shown in FIG.

[0029]

EXAMPLE A surface plate wear simulation was carried out by using the double-side polishing surface plate correction carrier according to the present invention and changing the through-hole area of the surfaces contacting the upper and lower surface plates.

(Conditions) 1) Gear and Hole The pitch circle diameter of the sun gear = 57 mm, the pitch circle diameter of the internal gear = 309 mm, the pitch circle diameter of the correction carrier = 126 mm, and the diameter of the upper hole in contact with the upper platen = 10.
0 mm, diameter of lower hole in contact with lower platen = 30 mm.

2) Number of revolutions Revolution of correction carrier = 12.7 rpm (clockwise), rotation of correction carrier = 3.8 rpm (counterclockwise), rotation of upper platen = 5 rpm (counterclockwise), lower platen Rotation = 1
6 rpm (clockwise).

3) Abrasive grain 250 g / L of # 400 SiC (average particle size: 30 μm)
Use pure water suspension.

4) Results As shown in FIG. 6, the upper platen is modified to have a downward convex shape, and the lower platen is modified to have an upward concave shape as shown in FIG. FIG. 8 shows the results of a wear simulation of the upper stool using a conventional correction carrier having a through hole having a diameter of 30 mm on both the upper and lower surfaces. Since the upper surface plate is modified and polished into a concave shape like the lower surface plate, if the upper surface plate before modification has a concave shape, it will be extremely concave.

[0034]

In the carrier for repairing the surface plate for double-side polishing according to the present invention, since the lower surface plate and the upper surface plate can be corrected and polished at the same time, the polishing time can be reduced and the efficiency can be reduced. Since the co-rubbing is not required, polishing loss of the expensive upper and lower platens can be avoided, and the cost can be corrected economically.

By making the area of the hole provided on one surface different from the area of the hole provided on the other surface, it is possible to easily obtain a double-sided polishing platen correction carrier having an appropriate pattern surface and to efficiently correct it. Polishing can be performed.

Either one of the holes provided on one side or the other side of the carrier is offset from the center of the carrier, or both the holes provided on one side and the other side are offset from the center of the carrier. Finer irregularities can be removed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface plate repair carrier for double-side polishing according to the present invention.

FIG. 2 is a top plan view of a surface plate repair carrier for double-side polishing according to the present invention.

FIG. 3 is a bottom plan view of a surface plate repair carrier for double-side polishing according to the present invention.

FIG. 4 is a cross-sectional view showing another embodiment of a carrier for repairing a surface plate for double-side polishing according to the present invention.

FIG. 5 is a cross-sectional view showing another embodiment of a carrier for repairing a surface plate for double-side polishing according to the present invention.

FIG. 6 is an explanatory diagram of a simulation result of upper platen wear using the double-sided polishing platen correction carrier according to the present invention.

FIG. 7 is an explanatory diagram of a simulation result of lower platen wear using the platen correction carrier for double-side polishing according to the present invention.

FIG. 8 is an explanatory diagram of a simulation result of upper platen wear using a conventional double-sided polishing platen modified carrier.

FIG. 9 is an explanatory view of a commonly used double-side polishing apparatus.

FIG. 10 is an operation explanatory view of the double-side polishing apparatus shown in FIG. 9;

FIG. 11 is a pattern diagram of a wear shape generated on a surface plate of a generally used double-side polishing apparatus.

FIG. 12 is a pattern diagram of a wear shape generated on a surface plate of a generally used double-side polishing apparatus.

FIG. 13 is a pattern diagram of a wear shape generated on a surface plate of a generally used double-side polishing apparatus.

FIG. 14 is a plan view of a conventional platen repair carrier for double-side polishing.

FIG. 15 is a plan view of another conventional double-side polishing surface plate repair carrier.

FIG. 16 is a plan view of another conventional double-side polishing surface plate repair carrier.

[Explanation of symbols]

 DESCRIPTION OF REFERENCE NUMERALS 1 Double-sided polishing platen correction carrier 1c Center 1d Step 1g Gear 2 Upper surface 2b Groove 2m Contact 2p Upper hole 3 Lower 3b Groove 3m Contact 3p Lower hole

Claims (3)

[Claims] 1. A workpiece is stored and held in a storage hole formed in a carrier, and slurry is supplied in a state where both surfaces thereof are pressed against an upper surface plate and a lower surface plate, and the carrier rotates between the upper and lower surface plates. And in a double-side polishing apparatus for polishing both sides of the workpiece by revolving, a double-side polishing surface plate correction carrier used to correct the flatness of the upper and lower surface plates by rubbing is provided on one surface of the carrier. And a hole provided on the other surface of the carrier and having a different area from the hole and communicating with the hole. 2. The carrier according to claim 1, wherein one of the holes provided on one surface or the other surface of the carrier is offset from the center of the carrier. 3. The carrier according to claim 1, wherein holes provided on one surface and the other surface of the carrier are offset from the center of the carrier.