CN115635415A - Grinding wheel, grinding device, grinding method and silicon wafer - Google Patents
Grinding wheel, grinding device, grinding method and silicon wafer Download PDFInfo
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- CN115635415A CN115635415A CN202211230927.5A CN202211230927A CN115635415A CN 115635415 A CN115635415 A CN 115635415A CN 202211230927 A CN202211230927 A CN 202211230927A CN 115635415 A CN115635415 A CN 115635415A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 67
- 239000010703 silicon Substances 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 17
- 206010006514 bruxism Diseases 0.000 claims description 25
- 238000005498 polishing Methods 0.000 claims description 16
- 230000003068 static effect Effects 0.000 claims description 13
- 230000002706 hydrostatic effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 57
- 238000005520 cutting process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The embodiment of the invention discloses a grinding wheel, a grinding device, a grinding method and a silicon wafer, wherein the grinding wheel comprises: a base; a plurality of grinding modules extending from the same surface of the base, the plurality of grinding modules being concentrically arranged and having different grinding capabilities; wherein a height at which each of the plurality of abrading modules extends from the surface of the base is adjustable such that the plurality of abrading modules can perform abrading operations independently of one another.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a grinding wheel, a grinding device, a grinding method and a silicon wafer.
Background
In a semiconductor processing process, a drawn silicon rod needs to be cut into silicon wafers through a cutting process, and the thickness of the silicon wafers obtained through the cutting process is usually set to leave a processing margin for a subsequent process. In order to remove mechanical damage to the surface of the silicon wafer caused by a cutting tool and mortar in the cutting process and achieve the purposes of effectively thinning the silicon wafer and controlling the surface flatness, a double-sided grinding processing technology is used, namely, the surface of the silicon wafer is ground in equal proportion by using a grinding wheel made of diamond, for example, so as to remove a surface damage layer and thin the silicon wafer.
The double-side grinding equipment mainly adopts two grinding modes: the silicon wafer grinding method comprises a horizontal grinding mode and a vertical grinding mode, wherein in a double-sided grinding device adopting the horizontal grinding mode, a silicon wafer is horizontally arranged on a grinding table with high flatness, a grinding wheel grinds downwards from the upper part, and after the single-sided processing is finished, the silicon wafer is turned over to grind the other side; in the double-side grinding equipment adopting the vertical grinding mode, a silicon wafer is supported by a material carrying ring and is erected in the double-side grinding equipment, and two grinding wheels are oppositely arranged on two sides of the silicon wafer so as to feed from the two sides to grind the two sides of the silicon wafer simultaneously.
At present, for a double-side grinding device adopting a vertical grinding mode, two grinding wheels arranged oppositely have single grinding capacity, and if the grinding efficiency needs to be improved, the grinding wheel usually has to be selected to improve the force acting on a silicon wafer when the grinding wheel carries out grinding operation or improve the grinding capacity of the grinding wheel. However, the increased force acting on the silicon wafer may cause the silicon wafer to swing so as to collide with the static pressure support member to crack or even damage the static pressure support member; the improvement of the polishing ability may reduce the quality of the silicon wafer.
Therefore, how to improve the polishing efficiency while ensuring the quality of the silicon wafer is an urgent problem to be solved in the art.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention desirably provide a grinding wheel, a grinding apparatus, a grinding method, and a silicon wafer.
The technical scheme of the invention is realized as follows:
in a first aspect, embodiments of the present invention provide a grinding wheel, including:
a base;
a plurality of grinding modules extending from the same surface of the base, the plurality of grinding modules being concentrically arranged and having different grinding capabilities;
wherein a height at which each of the plurality of abrading modules extends from the surface of the base is adjustable such that the plurality of abrading modules can perform abrading operations independently of one another.
In a second aspect, an embodiment of the present invention provides a polishing apparatus for performing double-side polishing on a silicon wafer, including:
two static pressure support members oppositely arranged at two sides of the silicon wafer, wherein the two static pressure support members are used for supporting the silicon wafer in a non-contact mode by providing hydrostatic pressure;
two grinding wheels according to the first aspect disposed opposite to each other on both sides of the silicon wafer.
In a third aspect, embodiments of the present invention provide a grinding method performed using the grinding apparatus according to the second aspect.
In a fourth aspect, embodiments of the present invention provide a silicon wafer manufactured by using the polishing apparatus according to the second aspect.
The embodiment of the invention provides a grinding wheel, a grinding device, a grinding method and a silicon wafer; the grinding wheel provided by the embodiment of the invention comprises a plurality of grinding modules which have different grinding capacities and can be independent from each other for grinding operation, so that a single grinding wheel also has multiple grinding capacities, when the grinding wheel is used for grinding a silicon wafer, the grinding module with stronger grinding capacity can be used for processing the thickness of the silicon wafer to be close to the target thickness in a labor-saving and efficient manner, the grinding module with weaker grinding capacity can be used for making the surface of the silicon wafer have better appearance, flatness and smoothness, the grinding wheel does not need to be replaced in the whole grinding process, the labor and time cost brought by related replacement operation is saved, the installation error caused by replacing the grinding wheel is avoided, and the grinding efficiency is improved while the quality of the silicon wafer is ensured.
Drawings
FIG. 1 shows a schematic view of a conventional grinding apparatus;
FIG. 2 shows another schematic view of a conventional grinding apparatus;
FIG. 3 illustrates a front view of an abrasive wheel provided by an embodiment of the present invention;
FIG. 4 shows a side view of an abrasive wheel provided by an embodiment of the present invention;
FIG. 5 shows a schematic view of a grinding wheel provided in accordance with another embodiment of the present invention;
fig. 6 shows a schematic view of a grinding apparatus provided by an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
Referring to fig. 1 and 2, fig. 1 and 2 show a conventional grinding apparatus 1, the grinding apparatus 1 including a carrier ring 11 for carrying a silicon wafer S, a first static pressure support 12, a second static pressure support 13, a first grinding wheel 14, a second grinding wheel 15, a robot arm R adsorbing the silicon wafer S to load it into the carrier ring 11 of the grinding apparatus 1 during grinding of the silicon wafer S, the first static pressure support 12 and the second static pressure support 13 positioned at the left and right sides of the carrier ring 11 being adjacent to the silicon wafer S, and then the first grinding wheel 14 and the second grinding wheel 15 positioned at the left and right sides of the carrier ring 11 passing through holes in the first static pressure support 12 and the second static pressure support 13, respectively, to perform double-side grinding of the silicon wafer S, the first grinding wheel 14 and the second grinding wheel 15 being generally designed to have the same grinding ability and to apply a uniform force to the silicon wafer when performing the grinding operation.
It should be noted that, for the design of the grinding ability of the grinding wheel, consideration is needed to be given to both grinding efficiency and silicon wafer quality, if the grinding ability of the grinding wheel is too strong, for example, in the case that the mesh number of the grinding wheel is too low, although the grinding efficiency can be obviously improved, the morphology, flatness and smoothness of the silicon wafer surface obtained thereby will be deteriorated, because the larger grinding particles of the grinding wheel with too low mesh number will leave more obvious grinding traces on the silicon wafer surface; on the contrary, if the grinding wheel with too high mesh number is adopted to pursue the quality of the silicon chip, the grinding efficiency will be significantly reduced, the productivity will be affected, and the problem of how to balance the relationship between the quality of the silicon chip and the production efficiency is always concerned by the technicians in the field.
In order to solve the above problem, referring to fig. 3 and 4, an embodiment of the present invention provides a grinding wheel 100, where the grinding wheel 100 includes: a base 101; a plurality of grinding modules 102 extending from the same surface 1011 of the base 101, the plurality of grinding modules 102 being concentrically arranged and having different grinding capacities; wherein a height of each of the plurality of grinding modules 102 extending from the surface 1011 of the base 101 is adjustable such that the plurality of grinding modules 102 can perform grinding operations independently of one another. The following description will be given by taking fig. 3 and 4 as an example.
Referring to fig. 3 and 4, the grinding wheel 100 includes: a generally cylindrical base 101 and a plurality of grinding modules 102. In the example of fig. 3 and 4, the plurality of grinding modules 102 includes three grinding modules, i.e., a first grinding module 102A, a second grinding module 102B, and a third grinding module 102C, and in practical applications, the number of the grinding modules may be set according to requirements, and for example, the grinding modules may be designed to include two or four grinding modules.
It should be noted that the surface 1011 of the base 101 on which the grinding modules are disposed refers to the axial end surface 1011 of the base 101.
The three grinding modules are concentric to the center of rotation of the grinding wheel 100 and extend perpendicularly from one axial end face 1011 of the base 101, i.e. in the axial direction of the grinding wheel 100, wherein the free axial end face of each grinding module can be used for grinding silicon wafers.
According to one example of the invention, a part of each grinding module is embedded in the base 101, another part extends from the axial end face 1011 of the base 101, and the part of the grinding module embedded in the base is movable in the axial direction guided by the through hole, so that the height of each grinding module relative to the axial end face 1011 is adjustable.
As shown in fig. 3 and 4, the first polishing module 102A is located at a working position extending from the axial end surface 1011 more, and the second polishing module 102B and the third polishing module 102C are located at original positions accommodated in the base 101 or extending from the axial end surface 1011 of the base 101 less, in this case, the first polishing module 102A can be used to perform a polishing operation, and the second polishing module 102B and the third polishing module 102C do not contact the silicon wafer and thus do not affect the silicon wafer, and of course, the second polishing module 102B or the third polishing module 102C can be extended to the working position and the other polishing modules are located at the original positions as required.
The first grinding module 102A, the second grinding module 102B, and the third grinding module 102C have different grinding capacities from each other, and when the same silicon wafer is ground, one, two, or three of the three grinding modules may be used to perform grinding operations according to application requirements, wherein when two or three grinding modules are used to perform grinding operations, a processing sequence may be arranged according to actual requirements, for example, the grinding module with the highest grinding capacity may be selected to perform grinding in a first stage so that the thickness of the silicon wafer approaches a target thickness, and then the grinding module with the lower grinding capacity may perform subsequent grinding so as to improve the topography, flatness, and smoothness of the surface of the silicon wafer by eliminating grinding traces caused by a preceding process.
Embodiments of the present invention provide a grinding wheel 100; the grinding wheel 100 comprises a plurality of grinding modules 102 which have different grinding capacities and can grind independently from each other, so that a single grinding wheel 100 also has multiple grinding capacities, when the grinding wheel 100 is used for grinding a silicon wafer, the grinding module with stronger grinding capacity can be used for processing the thickness of the silicon wafer to be close to a target thickness in a labor-saving and efficient manner, the grinding module with weaker grinding capacity can be used for making the surface of the silicon wafer have better appearance, flatness and smoothness, the grinding wheel does not need to be replaced in the whole grinding process, the labor and time costs brought by related replacement operations are saved, the installation errors caused by replacing the grinding wheel are avoided, and the grinding efficiency is improved while the quality of the silicon wafer is ensured.
Regarding the motion relationship between the plurality of grinding modules, preferably, the plurality of grinding modules are arranged to be able to rotate independently of each other, specifically, three grinding modules may be arranged not to be engaged with each other and may be arranged to be driven by the driving shafts respectively to realize independent rotation, for example, as shown in fig. 3 and 4, when the first grinding module 102A is adjusted to extend out more from the axial end face 1101 of the base 101 to perform the grinding operation, only the first grinding module 102A may be driven to rotate, while the second grinding module 102B and the third grinding module 102C may be kept stationary without any influence of the first grinding module 102A, and similarly, the second grinding module 102B and the third grinding module 102C may also be driven to rotate independently of the other grinding modules respectively to perform the grinding operation, since only appropriate driving power needs to be input to drive the grinding module to perform the grinding operation to rotate for each grinding operation, and excessive driving power does not need to input to drive all the grinding modules to rotate, thereby avoiding waste of production resources and saving production costs.
For a particular implementation of the grinding wheel, each grinding module of said plurality of grinding modules 102 preferably comprises a plurality of grinding teeth distributed in a circumferential direction on said surface 1011 of said base 101.
In particular, with continued reference to fig. 3, the first grinding module 102A comprises a plurality of first grinding teeth 1021, the second grinding module 102B comprises a plurality of second grinding teeth 1022, the third grinding module 102C comprises a plurality of third grinding teeth 1023, the first grinding teeth 1021, the second grinding teeth 1022 and the third grinding teeth 1023 are distributed in the circumferential direction on an axial end face 1011 of the base 101, and when the grinding wheel 100 rotates around its rotation axis, the grinding teeth can be processed on the surface of the silicon wafer through the free axial end faces thereof, and since the three grinding modules have different grinding capacities from each other, the first grinding teeth 1021, the second grinding teeth 1022 and the third grinding teeth 1023 can have different mesh numbers from each other, for example, it is conceivable that the different grinding capacities of the three grinding modules can also be achieved in other ways, for example, the first grinding teeth 1021, the second grinding teeth 1022 and the third grinding teeth 1023 can have different tooth shapes and different numbers.
The specific distribution of the plurality of grinding modules on the base can be set according to the application requirements, preferably, as shown in fig. 3, said plurality of grinding modules are arranged adjacent to each other in a radial direction on said surface of said base.
Referring to fig. 3, three grinding modules are arranged at different radial positions on the axial end surface 1011 of the base 101 and adjacent to each other in the radial direction of the axial end surface 1011, each grinding module having a plurality of grinding teeth arranged in a circle, which arrangement not only enables a guaranteed grinding capacity but also facilitates independent rotation of the three grinding modules.
In order to achieve automatic switching of grinding modules, preferably, referring to fig. 5, the grinding wheel 100 further comprises a driving module 103 for driving each grinding module 102 to extend and retract from the surface 1011 of the base 101, and the driving module 103 may comprise, for example, a pneumatic device, a hydraulic device, an electric device, or the like. In practical applications, the grinding wheel 100 may further include a control module (not shown in the drawings) for precisely controlling the extending and retracting amounts of the grinding modules, and the control module may be programmed in advance according to product requirements, so that each grinding module can operate according to a preset operation sequence, thereby achieving precise control of the whole grinding process.
For an actual grinding operation, preferably a plurality of grinding modules 102 may be provided: the plurality of grinding modules 102 include a first grinding module 102A for performing rough grinding, a second grinding module 102B for performing intermediate grinding, and a third grinding module 102C for performing fine grinding, for example, the first grinding module 102A, the second grinding module 102B, and the third grinding module 102C may be sequentially made to perform grinding operations in a conventional operation sequence, that is, in the sequence of rough grinding, intermediate grinding, and fine grinding, which not only can improve grinding efficiency, but also can ensure the topography, flatness, and smoothness of the silicon wafer surface compared to a conventional grinding wheel.
In order to achieve different grinding capacities, the three grinding modules can have different or identical grinding tooth shapes, preferably, the grinding teeth of the three grinding modules can have identical shapes but different mesh numbers, based on which the mesh number of the grinding teeth of the second grinding module is larger than that of the first grinding module and smaller than that of the third grinding module, for example, the mesh number of the first grinding teeth 1021 is 3000#, the mesh number of the second grinding teeth 1022 is 5000#, and the mesh number of the third grinding teeth 1023 is 8000#.
Referring to fig. 6, an embodiment of the present invention further provides a grinding apparatus 10, where the grinding apparatus is configured to perform double-sided grinding on a silicon wafer, and the grinding apparatus 10 includes:
two static pressure support members 12, 13 disposed opposite to each other on both sides of the silicon wafer S, for supporting the silicon wafer S in a non-contact manner by providing a hydrostatic pressure;
two grinding wheels 100 are disposed opposite to each other on both sides of the silicon wafer S.
Embodiments of the present invention also provide a grinding method performed by using the grinding apparatus 10 according to the above.
Finally, the embodiment of the invention also provides a silicon wafer, and the silicon wafer is manufactured by using the grinding device 10.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A grinding wheel, comprising:
a base;
a plurality of grinding modules extending from the same surface of the base, the plurality of grinding modules being concentrically arranged and having different grinding capabilities;
wherein a height at which each of the plurality of abrading modules extends from the surface of the base is adjustable such that the plurality of abrading modules can perform abrading operations independently of one another.
2. A grinding wheel according to claim 1, characterized in that the plurality of grinding modules are arranged to be rotatable independently of each other.
3. The grinding wheel of claim 2, wherein each of the plurality of grinding modules comprises a plurality of grinding teeth distributed in a circumferential direction on the surface of the base.
4. A grinding wheel according to claim 2, wherein the plurality of grinding modules are arranged adjacent to each other in a radial direction on the surface of the base.
5. A grinding wheel according to claim 1, further comprising a drive module for driving each grinding module to extend and retract from the surface of the base.
6. A grinding wheel according to any of claims 2 to 5, wherein the plurality of grinding modules comprises a first grinding module for performing rough grinding, a second grinding module for performing intermediate grinding and a third grinding module for performing fine grinding.
7. A grinding wheel according to claim 6, wherein the mesh of the grinding teeth of the second grinding module is larger than the mesh of the grinding teeth of the first grinding module and smaller than the mesh of the grinding teeth of the third grinding module.
8. A grinding device for double-side grinding of a silicon wafer, comprising:
two static pressure support members oppositely arranged at two sides of the silicon chip, wherein the two static pressure support members are used for supporting the silicon chip in a non-contact mode by providing hydrostatic pressure;
two grinding wheels according to any one of claims 1 to 7 disposed opposite each other on both sides of the silicon wafer.
9. A grinding method, characterized in that the grinding method is performed by using the grinding apparatus according to claim 8.
10. A silicon wafer, characterized in that it is produced by using the polishing apparatus according to claim 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211230927.5A CN115635415A (en) | 2022-09-30 | 2022-09-30 | Grinding wheel, grinding device, grinding method and silicon wafer |
| TW112104089A TWI832694B (en) | 2022-09-30 | 2023-02-06 | Grinding wheel, grinding device, grinding method and silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211230927.5A CN115635415A (en) | 2022-09-30 | 2022-09-30 | Grinding wheel, grinding device, grinding method and silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN115635415A true CN115635415A (en) | 2023-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211230927.5A Pending CN115635415A (en) | 2022-09-30 | 2022-09-30 | Grinding wheel, grinding device, grinding method and silicon wafer |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003181766A (en) * | 2001-12-17 | 2003-07-02 | Masao Nishiki | Grinding tool and polishing tool |
| US20040048552A1 (en) * | 2000-06-19 | 2004-03-11 | Kisboell Klaus | Multi-zone grinding and/or polishing sheet |
| CN202088084U (en) * | 2011-01-28 | 2011-12-28 | 绿能科技股份有限公司 | Grinding mechanism |
| CN103203682A (en) * | 2012-01-11 | 2013-07-17 | 新东工业株式会社 | Polishing brush and polishing method |
| US20160101500A1 (en) * | 2014-10-09 | 2016-04-14 | Applied Materials, Inc. | Chemical mechanical polishing pad with internal channels |
| CN114161245A (en) * | 2021-11-19 | 2022-03-11 | 万华化学集团电子材料有限公司 | Silicon wafer thinning device and thinning processing technology for monocrystalline silicon wafer |
| CN114473842A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | Grinding disc, chemical mechanical polishing device, system and method |
| CN217371901U (en) * | 2022-04-27 | 2022-09-06 | 西安奕斯伟材料科技有限公司 | Grinding wheel, double-side grinding device and silicon wafer |
-
2022
- 2022-09-30 CN CN202211230927.5A patent/CN115635415A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040048552A1 (en) * | 2000-06-19 | 2004-03-11 | Kisboell Klaus | Multi-zone grinding and/or polishing sheet |
| JP2003181766A (en) * | 2001-12-17 | 2003-07-02 | Masao Nishiki | Grinding tool and polishing tool |
| CN202088084U (en) * | 2011-01-28 | 2011-12-28 | 绿能科技股份有限公司 | Grinding mechanism |
| CN103203682A (en) * | 2012-01-11 | 2013-07-17 | 新东工业株式会社 | Polishing brush and polishing method |
| US20160101500A1 (en) * | 2014-10-09 | 2016-04-14 | Applied Materials, Inc. | Chemical mechanical polishing pad with internal channels |
| CN114473842A (en) * | 2020-11-11 | 2022-05-13 | 中国科学院微电子研究所 | Grinding disc, chemical mechanical polishing device, system and method |
| CN114161245A (en) * | 2021-11-19 | 2022-03-11 | 万华化学集团电子材料有限公司 | Silicon wafer thinning device and thinning processing technology for monocrystalline silicon wafer |
| CN217371901U (en) * | 2022-04-27 | 2022-09-06 | 西安奕斯伟材料科技有限公司 | Grinding wheel, double-side grinding device and silicon wafer |
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| TW202330154A (en) | 2023-08-01 |
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