CN111805400A - Polishing device - Google Patents

Polishing device Download PDF

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Publication number
CN111805400A
CN111805400A CN202010695473.3A CN202010695473A CN111805400A CN 111805400 A CN111805400 A CN 111805400A CN 202010695473 A CN202010695473 A CN 202010695473A CN 111805400 A CN111805400 A CN 111805400A
Authority
CN
China
Prior art keywords
polishing
disc
wafer
disk
driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010695473.3A
Other languages
Chinese (zh)
Inventor
具滋贤
张月
卢一泓
刘青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Microelectronics of CAS, Zhenxin Beijing Semiconductor Co Ltd filed Critical Institute of Microelectronics of CAS
Priority to CN202010695473.3A priority Critical patent/CN111805400A/en
Publication of CN111805400A publication Critical patent/CN111805400A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention provides a polishing device, which is applied to a wafer, and comprises: the polishing device comprises an upper polishing disk, a lower polishing disk, a limiting disk and a driving mechanism; the upper polishing disc is positioned on one side of the limiting disc facing a first direction, the lower polishing disc is positioned on one side of the limiting disc facing a second direction, and the first direction and the second direction are opposite; the rotating center of the lower polishing disk, the rotating center of the limiting disk and the rotating center of the upper polishing disk are on the same rotating central line; the limiting disc is used for bearing a wafer, and the wafer penetrates through the limiting disc along a first direction; the driving mechanism is used for respectively driving the upper polishing disk and the lower polishing disk to rotate relative to the rotating central line, so that the upper polishing disk and the lower polishing disk respectively polish two opposite ends of the wafer. The invention can simultaneously polish two opposite surfaces of the wafer.

Description

Polishing device
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to a polishing device.
Background
In the wafer manufacturing process, it is usually necessary to perform a chemical mechanical polishing process on the back surface of the wafer to remove particles on the back surface of the wafer.
However, after the chemical mechanical polishing process is performed on the back surface of the wafer, other devices are required to be introduced to perform the chemical mechanical polishing on the front surface of the wafer, which not only prolongs the wafer manufacturing time and reduces the wafer production efficiency, but also increases the devices used for wafer manufacturing and increases the wafer production cost.
Disclosure of Invention
In order to solve the problems, the polishing device provided by the invention can simultaneously polish two opposite surfaces of a wafer through the upper polishing disk and the lower polishing disk.
The invention provides a polishing device, which is applied to a wafer, and comprises: the polishing device comprises an upper polishing disk, a lower polishing disk, a limiting disk and a driving mechanism;
the upper polishing disc is positioned on one side of the limiting disc facing a first direction, the lower polishing disc is positioned on one side of the limiting disc facing a second direction, and the first direction and the second direction are opposite directions;
the rotating center of the lower polishing disc, the rotating center of the limiting disc and the rotating center of the upper polishing disc are on the same rotating central line;
the limiting disc is used for bearing the wafer, and the wafer penetrates through the limiting disc along a first direction;
the driving mechanism is used for respectively driving the upper polishing disk and the lower polishing disk to rotate relative to the rotating central line, so that the upper polishing disk and the lower polishing disk respectively polish two opposite ends of a wafer.
Optionally, the polishing apparatus further comprises: a central rotating shaft;
the central rotating shaft penetrates through the lower polishing disc, the limiting disc and the upper polishing disc, and the shaft axis of the central rotating shaft is coincided with the rotating central line.
Optionally, the limiting disc is fixedly connected with the central rotating shaft, and the upper polishing disc and the lower polishing disc are rotatably connected with the central rotating shaft.
Optionally, the surface of the limiting disc is provided with at least one through hole, the wafer penetrates through the limiting disc along a first direction through the at least one through hole, and the at least one through hole is located on the peripheral side of the central rotating shaft.
Optionally, a buffer ring is sleeved in the at least one through hole.
Optionally, the drive mechanism comprises: a first driving member;
the first driving piece is used for driving the limiting disc to rotate along a third direction;
the first driving piece is also used for driving the limiting disc to rotate for a specified angle along a fourth direction.
Optionally, the drive mechanism further comprises: a second driving member;
the second driving piece is used for driving the upper polishing disc and the lower polishing disc to rotate along a third direction.
Optionally, the upper polishing pad comprises: an upper platen and an upper polishing pad;
the upper polishing pad is fixedly arranged on one side of the upper pressure plate facing to the second direction.
Optionally, the lower polishing disc comprises: a lower platen and a lower polishing pad;
the lower polishing pad is fixedly arranged on one side of the lower pressing plate facing to the first direction.
Optionally, the drive mechanism further comprises; a third driving member;
the third driving piece is used for adjusting the relative distance between the upper polishing disk and the lower polishing disk.
According to the polishing device provided by the embodiment of the invention, the upper polishing disk and the lower polishing disk can be driven to rotate by the driving mechanism, so that the upper polishing disk and the lower polishing disk can simultaneously polish two opposite surfaces of a wafer, the time for polishing the wafer can be saved, the investment of polishing equipment is reduced, the production efficiency of the wafer can be improved, and the production cost of the wafer is reduced; the arrangement of the limiting disc can limit the wafer, so that the polishing uniformity can be ensured.
Drawings
Fig. 1 is a structural view of a polishing apparatus according to an embodiment of the present application, in section, showing a part between an upper platen and a lower platen;
fig. 2 is a top view showing a positional relationship between a retainer plate and a lower polishing plate according to an embodiment of the present application.
Reference numerals
100. A wafer; 200. an upper polishing disk; 201. an upper platen; 202. an upper polishing pad; 300. a lower polishing disk; 301. a lower platen; 302. a lower polishing pad; 400. a limiting disc; 401. a through hole; 402. a buffer ring; 500. a central rotating shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present embodiment provides a polishing apparatus applied to a wafer 100, and with reference to fig. 1, the polishing apparatus includes: an upper polishing disk 200, a lower polishing disk 300, a limiting disk 400 and a driving mechanism. Wherein, the upper polishing plate 200 is located at one side of the limiting plate 400 facing the first direction; the lower polishing plate 300 is positioned on one side of the limiting plate 400 facing the second direction; the first direction and the second direction are two opposite directions, in this embodiment, the first direction is an upward direction, and the second direction is a downward direction. The rotation center of the lower polishing disk 300, the rotation center of the spacing disk 400, and the rotation center of the upper polishing disk 200 are on the same rotation center line. The driving mechanism is used for respectively driving the upper polishing disk 200 and the lower polishing disk 300 to rotate relative to the rotation center line, so that the upper polishing disk 200 and the lower polishing disk 300 respectively polish the two opposite ends of the wafer 100. The retainer plate 400 is used for supporting the wafer 100.
The upper polishing pad 200 includes: an upper platen 201 and an upper polishing pad 202. The upper polishing pad 202 is fixedly disposed on a side of the upper platen 201 facing the second direction. The lower polishing plate 300 includes: a lower platen 301 and a lower polishing pad 302. The lower polishing pad 302 is fixedly disposed on a side of the lower platen 301 facing the first direction.
The polishing apparatus further includes: a central rotating shaft 500. The central shaft 500 penetrates through the lower platen 301, the lower polishing pad 302, the limiting plate 400, the upper polishing pad 202 and the upper platen 201 along the first direction, and the axis of the central shaft 500 coincides with the rotation center line.
The drive mechanism includes: the first driving piece, the second driving piece and the third driving piece. The first driving member is used for driving the limiting disc 400 to rotate along the third direction; the second driving member is used for driving the upper polishing disc 200 and the lower polishing disc 300 to rotate along a third direction; the third driving member is used to adjust the relative distance between the upper polishing pad 200 and the lower polishing pad 300. The first driving member can drive the limiting disc 400 to rotate along the third direction when the upper polishing pad 202 and the lower polishing pad 302 polish the wafer 100 at the same time, so that the uniformity of the polished wafer 100 can be further improved.
In this embodiment, the third direction is a counterclockwise direction or a clockwise direction in the horizontal direction, and in this embodiment, the third direction is a counterclockwise direction; the limiting disc 400 is fixedly connected with the central rotating shaft 500, and the upper polishing disc 200 and the lower polishing disc 300 are rotatably connected with the central rotating shaft 500; the first driving member is a servo motor, an output shaft of the servo motor is fixedly connected with one end of the central rotating shaft 500, so that the first driving member drives the central rotating shaft 500 to rotate along the third direction, and the central rotating shaft 500 can drive the limiting disc 400 to rotate along the third direction; the second driving member may be a belt driving member or a gear driving member, and in this embodiment, the second driving member is a belt driving member, and the belt driving member can drive the upper platen 201 and the lower platen 301 to rotate along the third direction through the conveyor belt; the third driving piece can be hydraulic cylinder or flexible pole, the third driving piece is hydraulic cylinder in this embodiment, hydraulic cylinder's lifter and last pressure disk 201 fixed connection, it slides along first direction and second direction with central pivot 500 to go up pressure disk 201 and last polishing pad 202 and be connected, hydraulic cylinder reciprocates through the drive lifter and can adjust the relative distance of polishing pad 202 and lower polishing pad 302, thereby can be at the in-process of polishing, through pressure disk 201 on the downstream, make and go up polishing pad 202 and lower polishing pad 302 and continue to polish wafer 100.
Referring to fig. 2, at least one through hole 401 is formed on the surface of the limiting plate 400, and the wafer 100 penetrates through the limiting plate 400 through the at least one through hole 401 along the first direction. In this embodiment, the number of the through holes 401 is four, and the four through holes 401 are symmetrically arranged on the peripheral side of the central rotating shaft 500. A buffer ring 402 is sleeved in each through hole 401, the buffer ring 402 is fixedly connected with the limiting disc 400, and the buffer ring 402 is used for buffering the thrust applied by the limiting ring to the wafer 100 so as to prevent the edge of the wafer 100 from being damaged; a wafer 100 is placed in each buffer ring 402, and the wafer 100 is clamped with the limiting disc 400 through the buffer ring 402, or the stability of the wafer 100 in the through hole is increased, so that the wafer 100 is prevented from being thrown out of the limiting ring, and thus the polishing device can polish two sides of four wafers 100 at the same time, and the polishing efficiency of the polishing device is further improved. The thickness of the retainer plate 400 is smaller than the final polishing target thickness of the wafer 100, so that the friction between the retainer plate 400 and the upper polishing pad 202 or/and the lower polishing pad 302 during the polishing process can be avoided.
The polishing apparatus further includes: and at least one robot for mounting the wafer 100 to the stopping disk 400 and for unloading the polished wafer 100 from the stopping disk 400. The first driving member is further configured to drive the limiting disc 400 to rotate by a specified angle along a fourth direction, where the fourth direction is a counterclockwise direction or a clockwise direction in the horizontal direction, and in this embodiment, the fourth direction is a counterclockwise direction; this can facilitate the mounting and dismounting of the wafer 100. In this embodiment, the number of the robot is one, and the first driving member can intermittently drive the limiting disc 400 to rotate 90 degrees in the third direction, so that in the process of mounting the wafer 100, every time one wafer 100 is mounted in one through hole 401, the first driving member drives the limiting disc 400 to rotate 90 degrees in the third direction, so that the robot does not need to rotate around the limiting disc 400 to find the through hole 401 where no wafer 100 is placed, and only the next wafer 100 needs to be placed at the position where the previous wafer 100 is placed, thereby improving the mounting efficiency of the wafer 100. This is also true during the unloading of the wafer 100, and will not be described herein.
When the number of the robots is two, the first driving member may intermittently drive the limiting plate 400 to rotate 180 degrees in the third direction, so that the two robots can simultaneously mount or unload the wafer 100.
The polishing device has a simple structure, and drives the upper polishing disk 200 and the lower polishing disk 300 to rotate through the driving mechanism, so that the upper polishing disk 200 and the lower polishing disk 300 simultaneously polish two opposite surfaces of the wafer 100, namely, particles on the back surface of the wafer 100 can be removed when the front surface of the wafer 100 is polished, thereby saving the polishing time of the wafer 100, reducing the investment of polishing equipment, reducing the probability of defocusing of the wafer 100, improving the production efficiency of the wafer 100, reducing the production cost of the wafer 100 and improving the polishing quality; the arrangement of the limiting disc 400 can limit the wafer 100, so that the polishing uniformity can be ensured.
In an alternative embodiment, the limiting plate 400 is rotatably connected to the central rotating shaft 500, the first driving member may be a belt driving member or a gear driving member, and in this embodiment, the first driving member is a belt driving member, and the belt driving member drives the limiting plate 400 to rotate along the third direction through a belt.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A polishing device applied to a wafer is characterized by comprising: the polishing device comprises an upper polishing disk, a lower polishing disk, a limiting disk and a driving mechanism;
the upper polishing disc is positioned on one side of the limiting disc facing a first direction, the lower polishing disc is positioned on one side of the limiting disc facing a second direction, and the first direction and the second direction are opposite directions;
the rotating center of the lower polishing disc, the rotating center of the limiting disc and the rotating center of the upper polishing disc are on the same rotating central line;
the limiting disc is used for bearing the wafer, and the wafer penetrates through the limiting disc along a first direction;
the driving mechanism is used for respectively driving the upper polishing disk and the lower polishing disk to rotate relative to the rotating central line, so that the upper polishing disk and the lower polishing disk respectively polish two opposite ends of a wafer.
2. The polishing apparatus according to claim 1, further comprising: a central rotating shaft;
the central rotating shaft penetrates through the lower polishing disc, the limiting disc and the upper polishing disc, and the shaft axis of the central rotating shaft is coincided with the rotating central line.
3. The polishing apparatus as recited in claim 2, wherein the retainer plate is fixedly coupled to the central shaft, and the upper polishing plate and the lower polishing plate are rotatably coupled to the central shaft.
4. The polishing apparatus as claimed in claim 2, wherein at least one through hole is formed in a surface of the retainer plate, the wafer penetrates the retainer plate through the at least one through hole in the first direction, and the at least one through hole is located on a peripheral side of the central shaft.
5. The polishing apparatus as recited in claim 4, wherein a buffer ring is fitted into the at least one through hole.
6. The polishing apparatus according to claim 1, wherein the drive mechanism comprises: a first driving member;
the first driving piece is used for driving the limiting disc to rotate along a third direction;
the first driving piece is also used for driving the limiting disc to rotate for a specified angle along a fourth direction.
7. The polishing apparatus according to claim 1, wherein the drive mechanism further comprises: a second driving member;
the second driving piece is used for driving the upper polishing disc and the lower polishing disc to rotate along a third direction.
8. The polishing apparatus as recited in claim 1, wherein the upper polishing pad comprises: an upper platen and an upper polishing pad;
the upper polishing pad is fixedly arranged on one side of the upper pressure plate facing to the second direction.
9. The polishing apparatus as recited in claim 1, wherein the lower polishing plate comprises: a lower platen and a lower polishing pad;
the lower polishing pad is fixedly arranged on one side of the lower pressing plate facing to the first direction.
10. The polishing apparatus according to claim 1, wherein the drive mechanism further comprises; a third driving member;
the third driving piece is used for adjusting the relative distance between the upper polishing disk and the lower polishing disk.
CN202010695473.3A 2020-07-17 2020-07-17 Polishing device Pending CN111805400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010695473.3A CN111805400A (en) 2020-07-17 2020-07-17 Polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010695473.3A CN111805400A (en) 2020-07-17 2020-07-17 Polishing device

Publications (1)

Publication Number Publication Date
CN111805400A true CN111805400A (en) 2020-10-23

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CN202010695473.3A Pending CN111805400A (en) 2020-07-17 2020-07-17 Polishing device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113561051A (en) * 2021-07-28 2021-10-29 上海申和热磁电子有限公司 Wafer regeneration processing device and control system
CN114952576A (en) * 2022-06-28 2022-08-30 广东先导微电子科技有限公司 Semiconductor double-side polishing device and semiconductor polishing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1441713A (en) * 2000-05-31 2003-09-10 三菱住友硅晶株式会社 Method of polishing semiconductor wafer by using double-sided polisher
CN101036976A (en) * 2006-03-13 2007-09-19 中国科学院半导体研究所 Twp-sided polishing machine
CN207344353U (en) * 2017-10-24 2018-05-11 江苏中科晶元信息材料有限公司 A kind of Ultra-precision Double Polishing Machine for chip processing
JP2019034357A (en) * 2017-08-10 2019-03-07 住友電工焼結合金株式会社 Workpiece carrier, double-end surface grinder, and double-sided abrasive machining method for workpiece
CN110235225A (en) * 2016-11-02 2019-09-13 胜高股份有限公司 The twin polishing method of semiconductor wafer
CN210307278U (en) * 2019-08-09 2020-04-14 衢州学院 Vertical double-sided grinding equipment for sapphire slices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1441713A (en) * 2000-05-31 2003-09-10 三菱住友硅晶株式会社 Method of polishing semiconductor wafer by using double-sided polisher
CN101036976A (en) * 2006-03-13 2007-09-19 中国科学院半导体研究所 Twp-sided polishing machine
CN110235225A (en) * 2016-11-02 2019-09-13 胜高股份有限公司 The twin polishing method of semiconductor wafer
JP2019034357A (en) * 2017-08-10 2019-03-07 住友電工焼結合金株式会社 Workpiece carrier, double-end surface grinder, and double-sided abrasive machining method for workpiece
CN207344353U (en) * 2017-10-24 2018-05-11 江苏中科晶元信息材料有限公司 A kind of Ultra-precision Double Polishing Machine for chip processing
CN210307278U (en) * 2019-08-09 2020-04-14 衢州学院 Vertical double-sided grinding equipment for sapphire slices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113561051A (en) * 2021-07-28 2021-10-29 上海申和热磁电子有限公司 Wafer regeneration processing device and control system
CN113561051B (en) * 2021-07-28 2022-04-19 上海申和投资有限公司 Wafer regeneration processing device and control system
CN114952576A (en) * 2022-06-28 2022-08-30 广东先导微电子科技有限公司 Semiconductor double-side polishing device and semiconductor polishing method

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Application publication date: 20201023

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