WO2010137616A1 - 接合体 - Google Patents
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- WO2010137616A1 WO2010137616A1 PCT/JP2010/058898 JP2010058898W WO2010137616A1 WO 2010137616 A1 WO2010137616 A1 WO 2010137616A1 JP 2010058898 W JP2010058898 W JP 2010058898W WO 2010137616 A1 WO2010137616 A1 WO 2010137616A1
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- WIPO (PCT)
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- joined
- bonded
- bonding
- sintered body
- cbn
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
- B23K31/025—Connecting cutting edges or the like to tools; Attaching reinforcements to workpieces, e.g. wear-resisting zones to tableware
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
- B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/008—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating pressure combined with radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/327—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/12—Boron nitride
- B23B2226/125—Boron nitride cubic [CBN]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2226/00—Materials of tools or workpieces not comprising a metal
- B23B2226/31—Diamond
- B23B2226/315—Diamond polycrystalline [PCD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2240/00—Details of connections of tools or workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- the present invention relates to a joined body, and particularly to a joined body suitable for a cutting tool.
- Non-Patent Document 1 tools in which cBN and cemented carbide are joined by brazing are manufactured and sold (eg, Igetaroy cutting tools ('07 -'08 general catalog) issued by Sumitomo Electric Hardmetal Corporation), October 2006, p.L4, Coated Sumiboron Series (Non-Patent Document 1)).
- a joined body in which PCD (sintered diamond) or cBN and ceramics or cermet are joined by brazing has been proposed (for example, Japanese Patent Laid-Open No. 2002-360008 (Patent Document 1), Japanese Patent Laid-Open No. 11-320218). Publication (Patent Document 2)).
- a cutting tool has also been proposed in which a cemented carbide or cermet and high-speed steel or the like are joined by brazing using a Cu brazing material (for example, Japanese Patent Laid-Open No. 11-294058 (Patent Document 3)). .
- JP 2002-360008 A JP-A-11-320218 Japanese Patent Laid-Open No. 11-294058
- brazing material shows a liquid phase at about 700 to 800 ° C. For this reason, it has been difficult to use a cutting tool using a joined body by brazing for high-speed cutting or the like that may exceed the aforementioned temperature during cutting. Moreover, the liquid phase produced
- the cBN sintered body and the diamond sintered body move back and forth, right and left with respect to the cemented carbide base material and become slanted due to the melting of the brazing material. It was difficult to stabilize the cutting edge position with respect to the carbide substrate. For this reason, there existed a problem that the grinding amount and grinding time of to-be-joined materials, such as a cBN sintered compact after joining, increased. In order to cope with this problem, it is necessary to prepare a larger cBN sintered body and diamond sintered body in consideration of the amount of movement of the cBN sintered body and diamond sintered body and the amount of grinding at the time of joining. there were.
- the present invention does not reduce the bonding strength of the bonding layer even when the temperature exceeds the temperature at which the brazing material generates a liquid phase during cutting, and the cBN sintered body has a large grinding allowance. It is another object of the present invention to provide a joined body suitable as a cutting tool that does not require the preparation of a diamond sintered body.
- a joined body according to the present invention is a joined body having a cemented carbide sintered body as a first material to be joined and a cBN sintered body or a diamond sintered body as a second material to be joined.
- 1 to-be-joined material and 2nd to-be-joined material are joined through the joining material which produces
- the material to be joined and the second material to be joined are joined by being heated by energization while being pressurized at a pressure of 0.1 MPa to 200 MPa.
- a first material to be joined made of a sintered cemented carbide sintered body and a second material to be joined made of a sintered cBN sintered body or a diamond sintered body are between them.
- a reduction in joining strength can be suppressed, and a cutting tool suitable for high-speed cutting can be provided.
- the thickness of the bonding material can be controlled to 30 ⁇ m or less, preferably 10 ⁇ m or less by conducting current heating while applying pressure, and the bonding position of the cBN sintered body or diamond sintered body can be constant with respect to the cemented carbide substrate.
- the amount of grinding after joining can be made smaller than in the case of brazing, and the amount of movement and grinding of the cBN sintered body can be designed to the minimum necessary size, and the cBN sintered body can be made smaller, which is expensive.
- the amount of cBN sintered body used can be suppressed.
- the cBN sintered body and the diamond sintered body, which are the second materials to be joined, are vulnerable to heat and easily decomposed at high temperatures, so that they are easily deteriorated by heat in a short time. For this reason, the first material to be joined and the second material to be joined by brazing joining which requires a long time of 10 minutes or more for joining using a joining material that generates a liquid phase at a temperature exceeding 800 ° C. and less than 1000 ° C. It was difficult to obtain a joined body with the material.
- the joining is performed by energization heating while applying a pressure of 0.1 MPa to 200 MPa between the first material to be joined and the second material to be joined, several seconds to several A strong bond can be obtained in an extremely short time within minutes.
- the preferred energization time is within 1 minute, particularly preferably within 30 seconds.
- the contact resistance between the cBN sintered body, diamond sintered body and cemented carbide sintered body, which is the material to be joined, and the electrode increases, and current does not flow or discharge. There is.
- the applied pressure is too large, there is a problem that the cBN sintered body or the cemented carbide sintered body is deformed.
- the pressurizing force is preferably 0.1 MPa to 200 MPa, these problems do not occur and a preferable joined body can be obtained.
- the pressure is 1 MPa to 100 MPa, an appropriate contact resistance is obtained, and heat generation at the joining surface is more efficiently performed. More preferably, when the pressure is 10 MPa to 70 MPa, the contact resistance is further appropriate, and the object to be joined is further deformed. This is more preferable.
- the cBN sintered body exceeds 50%, the difference in thermal expansion coefficient from the cemented carbide as the base material is large, and it is considered that the cBN sintered body is cracked during the cooling process after joining. It is also considered that the metal binder of the cBN sintered body or the diamond sintered body generates a liquid phase at a temperature of 1000 ° C. or higher, and cracks are generated in the cBN sintered body or the diamond sintered body.
- a bonding material that generates a liquid phase at a temperature of less than 1000 ° C. is used. For this reason, even when a cemented carbide and a cBN sintered body and a diamond sintered body containing a metal binder such as Co, and / or a sintered body having a cBN content ratio exceeding 70% and a cemented carbide are joined, Since the thermal load applied to the cBN sintered body and the diamond sintered body is smaller than that in the case of bonding at 1000 ° C. or higher, and the thermal expansion amount is also small, between the metal binder or cemented carbide and cBN and diamond.
- the thermal stress generated by the difference in thermal expansion coefficient is reduced, and it is difficult to introduce cracks into the cBN sintered body and the diamond sintered body, and good bonding can be performed.
- the metal binder in a cBN sintered compact or a diamond sintered compact does not produce
- the bonding material may be a bonding material that generates a liquid phase at a temperature of 900 ° C. or higher and lower than 1000 ° C.
- the first member to be joined may generate heat preferentially over the second member to be joined by energization heating, and may be joined.
- the cemented carbide sintered body that is the first material to be joined is heated and joined preferentially over the cBN sintered body and the diamond sintered body that are the second material to be joined.
- a cBN sintered body and a diamond sintered body have higher electric resistance than a cemented carbide sintered body. Therefore, when energized and heated, the cBN sintered body and the diamond sintered body, which are the second materials to be joined, are the first. Heat is generated preferentially over the cemented carbide sintered body, which is a material to be bonded, and may cause quality degradation (thermal degradation, decomposition, crack generation, etc.) of the cBN sintered body and the diamond sintered body.
- the second bonded material is heated so that the first bonded material generates heat preferentially over the second bonded material during energization heating.
- the bonding material, the arrangement of the bonding material, and the energization method can be changed.
- the material of the electrode By changing the material of the electrode, the amount of current flowing through each of the first material to be bonded and the second material to be bonded is different, so that each heat generation can be controlled.
- the first material to be bonded may be heated more intensively than the second material to be bonded, and the second material to be bonded may be indirectly heated.
- the first material to be joined can be preferentially heated over the second material to be joined.
- the cBN sintered body and the diamond sintered body, which are the second materials to be joined are heated in a short time, specifically within, for example, within 1 minute, preferably within 30 seconds without being heated at a higher temperature than necessary. Since the vicinity of the bonding material can be heated at a high temperature, strong bonding is possible, and cBN is not deteriorated (thermal deterioration, decomposition, crack generation, etc.) without causing quality deterioration of the cBN sintered body or diamond sintered body.
- Features such as the high hardness of the sintered body and the diamond sintered body can be fully utilized.
- At least one element of the joining material components may be diffused into the first joined material and / or the second joined material by energization heating.
- the first bonded material and the second bonded material are diffused. Bonding with a material to be bonded is performed more efficiently, and a bonded body with higher bonding strength can be obtained.
- the joined body may be joined using a joining material that is deformed by energization heating while being pressurized.
- the bonding material is made of an alloy containing at least one of titanium (Ti), zirconium (Zr), cobalt (Co), nickel (Ni), silver (Ag), and copper (Cu). Also good.
- Ti, Co which are generally used as binder phase components of the cemented carbide sintered body that is the first material to be joined and the cBN sintered body and the diamond sintered body that are the second material to be joined. Since a bonding material made of an alloy containing at least one of Ag, Cu, and Zr that exhibits excellent wettability with respect to Ni or a cBN sintered body or diamond sintered body is used, a bonded body with higher bonding strength Can be obtained.
- Examples of such a bonding material include an Ag—Cu alloy, an Ag—Ti alloy, an Ag—Zr alloy, a Cu—Si alloy, a Cu—Ti alloy, a Cu—Zr alloy, a Ni—Ti alloy, a Ni—Zr alloy, Examples thereof include Cu—Mn alloys, Ni—Zn alloys, and solid solutions thereof, such as Cu—Ti—Zr alloys, Ag—Cu—Ti alloys, and intermetallic compounds thereof.
- the intermetallic compound may be contained in the bonding material from the beginning.
- the elements constituting the intermetallic compound may be included in the bonding material in separate states, and may be generated by reaction during bonding. When an intermetallic compound is produced by reaction, reaction heat can be used for joining, which is more effective for joining.
- the bonding material may contain titanium (Ti).
- Ti titanium
- At least a part of the bonding material may generate a liquid phase during energization heating.
- the bonded component easily diffuses into the first bonded material and the second bonded material, 1 to-be-joined material and 2nd to-be-joined material can be joined firmly.
- nickel (Ni) contained in the bonding phase of the bonding material and / or the first bonded material may be 30 vol% (volume percentage) or less.
- the nickel (Ni) contained in the bonding phase of the bonding material or the first bonded material is set to 30 vol% or less.
- the bonded body is coated with CVD for the purpose of improving wear resistance. This is because there is a high possibility that the chlorine gas used as the CVD coating material reacts with the bonding material or the first bonded material to cause abnormal growth of the CVD film.
- the bonding material may be provided on the surface of the first bonded material and / or the second bonded material by a plating method.
- the bonding material is provided on the surface of the first bonded material or the second bonded material by plating.
- the plating method makes it easier to control the thickness of the bonding material than to apply the bonding material in the form of powder or paste, and can be easily controlled to 50 ⁇ m or less.
- the thickness of the bonding material after bonding can be set to 30 ⁇ m or less, preferably 10 ⁇ m or less, and the bonding quality can be stabilized.
- it is easy to automate the process which is preferable in terms of cost and quality stability.
- the bonding material may be provided on the surface of the first bonded material and / or the second bonded material by physical vapor deposition.
- the bonding material is provided on the surface of the first bonded material or the second bonded material by physical vapor deposition.
- the physical vapor deposition method makes it easier to control the thickness of the bonding material than when the bonding material is applied in the form of powder or paste, and can be easily controlled to 50 ⁇ m or less.
- the thickness of the bonding material after bonding can be set to 30 ⁇ m or less, preferably 10 ⁇ m or less, and the bonding quality can be stabilized.
- it is easy to mechanize and automate which is preferable in terms of cost and quality stability. Particularly preferred is the case where the film is formed by sputtering or arc evaporation.
- the joined body may be a cutting tool.
- the joined body uses the cemented carbide sintered body as the first joined material and the cBN sintered body and the diamond sintered body as the second joined material as the joined materials, A joined body obtained by joining via a joining material can be suitably used as a cutting tool.
- Specific cutting tools include, for example, rotary tools such as drills, end mills, and reamers in addition to cutting tips.
- the tool of the present invention can provide a cutting tool in which the bonding strength of the bonding material does not decrease even in high-speed cutting in which the brazing material has a temperature higher than the temperature at which a liquid phase is generated.
- the cBN sintered body and the diamond sintered body do not cause quality deterioration (thermal deterioration, decomposition, crack generation, etc.) of the cBN sintered body and the diamond sintered body which are high-pressure stable materials. It is possible to provide a tool that can fully utilize characteristics such as high hardness of the body. In particular, it can be suitably provided as a tool such as a wear-resistant tool, a mining / civil engineering tool, a cutting tool, and the like.
- the second material to be bonded can be bonded to the first material to be bonded without necessarily requiring a back metal (a thin cemented carbide layer provided on the opposite side of the cutting surface).
- a back metal a thin cemented carbide layer provided on the opposite side of the cutting surface.
- the joined body of the second material to be joined and the first material to be joined having the back metal is not excluded from the present invention.
- a cBN sintered body and a diamond sintered body having a large grinding allowance are prepared without decreasing the bonding strength of the bonding layer even when the temperature exceeds the temperature at which the brazing material generates a liquid phase during cutting. Therefore, even if a cBN sintered body or a diamond sintered body that is liable to crack during joining is joined, a joined body suitable as a cutting tool can be provided.
- FIG. 1 is a conceptual diagram illustrating one form of energization in energization / pressure bonding.
- the materials 1 and 3 to be joined are a first material to be joined (a cemented carbide sintered body) and a second material to be joined (a cBN sintered body or a diamond sintered body), respectively. Bonded using the bonded material 2.
- the materials to be bonded 1 and 3 and the bonding material 2 are sandwiched between electrodes (graphite) 4 and pressurized, and a current is passed through the electrode 4. Since the electrode 4 spans both the material to be bonded 1 and the material to be bonded 3, even if the electric resistance of any of the materials to be bonded is high, the electrode 4 is sufficient for bonding through the material to be bonded having the lower electric resistance. An electric circuit through which a current flows can be formed.
- the bonding material 2 a material that generates a liquid phase at a temperature higher than 800 ° C. and lower than 1000 ° C. by energization heating is used. At this time, it is desirable that the bonding material 2 is a material having the characteristics shown in the means for solving the above problems.
- the bonding material 2 By passing an electric current through the electrode 4, the bonding material 2 generates resistance heat together with the bonded materials 1 and 3, and the bonded materials 1 and 3 are bonded.
- the material of the two electrodes 4 is of course conductive, but it is desirable that the material does not react with the materials to be bonded 1, 3, and the bonding material 2. However, even if it reacts, the reaction with the electrode can be suppressed by disposing a carbon sheet between each of the materials 1 and 3 to be joined.
- FIG. 2 is a conceptual diagram illustrating another form of energization in energization / pressure bonding.
- the divided electrode 5 is in contact with the second material to be bonded 3
- the electrode 4 is in contact with the first material to be bonded 1.
- the electric conductivity and the thermal conductivity can be changed, and different currents can be applied to the first and second bonded materials. It becomes possible, and it becomes possible to change each temperature extremely. Thereby, even to-be-joined material which is easy to cause thermal degradation, it can join, without causing thermal degradation.
- the pressure applied to the first material to be joined and the second material to be joined can be controlled with high accuracy by dividing the electrodes and pressurizing each electrode independently, thus improving the joining strength. This is preferable.
- FIG. 3 is a conceptual diagram explaining one form at the time of carrying out the electricity pressurization joining of the rotary tool.
- a material to be bonded 1 and a material to be bonded 3 are arranged with a bonding material 2 interposed therebetween, and an electrode 4 is in contact with each material to be bonded.
- a voltage between the electrodes By applying a voltage between the electrodes, a current flows through the materials to be bonded 1 and 3 and the bonding material 2, and they are bonded by being heated. In order to flow a current sufficient for heating, it is preferable that the electrode 4 and the materials 1 and 3 are in close contact as much as possible.
- the material to be bonded 3 is a material having high electrical resistance, it is possible to secure a current path and flow a sufficient current for bonding by adding a material having low electrical resistance to a part of the material to be bonded 3 in advance. It becomes. It is preferable that the electrode 4 and the materials 1 and 3 to be joined are in close contact.
- FIG. 4 is a conceptual diagram explaining the other form at the time of carrying out the electricity pressurization joining of a rotary tool.
- a material to be bonded 1 and a material to be bonded 3 are arranged with a bonding material 2 interposed therebetween, and the electrodes are in contact with the respective materials to be bonded.
- the electrodes are divided into an electrode 7 and an electrode 9 that pressurize together with energization, and an electrode 6 and an electrode 8 that mainly energize.
- the electrode 7 and the electrode 6 and the electrode 9 and the electrode 8 may be in contact with each other. In addition, no current may flow through the electrode 7 and the electrode 9. Furthermore, it is preferable to configure the electrodes 6 and 8 so that the positions and current amounts of the electrodes 6 and 8 can be adjusted independently of each other because changes in shape and characteristics can be accommodated.
- the materials of the electrodes 6 to 9 may be the same, partially different, or all different. Or the material may differ only in the part which contacts the to-be-joined materials 1 and 3. FIG.
- the energization conditions are appropriately determined depending on the material to be joined and the material of the joining material, etc., but in order not to cause deformation / melting of the material to be joined and coarsening of the particles other than in the vicinity of the joining material. It is preferably within 1 minute, particularly within 30 seconds.
- a bonding material for performing energization and pressure bonding in addition to a method of applying the powder or paste on the surface of the first bonded material or the second bonded material, it is coated by a plating method or a physical vapor deposition method.
- the method can be adopted.
- the coating method by plating or physical vapor deposition is easy to handle the material to be bonded after coating the bonding material, which is advantageous for automating the bonding process and easy to control the coating film thickness. It is particularly preferable for stabilization.
- the bonding material By applying electric heating while applying pressure, the bonding material is easily deformed, the adhesion between the bonding material and the material to be bonded is increased, and element diffusion is facilitated. As a result, the bonding strength can be dramatically increased.
- the joining surfaces of the first material to be joined and the second material to be joined are in the vertical and horizontal directions in FIG. There are two directions, and the first material to be bonded and the second material to be bonded need to be firmly bonded in both directions. In such a case, it is preferable to apply pressure from two directions.
- the atmosphere during bonding is preferably performed in a vacuum, in an inert gas, or in a reducing atmosphere because both the material to be bonded and the bonding material contain metal.
- the degree of vacuum is not particularly limited, but is preferably higher than 13.3 Pa (0.1 Torr).
- the inert gas include argon, helium, nitrogen, or a mixed gas thereof.
- the reducing atmosphere include a gas atmosphere in which hydrogen gas is mixed in a certain proportion with the inert gas, and a method in which heated graphite is installed in the vicinity of the material to be joined.
- any direct current or alternating current can be used as long as a current for heating the material to be joined and the joining material to an appropriate temperature can be passed.
- the DC pulse current can change the peak current value and the ON / OFF ratio of the pulse, so that the instantaneous heating of the bonding interface and the overall temperature control range of the bonded object can be expanded. It is valid.
- Examples 1 to 6 and Comparative Examples 1 and 2 relate to the relationship between the pressure applied during bonding and the bonding strength, and the relationship between the deformation of the materials to be bonded.
- CBN chip with triangular back metal with a base metal made of cemented carbide with a counterbore (first material to be joined) plated with Ni-7wt% P (melting point: about 900 ° C) with a thickness of 10 ⁇ m (Second material to be joined) is set as shown in FIG. 1, and from the vertical direction, 0.05 MPa (Comparative Example 1), 0.1 MPa (Example 1), 10 MPa (Example 2), 30 MPa ( Example 3), 70 MPa (Example 4), 100 MPa (Example 5), 200 MPa (Example 6), and 250 MPa (Comparative Example 2) were applied under pressure and pressure bonding in a vacuum.
- the joined bodies of Examples 1 to 6 and Comparative Examples 1 and 2 were obtained.
- the energization is performed by a DC pulse current, the pulse current value is 1900 A, the pulse On: Off ratio is 1: 1, the pulse width is 10 ms, the energization time is 10 seconds, the load is 0.98 kN, and the temperature of the joined body is equal to or higher than the melting point of the joining material.
- the cemented carbide base metal (first material to be joined) is composed of WC-5% Co (material to be joined A) and WC-10% Co (material to be joined B) (both wt%: mass percentage). ) was used.
- the bonding strength (shear fracture strength) of each obtained bonded body was measured, and the presence or absence of deformation of each bonded material in the vicinity of the bonding layer was observed. The results are shown in Table 1.
- Example 7 Next, using a sputtering method, which is a physical vapor deposition method, instead of plating, a 5 ⁇ m thick Ti-50 wt% Cu layer (melting point: about 960 ° C.) is applied to cBN (second bonded material) with a back metal. It provided and joined with the cemented carbide base metal (1st to-be-joined material). At this time, as the cemented carbide base metal (first bonded material), the bonded material A and the bonded material B were used, and the bonding conditions were the same as those in Example 3. As a result, it was confirmed that cBN and the cemented carbide were joined without gaps through the Ti—Cu layer. This is presumably because a liquid phase was generated during bonding. The bonding strength was 250 MPa for the material to be bonded A and 270 MPa for the material to be bonded B.
- each of the joined bodies in Example 3 and each joined body in Example 7 using A and B as the first material to be joined is ground using a diamond grindstone, and then a known CVD method is used. Then, TiCN was coated with a thickness of 5 ⁇ m at a coating temperature of 870 ° C., and the state of growth of the CVD film was observed.
- the bonding material was Ni—P
- the joining material was Ti—Cu instead of Ni—P
- abnormal growth of the CVD film was not seen regardless of the type of the first joined material.
- Example 8 a material (bonding material) obtained by dissolving 50 vol% Cu-25 vol% Ti-25 vol% Zr powder (melting point: about 850 ° C.) with a solvent is used as a cemented carbide base metal (bonded material A: first bonded material). ), Set with a cBN chip without back metal (second material to be joined), and energized and pressure joined under the same energizing conditions as in Example 3.
- the joint strength of this joined body was 210 MPa, and it was confirmed that it had a strength equivalent to that of a conventional brazed product.
- a dense Cu—Ti—Zr layer having a thickness of 20 ⁇ m was observed at this joined portion, and it was confirmed that the Cu—Ti—Zr powder was melted or sintered.
- Example 9 Next, based on the Example 8, for the purpose of shortening the energization time, the joining condition was obtained by changing the energization time among the conditions shown in Example 8. As a result, when the energization time was changed from 10 seconds in Example 8 to 8 seconds, good joining was possible at a current 200 A larger than the current value (1900 A) shown in Example 8 in the pulse current value. Further, when the energization time was 6 seconds, good bonding was possible by further increasing the pulse current by 200 A.
- Example 10 In order to join the back surface of cBN (second material to be joined) with high accuracy, the joining was performed while applying pressure from two directions. As in the previous examples, the vertical pressure was applied with the upper and lower electrodes, and the load was applied separately from the side so that the cBN could be pressurized in the horizontal direction. In addition, the to-be-joined material A was used as a 1st to-be-joined material. The same Ni—P plated cBN with the same back metal as used in Example 3 was used, and the bonding was performed with a pulse current of 3000 A, a pulse On: Off ratio of 1: 4, and an energization time of 10 seconds.
- Example 11 Next, among the electrodes to be energized and pressed, the upper electrode is divided, and the electrode for pressing the cemented carbide base metal (bonded material A: first bonded material) and cBN without back metal (second bonded material) ) was made of a different material from the electrode that pressurizes. Thereby, the electric current which flows into each electrode becomes different, and the electric current value which flows into a cemented carbide base metal and cBN also changes. As a result, each temperature can be changed extremely, and the temperature of cBN in which deterioration is a concern at high temperatures can be lowered.
- bonded material A first bonded material
- cBN without back metal second bonded material
- the electrode that energizes and presses the cemented carbide base metal is graphite
- the electrode that energizes and presses cBN is hBN.
- hBN is an electrically insulating material, and almost no current flows.
- As cBN 69 vol% Ag-26 vol% Cu-5 vol% Ti (melting point: about 820 ° C.) coated with 10 ⁇ m by sputtering was used.
- a pulse current of 2500 A a pulse On: Off ratio of 1: 2 2 2
- cBN could be joined without thermal degradation.
- the bonding strength was 200 MPa, which was equivalent to that of a conventional brazed product.
- Example 12 A joined body was obtained in the same manner as in Example 11 except that the upper electrode was an undivided electrode.
- the joint strength of the obtained joined body was 250 MPa, which was equal to or higher than that of the conventional brazed product and higher than the joint strength in Example 11.
- Example 11 From the results of Example 11 and Example 12, by controlling the power supply to cBN (second bonded body) and preferentially heating the cemented carbide (first bonded body), cBN It was confirmed that a bonded body having high bonding strength without thermal deterioration of the (second bonded body) could be obtained.
- Example 13 Next, instead of the insulating hBN shown in Example 11, the material of the electrode that pressurizes cBN (second bonded material) is made conductive. At this time, a material having an electric conductivity higher than the electric conductivity of the electrode pressurizing the cemented carbide base metal (first bonded material) was used. Thereby, the current flowing through the cemented carbide base metal and the cBN can be made different. The current flowing through the cemented carbide base metal heats the base metal near the cBN, and the current flowing through the cBN gives priority to the bonding material. So that it can be heated.
- the cemented carbide base metal was set to about 1900 A, and cBN was set to about 1000 A (current is an estimated value).
- the difference between the counterbore depth and the cBN height of the cemented carbide base metal is 0.1 mm, and by using divided electrodes, it is possible to pressurize both the cemented carbide base metal and the cBN even if the gap is large. It was possible. As a result of energization, it was possible to perform the bonding firmly without deteriorating the cBN.
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Abstract
Description
本発明に従った接合体は、超硬合金焼結体を第1の被接合材とし、cBN焼結体またはダイヤモンド焼結体を第2の被接合材とする接合体であって、前記第1の被接合材および第2の被接合材は、両者の間に設置された800℃を超え1000℃未満の温度で液相を生成する接合材を介して接合されており、前記第1の被接合材および第2の被接合材は0.1MPa~200MPaの圧力で加圧しながら通電加熱することによって接合されていることを特徴とする接合体である。
このようにすれば、第2の被接合材であるcBN焼結体やダイヤモンド焼結体の結合相成分として用いられるTiを含む材料を接合材としているため、接合材中のTiが容易に第1の被接合材や第2の被接合材に元素拡散し、強固な接合を得ることができる。
このようにすれば、接合体は第1の被接合材としての超硬合金焼結体および第2の被接合材としてのcBN焼結体やダイヤモンド焼結体を被接合材としているため、上記接合材を介して接合することにより得られる接合体は、切削工具として好適に使用することができる。具体的な切削工具としては、例えば、切削チップの他、ドリル、エンドミル、リーマなどの回転工具を挙げることができる。本発明の工具はロウ材が液相を生成する温度以上となる高速切削においても、接合材の接合強度が低下することがない切削工具を提供することができる。
始めに、通電加圧接合における通電の形態について、図を用いて説明する。
図1は、通電加圧接合における通電の一形態を説明する概念図である。図1において、被接合材1、3は、それぞれ第1の被接合材(超硬合金焼結体)および第2の被接合材(cBN焼結体またはダイヤモンド焼結体)であって、挟み込まれた接合材2を用いて接合される。
図2は、通電加圧接合における通電の別の一形態を説明する概念図である。図2において、分割電極5は第2の被接合材3に接しており、電極4は第1の被接合材1に接している。電極4と分割電極5の材質を変えることで、それぞれの電気伝導度と熱伝導度を変えることができ、第1の被接合材と第2の被接合材にそれぞれ異なった電流を与えることが可能となり、それぞれの温度を極端に変えることが可能となる。これにより、熱劣化を起こしやすい被接合材でも、熱劣化を起こさずに接合することができる。さらに、電極を分割し、それぞれの電極を独立して加圧することにより、第1の被接合材と第2の被接合材に与える圧力を高精度に制御することができるため、接合強度を向上させることができ好ましい。
図3は、回転工具を通電加圧接合する際の一形態を説明する概念図である。図3において、接合材2を挟んで被接合材1と被接合材3が配置されており、電極4はそれぞれの被接合材に接している。電極間に電圧を印加することにより被接合材1,3と接合材2に電流が流れ、加熱されることによって接合される。加熱に十分な電流を流すためには、電極4と被接合材1、3はできるだけ密着していることが好ましい。被接合材3が電気抵抗の高い材料の場合、あらかじめ被接合材3の一部に電気抵抗の低い材料を加えておくことによって、電流経路を確保し、接合に十分な電流を流すことが可能となる。電極4と被接合材1,3は密着していることが好ましい。
図4は、回転工具を通電加圧接合する際の他の形態を説明する概念図である。図4において、接合材2を挟んで被接合材1と被接合材3とが配置されており、電極はそれぞれの被接合材に接している。第3の通電の形態の場合と異なり、電極は、通電と共に加圧を行う電極7および電極9と主に通電を行う電極6および電極8とに分かれている。これにより、電気抵抗が高い被接合材1、3であっても、被接合材1、3に電気抵抗の低い材料を加えておき、その部分に電極6および電極8から優先的に電流を流すことが可能となり、加圧と加熱とを必要な部分にのみ行うことが可能となる。なお、電極7と電極6および電極9と電極8とは接触していても良い。また、電極7および電極9には電流を流さなくても良い。さらには、電極6および電極8の位置、電流量をそれぞれ独立に調整できるように構成することが、形状や特性の変化に対応することができるため好ましい。また、電極6~9の材質はすべて同じであっても、一部異なっていても、すべて異なっていても良い。あるいは、被接合材1,3と接触する部分のみ材質が異なっていても良い。
次いで、上記図1~図4に示された通電を用いた通電加圧接合について説明する。
本実施例および比較例は、接合時の加圧力と接合強度との関係、および被接合材の変形との関係に関するものである。
次に、めっきの代わりに物理的蒸着法であるスパッタ法を用いて、厚さ5μmのTi-50wt%Cu層(融点約960℃)をバックメタルのあるcBN(第2の被接合材)に設け、超硬合金台金(第1の被接合材)と接合を行った。この時、超硬合金台金(第1の被接合材)としては、前記被接合材Aおよび被接合材Bを用い、接合条件は実施例3と同じとした。その結果、cBNと超硬合金はTi-Cu層を介して空隙なく接合されていることが確認できた。これは、接合中に液相を生成していたためと推測される。なお、その接合強度は、被接合材Aでは250MPa、被接合材Bでは270MPaであった。
次に、50vol%Cu-25vol%Ti-25vol%Zr粉末(融点約850℃)を溶媒で溶いた材料(接合材)を、超硬合金台金(被接合材A:第1の被接合材)に塗布し、バックメタル無しcBNチップ(第2の被接合材)とセットし、実施例3と同一の通電条件で通電加圧接合を行った。この接合体の接合強度は210MPaであり、従来のロウ付け品と同等の強度を有していることを確認した。この接合部分には緻密な厚み20μmのCu-Ti-Zr層が観察され、Cu-Ti-Zr粉末が溶融あるいは焼結していることが確認できた。
次に、前記実施例8を基に、通電時間の短縮化を目的として、実施例8に示した条件のうち通電時間を変化させて接合条件を求めた。その結果、通電時間を実施例8における10秒から8秒にした場合、パルス電流値を実施例8に示した電流値(1900A)よりも200A大きい電流において良好な接合が可能であった。さらに通電時間を6秒とした場合、パルス電流をさらに200A大きくすることによって良好な接合が可能であった。
次に、cBN(第2の被接合材)の背面も精度良く接合するため、2方向から加圧しながら接合を行った。これまでの例と同様、上下の電極で垂直方向の加圧を行うと共に、別途横から荷重を与えてcBNを水平方向に加圧できるようにした。なお、第1の被接合材としては、被接合材Aを用いた。実施例3に用いたと同じNi-Pめっきを施したバックメタル付きcBNを使用し、パルス電流3000A、パルスOn:Off比1:4、通電時間10秒として接合を行った。
次に、通電加圧する電極の内、上部電極を分割し、超硬合金台金(被接合材A:第1の被接合材)を加圧する電極とバックメタル無しcBN(第2の被接合材)を加圧する電極との材質を異なったものとした。これにより、各電極に流れる電流が異なったものとなり、超硬合金台金とcBNとに流れる電流値も異なったものとなる。その結果として、それぞれの温度を極端に変えることができ、高温において劣化が懸念されるcBNの温度を下げることができる。
上部電極を、分割されていない電極とした以外は、実施例11と同様にして、接合体を得た。得られた接合体の接合強度は、250MPaであり、従来のロウ付け品と同等以上の強度で実施例11における接合強度よりも高かった。しかし、得られた接合体のcBNには、一部亀裂が発生しており、熱による品質劣化が見られた。
次に、実施例11に示した絶縁性のhBNの代わりに、cBN(第2の被接合材)を加圧する電極の材質を導電性を有するものとした。このとき、超硬合金台金(第1の被接合材)を加圧する電極の電気伝導度より高い電気伝導度を有する材料を使用した。これにより、超硬合金台金とcBNに流す電流とを異なるものとすることができ、超硬合金台金に流す電流はcBN近傍の台金を加熱し、cBNに流す電流は接合材を優先的に加熱できるようにした。
Claims (12)
- 超硬合金焼結体を第1の被接合材(1)とし、cBN焼結体またはダイヤモンド焼結体を第2の被接合材(3)とする接合体であって、前記第1の被接合材(1)および第2の被接合材(3)は、両者の間に設置された800℃を超え1000℃未満の温度で液相を生成する接合材(2)を介して接合されており、前記第1の被接合材(1)および第2の被接合材(3)は0.1MPa~200MPaの圧力で加圧しながら通電加熱することによって接合されていることを特徴とする接合体。
- 前記接合材(2)が、900℃以上1000℃未満の温度で液相を生成する接合材であることを特徴とする請求の範囲第1項に記載の接合体。
- 通電加熱によって、前記第1の被接合材(1)が、前記第2の被接合材(3)よりも優先的に発熱して、接合されていることを特徴とする請求の範囲第1項に記載の接合体。
- 通電加熱によって、前記接合材(2)成分のうちの少なくとも1つの元素が、前記第1の被接合材(1)および/または前記第2の被接合材(3)中に元素拡散していることを特徴とする請求の範囲第1項に記載の接合体。
- 加圧しながらの通電加熱によって変形する接合材(2)を用いて接合されていることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合材(2)が、チタン(Ti)、ジルコニウム(Zr)、コバルト(Co)、ニッケル(Ni)、銀(Ag)、銅(Cu)の少なくとも1つを含む合金からなることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合材(2)が、チタン(Ti)を含むことを特徴とする請求の範囲第6項に記載の接合体。
- 前記接合材(2)の少なくとも一部が、通電加熱時に液相を生成していることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合材(2)および/または前記第1の被接合材(1)の結合相に含まれるニッケル(Ni)が、30vol%(体積百分率)以下であることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合材(2)が、めっき法により前記第1の被接合材(1)および/または前記第2の被接合材(3)の表面上に設けられていることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合材(2)が、物理蒸着法により前記第1の被接合材(1)および/または前記第2の被接合材(3)の表面上に設けられていることを特徴とする請求の範囲第1項に記載の接合体。
- 前記接合体が、切削工具であることを特徴とする請求の範囲第1項に記載の接合体。
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CN2010800125083A CN102355969A (zh) | 2009-05-27 | 2010-05-26 | 接合体 |
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JP2013184267A (ja) * | 2012-03-09 | 2013-09-19 | Sumitomo Electric Hardmetal Corp | 切削工具 |
CN107671412A (zh) * | 2012-03-19 | 2018-02-09 | Ev 集团 E·索尔纳有限责任公司 | 用于对接合压力进行压力传递的压力传递板 |
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JP6245520B2 (ja) * | 2014-03-24 | 2017-12-13 | 三菱マテリアル株式会社 | 複合部材及び切削工具 |
KR101776151B1 (ko) * | 2015-07-31 | 2017-09-19 | 덕산하이메탈(주) | 비정질 및 발열 특성을 갖는 금속 도금막을 이용한 초경재료의 접합방법 |
CN106825896A (zh) * | 2017-04-06 | 2017-06-13 | 爱迪森自动化科技(昆山)有限公司 | 一种硬质合金与钢的复合中间层液相扩散焊接方法 |
CN115229398A (zh) * | 2022-09-22 | 2022-10-25 | 泉州市恺益科技有限公司 | 一种金刚石磨盘的焊接装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183177A (ja) * | 1985-02-04 | 1986-08-15 | 三菱マテリアル株式会社 | ダイヤモンド基焼結材料部材を炭化タングステン基超硬合金部材に接合する方法 |
JPH11294058A (ja) | 1998-04-08 | 1999-10-26 | Mitsubishi Materials Corp | 接合強度に優れたろう付け切削工具 |
JPH11320218A (ja) | 1998-03-02 | 1999-11-24 | Sumitomo Electric Ind Ltd | 硬質焼結体工具及びその製造方法 |
JP2002036008A (ja) | 2000-07-24 | 2002-02-05 | Ngk Spark Plug Co Ltd | スローアウェイチップ及び切削工具 |
JP2006521214A (ja) * | 2003-02-07 | 2006-09-21 | ダイヤモンド イノベーションズ、インク. | ろう付合金固着済みダイヤモンド工具インサートおよびその製造方法 |
JP2008290130A (ja) * | 2007-05-25 | 2008-12-04 | National Institute Of Advanced Industrial & Technology | 接合体 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IE42084B1 (en) * | 1974-09-18 | 1980-06-04 | De Beers Ind Diamond | Abrasive bodies |
US4871377A (en) * | 1986-07-30 | 1989-10-03 | Frushour Robert H | Composite abrasive compact having high thermal stability and transverse rupture strength |
US5366522A (en) * | 1991-11-07 | 1994-11-22 | Sumitomo Electric Industries, Ltd. | Polycrystalline diamond cutting tool and method of manufacturing the same |
JPH07156003A (ja) * | 1993-12-07 | 1995-06-20 | Sumitomo Electric Ind Ltd | 多結晶ダイヤモンド工具及びその製造方法 |
JPH08225376A (ja) * | 1994-10-13 | 1996-09-03 | General Electric Co <Ge> | ろう付け可能なコバルト含有cbn成形体 |
JPH10180507A (ja) * | 1996-12-24 | 1998-07-07 | Mitsubishi Materials Corp | スローアウェイチップおよびその製造方法 |
US6155755A (en) * | 1998-03-02 | 2000-12-05 | Sumitomo Electric Industries, Ltd. | Hard sintered body tool |
JP2000052085A (ja) * | 1998-08-05 | 2000-02-22 | Mitsubishi Materials Corp | ダイヤモンド基超高圧焼結体と下地超硬合金とからなるろう付けタイプの高性能超高圧切削工具 |
CA2385303A1 (en) * | 2000-07-19 | 2002-01-24 | Sumitomo Electric Industries, Ltd. | Hard sintered compact throwaway tip |
US7429152B2 (en) * | 2003-06-17 | 2008-09-30 | Kennametal Inc. | Uncoated cutting tool using brazed-in superhard blank |
US7592077B2 (en) * | 2003-06-17 | 2009-09-22 | Kennametal Inc. | Coated cutting tool with brazed-in superhard blank |
EP1932816B1 (en) * | 2005-10-04 | 2015-11-18 | Sumitomo Electric Hardmetal Corp. | CBN SINTERED BODY FOR HIGH-QUALITY SURFACE ASPECT MACHINING AND CUTTING TOOL OF cBN SINTERED BODY |
EP1950189B1 (en) * | 2005-11-18 | 2016-08-17 | Sumitomo Electric Hardmetal Corp. | Cbn sintered body for high-quality surface property machining, cbn sintered body cutting tool, and method of cutting work therewith |
JP5225729B2 (ja) * | 2008-03-31 | 2013-07-03 | 独立行政法人産業技術総合研究所 | 接合体の接合方法 |
-
2009
- 2009-05-27 JP JP2009127850A patent/JP4647016B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-26 EP EP10780571.5A patent/EP2397246B1/en not_active Not-in-force
- 2010-05-26 CN CN2010800125083A patent/CN102355969A/zh active Pending
- 2010-05-26 WO PCT/JP2010/058898 patent/WO2010137616A1/ja active Application Filing
- 2010-05-26 US US13/264,681 patent/US20120034474A1/en not_active Abandoned
- 2010-05-26 KR KR1020117021248A patent/KR101307095B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183177A (ja) * | 1985-02-04 | 1986-08-15 | 三菱マテリアル株式会社 | ダイヤモンド基焼結材料部材を炭化タングステン基超硬合金部材に接合する方法 |
JPH11320218A (ja) | 1998-03-02 | 1999-11-24 | Sumitomo Electric Ind Ltd | 硬質焼結体工具及びその製造方法 |
JPH11294058A (ja) | 1998-04-08 | 1999-10-26 | Mitsubishi Materials Corp | 接合強度に優れたろう付け切削工具 |
JP2002036008A (ja) | 2000-07-24 | 2002-02-05 | Ngk Spark Plug Co Ltd | スローアウェイチップ及び切削工具 |
JP2006521214A (ja) * | 2003-02-07 | 2006-09-21 | ダイヤモンド イノベーションズ、インク. | ろう付合金固着済みダイヤモンド工具インサートおよびその製造方法 |
JP2008290130A (ja) * | 2007-05-25 | 2008-12-04 | National Institute Of Advanced Industrial & Technology | 接合体 |
Non-Patent Citations (2)
Title |
---|
"IGETALI,OY Cutting Tool", October 2006, SUMITOMO ELECTRIC HARDMETAL CO., pages: L4 |
"IGETALLOY Cutting Tool", October 2006, SUMITOMO ELECTRIC HARDMETAL CO., pages: L4 |
Also Published As
Publication number | Publication date |
---|---|
EP2397246A4 (en) | 2016-06-15 |
KR20110128859A (ko) | 2011-11-30 |
EP2397246A1 (en) | 2011-12-21 |
US20120034474A1 (en) | 2012-02-09 |
JP2010274287A (ja) | 2010-12-09 |
JP4647016B2 (ja) | 2011-03-09 |
EP2397246B1 (en) | 2018-02-21 |
CN102355969A (zh) | 2012-02-15 |
KR101307095B1 (ko) | 2013-09-11 |
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