WO2010131578A1 - Dispositif à semi-conducteurs doté d'un périphérique d'entrée et de sortie de signal optique incorporé et dispositif électronique équipé dudit dispositif - Google Patents

Dispositif à semi-conducteurs doté d'un périphérique d'entrée et de sortie de signal optique incorporé et dispositif électronique équipé dudit dispositif Download PDF

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Publication number
WO2010131578A1
WO2010131578A1 PCT/JP2010/057512 JP2010057512W WO2010131578A1 WO 2010131578 A1 WO2010131578 A1 WO 2010131578A1 JP 2010057512 W JP2010057512 W JP 2010057512W WO 2010131578 A1 WO2010131578 A1 WO 2010131578A1
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Prior art keywords
signal input
optical signal
output device
built
flexible substrate
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PCT/JP2010/057512
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English (en)
Japanese (ja)
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樋野智之
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日本電気株式会社
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Publication of WO2010131578A1 publication Critical patent/WO2010131578A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a semiconductor device with a built-in optical signal input / output device and an electronic device equipped with the semiconductor device.
  • optical interconnection technology using optical communication is being studied for interconnections between chips, boards, devices, etc., which are close to each other, and connections within a chip.
  • an optical module for optical interconnection further miniaturization and cost reduction are required as compared with an optical module for optical network communication. Therefore, development of an optical interconnection technology is proceeding in a direction in which a logic LSI and an optical module are integrated instead of a single optical module.
  • Japanese Patent Application Laid-Open No. 2005-20532 discloses an optical module in which a logic LSI and an optical module are integrated to reduce the size.
  • This optical module includes a wiring board on which an integrated circuit chip is mounted on one end side and an optical chip is mounted on the other end side. The wiring board is bent so that the integrated circuit chip and the optical chip face each other. At this time, a plastic spacer is provided between the integrated circuit chip and the optical chip, and the interval between the integrated circuit chip and the optical chip is defined.
  • An object of the present invention is to provide a semiconductor device with a built-in optical signal input / output device that can be miniaturized and has excellent heat dissipation characteristics, and an electronic device equipped with the same.
  • a semiconductor device with a built-in optical signal input / output device which is a semiconductor element for performing a predetermined process, an optical signal input / output device to which an optical fiber is connected, a semiconductor device and an optical signal input / output device And a flexible substrate bent in the area between the semiconductor element and the optical signal input / output device, and when the flexible substrate is bent, a gap is formed between the semiconductor element and the optical signal input / output device.
  • the electronic device includes a semiconductor element that performs predetermined processing, an optical signal input / output device to which an optical fiber is connected, a semiconductor element and an optical signal input / output device, and the semiconductor element and the optical signal input.
  • Optical signal input / output device built-in semiconductor comprising a flexible substrate bent in a region between the output device and a spacer that forms a gap between the semiconductor element and the optical signal input / output device when the flexible substrate is bent And a printed circuit board on which a semiconductor device with a built-in optical signal input / output device is mounted.
  • the present invention it is possible to reduce the size of the semiconductor device with a built-in optical signal input / output device and an electronic device equipped with the semiconductor device, and to improve the heat dissipation characteristics.
  • FIG. 1 is a cross-sectional view of a semiconductor device with an optical signal input / output device according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view of an electronic apparatus including the optical signal input / output device built-in semiconductor device according to the second embodiment of the present invention.
  • FIG. 3 is a partial cross-sectional view of the electronic apparatus according to the second embodiment.
  • FIG. 4 is a cross-sectional view of an optical module of related technology for explaining the action of a spacer in the semiconductor device with an optical signal input / output device according to the second embodiment.
  • FIG. 5 is a cross-sectional view of an optical signal input / output device built-in semiconductor device in which spacers are also provided on the curved side of the flexible substrate according to the second embodiment.
  • FIG. 1 is a cross-sectional view of a semiconductor device with an optical signal input / output device according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view of an electronic apparatus including the optical signal input
  • FIG. 6 is a cross-sectional view of an optical signal input / output device built-in semiconductor device in which a spacer is fixed between an optical signal input / output device side flexible substrate and an interposer substrate according to the second embodiment.
  • FIG. 7A is a cross-sectional view of the semiconductor device with a built-in optical signal input / output device in the reflow processing step according to the second embodiment.
  • FIG. 7B is a cross-sectional view of the optical signal input / output device built-in semiconductor device in the spacer mounting step according to the second embodiment.
  • FIG. 7C is a cross-sectional view of the optical signal input / output device built-in semiconductor device in the bending process of the flexible substrate according to the second embodiment.
  • FIG. 7A is a cross-sectional view of the semiconductor device with a built-in optical signal input / output device in the reflow processing step according to the second embodiment.
  • FIG. 7B is a cross-sectional view of the optical signal input / output device built-in
  • FIG. 8 is a cross-sectional view of an optical signal input / output device built-in semiconductor device including a heat radiation fin according to a third embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of an optical signal input / output device built-in semiconductor device in which the radiation fins of the optical input / output device of the third embodiment are attached to the logic LSI side.
  • FIG. 1 is a cross-sectional view of a semiconductor device 2 with a built-in optical signal input / output device according to the first embodiment.
  • the semiconductor device 2 with built-in optical signal input / output device includes a flexible substrate 5, a logic LSI (semiconductor element) 6, an optical signal input / output device 7, and a spacer 8.
  • An optical fiber 9 is connected to the optical signal input / output device 7.
  • a logic LSI 6 is mounted on one end side of the flexible substrate 5, and an optical signal input / output device 7 is mounted on the other end side.
  • the flexible substrate 5 is bent in a region between the logic LSI 6 and the optical signal input / output device 7.
  • FIG. 2 is a perspective view of the electronic apparatus 10 including the semiconductor device 11A with a built-in optical signal input / output device according to the second embodiment.
  • the electronic device 10 includes a printed circuit board 12 on which an optical signal input / output device built-in semiconductor device 11A and other electronic components 13 are mounted.
  • a printed circuit board 12 for example, a halogen-free circuit board composed of four layers of Cu-FR4 (Frame Regentant Type 4) -Cu-FR4 is used.
  • a predetermined wiring is formed on the printed circuit board 12, and the optical signal input / output device built-in semiconductor device 11 ⁇ / b> A and the other electronic component 13 are electrically connected via the wiring.
  • the semiconductor device 11A with a built-in optical signal input / output device includes an interposer substrate 14, a flexible substrate 16, a logic LSI 20 having a predetermined function, an optical signal input / output device 22, and a spacer 24. Then, the logic LSI 20 and the optical signal input / output device 22 are mounted on the flexible substrate 16, and the flexible substrate 16 is mounted on the interposer substrate 14.
  • the function of the logic LSI 20 does not limit the present invention.
  • the logic LSI 20 may be a communication control logic LSI or various arithmetic processing logic LSIs.
  • the optical signal input / output device 22 is electrically connected to the wiring of the flexible substrate 16 and is connected to an array 30 of multi-channel optical fibers to receive an optical signal and convert it into an electrical signal. Is converted into an optical signal.
  • the optical fiber array 30 is connected substantially horizontally to the printed circuit board 12 from three directions of the optical signal input / output device 22. Since connections can be made from multiple directions in this way, a large number of channels such as hundreds of channels can be formed.
  • the flexible substrate 16 is a flexible substrate made of a material such as polyimide resin or polyester resin.
  • the optical signal input / output device 22 is mounted on one end side, and the logic LSI 20 is mounted on the other end side. Has been. As shown in FIG.
  • the optical signal input / output device 22 and the logic LSI 20 are bent 180 degrees so as to face each other, and a gap 28 is formed between the optical signal input / output device 22 and the logic LSI 20. And is supported by the spacer 24. The effect of the spacer 24 will be described later.
  • the flexible substrate 16, the optical signal input / output device 22, the logic LSI 20, and the interposer substrate 14 are electrically connected using a BGA (Ball Grid Array) technique or the like.
  • the optical signal input / output device 22 and the logic LSI 20 transmit and receive signals via the wiring of the flexible substrate 16.
  • the logic LSI 20 and the other electronic components 13 transmit and receive signals via the wiring of the interposer substrate 14 and the printed circuit board 12.
  • the BGA technique is a technique for connecting terminals by arranging small ball-shaped solders (also referred to as bumps) in a lattice pattern with a dispenser and heating and melting the solder in a reflow furnace. That is, the terminals of the flexible substrate 16, the optical signal input / output device 22, the logic LSI 20, and the interposer substrate 14 are formed in a bump structure, and are connected by aligning them and melting the solder in a reflow furnace. This eliminates the need for lead terminals in the optical signal input / output device 22, the logic LSI 20, and the like, and the semiconductor device 11A with a built-in optical signal input / output device can be reduced in size by this lead terminal.
  • small ball-shaped solders also referred to as bumps
  • the interposer substrate 14 is a multilayer wiring substrate that adjusts the terminal pitch between the logic LSI 20 and the printed circuit board 12. That is, the terminal pitch of the interposer substrate 14 on the side connected to the logic LSI 20 is formed in accordance with the terminal pitch of the logic LSI 20. Further, the terminal pitch of the interposer substrate 14 on the side connected to the printed circuit board 12 is formed in accordance with the terminal pitch of the printed circuit board 12. It is also conceivable to connect the logic LSI 20 directly to the printed circuit board 12. However, in order to directly connect the logic LSI 20 to the printed board 12, the printed board 12 needs to have the same number of wiring layers as the interposer board 14. As the number of wiring layers on the printed circuit board increases, the cost increases accordingly.
  • the printed circuit board 12 has a larger area than the logic LSI 20, when the logic LSI 20 is directly connected to the printed circuit board 12, it is necessary to use a printed circuit board having a large area interposer function.
  • a printed circuit board having a large area interposer function is very expensive. Since electronic components that require adjustment of the terminal pitch are limited to specific electronic components such as the logic LSI 20, the cost is reduced by using the interposer substrate 14 only for connecting the corresponding electronic components.
  • the flexible substrate 16 is provided with an optical signal input / output device 22 and a logic LSI 20 facing each other.
  • the flexible substrate 16 is bent so that a gap 28 is formed between the optical signal input / output device 22 and the logic LSI 20, and is supported by a spacer 24.
  • the spacer 24 is a columnar body made of plastic, ceramic, or the like, and is provided at two opposing corner portions of the flexible substrate 16 as shown in FIG. The reason for forming the air gap 28 in this way will be described with reference to the optical module disclosed in Japanese Patent Laid-Open No. 2005-20532 shown in FIG. As described above, the optical module 100 shown in FIG. 4 has the integrated circuit chip 102 mounted on one end side of the wiring board 101 and the optical chip 103 mounted on the other end side.
  • the integrated circuit chip 102 and the optical chip 103 are fixed to a plastic spacer 104 in a state of facing each other.
  • the integrated circuit chip 102 and the optical chip 103 tend to increase in calorific value as the information processing speed increases.
  • plastic is handled as a heat insulating material, but has a finite thermal conductivity. Therefore, when the optical module 100 is continuously operated for a long time, the temperature of the spacer 104 increases. At this time, the temperature on the surface side of the spacer 104 with which the integrated circuit chip 102 and the optical chip 103 are in contact is higher than the temperature on the inner side of the spacer 104.
  • the temperature difference between the integrated circuit chip 102 and the optical chip 103 decreases as the surface temperature of the spacer 104 increases. Thereby, the heat of the integrated circuit chip 102 and the optical chip 103 is not easily transferred to the spacer 104. That is, the integrated circuit chip 102 and the optical chip 103 are not easily cooled. In the configuration shown in FIG. 4, heat can be radiated to the atmosphere only from the periphery of the spacer 104 (region where the integrated circuit chip or the like is not in contact).
  • the spacer 104 receives heat from the integrated circuit chip 102 and the optical chip 103 and dissipates it to the atmosphere, the heat conduction path is long and the surface of the spacer 104 in contact with the atmosphere is small. Heat is not easily dissipated. For this reason, the integrated circuit chip 102 and the optical chip 103 may thermally interfere with each other via the spacers 104, leading to an increase in temperature. Since the integrated circuit chip 102 and the optical chip 103 are semiconductor products, a rise in temperature causes deterioration factors such as switching characteristics and mobility. Therefore, it is necessary to efficiently cool the integrated circuit chip 102 and the optical chip 103, and this object cannot be achieved by the spacer 104 disclosed in JP-A-2005-20532.
  • a heating element such as an integrated circuit chip or an optical chip
  • the spacer accumulates heat and thermal interference between the integrated circuit chip and the optical chip occurs. Is shown. Therefore, in the present embodiment, a structure in which a heating element such as an integrated circuit chip or an optical chip is not in thermal contact with a solid spacer is used. That is, in the present embodiment, the optical signal input / output device 22 and the logic LSI 20 are configured to face each other with the gap 28 therebetween.
  • air is described as an example of the gas that fills the gap 28, it is not limited to air.
  • an inert gas such as nitrogen gas or argon gas may be used.
  • the thermal conductivity of air is about an order of magnitude smaller than that of plastic, the heat transfer between the optical signal input / output device 22 and the logic LSI 20 is reduced accordingly. That is, the optical signal input / output device 22 and the logic LSI 20 are less likely to cause thermal interference with each other. Further, the air filling the gap 28 causes convection. Such a convection does not occur in a solid such as plastic. Since the air filling the air gap 28 is circulated or agitated by convection, the optical signal input / output device 22 and the logic LSI 20 are efficiently cooled.
  • the spacer 24 is provided to form such a gap 28 between the optical signal input / output device 22 and the logic LSI 20. If the air gap 28 is formed between the optical signal input / output device 22 and the logic LSI 20, the spacer 24 may be a plate-like body, a columnar body, or the like.
  • FIG. 3 shows the case where the spacer 24 is provided on the optical fiber array 30 side, it may be provided on the curved side of the flexible substrate 16 as shown in FIG.
  • FIG. 5 is a cross-sectional view of the semiconductor device 11B with a built-in optical signal input / output device in which the spacer 24 is also provided on the curved side of the flexible substrate 16.
  • the spacer 24 on the curved side of the flexible substrate 16 is provided between the flexible substrates 16.
  • the spacer 24 on the optical fiber array 30 side is provided between the optical signal input / output device 22 and the interposer substrate 14.
  • the flexible substrate 16 is bent, the curvature of the curved portion is reduced, the size of the gap 28 is not varied, and the cooling characteristics of the optical signal input / output device 22 and the logic LSI 20 are not changed.
  • one end of the spacer 24 shown in FIG. 3 is bonded to the optical signal input / output device 22 and the other end is bonded to the interposer substrate 14.
  • the substrate 16 and the interposer substrate 14 may be bonded.
  • FIG. 6 is a cross-sectional view of an optical signal input / output device built-in semiconductor device 11C in which a spacer 24 is fixed between the flexible substrate 16 and the interposer substrate 14 on the optical signal input / output device 22 side.
  • the adhesive is accompanied by volume shrinkage when solidified.
  • the optical signal input / output device 22 and the logic LSI 20 are manufactured from semiconductors, and the semiconductors and the spacers 24 have different coefficients of thermal expansion. For this reason, when the spacer 24 is bonded to the optical signal input / output device 22 or the logic LSI 20, stress is generated in the bonded portion due to a difference in volume shrinkage or a coefficient of thermal expansion.
  • the characteristics of the optical signal input / output device 22 and the logic LSI 20 may change due to this stress.
  • the upper and lower ends of the spacer 24 are bonded to the flexible substrate 16, changes in the characteristics of the optical signal input / output device 22 and the logic LSI 20 due to such stress can be prevented.
  • a bonding method a known method such as an adhesive or a double-sided tape can be applied.
  • the optical signal input / output device 22 and the logic LSI 20 may be housed in a dedicated package (case). In such a case, there is no need to worry about the characteristic changes of the optical signal input / output device 22 and the logic LSI 20 due to the difference in volume shrinkage and thermal expansion coefficient.
  • FIG. 7A is a cross-sectional view of the semiconductor device with an optical signal input / output device in the reflow processing step.
  • FIG. 7B is a cross-sectional view of the optical signal input / output device built-in semiconductor device in the spacer mounting step.
  • FIG. 7C is a cross-sectional view of the optical signal input / output device built-in semiconductor device in the bending process of the flexible substrate. First, a reflow process is performed (FIG. 7A).
  • the optical signal input / output device 22 is mounted on the flexible substrate 16 on which predetermined wiring is formed, and the flexible substrate 16 is sandwiched between the logic LSI 20 and the interposer substrate 14 to perform the reflow processing. It is a process.
  • Known processing conditions can be applied to the reflow processing. For example, preheating is performed at 130 to 180 ° C. for 60 to 90 seconds, and then reflow is performed at 220 ° C. to 250 ° C. for 10 to 90 seconds. As a result, the optical signal input / output device 22 and the logic LSI 20 are mounted on the flexible substrate 16.
  • a spacer mounting step is performed (FIG. 7B).
  • the spacer attaching step is a step of attaching the spacer 24 to the interposer substrate 14 with an adhesive, a double-sided tape or the like.
  • the bending process of the flexible substrate 16 is performed (FIG. 7C).
  • the flexible substrate 16 is bent 180 degrees in the region between the optical signal input / output device 22 and the logic LSI 20.
  • the spacer 24 is attached to the flexible substrate 16 with an adhesive or a double-sided tape.
  • the semiconductor device 11A with a built-in optical signal input / output device shown in FIGS. 2 and 3 is assembled. As described above, it is possible to form a miniaturized semiconductor device with a built-in optical signal input / output device simply by bending the flexible substrate 16.
  • the optical signal input / output device 22 and the logic LSI 20 can be efficiently radiated, and mutual thermal interference is caused. Can be prevented.
  • a third embodiment of the present invention will be described.
  • the optical signal input / output device 22 and the logic LSI 20 are in direct contact with air.
  • the heat radiation fins are attached to the optical signal input / output device 22 and the like, so that efficient heat radiation can be performed through the heat radiation fins.
  • a heat radiation fin 36 is attached to the logic LSI 20 and a heat radiation fin 37 is attached to the flexible substrate 16 on the optical signal input / output device 22 side. Is different. Thus, by attaching the radiation fins 36 and 37, the heat exchange area with the air in the gap 28 is increased, so that efficient cooling is possible.
  • the heat radiation fins 36 and 37 are made of a material such as copper or aluminum, and are attached to the logic LSI 20 or the flexible substrate 16 via grease having high thermal conductivity (for example, silicon grease).
  • the third embodiment is not limited to the optical signal input / output device built-in semiconductor device 11D shown in FIG. 8, and may be, for example, an optical signal input / output device built-in semiconductor device 11E as shown in FIG.
  • the radiation fins 37 are attached to the optical signal input / output device 22.
  • the flexible substrate 16 includes, for example, a polyimide resin, a polyester resin, or the like, the thermal conductivity is small. Therefore, as shown in FIG. 9, by directly attaching the radiation fins 37 to the optical signal input / output device 22, it is possible to efficiently radiate heat.

Abstract

La présente invention a trait à un dispositif à semi-conducteurs (2) doté d'un périphérique d'entrée et de sortie de signal optique incorporé qui est équipé d'un élément semi-conducteur (6) qui effectue un processus prédéterminé, du périphérique d'entrée et de sortie de signal optique (7) connecté à une fibre optique (9), d'une carte souple (5) qui est équipée de l'élément semi-conducteur (6) et du périphérique d'entrée et de sortie de signal optique (7) et qui est pliée dans une région située entre l'élément semi-conducteur (6) et le périphérique d'entrée et de sortie de signal optique (7), et d'une entretoise (8) qui génère un espace (4) entre l'élément semi-conducteur (6) et le périphérique d'entrée et de sortie de signal optique (7) lorsque la carte souple (5) est pliée. Par conséquent, le dispositif à semi-conducteurs doté du périphérique d'entrée et de sortie de signal optique incorporé présente une taille réduite et de meilleures propriétés de rayonnement thermique.
PCT/JP2010/057512 2009-05-12 2010-04-21 Dispositif à semi-conducteurs doté d'un périphérique d'entrée et de sortie de signal optique incorporé et dispositif électronique équipé dudit dispositif WO2010131578A1 (fr)

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JP2017513237A (ja) * 2014-03-21 2017-05-25 ノキア テクノロジーズ オサケユイチア フレキシブル電子装置および関連する方法
US10435289B2 (en) 2014-10-16 2019-10-08 Nokia Technoloiges Oy Deformable apparatus and method

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JP2004221875A (ja) * 2003-01-14 2004-08-05 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP2004241415A (ja) * 2003-02-03 2004-08-26 Nichia Chem Ind Ltd 光学装置
JP2005181610A (ja) * 2003-12-18 2005-07-07 Sony Corp 光電複合装置、この装置に用いられるソケット、並びに光電複合装置の実装構造
JP2005197316A (ja) * 2003-12-26 2005-07-21 Toshiba Corp インターフェイスモジュール付ｌｓｉパッケージ及びそれに用いるインターポーザ、インターフェイスモジュール、接続モニタ回路、信号処理ｌｓｉ
JP2006059883A (ja) * 2004-08-17 2006-03-02 Toshiba Corp インターフェイスモジュール付ｌｓｉパッケージ
JP2007004043A (ja) * 2005-06-27 2007-01-11 Nec Corp 配線基板、配線基板を用いたモジュール、およびモジュール集合体
WO2008010518A1 (fr) * 2006-07-20 2008-01-24 Nec Corporation Dispositif de cartes à circuit imprimé, dispositif électronique muni du dispositif de cartes à circuit imprimé et procédé de connexion à la masse
JP2008041772A (ja) * 2006-08-02 2008-02-21 Nec Corp 光モジュール

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JP2017513237A (ja) * 2014-03-21 2017-05-25 ノキア テクノロジーズ オサケユイチア フレキシブル電子装置および関連する方法
US10470304B2 (en) 2014-03-21 2019-11-05 Nokia Technologies Oy Flexible electronics apparatus and associated methods
US10435289B2 (en) 2014-10-16 2019-10-08 Nokia Technoloiges Oy Deformable apparatus and method

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