WO2010117186A2 - Capteur tactile résistif intégré à un panneau de fenêtre - Google Patents

Capteur tactile résistif intégré à un panneau de fenêtre Download PDF

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Publication number
WO2010117186A2
WO2010117186A2 PCT/KR2010/002094 KR2010002094W WO2010117186A2 WO 2010117186 A2 WO2010117186 A2 WO 2010117186A2 KR 2010002094 W KR2010002094 W KR 2010002094W WO 2010117186 A2 WO2010117186 A2 WO 2010117186A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
window panel
touch sensor
layer
conductive
Prior art date
Application number
PCT/KR2010/002094
Other languages
English (en)
Korean (ko)
Other versions
WO2010117186A3 (fr
Inventor
조한용
천재욱
Original Assignee
Cho Han Yong
Chun Jae Wook
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cho Han Yong, Chun Jae Wook filed Critical Cho Han Yong
Publication of WO2010117186A2 publication Critical patent/WO2010117186A2/fr
Publication of WO2010117186A3 publication Critical patent/WO2010117186A3/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04113—Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field

Definitions

  • the present invention relates to a resistive touch sensor, and more particularly, to a touch panel of a window panel integrated resistive method.
  • Touch sensors are widely used as input devices in portable electronic devices such as mobile phones, PDAs (Personal Digital Assistance), and MP3s. Resistive film types and capacitive types are known for touch sensors. Capacitive touch sensors have excellent durability and have multi-touch functions, which have recently been widely applied to mobile phones. On the other hand, the resistive touch sensor has the advantage that the input speed of the touch is fast and the input resolution is high to enable handwriting recognition.
  • FIG. 1 is a perspective view of a mobile phone equipped with a conventional resistive touch sensor assembly 110
  • FIG. 2 is a cross-sectional view illustrating a state in which a touch sensor is installed therein.
  • the conventional mobile phone 100 includes an upper case 101 and the assembly 110 and the lower case 102 of the touch sensor.
  • the upper case 101 has a support portion 101a formed in a central opening, and a window panel touch sensor assembly 110 is installed on the support portion 101a.
  • the switch 120 is installed on the front of the upper case 101.
  • the lower case 102 is provided with a display device 140 such as an LCD and a main PCB 150.
  • the display device 140 is disposed under the window panel touch sensor assembly 110.
  • a flexible printed circuit (FPC) for signal transmission is electrically connected to the touch sensor assembly 110 and the main PCB 150.
  • the speaker 130 is provided on the upper case 101, and the microphone 140 is provided on the side surface.
  • FPC flexible printed circuit
  • the structure of the front panel of the window panel touch sensor assembly 110 is designed to be flush with the front of the upper case in order to facilitate assembly and to have a beautiful design. That is, the support 101a is formed around the center opening of the upper case 101 so as to be short as the thickness of the touch sensor assembly 110.
  • the front surface of the window panel touch sensor assembly 110 is divided into a transparent window area W in which an image output to the display device 140 is visible, and a decoration area D surrounding the window area W.
  • the window area W is a part that receives a touch input.
  • the decorative area (D) serves as a position to print a trademark or logo of a mobile phone maker, and at the same time, to cover an opaque electrode at the edge of the touch sensor or a dead zone of the touch sensor.
  • the window panel touch sensor assembly 200 includes a window panel 280 having a decorative layer 270 printed on the bottom edge thereof and a touch sensor 255 attached to the bottom of the window panel 280. .
  • the window panel 280 As the window panel 280, a flexible transparent film is usually used.
  • the window panel 280 having the decorative layer 270 printed on the edge is attached to the upper surface of the touch sensor 255 by the adhesive 260.
  • a reinforcing coated film 295 is attached to the top surface of the window panel 280 by the adhesive 290 to prevent the window panel 280 from being damaged.
  • the resistive touch sensor 255 any known 4-wire or 5-wire method may be used, but a 4-wire touch sensor is used.
  • the touch sensor 255 may include an upper substrate 250 coated with the transparent conductive film 240, a lower substrate 210 coated with the transparent conductive film 220, and a plurality of spacers 254 disposed between the conductive films. It is composed.
  • the lower substrate 210 is usually a tempered glass substrate or a transparent acrylic plate is used, the upper substrate is a transparent PET film is used.
  • An opaque electrode (not shown) printed at the edge of the touch sensor 255 is disposed below the decorative layer 270 of the window panel 280 so that the opaque electrode is not visible from the outside.
  • the conventional window panel touch sensor assembly 200 having the above structure has the following problems.
  • the defect that the bubble P remains may be due to the difference in height between the opaque decorative layer 270 printed on the lower surface of the window panel 280 and the window region W in which the decorative layer is not printed.
  • Second, the touch sensor 255, the window panel 280, and the protective film 295 are sequentially stacked to have a thick thickness and high material cost.
  • the light transmittance is poor because several layers of the film are attached with an adhesive.
  • An object of the present invention is to provide a resistive touch sensor assembly of a new structure that can be slim by reducing the thickness, can reduce the manufacturing cost, and can eliminate the bubble failure.
  • the window panel integrated resistive touch sensor includes a window panel substrate made of a transparent flexible material, an opaque decorative layer applied to one edge of the window panel substrate so that a transparent window area is partitioned on the window panel substrate, and a window panel substrate.
  • the opaque decorative layer can be formed by screen printing or by printing non-conductive ink on the decorative area (D).
  • the transparent first and second conductive layers may be optionally selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and cadmium tin oxide (CTO).
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • ZnO zinc oxide
  • CTO cadmium tin oxide
  • the first and second conductive layers are formed by sputtering or vapor deposition.
  • the window-integrated resistive touch sensor according to the present invention may be manufactured in the structure of a generally known 5-wire touch sensor, but the resistor disclosed in Korean Patent Application No. 10-2008-74107 filed by the inventors of the present invention in Korea.
  • the first and second conductive layers are formed by a sputtering or deposition method, and the second conductive layer is formed into a linear resistance pattern arranged so as not to cross one continuous line by etching the coated film.
  • the linear resistance pattern is preferably arranged to extend in a zigzag form in one direction from the upper surface of the lower substrate.
  • the touch sensor according to the present invention may further include an anti reflection layer applied on the linear resistance pattern.
  • Titanium oxide, silicon oxide, magnesium fluoride, etc. are used as the anti-reflection layer, and the titanium oxide and silicon oxide layer are formed in two or four layers to make the transparent electrode pattern difficult to see and reduce the transmittance by reducing the reflectance in the visible region. Can also increase.
  • a part of the edge of the adhesive layer is removed to form a connection portion, and conductive wires for electrically connecting the first conductive layer are disposed on opposite surfaces of the lower substrate. It is preferable to arrange
  • the touch sensor having the above structure allows the voltage induced in the first conductive layer to be induced in the conductive wiring of the lower substrate when the touch is applied, and outputs a signal by connecting the FPC to the lower substrate. In this case, a voltage may be applied to the second conductive layer through the FPC and the touch position signal induced in the first conductive layer may be transmitted.
  • the touch sensor according to the present invention forms a first conductive layer directly on a window panel on which a decorative layer is formed, thereby providing a touch sensor having a thin thickness and good light transmittance.
  • the touch sensor according to the present invention can simplify the manufacturing process it is possible to reduce the manufacturing cost.
  • there is no bubble failure because the process of attaching the touch sensor to the window panel is not necessary.
  • FIG. 1 is a perspective view of a mobile phone equipped with a window panel touch sensor assembly
  • FIG. 2 is a cross-sectional view showing a state in which a touch sensor assembly is installed in a mobile phone
  • FIG. 3 is a schematic diagram of a conventional window panel touch sensor assembly.
  • FIG. 4 is a schematic view for explaining the structure of the window panel-integrated resistive touch sensor according to the present invention.
  • FIG. 5 is an exploded perspective view illustrating the structure of the touch sensor shown in FIG. 4;
  • FIG. 6 is an explanatory view of a method of manufacturing a window panel integrated touch sensor according to the present invention.
  • FIGS. 4 and 5 An embodiment of a window panel integrated touch sensor according to the present invention will be described with reference to FIGS. 4 and 5.
  • the touch sensor 110 ′ of the present embodiment includes a window panel substrate 111 and a lower substrate 116.
  • the window panel substrate 111 uses a transparent PET film
  • the lower substrate 116 uses a tempered glass plate or a transparent acrylic plate.
  • the decorative layer 112 is coated on the bottom edge of the window panel substrate 111.
  • the decorative layer 112 forms opaque ink by silk screen printing.
  • a non-conductive thin film is coated, and a non-conductive ink is coated on the non-conductive material on the decorative area D using a silkscreen printing machine. ) May be formed.
  • the non-conductive thin film coated on the lower portion of the printed decorative layer 112 using the etching solution is left, and the thin film of the non-conductive material deposited in the window region W is removed.
  • a film of nonconductive material deposits a nonconductive metal or nonconductive oxide or nitride in vacuo.
  • the lower surface of the window panel substrate 111 is coated with a transparent first conductive layer 113 over the window region W and the decoration layer 112.
  • the first conductive layer 113 is formed by sputtering ITO. Referring to FIG. 3, the first conductive layer 113 is coated over the entire lower surface of the decorative layer 112, but may be coated to cover a portion of the inner edge of the lower surface of the decorative layer 112. The first conductive layer 113 must be coated to the lower surface of the decorative layer 112 so that the opaque member electrically connected to the first conductive layer can be hidden from the outside.
  • the lower substrate 116 is disposed to face the first conductive layer 113.
  • the second conductive layer 115 is coated on the opposite surface of the lower substrate 116 facing the first conductive layer 113.
  • the second conductive layer 115 of the present embodiment is arranged to extend in a zigzag direction in one direction so as not to intersect with a single line continuous to the upper surface of the lower substrate 116. pattern).
  • the linear resistance pattern 115 is formed by sputtering ITO on the lower substrate 116 to form a coating film, and then removing a portion of the coating film by a photolithography method.
  • a plurality of spacers 117 are disposed on the linear resistance pattern 115.
  • the plurality of spacers 117 are formed by silkscreen printing.
  • the window panel substrate 111 and the lower substrate 116 are joined by the adhesive layer 114 so that the first conductive layer 113 and the second conductive layer 115 face each other and maintain a constant gap therebetween.
  • the double-sided adhesive tape is used as the adhesive layer 114, it may be bonded after applying the adhesive to the edge of the lower substrate instead of the double-sided adhesive tape.
  • the adhesive layer 114 is formed with a connecting portion 114b from which a part of the edge is removed.
  • the lower substrate 116 is provided with a conductive line 115a to be electrically connected to the first conductive layer 113.
  • the conductive wiring 115a is positioned at the connecting portion 114b when the adhesive layer 114 is attached to the lower substrate 116.
  • a conductive member 114a is disposed above the conductive wiring 115a. Therefore, the first conductive layer 113 and the conductive wiring 115a are electrically connected by the conductive member 114a.
  • As the conductive member 114a an anisotropic conductive film (ACF) or an anisotropic conductive double-sided adhesive tape is used.
  • ACF anisotropic conductive film
  • anisotropic conductive double-sided adhesive tape is used as the conductive member 114a.
  • Reference numeral 118 denotes a flexible printed circuit (FPC) for electrically connecting the touch sensor 110 ', and reference numeral 118a denotes an anisotropic conductive film (ACF). As illustrated, the FPC is connected to both ends of the resistive pattern 115 and the ends of the conductive lines 115a electrically connected to the first conductive layer 113.
  • FPC flexible printed circuit
  • ACF anisotropic conductive film
  • the window-integrated touch sensor 110 ′ of the present embodiment may have a thinner thickness, increase light transmittance, and reduce manufacturing cost.
  • Conventional touch sensor assembly 200, the lower substrate (reinforced glass or acrylic substrate), ITO layer, spacer, upper substrate (PET film), adhesive layer (PSA), decorative printing layer, window panel, adhesive layer, reinforcement coating Since it is laminated
  • the touch sensor 110 'of the present embodiment prints a decorative layer on the upper substrate (film) and simultaneously uses the window panel, the process of attaching the touch sensor manufactured according to the conventional method to the window panel is eliminated.
  • a lower substrate 116 (tempered glass substrate or acrylic substrate) of a suitable size is prepared (S100).
  • the ITO film 115 ′ is coated on the upper surface of the lower substrate by the sputtering method (S110).
  • the ITO film 113 ' preferably has a sheet resistance in the range of 100 to 1000 ohms and a visible light transmittance of 87% or more.
  • a linear resistance pattern 115 is formed on the ITO film by the photolithography process (S120).
  • a plurality of spacers 117 are formed on the upper portion of the linear resistance pattern 115 by printing.
  • the window panel substrate 111 (PET film) is prepared (S200).
  • an opaque decorative layer 112 is formed at the edge of the window panel substrate.
  • the decorative layer 112 prints the non-conductive ink on the decorative region D, or coats the non-conductive thin film on the window panel substrate and applies the non-conductive ink on the decorative region D of the coated non-conductive thin film.
  • the nonconductive thin film on the window area W may be removed.
  • Non-conductive metal oxides or non-conductive metal alloys may be used to form the thin film of the non-conductive material.
  • Non-conductive metal oxides include titanium oxide (TiO 2 ) or silicon oxide (SiO 2 ).
  • the non-conductive metal alloy includes tin or silicon aluminum alloy.
  • a transparent conductive film (ITO film) is coated by sputtering over the window region and the decorative layer (S220). Since the process of coating the ITO film 313 'may use the same process as the conventional touch sensor manufacturing process, the detailed description thereof will be omitted.
  • a method of manufacturing a touch sensor by directly coating ITO and forming an electrode pattern on the window panel substrate 111 on which the decorative layer 112 is printed is required to change the concept.
  • the thickness of the printed decorative layer 112 is around 10 micrometers while the thickness of the ITO film is on the order of 0.01-0.1 micrometers. That is, the thickness of the ITO film is much thinner than the thickness of the decorative printed layer.
  • the FPC is bonded to the lower substrate by using ACF, and the window panel substrate is bonded to the lower substrate by using an adhesive 114.
  • a process of manufacturing one touch sensor is schematically illustrated, but it is obvious to those skilled in the art to manufacture a plurality of touch sensors simultaneously using a large disc.
  • a manufacturing process of the window panel integrated touch sensor is provided.
  • the process of bonding the window panel and the touch sensor is eliminated, thereby improving productivity.
  • the process of combining the separate window panel and the touch sensor is removed to remove the defects caused by bubbles generated by the step of the decorative layer.
  • the manufacturing steps of the window panel-integrated resistive touch sensor according to the present invention can be applied to the manufacture of a conventional 5-wire touch sensor.
  • the manufacturing method described above is different from the process of etching the second conductive layer deposited on the lower substrate to form a linear resistance pattern, instead of printing the electrode pattern on the edge of the second conductive layer. .
  • the window panel integrated touch sensor according to the present invention is used for an input device of a portable electronic device such as a mobile phone and a camera.
  • a portable electronic device such as a mobile phone and a camera.
  • the touch sensor according to the present invention there is an advantage in that the thickness of the portable electronic device can be made slim.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention se rapporte à un capteur tactile résistif intégré à un panneau de fenêtre. La présente invention comprend : une plaque de base de panneau de fenêtre dans un matériau flexible transparent ; une couche de décoration opaque recouvrant les bords sur une surface de la plaque de base de panneau de fenêtre de manière à délimiter une zone de fenêtre transparente sur la plaque de base de panneau de fenêtre ; une première couche transparente électroconductrice appliquée sur au moins une partie de la couche de décoration et de la zone fenêtre de la plaque de base de panneau de fenêtre ; une plaque de base inférieure disposée à l'opposé de la couche électroconductrice ; une seconde couche électroconductrice recouvrant la surface opposée de la plaque de base inférieure, faisant face à la première couche électroconductrice ; une pluralité d'entretoises placées entre la première couche électroconductrice et la seconde couche électroconductrice ; et une couche adhésive placée entre les bords de la première couche électroconductrice et de la seconde couche électroconductrice. Le capteur numérique selon la présente invention peut réduire les coûts de production car il implique un processus de production simple, et peut supprimer les défauts de bulle d'air qui surviennent lorsque le capteur numérique est fixé au panneau de fenêtre.
PCT/KR2010/002094 2009-04-07 2010-04-06 Capteur tactile résistif intégré à un panneau de fenêtre WO2010117186A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0029708 2009-04-07
KR1020090029708A KR20100111340A (ko) 2009-04-07 2009-04-07 윈도우 패널 일체형 저항 방식 터치 센서

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WO2010117186A2 true WO2010117186A2 (fr) 2010-10-14
WO2010117186A3 WO2010117186A3 (fr) 2011-01-20

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WO (1) WO2010117186A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041153A (ja) * 2015-08-20 2017-02-23 富士通コンポーネント株式会社 タッチパネル及びタッチパネルの製造方法

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KR101370453B1 (ko) * 2011-12-22 2014-03-06 엘지이노텍 주식회사 터치 패널
KR101319447B1 (ko) * 2012-04-23 2013-10-17 엘지이노텍 주식회사 터치 패널 및 그 제조 방법
KR101365036B1 (ko) * 2012-06-15 2014-02-27 일진디스플레이(주) 터치 패널용 전극 구조체, 터치 패널, 터치 패널의 전극 구조체 제조 방법
JP2020119223A (ja) * 2019-01-23 2020-08-06 尾池工業株式会社 加飾導電フィルム、抵抗膜式タッチパネルおよび電子機器

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JP2005173970A (ja) * 2003-12-11 2005-06-30 Alps Electric Co Ltd 座標入力装置及びそれを備えた画像表示装置と電子機器
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JP2003136625A (ja) * 2001-08-24 2003-05-14 Sony Corp 表示体用フィルム、タッチパネル及びこれらの製造方法
JP2005173970A (ja) * 2003-12-11 2005-06-30 Alps Electric Co Ltd 座標入力装置及びそれを備えた画像表示装置と電子機器
JP2008097494A (ja) * 2006-10-16 2008-04-24 Alps Electric Co Ltd 座標入力装置および座標検出方法
KR20060129980A (ko) * 2006-10-20 2006-12-18 아이티엠 주식회사 저항막 방식 터치스크린 패널 및 그 제조방법
KR100858331B1 (ko) * 2007-09-07 2008-09-11 주식회사 이투아이기술 윈도우 일체형 터치스크린 입력장치
KR20090027779A (ko) * 2007-09-13 2009-03-18 한플렉스 주식회사 터치패널 제조용 패드, 이를 이용한 터치패널 제조방법 및이에 의해 제조되는 터치패널

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041153A (ja) * 2015-08-20 2017-02-23 富士通コンポーネント株式会社 タッチパネル及びタッチパネルの製造方法

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KR20100111340A (ko) 2010-10-15
WO2010117186A3 (fr) 2011-01-20

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