WO2010058643A1 - 異方導電性フィルム - Google Patents
異方導電性フィルム Download PDFInfo
- Publication number
- WO2010058643A1 WO2010058643A1 PCT/JP2009/064935 JP2009064935W WO2010058643A1 WO 2010058643 A1 WO2010058643 A1 WO 2010058643A1 JP 2009064935 W JP2009064935 W JP 2009064935W WO 2010058643 A1 WO2010058643 A1 WO 2010058643A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- anisotropic conductive
- conductive film
- temperature
- dsc
- conductive particles
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 19
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 19
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims abstract description 10
- 230000020169 heat generation Effects 0.000 claims description 8
- 230000006866 deterioration Effects 0.000 abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- -1 ketone peroxides Chemical class 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005307 ferromagnetism Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- NREFJJBCYMZUEK-UHFFFAOYSA-N 2-[2-[4-[2-[4-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]phenyl]propan-2-yl]phenoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound C1=CC(OCCOCCOC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCCOCCOC(=O)C(C)=C)C=C1 NREFJJBCYMZUEK-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
Definitions
- the present invention relates to an anisotropic conductive film that bonds two circuit boards together and electrically connects mutually opposing circuits of different circuit boards without short-circuiting adjacent circuits in one circuit board. .
- Patent Document 1 discloses an example.
- an anisotropic conductive film a film in which conductive particles are dispersed in an adhesive film made of resin is used.
- the anisotropic conductive film By sandwiching the anisotropic conductive film between two circuit boards to be connected and thermocompression bonding, the two circuit boards are bonded by the anisotropic conductive film and the two circuit boards are opposed to each other. The circuits are electrically connected. At this time, it is required that adjacent circuits in the same circuit board are not short-circuited. Therefore, the anisotropic conductive film is required to have a connection performance with a low resistance (connection resistance) between circuits facing in the thickness direction and an insulation performance without short-circuiting between adjacent circuits in the surface direction. ing.
- An anisotropic conductive film is usually stored in the state of a film (in particular, the state of a film wound in a roll shape) until its mounting (when sandwiched between two circuit boards) after its manufacture. Therefore, excellent storage stability as a film is also desired.
- thermocompression bonding By using an anisotropic conductive film with excellent connection performance and insulation performance and performing the above-mentioned thermocompression bonding at a predetermined temperature and pressure, adhesion between the circuits and electrical connection are achieved, and between adjacent circuits. Insulation is also ensured.
- the temperature of thermocompression bonding that is, the mounting temperature of the anisotropic conductive film is too high, problems due to thermal damage of the circuit, thermal expansion / contraction difference, etc. occur. When placed in a high-humidity atmosphere, problems such as deterioration in connection performance over time tend to occur.
- thermocompression bonding temperature that is, the mounting temperature of the anisotropic conductive film is lower.
- time required for mounting that is, thermocompression bonding
- a highly conductive film Preferably, there is a need for an anisotropic conductive film that is further excellent in storage stability.
- the present invention can achieve sufficient electrical connection between circuit boards with a lower mounting temperature and shorter heating than conventional anisotropic conductive films, and the connection performance deteriorates over time in a high-temperature and high-humidity atmosphere. It is an object of the present invention to provide an anisotropic conductive film that does not have such problems.
- the above-mentioned problem is an anisotropic conductive film containing a radical polymerizable substance, a polymerization initiator that generates radicals upon heating, a phenoxy resin having a molecular weight of 30000 or more, and conductive particles, at a heating rate of 10 ° C./min.
- the anisotropic conductive film (first invention of the present application) characterized in that the DSC heat generation starting temperature when measured is 100 ° C. or lower and the DSC peak temperature is 120 ° C. or lower.
- the inventor used a film comprising a resin composition containing a radical polymerizable substance and its polymerization initiator together with a phenoxy resin as an adhesive film constituting an anisotropic conductive film, and the film
- the starting temperature of the thermosetting reaction can be made 100 ° C. or lower and the reaction peak temperature can be made 120 ° C. or lower, and the starting temperature and reaction of the hardening reaction
- the peak temperature within the above range, it is possible to achieve sufficient electrical connection between circuit boards at a low mounting temperature, and there is no problem such as deterioration of the connection performance over time in a high-temperature and high-humidity atmosphere.
- the present invention was completed by finding that a conductive film can be obtained.
- the starting temperature of the thermosetting reaction is defined as the DSC exothermic starting temperature when measured at a heating rate of 10 ° C./min.
- the reaction peak temperature is defined as the DSC peak temperature when measured at a heating rate of 10 ° C./min.
- the DSC peak temperature exceeds 120 ° C.
- the resistance between the opposing circuits of the two circuit boards cannot be lowered under a low mounting temperature condition, for example, heating at 140 ° C. for about 10 seconds. In this case, sufficient connection performance cannot be obtained.
- the thermosetting reaction starts at a low temperature and is quickly activated, thereby improving the reactivity at a low temperature. Excellent connection performance can be obtained even at low mounting temperatures.
- the difference between the DSC heat generation start temperature and the DSC peak temperature is small. Specifically, by setting the difference to 20 ° C. or less, further excellent connection performance can be obtained.
- the types of phenoxy resin, radical polymerizable substance, and polymerization initiator and their blending amounts are such that the DSC exotherm starting temperature is 100 ° C. or lower and the DSC peak temperature is 120 ° C. when measured at a temperature rising rate of 10 ° C./min. It is selected in the following range. As long as this condition is satisfied, the type and the blending amount thereof are not particularly limited, but the following are exemplified.
- the phenoxy resin constituting the anisotropic conductive film of the present invention is a high molecular weight polyhydroxy polyether synthesized from bisphenol and epihalohydrin.
- the bisphenol A is bisphenol A
- bisphenol A type phenoxy resins represented by the following structural formulas are given as representative examples. Fluorene ring-containing phenoxy resin, caprolactone-modified bisphenol A type phenoxy resin and the like can also be exemplified.
- the phenoxy resin is tough, flexible, has good adhesiveness, has excellent film forming properties, and is an essential component for forming an anisotropic conductive film.
- a phenoxy resin having a molecular weight of 30000 or more is used for forming an anisotropic conductive film.
- the molecular weight means a weight average molecular weight in terms of polystyrene measured by GPC.
- the radically polymerizable substance is selected from monomers and oligomers that undergo radical polymerization at a mounting temperature, for example, 140 ° C., and are compatible with a phenoxy resin having a molecular weight of 30000 or more.
- a mounting temperature for example, 140 ° C.
- examples thereof include acrylic acid esters and methacrylic acid esters.
- the radical polymerization initiator is compatible with a phenoxy resin having a molecular weight of 30,000 or more and is stable at room temperature, but generates radicals by heating at a mounting temperature, for example, 140 ° C., and the polymerization reaction of the radical polymerizable substance Selected from compounds having the ability to initiate Specific examples include peroxides, ketone peroxides, diacyl peroxides, peroxydicarbonates, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, and the like.
- Examples of the conductive particles dispersed in the organic binder component include metal particles such as gold, silver, copper, nickel, lead, tin, and alloys made of the above metals, such as solder, silver-copper alloy, etc.
- conductive particles such as carbon, conductive particles or non-conductive glass, ceramics, and plastic particles may be used as the core, and other conductive materials such as metal or ITO may be coated on the surface.
- the anisotropic conductive film is oriented by its own magnetism and can be oriented by using a magnetic field as will be described later. As a result, the anisotropic conductive film has excellent connection performance. Is preferable because it is easily obtained.
- the particle size of the conductive particles is preferably 0.05 to 20 ⁇ m. If the particle size is too small, the connection performance tends to be unstable, and if it is too large, a short circuit between adjacent circuits tends to occur, and the insulation performance tends to decrease.
- the blending amount of the conductive particles is preferably in the range of 0.01 to 20% by volume, more preferably based on the total volume of the radical polymerizable substance, the polymerization initiator that generates radicals upon heating, and the phenoxy resin having a molecular weight of 30000 or more. Is in the range of 0.03 to 5% by volume. When the blending amount of the conductive particles is too large, the insulation performance tends to be lowered, and when it is too little, the connection performance tends to be lowered.
- the second invention of the present application is the anisotropic conductive film according to the first invention of the present application, characterized in that the DSC heat generation starting temperature is 70 ° C. or higher when measured at a heating rate of 10 ° C./min.
- the DSC heat generation start temperature is too low, the storage stability of the anisotropic conductive film is lowered. This problem is particularly noticeable in the case of preservation in summer and tropical areas. If the DSC heat generation start temperature is 70 ° C. or higher, it is preferable because sufficient storage stability can be obtained even in the storage state where the temperature is high, such as in summer or in the tropical region.
- the third invention of the present application is the anisotropic conductive film of the first invention of the present application or the second invention of the present application, wherein the ratio of the length to the diameter of the conductive particles is 5 or more.
- conductive particles having a diameter to length ratio (aspect ratio) of 5 or more are used as the conductive particles used in the present invention, excellent connection performance is obtained even when the blending amount of the conductive particles is small. This is preferable because the insulating performance can be further improved.
- This aspect ratio can be directly measured by observation using a CCD microscope or the like.
- the aspect ratio is obtained using the maximum length of the cross section as the diameter.
- the conductive particles are bent or branched, the aspect ratio is obtained with the maximum length of the conductive particles as the length.
- the conductive particles having an aspect ratio of 5 or more include needle-shaped conductive particles, and examples thereof include those formed by connecting a large number of fine metal particles into a needle shape. More preferably, the aspect ratio is 10 to 100.
- the fourth invention of the present application is the anisotropic conductive film of the third invention of the present application, characterized in that the major axis direction of the conductive particles is oriented in the thickness direction of the film.
- conductive particles having an aspect ratio of 5 or more in the thickness direction of the film because the connection performance and insulation performance are further improved.
- the method for orienting the conductive particles in the thickness direction of the film is not particularly limited. However, when using conductive particles having ferromagnetism, the conductive particles are oriented in a resin solution in which conductive particles are dispersed as described below. A method of forming a film while applying a magnetic field in the direction to be generated can be mentioned.
- the anisotropic conductive film of the present invention is, for example, a plate in which conductive particles are dispersed in a resin solution in which a radical polymerizable substance, a polymerization initiator that generates radicals upon heating, and a phenoxy resin having a molecular weight of 30000 or more are dissolved in a solvent.
- the film can be formed by a method such as coating on the surface, and the solvent can be removed from the film.
- the solvent is not particularly limited as long as it can dissolve a radical polymerizable substance, a polymerization initiator, and a phenoxy resin and disperse the conductive particles. Among them, those which can be easily formed and have a low boiling point and can be easily removed by volatilization are preferable.
- the anisotropic conductive film of the present invention can be used for adhesion and electrical connection between two circuit boards by the same method as the conventional anisotropic conductive film. That is, by sandwiching the anisotropic conductive film of the present invention between two circuit boards to be connected and thermocompression bonding, the two circuit boards are bonded to each other and the two circuit boards are opposed to each other. The space is electrically connected. Since the anisotropic conductive film of this invention has the outstanding insulation performance, the short circuit between the adjacent circuits in the same circuit board does not arise in this case.
- the anisotropic conductive film of the present invention is capable of achieving sufficient electrical connection between circuit boards with a low mounting temperature and a short heating time, and the connection performance deteriorates over time in a high temperature and high humidity atmosphere. Nor.
- Conductive particles As the conductive particles, linear nickel fine particles having a long diameter distribution of 1 ⁇ m to 8 ⁇ m and a short diameter distribution of 0.1 ⁇ m to 0.4 ⁇ m were used.
- the conductive particles obtained above were blended in an amount of 0.1% by volume in the resin solution obtained above and dispersed. Then, it apply
- DSC measurement About the obtained anisotropic conductive film, DSC measurement was performed on the conditions shown below. The results are shown in Table 2.
- Equipment used Differential scanning calorimeter DSC-60, manufactured by Shimadzu Corporation Measurement conditions: Temperature rising rate 10 ° C./min
- a flexible printed circuit board in which 100 copper electrodes plated with gold of 100 ⁇ m width and 18 ⁇ m height are arranged at intervals of 100 ⁇ m, and 100 copper electrodes plated with gold of 100 ⁇ m width and 18 ⁇ m in height are arranged at intervals of 100 ⁇ m.
- a prepared glass epoxy substrate was prepared. The anisotropic conductive film obtained above is sandwiched between the flexible printed circuit board and the glass epoxy board, and is heated and bonded at 140 ° C. for 10 seconds under a pressure of 3 MPa. And a connected body of the glass epoxy substrate was obtained. The resistance value between the circuits of the flexible printed circuit board and the glass epoxy board was measured. This evaluation was repeated 10 times, and the average value of the connection resistance was obtained. These measured values were used as initial connection resistance values and are shown in Table 2.
- connection body was put into a constant temperature and humidity chamber set at a temperature of 85 ° C. and a humidity of 85%, taken out after the elapse of 500 hours, and the average value of connection resistance was obtained again in the same manner as described above.
- the measured values are shown in Table 2 as the connection resistance values after 500 hours of high temperature and high humidity.
- the DSC exotherm starting temperature is 100 ° C. or lower and the DSC peak temperature is 120 ° C. or lower (and the difference between the DSC exothermic starting temperature and the DSC peak temperature is 20 ° C. or lower).
- the anisotropic conductive film (Example of the present invention) of Example 2 was used, although the connection body was manufactured at a low mounting temperature (140 ° C., 3 MPa, heating for 10 seconds), the initial connection resistance Shows excellent connection performance.
- Table 2 shows that the connection resistance after being left in a high temperature and high humidity atmosphere for 500 hours is low and there is no problem that the connection performance deteriorates with time in the high temperature and high humidity atmosphere.
- the present invention can achieve sufficient electrical connection between circuit boards with a lower mounting temperature and shorter heating than conventional anisotropic conductive films, and the connection performance deteriorates over time in a high-temperature and high-humidity atmosphere.
- An anisotropic conductive film without such problems can be provided.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
導電性粒子としては、長径の分布が1μmから8μm、短径の分布が0.1μmから0.4μmである直鎖状ニッケル微粒子を用いた。
2,2-ビス[4-(メタクリロキシジエトキシ)フェニル]プロパン(ラジカル重合性物質、商品名:BPE-200、新中村化学社製)、ビスフェノールA型フェノキシ樹脂(分子量50000のフェノキシ樹脂、商品名:エピコート1256、JER社製)、及び下記の重合開始剤のそれぞれを、表1に示す組成(重量比)で配合し、2-エトキシエチルアセタートに固形分50重量%となるように溶解して樹脂溶液を得た。
・パーブチルO 日本油脂社製
・パーヘキシルO 日本油脂社製
・パーオクタO 日本油脂社製
得られた異方導電性フィルムについて、以下に示す条件でDSC測定を行った。結果を表2に示す。
使用装置:示差走査熱量計DSC-60、島津製作所社製
測定条件:昇温速度10℃/min
幅100μm、高さ18μmの金メッキが施された銅電極が100μm間隔で100個配列されたフレキシブルプリント回路基板と、幅100μm、高さ18μmの金メッキが施された銅電極が100μm間隔で100個配列されたガラスエポキシ基板とを用意した。このフレキシブルプリント回路基板とガラスエポキシ基板との間に前記で得られた異方導電性フィルムを挟み、140℃に加熱しながら、3MPaの圧力で10秒間加圧して熱接着させ、フレキシブルプリント回路基板とガラスエポキシ基板との接続体を得た。フレキシブルプリント回路基板とガラスエポキシ基板の回路間の抵抗値を測定した。この評価を10回繰り返し、接続抵抗の平均値を求めた。この測定値を初期接続抵抗値とし、表2に示した。
前記接続体を温度85℃、湿度85%に設定した恒温恒湿槽内に投入し、500時間経過後に取り出し、再び前記と同様にして接続抵抗の平均値を求めた。この測定値を高温高湿500hr後接続抵抗値とし、表2に示した。
Claims (4)
- ラジカル重合性物質、加熱によりラジカルを発生する重合開始剤、分子量30000以上のフェノキシ樹脂、及び導電粒子を含有する異方導電性フィルムであって、昇温速度10℃/分で測定したときのDSC発熱開始温度が100℃以下であり、かつDSCピーク温度が120℃以下であることを特徴とする異方導電性フィルム。
- 前記DSC発熱開始温度が70℃以上であることを特徴とする請求項1に記載の異方導電性フィルム。
- 前記導電粒子の径に対する長さの比が5以上であることを特徴とする請求項1又は請求項2に記載の異方導電性フィルム。
- 導電粒子の長径方向をフィルムの厚み方向に配向させたことを特徴とする請求項3に記載の異方導電性フィルム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09827424A EP2355253A1 (en) | 2008-11-18 | 2009-08-27 | Anisotropic conductive film |
US12/918,260 US20100323147A1 (en) | 2008-11-18 | 2009-08-27 | Anisotropic conductive film |
CN2009801055333A CN102273015A (zh) | 2008-11-18 | 2009-08-27 | 各向异性导电膜 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2008-294655 | 2008-11-18 | ||
JP2008294655A JP2010121007A (ja) | 2008-11-18 | 2008-11-18 | 異方導電性フィルム |
Publications (1)
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WO2010058643A1 true WO2010058643A1 (ja) | 2010-05-27 |
Family
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Family Applications (1)
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PCT/JP2009/064935 WO2010058643A1 (ja) | 2008-11-18 | 2009-08-27 | 異方導電性フィルム |
Country Status (7)
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US (1) | US20100323147A1 (ja) |
EP (1) | EP2355253A1 (ja) |
JP (1) | JP2010121007A (ja) |
KR (1) | KR20110095127A (ja) |
CN (1) | CN102273015A (ja) |
TW (1) | TW201027567A (ja) |
WO (1) | WO2010058643A1 (ja) |
Families Citing this family (6)
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JP2016162510A (ja) * | 2015-02-26 | 2016-09-05 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び接続構造体 |
KR101991992B1 (ko) * | 2016-04-29 | 2019-06-21 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 이를 이용한 접속 구조체 |
JP2018104653A (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤 |
JP6867425B2 (ja) * | 2019-03-11 | 2021-04-28 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び接続構造体 |
CN113012566A (zh) | 2019-12-19 | 2021-06-22 | 群创光电股份有限公司 | 可挠性显示装置以及其制作方法 |
CN114882790B (zh) * | 2022-04-24 | 2023-06-16 | 绵阳惠科光电科技有限公司 | 异方性导电胶和显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000509425A (ja) * | 1996-05-16 | 2000-07-25 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 接着剤組成物と使用方法 |
JP2003221557A (ja) * | 2002-01-31 | 2003-08-08 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
JP2008117748A (ja) | 2006-10-10 | 2008-05-22 | Sumitomo Electric Ind Ltd | 異方性導電フィルム、異方性導電フィルムの製造方法、配線板、配線板接続体および配線板モジュール |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7604868B2 (en) * | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
ATE408250T1 (de) * | 2002-03-04 | 2008-09-15 | Sumitomo Electric Industries | Anisotroper leitfähiger film und verfahren zu seiner herstellung |
-
2008
- 2008-11-18 JP JP2008294655A patent/JP2010121007A/ja not_active Withdrawn
-
2009
- 2009-08-27 EP EP09827424A patent/EP2355253A1/en not_active Withdrawn
- 2009-08-27 WO PCT/JP2009/064935 patent/WO2010058643A1/ja active Application Filing
- 2009-08-27 US US12/918,260 patent/US20100323147A1/en not_active Abandoned
- 2009-08-27 CN CN2009801055333A patent/CN102273015A/zh active Pending
- 2009-08-27 KR KR1020107016558A patent/KR20110095127A/ko not_active Application Discontinuation
- 2009-11-17 TW TW098138922A patent/TW201027567A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000509425A (ja) * | 1996-05-16 | 2000-07-25 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 接着剤組成物と使用方法 |
JP2003221557A (ja) * | 2002-01-31 | 2003-08-08 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続用接着剤組成物及び回路接続方法 |
WO2004055126A1 (en) * | 2002-12-13 | 2004-07-01 | Ls Cable Ltd. | Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
JP2008117748A (ja) | 2006-10-10 | 2008-05-22 | Sumitomo Electric Ind Ltd | 異方性導電フィルム、異方性導電フィルムの製造方法、配線板、配線板接続体および配線板モジュール |
Also Published As
Publication number | Publication date |
---|---|
EP2355253A1 (en) | 2011-08-10 |
US20100323147A1 (en) | 2010-12-23 |
CN102273015A (zh) | 2011-12-07 |
KR20110095127A (ko) | 2011-08-24 |
TW201027567A (en) | 2010-07-16 |
JP2010121007A (ja) | 2010-06-03 |
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