WO2010056054A2 - 터치스크린 및 그 제조방법 - Google Patents
터치스크린 및 그 제조방법 Download PDFInfo
- Publication number
- WO2010056054A2 WO2010056054A2 PCT/KR2009/006668 KR2009006668W WO2010056054A2 WO 2010056054 A2 WO2010056054 A2 WO 2010056054A2 KR 2009006668 W KR2009006668 W KR 2009006668W WO 2010056054 A2 WO2010056054 A2 WO 2010056054A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- touch screen
- ito film
- manufacturing
- film
- metal layer
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- the present invention relates to a touch screen and a method of manufacturing the same.
- the touch screen is a device that can sense the position when the finger or the touch pen is in close proximity or touch, and is installed on the screen of the image display device so that information can be easily input.
- the touch screen senses a touch input using a hand or a pen by using a transparent electrode.
- the transparent electrode may be formed by wiring a metal film on a transparent conductive oxide film such as indium tin oxide (ITO).
- the conventional wiring process of the touch screen has a problem that the process is complicated.
- the thickness of the metal film may be formed thick. If the metal film is thick, there is a problem in that the ductility of the touch screen is weakened and adhesion is reduced.
- An embodiment of the present invention provides a touch screen and a method of manufacturing the same that are excellent in ductility and can simplify the manufacturing process.
- the transparent conductive material deposited on the upper surface of the flexible plastic film It includes a metal layer vacuum deposited on the transparent conductive film.
- Method of manufacturing a touch screen the step of heat treatment for preventing shrinkage of the ITO film; Pretreatment by removing impurities on the surface of the ITO film; Depositing a metal layer on the pretreated ITO film.
- FIG. 1 is a cross-sectional view of a touch screen according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view of a touch screen according to a second embodiment of the present invention.
- FIG. 3 is a flow chart of a touch screen manufacturing method according to an embodiment of the present invention.
- FIG. 1 is a cross-sectional view of a touch screen according to a first embodiment of the present invention.
- the touch screen according to the first embodiment of the present invention includes a transparent conductive film 20 such as indium tin oxide (ITO) deposited on the upper surface of the flexible plastic film 10, and a transparent conductive layer. And a conductor layer 30 deposited on the film 20.
- a transparent conductive film 20 such as indium tin oxide (ITO) deposited on the upper surface of the flexible plastic film 10, and a transparent conductive layer.
- a conductor layer 30 deposited on the film 20.
- the flexible plastic film 10 may be a film such as PES, PC, PE, PI, Acryl, etc., in the embodiment of the present invention to illustrate the case of using a polyethylene terephthalate (PET) film 10 do.
- PET polyethylene terephthalate
- the PET film 10 has a property of shrinking in the 100 ⁇ 150 °C region. Therefore, when the PET film 10 having the transparent conductive film 20 deposited thereon is used for manufacturing a touch screen, the alignment is inconsistent due to shrinkage of the PET film 10 during heat treatment for the bonding process of the upper and lower plates. There is a problem. Therefore, the PET film 10 is heat-treated at 150 ° C. for 90 minutes to perform an annealing process to generate shrinkage of the film in advance, thereby eliminating shrinkage that may occur in metal layer deposition and subsequent processes.
- the conductor layer 30 is deposited on the ITO film 20.
- the surface of the ITO film 20 functions to sense a touch, and the conductor layer 30 is used as an electrode for moving charges.
- the conductor layer 30 is formed using a conductive metal having a lower resistance than the ITO film 20.
- the conductor layer 30 may be formed of a metal having excellent conductivity such as Ag, Cu, Au, and Al by using a vacuum deposition technique such as RF sputter, DC sputter, or CVD. Since the conductor layer 30 directly affects the sensitivity of the touch screen, the deposition metal and thickness may be adjusted so that the resistance value may be adjusted to 0.1 ⁇ / square or less.
- impurities on the surface of the ITO film 20 by plasma or ion beam can be used to perform the pretreatment process.
- FIG. 2 is a cross-sectional view of a touch screen according to a second embodiment of the present invention.
- a double layer of metal is formed on the ITO film 20 deposited on the PET film 10 to form the buffer layer 40 and the conductor layer 30. Can be used.
- the surface of the ITO film 20 is pretreated by a method such as plasma treatment or ion beam irradiation, and then the metal layers 30 and 40 are deposited to form the ITO film 20. It is possible to prevent surface damage and to improve the adhesion and conductivity of the metal layers 30 and 40.
- the buffer layer 40 deposited directly on the ITO film 20 improves adhesion between the ITO film 20 and the metal layers 30 and 40. Accordingly, the buffer layer 40 may be formed of a material such as Ni, Cr, Ni-Cr, Ti, Sn, Mo, and the conductor layer 30 may select a material having excellent adhesion and conductivity with the buffer layer 40.
- the buffer layer 40 deposited directly on the ITO film 20 improves the adhesion between the ITO film 20 and the metal layer. Accordingly, the buffer layer 40 may be formed of a material such as Ni, Cr, Ni-Cr, Ti, Sn, Mo, and the conductor layer 30 may select a material having excellent adhesion and conductivity with the buffer layer 40.
- Mo / Ag deposited ITO film 20 may be formed by depositing Mo to a thickness of 100 ⁇ with the buffer layer 40 and depositing Ag to 800 ⁇ with the conductor layer 30.
- the conductivity and adhesion are measured as 1.50 ⁇ / ⁇ , 0.95 kgf / cm.
- Ni-Cr may be deposited to a thickness of 100 kV into the buffer layer 40
- Ag may be deposited to a thickness of 800 kW into the conductor layer 30 to form a Ni-Cr / Ag deposited ITO film 20.
- the conductivity and adhesion are measured as 1.48 ⁇ / ⁇ , 0.98 kgf / cm.
- Ni-Cr may be deposited to a thickness of 100 ⁇ with the buffer layer 40, and Cu may be deposited to a thickness of 1000 ⁇ with the conductor layer 30 to form a Ni-Cr / Cu deposited ITO film 20.
- the conductivity and adhesion are measured as 1.10 ⁇ / ⁇ , 0.97 kgf / cm.
- the conductivity and adhesion are measured as 0.88 ⁇ / ⁇ , 0.3 kgf / cm, 0.94 ⁇ / ⁇ , and 0.34 kgf / cm, respectively.
- FIG. 3 is a flowchart illustrating a touch screen manufacturing method according to an embodiment of the present invention.
- the touch screen when manufacturing the touch screen according to an embodiment of the present invention, first, heat treatment of the PET film 10, the ITO film 20 is deposited (S110).
- the surface of the ITO film 20 is pretreated using a plasma or an ion beam (S120).
- the reactive gas for generating the ion beam may be selected from O 2 , O 3 , N 2 , N 2 O, NO 2 , CO 2 , or may be selected from inert gas Ar, Kr, Xe, Ne have.
- it can apply in the state which mixes reactive gas, an inert gas solely, or is mixed.
- the irradiation amount of the ion beam can be used in the range of 1X10 15 / cm 2 ⁇ 1X10 18 / cm 2 .
- the buffer layer 40 which is the first metal layer, is deposited on the pretreated ITO film 20 (S130).
- the buffer layer 40 may be formed of metals such as Ni, Cr, Ni-Cr, Ti, Sn, and Mo by using a vacuum deposition method such as RF sputtering, DC sputtering, or CVD techniques.
- a second metal layer which is a conductor layer 30, is deposited on the first metal layer (S140).
- the conductor layer 30 may be formed of a metal such as Ag, Cu, Au, Al, or the like by using a vacuum deposition method such as an RF sputter, a DC sputter, or a CVD technique.
- the present invention can provide a touch screen that is excellent in ductility and can simplify the manufacturing process.
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
버퍼층 | 전도체층 | 전도도(면저항,Ω/□) | 밀착력(kgf/cm) | |
실험1 | Mo, 100Å | Ag, 800Å | 1.50 | 0.95 |
실험2 | Ni-Cr, 100Å | Ag, 800Å | 1.48 | 0.98 |
실험3 | Ni-Cr, 100Å | Cu, 1000Å | 1.10 | 0.97 |
실험4 | 0 | Ag, 1000Å | 0.88 | 0.3 |
실험5 | 0 | Cu, 1000Å | 0.94 | 0.34 |
Claims (11)
- 연성 플라스틱 필름의 상면에 증착된 투명 도전성 물질과;상기 투명 도전성 필름에 진공 증착된 금속층을 포함하는 터치스크린.
- 제1항에 있어서,상기 연성 플라스틱 필름은,PET, PES, PC, PE, PI, Acryl 중 적어도 어느 하나를 포함하는 터치스크린.
- 제1항에 있어서,상기 금속층은,Ag, Cu, Au, Al 중 적어도 어느 하나로 구성되는 전도체층을 포함하는 터치스크린.
- 제1항에 있어서,상기 금속층은,Ni, Cr, Ni-Cr, Ti, Sn, Mo 중 적어도 어느 하나로 구성되는 버퍼층과;Ag, Cu, Au, Al 중 적어도 어느 하나로 구성되는 전도체층을 포함하는 터치스크린.
- 제1항에 있어서,상기 금속층은,RF 스퍼터, DC 스퍼터, CVD 기술 중 적어도 어느 하나를 이용한 진공 증착되는 것을 특징으로 하는 터치스크린.
- ITO 필름의 수축방지를 위한 열처리하는 단계와;상기 ITO 필름의 표면의 불순물을 제거하여 전처리 하는 단계와;상기 전처리된 ITO 필름에 금속층을 진공 증착하는 단계를 포함하는 터치스크린의 제조방법.
- 제6항에 있어서,상기 ITO 필름의 표면의 불순물을 제거하여 전처리 하는 단계는,O2, O3, N2, N2O, NO2, CO2 중 적어도 어느 하나를 이용한 이온 빔을 발생시켜 전처리 하는 단계를 포함하는 터치스크린의 제조방법.
- 제6항에 있어서,상기 ITO 필름의 표면의 불순물을 제거하여 전처리 하는 단계는,Ar, Kr, Xe, Ne 중 적어도 어느 하나를 이용한 플라즈마를 발생시켜 전처리 하는 단계를 포함하는 터치스크린의 제조방법.
- 제6항에 있어서,상기 전처리된 ITO 필름에 금속층을 진공 증착하는 단계는,Ag, Cu, Au, Al 중 적어도 어느 하나를 진공 증착하여 전도체층을 형성하는 단계를 포함하는 터치스크린의 제조방법.
- 제6항에 있어서,상기 전처리된 ITO 필름에 금속층을 증착하는 단계는,Ni, Cr, Ni-Cr, Ti, Sn, Mo 중 적어도 어느 하나를 진공 증착하여 버퍼층을 형성하는 단계와;Ag, Cu, Au, Al 중 적어도 어느 하나를 진공 증착하여 전도체층을 형성하는 단계를 포함하는 터치스크린의 제조방법.
- 제6항에 있어서,상기 전처리된 ITO 필름에 금속층을 진공 증착하는 단계는,RF 스퍼터, DC 스퍼터, CVD 기술 중 적어도 어느 하나를 이용하여 진공 증착하는 단계를 포함하는 터치스크린의 제조방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200980145573.0A CN102216886B (zh) | 2008-11-14 | 2009-11-13 | 触摸屏及其制造方法 |
US13/129,362 US8842083B2 (en) | 2008-11-14 | 2009-11-13 | Touch screen and manufacturing method thereof |
JP2011536244A JP2012508923A (ja) | 2008-11-14 | 2009-11-13 | タッチスクリーン及びその製造方法 |
EP09826286A EP2354899A4 (en) | 2008-11-14 | 2009-11-13 | TOUCH SCREEN AND METHOD FOR MANUFACTURING THE SAME |
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KR10-2008-0113678 | 2008-11-14 | ||
KR20080113678A KR101172113B1 (ko) | 2008-11-14 | 2008-11-14 | 터치스크린 및 그 제조방법 |
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WO2010056054A2 true WO2010056054A2 (ko) | 2010-05-20 |
WO2010056054A3 WO2010056054A3 (ko) | 2010-08-12 |
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PCT/KR2009/006668 WO2010056054A2 (ko) | 2008-11-14 | 2009-11-13 | 터치스크린 및 그 제조방법 |
Country Status (6)
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US (1) | US8842083B2 (ko) |
EP (1) | EP2354899A4 (ko) |
JP (2) | JP2012508923A (ko) |
KR (1) | KR101172113B1 (ko) |
CN (2) | CN103927049B (ko) |
WO (1) | WO2010056054A2 (ko) |
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- 2009-11-13 JP JP2011536244A patent/JP2012508923A/ja active Pending
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CN102184682A (zh) * | 2011-04-27 | 2011-09-14 | 冠捷显示科技(厦门)有限公司 | 一种光学级塑胶透明片显示器及其制作方法 |
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CN102314257A (zh) * | 2011-09-22 | 2012-01-11 | 中兴通讯股份有限公司 | 一种触摸装置及用户终端 |
Also Published As
Publication number | Publication date |
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CN102216886A (zh) | 2011-10-12 |
EP2354899A2 (en) | 2011-08-10 |
JP2014112444A (ja) | 2014-06-19 |
EP2354899A4 (en) | 2013-03-27 |
KR101172113B1 (ko) | 2012-08-10 |
WO2010056054A3 (ko) | 2010-08-12 |
JP5969527B2 (ja) | 2016-08-17 |
US20110304568A1 (en) | 2011-12-15 |
CN103927049B (zh) | 2017-03-15 |
JP2012508923A (ja) | 2012-04-12 |
US8842083B2 (en) | 2014-09-23 |
CN103927049A (zh) | 2014-07-16 |
CN102216886B (zh) | 2015-03-11 |
KR20100054674A (ko) | 2010-05-25 |
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