WO2010050773A3 - 임베디드 커패시터 및 그 제조방법 - Google Patents
임베디드 커패시터 및 그 제조방법 Download PDFInfo
- Publication number
- WO2010050773A3 WO2010050773A3 PCT/KR2009/006341 KR2009006341W WO2010050773A3 WO 2010050773 A3 WO2010050773 A3 WO 2010050773A3 KR 2009006341 W KR2009006341 W KR 2009006341W WO 2010050773 A3 WO2010050773 A3 WO 2010050773A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- embedded capacitor
- fabricating same
- oxide film
- metal oxide
- electrode layer
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 2
- 229910044991 metal oxide Inorganic materials 0.000 abstract 3
- 150000004706 metal oxides Chemical class 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801409395A CN102187414B (zh) | 2008-10-30 | 2009-10-30 | 埋入式电容器及其制造方法 |
US13/121,618 US8665580B2 (en) | 2008-10-30 | 2009-10-30 | Embedded capacitor and method of fabricating the same |
JP2011532029A JP5221767B2 (ja) | 2008-10-30 | 2009-10-30 | 内蔵キャパシタ及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0107370 | 2008-10-30 | ||
KR1020080107370A KR101628355B1 (ko) | 2008-10-30 | 2008-10-30 | 임베디드 커패시터 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010050773A2 WO2010050773A2 (ko) | 2010-05-06 |
WO2010050773A3 true WO2010050773A3 (ko) | 2010-08-05 |
Family
ID=42129484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/006341 WO2010050773A2 (ko) | 2008-10-30 | 2009-10-30 | 임베디드 커패시터 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8665580B2 (ko) |
JP (1) | JP5221767B2 (ko) |
KR (1) | KR101628355B1 (ko) |
CN (1) | CN102187414B (ko) |
WO (1) | WO2010050773A2 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012181445A (ja) | 2011-03-02 | 2012-09-20 | Seiko Epson Corp | 電気装置 |
CN103350543B (zh) * | 2013-07-19 | 2016-01-20 | 广东生益科技股份有限公司 | 一种埋容材料、制备方法及其用途 |
CN103350542B (zh) * | 2013-07-19 | 2016-01-20 | 广东生益科技股份有限公司 | 一种埋容材料、制备方法及其用途 |
KR102187695B1 (ko) * | 2014-01-28 | 2020-12-07 | 엘지이노텍 주식회사 | 인쇄회로기판 |
KR102248388B1 (ko) * | 2014-09-01 | 2021-05-07 | (주)포인트엔지니어링 | 커패시터 |
US10798821B2 (en) | 2016-04-02 | 2020-10-06 | Intel Corporation | Circuit board having a passive device inside a via |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030054310A (ko) * | 2001-12-24 | 2003-07-02 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터의 제조 방법 |
KR100413479B1 (ko) * | 2001-04-18 | 2003-12-31 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 형성 방법 |
KR100679827B1 (ko) * | 2004-12-22 | 2007-02-06 | 동부일렉트로닉스 주식회사 | 금속-절연체-금속 커패시터의 제조 방법 |
KR100721184B1 (ko) * | 2001-02-06 | 2007-05-23 | 주식회사 하이닉스반도체 | 반도체 커패시터의 제조방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55166916A (en) | 1979-06-15 | 1980-12-26 | Nippon Electric Co | Method of manufacturing thin film condenser |
US6461493B1 (en) * | 1999-12-23 | 2002-10-08 | International Business Machines Corporation | Decoupling capacitor method and structure using metal based carrier |
EP1132973A1 (de) | 2000-03-06 | 2001-09-12 | Infineon Technologies AG | Metall-Isolator-Metall-Kondensator und Verfahren zu seiner Herstellung |
US6370012B1 (en) * | 2000-08-30 | 2002-04-09 | International Business Machines Corporation | Capacitor laminate for use in printed circuit board and as an interconnector |
JP2002134358A (ja) | 2000-10-23 | 2002-05-10 | Hitachi Ltd | 薄膜コンデンサ及びその製造方法 |
JP3711343B2 (ja) * | 2002-06-26 | 2005-11-02 | 株式会社トッパンNecサーキットソリューションズ | 印刷配線板及びその製造方法並びに半導体装置 |
US7102367B2 (en) | 2002-07-23 | 2006-09-05 | Fujitsu Limited | Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof |
KR100467834B1 (ko) * | 2002-12-23 | 2005-01-25 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
US7035113B2 (en) * | 2003-01-30 | 2006-04-25 | Endicott Interconnect Technologies, Inc. | Multi-chip electronic package having laminate carrier and method of making same |
JP4937495B2 (ja) * | 2003-12-25 | 2012-05-23 | 新光電気工業株式会社 | キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法 |
US7271083B2 (en) * | 2004-07-22 | 2007-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | One-transistor random access memory technology compatible with metal gate process |
CN101151729A (zh) | 2005-03-30 | 2008-03-26 | 富士通株式会社 | 半导体装置及其制造方法 |
KR100691437B1 (ko) | 2005-11-02 | 2007-03-09 | 삼성전기주식회사 | 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판 |
KR100673860B1 (ko) * | 2005-11-17 | 2007-01-25 | 삼성전기주식회사 | 임베디드 인쇄회로기판 제작방법 |
-
2008
- 2008-10-30 KR KR1020080107370A patent/KR101628355B1/ko active IP Right Grant
-
2009
- 2009-10-30 US US13/121,618 patent/US8665580B2/en active Active
- 2009-10-30 CN CN2009801409395A patent/CN102187414B/zh active Active
- 2009-10-30 WO PCT/KR2009/006341 patent/WO2010050773A2/ko active Application Filing
- 2009-10-30 JP JP2011532029A patent/JP5221767B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100721184B1 (ko) * | 2001-02-06 | 2007-05-23 | 주식회사 하이닉스반도체 | 반도체 커패시터의 제조방법 |
KR100413479B1 (ko) * | 2001-04-18 | 2003-12-31 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 형성 방법 |
KR20030054310A (ko) * | 2001-12-24 | 2003-07-02 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터의 제조 방법 |
KR100679827B1 (ko) * | 2004-12-22 | 2007-02-06 | 동부일렉트로닉스 주식회사 | 금속-절연체-금속 커패시터의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
US8665580B2 (en) | 2014-03-04 |
KR20100048277A (ko) | 2010-05-11 |
JP5221767B2 (ja) | 2013-06-26 |
KR101628355B1 (ko) | 2016-06-21 |
JP2012505556A (ja) | 2012-03-01 |
CN102187414B (zh) | 2013-11-13 |
CN102187414A (zh) | 2011-09-14 |
WO2010050773A2 (ko) | 2010-05-06 |
US20110194229A1 (en) | 2011-08-11 |
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