WO2010050773A3 - 임베디드 커패시터 및 그 제조방법 - Google Patents

임베디드 커패시터 및 그 제조방법 Download PDF

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Publication number
WO2010050773A3
WO2010050773A3 PCT/KR2009/006341 KR2009006341W WO2010050773A3 WO 2010050773 A3 WO2010050773 A3 WO 2010050773A3 KR 2009006341 W KR2009006341 W KR 2009006341W WO 2010050773 A3 WO2010050773 A3 WO 2010050773A3
Authority
WO
WIPO (PCT)
Prior art keywords
embedded capacitor
fabricating same
oxide film
metal oxide
electrode layer
Prior art date
Application number
PCT/KR2009/006341
Other languages
English (en)
French (fr)
Other versions
WO2010050773A2 (ko
Inventor
최재봉
남상혁
Original Assignee
엘지이노텍주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍주식회사 filed Critical 엘지이노텍주식회사
Priority to US13/121,618 priority Critical patent/US8665580B2/en
Priority to JP2011532029A priority patent/JP5221767B2/ja
Priority to CN2009801409395A priority patent/CN102187414B/zh
Publication of WO2010050773A2 publication Critical patent/WO2010050773A2/ko
Publication of WO2010050773A3 publication Critical patent/WO2010050773A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

실시예에 따른 커패시터는 금속 기판; 상기 금속 기판에 형성된 금속 산화막; 상기 금속 산화막의 제1 면에 형성된 제1 전극층; 및 상기 금속 산화막의 제2 면에 형성된 제2 전극층을 포함한다.
PCT/KR2009/006341 2008-10-30 2009-10-30 임베디드 커패시터 및 그 제조방법 WO2010050773A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/121,618 US8665580B2 (en) 2008-10-30 2009-10-30 Embedded capacitor and method of fabricating the same
JP2011532029A JP5221767B2 (ja) 2008-10-30 2009-10-30 内蔵キャパシタ及びその製造方法
CN2009801409395A CN102187414B (zh) 2008-10-30 2009-10-30 埋入式电容器及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0107370 2008-10-30
KR1020080107370A KR101628355B1 (ko) 2008-10-30 2008-10-30 임베디드 커패시터 및 그 제조방법

Publications (2)

Publication Number Publication Date
WO2010050773A2 WO2010050773A2 (ko) 2010-05-06
WO2010050773A3 true WO2010050773A3 (ko) 2010-08-05

Family

ID=42129484

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006341 WO2010050773A2 (ko) 2008-10-30 2009-10-30 임베디드 커패시터 및 그 제조방법

Country Status (5)

Country Link
US (1) US8665580B2 (ko)
JP (1) JP5221767B2 (ko)
KR (1) KR101628355B1 (ko)
CN (1) CN102187414B (ko)
WO (1) WO2010050773A2 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012181445A (ja) 2011-03-02 2012-09-20 Seiko Epson Corp 電気装置
CN103350543B (zh) * 2013-07-19 2016-01-20 广东生益科技股份有限公司 一种埋容材料、制备方法及其用途
CN103350542B (zh) * 2013-07-19 2016-01-20 广东生益科技股份有限公司 一种埋容材料、制备方法及其用途
KR102187695B1 (ko) * 2014-01-28 2020-12-07 엘지이노텍 주식회사 인쇄회로기판
KR102248388B1 (ko) * 2014-09-01 2021-05-07 (주)포인트엔지니어링 커패시터
US10798821B2 (en) 2016-04-02 2020-10-06 Intel Corporation Circuit board having a passive device inside a via

Citations (4)

* Cited by examiner, † Cited by third party
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KR20030054310A (ko) * 2001-12-24 2003-07-02 주식회사 하이닉스반도체 반도체 소자의 캐패시터의 제조 방법
KR100413479B1 (ko) * 2001-04-18 2003-12-31 주식회사 하이닉스반도체 반도체 소자의 커패시터 형성 방법
KR100679827B1 (ko) * 2004-12-22 2007-02-06 동부일렉트로닉스 주식회사 금속-절연체-금속 커패시터의 제조 방법
KR100721184B1 (ko) * 2001-02-06 2007-05-23 주식회사 하이닉스반도체 반도체 커패시터의 제조방법

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JPS55166916A (en) 1979-06-15 1980-12-26 Nippon Electric Co Method of manufacturing thin film condenser
US6461493B1 (en) * 1999-12-23 2002-10-08 International Business Machines Corporation Decoupling capacitor method and structure using metal based carrier
EP1132973A1 (de) 2000-03-06 2001-09-12 Infineon Technologies AG Metall-Isolator-Metall-Kondensator und Verfahren zu seiner Herstellung
US6370012B1 (en) * 2000-08-30 2002-04-09 International Business Machines Corporation Capacitor laminate for use in printed circuit board and as an interconnector
JP2002134358A (ja) 2000-10-23 2002-05-10 Hitachi Ltd 薄膜コンデンサ及びその製造方法
JP3711343B2 (ja) * 2002-06-26 2005-11-02 株式会社トッパンＮｅｃサーキットソリューションズ 印刷配線板及びその製造方法並びに半導体装置
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KR100467834B1 (ko) * 2002-12-23 2005-01-25 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
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JP4937495B2 (ja) * 2003-12-25 2012-05-23 新光電気工業株式会社 キャパシタ装置、電子部品実装構造及びキャパシタ装置の製造方法
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KR100691437B1 (ko) 2005-11-02 2007-03-09 삼성전기주식회사 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판
KR100673860B1 (ko) 2005-11-17 2007-01-25 삼성전기주식회사 임베디드 인쇄회로기판 제작방법

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Publication number Priority date Publication date Assignee Title
KR100721184B1 (ko) * 2001-02-06 2007-05-23 주식회사 하이닉스반도체 반도체 커패시터의 제조방법
KR100413479B1 (ko) * 2001-04-18 2003-12-31 주식회사 하이닉스반도체 반도체 소자의 커패시터 형성 방법
KR20030054310A (ko) * 2001-12-24 2003-07-02 주식회사 하이닉스반도체 반도체 소자의 캐패시터의 제조 방법
KR100679827B1 (ko) * 2004-12-22 2007-02-06 동부일렉트로닉스 주식회사 금속-절연체-금속 커패시터의 제조 방법

Also Published As

Publication number Publication date
KR20100048277A (ko) 2010-05-11
KR101628355B1 (ko) 2016-06-21
US8665580B2 (en) 2014-03-04
CN102187414A (zh) 2011-09-14
US20110194229A1 (en) 2011-08-11
JP2012505556A (ja) 2012-03-01
CN102187414B (zh) 2013-11-13
WO2010050773A2 (ko) 2010-05-06
JP5221767B2 (ja) 2013-06-26

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