WO2010050404A1 - Procédé de connexion de circuit imprimé souple (cis) d'un panneau de protection à fonction d'entrée tactile - Google Patents

Procédé de connexion de circuit imprimé souple (cis) d'un panneau de protection à fonction d'entrée tactile Download PDF

Info

Publication number
WO2010050404A1
WO2010050404A1 PCT/JP2009/068225 JP2009068225W WO2010050404A1 WO 2010050404 A1 WO2010050404 A1 WO 2010050404A1 JP 2009068225 W JP2009068225 W JP 2009068225W WO 2010050404 A1 WO2010050404 A1 WO 2010050404A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc
conductive adhesive
circuit
panel
touch input
Prior art date
Application number
PCT/JP2009/068225
Other languages
English (en)
Japanese (ja)
Inventor
一登 中村
孝夫 橋本
和宏 西川
Original Assignee
日本写真印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本写真印刷株式会社 filed Critical 日本写真印刷株式会社
Publication of WO2010050404A1 publication Critical patent/WO2010050404A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Definitions

  • the present invention is used for applications such as PDAs, portable terminals such as handy terminals, OA devices such as copiers and facsimiles, smartphones, mobile phones, portable game devices, electronic dictionaries, car navigation systems, small PCs, various home appliances, etc.
  • the present invention relates to an FPC (Flexible-Printed-Circuit) connection method of a protection panel with a touch input function that is cost-effective and has a high degree of freedom in component mounting and material selection.
  • FPC Flexible-Printed-Circuit
  • casings in electronic devices are configured by combining a front casing and a rear casing made of synthetic resin.
  • a protective panel is fixed to the surface of the front casing by fusion or the like in order to protect the liquid crystal display window.
  • a colorless and transparent resin panel has been used as the protective panel.
  • decoration such as bordering has been given by printing.
  • a protection panel 1 with a touch input function includes a lower electrode having a lower transparent electrode 5 and lower circuits 7a and 7b provided around the lower transparent electrode 5 on the upper surface of a non-flexible protection panel body.
  • An upper transparent electrode 4 provided at a position facing the lower transparent electrode 5 on the lower surface of the panel 3 and a flexible transparent insulating film, and upper circuits 6a to 6d, 7c provided around the upper transparent electrode 4 , 7d, and a transparent window 18 formed by concealing the lower circuits 7a, 7b and the upper circuits 6a-6d, 7c, 7d with a pattern 17 on a flexible transparent insulating film.
  • a decorative sheet 2b having a decorative layer.
  • ITO indium oxide / tin
  • the upper electrode sheet 2a is formed with strip-shaped bus bars 6a and 6b using a silver paste connected to the transparent electrode 4, and the lower electrode panel 3 has a transparent electrode in a direction perpendicular to the bus bars 6a and 6b.
  • Band-shaped bus bars 7a and 7b using a silver paste connected to 5 are formed.
  • Each of the bus bars 6a, 6b, 7a, 7b has a circuit extending to the connecting portion 8 provided at the edge of the upper electrode sheet 2a, and is integrated into one place.
  • the decorative sheet 2b is bonded to the entire front surface of the upper electrode sheet 2a (hereinafter, a laminated film of the upper electrode sheet 2a and the decorative sheet 2b is referred to as a movable sheet 2), and the decorative sheet 2b is applied with a finger or a pen.
  • the movable sheet 2 is integrally bent and downwards.
  • the transparent electrodes 4 and 5 formed on the inner surfaces of the upper electrode sheet 2a and the lower electrode panel 3 come into contact with each other. The input position is detected.
  • the lower electrode panel 3 is penetrated corresponding to the electrode ends 6 c, 7 c, 6 d, and 7 d in the connection portion 8. Holes 9a to 9d are formed in parallel to the Z direction. Then, four metal pins 11 to 14 are erected on the connection side end portion 10a of the FPC 10 corresponding to the through holes 9a to 9d, and the metal pins 11 to 14 are interposed via a conductive adhesive (not shown). The electrode ends 6c, 7c, 6d and 7d are electrically connected.
  • a manufacturing method from the back surface of the lower electrode panel 3 is disclosed in Patent Document 2.
  • a metal pin fixing hole 10e is formed in a film base 10f and a circuit 10c as a conductive portion at a connection side end 10a of the FPC 10, and the metal pin fixing hole 10e is formed in the metal pin fixing hole 10e.
  • metal pins 11 to 14 having a pin shaft portion and a head portion having a diameter larger than the outer diameter of the pin shaft portion are inserted to cover the head portions of the metal pins 11 to 14.
  • the coverlay film 10b is stuck on the circuit 10c and the film substrate 10f (see FIG. 10).
  • the FPC with pins has a problem that it is difficult to mount components such as BtoB (Board-to-Board) connectors and IC chips. That is, when printing a solder paste for mounting a component on the circuit of the FPC, the metal pin is erected at the connection side end of the FPC, which is an obstacle to printing. For example, a screen plate or a squeegee of a screen printing apparatus hits the metal pin during printing.
  • BtoB Board-to-Board
  • the great advantage of the FPC with a pin is that an ultrasonic insert method with high FPC connection strength to the lower electrode panel can be used (the ultrasonic insert method applies ultrasonic vibration and pressure).
  • the ultrasonic insert method applies ultrasonic vibration and pressure.
  • the ultrasonic insert method can be applied only to a part of the material of the protective panel body conventionally used for the lower electrode panel of the protective panel with a touch input function.
  • the ultrasonic insert method cannot be applied to a thin protective panel that cannot secure a thickness for fixing the pin shaft stably.
  • the present invention provides an FPC connection method for a protection panel with a touch input function that is low in cost and has a high degree of freedom in component mounting and material selection in consideration of the above-described problems of the prior art.
  • an upper electrode sheet having an upper transparent electrode and an upper circuit is disposed opposite to a lower electrode panel having a lower transparent electrode and a lower circuit, and the transparent window is formed in a state of concealing the lower circuit and the upper circuit.
  • a through hole for electrically connecting the lower circuit, the upper circuit, and the FPC is formed in the lower electrode panel, A hole for filling is formed through the film base at the connection side end of the FPC and the circuit formed on one side thereof,
  • An insulating adhesive layer is provided at the connection side end of the FPC, Positioning the FPC and the lower electrode panel so that the through hole and the filling hole communicate with each other; Adhering the FPC to the lower surface of the lower electrode panel via the insulating adhesive layer, Injecting a conductive adhesive into a cavity that includes the through hole and extends from the filling hole to the through hole, The gist
  • the lower electrode panel has a lower transparent electrode on the upper surface of the protective panel body and a lower circuit provided around the lower transparent electrode
  • the electrode sheet has, on the lower surface of a flexible transparent insulating film, an upper transparent electrode provided at a position facing the lower transparent electrode and an upper circuit provided around the upper transparent electrode
  • the gist of the decorative sheet is that a decorative layer is formed on at least one surface of a flexible transparent insulating film and is bonded to the upper surface of the upper electrode sheet.
  • the said conductive adhesive when the said conductive adhesive is what disperse
  • the conductive adhesive when the conductive adhesive is obtained by dispersing a conductive filler in a moisture curable resin paste, the conductive adhesive is cured by absorbing moisture through the filling hole. Can be made.
  • the said conductive adhesive when the said conductive adhesive is what disperse
  • an electronic component can be mounted on the FPC, for example, a COF (Chip-on-Film).
  • the protective panel body can be composed of a glass plate.
  • the cavity facing the filling hole is formed by a connection side end of the FPC, a lower surface of the lower electrode panel, and a through hole provided in the lower electrode panel.
  • the FPC for connection is provided with a circuit on one side of the film base material, and a filling hole penetrating both the film base material and the circuit at the connection side end. Because it is not pinned, it has the following effects. That is, since high-cost metal pin processing is not performed, the touch window can be connected at low cost, and there are no standing pins that obstruct the printing of solder paste, so that components such as BtoB connectors and IC chips are mounted. In addition, since it is not fixed by pin insertion, it is possible to construct a touch window that uses a glass support plate as a lower electrode panel to which the ultrasonic insert method cannot be applied, and is provided on the pin and the glass support plate. It is also possible to eliminate cracks in the glass support plate that occur when the position accuracy of the holes is low.
  • an insulating adhesive layer is provided at the connection side end of the FPC leaving the periphery of the filling hole, and the FPC is adhered to the lower surface of the lower electrode panel by the insulating adhesive layer.
  • FIG. 5 is an exploded perspective view showing a basic configuration excluding the FPC 10 of the protection panel 1 with a touch input function.
  • a protection panel 1 with a touch input function includes a lower electrode having a lower transparent electrode 5 and lower circuits 7a and 7b provided around the lower transparent electrode 5 on the upper surface of a non-flexible protection panel body.
  • An upper transparent electrode 4 provided at a position facing the lower transparent electrode 5 on the lower surface of the panel 3 and a flexible transparent insulating film, and upper circuits 6a to 6d, 7c provided around the upper transparent electrode 4 , 7d, and a transparent window 18 formed by concealing the lower circuits 7a, 7b and the upper circuits 6a-6d, 7c, 7d with a pattern 17 on a flexible transparent insulating film.
  • the decorative sheet 2b having a decorative layer is provided.
  • Examples of the material of the inflexible protective panel body of the lower electrode panel 3 include glass plates, engineering plastics such as polycarbonate, polyamide, and polyether ketone, acrylic, polyethylene terephthalate, and polybutylene terephthalate.
  • a plastic plate or the like of a system can be used.
  • engineering plastics such as polycarbonate, polyamide, or polyetherketone, acrylic, polyethylene terephthalate, or polybutylene terephthalate are pasted on the surface of these plates where the lower transparent electrode is to be formed.
  • the lower electrode panel 3 may be used.
  • Examples of the material of the flexible transparent insulating film of the upper electrode sheet 2a include engineering plastics such as polycarbonate, polyamide, or polyether ketone, acrylic, polyethylene terephthalate, or polybutylene. A terephthalate film or the like can be used.
  • the upper electrode sheet 2a and the lower electrode panel 3 are arranged to face each other so as to form a gap between the transparent electrodes 4 and 5, and are bonded to each other at the peripheral edge.
  • the transparent electrodes 4 and 5 are mainly composed of metal oxide films such as tin oxide, indium oxide, antimony oxide, zinc oxide, cadmium oxide, or indium tin oxide (ITO), or these metal oxides.
  • a composite film or a metal film such as gold, silver, copper, tin, nickel, aluminum, or palladium is formed in a rectangular shape by a vacuum evaporation method, sputtering, ion plating, or CVD method.
  • the upper electrode sheet 2a is a strip-shaped bus bar 6a, 6b using a conductive paste such as a metal such as gold, silver, copper, or nickel, or carbon connected to the upper transparent electrode 4 as an upper circuit.
  • a conductive paste such as a metal such as gold, silver, copper, or nickel, or carbon connected to the upper transparent electrode 4 as an upper circuit.
  • the lower electrode panel 3 is formed with strip-like bus bars 7a, 7b orthogonal to the bus bars 6a, 6b as the lower transparent electrode 5 and the lower circuit.
  • the strip-shaped bus bars 6a, 6b, 7a, and 7b can be formed by a printing method such as screen printing, offset printing, gravure printing, or flexographic printing, a photoresist method, or a brush coating method.
  • each bus bar 6a, 6b, 7a, 7b has a circuit extended to the connection part 8 provided in the edge part of the upper electrode sheet 2a, and is put together in one place.
  • the bus bars 6a and 6b of the upper electrode sheet 2a are extended to the electrode ends 6d and 6c of the connecting portion 8, and the lower circuit is extended from the bus bars 7a and 7b of the lower electrode panel 3 by the portion 7e.
  • 7f are connected to the electrode ends 7c, 7d formed on the connecting portion 8 of the upper electrode sheet 2a along with the electrode ends 6d, 6c by a conductive adhesive (not shown).
  • Through holes 9a to 9d are formed in the lower electrode panel 3 so as to correspond to the electrode ends 6c, 7c, 6d, and 7d in the connecting portion 8.
  • a decorative sheet 2b having a transparent window 18 is bonded to the surface of the upper electrode sheet 2a.
  • the decorative sheet 2b is a flexible transparent insulating film such as polycarbonate, polyamide or polyether ketone engineering plastic, acrylic, polyethylene terephthal or polybutylene terephthal.
  • a decorative layer is formed with a pattern 17 so as to conceal the periphery of the transparent window 18, that is, the upper circuit, the lower circuit, and the like on one side.
  • the decorative layer is made of a resin such as polyvinyl resin, polyamide resin, polyester resin, polyacrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, or alkyd resin, and is used as a binder. Colored inks containing color pigments or dyes as colorants may be used.
  • a normal printing method such as screen printing, offset printing, gravure printing, or flexographic printing may be used.
  • the offset printing method and the gravure printing method are suitable for performing multicolor printing and gradation expression.
  • the decorative layer may be composed of a metal thin film layer or a combination of a pattern printing layer and a metal thin film layer.
  • the metal thin film layer expresses metallic luster as the decorative layer, and is formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method, or the like.
  • a metal such as aluminum, nickel, gold, platinum, chromium iron, copper, tin, indium, silver, titanium, lead, or zinc, or an alloy or compound thereof is used depending on the metallic luster color to be expressed. use.
  • the film thickness of the metal thin film layer is generally about 0.05 ⁇ m.
  • the decorative sheet 2b is bonded to the entire front surface of the upper electrode sheet 2a to constitute the movable sheet 2.
  • the movable sheet 2 is integrally bent downward, and as a result, each transparent electrode 4 formed on the inner surface of the lower electrode panel 3 extending over the upper electrode sheet 2a. , 5 are contacted to detect the input position.
  • the adhesive layer used for bonding for example, a polyacrylic resin, a polystyrene resin, a polyamide resin, vinyl chloride, vinyl acetate, or an acrylic copolymer may be used.
  • a normal printing method such as screen printing, offset printing, gravure printing, or flexographic printing may be used.
  • the basic configuration of the protection panel 1 with a touch input function of the electronic device display window has been described above.
  • the feature of the present invention is that the through-hole provided in the lower electrode panel 3 with respect to the protection panel 1 with a touch input function. This is a method for electrically connecting the FPC 10 to the lower circuit and the upper circuit through 9a to 9d, and the following steps (FIGS. 1 to 4) are performed.
  • a circuit 10c is provided on one surface of a film substrate 10f, and a filling hole 10d penetrating both the film substrate 10f and the circuit 10c is formed in a connection side end 10a. Is prepared (see FIG. 6).
  • the FPC has a film base 10f having a circuit 10c covered with a coverlay film 10b for protecting and insulating the conductor circuit 10c. Is not covered because it needs to be connected to the electrode end, exposing the circuit 10c.
  • a flexible insulating film such as polyimide cage (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) can be used.
  • the circuit 10c is formed using a metal such as gold, silver, copper, or nickel, or a conductive paste such as carbon.
  • a printing method such as screen printing, offset printing, gravure printing, or flexographic printing, a photoresist method, or the like can be used.
  • a drill method or the like can be used as a means for forming the filling hole 10d.
  • An insulating adhesive layer 23 is provided on the connection side end 10a of the FPC 10 so as to leave the periphery of the filling hole 10d, and is adhered to the lower surface of the lower electrode panel 3 by the insulating adhesive layer 23 (see FIG. 1).
  • connection side end 10a of the bonded FPC 10 and the lower surface of the lower electrode panel 3, and the through holes 9a to 9d provided in the lower electrode panel 3, the filling hole 10d.
  • a cavity 22 is formed facing the surface.
  • Each region surrounded by the insulating adhesive layer 23 is formed to be slightly larger than each of the through holes 9a to 9d provided in the lower electrode panel 3, so that the bonding position of the FPC 10 is shifted. That is, even when the bonding positions of the regions surrounded by the insulating adhesive layer 23 and the through holes 9a to 9d are deviated, the reliability of electrical connectivity can be obtained.
  • the insulating adhesive layer 23 a frame-shaped double-sided tape in which the filling hole 10d is punched can be used. In place of the double-sided tape, an insulating adhesive such as water-based or acrylic printing paste may be used.
  • 16 in FIG. 1 is an adhesive layer for bonding the upper electrode sheet 2a of the movable sheet 2 and the lower electrode panel 3 around.
  • the adhesive layer 16 it is necessary to form connection holes for injecting the conductive adhesive 15 corresponding to the electrode ends 6 c, 7 c, 6 d, 7 d in the connection part 8.
  • a frame-like double-sided tape in which at least the connection holes (the transparent window 18 in FIG. 5) and the connection holes are punched out can be used.
  • an insulating adhesive for example, an aqueous, acrylic or hot-melt printing paste may be used.
  • a conductive adhesive 15 is filled in the cavity 22 facing the filling hole 10d to electrically connect the FPC 10 to the lower circuit and the upper circuit (see FIG. 2).
  • thermosetting conductive adhesive As the conductive adhesive 15 filled in the cavity 22, a thermosetting conductive adhesive can be used.
  • the thermosetting conductive adhesive is obtained by dispersing a conductive filler in a thermosetting resin paste. When heated, the curing progresses, and the cured molecules generally form a three-dimensional network.
  • thermosetting resin examples include those made of thermosetting resin components such as (meth) acrylic compounds, acrylic resins, urethane compounds, urethane resins, unsaturated polyester resins, epoxy compounds, epoxy resins, and phenol resins. can do.
  • the form of the curing reaction of the thermosetting resin may be any polymerization form such as radical polymerization of double bonds, ionic polymerization of epoxy resin, or polyaddition.
  • the conductive filler includes inorganic insulators such as alumina and glass as core materials, and organic materials such as polyethylene, polystyrene, and divinylbenzene. Examples thereof include a polymer, etc., the core material surface of which is coated with a conductive layer such as gold and nickel, carbon, graphite and the like.
  • the conductive filler may have a flake shape, a spherical shape, a short fiber shape, or the like. Examples of the method for filling the conductive adhesive 15 include a dispenser method.
  • the conductive adhesive 15 is cured while being exposed to the filling hole 10d (see FIG. 3).
  • 24 is a conductive adhesive after curing.
  • the FPC is electrically connected in the usual manner using the thermosetting conductive adhesive, that is, the filling hole 10d is commercially available after the thermosetting conductive adhesive is applied as shown in FIG.
  • the curing basically depends on heat conduction, the FPC becomes an obstacle, the curing rate is slow and the production rate cannot be increased, and further the adhesive strength of the conductive part is not cured to the inside.
  • the electrical reliability cannot be obtained inside without improving. Further, deformation and deterioration due to heat of the FPC are inevitable.
  • the FPC may be cured before being fixed, and the FPC may not be conductively bonded.
  • thermosetting conductive adhesive since the thermosetting conductive adhesive is exposed in the filling hole 10d, the adhesive can be directly heated through the filling hole 10d, and curing is promoted. Cures quickly to the inside. Therefore, compared with the structure of the preceding paragraph, there exists an advantage that the adhesive strength of an electroconductive part improves and electrical reliability is acquired also inside. In addition, since the adhesive can be directly heated, the influence of heat on the FPC is small, and deformation and deterioration of the FPC can be prevented. In addition, since the FPC having the filling hole 10d is fixed to the lower surface of the lower electrode panel, the thermosetting conductive adhesive is filled and cured in the cavity 22 facing the filling hole 10d. The conductive adhesion with the FPC is sufficient.
  • the filling hole 10d is sealed with a sealing material 21 (see FIG. 4).
  • the sealing material 21 is made of a thermosetting resin component such as a (meth) acrylic compound, an acrylic resin, a urethane compound, a urethane resin, an unsaturated polyester resin, an epoxy compound, an epoxy resin, or a phenol resin. Can do. Sealing after curing of the conductive adhesive 15 has the purpose of ensuring insulation and preventing deterioration. As a means for sealing the filling hole 10d using these sealing materials 21, there is a dispenser method or the like.
  • Example 1 An ITO film having a thickness of 20 nm was formed on one surface of a PET film having a thickness of 0.1 mm by sputtering, and the peripheral portion of the ITO film was removed to obtain a transparent electrode having a wide rectangular shape. Also, bus bars arranged on two sides facing the transparent electrode in the lateral direction and lead lines for outputting to the outside from the bus bars were formed by screen printing of silver paste.
  • an ITO film with a thickness of 20 nm is formed on the entire surface by sputtering, and the peripheral portion of the ITO film is removed to form a wide rectangular shape.
  • a transparent electrode was obtained.
  • a bus bar arranged on two sides facing the vertical direction of the transparent electrode and a lead-out line (thickness 35 ⁇ m) to be output from the bus bar to the outside are finely flaky silver powder (diameter in a binder made of polyester resin.
  • a silver paste containing a large number of conductive fillers of 10 ⁇ m) was formed by screen printing to obtain an upper electrode sheet.
  • a decorative layer having a transparent window on the opposite side of the hard coat surface is formed by gravure printing.
  • a decorative sheet was obtained.
  • the surface of the decorative sheet on the side of the decorative layer was bonded to the surface opposite to the transparent electrode side of the upper electrode sheet with a baseless transparent adhesive having a thickness of 0.025 mm to obtain a movable sheet.
  • the lower electrode panel and the movable sheet are arranged to face each other so as to separate the electrodes formed on each other, and a frame-shaped double-sided adhesive tape (thickness 50 ⁇ m) in which a transparent window portion and front connection holes are punched out And cut along the inner periphery of the decorative layer.
  • an insulating adhesive layer made of a polyester resin was provided by a screen printing method while leaving the periphery of the filling hole (diameter 1.6 mm) at the connection side end of the FPC. This was overlaid on the lower surface of the lower electrode panel so that the filling hole corresponded to the through hole, and was bonded and fixed by the insulating adhesive layer.
  • thermosetting conductive adhesive ink obtained by mixing flaky silver powder having a particle size of 10 ⁇ m in a binder made of an acrylic resin.
  • thermosetting conductive adhesive was cured by direct heating in a state where the thermosetting conductive adhesive was exposed in the filling hole.
  • a sealing material made of acrylic resin was applied to the filling hole with a dispenser, and the filling hole was sealed to complete the FPC connection to the protection panel with a touch input function.
  • a moisture curable conductive adhesive can be used instead of the thermosetting conductive adhesive of the first embodiment.
  • the moisture curable conductive adhesive is obtained by dispersing a conductive filler in a moisture curable resin paste, the curing reaction is accelerated in the presence of moisture, and the adherend is bonded and fixed. Unlike the first embodiment, heating is not necessary.
  • the moisture curable resin includes a silicone adhesive, a modified silicone adhesive, a urethane adhesive, and the like.
  • the material of the conductive filler and the filling method of the conductive adhesive 15 are the same as in the first embodiment.
  • the FPC is electrically connected in the usual manner using the moisture curable conductive adhesive, that is, the commercially available filling hole 10d is provided after the moisture curable conductive adhesive is applied as shown in FIG.
  • the moisture curable conductive adhesive When an FPC that is not bonded is bonded and fixed, it takes time for moisture to penetrate into the moisture curable conductive adhesive due to the FPC becoming an obstacle, or the vicinity of the FPC side of the moisture curable conductive adhesive is It hardens quickly due to moisture, and afterwards it becomes difficult for moisture to penetrate inside, so the inside remains uncured for a long time, and the adhesive strength of the conductive part does not improve, and electrical reliability is obtained inside The problem arises.
  • it takes time for moisture absorption after application of the moisture-curable conductive adhesive to cure the inside it may be cured before fixing the FPC, and conductive adhesion with the FPC may not be possible.
  • the moisture-curing conductive adhesive is exposed in the filling hole 10d, moisture existing in the air can reach the adhesive through the filling hole 10d and is cured. Is accelerated and hardens quickly to the inside. Therefore, compared with the structure of the preceding paragraph, there exists an advantage that the adhesive strength of an electroconductive part improves and electrical reliability is acquired also inside.
  • the moisture curable conductive adhesive is filled and cured in the cavity 22 facing the filling hole 10d. The conductive adhesion with the FPC is sufficient.
  • Example 2 In place of the thermosetting conductive adhesive described in Example 1, a moisture curable conductive adhesive is filled, and the moisture curable conductive adhesive is exposed to the filling hole by moisture absorption. The procedure was the same as Example 1 except that it was cured. This moisture curable conductive adhesive is obtained by mixing a flaky silver powder having a particle size of 10 ⁇ m in a binder made of a silicone resin.
  • a solvent volatile conductive adhesive can be used instead of the thermosetting conductive adhesive of the first embodiment.
  • the solvent volatile conductive adhesive is obtained by dispersing a conductive filler in a solvent volatile resin paste, and by volatilizing the solvent, the curing reaction is promoted to adhere and fix the adherend.
  • the solvent volatile resin include polyether polyol / polyisocyanate adhesive and polyester polyol / polyisocyanate adhesive.
  • the material of the conductive filler and the filling method of the conductive adhesive 15 are the same as in the first embodiment.
  • the FPC is electrically connected in the usual manner using the solvent volatile conductive adhesive, that is, as shown in FIG. 7, the commercially available filling hole 10d is provided after the solvent volatile conductive adhesive is applied. If an unfixed FPC is bonded and fixed, the FPC becomes an obstacle and it takes time for the solvent to evaporate, or the solvent remains and remains uncured for a long period of time. A problem arises in that it is not possible to obtain reliable reliability. Furthermore, since the solvent volatile conductive adhesive has a volume shrinkage during curing, or due to outgassing, avoid deformation and deterioration of the FPC in contact with the solvent volatile conductive adhesive. I can't. Further, if it takes time for moisture absorption after the application of the solvent volatile conductive adhesive to cure, it may be cured before bonding the FPC, and the FPC may not be conductively bonded.
  • the solvent volatile conductive adhesive since the solvent volatile conductive adhesive is exposed in the filling hole 10d, the solvent can be volatilized through the filling hole 10d, and the curing is promoted to the inside. Cures quickly. Therefore, compared with the structure of the preceding paragraph, there exists an advantage that the adhesive strength of an electroconductive part improves and electrical reliability is acquired also inside. Moreover, even if the volume shrinks during the curing, the FPC filling hole 10d is not in contact with the solvent volatile conductive adhesive, so the influence of the shrinkage on the FPC is small, and the outgas is also the above-mentioned Since it comes out of the filling hole 10d, deformation and deterioration of the FPC can be prevented. Since the FPC having the filling hole 10d formed therein is fixed to the lower surface of the lower electrode panel, the solvent volatile conductive adhesive is filled and cured in the cavity 22 facing the filling hole 10d. The conductive adhesion with the FPC is sufficient.
  • the FPC connection method of the present invention does not perform high-cost metal pin processing. FPC can be connected at low cost. Further, since there are no standing pins that obstruct the printing of the solder paste, it is easy to mount components such as a BtoB connector and an IC chip. Furthermore, since the FPC connection method of the present invention is not fixed by inserting pins, the FPC can be connected to a protection panel with a touch input function using a glass support plate for the lower electrode panel.
  • Example 3 In place of the thermosetting conductive adhesive described in Example 1, a solvent volatile conductive adhesive is filled, and the solvent volatile conductive adhesive is exposed in the filling hole and dried ( Example 1 except that it was cured by solvent volatilization.
  • This solvent volatile conductive adhesive is obtained by mixing flaky silver powder having a particle size of 10 ⁇ m in a binder made of polyester polyol resin.
  • the present invention is used for display units of PDAs, handy terminals and other portable information terminals, copiers, OA devices such as facsimiles, smartphones, mobile phones, portable game devices, electronic dictionaries, car navigation systems, small PCs, and various household appliances Can do.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Position Input By Displaying (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacture Of Switches (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Push-Button Switches (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Le procédé de connexion de circuit imprimé souple (CIS) d'un panneau de protection à fonction d'entrée tactile, à bas coût et offrant une grande liberté de choix des composants pour montage et des matériaux, est tel qu'il connecte électriquement un CIS (10) avec un circuit inférieur d'un panneau d'électrode inférieur et un circuit supérieur d'une feuille d'électrode supérieure, par l'intermédiaire de trous traversants (9a à 9d) disposés dans le panneau d'électrode inférieur (3) susmentionné. Sur l'une des surfaces d'un matériau de base sous forme de film, le CIS susmentionné est pourvu d'un circuit. Sur la pièce d'extrémité latérale du côté de la connexion, est alésé un trou de remplissage (10d) traversant le matériau de base sous forme de film susmentionné et le circuit susmentionné. L'invention se caractérise par le fait qu'une couche isolante adhésive (23), adhérant à la surface inférieure du panneau d'électrode inférieur susmentionné, est disposée sur la pièce d'extrémité latérale du côté de la connexion susmentionnée dudit CIS; dans la cavité (22) faisant face au trou de remplissage susmentionné, est versé un adhésif conducteur (15) qui connecte électriquement le CIS susmentionné au circuit inférieur et au circuit supérieur susmentionnés; enfin, après durcissement de l'adhésif conducteur susmentionné, tel qu'il est exposé, dans le trou de remplissage susmentionné, le trou de remplissage est étanchéifié à l'aide d'un matériau d'étanchéité.
PCT/JP2009/068225 2008-10-31 2009-10-23 Procédé de connexion de circuit imprimé souple (cis) d'un panneau de protection à fonction d'entrée tactile WO2010050404A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-281841 2008-10-31
JP2008281841A JP2012014206A (ja) 2008-10-31 2008-10-31 タッチ入力機能付き保護パネルのｆｐｃ接続方法

Publications (1)

Publication Number Publication Date
WO2010050404A1 true WO2010050404A1 (fr) 2010-05-06

Family

ID=42128767

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/068225 WO2010050404A1 (fr) 2008-10-31 2009-10-23 Procédé de connexion de circuit imprimé souple (cis) d'un panneau de protection à fonction d'entrée tactile

Country Status (3)

Country Link
JP (1) JP2012014206A (fr)
TW (1) TW201031295A (fr)
WO (1) WO2010050404A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102967956A (zh) * 2011-08-31 2013-03-13 瀚宇彩晶股份有限公司 触控显示设备、触控模块以及显示模块
JP2013530468A (ja) * 2010-06-16 2013-07-25 サムウォン エスティー タッチパネルセンサー
JP2014089797A (ja) * 2010-07-15 2014-05-15 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの製造方法
US9204528B2 (en) 2011-04-28 2015-12-01 Kaneka Corporation Flexible printed circuit integrated with stiffener
CN105845708A (zh) * 2016-04-20 2016-08-10 上海天马微电子有限公司 柔性集成触控显示面板及其制作方法
CN107664858A (zh) * 2016-07-29 2018-02-06 株式会社日本显示器 显示装置
JP2019060946A (ja) * 2017-09-25 2019-04-18 大日本印刷株式会社 電子ペーパー
US10503041B2 (en) 2016-11-30 2019-12-10 E Ink Corporation Laminated electro-optic displays and methods of making same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101682569B1 (ko) * 2014-08-12 2016-12-07 희성전자 주식회사 정전용량 방식 터치스크린 패널 제조방법
JP6317226B2 (ja) * 2014-10-08 2018-04-25 日本電信電話株式会社 フレキシブルプリント基板搭載パッケージおよびその製造方法
CN105786230B (zh) * 2014-12-23 2019-08-13 宸鸿科技(厦门)有限公司 触控面板及其制造方法
JP6727827B2 (ja) * 2016-02-05 2020-07-22 富士通コンポーネント株式会社 タッチパネル及びタッチパネルの製造方法
JP6768394B2 (ja) 2016-07-29 2020-10-14 株式会社ジャパンディスプレイ 電子機器
KR101957156B1 (ko) * 2017-09-05 2019-03-14 (주)코텍 터치스크린 패널
CN108255338B (zh) * 2018-01-12 2021-02-02 京东方科技集团股份有限公司 柔性触摸屏、触摸面板、触摸基板及其制作方法
CN110636696B (zh) * 2019-08-23 2021-02-02 武汉华星光电半导体显示技术有限公司 覆晶薄膜及显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427728U (fr) * 1987-08-07 1989-02-17
JPH08332649A (ja) * 1995-06-07 1996-12-17 Gunze Ltd 透明タッチパネル用基板の製造方法
JP2001215528A (ja) * 2000-02-03 2001-08-10 Matsushita Electric Ind Co Ltd 周辺駆動回路内蔵型液晶表示パネル
JP2007018020A (ja) * 2003-07-22 2007-01-25 Gunze Ltd 透明タッチパネル及び電子機器
WO2008117770A1 (fr) * 2007-03-26 2008-10-02 Nissha Printing Co., Ltd. Panneau de protection avec fonction d'entrée tactile d'une fenêtre d'affichage d'instrument électronique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427728U (fr) * 1987-08-07 1989-02-17
JPH08332649A (ja) * 1995-06-07 1996-12-17 Gunze Ltd 透明タッチパネル用基板の製造方法
JP2001215528A (ja) * 2000-02-03 2001-08-10 Matsushita Electric Ind Co Ltd 周辺駆動回路内蔵型液晶表示パネル
JP2007018020A (ja) * 2003-07-22 2007-01-25 Gunze Ltd 透明タッチパネル及び電子機器
WO2008117770A1 (fr) * 2007-03-26 2008-10-02 Nissha Printing Co., Ltd. Panneau de protection avec fonction d'entrée tactile d'une fenêtre d'affichage d'instrument électronique

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013530468A (ja) * 2010-06-16 2013-07-25 サムウォン エスティー タッチパネルセンサー
JP2014089797A (ja) * 2010-07-15 2014-05-15 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの製造方法
US9204528B2 (en) 2011-04-28 2015-12-01 Kaneka Corporation Flexible printed circuit integrated with stiffener
CN102967956A (zh) * 2011-08-31 2013-03-13 瀚宇彩晶股份有限公司 触控显示设备、触控模块以及显示模块
CN105845708A (zh) * 2016-04-20 2016-08-10 上海天马微电子有限公司 柔性集成触控显示面板及其制作方法
CN107664858A (zh) * 2016-07-29 2018-02-06 株式会社日本显示器 显示装置
CN107664858B (zh) * 2016-07-29 2020-11-03 株式会社日本显示器 显示装置
US10503041B2 (en) 2016-11-30 2019-12-10 E Ink Corporation Laminated electro-optic displays and methods of making same
US11397362B2 (en) 2016-11-30 2022-07-26 E Ink Corporation Top plane connections for electro-optic devices including a through-hole in rear substrate
US11829047B2 (en) 2016-11-30 2023-11-28 E Ink Corporation Top plane connections for electro-optic devices including a through-hole in rear substrate
JP2019060946A (ja) * 2017-09-25 2019-04-18 大日本印刷株式会社 電子ペーパー

Also Published As

Publication number Publication date
TW201031295A (en) 2010-08-16
JP2012014206A (ja) 2012-01-19

Similar Documents

Publication Publication Date Title
WO2010050404A1 (fr) Procédé de connexion de circuit imprimé souple (cis) d'un panneau de protection à fonction d'entrée tactile
TWI398798B (zh) Electronic machine display window with touch input function of the protection panel
KR20100015836A (ko) 전자 기기 표시창의 터치 입력 기능을 구비한 보호 패널
WO2011010378A1 (fr) Panneau de protection pourvu d’une fonction d’entrée tactile pour une fenêtre d’affichage de dispositif électronique
WO2004061640A1 (fr) Ecran tactile a cadre etroit
CN102116987A (zh) 电子纸面板及其制造方法、电子纸显示设备
JP2019169745A (ja) 配線体アセンブリ、配線構造体、タッチセンサ、及び、配線体アッセンブリの製造方法
CN112822834A (zh) 一种电路板及电子设备
JP4543092B2 (ja) 電子機器表示窓のタッチ入力機能付き保護パネル
CN214851965U (zh) 一种电路板及电子设备
JP2008210199A (ja) タッチパネル及びその製造方法並びに電子機器
KR101272625B1 (ko) 터치 패널용 패드와 기판의 결합체
KR101069747B1 (ko) 터치 패널용 패드와 기판의 결합 방법 및 이에 의해 제조되는 결합체
WO2018135519A1 (fr) Corps de câblage et ensemble de corps de câblage
KR20150017591A (ko) Ito를 이용한 연성 회로 기판 및 그 제조 방법
KR101217733B1 (ko) 터치 패널용 패드와 기판의 결합 방법 및 이에 의해 제조되는 결합체
JP2018110153A (ja) 配線体アセンブリ、配線基板、及びタッチセンサ
JP2019020513A (ja) 電子ペーパー用背面電極基材およびそれを用いた電子ペーパー、ならびにそれらの製造方法
JP2000173351A (ja) 電極保護装置
CN115866882A (zh) 电路组件、电子装置及其制备方法
JP4437459B2 (ja) ヒートシールコネクタ及びその接続方法
JPWO2007108539A1 (ja) フレキシブル配線板及びヒートシールコネクタ
JP2018110152A (ja) 配線体アセンブリ、配線基板、及びタッチセンサ
JP2010113060A (ja) 液晶表示装置及びその製造方法
JP2006236944A (ja) ヒートシールコネクタ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09823515

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 09823515

Country of ref document: EP

Kind code of ref document: A1