WO2010035788A1 - Substrat permettant de monter un élément électroluminescent et procédé de production associé - Google Patents

Substrat permettant de monter un élément électroluminescent et procédé de production associé Download PDF

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Publication number
WO2010035788A1
WO2010035788A1 PCT/JP2009/066661 JP2009066661W WO2010035788A1 WO 2010035788 A1 WO2010035788 A1 WO 2010035788A1 JP 2009066661 W JP2009066661 W JP 2009066661W WO 2010035788 A1 WO2010035788 A1 WO 2010035788A1
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Prior art keywords
emitting element
light emitting
convex portion
metal
insulating layer
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PCT/JP2009/066661
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English (en)
Japanese (ja)
Inventor
博和 佐野
吉村　栄二
Original Assignee
デンカＡｇｓｐ株式会社
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Priority to JP2010530872A priority Critical patent/JPWO2010035788A1/ja
Publication of WO2010035788A1 publication Critical patent/WO2010035788A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the present invention relates to a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode chip, and a manufacturing method thereof.
  • This light emitting element mounting substrate is useful as a light emitting element mounting substrate such as a light emitting element panel or a light emitting element package of a lighting device.
  • ceramic substrates have been widely used as substrates for LED packages equipped with chip LEDs and the like.
  • Resin substrates for mounting LED packages and the like have also been developed, and several techniques for improving heat dissipation and heat transfer are known.
  • a metal protrusion is formed on the upper surface of a metal substrate by etching, an insulating resin layer having the same height as the metal protrusion is formed around the metal protrusion, and the metal protrusion is formed.
  • a light emitting element mounting substrate in which a heat radiation pattern is plated on the upper surface of the part and a power supply pattern is plated on the upper surface of the insulating resin layer so that the light emitting element can be mounted on the upper surface of the metal convex part via the heat radiation pattern .
  • Patent Document 1 uses etching when forming the metal protrusions on the upper surface of the metal substrate, the manufacturing process becomes complicated, and there is a problem that chemicals, secondary materials, and processing costs are considerable. there were. Further, since the metal having a thickness corresponding to the height of the metal protrusion is eroded and removed by etching, the metal is wasted, which is disadvantageous in terms of cost.
  • an object of the present invention is to provide a substrate for mounting a light emitting element and a method for manufacturing the same, which can cost-effectively manufacture a substrate having a convex portion for heat dissipation by a simple process.
  • the light-emitting element mounting substrate of the present invention includes a metal plate having a convex portion formed by pressing at least at a light-emitting element mounting position, an insulating layer formed at least in the vicinity of the convex portion, and the insulating layer. And a power supply pattern provided on the upper surface of the substrate.
  • the “pressing process” of the present invention includes a pressing process (roll forming process) performed between rolls having a groove having a shape corresponding to the convex part, in addition to the pressing process using the press surface.
  • the “metal plate” may partially have an opening, and includes, for example, a metal lead frame.
  • the convex portion of the metal plate is formed by pressing that is a dry process, the manufacturing process is simplified compared to the case of forming by etching or the like, Sub-materials and metals are not wasted, and the yield is improved by simplification of the process, so that a substrate having a convex portion for heat dissipation can be advantageously manufactured in a simple process.
  • each height can be easily changed between several convex parts, and also the convex part of the shape where the front-end
  • the convex portion having a sharp tip can have a structure in which resin or the like hardly remains on the upper surface of the convex portion when the insulating layer is formed.
  • a heat radiation pattern is formed in contact with the upper surface of the convex portion.
  • effective heat conduction in the surface direction and the thickness direction is enabled by the thicknesses of both the heat radiation pattern and the convex portion, so that heat radiation from the light emitting element becomes better.
  • heat dissipation can be further improved by using a high thermal conductive material for the insulating layer.
  • the heat radiation is further improved.
  • the heat radiation effect in the surface direction can be further enhanced.
  • the said convex part is formed in the continuous protruding item
  • the amount of heat radiated from the continuous ridges to the surface side is increased as compared with the convex portions formed in the form of dots, so that the heat radiation effect is further increased.
  • the light emitting elements are arranged in a line shape, the heat dissipation characteristics are uniform and good, and there is an effect of reducing luminance unevenness, color unevenness and the like, and further improving the LED light emission efficiency.
  • a heat pipe is provided on the back surface of the convex portion, and in particular, a heat pipe having a concave portion on the back surface of the convex portion and a part of which is inserted in the concave portion is provided. More preferred.
  • a heat pipe is provided on the back surface of the convex portion, the heat radiation effect of the heat pipe is very large, and thus heat radiation from the light emitting element becomes better.
  • the heat transfer effect to the heat pipe is further increased, and the heat radiation from the light emitting element is further improved.
  • a metal plate is pressed to form a convex portion at least at the light emitting element mounting position, and an insulating layer is formed at least in the vicinity of the convex portion. And a step of forming a power feeding pattern on an upper surface of the insulating layer.
  • the metal plate is pressed to form a convex part at least at the mounting position of the light emitting element. Therefore, the convex part can be formed by a dry process and formed by etching or the like. Compared to the case, the manufacturing process is simplified and the waste of metal is eliminated, so that a substrate having a convex portion for heat dissipation can be manufactured advantageously in a simple process.
  • a metal plate, an insulating layer forming material, and a laminate including the metal layer forming material are hot-pressed, and at least a light emitting element mounting position on the metal plate.
  • this method for manufacturing a light emitting element mounting substrate by performing hot pressing, it is possible to form the convex portion of the metal plate and simultaneously form the insulating layer and the metal layer on the surface. At this time, since the convex portion can be formed on the metal layer on the surface, the convex portion of the metal plate is exposed by removing the convex portion of the laminated body, or the thickness of the insulating layer on the upper surface of the convex portion is reduced. be able to. By mounting the light emitting element in that portion, heat radiation from the light emitting element to the metal plate through the convex portion of the metal plate becomes good.
  • the manufacturing process is simplified and the metal is not wasted compared to the case where the convex part of the metal plate is formed by etching or the like, so that the substrate having the convex part for heat dissipation can be reduced in a simple process. Can be advantageously produced.
  • substrate for light emitting element mounting of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention.
  • the figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention.
  • FIG. 1 is a diagram showing an example of a light-emitting element mounting substrate according to the present invention.
  • 2 to 4 are drawings showing an example of a manufacturing process flow of the light emitting element mounting substrate of the present invention.
  • the light emitting element mounting substrate of the present invention is formed at least in the vicinity of the convex portion 10 a and the metal plate 10 having the convex portion 10 a formed by pressing at the mounting position of the light emitting element 30. And an insulating layer 16 and a power feeding pattern 20 a provided on the upper surface of the insulating layer 16.
  • the substantially circular convex part 10a is formed in the metal plate 10, and the example which is formed in the state which the pattern 20b for thermal radiation contacted on the upper surface is shown. .
  • the light emitting element 30 is mounted on the light emitting element mounting substrate of the present invention.
  • the light emitting element 30 used include a light emitting diode chip (flip chip, bare chip) having electrodes on the bottom surface and / or the top surface, a packaged surface mount type light emitting diode (LED package, chip LED), and a semiconductor laser chip.
  • a light emitting diode chip having one electrode on the bottom surface there are two types of the bottom surface, a cathode type and an anode type, either of which can be used.
  • the light emitting element 30 when the light emitting element 30 is a packaged LED, it is preferable to provide a heat radiation pad 32 on the bottom surface, and the pad 32 is bonded to the upper surface of the convex portion 10a of the metal plate 10 or the heat radiation pattern 20b. It is preferable to do this. Moreover, when using a bare chip etc., it is preferable to die-bond this to the upper surface of the convex part 10a of the metal plate 10, or the upper surface of the pattern 20b for thermal radiation. Thereby, heat can be efficiently transferred from the pad 32 or the like to the convex portion 10a of the metal plate 10, and heat radiation from the LED can be performed satisfactorily. In the present embodiment, an example is shown in which a package LED having a heat radiation pad 32 on the bottom surface is used as the light emitting element 30 and bonding is performed on the upper surface of the heat radiation pattern 20b.
  • the electrode 31 of the light emitting element 30 is electrically connected to the power feeding pattern 20a.
  • the connection with the power supply pattern 20 reflow connection by solder or the like is possible in the case of a surface mount type package LED, but in the case of a bare chip or the like, wire bonding or the like is used.
  • the convex portion 10a may be formed in a continuous ridge, and the rear surface of the convex portion 10a has a concave portion.
  • the back surface of the continuous ridge has a groove portion 10b and a heat pipe 40 partially inserted into the groove portion 10b is provided, and a ridge 41 having a trapezoidal cross section is formed on the upper surface. Has been.
  • the convex part 10a of the metal plate 10 in a continuous protruding item
  • the virtual line in a figure has shown the mounting position of the light emitting element 30. FIG. Such ridges may be provided in a plurality of rows.
  • the heat pipe 40 has a structure in which a heat medium is sealed inside a pipe made of a heat transfer material such as metal, and a function of quickly transferring local heat to other parts by evaporation / condensation of the heat medium.
  • a heat transfer material such as metal
  • the ridges 41 of the heat pipe 40 can be provided by joining the ridges 41 made of metal by welding or the like, or by bonding with a heat conductive adhesive. It is also possible to make the heat pipe 40 with a metal having the ridges 41 in advance.
  • the protrusion 41 of the heat pipe 40 may have any cross-sectional shape such as a semicircular shape or a square shape, but a shape inscribed in the groove portion 10b of the metal plate 10 is preferable, and a shape in contact with almost the entire surface is more preferable.
  • a heat transfer material such as a thermal sheet.
  • a dam 201 having a reflector function may be formed around the mounting position of the light emitting element 30 as shown in FIG.
  • a bare chip as the light emitting element 30 is bonded to the upper surface of the heat radiation pattern 20b, and is further electrically connected to the power supply pattern 20a by wire bonding.
  • wire bonding a fine metal wire such as gold or a ribbon lead can be used, and the wire can be connected by a method using ultrasonic waves or heating together.
  • the upper surface of the convex portion 10a and the heat radiation pattern 20b may not be in contact with each other and the resin constituting the insulating layer 16 may be interposed.
  • the dam 201 is bonded to the upper surface of the power feeding pattern 20a with an adhesive 202.
  • the dam 201 can be formed, for example, by applying a dam-shaped hole to an Al plate having a predetermined thickness.
  • the reflective surface of the dam 202 can be further plated with Ni, Ag, Cu, or the like.
  • the inside of the dam 201 can be covered with a transparent resin, a fluorescent color resin, or the like.
  • a convex transparent resin lens can be provided above the surface. Since the transparent resin lens has a convex surface, light can be efficiently emitted upward from the substrate.
  • the transparent resin lens may be colored.
  • the transparent resin lens or the like can be directly formed on the substrate by a known method such as insert molding or potting without providing the dam 201.
  • the inside of the dam 201 can be covered (sealed) with a transparent resin, and a transparent resin lens can be provided to constitute a light emitting element package or a light emitting element panel.
  • the light emitting element package generally has a package configuration in which one light emitting element is mounted on a substrate on which a wiring pattern is formed.
  • the light emitting element package is mounted on a circuit board.
  • a light emitting element panel generally has a configuration in which a plurality of light emitting elements are mounted on a substrate on which a wiring pattern is formed.
  • an insulating resin dam can be formed by interposing an adhesive on the upper surface of the power supply pattern 20a, and that the reflecting surface is plated with, for example, Ni, Ag or the like to exhibit the reflector function.
  • the insulating resin dam can be formed by forming a dam-shaped hole in an insulating resin plate having a predetermined thickness.
  • a circuit board whose base is an insulating resin may be used as the insulating resin plate.
  • step S1 A step of pressing the metal plate 10 to form the convex portion 10a at least at the mounting position of the light emitting element 30 (step S1).
  • a metal plate 10 is prepared.
  • the metal plate 10 may be either a single layer or a laminate, and any metal may be used as a constituent metal.
  • any metal may be used as a constituent metal.
  • copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, and the like can be used.
  • copper, copper alloy, and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity.
  • the thickness of the metal plate 10 is preferably 70 to 3000 ⁇ m and more preferably 70 to 1000 ⁇ m from the viewpoint of further improving the heat dissipation.
  • the strength of the convex portion 10a of the metal plate 10 is high. In this case, the thickness of the metal plate 10 is 100 ⁇ 1000 ⁇ m is preferred.
  • the lower mold 42 and the upper mold 41 can be used as attachments if the convex portions 42a and the concave portions 41a can be positioned when the press device is operated, and are interposed in the press surface of the press device. May be used.
  • type 41 may be reversed up and down, and the convex-shaped convex part 10a is formed in the lower side in that case.
  • the shape, size, and the like of the convex portion 10a of the obtained metal plate 10 are determined by the shape and size of the concave portion 41a of the upper die 41 and the convex portion 42a of the lower die 42.
  • the height of the convex portion 10a (height from the upper surface of the metal plate 10) is preferably 60 to 150 ⁇ m, and preferably 60 to 100 ⁇ m, from the viewpoint of heat dissipation from the convex portion 10a, the thickness of the insulating layer, and thermal conductivity. More preferred.
  • the size of the upper surface of the convex portion 10a may be smaller or larger than the light emitting element 30 to be mounted.
  • the diameter of the upper surface is preferably 400 ⁇ m to 10 mm.
  • the shape of the upper surface of the convex portion 10a may be any of a square, a circle, an ellipse, etc., or may be formed in a continuous ridge.
  • the metal plate 10 is pressed to form the convex portion 10 a at least at the mounting position of the light emitting element 30.
  • the conditions such as the pressing pressure at that time are the same as in the case of normal metal processing.
  • demolding is performed.
  • the lower mold 42 having the convex portions 42a it is preferable to demold only the upper mold 41.
  • the metal plate 10 is removed from both the upper mold 41 and the lower mold 42.
  • step S2 A step of forming the insulating layer 16 at least in the vicinity of the convex portion 10a (step S2).
  • this process is performed by pressing a laminate including the metal plate 10, the insulating layer forming material 16 a, and the metal layer forming material 19 a, so that the metal layer 19 formed on the surface via the insulating layer 16 is formed.
  • the example implemented by the process of obtaining the laminated body which has the convex part A is shown.
  • a copper foil with resin in which an insulating resin material that is the insulating layer forming material 16a and a copper foil that is the metal layer forming material 19a are laminated and integrated is used.
  • the metal plate 10 is heated and pressed with a pressing surface, whereby the insulating layer 16 and the metal layer 19 are simultaneously laminated and the convex portion 10 a of the metal plate 10.
  • a sheet material for example, a cushion material
  • the above-mentioned insulating resin material and copper foil are commercially available, and any of them can be used. Further, the insulating resin material forming material and the copper foil forming material may be arranged separately. In this process, since the sheet material is deformed in a concave shape at the time of hot pressing due to the presence of the convex portion 10a of the metal plate 10, the corresponding convex portion A is formed in the laminate.
  • a heating / pressurizing device vacuum hot press, thermal laminator, heating press
  • the atmosphere is set to a vacuum (vacuum laminator, etc.) in order to avoid air contamination. May be.
  • Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating layer forming material and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa.
  • any material may be used as long as it is deformed at the time of lamination and cured by heating or the like and has heat resistance required for the wiring board.
  • Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites (prepregs) of the same with glass fibers, ceramic fibers, aramid fibers, and the like.
  • the insulating layer forming material of the insulating layer 16 is preferably made of a material having high thermal conductivity, and examples thereof include a resin containing a thermal conductive filler.
  • the insulating layer 16 in this case has a thermal conductivity of 1.0 W / mK or higher, preferably has a thermal conductivity of 1.2 W / mK or higher, and has a thermal conductivity of 1.5 W / mK or higher. It is more preferable. Thereby, the heat from the convex part 10a can be efficiently radiated to the metal plate 10 side.
  • the thermal conductivity of the insulating layer 16 is appropriately determined by selecting a formulation in consideration of the blending amount and particle size distribution of the thermally conductive filler, but the coating property of the insulating adhesive before curing is determined. In consideration, generally, the upper limit is preferably about 10 W / mK.
  • the insulating layer 16 is preferably composed of a thermally conductive filler that is a metal oxide and / or a metal nitride and a resin (insulating adhesive).
  • Metal oxides and metal nitrides are preferably excellent in thermal conductivity and electrically insulating.
  • Aluminum oxide, silicon oxide, beryllium oxide, and magnesium oxide are selected as the metal oxide, and boron nitride, silicon nitride, and aluminum nitride are selected as the metal nitride. These can be used alone or in combination of two or more. .
  • aluminum oxide can easily obtain an insulating adhesive layer having good electrical insulation and thermal conductivity, and can be obtained at low cost.
  • boron nitride is preferable because it is excellent in electrical insulation and thermal conductivity and has a low dielectric constant.
  • the thermally conductive filler those containing a small diameter filler and a large diameter filler are preferable.
  • the heat transfer function by the large-diameter filler itself and the function of increasing the heat transfer property of the resin between the large-diameter fillers by the small-diameter filler can be further improved.
  • the median diameter of the small filler is preferably 0.5 to 2 ⁇ m, and more preferably 0.5 to 1 ⁇ m.
  • the median diameter of the large filler is preferably 10 to 40 ⁇ m, more preferably 15 to 20 ⁇ m.
  • the resin constituting the insulating layer 16 includes a metal oxide and / or a metal nitride, but has excellent bonding strength with the metal plate 10 in a cured state and does not impair withstand voltage characteristics. Is selected.
  • a resin an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, but among them, the epoxy resin is excellent in bonding strength between metals. preferable.
  • epoxy resins bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, hydrogenated, which have high fluidity and excellent mixing properties with the above metal oxides and metal nitrides.
  • the sheet material may be any material that allows concave deformation at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, metal foil, and composites thereof. Can be mentioned. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable.
  • step S3 A step of forming the power feeding pattern 20a on the upper surface of the insulating layer 16 (step S3).
  • This step is performed, for example, by removing the convex portion A above the convex portion 10a of the metal plate 10 to expose the convex portion 10a and etching the metal foil (metal layer 19) with a predetermined pattern. can do.
  • the convex portion A is removed, the convex portion 10a is exposed, and a flat surface B is formed.
  • a method for removing the convex portion A a method by grinding or polishing is preferable.
  • the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade.
  • polishing method the method of lightly grind
  • the protrusion A is formed on the laminate as in the present invention, it becomes easy to grind only that portion, and the entire flattening can be performed more reliably.
  • the metal layer 19 is etched.
  • the exposed protrusions 10a and the metal layer 19 are metal-plated to form a metal-plated layer 20 before the etching.
  • the method of metal-plating the convex part 10a exposed at least may be used.
  • the metal species for metal plating for example, copper, silver, Ni and the like are preferable.
  • the method for forming the metal plating layer 20 include a panel plating method in which a pattern is formed using an etching resist, a pattern plating method in which a pattern plating resist is used for plating, and the like.
  • the metal plating layer 20 and the metal layer 19 are etched in a predetermined pattern, so that the pad 20b and the power supply pattern 20a are formed.
  • An upper surface metal layer is formed.
  • the size of the pad 20b may be larger or smaller than the size of the light emitting element 30, but for example, the upper surface has a diameter of 400 ⁇ m to 10 mm.
  • the shape of the upper surface of the pad 20b may be any of a quadrangle and a circle.
  • the removal of the etching resist M may be appropriately selected according to the type of the etching resist M, such as removal of chemicals and removal of peeling. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.
  • the pad 20b and the power supply pattern 20a are preferably plated with a noble metal such as gold, nickel, silver, etc. in order to improve the reflection efficiency and the bonding property.
  • a solder resist may be formed as in the case of a conventional wiring board, or solder plating may be partially performed.
  • another method for manufacturing a substrate for mounting a light-emitting element includes heating and pressing a laminate including a metal plate 10, an insulating layer forming material 16a, and a metal layer forming material 19a.
  • the step of forming the convex portion 10a at least on the mounting position of the light emitting element 30 on the plate 10 and simultaneously obtaining the laminate in which the metal layer 19 formed on the surface via the insulating layer 16 has the convex portion A;
  • the difference between the manufacturing method of another invention and the manufacturing method shown in FIG. 3 is that the latter is pressed in two steps, and the convex portion 10a is formed on the metal plate 10 by the first press work. 5 is formed on the metal layer 19 on the surface, whereas the manufacturing method of another invention shown in FIG. 5 forms the protrusion 10a on the metal plate 10 by one press.
  • the point that the convex portion A is formed on the metal layer 19 on the surface is different. Accordingly, both the steps after the step shown in FIG. 5D are the same.
  • a metal plate 10, an insulating layer forming material 16a, and a metal layer forming material 19a are prepared.
  • the convex part 42a of the lower mold 42 is designed according to the shape and size of the convex part 10a of the metal plate 10 to be formed.
  • the concave portion 41 a of the upper mold 41 is designed according to the shape and size of the convex portion A formed on the surface of the metal layer 19.
  • the cushion material may be interposed by using the upper mold 41 having a flat bottom surface.
  • a metal plate for example, a stainless steel plate
  • the cushion material it is not necessary to produce the upper mold 41 having the concave portions 41a, and the convex portion formation and the insulating layer formation can be carried out integrally by one heating press, and the alignment can be performed. Problems are less likely to occur.
  • the laminate including the metal plate 10, the insulating layer forming material 16 a, and the metal layer forming material 19 a is hot-pressed to mount at least the light emitting element 30 mounting position on the metal plate 10.
  • a laminate in which the metal layer 19 formed on the surface via the insulating layer 16 has the convex portion A is obtained.
  • the power supply pattern 20a can be formed.
  • the metal plate may be formed in a circuit with a predetermined pattern.
  • a pattern may be formed in which a plurality of light emitting elements are mounted and the interlayer connection portions below the adjacent light emitting elements are connected so that they can be connected in series.
  • the cathode electrode is connected to one interlayer connection, and the anode electrode is connected to the other interlayer connection.
  • the example in which the light emitting element mounting substrate is configured by the light emitting element mounting and the electrode has been described.
  • other electronic circuits may be formed on the same substrate. .
  • wiring, lands, pads for bonding, pads for electrical connection to the outside, etc. are patterned in the periphery of the substrate, particularly in the corner and the vicinity thereof, and components such as chip capacitors, chip resistors and printing resistors, A transistor, a diode, an IC, or the like may be provided.
  • the insulating layer is formed by laminating the insulating layer forming material and heat-pressing.
  • the insulating layer is formed by a method of applying a resin such as curtain coating. Good.
  • the upper surface of the convex part of a metal plate can be exposed by cutting or grind
  • a power supply pattern can be formed by forming a metal layer by plating or the like and etching the metal layer.
  • the surface thereof may be covered or sealed with a light-resistant film of one or more layers.
  • a resin composition containing a fluororesin and a methacrylic ester resin can be used.
  • fluororesin examples include homopolymers and copolymers of polyvinylidene fluoride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyhexafluoropropylene, and polyvinyl fluoride.
  • the methacrylic ester resin refers to a homopolymer of methyl methacrylate (MMA), a copolymer of a monomer copolymerizable with methyl methacrylate, a blend of polymethyl methacrylate and acrylic rubber, or the like.
  • copolymerizable monomers examples include methacrylic acid esters having 2 to 4 carbon atoms, acrylate esters having 1 to 8 carbon atoms such as butyl acrylate, styrene, ⁇ -methylstyrene, acrylonitrile, acrylic acid, and the like. Examples include ethylenically unsaturated monomers.
  • a phosphor may be contained in at least one layer constituting the light-resistant film.
  • YAG Ce phosphor in which the activator cerium is introduced into the phosphor matrix yttrium aluminate, and the activator europium is introduced in the phosphor matrix strontium barium silicate (Sr, Ba) 2 SiO 4 : Eu.
  • oxide phosphors such as phosphors, nitride phosphors such as ⁇ -sialon phosphors and ⁇ -sialon phosphors, and zinc sulfide activated by copper, copper, aluminum, and magnesium.
  • the particle size of the phosphor can vary within a wide range, for example, 0.001 to 20 ⁇ m. Since light scattering can increase in direct proportion to the particle size, particles of the order of 1 to 2 ⁇ m or less are preferred, and particles of the order of 0.01 to 0.4 ⁇ m or less are more desirable.
  • an ultraviolet absorber, antioxidant, a dispersing agent, a coupling agent, etc. can also be used for at least 1 layer which comprises a light-resistant film.
  • a thicker metal plate may be laminated on the back surface side, or a layer made of a highly heat conductive material may be formed on the back surface side. In that case, it is good also as a structure which filled the said material in the recessed part of the back surface side of a convex part.
  • a metal matrix composite (MMC) that can enhance the radiation effect as well as heat transfer is preferable.
  • the MMC examples include a composite of aluminum and silicon carbide, a composite of aluminum and carbon, and the like.
  • the metal plate 10 having a convex portion 10a having a sharper tip as shown in FIG. 7 (a) or (b). Can be used.
  • the convex portion 10a having a sharp tip can have a structure in which resin or the like hardly remains on the upper surface of the convex portion 10a when the insulating layer 16 is formed.
  • the insulating layer 16 is formed on the metal plate 10 by a method of laminating the insulating layer forming material 16a and heating and pressing, or a method of applying a resin such as curtain coat, a sharp convex portion The tip of 10a can be exposed or almost exposed from the insulating layer 16. Then, if the upper surface of the convex part 10a of the metal plate 10 is flattened by cutting or polishing the tip part of the convex part 10a, the light emitting element can be mounted on the part by bonding or the like.

Abstract

La présente invention a trait à un substrat permettant de monter un élément électroluminescent, qui est doté d’une partie en saillie destinée à la dissipation thermique et qui peut être produit au moyen d’un processus simple à un coût avantageux. La présente invention a également trait à un procédé de production du substrat permettant de monter un élément électroluminescent. Le substrat permettant de monter un élément électroluminescent comprend une plaque métallique (10) dotée d’une partie en saillie (10a) qui est formée en appuyant au moins sur une position où un élément électroluminescent (30) doit être monté, une couche isolante (16) formée au moins à proximité de la partie en saillie (10a), et un motif d’alimentation (20a) formé sur la surface supérieure de la couche isolante (16).
PCT/JP2009/066661 2008-09-25 2009-09-25 Substrat permettant de monter un élément électroluminescent et procédé de production associé WO2010035788A1 (fr)

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JP2011228705A (ja) * 2010-04-14 2011-11-10 Bang Ming Huang フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造
JP4887529B1 (ja) * 2011-04-12 2012-02-29 国立大学法人九州工業大学 Ｌｅｄパッケージの製造方法
JP4904604B1 (ja) * 2011-02-17 2012-03-28 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP4910157B1 (ja) * 2010-12-20 2012-04-04 国立大学法人九州工業大学 Ｌｅｄパッケージの製造方法
JP4914998B1 (ja) * 2010-11-17 2012-04-11 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
WO2012053550A1 (fr) * 2010-10-19 2012-04-26 国立大学法人九州工業大学 Dispositif de module de del, son procédé de fabrication, boîtier de del utilisé pour dispositif de module de del et son procédé de fabrication
KR101175093B1 (ko) 2011-01-04 2012-08-21 이명희 금속기판의 실장방법
JP2013543277A (ja) * 2010-11-19 2013-11-28 コーニンクレッカ フィリップス エヌ ヴェ 発光デバイスのための点在キャリア
JP2014093463A (ja) * 2012-11-06 2014-05-19 Fuji Xerox Co Ltd 面発光型半導体レーザアレイ装置、光源および光源モジュール
TWI462351B (zh) * 2010-07-19 2014-11-21 Interlight Optotech Corp 發光二極體發光模組及其製造方法
KR20160057039A (ko) * 2014-11-12 2016-05-23 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
CN106784245A (zh) * 2016-12-28 2017-05-31 安徽连达光电科技有限公司 一种高气密性的led封装支架及其制作方法

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JP2008199057A (ja) * 2006-06-02 2008-08-28 Nec Lighting Ltd 電子機器および電子機器の製造方法
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US9000463B2 (en) 2010-04-14 2015-04-07 Pang-Ming Huang LED housing with fluoropolymer surface coating layer and LED structure having the same
JP2011228705A (ja) * 2010-04-14 2011-11-10 Bang Ming Huang フッ素化ポリマーの表面塗膜を備えた発光ダイオードの筐体及びその発光ダイオード構造
TWI462351B (zh) * 2010-07-19 2014-11-21 Interlight Optotech Corp 發光二極體發光模組及其製造方法
WO2012053550A1 (fr) * 2010-10-19 2012-04-26 国立大学法人九州工業大学 Dispositif de module de del, son procédé de fabrication, boîtier de del utilisé pour dispositif de module de del et son procédé de fabrication
JP4914998B1 (ja) * 2010-11-17 2012-04-11 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP2013543277A (ja) * 2010-11-19 2013-11-28 コーニンクレッカ フィリップス エヌ ヴェ 発光デバイスのための点在キャリア
US9997686B2 (en) 2010-11-19 2018-06-12 Lumileds Llc Islanded carrier for light emitting device
JP4910157B1 (ja) * 2010-12-20 2012-04-04 国立大学法人九州工業大学 Ｌｅｄパッケージの製造方法
KR101175093B1 (ko) 2011-01-04 2012-08-21 이명희 금속기판의 실장방법
JP4904604B1 (ja) * 2011-02-17 2012-03-28 国立大学法人九州工業大学 Ｌｅｄモジュール装置及びその製造方法
JP4887529B1 (ja) * 2011-04-12 2012-02-29 国立大学法人九州工業大学 Ｌｅｄパッケージの製造方法
JP2014093463A (ja) * 2012-11-06 2014-05-19 Fuji Xerox Co Ltd 面発光型半導体レーザアレイ装置、光源および光源モジュール
KR20160057039A (ko) * 2014-11-12 2016-05-23 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
KR102268781B1 (ko) * 2014-11-12 2021-06-28 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
CN106784245A (zh) * 2016-12-28 2017-05-31 安徽连达光电科技有限公司 一种高气密性的led封装支架及其制作方法

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