WO2012053550A1 - Dispositif de module de del, son procédé de fabrication, boîtier de del utilisé pour dispositif de module de del et son procédé de fabrication - Google Patents

Dispositif de module de del, son procédé de fabrication, boîtier de del utilisé pour dispositif de module de del et son procédé de fabrication Download PDF

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WO2012053550A1
WO2012053550A1 PCT/JP2011/074050 JP2011074050W WO2012053550A1 WO 2012053550 A1 WO2012053550 A1 WO 2012053550A1 JP 2011074050 W JP2011074050 W JP 2011074050W WO 2012053550 A1 WO2012053550 A1 WO 2012053550A1
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Prior art keywords
led
metal foil
led package
pair
led chip
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PCT/JP2011/074050
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English (en)
Japanese (ja)
Inventor
政道 石原
勉 豊嶋
行信 杉村
中村　邦彦
横澤　舜哉
佳嗣 松浦
Original Assignee
国立大学法人九州工業大学
日立化成工業株式会社
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Publication of WO2012053550A1 publication Critical patent/WO2012053550A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Definitions

  • the present invention relates to an LED module device using an LED package substrate formed by bending a metal plate and a manufacturing method thereof, and an LED package used in the LED module device and a manufacturing method thereof.
  • LED Light Emitting Diode
  • a package on which such an LED chip is mounted is mounted on a wiring board, and is used for a large display, a backlight of an electronic device such as a mobile phone, a digital video camera, or a PDA, road illumination, general illumination, and the like. Since the LED itself is a light emitting element and emits heat, the LED package basically includes a heat dissipation device for cooling.
  • a ceramic substrate, a silicon substrate, or a metal substrate is used as the LED package substrate.
  • the heat conduction of ceramic or silicon is higher than that of a metal such as copper.
  • problems such as being unable to dissipate heat well, expensive, and difficult to process.
  • FIG. 22 is a diagram illustrating a conventionally known light emitting device (see Patent Document 1).
  • a copper foil pattern constituting a lead electrode is formed on the surface of a stainless steel substrate via an insulating film.
  • a through hole is formed in the stainless steel substrate, and a copper support is fitted into the through hole.
  • the LED chip is placed in a recess formed at the tip of the copper support.
  • Each electrode of the LED chip and a copper foil pattern provided on the surface of the substrate are wire-bonded.
  • a lens is formed by potting and curing a translucent resin such as a silicon resin.
  • the silicon resin functioning as a lens is provided so as to cover the protrusions of the support, the light emitting elements, and even the wires bonded to the electrodes.
  • FIG. 23 is a side cross-sectional view showing the light emitting device disclosed in Patent Document 2.
  • the substrate uses an electrically insulating material such as a liquid crystal polymer, and forms an insulating substrate by injection molding. Then, a three-dimensional three-dimensional insulating base material is formed, for example, by providing a recess in the LED chip mounting location. After the metal film is formed on the surface of the insulating substrate, the metal film other than the portion where the circuit portion is formed is removed.
  • the LED chip is mounted in the recess of the substrate, and the circuit portion and the LED chip are electrically joined with a conductive adhesive. Thereafter, the upper electrode of the LED chip and the circuit part are joined with a gold wire. Next, the recess is filled with a transparent resin to seal the LED chip. Finally, a diffusion plate made of a transparent resin or the like is attached to the surface of the substrate to complete the LED lighting module.
  • the light-emitting device disclosed in Patent Document 2 has a problem that the process is complicated and the cost is high because a substrate serving as a package base is formed three-dimensionally and wiring is formed later. There is.
  • FIG. 24 is a view showing the LED lighting apparatus disclosed in Patent Document 3, wherein (A) shows a top view and (B) shows a partial cross-sectional view.
  • the insulating metal substrate has a recess for installing the LED chip provided by squeezing.
  • the insulating metal substrate includes a metal substrate layer, an electrical insulating layer made of an insulating material layer, an electrode pattern made of a conductive metal, and a lead pattern. Adjacent LED chips are electrically connected by a bonding wire via an electrode pattern.
  • Patent Document 3 discloses a module in which a plurality of LED chips are mounted on a single insulating metal substrate.
  • a product including a plurality of chips (illustrated as 6 chips) constitutes one product.
  • the product will be defective.
  • one defective chip is sacrificed together with other chips. That is, a product becomes a non-defective product only after all the lights are turned on. Even if the LED chip is determined to be a non-defective product by the bare chip inspection in the same manner as the IC chip, it may become defective due to the establishment of the assembly process.
  • Patent Document 3 discloses an individual package that is divided into individual pieces for each LED chip, and an individual package that is divided into a wiring board and an individual package. There is no disclosure about mounting on a radiator. Therefore, no consideration has been given to heat dissipation.
  • an LED chip is mounted on a bottom of a recess formed by bending an insulating metal substrate, and a connection by bonding is provided in the middle (or upper) of the recess.
  • the bottom area of the metal substrate is slightly larger than the LED chip area, and it is not considered to utilize the bottom surface for heat dissipation.
  • the electrical insulating layer located on the lower surface of the LED chip is usually about 80 ⁇ m thick and has poor thermal conductivity, so that there is a problem that good heat dissipation characteristics cannot be obtained. is there.
  • an insulating layer polyimide layer
  • Patent Document 3 discloses only application of a white material and metal deposition as a retrofit. Using a transparent insulating layer and using the underlying metal surface as a reflecting surface increases the cost of the gloss treatment on the transparent insulating layer and the underlying metal surface.
  • the white resist coating increases the additional material costs and the coating process costs.
  • Deposition of metal film means that metal is evaporated at low pressure (vacuum) and high temperature, and a metal film is formed on the object.
  • the apparatus is large and requires a high apparatus, and it takes time and effort to draw a vacuum, and the throughput is long. As a result, process costs also increase. In addition, the cost of the target metal is also increased. There is a demand for the formation of a reflective surface that can exhibit reflective performance at low cost without any additional process.
  • FIG. 25 is a cross-sectional view showing a lighting fixture disclosed in Patent Document 6.
  • the illustrated metal core printed circuit board includes a metal core and a printed circuit obtained by processing a copper foil over the insulating layer on the metal core.
  • a heat-resistant thermoplastic resin having a thickness of about 100 ⁇ m made of any one of polyether ether ketone, polyether imide, and polyether sulfone is used.
  • a light emitting diode is mounted and fixed on the bottom surface of the recess of the metal core printed circuit board, and each terminal is connected to the printed circuit.
  • the hollow of the metal core printed circuit board is filled with a transparent acrylic resin.
  • thermoplastic resin As described above, it is known to use a heat-resistant thermoplastic resin as the insulating layer, however, it cannot be said that the resin is usually excellent in heat dissipation. There is a need for an insulating layer with good thermal conductivity that can dissipate heat generated by a light emitting diode while achieving electrical insulation.
  • FIG. 26 is a cross-sectional view illustrating a light emitting device disclosed in Patent Document 7.
  • a Cu substrate on which an LED element is mounted integrally has a thin-film Cu wiring layer using an insulating layer made of SiO 2 as an adhesive.
  • the surface of the Cu wiring layer is Ag-plated and has light reflectivity.
  • the Cu wiring layer and the insulating layer in the element mounting portion are partially removed to expose the Cu substrate, and are bonded and fixed to the exposed surface of the Cu substrate.
  • a pair of electrodes of the LED element is connected to a corresponding Cu wiring layer through a wire.
  • a sealing resin which is a translucent resin material, is sealed in the element mounting portion of the Cu substrate.
  • the process of partially removing the Cu wiring layer and the insulating layer to expose the Cu substrate is not easy. Conventionally, such partial removal is performed by an etching technique.
  • SiO 2 used as an insulating layer is difficult to etch with a normal acid or alkali, and hydrofluoric acid, which is an extremely dangerous chemical in handling, is used. Need to use.
  • Cu reacts with hydrofluoric acid to form CuF 2 , there is a problem that the surface Cu foil is damaged. There is a need for a simpler partial removal process of the insulating layer.
  • a polyimide resin layer is used as an insulating layer.
  • a metal foil is etched and opened as a first step, and the opened metal foil is used as a mask. Even if the polyimide resin layer is opened by etching in the second stage, toxic hydrazine is required to etch the polyimide resin layer.
  • the resin layer is a polyimide precursor, the precursor is formed after the opening step by alkali etching. The process is complicated because it requires imidization of the body.
  • the etching so that the size of the resin layer opening is the same as or smaller than the size of the metal foil opening, and there is a risk that the resin layer end face may recede from the metal foil end face in the opening. There is a concern that reliability may be reduced due to short circuit between the metal plate and the metal plate.
  • the present invention solves such problems and is an LED module device in which an LED package in which an LED chip is attached to an LED package substrate formed by processing a metal plate is attached to a wiring substrate and a radiator is attached.
  • the purpose is to improve the heat dissipation characteristics.
  • the present invention uses a metal plate having good processability and thermal conductivity as an LED package substrate, and uses an insulating layer that ensures insulation from the connection wiring of the LED chip mounted thereon, while insulating the same.
  • the aim is to improve the thermal conductivity through the layers.
  • the present invention is such that the electrical connection portion of the LED package connected to the wiring board is positioned on the upper surface of the LED chip, while the heat dissipator for mounting the LED package board is positioned below to separate the two.
  • the cost performance of each of the heat dissipation and electrical connection is optimized, and overall, low-cost and high-efficiency exhaust heat is realized. It is aimed.
  • An LED module device and a manufacturing method thereof according to the present invention comprise an LED package substrate for an LED chip by bending a metal plate made of a plate material having a predetermined plate thickness, and an LED package using the substrate. Attached to the wiring board.
  • the LED package substrate is bent so as to integrally form a flat bottom portion for mounting the LED chip, a wall portion rising from both sides of the bottom end, and a connection electrode portion where the upper portion of the wall portion is bent outward.
  • a laminated structure in which two insulating layers composed of a resin layer and an adhesive layer are sandwiched between the metal plate and the metal foil.
  • a metal foil at the upper end of the connection electrode portion where the upper portion of the wall portion is bent outward is configured as at least one of the pair of external connection electrodes.
  • the LED chip is mounted on the upper surface of the flat bottom of the LED package substrate, at least one of the pair of electrodes of the LED chip is connected to the metal foil on the upper surface of the flat bottom, and the transparent resin is sandwiched between the walls.
  • An LED package is formed by filling the recess.
  • the flat bottom surface of the LED package is fixed or brought into contact with the heat sink, and the LED package is mounted in the opening of the wiring board arranged with a space between the heat sink and placed inside the end of the metal plate.
  • the paired external connection electrodes are connected to the wiring of the wiring board.
  • a metal foil provided with a metal surface treatment that functions as a reflective material on a metal plate, and an end portion of the metal foil configured as an external connection electrode can be disposed inside the metal plate end.
  • the metal foil on the upper surface of the flat bottom portion is insulated and separated on both sides so that the metal foil on the upper end of the wall portion functions as a pair of external connection electrodes, and the pair of electrodes of the LED chip are insulated and separated. Can be connected to each of.
  • An LED chip is electrically and mechanically bonded to the upper surface of the flat bottom of the metal plate without using an insulating layer using a conductive die-bonding material, and one of the pair of electrodes of the LED chip is attached.
  • the wire foil is connected to the metal foil, while the other electrode is connected to the metal plate by a conductive die bond material, and the metal foil on the upper end side of the wall portion is connected to one of the pair of connection electrodes. It can function as a connection electrode, and the other connection electrode can be configured by a metal plate on the upper end side of the wall portion.
  • the LED package substrate has an area sufficient to form on the upper surface a pair of connection portions for connecting the LED chip mounting portion and the pair of electrodes of the LED chip. It consists of a resin layer on a metal plate that is bent so as to integrally form a flat bottom, a wall that rises from both sides of the bottom edge, and a connection electrode that is bent outwardly from the top of the wall.
  • a laminated structure in which metal foils are bonded with an insulating layer interposed therebetween, and the resin layer constituting the insulating layer is a polyimide resin having a film thickness in the range of 5 ⁇ m to 40 ⁇ m.
  • the polyimide resin spherical spacer particles, a thermally conductive filler smaller than the diameter of the spacer particles, or both can be mixed in a polyimide resin containing thermoplastic polyimide.
  • the long side of the flat bottom portion of the LED package in contact with the heat dissipator can be twice to 20 times as long as the short side of the LED chip.
  • the laminate can be formed by applying a polyimide resin solution to a metal foil or a metal plate and drying it, followed by thermocompression bonding to the metal plate or metal foil.
  • the laminate is formed by applying at least one polyimide precursor resin layer that can be converted into a thermoplastic polyimide resin on a metal foil or a metal plate, and then heat-treating the precursor resin layer, thereby thermoplasticity.
  • a polyimide-based resin layer is formed, and a metal plate or a metal foil can be bonded to the thermoplastic polyimide-based resin layer by heating and pressing.
  • a laminated body can be formed by bonding a material obtained by sandwiching a thermoplastic polyimide film between a metal foil and a metal plate under heat and pressure.
  • the LED The package substrate shape is devised to secure a large area on the flat bottom and to transfer heat to the radiator through this large area, thereby improving the thermal conductivity from the LED chip to the radiator. be able to.
  • the LED package substrate of the present invention has a metal-two-layer insulating layer (polyimide + adhesive layer) -metal four-layer structure, so that the insulating resin layer (polyimide) can be made very thin and the adhesive material has a low heat By mixing a resistance filler, the thermal conductivity can be improved by an order of magnitude over the insulating layer, and the total thermal resistance can be reduced.
  • the LED package substrate of the present invention has a very thin insulating resin layer (polyimide) by devising a method for manufacturing a laminate comprising an insulating layer sandwiched between a metal plate and a metal foil. , Thermal resistance can be reduced.
  • the electrical connection between the LED package substrate and the wiring board can be easily performed by separating the electrical connection portion between the LED package board and the wiring board from the heat radiating body on which the LED package board is mounted. At the same time, by optimizing the cost performance of heat dissipation and electrical connection, it is possible to achieve low-cost and high-efficiency exhaust heat overall.
  • the manufacturing process can be simplified by forming the opening for mounting the LED chip on the metal plate by punching instead of etching.
  • FIG. 1 It is side surface sectional drawing which shows the 1st example of the LED module apparatus which actualizes this invention. It is a figure explaining the bending process of a 1st LED package board
  • FIG. 4 is a view showing only the LED package substrate taken out
  • C is a cross-sectional view taken along line AA ′ shown in (B)
  • D is a line BB ′ shown in (B). It is sectional drawing cut
  • A is a figure which shows the state which connected several LED package board
  • FIG. It is a figure explaining the 5th example of the LED module device which embodies this invention, (A) shows the sectional view, and (B) is the upper surface shown in the state where three LED packages were attached to the wiring board.
  • FIG. It is a figure explaining the 6th example of the LED module device which actualizes this invention, (A) shows the top view of a connection structure LED package, (B) attached this connection structure LED package to the wiring board. A sectional view taken along the line AA ′ in the state is shown. It is a graph which shows the film thickness dependence of LED junction temperature. (A) is a graph which shows heat dissipation performance (thermal resistance ratio), (B) is a figure which shows the LED package structure with which a heat sink is mounted
  • FIG. 10 is a side cross-sectional view showing a light emitting device disclosed in Patent Document 2. It is a figure which shows the LED lighting fixture disclosed by patent document 3, (A) shows the top view, (B) has shown the fragmentary sectional view. It is sectional drawing which shows the lighting fixture of the patent document 6.
  • FIG. 10 is a cross-sectional view illustrating a light emitting device disclosed in Patent Document 7.
  • FIG. 1 is a side sectional view showing a first example of an LED module device embodying the present invention.
  • the exemplary LED module device includes an LED package, a wiring board having an opening for mounting the LED package, and a heat sink fixed to the back surface of the LED package.
  • the LED package is attached to the opening of the wiring board by filling a gap between the LED package side surface and the wiring board with an adhesive (heat-resistant adhesive), and on the adhesive, a pair of connection electrodes ( The external connection electrodes for connecting to the wiring board are connected to the wiring on the upper surface of the wiring board by soldering or the like.
  • the LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the wiring board.
  • the back surface of the LED package on which the wiring board is mounted is fixed on the heat sink by solder connection. Alternatively, instead of this solder connection, it is possible to bond using a highly heat conductive adhesive.
  • the LED package is assembled on the LED package substrate.
  • the LED package substrate used in the first example of the LED module device is, for example, a metal plate bent into a predetermined shape so as to have a recess for mounting an LED chip, as will be described later with reference to FIG.
  • a laminated film made of a resin-attached metal foil is attached onto the metal foil using an adhesive, and silver plating that functions as a reflector is applied on the metal foil.
  • a slit for insulating and separating a pair of connection electrodes both ends of the metal foil
  • a transparent resin is filled to configure the LED package.
  • the LED package substrate includes an insulating layer sandwiched between a metal plate and a metal foil, which is composed of two layers of a resin layer (polyimide film) and an adhesive layer. Since it is responsible for electrical insulation and the adhesive material is responsible for adhesion, each can be optimized, resulting in improved heat transfer characteristics.
  • the LED package substrate is formed of a polyimide resin with an insulating layer formed on a metal plate (for example, a copper foil) on the metal plate with the insulating layer made of the polyimide resin interposed therebetween.
  • the LED chip mounting part and the connection part for connecting the pair of electrodes are formed on the flat bottom surface by bending the laminated body joined together into a predetermined shape.
  • the LED package substrate has a flat bottom portion having an area sufficient to mount the LED chip and form a connection portion connecting the pair of electrodes, and the flat bottom portion having this large area. Since the radiator is mounted on the lower surface of the LED, the heat radiation from the LED chip is efficiently transferred to the radiator. Moreover, since the rigidity after singulation can be held by a metal plate thicker than the metal foil, the reliability is remarkably improved. There is no need to ensure rigidity with transparent resin, and there are many choices of resin materials, resulting in cost reduction. Hereinafter, the production method will be described in detail.
  • FIG. 2 is a diagram for explaining bending of the first LED package substrate.
  • FIG. 2A is a side view showing a metal plate to be processed (a plate metal member having high thermal conductivity such as copper or aluminum).
  • a laminated film made of a metal foil with a resin for example, a copper foil with a polyimide film attached thereto: for example, MCF-5000IR manufactured by Hitachi Chemical Co., Ltd., this material, as shown in FIG.
  • the polyimide film has a thickness of only 5 ⁇ m, which is a very advantageous material in terms of heat resistance, and is attached using an adhesive. By making the thickness of the resin layer thinner than that of the adhesive layer, it is advantageous in terms of both cost and heat dissipation.
  • This adhesive is preferably filled with a heat conductive filler.
  • a two-layer insulating layer composed of a resin layer (polyimide film) and an adhesive layer is sandwiched between the metal plate and the metal foil.
  • the polyimide film and the adhesive layer can not only provide insulation between the pair of connection electrodes of the LED chip, but also can utilize a copper foil as the connection wiring of the LED chip.
  • metal foil metal layer with high heat conductivity like aluminum can be used.
  • the insulating layer by using a two-layer structure of the resin layer and the adhesive layer as the insulating layer, it is possible to greatly improve the heat dissipation of the insulating layer.
  • polyimide when only one layer of polyimide film is used as an insulating layer between an 18 ⁇ copper foil and a copper plate (metal plate) of around 125 ⁇ m, polyimide can be used to take into account both tolerances and also serve as an adhesive force between them. For example, a film thickness of about 20 to 30 ⁇ m is required.
  • the polyimide film thickness can be made as thin as possible. This can be realized by thinly applying polyimide on the copper foil.
  • a polyimide film thickness of 5 ⁇ m is realized.
  • An adhesive is further used to attach a laminate of this copper foil and a thin polyimide film. Since it is assumed that it is applied to a relatively thick plate (metal plate) of about 125 ⁇ m, the thickness of the adhesive layer is set to about 25 ⁇ m for the same reason as described above. Simply speaking, the ratio of thickness is 25 ⁇ m in the case of one insulating layer, and 25 ⁇ m + 5 ⁇ m in the case of two layers of a polyimide film and an adhesive layer, which is disadvantageous for two insulating layers. However, in the case of two insulating layers, the 5 ⁇ m polyimide film has insulation resistance, so the adhesive layer can easily increase heat conduction.
  • thermally conductive filler ceramic or metal such as aluminum nitride
  • the thermal conductive filler As the thermal conductive filler is filled, the electrical insulation resistance decreases, but the electrical insulation resistance does not have to be considered by the lamination with the polyimide film.
  • the total thermal conductivity can be improved by about three times compared to a single-layer adhesive having substantially the same thickness.
  • the presence of the resin layer makes it easy to etch the copper foil on the top surface. There is no concern that the adhesive layer is eroded by the etchant during etching. However, if the heat conduction is improved only by the adhesive layer, the insulation resistance is easily sacrificed, and it is difficult to achieve both the heat conduction and the insulation resistance by a single adhesive layer.
  • the attached metal foil is processed to form slit openings and copper foil removal portions.
  • photolithography technology is used for this processing.
  • a resist is applied on the metal layer (copper foil), the pattern is exposed and developed, and etching is further performed to remove the resist, thereby completing the slit opening and the copper foil removing portion.
  • the slit is opened in the metal foil of the laminated film with the laminated film attached on the metal plate.
  • the processed laminated film can also be attached on the metal plate using an adhesive.
  • the slit opening can be made by punching in the state of the laminated film alone.
  • the slit is opened not only to the metal foil but also to the polyimide layer.
  • the metal plate to which the metal foil with resin is attached is bent. This bending process is performed by pressing using a mold so as to form a recess for mounting the LED chip and a connection electrode with the upper part bent outward.
  • the copper foil is removed by partially removing the connection electrode tip in order to prevent the solder from electrically shorting the connection electrode and the metal plate.
  • the connection electrode end is disposed inside the metal plate end.
  • the copper foil removing portion can be provided by a slit opening step shown in FIG.
  • metal (for example, silver) plating metal surface treatment
  • metal surface treatment metal surface treatment
  • the metal foil as a plating electrode for the plating process, it is possible to plate only on the upper surface of the metal foil except for the slit and the copper foil removing portion.
  • a glossy surface is formed by applying an ink jet to a portion requiring metal surface treatment using silver ink and baking.
  • FIG. 3 is a view showing a completed first LED package substrate
  • (A) is a view showing a state in which a plurality of LED package substrates are connected
  • (B) is a single LED package substrate.
  • (C) is a cross-sectional view taken along the line AA ′ shown in (B)
  • (D) is a view taken along the line BB ′ shown in (B). It is sectional drawing.
  • 5 ⁇ 14 LED package substrates are illustrated as being simultaneously formed on a single metal plate.
  • individualization is performed by dividing into individual packages or arbitrary plural connected packages. The singulation is performed along the dividing line shown in FIG.
  • the connected LED package can be provided with flexibility, and can be mounted on a heat sink or housing having an arbitrary outer surface shape such as a convex shape or a concave shape (see FIG. 19 described later).
  • a recess for mounting the LED chip is formed.
  • Left and right wall portions are provided on both sides of the recess, and front and rear wall portions connected to and orthogonal to the left and right wall portions are provided to perform a function of confining the sealing resin from the left and right front and rear.
  • the metal foils on the upper surfaces of the left and right wall parts (and the silver plating thereon) function as a pair of connection electrodes.
  • slits for electrically separating the pair of connection electrodes are formed in the metal foil (and silver plating thereon).
  • An LED chip is mounted on one of the metal foils divided by the slit as described later.
  • the illustrated first LED package substrate includes a flat bottom portion on which the LED chip is to be mounted, and LED lamps in a direction that rises by bending from the bottom end located on the left and right front and back of the bottom portion.
  • Left and right and front and rear wall portions extending on the same side as the light emitting direction of the chip are provided.
  • the metal foils on the pair of left and right wall tip surfaces function as connection electrodes.
  • the directions in which the left and right front and rear walls rise from the bottom end do not necessarily have to be orthogonal to each other.
  • the connection electrode can be raised linearly or curved upward at an angle so that the connection electrode can be positioned above the flat bottom. May be.
  • the pair of connection electrodes are separated from each other by dividing the metal foil of the flat bottom portion and the front and rear wall portions into two by slits.
  • an LED chip is mounted on one of the two divided bottom metal foils to make one wire bond connection, while the other of the two divided bottom metal foils has the other wire bond connection. do.
  • FIG. 4 is a view showing another example of the first LED package substrate different from FIG. 3,
  • (A) is a view showing a state in which a plurality of LED package substrates are connected, and (B) is It is a figure which takes out and shows only the one LED package board
  • FIG. 6 is a cross-sectional view taken along line ⁇ B ′. In the illustrated example, as in FIG. 3, 5 ⁇ 14 LED package substrates are illustrated as being simultaneously formed on one metal plate. The first LED package substrate shown in FIG. 4 is different from FIG.
  • FIG. 5 is a diagram for explaining bending of the second LED package substrate.
  • FIG. 5A is a side view showing a metal plate to be processed.
  • the laminated body which joined metal foil (for example, copper foil) on this metal plate on both sides of the insulating layer which consists of polyimide resins is comprised.
  • a solution obtained by dissolving a polyimide resin containing a thermoplastic polyimide in a solvent is first applied to a metal foil (or metal plate), dried, and thermocompression bonded to the metal plate (or metal foil).
  • a polyimide resin having a thickness of at least 5 ⁇ m in order to ensure a certain withstand voltage.
  • the thickness of the polyimide resin is preferably thin from the viewpoint of heat dissipation characteristics, but a certain thickness is required from the viewpoint of withstand voltage and tear strength.
  • the withstand voltage of the insulating film required for LED mounting is generally 2.5 to 5 kV, and the withstand voltage of the polyimide resin varies depending on the structure, but several hundred to Since it is 500 V / ⁇ m, a minimum thickness of 5 ⁇ m is required.
  • the polyimide resin layer cannot be thickened, and the thickness is desirably 40 ⁇ m or less, preferably 20 ⁇ m or less (see the section of Example 1 described later based on FIG. 20).
  • thermoplastic polyimide resin layer that can be converted into a thermoplastic polyimide resin is applied on a metal plate (see Example 2).
  • the precursor resin layer is heat-treated to form a thermoplastic polyimide resin layer.
  • a copper foil is joined under heat and pressure to form a laminate.
  • a polyimide precursor resin layer that can be converted into thermoplastic polyimide is applied on a copper foil instead of a metal plate.
  • the precursor resin layer can be heat-treated to form a thermoplastic polyimide resin layer, and then laminated with a metal plate under heat and pressure.
  • a predetermined film thickness is required to secure the breakdown voltage while making the insulating layer as thin as possible in order to improve heat dissipation, but it is necessary to further increase the flatness variation film thickness.
  • heat dissipation characteristics can be further improved by mixing a filler having good thermal conductivity smaller than the diameter of the spacer particles in the polyimide resin separately from the spacer particles or by mixing both.
  • the filler having good thermal conductivity aluminum nitride, alumina-coated metal fine particles (for example, copper), or alumina-coated carbon particles or fibers can be used.
  • the thermal conductive filler is filled, the electrical insulation resistance is lowered, but since the insulating layer can be applied thickly, the film thickness can be easily controlled.
  • the insulating layer made of polyimide resin containing thermoplastic polyimide is formed into a laminated structure in which the metal plate and the metal foil are sandwiched, and the thickness of the insulating layer can be controlled to a predetermined value (5 ⁇ m to 40 ⁇ m).
  • This insulating layer not only provides insulation between the pair of connection electrodes of the LED chip, but also allows copper foil to be used as the connection wiring of the LED chip. Moreover, not only copper foil but metal foil (metal layer) with high heat conductivity like aluminum can be used.
  • the joined metal foil is processed to form slit openings and copper foil removal portions (for details, see the description of FIG. 2C).
  • the presence of the polyimide resin layer facilitates etching of the upper surface copper foil. Since the slit portion does not function as a reflective material for light emission from the LED chip, it is desirable that the slit portion is narrow, but about 20 ⁇ m to 100 ⁇ m is desirable in order to insulate and separate the metal foil on both sides of the slit.
  • metal (for example, silver) plating metal surface treatment
  • metal surface treatment metal surface treatment that functions as a reflective material for light emission from the LED chip is applied to all of the upper surface of the metal foil (for details, see (See description of FIG. 2 (e)).
  • a metal reflection process is performed on almost the entire surface of the metal plate.
  • the laminate is pressed in a state where at least the metal reflection treatment surface is covered with the protective tape, and then the protective tape is peeled off.
  • FIG. 6 is a view showing a completed second LED package substrate
  • (A) is a view showing a state in which a plurality of LED package substrates are connected
  • (B) is a single LED package substrate. It is a figure which takes out only and shows. In the illustrated example, 5 ⁇ 14 LED package substrates are illustrated as being simultaneously formed on a single metal plate. In a later step, after mounting the LED chip on the LED package substrate and resin-sealing, individualization is performed by dividing into individual packages or arbitrary plural connected packages.
  • a gap is formed around the package substrate region so as not to exert the distortion of the drawing during bending of the laminate on the periphery. It is connected to the surrounding metal plate via a coupling portion provided around the package substrate region. At the time of individualization in a later process, the joint is cut. Details of the inside of the package substrate region will be described later with reference to FIG.
  • FIG. 7 is a diagram showing details of the second LED package substrate, (A) is a diagram showing only one LED package substrate, and (B) is an AA shown in (A). (C) is a cross-sectional view taken along line BB 'shown in (A).
  • the illustrated second LED package substrate has a recess for mounting the LED chip. On both sides of the recess, at least left and right wall portions are provided, and front and rear wall portions connected to and orthogonal to the left and right wall portions are provided, so that the sealing resin can be confined from the left and right front and rear.
  • the resin flowing in the left and right directions in the figure is left and right wall portions when the resin is sealed in the mold after mounting the LED chip on the LED package substrate in a later step.
  • the resin flowing in the front-rear direction is restricted by edge processing of the package substrate, for example, by providing a wall only at the edge.
  • connection electrodes external connection electrodes for connecting to the wiring board (see FIG. 1)
  • slits for electrically separating the pair of connection electrodes are formed in the metal foil (and silver plating thereon).
  • An LED chip is mounted on one of the metal foils divided by the slit as described later.
  • the second LED package substrate has a flat bottom portion that is to be electrically connected with the LED chip mounted thereon, and a direction in which the second LED package substrate is bent from the bottom end and located on the left and right sides of the bottom portion.
  • left and right and front and rear wall portions extending on the same side as the light emitting direction of the LED chip are provided.
  • the flat bottom portion has an area sufficient for mounting the LED chip on the upper surface thereof and forming a connection portion for connecting the pair of connection electrodes. In order to perform the bonding connection at the bottom, a certain amount of space is required in the process, and it is preferable that the LED chip is optically located at the center.
  • the chip short side m It is desirable to take 2 to 20 times, preferably 3 to 10 times (see Example 3 below based on FIG. 21). Further, as will be described later, since the heat radiating body is mounted in contact with the lower surface of the flat bottom portion having a large area, the heat radiated from the LED chip is efficiently transferred to the heat radiating body.
  • the metal foils on the pair of left and right wall tip surfaces function as connection electrodes (external connection electrodes).
  • the opening of the third LED package substrate is different from the first and second LED package substrates in that it has a sufficient opening width for mounting the LED chip.
  • FIG. 8 is a diagram illustrating the bending process of the third LED package substrate.
  • A is a side view which shows the metal plate which should be processed.
  • B is a laminated film composed of a resin layer (for example, a polyimide film) and a metal foil (for example, a copper foil) bonded to the metal plate shown in (a).
  • the laminated film is punched to provide an opening.
  • the resin layer and the metal foil can be simultaneously opened by punching.
  • this opening part electrically insulates and separates the copper foils on both the left and right sides and forms a space for mounting the LED chip.
  • the copper foil separated on both sides can be used as the connection wiring of the LED chip.
  • metal foil metal layer with high heat conductivity like aluminum can be used.
  • the polyimide film side of the laminated film in which the opening is formed is pasted onto the metal plate shown in (a) using an adhesive.
  • an adhesive it is also possible to open an opening by punching out a portion corresponding to a chip mounting location in a laminated body made of an adhesive / polyimide resin / metal foil (copper foil) and adhere it to a metal plate.
  • the adhesive has an insulating property, thermal conductivity is not necessarily required because it does not exist under the LED chip.
  • a two-layer insulating layer (see FIG. 2) composed of a resin layer (polyimide film) and an adhesive layer is sandwiched between the metal plate and the metal foil.
  • this insulating layer can be formed in a narrow structure in which only the resin layer (polyimide film) described above with reference to FIG. 5 is sandwiched between the metal plate and the metal foil.
  • This narrow attachment configuration is performed by high-temperature pressure bonding of a laminate made of a thermocompression bonding polyimide resin and a metal foil (copper foil) to a metal plate.
  • a metal foil removing portion is provided by partially removing the front end side of the connection electrode soldered to the wiring board (see FIG. 1).
  • the metal plate with the laminated film attached is bent.
  • This bending process is performed by pressing using a mold so as to form a recess for mounting an LED chip and sealing with resin, and a connection electrode whose upper part is bent outward.
  • a metal surface treatment for example, silver plating that functions as a reflective material for light emission from the LED chip is applied to the entire upper surface of the metal foil.
  • the third LED package substrate illustrated in FIG. 8 has the same configuration as the above-described first or second LED package substrate except that the LED chip is mounted in the opening. be able to.
  • FIG. 9 is a diagram showing a first example of LED package assembly.
  • the LED package substrate shown in (a) is the same as the first LED package substrate shown in FIGS. 2 to 4 or the second LED package substrate shown in FIGS.
  • the LED chip is fixed on the silver-plated metal foil on the flat bottom surface of the LED package substrate with an adhesive as shown in FIG.
  • This LED chip has an LED light emitting surface on the upper surface.
  • a plurality of chips can be mounted (see FIG. 13).
  • wire bond connection is performed between the LED chip and the metal foil functioning as connection wiring.
  • wire bonding is performed between the respective connection portions on the two-part metal foil and the pair of connection electrodes of the LED chip by bonding wires.
  • silver plating is formed as a reflective material on the metal foil, this silver plating can also function for improving wire bonding.
  • resin sealing (transfer molding or potting) is performed using a transparent resin (material is, for example, epoxy or silicone).
  • the transparent resin may be mixed with a phosphor.
  • a white LED a yellow phosphor is disposed on an LED chip using a blue light emitting LED chip, and this phosphor receives blue and glows white.
  • this phosphor is often mixed in a transparent resin.
  • Resin sealing is performed by placing the connected package in a mold. Alternatively, resin sealing may be performed by a dispenser or screen printing. The height of the sealing resin is injected up to the same plane as the front end surface of the wall functioning as a connection electrode. Thereafter, the LED package is completed by dividing into individual packages or a plurality of connected packages.
  • FIG. 10 is a diagram showing a second example of LED package assembly.
  • the LED package substrate shown in (a) is different from the first or second LED package substrate described above in that a silver-plated metal foil is formed with a wiring pattern for flip chip mounting.
  • the LED chip is flip-chip mounted on the connection portion on the flip-chip mounting wiring pattern.
  • the same resin sealing as described with reference to FIG. 9 is performed.
  • FIG. 11 is a diagram showing a third example of LED package assembly.
  • the LED package substrate shown in (a) is the same as the LED package substrate of the third example shown in FIG.
  • the LED chip is fixed on the metal plate as shown in FIG.
  • This chip fixing is performed using a die bond material such as silver paste, gold-silicon eutectic, or silver nanopaste (having silver characteristics after firing).
  • This LED chip has an LED light emitting surface on the upper surface. Although only one LED chip is illustrated, a plurality of chips can be mounted.
  • wire bond connection is performed between the LED chip and the metal foil functioning as connection wiring.
  • a pair of electrodes of the mounted LED chip is wire-bonded to the left and right metal foils by bonding wires.
  • a metal surface treatment (silver plating) is formed on the metal foil as a reflective material, so that this silver plating can also function to improve wire bonding properties.
  • FIG. 12A is a cross-sectional view showing another example different from the assembly of the LED package shown in FIG. 11, and FIG. 12B is a cross-sectional view showing still another example.
  • the LED package substrate itself shown in (A) is the same as the LED package substrate of the third example shown in FIG.
  • the connection electrodes are different.
  • the illustrated configuration uses not only the metal foil (and metal surface treatment) formed on the metal plate via an insulating film but also the metal plate itself as a connection electrode.
  • the LED chip is electrically and mechanically fixed on the metal plate at the opening of the LED package substrate.
  • One of the pair of electrodes of the LED chip is formed on the upper surface thereof, while the other electrode is formed on the lower surface of the LED chip.
  • Chip fixation is performed using a conductive die bond material (conductive adhesive material) such as silver paste, gold silicon eutectic, or silver nano paste (having silver characteristics after firing).
  • the electrical connection between the electrode on the lower surface of the chip and the metal plate is completed by fixing using the conductive die bond material.
  • the connection electrode on the right side in the figure is constituted by the metal foil on the upper end side
  • the connection electrode on the left side in the figure is constituted by the side surface of the metal plate on the upper end side.
  • the metal foil (and the metal surface treatment thereon) to which one electrode of the LED chip is connected is an insulating layer on the right side of the figure, as in the example shown in FIG.
  • the metal plate on the left side of the figure is formed with a metal surface treatment as a reflective material, and an insulating layer and a metal foil are attached to the metal plate on the left side of the figure. Absent.
  • This metal surface treatment can be performed by forming a glossy surface (reflecting material) by applying an ink jet to a necessary portion on a metal plate using a silver ink and baking it.
  • FIG. 13 is a view showing a fourth example of LED package assembly, where (A) shows a top view of the completed LED package and (B) shows a side cross-sectional view.
  • a silver-plated metal foil is divided into three by two slits on the left and right sides.
  • a plurality of (6 ⁇ 6 exemplified) LED chips are mounted on the central metal foil divided into three, and the wiring between the LED chips and the wiring between the LED chip and the metal foil are bonded using bonding wires. It is connected.
  • FIG. 14 is a view for explaining assembly of the first example (see FIG. 1) of the LED module device embodying the present invention.
  • an LED package see FIG. 9 and the LED package shown in FIGS. 10 to 13 can be used
  • a wiring board having an opening corresponding to the LED package for example, Prepare a single-layer glass epoxy board
  • place the LED package in the opening of this wiring board and use a bonding material (heat-resistant and insulating bonding material) to clear the gap between the LED package side surface and the wiring board fill in.
  • a pair of connection electrodes of the LED package is soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet.
  • the LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the LED package substrate.
  • the LED package on which the wiring board is mounted is fixed on a heat radiating plate (for example, copper or aluminum plate) by solder connection.
  • a heat radiating plate for example, copper or aluminum plate
  • solder connection it is possible to bond using a highly heat conductive adhesive.
  • the heat radiating plate it can be directly fixed to the housing.
  • FIG. 15 is a side cross-sectional view showing a second example of an LED module device embodying the present invention.
  • the exemplary LED module device differs from the first example of the LED module device described with reference to FIG. 14 only in that the LED package uses the third example of the LED package shown in FIG. Yes. Detailed description thereof is omitted.
  • FIG. 16 is a side cross-sectional view showing a third example of the LED module device embodying the present invention.
  • the exemplary LED module device is different from the above-described first or second example of the LED module device only in that the LED package described with reference to FIG. 12A is used as the LED package. Yes.
  • the LED package described with reference to FIG. 12B can also be used. Detailed description thereof is omitted.
  • FIG. 17 is a diagram for explaining assembly of the fourth example of the LED module device embodying the present invention.
  • a wiring board is used as a heat radiator.
  • the exemplary wiring board does not have an opening for mounting the LED package, and is different from the above example in that the LED package is mounted on the upper surface of the wiring board.
  • a wiring board having a good thermal conductivity for example, 1 more filled with a thermal conductive filler such as aluminum nitride described above
  • the above-described LED package is fixed to a predetermined position on the layer glass epoxy substrate) using an adhesive (heat-resistant and insulating adhesive).
  • an isolated wiring pattern is provided on the wiring board, it can be fixed by soldering.
  • the space between the LED package side surface and the wiring board is filled with an insulating adhesive.
  • a pair of connection electrodes of the LED package are soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet. Heat generated from the LED chip is radiated from the LED package substrate through the wiring substrate.
  • FIGS. 9 to 13 are diagrams for explaining a fifth example of the LED module device embodying the present invention.
  • FIG. 18A is a cross-sectional view thereof
  • FIG. 18B is a diagram in which three LED packages are mounted on a wiring board. It is a top view shown in a state.
  • An LED package described above (see FIGS. 9 to 13) and a wiring board having an opening corresponding to the LED package are prepared.
  • the wiring board can be, for example, a single-layer glass epoxy board having a wiring layer on the back surface, but it is desirable that the wiring board be as thin as possible for light radiation, and a tape board such as polyimide may be used. When the wiring board is opened, the thickness of the board becomes a wall, and light hitting it becomes a loss.
  • the wiring board has a large opening area and a small connection portion with the LED package.
  • a white resist is applied to the front surface of the wiring board to obtain a reflection effect.
  • the LED package is disposed in the opening of the wiring board, and the connection electrode on the upper surface of the LED package is soldered to the wiring on the back surface of the wiring board.
  • the connection electrode penetrates from the end of the metal plate, so that the solder does not protrude from the end of the metal plate. If the connection electrode extends to the end of the metal plate, there is a high risk that the solder will bridge on the thin insulating layer.
  • the LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the LED package substrate.
  • the LED package with the wiring board attached is soldered on a heat sink (eg, copper or aluminum plate).
  • a heat sink eg, copper or aluminum plate.
  • the heat radiating plate it can be directly fixed to the housing.
  • FIG. 19A and 19B are views for explaining a sixth example of the LED module device embodying the present invention.
  • FIG. 19A is a top view of the connection configuration LED package
  • FIG. 19B is a wiring diagram of the connection configuration LED package.
  • a cross-sectional view taken along the line AA ′ in a state of being mounted on a substrate is shown.
  • the connected configuration LED package is obtained by connecting a plurality of LED packages (illustrated as four) at a connecting portion. In the connecting portion, partial cut portions are formed on both sides of the connecting portion in order to escape distortion during drawing.
  • connection structure LED package is mounted in a wiring board. As described above with reference to FIG. 14, the mounting on the wiring board is performed by filling the space between the LED package side surface and the wiring board with an insulating adhesive, and then connecting the insulating adhesive on the insulating adhesive. A pair of connection electrodes of the configuration LED package are soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet.
  • FIG. 20 is a graph showing the film thickness dependence of the LED junction temperature. The analysis was performed under the following analysis conditions. Package size: 4 mm ⁇ 4 mm, heat radiation area 1.5 mm ⁇ 1.5 mm, power consumption: 1 W, ambient temperature Ta: 60 ° C. The horizontal axis of the graph indicates the thickness of the polyimide resin layer, and the vertical axis indicates the junction temperature.
  • the LED junction temperature is desirably 120 ° C or less, and in order to realize this in a 4 mm square package, it is necessary to make the polyimide film thickness 40 ⁇ m or less. More desirably, the film thickness is 20 ⁇ m or less, and the LED junction temperature is 100 ° C. or less.
  • the insulating film on the metal substrate of the LED must satisfy the following characteristics in addition to the thermal conductivity described above.
  • (1) Insulation In order to have insulation reliability with a thin film, it is necessary that the dielectric breakdown voltage is high.
  • the standard dielectric breakdown voltage of polyimide is about 150 kV / mm, high-performance products are about 500 kV / mm, and ordinary engineering plastics are about 15 to 30 kV / mm. For this reason, as described above, it is possible to reduce the thickness to 5 ⁇ m by using high-performance polyimide.
  • (2) Heat resistance It is necessary to have solder heat resistance (260 ° C.), and it is necessary to withstand the heat generation of the LED.
  • the thermal decomposition temperature of polyimide is 500 ° C or higher and has excellent performance.
  • Thermoplastic Polyimide has thermoplasticity and thermosetting properties, but it needs to be thermoplastic polyimide to withstand deformation by press molding. (4) Mechanical strength Mechanical strength that does not crack against stress. (5) Flexibility Since polyimide is used for flexible substrates, it has excellent performance. (6) Long-term stability The above characteristics are stable without deterioration over a long period of time.
  • thermoplastic polyimide resin solution is applied onto a metal plate, for example, “Iupitite UPA-N221C” (trade name: manufactured by Ube Industries), which is a thermoplastic polyimide varnish, is made to have a solid content of 15% with tetrahydrofuran.
  • a diluted solution can be applied, and heated to dry the solvent to form a film.
  • a solution containing a polyamic acid obtained by polymerizing tetracarboxylic dianhydride and diamine in equimolar amounts as raw materials is applied, It is desirable to carry out the solvent removal treatment at a temperature not higher than the imide ring-closing temperature after heating gradually, and finally heat to 300 to 400 ° C. to close the imide and convert to polyimide.
  • Patent Document 4 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride is used as the tetracarboxylic dianhydride, and metaxylylenediamine and 1,3-bis (4- Aminophenoxy) benzene is disclosed.
  • Patent Document 5 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride is used as the tetracarboxylic dianhydride content, and 1,3- (3-aminophenoxy) benzene is used as the diamine component. , 3-bis (3-maleimidophenoxy) benzene copolymerized.
  • the coating method is not limited to this, but can be performed by a known method such as a bar coater, a roll coater, a die coater comma coater, a gravure coater, a curtain coater, or a spray coater.
  • FIG. 21A is a graph showing heat dissipation performance (thermal resistance ratio)
  • FIG. 21B is a diagram showing an LED package structure mounted on a heat sink.
  • the LED chip size is m
  • the length of the metal plate in contact with the heat sink is L.
  • the horizontal axis represents the length L (1 m to 5 m) changed to a multiple of m (and the heat radiation area squared)
  • the vertical axis represents the heat calculated.
  • the thermal conductivity of the lead frame 300 W / mk
  • the thermal conductivity of polyimide 0.5 W / mk
  • the thermal conductivity of copper foil 400 W / mk.
  • the thickness of the copper foil was 9 ⁇ m
  • the thickness of the metal plate was 125 ⁇ m
  • the thermal resistance of each member was calculated according to Fourier's law for each polyimide thickness of 5/10/30 ⁇ m.
  • the total thermal resistance is calculated for each of copper foil, polyimide, and metal plate, and is totaled.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur un dispositif de module de DEL (DEL) qui comporte un boîtier de DEL, un substrat de câblage ayant une ouverture pour monter le boîtier de DEL, et une plaque de dissipation de chaleur fixée à la surface arrière du boîtier de DEL. Le boîtier de DEL est assemblé sur le substrat de boîtier de DEL. Le substrat de boîtier de DEL est constitué par l'attachement, à l'aide d'un adhésif, d'un film stratifié qui est formé à partir d'une feuille métallique avec une résine sur une plaque métallique incurvée sous une forme prescrite de façon à avoir un creux pour monter une puce de DEL, et portant un placage en argent qui sert de matériau réfléchissant sur cette feuille métallique. Le boîtier de DEL est constitué par la puce de DEL qui est montée sur le substrat de boîtier de DEL ainsi constitué et, après la mise en œuvre d'un câblage de connexions électriques, par le remplissage avec une résine transparente.
PCT/JP2011/074050 2010-10-19 2011-10-19 Dispositif de module de del, son procédé de fabrication, boîtier de del utilisé pour dispositif de module de del et son procédé de fabrication WO2012053550A1 (fr)

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JP2010-234173 2010-10-19
JP2010234173 2010-10-19
JP2010241777 2010-10-28
JP2010-241777 2010-10-28
JP2010256634 2010-11-17
JP2010-256634 2010-11-17

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WO2015059499A3 (fr) * 2013-10-25 2015-06-18 Litecool Limited Ensemble de led, et module à led
JP2015220307A (ja) * 2014-05-16 2015-12-07 日亜化学工業株式会社 発光装置及びその製造方法
EP3116038A1 (fr) * 2015-07-06 2017-01-11 LG Electronics Inc. Module de source de lumière, procédé de fabrication de celui-ci et unité d'éclairage comprenant celui-ci
CN107087351A (zh) * 2017-06-28 2017-08-22 奇酷互联网络科技（深圳）有限公司 印刷电路板、印刷电路板的制造方法以及电子产品
CN107525025A (zh) * 2017-09-22 2017-12-29 宁波升谱光电股份有限公司 一种led封装方法和结构
JP2018174334A (ja) * 2018-06-08 2018-11-08 日亜化学工業株式会社 発光装置及びその製造方法
CN108807646A (zh) * 2018-08-28 2018-11-13 吉安市木林森光电有限公司 一种led单晶芯片支架及led灯珠
CN109343273A (zh) * 2018-11-23 2019-02-15 江苏新广联科技股份有限公司 一种大出光角Mini LED背光模组及其制作方法

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TWI559581B (zh) * 2014-12-11 2016-11-21 綠點高新科技股份有限公司 發光單元、其製造方法及發光裝置

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
WO2015059499A3 (fr) * 2013-10-25 2015-06-18 Litecool Limited Ensemble de led, et module à led
JP2015220307A (ja) * 2014-05-16 2015-12-07 日亜化学工業株式会社 発光装置及びその製造方法
EP3116038A1 (fr) * 2015-07-06 2017-01-11 LG Electronics Inc. Module de source de lumière, procédé de fabrication de celui-ci et unité d'éclairage comprenant celui-ci
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CN107525025A (zh) * 2017-09-22 2017-12-29 宁波升谱光电股份有限公司 一种led封装方法和结构
JP2018174334A (ja) * 2018-06-08 2018-11-08 日亜化学工業株式会社 発光装置及びその製造方法
CN108807646A (zh) * 2018-08-28 2018-11-13 吉安市木林森光电有限公司 一种led单晶芯片支架及led灯珠
CN109343273A (zh) * 2018-11-23 2019-02-15 江苏新广联科技股份有限公司 一种大出光角Mini LED背光模组及其制作方法

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