WO2010024359A1 - 絶縁ワイヤ - Google Patents
絶縁ワイヤ Download PDFInfo
- Publication number
- WO2010024359A1 WO2010024359A1 PCT/JP2009/065009 JP2009065009W WO2010024359A1 WO 2010024359 A1 WO2010024359 A1 WO 2010024359A1 JP 2009065009 W JP2009065009 W JP 2009065009W WO 2010024359 A1 WO2010024359 A1 WO 2010024359A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- wire
- extrusion
- enamel
- insulated wire
- Prior art date
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- 239000010410 layer Substances 0.000 claims abstract description 127
- 229920005989 resin Polymers 0.000 claims abstract description 87
- 239000011347 resin Substances 0.000 claims abstract description 87
- 210000003298 dental enamel Anatomy 0.000 claims abstract description 76
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 65
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 65
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 238000001125 extrusion Methods 0.000 claims abstract description 37
- 239000011342 resin composition Substances 0.000 claims abstract description 35
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 229920000642 polymer Polymers 0.000 claims abstract description 27
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 12
- 239000000155 melt Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 44
- 238000007765 extrusion coating Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000003963 antioxidant agent Substances 0.000 claims description 16
- 230000003078 antioxidant effect Effects 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 239000012298 atmosphere Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003112 inhibitor Substances 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 29
- 230000014759 maintenance of location Effects 0.000 description 27
- 238000012545 processing Methods 0.000 description 23
- -1 polyethylene Polymers 0.000 description 22
- 239000002904 solvent Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 14
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 12
- 230000032683 aging Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005259 measurement Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 9
- 239000002966 varnish Substances 0.000 description 9
- 238000000137 annealing Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 238000001953 recrystallisation Methods 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 229920000491 Polyphenylsulfone Polymers 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000004697 Polyetherimide Substances 0.000 description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 229910052979 sodium sulfide Inorganic materials 0.000 description 4
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 4
- 239000004711 α-olefin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 3
- 229910052977 alkali metal sulfide Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000005461 lubrication Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 2
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 2
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 2
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 229920003055 poly(ester-imide) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 238000003878 thermal aging Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- ZRMMVODKVLXCBB-UHFFFAOYSA-N 1-n-cyclohexyl-4-n-phenylbenzene-1,4-diamine Chemical compound C1CCCCC1NC(C=C1)=CC=C1NC1=CC=CC=C1 ZRMMVODKVLXCBB-UHFFFAOYSA-N 0.000 description 1
- TUYBEVLJKZQJPO-UHFFFAOYSA-N 19-(3,5-ditert-butyl-4-hydroxyphenyl)heptatriacontan-19-ylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCCCC(CCCCCCCCCCCCCCCCCC)(P(O)(O)=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 TUYBEVLJKZQJPO-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- XQMHLQCMMWBAPP-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-[2-(2,2,6,6-tetramethylpiperidin-4-yl)oxyethoxy]piperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OCCOC1CC(C)(C)NC(C)(C)C1 XQMHLQCMMWBAPP-UHFFFAOYSA-N 0.000 description 1
- IUKIOUVQRQCBOX-UHFFFAOYSA-N 2,2,6,6-tetramethyl-4-phenoxypiperidine Chemical compound C1C(C)(C)NC(C)(C)CC1OC1=CC=CC=C1 IUKIOUVQRQCBOX-UHFFFAOYSA-N 0.000 description 1
- GXURZKWLMYOCDX-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.OCC(CO)(CO)CO GXURZKWLMYOCDX-UHFFFAOYSA-N 0.000 description 1
- PNZLJNVUTPFUIE-UHFFFAOYSA-N 2,3-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]propyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)OC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 PNZLJNVUTPFUIE-UHFFFAOYSA-N 0.000 description 1
- JZODKRWQWUWGCD-UHFFFAOYSA-N 2,5-di-tert-butylbenzene-1,4-diol Chemical compound CC(C)(C)C1=CC(O)=C(C(C)(C)C)C=C1O JZODKRWQWUWGCD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FVEAIIZMVQXSQE-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-2-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-2-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=CC(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O FVEAIIZMVQXSQE-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- VZXOZSQDJJNBRC-UHFFFAOYSA-N 4-chlorobenzenethiol Chemical compound SC1=CC=C(Cl)C=C1 VZXOZSQDJJNBRC-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RWWGPCWSFFOXJN-UHFFFAOYSA-N 4-methoxy-2,2,6,6-tetramethylpiperidine Chemical compound COC1CC(C)(C)NC(C)(C)C1 RWWGPCWSFFOXJN-UHFFFAOYSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FDBMBOYIVUGUSL-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)C)C(C)(C)C Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)C)C(C)(C)C FDBMBOYIVUGUSL-UHFFFAOYSA-N 0.000 description 1
- FQBLMOIKKJWNGN-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(C1)(C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(CC(C=C1)(C(C)(C)C)C)C(C)(C)C Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(C1)(C)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(CC(C=C1)(C(C)(C)C)C)C(C)(C)C FQBLMOIKKJWNGN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- MGJNXXBZNRTWBP-UHFFFAOYSA-N P(OC1=C(C=CC=C1)C(CC)(C)C)(OC1=C(C=CC=C1)C(CC)(C)C)OC1=C(C=CC=C1)C(CC)(C)C.P(OC1=C(C=CC=C1)C(C)(C)C)(OC1=C(C=CC=C1)C(C)(C)C)OC1=C(C=CC=C1)C(C)(C)C Chemical compound P(OC1=C(C=CC=C1)C(CC)(C)C)(OC1=C(C=CC=C1)C(CC)(C)C)OC1=C(C=CC=C1)C(CC)(C)C.P(OC1=C(C=CC=C1)C(C)(C)C)(OC1=C(C=CC=C1)C(C)(C)C)OC1=C(C=CC=C1)C(C)(C)C MGJNXXBZNRTWBP-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920003295 Radel® Polymers 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 241000546339 Trioxys Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- UROGBLCMTWAODF-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) hexanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 UROGBLCMTWAODF-UHFFFAOYSA-N 0.000 description 1
- DGBLGWVHPYOSAI-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) propanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CC(=O)OC1CC(C)(C)NC(C)(C)C1 DGBLGWVHPYOSAI-UHFFFAOYSA-N 0.000 description 1
- DMXDKAQPFYMMOZ-UHFFFAOYSA-N bis(2-tert-butylphenyl) phenyl phosphite Chemical compound CC(C)(C)C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C(C)(C)C)OC1=CC=CC=C1 DMXDKAQPFYMMOZ-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- HNDAFHXJOOETRX-UHFFFAOYSA-N butane;2-tert-butyl-5-methylbenzene-1,4-diol Chemical compound CCCC.CC1=CC(O)=C(C(C)(C)C)C=C1O HNDAFHXJOOETRX-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000008733 trauma Effects 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 1
- AZSKHRTUXHLAHS-UHFFFAOYSA-N tris(2,4-di-tert-butylphenyl) phosphate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(=O)(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C AZSKHRTUXHLAHS-UHFFFAOYSA-N 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- HBYRZSMDBQVSHO-UHFFFAOYSA-N tris(2-tert-butyl-4-methylphenyl) phosphite Chemical compound CC(C)(C)C1=CC(C)=CC=C1OP(OC=1C(=CC(C)=CC=1)C(C)(C)C)OC1=CC=C(C)C=C1C(C)(C)C HBYRZSMDBQVSHO-UHFFFAOYSA-N 0.000 description 1
- JIKOHGNZNKFYHF-UHFFFAOYSA-N tris(2-tert-butyl-4-phenylphenyl) phosphite Chemical compound CC(C)(C)C1=CC(C=2C=CC=CC=2)=CC=C1OP(OC=1C(=CC(=CC=1)C=1C=CC=CC=1)C(C)(C)C)OC(C(=C1)C(C)(C)C)=CC=C1C1=CC=CC=C1 JIKOHGNZNKFYHF-UHFFFAOYSA-N 0.000 description 1
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 1
- ZMPODEGAECKFEA-UHFFFAOYSA-N tris[2,4-bis(2-methylbutan-2-yl)phenyl] phosphite Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)CC)C(C)(C)CC)OC1=CC=C(C(C)(C)CC)C=C1C(C)(C)CC ZMPODEGAECKFEA-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D181/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Coating compositions based on polysulfones; Coating compositions based on derivatives of such polymers
- C09D181/02—Polythioethers; Polythioether-ethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/308—Wires with resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49009—Dynamoelectric machine
Definitions
- the present invention relates to an insulated wire, and more particularly to an insulated surge-insulated wire with enhanced insulation and an insulated wire for the purpose of omitting core insulation.
- Inverters are becoming an efficient variable speed control device that can be attached to many electrical devices.
- the inverter is switched at several kHz to several tens of kHz, and a surge voltage is generated for each pulse.
- Inverter surge is a phenomenon in which reflection occurs at a discontinuous point of impedance in the propagation system, for example, at the start and end of a connected wiring, and as a result, a voltage twice as large as the inverter output voltage is applied.
- an output pulse generated by a high-speed switching element such as an IGBT has a high voltage agility, so that even if the connection cable is short, the surge voltage is high, and furthermore, the voltage attenuation by the connection cable is also small. A voltage nearly doubled is generated.
- Insulator-related equipment for example, high-speed switching elements, rotating electrical machines driven by inverters, coils of electrical equipment such as transformers, etc., insulated wires, mainly enameled wires, are used as magnet wires.
- inverter-related equipment a voltage nearly twice as high as the inverter output voltage is applied, so that it is possible to minimize inverter surge deterioration of enameled wire, which is one of the materials constituting these electrical equipment coils. It is becoming required.
- partial discharge deterioration includes degradation of molecular chains caused by collision of charged particles generated by the partial discharge of an electrically insulating material, sputtering deterioration, thermal melting or thermal decomposition deterioration due to local temperature rise, chemical deterioration due to ozone generated by discharge, etc. Is a complicated phenomenon. For this reason, it can be seen that the thickness of the electrically insulating material deteriorated by the actual partial discharge is reduced.
- the inverter surge deterioration of the insulated wire proceeds by the same mechanism as general partial discharge deterioration.
- the inverter surge degradation of enameled wire is a phenomenon in which partial discharge occurs in the insulated wire due to high surge voltage generated by the inverter, and the coating of the insulated wire causes partial discharge degradation due to the partial discharge, that is, high frequency partial discharge. It is deterioration.
- the partial discharge generation voltage In recent electric equipment, an insulated wire capable of withstanding a surge voltage of 500V has been demanded. That is, the partial discharge generation voltage needs to be 500 V or more.
- the partial discharge generation voltage is a value measured by a device called a commercially available partial discharge tester. The measurement temperature, the frequency of the AC voltage used, the measurement sensitivity, etc. are changed as necessary. The above values are measured at 25 ° C., 50 Hz, 10 pC, and the effective value of the voltage at which partial discharge occurs. It is.
- the most severe situation when used as a magnet wire is assumed, and a method of producing a sample shape that can be observed between two insulating wires that are in close contact is used.
- a method of producing a sample shape that can be observed between two insulating wires that are in close contact is used.
- two insulating wires are spirally twisted to make line contact, and a voltage is applied between the two.
- the long surfaces of two insulating wires are brought into surface contact with each other, and a voltage is applied between the two.
- a resin having a low relative dielectric constant is used for the enamel layer.
- a method of increasing the thickness of the enamel layer is used for the enamel layer.
- most commonly used resin varnish resins have a relative dielectric constant between 3 and 4, and there is no specific dielectric constant that is low, and there are other requirements for enamel layers.
- the thickness of the enamel layer is required to be 60 ⁇ m or more from experience in order to set the partial discharge generation voltage to a target of 500 V or more.
- the number of times of passing through a baking furnace in the manufacturing process is increased, and the thickness of the coating made of copper oxide on the copper surface, which is the conductor, grows.
- the adhesive strength of the is reduced.
- the number of passes through the baking furnace exceeds 10 times. It has been found that the adhesive strength between the conductor and the enamel layer is extremely reduced when the number of times exceeds 10 times.
- there is a method to increase the thickness that can be applied by one baking so as not to increase the number of times of passing through the baking furnace, but in this method, the solvent of the varnish cannot be completely evaporated and bubbles are formed in the enamel layer.
- Patent Documents 1 to 3 and the like are conventional techniques in which an extrusion coating layer is provided on an enamel layer, and these include the enamel layer and the enamel layer from the viewpoint of achieving both a partial discharge generation voltage and the adhesion between the conductor and the enamel layer. The thickness configuration of the extrusion coating was not satisfactory.
- insulation wires such as enameled wires used as magnet wires for space electrical equipment, aircraft electrical equipment, nuclear electrical equipment, energy electrical equipment, and automotive electrical equipment have excellent wear resistance.
- heat aging characteristics and solvent resistance have been demanded.
- the characteristics of the insulation film necessary for coiling motor rotating electrical machines and transformer transformers include the processing performance of the film. This is because, in the coil processing step described above, if the wire coating is damaged, the electrical insulation performance is lowered.
- a method for imparting this processing resistance to the wire coating This can be achieved by applying lubricity to the film to reduce the coefficient of friction and reducing the damage caused by coil processing, or by improving the adhesion between the film and the electrical conductor to prevent the film from peeling off the conductor. For example, the insulation performance can be maintained.
- the former method of imparting lubrication performance is to apply a lubricant such as wax to the surface of the wire, or to add a lubricant to the insulation film and bleed out the lubricant to the surface of the wire when manufacturing the wire.
- a method of imparting lubrication performance has been adopted in the past, and there are many examples. However, since this method of imparting lubrication performance does not improve the strength of the electric wire film itself, it seems to be effective against the cause of trauma, but the effect is actually limited.
- Patent Document 4 wax, oil, surfactant, solid lubricant, etc.
- Patent Document 5 it is possible to apply and bake a lubricant that is emulsified in water and a resin that can be emulsified in water and solidified by heating.
- a lubricant that is emulsified in water and a resin that can be emulsified in water and solidified by heating.
- the above method is considered to improve the surface lubricity of the insulated wire, and as a result, to protect the insulating layer from damage by the surface slippage of the wire.
- Patent Document 7 As means for solving these problems, means described in Patent Document 7 has been proposed.
- the invention having the following configuration is described.
- the extrusion-coated resin layer is made of a resin material having a tensile elastic modulus at 25 ° C. of 1000 MPa or more and a tensile elastic modulus at 250 ° C.
- Insulated wire according to item (4) An insulated wire having at least one enamel-baked layer on the outer periphery of a conductor having a rectangular cross section and at least one extrusion-coated resin layer on the outer side thereof, and a pair of opposing 2 in the cross section Any one of (1) to (3), wherein the thickness of the extrusion-coated resin layer provided on the side is different from the thickness of the extrusion-coated resin layer provided on the other two opposite sides.
- Insulated wire according to item (5) An adhesive layer is provided between the enamel baked layer and the extrusion-coated resin layer, and the adhesive force between the enamel baked layer and the extrusion-coated resin layer is reinforced using the adhesive layer as a medium.
- the insulated wire according to any one of (1) to (4), and (6) On the outer periphery of the enamel baking layer, a varnished resin is baked to form an adhesive layer, which is then contacted with an extrusion coating resin that is in a molten state at a temperature higher than the glass transition temperature of the resin.
- Patent Document 7 describes the following contents as the object of the invention.
- An object of the present invention is to provide an insulated wire having a high partial discharge generation voltage.
- Another object of the present invention is to provide an insulating wire capable of realizing the thickening of the insulating layer for increasing the partial discharge generation voltage without lowering the adhesive strength between the conductor of the insulating wire and the enamel layer.
- Another object of the present invention is to provide an insulated wire that satisfies the requirements for the wear resistance, heat aging characteristics, and solvent resistance required for an insulated wire.
- Another object of the present invention is to provide an insulated wire capable of increasing the space factor without lowering the partial discharge generation voltage.
- the insulated wire of the present invention satisfies both the “partial discharge generation voltage” and the “conductor / enamel layer adhesive strength”, and the inverter surge deterioration is less likely to occur. Further, when the thickness of the enamel layer is 50 ⁇ m or less, the number of times of passing through the baking furnace can be reduced, and the adhesive force between the conductor and the enamel layer can be prevented from being extremely reduced. Further, when the extrusion-coated resin layer is made of a resin material having a tensile elastic modulus at 25 ° C. of 1000 MPa or more and a tensile elastic modulus at 250 ° C. of 10 MPa or more, wear resistance, heat aging characteristics, solvent resistance It is also excellent in properties.
- the insulated wire of the said invention has a small coefficient of static friction, and its insertability when processed as a coil of a rotating electrical machine is also good.
- production of the above wrinkles can be prevented by introduce
- an varnished resin is baked on the outer periphery of the enamel baking layer to form an adhesive layer, and then an extruded coating resin in a molten state at a temperature higher than the glass transition temperature of the resin used in the adhesive layer;
- the insulated wire of the said invention can be manufactured suitably by making it contact and heat-sealing an enamel baking layer and an extrusion coating resin layer.
- the strain applied to the insulating film of the wire during processing is not limited.
- the processing forms applied to wires have become harsher due to the downsizing and higher efficiency of rotating electrical machines, as well as those with large conductor diameters and those with thick insulation films on wires.
- the strain applied to the insulating film locally increases and the insulating film may break after processing.
- the superiority and inferiority appear significantly after heat cycle after processing.
- Insulation performance retention after heat aging (heat resistance)
- heat resistance In various fields where rotating electrical machines are used, there are many cases where the working voltage is increasing due to the high efficiency of rotating electrical machines, and there are many cases where heat dissipation is not sufficiently secured due to downsizing. Similarly, the heat resistance requirement for magnet wires is also increasing. In particular, sufficient insulation performance is required for coatings even after being instantaneously and intermittently exposed to higher temperatures than designed.
- JP 59-040409 A Japanese Patent No. 1998680 (Japanese Patent Publication No. 7-031944) JP-A 63-195913 JP-A-61-269808 JP-A-62-200605 JP 63-29412 A JP 2005-203334 A
- the enamel baking layer has a thickness of 50 ⁇ m or less;
- the extrusion coating resin layer contains a polyphenylene sulfide (hereinafter also referred to as “PPS”) polymer having a melt viscosity at 300 ° C. of 100 Pa ⁇ s or more, 2 to 8% by mass of a thermoplastic elastomer, and an antioxidant.
- PPS polyphenylene sulfide
- An anti-inverter surge-insulating wire characterized by comprising a polyphenylene sulfide resin composition having a tensile elastic modulus at 25 ° C. of 2500 MPa or more and a tensile elastic modulus at 250 ° C. of 10 MPa or more, (2)
- the polyphenylene sulfide resin composition has a tensile elongation at break of 15% or more at 25 ° C. and a tensile elongation at break of 25 ° C. after exposure at 200 ° C. for 100 hours in an atmosphere of 5% or more.
- Inverter surge-insulated wire as described in (1), (3) The non-Newtonian index of the polyphenylene sulfide polymer is 1.1 or less, (1) or (2) the inverter surge insulation wire according to item, and (4) Using the insulated wire of (1) in which the polyphenylene sulfide resin composition of the extrusion-coated resin layer is not crystallized, the armature of the rotating electric machine with wire deformation processing is assembled, A method of manufacturing a rotating electrical machine, comprising a step of crystallizing a polyphenylene sulfide resin of an insulated wire by heating the insulated wire to 120 ° C. or higher.
- the inverter surge insulation wire of the present invention has a high partial discharge generation voltage, film abrasion resistance, solvent resistance, insulation performance retention of the processed part, film shape retention of the processed part, and insulation performance after thermal aging It can be set as the wire excellent in the retainability.
- the motor manufacturing method of the present invention can reduce the stress applied to the insulating film of the wire at the time of forming the wire, and further improve the performance of the film such as thermal, mechanical and chemical by crystallizing after the assembly process. Can be made.
- One embodiment of the present invention has at least one enamel baked layer on the outer periphery of the conductor and at least one extruded coated resin layer on the outer side thereof, and is between the enamel baked layer and the extruded coated resin layer.
- a wire having an adhesive layer, and using the adhesive layer as a medium and having enhanced adhesive strength between the enamel baked layer and the extrusion-coated resin layer, the thickness of the enamel baked layer, the extrusion-coated resin layer, and the adhesive layer The total thickness is 60 ⁇ m or more, the thickness of the enamel baked layer is 50 ⁇ m or less, and the extrusion-coated resin layer comprises 2 to 8 PPS polymer having a melt viscosity at 300 ° C.
- the insulated wire of the present invention is suitable for heat-resistant windings, for example, inverter-related equipment, high-speed switching elements, rotating electric motors driven by inverters, electrical equipment coils such as transformers, space electrical equipment, aircraft It can be used for a magnetic wire for electrical equipment for nuclear power, electrical equipment for nuclear power, electrical equipment for energy, electrical equipment for automobiles, and the like.
- the oxygen content is low oxygen copper of 30 ppm or less, more preferably 20 ppm or less. Or an oxygen-free copper conductor. If the oxygen content is 30 ppm or less, when the conductor is melted with heat to prevent welding, voids due to oxygen contained in the welded portion are not generated, and the electrical resistance of the welded portion is prevented from deteriorating. The strength of the welded portion can be maintained. Further, the conductor having a desired cross-sectional shape can be used, but a conductor having a shape other than a circle is preferably used, and a rectangular shape is particularly preferable.
- the shape has chamfers (radius r) at the four corners.
- the size of the conductor is not particularly limited, but in the case of a rectangular conductor, the thickness is preferably 0.1 to 3.0 mm and the width is 0.5 to 15 mm.
- the enamel baking layer (hereinafter also simply referred to as “enamel layer”) is formed by applying and baking a resin varnish on a conductor a plurality of times.
- the method of applying the resin varnish may be a conventional method.
- a method of using a varnish application die having a similar conductor shape, or a “universal die formed in a cross-beam shape if the conductor cross-sectional shape is a quadrangle” Can be used.
- the conductors coated with these resin varnishes are baked in a baking furnace in the usual manner.
- the specific baking conditions depend on the shape of the furnace used, but for a natural convection type vertical furnace of about 5 m, the passage time is set to 10 to 90 seconds at 400 to 500 ° C. Can be achieved.
- enamel resin for forming the enamel layer those conventionally used can be used, for example, polyimide, polyamideimide, polyesterimide, polyetherimide, polyimide hydantoin-modified polyester, polyamide, formal, polyurethane, polyester, Polyvinyl formal, epoxy, and polyhydantoin are mentioned, and polyimide resins such as polyimide, polyamideimide, polyesterimide, polyetherimide, and polyimide hydantoin-modified polyester that are excellent in heat resistance are preferable. Moreover, these may be used individually by 1 type, and may mix and use 2 or more types.
- the thickness of the enamel layer is 50 ⁇ m or less, preferably 40 ⁇ m or less, in order to reduce the number of passes through the baking furnace and prevent the adhesive force between the conductor and the enamel layer from being extremely lowered. Moreover, in order not to impair the withstand voltage characteristics and the heat resistance characteristics, which are characteristics necessary for an enameled wire as an insulating wire, it is preferable that the enamel layer has a certain thickness.
- the lower limit thickness of the enamel layer is not particularly limited as long as it does not cause pinholes, and is preferably 3 ⁇ m or more, more preferably 6 ⁇ m or more.
- the enamel layer may be a single layer or a plurality of layers.
- the extrusion-coated resin layer contains a PPS polymer having a melt viscosity of 100 Pa ⁇ s or more at 300 ° C., 2 to 8% by mass of a thermoplastic elastomer, and an antioxidant, and has a tensile strength at 25 ° C. It consists of a PPS resin composition having an elastic modulus of 2500 MPa or more and a tensile elastic modulus at 250 ° C. of 10 MPa or more.
- the tensile elasticity modulus in 25 degreeC of a PPS resin composition is 2800 Mpa or more. Moreover, it is preferable that the tensile elasticity modulus in 250 degreeC is 180 Mpa or more.
- the tensile elongation at break of the PPS resin composition at 25 ° C. is preferably 15% or more, and more preferably 18% or more. Further, the tensile elongation at break at 25 ° C. after exposure in the atmosphere at 200 ° C. for 100 hours is preferably 5% or more, more preferably 6% or more.
- the tensile elastic modulus means a value measured using an ASTM No. 4 dumbbell according to ASTM D-638.
- the tensile elongation at break means a value measured using ASTM No. 4 dumbbell according to ASTM D-638.
- the PPS polymer used in the present invention has a resin structure having a structure in which an aromatic ring and a sulfur atom are bonded as a repeating unit, and preferably has a structure represented by the following structural formula (1) or (2) A resin having a site as a repeating unit.
- Examples include those bonded at the para position represented by the structural formula (1) and those bonded at the meta position represented by the structural formula (2).
- the bonding of the sulfur atom to the aromatic ring in the repeating unit Is preferably a structure bonded at the para-position represented by the structural formula (1) in terms of heat resistance and crystallinity.
- the melt viscosity at 300 ° C. of the PPS polymer used in the present invention is preferably in the range of 100 Pa ⁇ s or more, since the improvement in toughness to prevent cracking during the processing of insulated wires is significant. Further, it is preferably 2,000 Pa ⁇ s or less because of good fluidity during extrusion molding. Among these, the range of 200 to 1,000 Pa ⁇ s is particularly preferable from the viewpoint of the balance between these performances.
- the melt viscosity is a value measured using a cavity rheometer, measured at 300 ° C., a shear rate of 100 sec ⁇ 1 , a nozzle hole diameter of 0.5 mm, and a length of 1.0 mm.
- the non-Newtonian index of the PPS polymer is preferably 1.1 or less, and more preferably 1.05 or less.
- the non-Newtonian index exceeds 1.1, the reduction in tensile elongation at 200 ° C. for 100 hours becomes significant.
- the non-Newton index means that the PPS polymer is sheared at a shear rate of 100 to 1000 (sec ⁇ 1 ) using a capillary rheometer and a die having a diameter of 1 mm and a length of 40 mm under a condition of a temperature of 300 ° C. This is a value calculated from the slopes of logarithm plots obtained by measuring stress.
- the method for producing the PPS polymer is not particularly limited, and for example, it can be produced by the following methods 1 to 5.
- Method 1 A method of polymerizing polyhalogen aromatic compounds in the presence of sulfur and sodium carbonate.
- Method 2 A method of polymerizing dihalogen aromatic compounds in a polar solvent in the presence of a sulfidizing agent.
- Method 2 A method of self-condensing P-chlorothiophenol.
- Method 3 N-methylpyrrolidone and polyhalogenoaromatic compound are mixed and heated, and the water-containing sulfidizing agent is added at such a rate that the water content in the reaction system falls within the range of 2 to 50 mol% of the organic polar solvent.
- Method 4 During the reaction between the alkali metal sulfide and the polyhalogenoaromatic compound in N-methylpyrrolidone, a part of the gas phase in the reaction vessel is condensed by cooling the gas phase portion of the reaction vessel, A process for producing a PPS polymer by refluxing the phase;
- Method 5 N-methylpyrrolidone, a non-hydrolyzable organic solvent, and a hydrous alkali metal sulfide are mixed, and then the obtained mixed solution is dehydrated to obtain a solid alkali metal sulfide and an alkali metal hydrosulfide ( b) and an alkali metal salt of a hydrolyzate of N-methylpyrrolidone (Step 1), and then, in the presence of the slurry, a polyhalogenoaromatic compound, the alkali metal hydrosulfide, and the Poly
- Method 3 Method 4, and Method 5 are particularly preferable because a linear high molecular weight PPS polymer can be easily obtained.
- thermoplastic elastomer a polyolefin-based elastomer having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a mercapto group, an epoxy group, an acid anhydride group, an isocyanate group, an ester group, or a vinyl group is compatible with the PPS polymer. From the point which is excellent in it.
- those having a functional group or an epoxy group derived from a carboxylic acid such as an acid anhydride, an acid, or an ester are particularly preferable.
- the polyolefin elastomer can be obtained, for example, by copolymerization of ⁇ -olefins and vinyl polymerizable compounds having the functional group.
- ⁇ -olefins include ⁇ -olefins having 2 to 8 carbon atoms such as ethylene, propylene, and butene.
- vinyl polymerizable compounds having the functional group examples include ⁇ , ⁇ -unsaturated carboxylic acids such as acrylic acid, methacrylic acid, acrylic acid esters, and methacrylic acid esters, and alkyl esters thereof, maleic acid, Fumaric acid, itaconic acid, other unsaturated dicarboxylic acids having 4 to 10 carbon atoms, mono- and diesters thereof, and ⁇ , ⁇ -unsaturated dicarboxylic acids such as anhydrides thereof, anhydrides thereof, glycidyl (meth) acrylate, etc. Is mentioned.
- a copolymer containing a plurality of these functional groups at the same time can be used.
- Preferable examples of these include terpolymers of ⁇ -olefins, maleic anhydride, and glycidyl acrylate.
- thermoplastic elastomer containing these functional groups has good dispersibility with the PPS polymer, makes it easy to obtain a uniformly mixed resin composition, and improves the processing characteristics of the insulated wire.
- thermoplastic elastomer The blending ratio of such a thermoplastic elastomer is 2 to 8% by mass in the PPS resin composition. By being in this range, the balance between scratch resistance and workability is excellent.
- the blending ratio of the thermoplastic elastomer is preferably 3 to 7% by mass in the PPS resin composition.
- the antioxidant used in the present invention is effective in preventing cracking of the resin coating layer after heat treatment at 200 ° C.
- Preferred examples of the antioxidant include phenolic (such as hindered phenols), amine (such as hindered amines), phosphorus, sulfur, hydroquinone, and quinoline antioxidants.
- Phenol antioxidants include hindered phenols such as 2,2′-methylenebis (4-methyl-6-tert-butylphenol), 4,4′-methylenebis (2,6-di-tert-butylphenol). 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 2,6-di-tert-butyl-p-cresol, 1,3,5-trimethyl-2,4,6-tris (3 , 5-di-t-butyl-4-hydroxybenzyl) benzene, 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], pentaerythritol tetrakis [ 3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3- (3-t-butyl-5-methyl- -Hydroxyphenyl) propionate], n-oc
- C 2-10 alkylenediol-bis such as, for example, 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate].
- Amine-based antioxidants include hindered amines such as tri- or tetra-C 1-3 alkylpiperidine or derivatives thereof [eg 4-methoxy-2,2,6,6-tetramethylpiperidine, 4-benzoyloxy-2 , 2,6,6-tetramethylpiperidine, 4-phenoxy-2,2,6,6-tetramethylpiperidine, etc.], bis (tri, tetra or penta C 1-3 alkylpiperidine) C 2-20 alkylene dicarboxylic acid Esters [eg bis (2,2,6,6-tetramethyl-4-piperidyl) ogisalate, bis (2,2,6,6-tetramethyl-4-piperidyl) malonate, bis (2,2,6, 6-tetramethyl-4-piperidyl) adipate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis ( , 2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (2
- phosphorus stabilizers examples include triisodecyl phosphite, trisnonyl phenyl phosphite, diphenyl isodecyl phosphite, phenyl diisodecyl phosphite, 2,2-methylenebis (4,6-di-t-butylphenyl) octyl.
- hydroquinone antioxidant examples include 2,5-di-t-butylhydroquinone
- examples of the quinoline antioxidant include 6-ethoxy-2,2,4-trimethyl-1,2. -Dihydroquinoline and the like
- sulfur antioxidants include, for example, dilauryl thiodipropionate, distearyl thiodipropionate and the like.
- antioxidants can be used alone or in combination of two or more.
- the blending amount of the antioxidant is 0.05 to 2% by mass in the PPS resin composition of the present invention, since the effect of suppressing the decrease in tensile break elongation at 200 ° C. for 100 hours becomes remarkable.
- the content is 0.1 to 1% by mass.
- the thickness of the extrusion-coated resin layer can be set to a thickness corresponding to a necessary partial discharge generation voltage, preferably 10 ⁇ m or more, and more preferably 20 ⁇ m or more.
- the upper limit of the thickness of the extrusion-coated resin layer is not particularly limited, and is preferably 200 ⁇ m or less, more preferably 160 ⁇ m or less.
- the extrusion coating resin layer may be a single layer or a plurality of layers.
- the insulated wire of the present invention has an adhesive layer between the enamel baked layer and the extrusion-coated resin layer, and uses the adhesive layer as a medium to reinforce the adhesive force between the enamel baked layer and the extrusion-coated resin layer. It is.
- the insulated wire of the present invention is, for example, baked varnished thermoplastic resin on the outermost periphery of the enamel baked layer to form an adhesive layer, and in the subsequent extrusion process coating step, the adhesive layer and the adhesive layer resin It can be manufactured by bringing an extrusion coating resin melted at a temperature higher than the glass transition temperature into contact with each other and thermally fusing both.
- the adhesive layer may be any resin as long as it can be heat-sealed. However, it is preferably an amorphous resin that is easily dissolved in a solvent because it is used as a varnish. Furthermore, in order not to lower the heat resistance as the insulated wire, a resin having excellent heat resistance is preferable. In view of these, preferred resins include polysulfone (PSU), polyethersulfone (PES), polyetherimide (PEI), polyphenylsulfone (PPSU), polyamideimide (PAI), polyimide (PI), and epoxy. Resins and the like are mentioned, and PES and PPSU are more preferable.
- the solvent used for varnishing may be any solvent that can dissolve the selected resin. However, in order to improve the adhesiveness with the enamel layer that is the base when baking to the enamel layer, the base is used. The same solvent used when baking the enamel layer is preferred.
- the thickness of the adhesive layer is preferably 2 to 20 ⁇ m, more preferably 5 to 10 ⁇ m.
- the resin temperature in the extrusion coating process needs to be equal to or higher than the Tg (glass transition temperature) of the resin selected for the adhesive layer, preferably from Tg Also, a temperature higher by 30 ° C. or higher, more preferably a temperature higher by 50 ° C. or higher than Tg is preferable.
- the total thickness of the enamel baked layer, the extrusion-coated resin layer, and the adhesive layer (adhesive layer) is 60 ⁇ m or more, preferably 70 to 200 ⁇ m.
- Another embodiment of the present invention is an assembly of an armature for a rotating electrical machine with wire deformation using the above-described insulated wire of the present invention in which the PPS resin composition of the extrusion-coated resin layer is not crystallized.
- a method of manufacturing a rotating electrical machine having a step of crystallizing a PPS resin composition of an insulated wire by heating the heated insulated wire to 120 ° C. or higher after completion of assembly.
- the stress applied to the insulating film of the wire at the time of forming the wire can be reduced, and further, the thermal, mechanical and chemical performances of the film can be improved by crystallizing after the assembling process.
- transformation process of said wire can be performed by a conventional method.
- the crystallinity of the PPS resin composition is defined by the following formula based on DSC measurement.
- (Crystallinity) (1 ⁇ CT / MP) ⁇ 100 (%)
- CT Recrystallization calorific value (J / g) in DSC measurement
- MP melting endotherm in DSC measurement (J / g)
- the temperature was increased from 40 ° C. to 330 ° C. at 20 ° C./min in a nitrogen atmosphere.
- the wire processing in the manufacturing method of the motor of the present invention is performed in a state where the PPS resin composition is not crystallized, but in the state of not crystallized in the present invention, the crystallinity is 85% or less, In this case, since the toughness of the PPS resin composition is improved, stress applied during wire processing can be reduced. This works in an advantageous direction with respect to the film shape retention that is a problem in the present invention, and has an effect of preventing breakage of the insulating film after processing. Further, preferably, by maintaining the crystallinity at 40% or more, it is possible to prevent the PPS resin from becoming too soft, which is in an advantageous direction with respect to the insulation performance retention that is the subject of the present invention. work. That is, it is possible to prevent compression marks from being formed on the film by bending using an addressing jig as a fulcrum, and there is an effect of preventing a local decrease in the thickness of the insulating layer.
- the crystallinity of the PPS resin composition can be improved by applying a temperature higher than the recrystallization temperature.
- a preferable temperature for recrystallization includes 120 ° C. or higher. More preferably, it is 150 degreeC or more.
- the crystallinity after crystallization is preferably 90% or more, more preferably 95% or more.
- Dehydration is performed during the dropping reaction, paradichlorobenzene co-evaporated is returned to the reaction tank, and water is discharged out of the system so that the amount of water in the system is 0.02 to 0.5 mol per 1 mol of N-methylpyrrolidone.
- the reaction was carried out with adjustment. The reaction was carried out until the temperature reached 240 ° C. by heating, and then the reaction was terminated by maintaining at 240 ° C. for 1 hour.
- Production Example 2 In Production Example 1, (1) water-containing flaky sodium sulfide 1.6 kg, (2) water-containing flaky sodium hydrosulfide 0.185 kg, 300 ° C. melt viscosity of 80 Pa ⁇ s, non-Newtonian index 1.02 PPS polymer PPS-2 was obtained.
- Production Example 3 The PPS-2 obtained in Production Example 2 is heat-treated at 220 ° C. for 48 hours in an air atmosphere to obtain a PPS polymer PPS-3 having a melt viscosity at 300 ° C. of 1,000 Pa ⁇ s and a non-Newton index of 1.18. It was.
- PPS-1 to 3 PPS-1 to 3 manufactured in the above Preparation Examples 1 to 3
- ELA Maleic anhydride-modified ethylene / propylene copolymer (Tafmer MH-7020 (trade name) manufactured by Mitsui Chemicals, Inc.)
- ANTOXD phenolic antioxidant ("Irganox 1010" (trade name) manufactured by Ciba Specialty Chemicals)
- an enamel die similar in shape to the cross-sectional shape of the conductor was used to coat the polyamide imide resin varnish (trade name HI406 manufactured by Hitachi Chemical Co., Ltd.) on the conductor, and the furnace length set at 450 ° C.
- An 8 m baking furnace was passed at a speed that would result in a baking time of 15 seconds, and an enamel having a thickness of 5 ⁇ m was formed in this single baking process.
- an enamel layer having a thickness of 40 ⁇ m was formed, and an enameled wire having a thickness of 40 ⁇ m was obtained.
- polyphenylsulfone resin PPSU
- NMP N-methyl-2-pyrrolidone
- a resin varnish made into a 20 wt% solution was similar to the shape of the conductor.
- the enameled wire was coated and passed through a baking furnace with a furnace length of 8 m set at 450 ° C. at a speed that would result in a baking time of 15 seconds, and this was repeated twice to achieve a thickness of 5 ⁇ m.
- An adhesive layer was formed (the thickness formed in one baking process was 2.5 ⁇ m).
- the thickness of the PPS resin A-1 shown in Table 1 is 115 ⁇ m, and the adhesive layer and the PPS An insulating wire was produced by extrusion coating so that the total thickness of the layers was 120 ⁇ m.
- Extrusion temperature conditions were performed according to Table 2.
- it cooled with water and the crystallinity degree of the PPS resin composition was 40%.
- Example 2 to 5 and Comparative Examples 1 to 4 In the same manner as in Example 1, Examples 2 to 5 using PPS resin compositions A-2 to A-5 and Comparative Examples 1 to 4 using PPS resin compositions B-1 to B-4 were used. An insulated wire was produced.
- Partial discharge generation voltage For the measurement of the partial discharge generation voltage, a partial discharge tester “KPD1050” manufactured by Kikusui Electronics Corporation was used. A sample was prepared in which insulating wires having a square cross-sectional shape were brought into close contact with each other over a length of 150 mm so that there would be no gap between the long surfaces of the two insulating wires. An electrode was connected between the two conductors, and the voltage was continuously increased while applying an AC voltage of 50 Hz at a temperature of 25 ° C., and the voltage at the time when a partial discharge of 10 pC occurred was read as an actual value.
- Abrasion resistance (25 ° C) Abrasion resistance is measured according to JIS C 3003 enamel wire test method. Similar to the wear resistance (round line), measurements were made on the four corners of the flat wire. 2,000 g or more was accepted.
- solvent resistance The solvent resistance is measured according to JIS C 3003 enamel wire test method, 7. What was wound according to flexibility was immersed in a solvent for 10 seconds, and the surface of the enamel layer or the extrusion-coated resin layer was visually checked for cracks and crazing.
- As the solvent three types of acetone, xylene, and styrene were used, and the temperature was measured at two levels of normal temperature and 150 ° C. (the sample was immersed in the solvent in a hot state after being heated at 150 ° C. for 30 minutes). Those with no abnormalities were accepted.
- the wire was exposed to an air atmosphere at 200 ° C. for 100 hours. Thereafter, a conductive paste was applied to the entire circumferential direction over a length direction of 20 mm of the wire. A voltage of 50 Hz was applied between the conductor and the conductive paste, and the breakdown voltage was measured. A case where the breakdown voltage was 70% or more of the value before exposure was regarded as acceptable.
- Example 6 A motor was manufactured by assembling a motor using the wire of Example 1 (crystallinity 40%), and annealing the polyphenylene sulfide resin of the insulating wire by annealing at 150 ° C. for 1 hour after the assembly was completed.
- Example 5 A motor was manufactured in the same manner as in Example 6 except that the annealing temperature after assembly was 110 ° C.
- Example 6 A motor was manufactured in the same manner as in Example 6 except that the wire line produced in Example 1 was previously annealed at 150 ° C. for 1 hour to change the crystallinity of PPS to 90%.
- each insulating film is the same as in Patent Document 7, and as a result, satisfactory results are obtained with respect to the partial discharge start voltage.
- the 25 ° C. tensile modulus and the 250 ° C. tensile modulus are the same as those in Patent Document 7, satisfactory results are obtained with respect to wear resistance and solvent resistance.
- Examples 1 to 4 contain a polyphenylene sulfide polymer having a melt viscosity at 300 ° C. of 100 Pa ⁇ s or more, 2 to 8% by mass of a thermoplastic elastomer, an antioxidant, and 1) 25 ° C. 2) Tensile rupture elongation at 25 ° C. after exposure to the atmosphere at 200 ° C.
- Non-Newton index is 1.1 or less It is.
- the non-Newtonian index is larger than 1.1, and the tensile breaking elongation at 25 ° C. after exposure at 200 ° C. for 100 hours in air is less than 5%.
- Comparative Example 1 has a melt viscosity at 300 ° C.
- thermoplastic elastomer content is more than 8%, so that satisfactory results are not obtained in the insulation performance retention of the processed part.
- no antioxidant was added, and the tensile elongation at break at 25 ° C. after exposure in the atmosphere at 200 ° C. for 100 hours was less than 5%, so that the insulation performance retention after heat aging was satisfactory. Is not obtained.
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Abstract
Description
また、焼き付け炉を通す回数を増やさないために、1回の焼き付けで塗布できる厚さを厚くする方法もあるが、この方法では、ワニスの溶媒が蒸発しきれずに、エナメル層の中に気泡として残るという欠点があった。
エナメル線の外側に被覆樹脂を設けることで、特性上の付加価値(部分放電発生電圧以外の特性)を与えるという試みはこれまでにもなされてきた。エナメル層に押出被覆層を設ける構成での従来技術としては、特許文献1~3等があるが、これらは部分放電発生電圧と導体とエナメル層の密着性を両立させるという観点からはエナメル層や押出被覆の厚さ構成において満足なものではなかった。
前者の潤滑性能を付与させる方法は、電線の表面にワックスなどの潤滑剤を塗布する方法や絶縁皮膜中に潤滑剤を添加して、電線の製造時にその潤滑剤を電線表面にブリードアウトさせて潤滑性能を付与させる方法が旧来採られており、その実施例は多い。しかしながら、この潤滑性能を付与させる方法は、電線皮膜自体の強度を向上させる訳ではないので、外傷要因に対しては効果があるように見えるが、実際にはその効果には限界があった。
これらの自己潤滑成分は、その潤滑成分によって自己潤滑性能(摩擦係数)の向上は見られるが、耐加工性に起因する往復摩耗などの特性向上は見られない。また、ポリエチレンやポリテトラフルオロエチレンなどの多くの自己潤滑成分が絶縁塗料との比重の差によって、絶縁塗料中で分離してしまい、これらの塗料を使用する時に細心の注意が必要であった。
(1)導体の外周に、少なくとも1層のエナメル焼き付け層と、その外側に少なくとも1層の押出被覆樹脂層を有し、該エナメル焼き付け層と該押出被覆樹脂層の厚さの合計が60μm以上であることを特徴とする絶縁ワイヤ、
(2)前記エナメル焼き付け層の厚さが50μm以下であることを特徴とする(1)項記載の絶縁ワイヤ、
(3)前記押出被覆樹脂層が、25℃における引張弾性率が1000MPa以上であり、かつ250℃における引張弾性率が10MPa以上である樹脂材料からなることを特徴とする(1)または(2)項記載の絶縁ワイヤ、
(4)断面が矩形状である導体の外周に、少なくとも1層のエナメル焼き付け層と、その外側に少なくとも1層の押出被覆樹脂層を有する絶縁ワイヤであって、該断面の一対の対向する2辺に設けられた押出被覆樹脂層の厚さが、他の一対の対向する2辺に設けられた押出被覆樹脂層の厚さと異なることを特徴とする(1)~(3)のいずれか1項記載の絶縁ワイヤ、
(5)前記エナメル焼き付け層と前記押出被覆樹脂層との間に接着層を有し、該接着層を媒体として、エナメル焼き付け層と押出被覆樹脂層との接着力を強化させたことを特徴とする(1)~(4)のいずれか1項に記載の絶縁ワイヤ、及び、
(6)前記エナメル焼き付け層の外周に、ワニス化された樹脂を焼き付けてこれを接着層とし、その後、前記樹脂のガラス転移温度よりも高い温度の溶融状態である押出被覆樹脂と接触させ、エナメル層と押出被覆樹脂層とを熱融着させることを特徴とする(5)項記載の絶縁ワイヤの製造方法。
すなわち、上記発明の絶縁ワイヤは「部分放電発生電圧」と「導体/エナメル層の接着強度」の両方を満足し、インバータサージ劣化が起こりにくくなる。
また、エナメル層の厚さを50μm以下とするとで、焼き付け炉を通す回数を減らし、導体とエナメル層との接着力が極端に低下すること防ぐことができる。
また、押出被覆樹脂層が、25℃における引張弾性率が1000MPa以上であり、かつ250℃における引張弾性率が10MPa以上である樹脂材料からなるものとすると、耐摩耗性、耐熱老化特性、耐溶剤性にも優れたものである。
また、上記発明の絶縁ワイヤは、静摩擦係数が小さく、回転電機のコイルとして加工する場合の挿入性も良好である。
また、エナメル層と押出被覆樹脂層との間に接着機能を有する層を導入して接着強度を高めることで、上記のようなシワの発生を防ぐことができる。
(i)加工部分の絶縁性能保持性(耐加工性)
マグネットワイヤをモータ等の回転電機へ加工する際、さまざまな応力が加えられる。中でも折り曲げ加工といわれる工程では、あて治具を支点としたワイヤの曲げ加工が行われる。特に近年増えてきているワイヤの導体径が大きいものや、ワイヤの絶縁皮膜厚さが厚いものでは、応力もその分大きくなり、支点とあて治具のワイヤへ押し付け力も大きくなる。このような場合、ワイヤのあて治具が接触した部分においては、ワイヤの絶縁皮膜に圧縮痕が残り、局所的に絶縁層厚さが小さくなる。また曲げRの外側では皮膜が伸ばされて絶縁厚さは小さくなる。その結果それらの部分の電気的な絶縁特性が低下するという課題がある。
上記同様のワイヤの折り曲げ加工後において、加工時にワイヤの絶縁皮膜にかかる歪は少なくない。特に近年では回転電機の小型化、高効率化を理由にワイヤへ施される加工形態も過酷になってきていることと、上記同様に導体径が大きいものや、ワイヤの絶縁皮膜厚さ厚いものなどでは局所的に絶縁皮膜にかかる歪が大きくなり、加工後に絶縁皮膜が破断する場合があるという課題がある。特に加工後にヒートサイクルを行った後にその優劣は顕著に現れる。
回転電機が利用される各分野では、回転電機の高効率化から使用電圧が高くなってきていることや、小型化によって放熱性が十分に確保できない場合等も多々あり、最近では回転電機の耐熱性つまりは同様にマグネットワイヤに対する耐熱性要求も高まっている。特に瞬間的、断続的に設計以上の高温下にさらされた後においても皮膜には十分な絶縁性能が求められるようになってきている。
また、本発明の別の課題は、ワイヤの変形加工を伴うモータ組み立て時にワイヤの絶縁皮膜に対する歪発生を軽減するモータの製造方法を提供することにある。
(1)導体の外周に、少なくとも1層のエナメル焼き付け層と、その外側に少なくとも1層の押出被覆樹脂層を有し、前記エナメル焼き付け層と前記押出被覆樹脂層との間に接着層を有し、該接着層を媒体として、エナメル焼き付け層と押出被覆樹脂層との接着力を強化させたワイヤであって、該エナメル焼き付け層と該押出被覆樹脂層と該接着層の厚さの合計が60μm以上であり、
前記エナメル焼き付け層の厚さが50μm以下であり、
前記押出被覆樹脂層が、300℃における溶融粘度が100Pa・s以上であるポリフェニレンスルフィド(以下、「PPS」ともいう)ポリマーと、熱可塑性エラストマーを2~8質量%と、酸化防止剤とを含有し、25℃における引張弾性率が2500MPa以上であり、かつ、250℃における引張弾性率が10MPa以上であるポリフェニレンスルフィド樹脂組成物からなる
ことを特徴とする耐インバータサージ絶縁ワイヤ、
(2)前記ポリフェニレンスルフィド樹脂組成物が、25℃における引張破断伸びが15%以上で、200℃、100時間大気下暴露後の25℃での引張破断伸びが5%以上であることを特徴とする(1)項記載の耐インバータサージ絶縁ワイヤ、
(3)前記ポリフェニレンスルフィドポリマーの非ニュートン指数が1.1以下である(1)または(2)項に記載の耐インバータサージ絶縁ワイヤ、及び、
(4)押出被覆樹脂層のポリフェニレンスルフィド樹脂組成物が結晶化していない状態の(1)の絶縁ワイヤを用いて、ワイヤの変形加工を伴う回転電機の電機子の組み立てを行い、組立終了後の絶縁ワイヤを120℃以上に加熱することで絶縁ワイヤのポリフェニレンスルフィド樹脂を結晶化させる工程を有することを特徴とする回転電機の製造方法。
本発明のモータの製造方法は、ワイヤの成形加工時にワイヤの絶縁皮膜にかかるストレスを軽減でき、更には組み立て加工後に結晶化させることで皮膜の熱的、機械的および化学的等の性能を向上させることができる。
本発明の上記及び他の特徴及び利点は、下記の記載からより明らかになるであろう。
本発明に用いられる導体としては、従来、絶縁ワイヤで用いられているものを使用することができるが、好ましくは、酸素含有量が30ppm以下の低酸素銅、さらに好ましくは20ppm以下の低酸素銅または無酸素銅の導体である。酸素含有量が30ppm以下であれば、導体を溶接するために熱で溶融させた場合、溶接部分に含有酸素に起因するボイドの発生がなく、溶接部分の電気抵抗が悪化することを防止するとともに溶接部分の強度を保持することができる。
また、導体はその横断面が所望の形状のものを使用できるが、円以外の形状を有するものを使用するのが好ましく、特に平角形状のものが好ましい。更には、角部からの部分放電を抑制するという点において、4隅に面取り(半径r)を設けた形状であることが望ましい。
導体の大きさについては特に限定はないが、平角導体の場合は、好ましくは、厚さが0.1~3.0mm、幅が0.5~15mmである。
エナメル焼き付け層(以下、単に「エナメル層」ともいう)については、樹脂ワニスを導体上に複数回塗布、焼付して形成したものである。樹脂ワニスを塗布する方法は常法でよく、たとえば、導体形状の相似形としたワニス塗布用ダイスを用いる方法や、もし導体断面形状が四角形であるならば、井桁状に形成された「ユニバーサルダイス」と呼ばれるダイスを用いることができる。これらの樹脂ワニスを塗布した導体はやはり常法にて焼付炉で焼き付けされる。具体的な焼き付け条件はその使用される炉の形状などに左右されるが、およそ5mの自然対流式の竪型炉であれば、400~500℃にて通過時間を10~90秒に設定することにより達成することができる。
また、これらは1種を単独で使用してもよく、また、2種以上を混合して使用するようにしてもよい。
エナメル層は1層であっても複数層であってもよい。
本発明においては、押出被覆樹脂層は、300℃における溶融粘度が100Pa・s以上であるPPSポリマーと、熱可塑性エラストマーを2~8質量%と、酸化防止剤とを含有し、25℃における引張弾性率が2500MPa以上、かつ、250℃における引張弾性率が10MPa以上であるPPS樹脂組成物からなる。
また、PPS樹脂組成物の25℃での引張破断伸びは15%以上であることが好ましく、18%以上がさらに好ましい。また、200℃、100時間大気下暴露後の25℃での引張破断伸びが5%以上であることが好ましく、6%以上がさらに好ましい。
ここで、溶融粘度とは、キャビラリーレオメーターを用いて測定した、300℃、せん断速度100sec-1、ノズル孔径0.5mm、長さ1.0mmで測定した値である。
方法1:ポリハロゲン芳香族化合物類を硫黄と炭酸ソーダの存在下に重合させる方法。
ジハロゲン芳香族化合物類を極性溶媒中でスルフィド化剤の存在下に重合させる方法。
方法2:P-クロルチオフェノールを自己縮合させる方法。
方法3:N-メチルピロリドンとポリハロゲノ芳香族化合物を混合し加熱しておき、反応系内の水分量が有機極性溶媒の2~50モル%の範囲内になる様な速度で含水スルフィド化剤を加えてポリハロゲノ芳香族化合物とスルフィド化剤とを反応させる方法。
方法4:N-メチルピロリドン中でアルカリ金属硫化物とポリハロゲノ芳香族化合物との反応中、反応缶の気相部分を冷却することにより反応缶内の気相の一部を凝縮させ、これを液相に還流させることによりPPSポリマーを製造する方法、
方法5:N-メチルピロリドン、非加水分解性有機溶媒、含水アルカリ金属硫化物を混合し、次いで、得られた混合液を脱水して、固形のアルカリ金属硫化物と、アルカリ金属水硫化物(b)と、N-メチルピロリドンの加水分解物のアルカリ金属塩とを含むスラリーを製造し(工程1)、次いで、前記スラリーの存在下、ポリハロゲノ芳香族化合物と前記アルカリ金属水硫化物と、前記したN-メチルピロリドンの加水分解物のアルカリ金属塩とを反応させて重合を行う(工程2)方法。
また、本発明の絶縁ワイヤは、例えばエナメル焼付け層の最外周に、ワニス化した熱可塑性樹脂を焼き付けてこれを接着層とし、その後の押出工程被覆工程において、この接着層と、接着層樹脂のガラス転移温度よりも高い温度で溶融させた押出被覆樹脂とを接触させて、両者を熱融着させることで製造することができる。
この部分放電発生電圧の低下を防止するためには、曲げの円弧内側にシワが生じないようにする必要があり、エナメル層と押出被覆樹脂層との間に接着機能を有する層を導入して接着強度を高めることで、上記のようなシワの発生を防ぐことができる。
また、接着層の厚さは2~20μmが好ましく、5~10μmが更に好ましい。接着層と押出被覆樹脂層を十分に熱融着させるためには、押出被覆工程における樹脂温度は、接着層に選んだ樹脂のTg(ガラス転移温度)以上である必要があり、好ましくはTgよりも30℃以上高い温度、更に好ましくはTgよりも50℃以上高い温度が良い。
PPSポリマーは結晶性高分子のため、結晶化が不十分の場合、DSC(Differential Scanning Calorimeter)法により試料を昇温した場合120℃近傍に再結晶化による発熱が観測される。結晶化が十分に進行した場合、再結晶化発熱は観測されない。
PPS樹脂組成物の結晶化度を、DSC測定に基づき、以下の式で定義する。
(結晶化度)=(1-CT/MP)×100 (%)
CT:DSC測定における、再結晶発熱量(J/g)
MP:DSC測定における、融解吸熱量(J/g)
DSC測定は環境雰囲気、昇温速度に若干依存するが、本発明においては、窒素雰囲気下、40℃より330℃まで20℃/分で昇温した。
本発明のモータの製造方法におけるワイヤ加工は、PPS樹脂組成物が結晶化していない状態で加工を行うが、本発明における結晶化していない状態とは、結晶化度はが85%以下であり、この場合PPS樹脂組成物の靭性が向上するためワイヤ加工時にかかるストレスを低減することができる。このことは本発明で課題としている皮膜形状保持性に対して有利な方向に働き、加工後の絶縁皮膜の破断を防止する効果がある。また、好ましくは、結晶化度を40%以上に保つことで、PPS樹脂が柔らかくなりすぎることを防ぐことができ、このことは本発明で課題としている絶縁性能保持性に対して有利な方向に働く。すなわち、あて冶具を支点とした曲げ加工にて皮膜に圧縮痕がつくのを防ぐことができ、局所的な絶縁層厚さの低下を防ぐ効果がある。
製造例1
まず、以下材料を混合して含水スルフィド化剤を作成した。
(1)含水フレーク状硫化ナトリウム(ナガオ製) : 1.5kg
純度/Na2S(58.9質量%)、NaSH(1.3質量%)
(2)含水フレーク状水硫化ナトリウム(ナガオ製);0.225kg
純度/NaSH(71.2質量%)、Na2S(2.7質量%)
(3)水 0.425kg
以上、3種類を混合して含水スルフィド化剤2.15kgを作成した。
当反応物は通常の方法で水洗い、乾燥して白色粉末のポリマーを得た。このポリマーを「PPS-1」とする。PPS-1は300℃の溶融粘度300Pa・s、非ニュートン指数1.05であった。
製造例1において、(1)含水フレーク状硫化ナトリウムを1.6kg、(2)含水フレーク状水硫化ソーダを0.185kgとして、300℃の溶融粘度が80Pa・s、非ニュートン指数1.02のPPSポリマーPPS-2を得た。
製造例2で得たPPS-2を大気雰囲気下、220℃48時間加熱処理することにより、300℃の溶融粘度が1,000Pa・s、非ニュートン指数1.18のPPSポリマーPPS-3を得た。
表1中に示した各種材料を、表1中の質量百分率で均一に混合した後、35mmφの2軸押出機を用い290~330℃で混練押出ししてPPS樹脂組成物「A-1」~「A-5」、「B-1」~「B-4」を得た。
PPS-1~3:上記製造例1~3で製造したPPS-1~3
ELA:無水マレイン酸変性エチレン・プロピレン共重合体(三井化学株式会社製「タフマーMH-7020」(商品名))
ANTOXD:フェノール系酸化防止剤(チバスペシャリティケミカル製「イルガノックス1010」(商品名))
1.85×2.48mm(厚さ×幅)で四隅の面取り半径r=0.5mmの平角導体(酸素含有量15ppmの銅)を準備した。エナメル層の形成に際しては、導体の断面形状と相似形のエナメルダイスを使用して、ポリアミドイミド樹脂ワニス(日立化成(株)製 商品名 HI406)を導体へコーティングし、450℃に設定した炉長8mの焼付炉内を、焼き付け時間15秒となる速度で通過させ、この1回の焼き付け工程で厚さ5μmのエナメルを形成した。これを繰り返し8回行うことで厚さ40μmのエナメル層を形成し、被膜厚さ40μmのエナメル線を得た。次に、N-メチル-2-ピロリドン(NMP)にポリフェニルサルホン樹脂(PPSU)(ソルベイアドバンストポリマー:レーデルR5800)を溶解させ、20wt%溶液とした樹脂ワニスを、導体の形状と相似形のダイスを使用して、前記エナメル線へコーティングし、450℃に設定した炉長8mの焼付炉内を、焼き付け時間15秒となる速度で通過させ、これを繰り返し2回行うことで厚さ5μmの接着層を形成した(1回の焼き付け工程で形成される厚さは2.5μm)。
実施例1と同様の方法で、PPS樹脂組成物A-2~A-5を用いて実施例2~5、及びPPS樹脂組成物B-1~B-4を用いて比較例1~4の絶縁ワイヤを作製した。
(引張弾性率)
ASTM 4号ダンベルに対し、ASTM D-638に準拠し引張破断伸びを測定した。
キャビラリーレオメーター(島津製作所製CFT-500D)を用い、300℃、せん断速度100sec-1、ノズル孔径0.5mm、長さ1.0mmで測定した。
ASTM 4号ダンベルに対し、ASTM D-638に準拠し引張破断伸びを測定した。
200℃の熱風循環式乾燥器内にてASTM 4号ダンベルを100時間暴露後、ASTM D-638に準拠し引張破断伸びを測定した。
部分放電発生電圧の測定には、菊水電子工業製の部分放電試験機「KPD1050」を用いた。断面形状が方形の絶縁ワイヤを、二本の絶縁ワイヤの長編となる面同士を長さ150mmに亘って隙間が無いように密着させた試料を作製した。この二本の導体間に電極をつなぎ、温度は25℃にて、50Hzの交流電圧かけながら連続的に昇圧していき、10pCの部分放電が発生した時点の電圧を実行値で読みとった。
耐摩耗性を、JIS C 3003エナメル線試験方法の、9.耐摩耗(丸線)と同様に、平角線の四隅のコーナーについて測定した。2000g以上を合格とした。
耐溶剤性を、JIS C 3003エナメル線試験方法の、7.可撓性に従って巻き付けたものを、溶剤に10秒間浸漬後、エナメル層または押出被覆樹脂層の表面を目視にて、クラックやクレージングの有無を確認した。溶剤としてはアセトン、キシレン、スチレンの3種類によって行い、温度は常温と150℃(試料を150℃×30分加熱後に熱い状態で溶剤へ浸漬する)の2水準について行った。異常なしであるものを合格とした。
マグネットワイヤを、あて治具を視点としたワイヤの折り曲げ加工により90℃まで曲げたものを試験片とし、JIS C 3003 エナメル試験法の6.c)ピンホール法に従って、加工部位をフェノールフタレインの3%アルコール溶液の適量を滴下した0.2%食塩水中に浸し、液を正極試験片の導体を負極とし、12Vの直流電圧を1分間加えて発生するピンホール数を測定した。ピンホール数1以下を合格とした。また、JIS C 3003 エナメル試験法の10.絶縁破壊電圧試験法に従って、加工部位の絶縁破壊電圧を測定し、JIS基準値以上を合格とした。
マグネットワイヤを、あて治具を支点としてワイヤの折り曲げ加工により90℃まで曲げたものを試験片とし-40℃ 20分⇔200℃ 20分を1サイクルとした熱衝撃試験を実施後、皮膜の割れの発生の有無を目視による観察で確認した。試験終了後、皮膜に割れが発生しないものを合格とした。
ワイヤを空気雰囲気200℃下に100時間暴露した。その後ワイヤの長さ方向20mmにわたって周方向全体に導電ペーストを塗布した。導体と導電ペーストの間に50Hzの電圧をかけ、破壊電圧を測定した。この破壊電圧が暴露前の値の70%以上の場合を合格とした。
実施例1のワイヤ(結晶化度40%)を用いて、モータの組み立てを行い、組立終了後に150℃1時間アニール加熱することで絶縁ワイヤのポリフェニレンスルフィド樹脂を結晶化させてモータを製造した。
組立終了後のアニーリング温度を110℃とした以外は、実施例6と同様の方法でモータを製造した。
実施例1で作製したワイヤ線を予め150℃1時間のアニーリングによってPPSの結晶化度を90%とした以外は実施例6と同様の方法でモータを製造した。
(PPS樹脂組成物の結晶化度、および、加工後にアニール後のPPS樹脂組成物の結晶化度)
パーキンエルマー社製DSC-7を用い、PPS樹脂組成物5mgを測定試料として、窒素雰囲気下、40℃より330℃まで20℃/分で昇温し、再結晶発熱量と融解吸熱量を測定し、結晶化度を評価した。
(加工部分の皮膜形状保持性)
マグネットワイヤを、あて治具を支点としてワイヤの折り曲げ加工により90℃まで曲げたものを試験片とし-40℃ 20分⇔200℃ 20分を1サイクルとした熱衝撃試験を実施後、皮膜の割れの発生の有無を目視による観察で確認した。試験終了後、皮膜に割れが発生しないものを合格とした。
(アニール後のワイヤの鉛筆硬度)
マグネットワイヤを、JIS-K 5600-5-4引っかき硬度(鉛筆法)に従って測定した。
実施例1~4は、300℃における溶融粘度が100Pa・s以上であるポリフェニレンスルフィドポリマーを含有し、熱可塑性エラストマーを2~8質量%を含有し、酸化防止剤を含有し、1)25℃における引張破断伸びが15%以上で、2)200℃100時間大気下暴露後の25℃での引張破断伸びが5%以上、3)非ニュートン指数が1.1以下であるという範囲に入るものである。その結果、本発明の課題である(i)加工部分の絶縁性能保持性、(ii)加工部分の皮膜形状保持性、(iii)熱老化後の絶縁性能保持性は全て満足な結果が得られている。ただし実施例5は非ニュートン指数が1.1より大きく、200℃100時間大気下暴露後の25℃での引張破断伸びが5%未満であることから、熱老化後の絶縁性能保持性は実施例1~4と比較すると若干劣るものの、本発明の請求する範囲となる。
これに対し、比較例1は300℃における溶融粘度が100Pa・s未満であることから加工部分の皮膜形状保持性において満足な結果がえられず、更に25℃における引張破断伸びが15%未満であり、200℃100時間大気下暴露後の25℃での引張破断伸びが5%未満であることから、熱老化後の絶縁性能保持性において満足な結果が得られていない。
また比較例2は熱可塑性エラストマーの含有量が2%未満であることから加工部分の皮膜形状保持性において満足な結果が得られておらず、25℃における引張破断伸びが15%未満であり、200℃100時間大気下暴露後の25℃での引張破断伸びが5%未満であることから、やはり熱老化後の絶縁性能保持性において満足な結果が得られていない。
また比較例3においては熱可塑性エラストマーの含有量が8%より大であることから加工部分の絶縁性能保持性において満足な結果が得られていない。
また比較例4においては酸化防止剤の添加がなく、200℃100時間大気下暴露後の25℃での引張破断伸びが5%未満であることから熱老化後の絶縁性能保持性において満足な結果が得られていない。
Claims (4)
- 導体の外周に、少なくとも1層のエナメル焼き付け層と、その外側に少なくとも1層の押出被覆樹脂層を有し、前記エナメル焼き付け層と前記押出被覆樹脂層との間に接着層を有し、該接着層を媒体として、エナメル焼き付け層と押出被覆樹脂層との接着力を強化させたワイヤであって、該エナメル焼き付け層と該押出被覆樹脂層と該接着層の厚さの合計が60μm以上であり、
前記エナメル焼き付け層の厚さが50μm以下であり、
前記押出被覆樹脂層が、300℃における溶融粘度が100Pa・s以上であるポリフェニレンスルフィドポリマーと、熱可塑性エラストマーを2~8質量%と、酸化防止剤とを含有し、25℃における引張弾性率が2500MPa以上であり、250℃における引張弾性率が10MPa以上であるポリフェニレンスルフィド樹脂組成物からなる
ことを特徴とする耐インバータサージ絶縁ワイヤ。 - 前記ポリフェニレンスルフィド樹脂組成物が、25℃における引張破断伸びが15%以上で、200℃、100時間大気下暴露後の25℃での引張破断伸びが5%以上であることを特徴とする請求項1記載の耐インバータサージ絶縁ワイヤ。
- 前記ポリフェニレンスルフィドポリマーの非ニュートン指数が1.1以下である請求項1または2に記載の耐インバータサージ絶縁ワイヤ。
- 押出被覆樹脂層のポリフェニレンスルフィド樹脂組成物が結晶化していない状態の請求項1の絶縁ワイヤを用いて、ワイヤの変形加工を伴う回転電機の電機子の組み立てを行い、組立終了後の絶縁ワイヤを120℃以上に加熱することで絶縁ワイヤのポリフェニレンスルフィド樹脂組成物を結晶化させる工程を有することを特徴とする回転電機の製造方法。
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US8720042B2 (en) | 2010-06-23 | 2014-05-13 | Toyota Jidosha Kabushiki Kaisha | Stator manufacturing method and stator |
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US9514863B2 (en) | 2012-11-30 | 2016-12-06 | Furukawa Electric Co., Ltd. | Inverter surge-resistant insulated wire and method of producing the same |
Also Published As
Publication number | Publication date |
---|---|
EP2328154B1 (en) | 2014-04-16 |
US8586869B2 (en) | 2013-11-19 |
EP2328154A1 (en) | 2011-06-01 |
CN102138186B (zh) | 2013-01-23 |
JP5306742B2 (ja) | 2013-10-02 |
KR101331711B1 (ko) | 2013-11-20 |
KR20110069786A (ko) | 2011-06-23 |
JP2010055964A (ja) | 2010-03-11 |
EP2328154A4 (en) | 2013-04-24 |
US20110226508A1 (en) | 2011-09-22 |
CN102138186A (zh) | 2011-07-27 |
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