WO2009148086A1 - レーザ加工装置およびレーザ加工方法 - Google Patents
レーザ加工装置およびレーザ加工方法 Download PDFInfo
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- WO2009148086A1 WO2009148086A1 PCT/JP2009/060167 JP2009060167W WO2009148086A1 WO 2009148086 A1 WO2009148086 A1 WO 2009148086A1 JP 2009060167 W JP2009060167 W JP 2009060167W WO 2009148086 A1 WO2009148086 A1 WO 2009148086A1
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- Prior art keywords
- processed
- substrate
- laser
- protective material
- processing apparatus
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- 238000003672 processing method Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims abstract description 75
- 230000001681 protective effect Effects 0.000 claims abstract description 72
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0475—PV cell arrays made by cells in a planar, e.g. repetitive, configuration on a single semiconductor substrate; PV cell microarrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a laser processing apparatus and a laser processing method for processing a substrate to be processed by irradiating the substrate to be processed held by a holding unit with laser light.
- a laser processing apparatus for processing a substrate to be processed, a holding unit that holds the substrate to be processed, a laser oscillator that irradiates the substrate to be processed held by the holding unit with laser light reflected by a reflection mirror, and are known (for example, see Japanese Patent Application Laid-Open No. 2007-048835).
- a protective material made of fluorine-based resin or glass for example, special features No. 2001-102603
- the substrate to be processed tends to increase in size, and it takes a long time to complete the processing of the substrate to be processed, such as an increase in the number of grooves formed in the substrate to be processed.
- the protective material is already applied by the reaction with the external atmosphere when the protective material is applied.
- the machined part is deteriorated or contaminated.
- it takes time to apply the protective material in this way when the protective material is applied, dust may already adhere to the part to be processed.
- the present invention has been made in consideration of such points, and even when a large substrate to be processed is processed, a laser processing apparatus capable of preventing a portion to be processed of the substrate to be processed from being deteriorated, and An object is to provide a laser processing method.
- the laser processing apparatus comprises: A laser processing apparatus for processing a substrate to be used for a solar cell, A holding unit for holding the substrate to be processed; A laser oscillator that irradiates the substrate to be processed with laser light and processes the substrate to be processed; A moving mechanism for relatively moving the irradiation position of the laser beam with respect to the substrate to be processed held by the holding unit; An application mechanism that sequentially applies a protective material to a processed portion processed by laser light in the processed substrate; It has.
- the moving mechanism moves the irradiation position of the laser beam on the workpiece substrate held by the holding unit by moving the laser oscillator
- the coating mechanism may be moved integrally with the laser oscillator by the moving mechanism.
- the protective material may be made of a liquid or gel fluid, and may exhibit electrical insulation and weather resistance by being dried and solidified.
- the laser processing apparatus comprises: A cleaning mechanism for cleaning a processed portion processed by laser light in the processed substrate; After the application mechanism is cleaned by the cleaning mechanism, a protective material may be applied to a processed portion processed by laser light in the processed substrate.
- the laser processing apparatus comprises: You may further provide the heating mechanism which dries the protective material apply
- the laser processing apparatus comprises: Further equipped with an ultraviolet light source for irradiating ultraviolet rays,
- the protective material includes an ultraviolet curable resin,
- the ultraviolet light source may cure the protective material by irradiating the protective material applied to the substrate to be processed by the application mechanism with ultraviolet rays.
- the application mechanism may apply a protective material to a processed portion processed by laser light in the processed substrate by an inkjet method.
- the laser processing method comprises: In a laser processing method for processing a substrate to be used for a solar cell, Holding the substrate to be processed by a holding unit; Irradiating the substrate to be processed with a laser beam by a laser oscillator to process the substrate to be processed; Moving the laser oscillator by a moving mechanism to relatively move the irradiation position of the laser beam on the workpiece substrate held by the holding unit; By sequentially moving a coating mechanism integrally with the laser oscillator by the moving mechanism, a protective material is sequentially applied to a processing portion processed by a laser beam in the processing substrate; It has.
- the coating mechanism sequentially applies the protective material to the portion of the substrate to be processed that has been processed by the laser beam. For this reason, it is possible to prevent the portion to be processed of the substrate to be processed from being deteriorated regardless of whether a large substrate to be processed is processed.
- FIG. 1 is a configuration diagram showing a laser processing apparatus according to a first embodiment of the present invention.
- FIG. 2 is a block diagram showing a laser processing method using the laser processing apparatus according to the first embodiment of the present invention.
- FIG. 3 is a block diagram showing a laser processing apparatus according to a modification of the first embodiment of the present invention.
- FIG. 4 is a block diagram showing a laser processing apparatus according to another modification of the first embodiment of the present invention.
- FIG. 5 is a block diagram showing a laser processing apparatus according to the second embodiment of the present invention.
- FIG. 1 to FIG. 4 are diagrams showing a first embodiment of the present invention.
- the laser processing apparatus of this embodiment processes a substrate to be processed used for a solar cell.
- the laser processing apparatus includes a holding unit 65 that holds a substrate to be processed 60, a laser oscillator 1 that processes the substrate to be processed 60 by irradiating the substrate to be processed 60 with a laser beam L, and a holding unit.
- Protective material is sequentially applied to the moving mechanism 5 that relatively moves the irradiation position of the laser beam L with respect to the workpiece substrate 60 held by 65 and the workpiece portion processed by the laser beam L of the workpiece substrate 60.
- an application mechanism 10 for applying is sequentially applied to the moving mechanism 5 that relatively moves the irradiation position of the laser beam L with respect to the workpiece substrate 60 held by 65 and the workpiece portion processed by the laser beam L of the workpiece substrate 60.
- a material made of a liquid or gel fluid, which exhibits electrical insulation and weather resistance by being dried and solidified is used as the protective material.
- the reflection mirror 21 that reflects the laser light L, and the reflection mirror 21.
- a condensing lens 22 is provided for condensing the laser light L reflected at the substrate 60 to be processed.
- the moving mechanism 5 moves the laser oscillator 1, the reflecting mirror 21, the condensing lens 22, and the coating mechanism 10 together to move the laser beam L to the workpiece substrate 60 held by the holding unit 65.
- the irradiation position is moved.
- the moving mechanism 5 includes a cleaning mechanism that cleans a portion of the substrate 60 to be processed that has been processed by the laser light L on the upstream side (left side of FIG. 1) of the coating mechanism 10. 15 is provided.
- the cleaning mechanism 15 includes a cleaning roller 15a that is rotatable about a rotation shaft 15b.
- a description will be given using a mode in which a portion to be processed processed by the laser beam L is cleaned by the rotatable cleaning roller 15a.
- the present invention is not limited to this, and the cleaning mechanism 15 cleans the processed portion processed by the laser beam L by, for example, blowing clean air or an inert gas (such as nitrogen) to the processed portion. Something like that. Further, as long as the cross section processed by the laser beam L is not soiled, a cleaning liquid can be used.
- the cleaning mechanism 15 uses gas as described above, the mechanism is simple, and it is excellent in that the cleaning liquid does not need to be collected unlike the case where the cleaning liquid is used.
- the cleaning mechanism 15 uses a cleaning liquid, it is excellent in that it can be cleaned by a chemical cleaning effect. Further, for example, the protective material can be cured by the interaction with the protective material applied in a subsequent process, and it is not necessary to use the heating mechanism 18 described later or the ultraviolet light source 19 shown in the second embodiment.
- the cleaning roller 15a is not necessarily required when using gas or cleaning liquid. In this case, since it is not necessary to perform mechanical cleaning, damage to the substrate to be processed 60 can be reduced.
- the moving mechanism 5 has a heating mechanism 18 that dries the protective material applied to the substrate 60 to be processed by the application mechanism 10 on the downstream side (right side in FIG. 1) of the application mechanism 10. Is provided.
- the transparent workpiece substrate 60 is held by the holding unit 65 (holding step 81) (see FIGS. 1 and 2). Thereafter, the laser oscillator 1, the reflection mirror 21, the condenser lens 22, the cleaning mechanism 15, the coating mechanism 10, and the heating mechanism 18 are moved together by the moving mechanism 5. In addition, the following processes are performed while the laser oscillator 1, the reflection mirror 21, the condensing lens 22, the cleaning mechanism 15, the coating mechanism 10, and the heating mechanism 18 are moving as described above.
- laser light L is emitted from the laser oscillator 1 (laser irradiation step 82) (see FIGS. 1 and 2).
- the laser beam L emitted from the laser oscillator 1 reaches the substrate to be processed 60 through the reflection mirror 21 and the condenser lens 22, and the substrate to be processed 60 is processed (see FIG. 1).
- the portion to be processed that has been processed by the laser light L in the processing substrate 60 is cleaned by the cleaning mechanism 15 (cleaning step 84) (see FIGS. 1 and 2). More specifically, the cleaning roller 15a is brought into contact with the portion to be processed of the substrate 60 to be processed, and the cleaning roller 15a is rotated about the rotation shaft 15b.
- the processed substrate 60 is sequentially processed (processed substrate 60 is processed) into the processed portion of the processed substrate 60 processed by the laser beam L.
- the protective material is applied (according to the order) (application step 85) (see FIGS. 1 and 2).
- the laser oscillator 1 and the coating mechanism 10 move as a unit. Therefore, when the substrate 60 is processed by the laser light L, the processing is performed immediately after that. A protective material is applied to the workpiece. For this reason, a to-be-processed part can be covered with a protective material immediately. As a result, even when processing a large substrate 60 to be processed, it is possible to reliably prevent the processing portion from being contaminated or deteriorated, and dust from adhering to the processing portion. Can do.
- a protective material is applied to the processing portion. Is done. For this reason, when a large substrate 60 is processed, it takes a long time after the processing portion is processed until the protective material is applied to the processing portion. As a result, when the protective material is applied to the part to be processed, the part to be processed has already deteriorated due to the reaction with the external atmosphere or has been contaminated. In addition, when the protective material is applied to the part to be processed, dust may already adhere to the part to be processed.
- the protective material is applied to the processed portion.
- the processed processed portion can be immediately covered with a protective material.
- the time that the part to be processed comes into contact with the external atmosphere can be significantly shortened, and it is possible to reliably prevent the part to be processed from being contaminated or deteriorated, and from adhering to the part to be processed. can do.
- the protective material applied to the processed substrate 60 is heated and dried by the heating mechanism 18 (heating step 86) (FIG. 1 and FIG. 2).
- the protective material made of a liquid or gel fluid is solidified at the stage of application from the application mechanism 10.
- the solidified protective material since the solidified protective material has an electrical insulation property and a weather resistance, a to-be-processed part will be protected reliably.
- coated to the to-be-processed part is heated and dried by the heating mechanism 18, a to-be-processed part can be covered with a protective material quickly and reliably. For this reason, it can prevent more reliably that a to-be-processed part is contaminated or deteriorated, and that dust adheres to a to-be-processed part.
- the laser irradiation process 82, the cleaning process 84, the coating process 85, and the heating process 86 described above are performed intermittently or continuously until all of the processing targets of the substrate 60 to be processed are processed. Then, when all the parts to be processed are processed (processing ends), the moving mechanism 5 is stopped, and the substrate 60 to be processed is removed from the holding unit 65 (removal step 89).
- the application mechanism 10 a mechanism that applies a protective material by an ink jet method may be used.
- the protective material can be supplied by the fine droplets, so that the protective material can be quickly dried only by preheating the laser light L. For this reason, it is not necessary to use the heating mechanism 18 or the ultraviolet light source 19 shown in the second embodiment. Further, the application amount and the application position can be controlled with high accuracy, and waste can be eliminated.
- the application mechanism 10 may include a dispense nozzle, and the dispenser nozzle may be used to apply a protective material.
- a laser oscillator may be used as the heating mechanism 18.
- a laser oscillator having an output sufficient to generate heat necessary for drying the protective material may be used.
- a laser oscillator different from the laser oscillator 1 may be provided, or after the laser light L emitted from the laser oscillator 1 is branched, the output is reduced through a filter or the like, and then the protective material is irradiated. May be.
- the heating mechanism 18 it is not necessary to use the heating mechanism 18, so that the structure can be simplified.
- the protective material is selectively heated by the laser beam L having a low output through a filter or the like, damage applied to the substrate 60 can be reduced.
- the heating mechanism 18 one that irradiates IR light (infrared light) may be used.
- the protective material applied to the substrate to be processed 60 is dried by IR light (infrared light).
- the moving mechanism 5 as shown in FIG. 1, the one that moves the laser oscillator 1, the reflecting mirror 21, the condenser lens 22, the cleaning mechanism 15, the coating mechanism 10, and the heating mechanism 18 together is used. explained.
- the present invention is not limited to this.
- the moving mechanism 5 is provided in the holding portion 65, and the moving mechanism 5 moves the holding portion 65, thereby causing the laser beam L to the substrate 60 to be processed.
- the irradiation position may be moved relatively.
- the processed portion to be processed can be covered with a protective material immediately after that.
- the processed part may be contaminated or deteriorated, or the processed part may be debris, regardless of the case where the large processed substrate 60 is processed. Adhesion can be reliably prevented.
- the application mechanism 10, the cleaning mechanism 15, and the heating mechanism 18 are arranged on the same side as the reflection mirror 21 and the condenser lens 22 with respect to the substrate 60 to be processed, and moved by the moving mechanism 5.
- the present invention is not limited to this, and as shown in FIG. 4, the coating mechanism 10, the cleaning mechanism 15, and the heating mechanism 18 are arranged on the opposite side of the reflecting mirror 21 and the condenser lens 22 with respect to the substrate to be processed 60. May be.
- the mode as shown in FIG. 4 is used, for example, when a thin film (not shown) that is a processing target of the substrate to be processed 60 is positioned below the substrate to be processed 60.
- the coating mechanism 10 may be one that applies a protective material by an ink jet method. And when apply
- the protective material is made of an ultraviolet curable resin.
- an ultraviolet light source 19 for curing a protective material made of an ultraviolet curable resin applied to the substrate 60 to be processed by the application mechanism 10 is provided.
- Other configurations are substantially the same as those of the first embodiment shown in FIGS.
- the protective material is made of an ultraviolet curable resin, and the ultraviolet curable resin applied to the processed portion of the processed substrate 60 is cured by the ultraviolet rays irradiated from the ultraviolet light source 19.
- the effects brought about by the cleaning mechanism 15 and the coating mechanism 10 can be naturally achieved.
- the effect brought about by the heating mechanism 18 of the first embodiment can be realized without using the heating mechanism 18 as in the first embodiment.
- a protective material is applied to the processed portion to be processed.
- the protective material applied to the part to be processed is cured by the ultraviolet rays emitted from the ultraviolet light source 19.
- a part to be processed can be covered with a protective material quickly and reliably, and the part to be processed can be more reliably prevented from being contaminated or deteriorated, and dust from being attached to the part to be processed. be able to.
- the heat is not used when the protective material is cured by the ultraviolet light emitted from the ultraviolet light source 19 as described above, it is possible to prevent the work substrate 60 from being altered by the heat.
- a laser oscillator that irradiates a laser beam having an ultraviolet wavelength may be used as the ultraviolet light source 19.
- a laser oscillator different from the laser oscillator 1 may be provided, the laser light L from the laser oscillator 1 may be branched and converted into laser light having an ultraviolet wavelength by a wavelength converter, The laser oscillator 1 may be one that emits laser light having an ultraviolet wavelength.
- the protective material is selectively irradiated with the laser beam L having a low output through a filter or the like, damage applied to the substrate to be processed 60 can be reduced.
- the laser beam branched from the laser oscillator 1 is used as described above, it is not necessary to use the ultraviolet light source 19, so that the structure can be simplified.
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Abstract
Description
太陽電池に用いられる被加工基板を加工するレーザ加工装置であって、
被加工基板を保持する保持部と、
前記被加工基板にレーザ光を照射し、該被加工基板を加工するレーザ発振器と、
前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を相対的に移動させる移動機構と、
前記被加工基板のうちレーザ光によって加工された被加工部分に、順次、保護材を塗布する塗布機構と、
を備えている。
前記移動機構は、前記レーザ発振器を移動させることによって、前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を移動させ、
前記塗布機構は、前記移動機構によって、前記レーザ発振器と一体となって移動させてもよい。
前記保護材は、液状またはジェル状の流体からなり、乾燥されて固化されることによって、電気的絶縁性および耐候性を示すものからなってもよい。
前記被加工基板のうちレーザ光によって加工された被加工部分を洗浄する洗浄機構をさらに備え、
前記塗布機構が、前記洗浄機構によって洗浄された後で、前記被加工基板のうちレーザ光によって加工された被加工部分に保護材を塗布してもよい。
前記塗布機構によって前記被加工基板に塗布された保護材を乾燥させる加熱機構をさらに備えてもよい。
紫外線を照射する紫外線光源をさらに備え、
前記保護材が、紫外線硬化樹脂を含み、
前記紫外線光源が、前記塗布機構によって前記被加工基板に塗布された保護材に紫外線を照射することで、該保護材を硬化させてもよい。
前記塗布機構は、インクジェット方式によって、前記被加工基板のうちレーザ光によって加工された被加工部分に、保護材を塗布してもよい。
太陽電池に用いられる被加工基板を加工するレーザ加工方法において、
保持部によって、前記被加工基板を保持することと、
レーザ発振器によって、前記被加工基板にレーザ光を照射して、該被加工基板を加工することと、
移動機構によって前記レーザ発振器を移動させることで、前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を相対的に移動させること、
前記移動機構により塗布機構を前記レーザ発振器と一体となって移動させることで、前記被加工基板のうちレーザ光によって加工された被加工部分に、順次、保護材を塗布することと、
を備えている。
以下、本発明に係るレーザ加工装置およびレーザ加工方法の第1の実施の形態について、図面を参照して説明する。ここで、図1乃至図4は本発明の第1の実施の形態を示す図である。
このため、被加工部分が汚染されたり、劣化したりすることや、被加工部分にゴミが付着することを、より確実に防止することができる。
次に、図5により、本発明の第2の実施の形態について説明する。図5に示す第2の実施の形態は、保護材が紫外線硬化樹脂からなっている。そして、加熱機構18の代わりに、塗布機構10によって被加工基板60に塗布された紫外線硬化樹脂からなる保護材を硬化させる紫外線光源19が設けられたものである。その他の構成は、図1乃至図3に示す第1の実施の形態と略同一である。
Claims (8)
- 太陽電池に用いられる被加工基板を加工するレーザ加工装置において、
被加工基板を保持する保持部と、
前記被加工基板にレーザ光を照射し、該被加工基板を加工するレーザ発振器と、
前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を相対的に移動させる移動機構と、
前記被加工基板のうちレーザ光によって加工された被加工部分に、順次、保護材を塗布する塗布機構と、
を備えたことを特徴とするレーザ加工装置。 - 前記移動機構は、前記レーザ発振器を移動させることによって、前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を移動させ、
前記塗布機構は、前記移動機構によって、前記レーザ発振器と一体となって移動させられることを特徴とする請求項1に記載のレーザ加工装置。 - 前記保護材は、液状またはジェル状の流体からなり、乾燥されて固化されることによって、電気的絶縁性および耐候性を示すことを特徴とする請求項1に記載のレーザ加工装置。
- 前記被加工基板のうちレーザ光によって加工された被加工部分を洗浄する洗浄機構をさらに備え、
前記塗布機構は、前記洗浄機構によって洗浄された後で、前記被加工基板のうちレーザ光によって加工された被加工部分に保護材を塗布することを特徴とする請求項1に記載のレーザ加工装置。 - 前記塗布機構によって前記被加工基板に塗布された保護材を乾燥させる加熱機構をさらに備えたことを特徴とする請求項1に記載のレーザ加工装置。
- 紫外線を照射する紫外線光源をさらに備え、
前記保護材は、紫外線硬化樹脂を含み、
前記紫外線光源は、前記塗布機構によって前記被加工基板に塗布された保護材に紫外線を照射することで、該保護材を硬化させることを特徴とする請求項1に記載のレーザ加工装置。 - 前記塗布機構は、インクジェット方式によって、前記被加工基板のうちレーザ光によって加工された被加工部分に、保護材を塗布することを特徴とする請求項1に記載のレーザ加工装置。
- 太陽電池に用いられる被加工基板を加工するレーザ加工方法において、
保持部によって、前記被加工基板を保持することと、
レーザ発振器によって、前記被加工基板にレーザ光を照射して、該被加工基板を加工することと、
移動機構によって前記レーザ発振器を移動させることで、前記保持部に保持された前記被加工基板に対するレーザ光の照射位置を相対的に移動させること、
前記移動機構により塗布機構を前記レーザ発振器と一体となって移動させることで、前記被加工基板のうちレーザ光によって加工された被加工部分に、順次、保護材を塗布することと、
を備えたことを特徴とするレーザ加工方法。
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CN2009801211399A CN102317029A (zh) | 2008-06-06 | 2009-06-03 | 激光加工装置及激光加工方法 |
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KR (1) | KR20110027755A (ja) |
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CN112894134A (zh) * | 2021-02-02 | 2021-06-04 | 昂华(上海)自动化工程股份有限公司 | 一种锂电池模组装配装置和方法 |
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- 2009-06-03 CN CN2009801211399A patent/CN102317029A/zh active Pending
- 2009-06-03 KR KR1020117000187A patent/KR20110027755A/ko not_active Application Discontinuation
- 2009-06-03 JP JP2010515893A patent/JPWO2009148086A1/ja active Pending
- 2009-06-03 WO PCT/JP2009/060167 patent/WO2009148086A1/ja active Application Filing
- 2009-06-06 TW TW098118951A patent/TW201011933A/zh unknown
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JPS6292485A (ja) * | 1985-10-18 | 1987-04-27 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
JPH0918045A (ja) * | 1995-07-03 | 1997-01-17 | Sanyo Electric Co Ltd | 太陽電池とその製造方法 |
JPH1099978A (ja) * | 1996-09-27 | 1998-04-21 | Hitachi Ltd | レーザー加工装置 |
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KR20110027755A (ko) | 2011-03-16 |
CN102317029A (zh) | 2012-01-11 |
JPWO2009148086A1 (ja) | 2011-11-04 |
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