WO2009144925A1 - Composition de résine conductrice - Google Patents

Composition de résine conductrice Download PDF

Info

Publication number
WO2009144925A1
WO2009144925A1 PCT/JP2009/002326 JP2009002326W WO2009144925A1 WO 2009144925 A1 WO2009144925 A1 WO 2009144925A1 JP 2009002326 W JP2009002326 W JP 2009002326W WO 2009144925 A1 WO2009144925 A1 WO 2009144925A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
component
powder
group
meth
Prior art date
Application number
PCT/JP2009/002326
Other languages
English (en)
Japanese (ja)
Inventor
宏則 鈴木
仁志 真舩
Original Assignee
株式会社スリーボンド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社スリーボンド filed Critical 株式会社スリーボンド
Priority to CN200980115570.2A priority Critical patent/CN102015906B/zh
Publication of WO2009144925A1 publication Critical patent/WO2009144925A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials

Definitions

  • the present invention relates to a conductive resin composition containing ferromagnetic powder and silver powder and / or nickel powder.
  • compositions generally referred to as conductive adhesives have a resin component content of 5 to 25% by weight, metal powders such as silver powder, nickel powder, palladium powder, and gold powder (hereinafter referred to as the following).
  • metal powders such as silver powder, nickel powder, palladium powder, and gold powder (hereinafter referred to as the following).
  • conductive powder is a composition having a composition of 65 to 95% by weight.
  • the conductivity may become unstable or the conductivity may not be exhibited. This is because if the metal powder is not highly filled, the resin component layer interposed between the metal particles becomes thick and it is difficult to cause dielectric breakdown.
  • the price of the conductive adhesive with a large amount of conductive powder added tends to increase.
  • the materials that can be used as the conductive powder are limited, and metal powders such as aluminum, copper, iron, and tin other than the conductive powder form an oxide film of oxygen and metal. Even if kneaded, conductivity does not appear. As a matter of course, even if the metal oxide powder such as silicon oxide (silica), aluminum oxide (alumina), iron oxide (ferrite) or the like is highly filled, conductivity is not exhibited.
  • Conductive adhesives are often used in connection with electronic components, and similarly, high reliability is required.
  • Specific test methods for confirming reliability include a moisture resistance test (for example, 85 ° C. ⁇ 85% RH) that is left under high temperature and high humidity, and a heat cycle test / heat shock test (for example, ⁇ Changes in conductivity (resistance value and volume resistivity), adhesive force, etc. of the conductive adhesive are confirmed by repetition of 40 ° C. to 80 ° C.).
  • Patent Document 2 In order to reduce costs, it is known to use conductive powder and silver-plated glass powder as described in Patent Document 1, but in reality, the processing cost of the silver-plated glass powder itself is added. For this reason, it is difficult to reduce the cost of the powder itself, and a significant cost reduction cannot be achieved. Further, as described in Patent Document 2, a technique of physically rubbing spherical silver powder on the surface of copper powder subjected to 20% by weight of silver plating is used. However, when copper is used, the resistance value cannot be stabilized unless the content of the silver component as a whole is increased. Therefore, such a method prevents the cost reduction by increasing the content of the noble metal as a result.
  • Patent Document 3 As a composition for mixing silver powder and a magnet having ferromagnetism, the one described in Patent Document 3 is known. However, the composition of Patent Document 3 uses a magnet powder having ferromagnetism for noise reduction. I'm just using it. Moreover, although the use of ferrite is described in Patent Document 4, since it is used as iron oxide, it is a material different from a ferrite-based magnet having ferromagnetism. Furthermore, Patent Document 5 describes mixing ferromagnetic particles and conductive particles in the resin component, but adding ferromagnetic particles for the purpose of preventing the resin composition from clogging the plate during screen printing. is doing.
  • the conductive resin composition does not exhibit conductivity, so the cost cannot be reduced simply by reducing the conductive powder. . Even if the cost is reduced by using silver plating powder or alloy powder as an alternative to silver powder, the reliability of the conductive resin composition is low, the manufacturing process of the powder becomes complicated, and processing costs are added. Therefore, it has been difficult to significantly reduce the cost as the conductive resin composition.
  • the present inventors have realized that stable conductivity is exhibited even when the conductive powder is reduced, and both high reliability and cost reduction are achieved.
  • the inventors have completed an invention relating to a conductive resin composition that can be used.
  • the first embodiment of the present invention is a conductive resin composition
  • a conductive resin composition comprising the following components (A) to (C):
  • Nickel powder of less than 3 is a conductive resin composition comprising the following components (A) to (C): (A) component: curable resin composition; (B) component: powder having ferromagnetism; and (C) component: silver powder having a tap density of less than 0.1 to 1.5 g / cm 3 and / or an apparent density of 0.1 to 1.0 g / cm.
  • Nickel powder of less than 3 .
  • the component (B) is contained in an amount of 10 to 100 parts by weight per 100 parts by weight of the component (A).
  • the component (C) is contained in an amount of 25 to 70% by weight based on the total weight of the conductive resin composition of the present invention.
  • the component (B) has an average particle size of 0.1 ⁇ m to 5 ⁇ m.
  • the component (B) has a residual magnetic flux density of 1.0 to 14.0 kG.
  • the component (B) is made of anisotropic or isotropic magnet powder.
  • the magnet powder is a ferrite magnet powder.
  • the component (A) is selected from the group consisting of a thermosetting resin composition, a moisture curable resin composition, a photocurable resin composition, and a solvent volatile curable resin composition. At least one curable resin composition.
  • the component (A) is an epoxy resin composition, an epithio resin composition, a urethane resin composition, a moisture curable silicone resin composition, a thermosetting silicone resin composition, or an acrylic resin composition. At least one curable resin composition selected from the group consisting of a product, a methacrylic resin composition, and a vinyl ether resin composition.
  • the present invention it is possible to provide a conductive resin composition that can stabilize conductivity and reduce costs even if the amount of conductive powder added to the curable resin composition is reduced.
  • the component (A) that can be used in the present invention is not limited as long as it is a resin composition that is cured by heat curing, moisture curing, photocuring, solvent volatilization, or the like.
  • the thermosetting resin composition include an epoxy resin composition, a urethane resin composition containing a blocked isocyanate, a thermosetting silicone resin composition, an acrylic resin composition containing an organic peroxide, and a methacrylic resin composition.
  • the moisture curable resin composition include a urethane resin composition and a moisture curable silicone resin composition.
  • Specific examples of the photocurable resin composition include an acrylic resin composition containing a photoinitiator and a methacrylic resin composition.
  • the solvent volatile curable resin composition include a coating composition and a varnish.
  • the solvent volatile curable resin composition refers to a resin composition in which a solid content such as plastic or rubber remains by volatilization or drying of the solvent.
  • the epoxy resin composition includes a compound having one or more epoxy groups of Chemical Formula 1 in the molecule and at least one curing agent selected from a polyamine compound, a polyphenol compound, a polythiol compound, and an acid anhydride.
  • a tertiary amine compound can be used as a curing accelerator.
  • the tertiary amine compound may be used alone as a curing agent.
  • the curing agent and the curing accelerator may be liquid or solid (including powder) and are not limited.
  • an epoxy compound a compound having an epoxy group and a curing agent and / or a curing accelerator are all mixed, or a two-component type prepared separately and mixed at the time of use can also be used.
  • a compound having one or more epoxy groups in the molecule is referred to as an epoxy compound.
  • the epoxy compound include those obtained by condensation of epichlorohydrin with polyhydric phenols such as bisphenols and polyhydric alcohols, such as bisphenol A type, brominated bisphenol A type, hydrogenated bisphenol A type, Glycidyl ethers such as bisphenol F type, bisphenol S type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, novolak type, phenol novolak type, orthocresol novolak type, tris (hydroxyphenyl) methane type, tetraphenylolethane type There is a type epoxy resin.
  • polyhydric phenols such as bisphenols and polyhydric alcohols
  • bisphenol A type brominated bisphenol A type
  • hydrogenated bisphenol A type Glycidyl ethers
  • bisphenol F type bisphenol S type
  • bisphenol AF type bisphenol AF type
  • biphenyl type biphenyl type
  • naphthalene type fluorene type
  • glycidyl ester type epoxy resins obtained by condensation of epichlorohydrin with carboxylic acids such as phthalic acid derivatives and fatty acids
  • glycidyl amine type epoxy resins obtained by reaction of epichlorohydrin with amines, cyanuric acids, hydantoins
  • various An epoxy resin modified by various methods can be mentioned, but is not limited thereto.
  • monovalent epoxy compounds compounds having one epoxy group in the molecule
  • monovalent epoxy compounds include phenyl glycidyl ether, cresyl glycidyl ether, pt-butylphenyl glycidyl ether, butyl glycidyl ether, C12 to C14 alcohol glycidyl ether.
  • the epithio resin composition contains a compound having one or more epithio groups of Chemical Formula 2 in the molecule and at least one curing agent selected from a polyamine compound, a polyphenol compound, a polythiol compound, and an acid anhydride.
  • a tertiary amine compound can be used as a curing accelerator in order to improve the reactivity with respect to these compositions.
  • the tertiary amine compound may be used alone as a curing agent.
  • the curing agent and the curing accelerator may be liquid or solid (including powder) and are not limited.
  • an epithio compound a compound having an epithio group and a curing agent and / or a curing accelerator are all mixed, or a two-component type in which the compound is prepared separately and mixed at the time of use can be used.
  • a compound having one or more epithio groups in the molecule is referred to as an epithio compound.
  • epithio compound examples include 2,2-bis (4- (2,3-epithiopropoxy) phenyl) propane, bis (4- (2,3-epithiopropoxy) phenyl) methane, , 6-Di (2,3-epithiopropoxy) naphthalene, 1,1,1-tris- (4- (2,3-epithiopropoxy) phenyl) ethane, 2,2-bis (4- (2, 3-epithiopropoxy) cyclohexyl) propane, bis (4- (2,3-epithiopropoxy) cyclohexyl) methane, 1,1,1-tris- (4- (2,3-epithiopropoxy) cyclohexyl) ethane 1,5-pentanediol 2,3-epithiocyclohexyl) ether, 1,6-hexanediol di (3,4-epithiooctyl) ether
  • the curing agent or curing accelerator that can be used for epoxy compounds and epithio compounds are described below.
  • Specific examples of the polyamine compound include diethylenetriamine, triethylenetetramine, metaxylylenediamine, isophoronediamine, 1,3-bisaminomethylcyclohexane, diaminodiphenylmethane, metaphenylenediamine, diaminodiphenylsulfone, dicyandiamide, organic acid dihydrazide, Examples include, but are not limited to, piperidine.
  • the polyphenol compound examples include novolak type phenol resins obtained by reacting phenols such as phenol and alkylphenol with aldehydes such as formaldehyde and paraformaldehyde, and zylog type phenols which are modified phenol novolac resins.
  • phenols such as phenol and alkylphenol
  • aldehydes such as formaldehyde and paraformaldehyde
  • zylog type phenols which are modified phenol novolac resins.
  • resins include, but are not limited to, polyhydric phenol resins such as resins, dicyclopentadiene type phenol resins, and polyfunctional phenol resins.
  • a polyphenol compound that is liquid at room temperature is preferred.
  • polythiol compound examples include 3-methoxybutyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, tridecyl 3-mercaptopropionate, trimethylolpropane tristhiopropionate, pentaerythritol.
  • the acid anhydride examples include dodecenyl succinic anhydride, polyazeline acid anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, trimellitic anhydride, pyroanhydride
  • cyclic acid anhydrides such as merit acid, benzophenone tetracarboxylic anhydride, tetrabromophthalic anhydride, and head acid anhydride, it is not limited thereto.
  • the tertiary amine compound include a pulverized product of an epoxy adduct compound in which an epoxy resin typified by a bisphenol A type epoxy resin and the like and an amine compound react to an intermediate stage, an imidazole derivative, and a diazabicyclo derivative.
  • the curing agent is 30 to 120 parts by weight, preferably 50 to 100 parts by weight
  • the curing accelerator is 0.1 to 10 parts by weight, preferably 0.3 to 0.7 parts by weight based on 100 parts by weight of the epoxy compound or epithio compound. Parts by weight.
  • the urethane resin composition is a composition containing a compound having an isocyanate group and a curing agent for a polyol compound and / or a polyamine compound having a plurality of hydroxyl groups.
  • a catalyst an organic tin complex, an organic zinc complex, or a tertiary amine compound can be used.
  • the one-component type which mixed all the compositions and the two-component type which prepares separately and mixes at the time of use can also be used.
  • a compound having an isocyanate group is referred to as an isocyanate compound.
  • the isocyanate compound is not particularly limited as long as it has two or more isocyanate groups in one molecule, and examples thereof include aromatic diisocyanates, aliphatic diisocyanates, and alicyclic diisocyanates.
  • Specific examples of the compounds include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 2,2'- Diphenylmethane diisocyanate, polyphenylene polymethylene polyisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate, etc.
  • Aliphatic diisocyanates include tetramethylene diisocyanate, hexamethylene diisocyanate, and 2-methyl-1,5-pentane diisocyanate.
  • Examples of alicyclic diisocyanates include 1-methylcyclohexane-2,4-diisocyanate, isophorone diisocyanate, and dicyclohexylmethane-4,4′-diisocyanate, but are not particularly limited.
  • the compound which has a blocked isocyanate which blocks an isocyanate group with a protective group and removes the protective group by heating to generate an isocyanate group can also be used.
  • polyol compound examples include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 4,4′-dihydroxydiphenylmethane, glycerin, 1,2, There are those having at least two hydroxyl groups in the molecule such as 6-hexanetriol, 1,1,1-trimethylolpropane, pentaerythritol, sorbit, sucrose, but are not particularly limited.
  • polyamine compound examples include diethylenetriamine, triethylenetetramine, metaxylylenediamine, isophoronediamine, 1,3-bisaminomethylcyclohexane, diaminodiphenylmethane, metaphenylenediamine, diaminodiphenylsulfone, dicyandiamide, organic acid dihydrazide, Examples include, but are not limited to, piperidine.
  • An organotin complex is suitable for the catalyst in view of price and variety. Specific examples include dibutyltin dioctoate, dibutyltin acetate, dibutyltin dilaurate, butyltin-2-ethylhexoate, stannous caprylate, tin naphthenate, tin oleate, and tin butyrate. It is not limited to. Specific examples of the organic zinc complex include zinc acrylate, zinc acetate, zinc citrate, zinc salicylate, zinc oxalate, zinc adipate, zinc carbamate, zinc phthalocyanine, zinc thiolate and zinc stearate, naphthenic acid.
  • Examples include zinc, zinc decanoate, zinc butyrate, zinc neodecanoate, zinc isobutyrate, zinc benzoate, zinc octylate, and zinc 2-ethylhexanoate.
  • Examples of tertiary amine compounds include pulverized products of epoxy adduct compounds, imidazole derivatives, and diazabicyclo derivatives in which an epoxy resin represented by bisphenol A type epoxy resin or the like and an amine compound react to an intermediate stage. It is not limited to.
  • the curing agent is 10 to 100 parts by weight, preferably 30 to 70 parts by weight, and the catalyst is 0.001 to 1 part by weight, preferably 0.01 to 0.1 parts by weight, based on 100 parts by weight of the isocyanate compound.
  • the moisture curable silicone resin composition includes an organopolysiloxane having a hydroxyl group bonded to a silicon atom and a silane compound having a polyfunctional hydrolyzable group as a crosslinking agent. Furthermore, in order to cause these to undergo a condensation reaction, an organic complex composed of an organic tin complex, an amine compound, a titanium or zirconium group 4 element is used as a catalyst. Depending on the type of hydrolyzable group, there are dealcohol-type, deoxime-type, deacetate-type, and deketone-type. Moreover, the one-component type which mixed all the compositions and the two-component type which prepares separately and mixes at the time of use can also be used.
  • silanol an organopolysiloxane having a hydroxyl group bonded to a silicon atom.
  • the silanol preferably has two or more hydroxyl groups in one molecule, and usually both ends of the molecular chain are blocked with hydroxyl groups.
  • the type of organic group bonded to the silicon atom is not particularly limited.
  • an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a vinyl group.
  • alkenyl group such as an allyl group, an aryl group such as a phenyl group, a tolyl group, and a naphthyl group, an aralkyl group such as a 2-phenylethyl group, or a halogen atom such as a chlorine atom or a part or all of hydrogen atoms of these groups
  • an aryl group such as a phenyl group, a tolyl group, and a naphthyl group
  • an aralkyl group such as a 2-phenylethyl group
  • halogen atom such as a chlorine atom or a part or all of hydrogen atoms of these groups
  • the crosslinking agent is not particularly limited as long as it is a compound having 2 to 3 hydrolyzable groups in one molecule, and is preferably a silane coupling agent in which a hydrolyzable group is bonded to a silicon atom.
  • the hydrolyzable group include acyloxy groups such as acetoxy group, octanoyloxy group and benzoyloxy group, ketoxime groups such as dimethyl ketoxime group, methyl ethyl ketoxime group and diethyl ketoxime group, methoxy group, ethoxy group and propoxy group.
  • Group such as alkoxy group, isopropenyloxy group, alkenyloxy group such as 1-ethyl-2-methylvinyloxy group, amino group such as dimethylamino group, diethylamino group, butylamino group, cyclohexylamino group, dimethylaminoxy group
  • Examples thereof include, but are not limited to, aminoxy groups such as diethylaminoxy group, amide groups such as N-methylacetamide group, N-ethylacetamide group, and N-methylbenzamide group.
  • a methoxy group, an ethoxy group, and a propoxy group are preferable.
  • the catalyst include dibutyltin dioctoate, dibutyltin acetate, dibutyltin dilaurate, butyltin-2-ethylhexoate, stannous caprylate, tin naphthenate, tin oleate, and butyl.
  • examples include acid tin.
  • titanium catalysts tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium octylene glycolate, titanium tetraacetylacetonate, titanium ethyl acetoacetate, polyhydroxy titanium stearate , Titanium lactate, titanium triethanolamate and the like.
  • Zirconium-based catalysts include tetranormal propoxyzirconium, tetranormalbutoxyzirconium, zirconium tetraacetylacetonate, zirconium monobutoxyacetylacetonate bis (ethylacetoacetate), zirconium dibutoxybis (ethylacetoacetate), zirconium tetraacetylacetonate, Zirconium tributoxy systemate.
  • the compound which has an amine in the structure of a crosslinking agent can also be used as a catalyst.
  • amine compound examples include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (amino Ethyl) -3-aminopropylmethyldiethoxysilane, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, and 3-aminopropyltriethoxysilane.
  • the crosslinking agent is 0.1 to 25 parts by weight, preferably 1 to 20 parts by weight, and the catalyst is 0.001 to 1 part by weight, preferably 0.01 to 0.1 parts by weight, based on 100 parts by weight of silanol. .
  • the thermosetting silicone resin composition contains an organopolysiloxane having a vinyl group bonded to a silicon atom and an organopolysiloxane having a hydrogen atom bonded to a silicon atom.
  • platinum group metal complexes such as platinum, rhodium and palladium are used as catalysts. If a compound having a pi bond or an unshared electron pair such as an acetylene group, an ethylene group or a tertiary amine is used as an inhibitor, the reaction by the catalyst can be temporarily suppressed.
  • an organopolysiloxane having a vinyl group bonded to a silicon atom is referred to as vinyl siloxane
  • an organopolysiloxane having a hydrogen atom bonded to a silicon atom is referred to as hydrogen siloxane.
  • the vinyl siloxane preferably has two or more vinyl groups in one molecule.
  • a compound having vinyl groups at both ends is preferred.
  • R 1 represents an alkyl group such as methyl, ethyl, propyl, pentyl, octyl, undecyl, octadecyl, or the like, or a cycloalkyl group such as cyclohexyl, or an aryl group such as phenyl, tolyl, xylyl, benzyl, or 2-phenylethyl.
  • R 2 represents vinyl, x and y are integers of 0 to 3, n and m are integers of 0 or more (provided that x + y + m ⁇ 2), and n and m are each present in one molecule.
  • This represents the total number of —Si (CH 3 ) 2 O— units and —Si (H) (CH 3 ) O— units, and each unit may or may not be present together.
  • the hydrogen siloxane need only contain two or more hydrogen atoms (Si-H) bonded to silicon atoms in one molecule.
  • Chemical formula 4 partially having hydrogen atoms bonded to any silicon atom other than both ends
  • Chemical formula 5 having hydrogen atoms bonded to all silicon atoms other than both ends
  • the chemical formula 6 is specifically exemplified.
  • M is an integer of 2 or more
  • n is an integer of 1 or more
  • n and m are each a —Si (CH 3 ) 2 O— unit and —Si ( H) represents the total number of (CH 3 ) O-units, and each unit may or may not be present together.
  • the catalyst is a platinum group metal complex, it may be used as a catalyst, but platinum and rhodium are often used because of their large price and variety.
  • platinum catalysts include divinyltetramethyldisiloxane platinum complexes, tetravinyltetramethyltetracyclosiloxane platinum complexes for zero-valent platinum complexes, and dichlorobistriphenylphosphine palladium complexes for divalent platinum complexes, tetravalent.
  • the platinum complex include, but are not limited to, chloroplatinic acid.
  • rhodium catalysts include chlorotristriphenylphosphitrodium complex for monovalent rhodium complexes, tetrakisacetate dirhodium complex for divalent rhodium complexes, and trisacetylacetonatodium complex for trivalent rhodium complexes. However, it is not limited to these.
  • inhibitors include 1-ethynyl-1-cyclohexanol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol and 3 as acetylenic alcohols. -Methyl-1-dodecin-3-ol and the like.
  • polymethylvinylcyclosiloxane include 1,3,5,7-tetravinyltetramethyltetracyclosiloxane, divinyltetramethyldisiloxane, tetravinyldimethyldisiloxane, and trialkylcyanurate.
  • Other examples include, but are not limited to, diallyl maleate, dimethyl maleate, diethyl maleate, diallyl fumarate, and diethyl fumarate.
  • the hydrogen siloxane is 0.1 to 30 parts by weight, preferably 1 to 20 parts by weight, based on 100 parts by weight of the vinyl siloxane, and the catalyst is an effective amount, for example 0.001 to 1 part by weight, preferably 0.01.
  • the inhibitor is 0.001 to 1 part by weight, preferably 0.01 to 0.1 part by weight.
  • the acrylic resin composition, methacrylic resin composition, and vinyl ether resin composition are not limited as long as they are compounds having at least one acrylic group, methacrylic group, and vinyl ether group in one molecule. Specifically, there are monofunctional, bifunctional, trifunctional, and polyfunctional monomers and oligomers. Heat curing by generating radical species or cationic species from organic peroxides or cationic initiators by heating, and radicals from radical photoinitiators or cationic initiators by energy rays such as ultraviolet rays and visible light There is photocuring in which seeds or cationic species are generated and polymerized.
  • an acrylic compound compounds having an acrylic group, a methacrylic group, and a vinyl ether group are referred to as an acrylic compound, a methacrylic compound, and a vinyl ether compound, respectively, and all are collectively referred to as a vinyl compound.
  • the acrylic compound and the methacrylic compound are collectively referred to as a (meth) acrylic compound.
  • Organic peroxides, radical photoinitiators, and cationic initiators are collectively referred to as initiators.
  • monofunctional (meth) acrylic monomers include lauryl (meth) acrylate, stearyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, and cyclohexyl (meth) acrylate.
  • Dicyclopentanyl (meth) acrylate Dicyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate , Nonylphenoxyethyl (meth) acrylate, nonylphenoxytetraethylene glycol (meth) acrylate, methoxydiethylene glycol (Meth) acrylate, ethoxydiethylene glycol (meth) acrylate, butoxyethyl (meth) acrylate, butoxytriethylene glycol (meth) acrylate, 2-ethylhexyl polyethylene glycol (meth) acrylate, nonylphenyl polypropylene glycol (meth) acrylate, methoxy
  • bifunctional (meth) acrylic monomer examples include 1,3-butylene glycol di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1, 6-hexane glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, EO-modified neopentyl glycol Di (meth) acrylate, propylene oxide side (hereinafter abbreviated as PO) modified neopentyl glycol di (meth) acrylate, bisphenol A di (meth) acrylate, EO modified bisphenol A di (meth) acrylate, CH-modified bisphenol A di (meth) acrylate, EO-modified bisphenol S di (meth) acrylate
  • trifunctional (meth) acrylic monomers include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate, PO-modified trimethylolpropane tri ( Examples include, but are not limited to, (meth) acrylate, ECH-modified trimethylolpropane tri (meth) acrylate, ECH-modified glycerol tri (meth) acrylate, and tris (acryloyloxyethyl) isocyanurate.
  • polyfunctional (meth) acrylic monomer examples include ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol pentaacrylate, Examples include, but are not limited to, dipentaerythritol hexa (meth) acrylate and caprolactone-modified dipentaerythritol hexa (meth) acrylate.
  • (meth) acrylic oligomers include bisphenol A type, novolac type, polyhydric alcohol type, polybasic acid type, polybutadiene type epoxy (meth) acrylate, polyester type, polyether type urethane (meth) acrylate. However, it is not limited to these.
  • vinyl ether compound examples include ethylene glycol divinyl ether, 1,3-propanediol divinyl ether, propylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,3-butanediol divinyl ether, 1,2- Butanediol divinyl ether, 2,3-butanediol divinyl ether, 1-methyl-1,3-propanediol divinyl ether, 2-methyl-1,3-propanediol divinyl ether, 2-methyl-1,2-propanediol Divinyl ether, 1,5-pentanediol divinyl ether, 1,6-hexanediol divinyl ether, cyclohexane-1,4-diol divinyl ether, cyclohexane-1,4-dimethanol divinyl ether p-xylene glycol divinyl ether, diethylene glycol
  • organic peroxide examples include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl acetoacetate peroxide, and acetylacetone peroxide.
  • ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl acetoacetate peroxide, and acetylacetone peroxide.
  • Photoinitiators that can be used for photocuring include radical photoinitiators that generate radical species by energy rays such as visible light, ultraviolet rays, X-rays, and electron beams, and cationic species such as Bronsted acid and Lewis acid. There are cationic initiators that generate. When using it for a (meth) acrylic compound, a radical initiator is preferable, but when using a vinyl ether compound, a radical initiator and / or a cationic initiator can be used.
  • radical photoinitiator examples include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 4- (2-hydroxyethoxy) phenyl- (2 -Hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenylketone, 2-methyl-2-morpholino (4-thiomethylphenyl) propan-1-one, 2-benzyl-2-dimethylamino-1- (4- Acetophenones such as morpholinophenyl) butanone and 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone oligomers; benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl Ether etc.
  • Examples of the cationic initiator include diazonium salts, sulfonium salts, and iodonium salts. Specific examples include benzenediazonium hexafluoroantimonate, benzenediazonium hexafluorophosphate, benzenediazonium hexafluoroborate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroborate, 4 , 4'-bis [bis (2-hydroxyethoxyphenyl) sulfonio] phenyl sulfide bishexafluorophosphate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate, diphenyl-4-thiophenoxyphenylsulfonium hexafluoro There is a
  • the coating composition examples include a composition in which a plastic (such as general-purpose plastic or engineering plastic), rubber (such as a diene rubber or non-diene rubber), or a thermoplastic elastomer is dissolved in a solvent.
  • a plastic such as general-purpose plastic or engineering plastic
  • rubber such as a diene rubber or non-diene rubber
  • thermoplastic elastomer a thermoplastic elastomer
  • plastics polyethylene, polypropylene, vinyl chloride resin, polystyrene, ABS resin, PET resin, methacrylic resin (acrylic resin), polyvinyl alcohol, engineering plastics such as polycarbonate, polyamide, polyacetal, polybutylene terephthalate, fluorine Resin etc. are mentioned.
  • diene rubber natural rubber, isoprene rubber, butadiene rubber, styrene butadiene rubber, chloroprene rubber, acrylonitrile butadiene rubber and the like can be mentioned.
  • non-diene rubbers include butyl rubber, ethylene propylene rubber, urethane rubber, silicone rubber, chlorosulfonated rubber, chlorinated polyethylene, acrylic rubber, epichloro non-drin rubber, and fluororubber. These copolymers are also included in the rubber.
  • thermoplastic elastomers with intermediate properties between plastic and rubber styrene such as SIS (styrene isoprene styrene block copolymer), SEPS (styrene ethylene propylene styrene block copolymer), TPO (thermopolyolefin), TPV ( Olefins such as thermoplastic vulcanized elastomers, ethylene-vinyl acetates such as EVA (ethylene vinyl acetate copolymer), EEA (ethylene ethyl acrylate), or other vinyl chlorides, urethanes, esters, amides , Fluorine-based, ionomer-based, isobutylene-based, silicone-based, and the like, but are not limited thereto.
  • SIS styrene isoprene styrene block copolymer
  • SEPS styrene ethylene propylene styrene block copoly
  • gum, and a thermoplastic elastomer there will be no limitation if it can dissolve each composition.
  • the solvent include aliphatic hydrocarbon type, aromatic type and ester type solvents.
  • aliphatic hydrocarbons include n-hexane and petroleum solvents
  • aromatics include toluene and xylene
  • esters include ethylene glycol mononormal butyl ether and ethylene glycol. Examples include, but are not limited to, monomethyl ether and ethylene glycol monoethyl ether acetate.
  • pigments, dyes and other colorants in the range not impairing the characteristics of the present invention, pigments, dyes and other colorants, metal powders, calcium carbonate, talc, silica, alumina, aluminum hydroxide and other inorganic fillers, flame retardants, organic fillers, plasticizers, oxidation
  • An appropriate amount of additives such as an inhibitor, an antifoaming agent, a silane coupling agent, a leveling agent, a rheology control agent, and a solvent can be blended.
  • the component (B) is a ferromagnetic powder and may correspond to a permanent magnet.
  • a permanent magnet is an object that retains its properties as a magnet for a relatively long period of time without receiving a magnetic field or current from the outside.
  • Specific examples of permanent magnets include alnico magnets mainly composed of aluminum, nickel, and cobalt, ferrite magnets composed mainly of iron and strontium or barium, and main components composed of neodymium, samarium, and cobalt. And rare earth magnets.
  • soft iron or the like having a property as a magnet only when it is magnetized by an external magnetic field is called a temporary magnet.
  • the residual magnetic flux density is used as a measure of magnetism.
  • Ferromagnetism described in the present specification means that the residual magnetic flux density is 1.0 or more.
  • Component (B) suitable for use in the present invention has a residual magnetic flux density of 1.0 to 14.0 kG, preferably 1.0 to 7.0 kG, and more preferably 1.5 to 3.0 kG.
  • Alnico magnets and rare earth magnets have a residual magnetic flux density (Br) of 9.0 to 14.0 kG, preferably 7.0 to 10.0 kG.
  • Ferrite magnets have a residual magnetic flux density (Br) of 1. Those having 0 to 5.0 kG, preferably 1.5 to 3.0 kG can be used.
  • ⁇ Magnets can be made with strong magnetism only in a specific direction. This is called an anisotropic magnet. Anisotropic magnets are characterized by being strong in a specific direction and tend not to be magnetized in other directions. A magnet having the same magnetism in any direction is said to be isotropic and has a characteristic that it is accompanied by magnetism in any direction although the magnetism is weak.
  • anisotropic and anisotropic magnet powders are magnets that can be added to and mixed with a resin such as plastic or rubber, and then shaped and solidified into a predetermined shape by compression, injection, extrusion, or the like.
  • a resin such as plastic or rubber
  • anisotropic magnetic powders There are two types of processing methods for anisotropic magnetic powders, namely, mechanical orientation and magnetic orientation. Since mechanical orientation is oriented by mechanical shear between rolls, a plate-shaped magnet powder is used so that orientation is easy.
  • the magnetic field orientation is extruded by an injection molding machine in a magnetic field, and a magnetic powder having a slightly rounded particle shape is used so as not to receive resistance during flow.
  • the isotropic magnet powder is molded while the particles are at random directions.
  • the component (B) that can be used in the present invention is not limited as long as it is a magnet powder having ferromagnetism, but an anisotropic or isotropic ferrite-based magnet powder is preferable in consideration of price. .
  • the molding density is 2.0 to 4.0 g / cm 3
  • the coercive force is 140 kA / m or less (for example, 1 to 140 kA / m)
  • the intrinsic coercive force is 300 kA / m or less (for example, 1 to 300 kA / m)
  • the maximum energy A product having a product of 10 kJ / m 3 or less can be used.
  • the ferrite magnet powder include anisotropic ferrite powders OP-56 and NF-56 for machine orientation manufactured by DOWA Electronics Co., Ltd., anisotropic ferrite powders NF-350, OP-71 for magnetic field orientation, There are NP-110 and SF-120, and isotropic ferrite powders NEY, NRK, BOP-B, and BOP-K.
  • Specific examples of ferrite-based magnet powders include anisotropic ferrite powders for magnetic field orientation MA-951, FL-900, FM-201, FA-700, and FAN-800 manufactured by Toda Kogyo Co., Ltd., mechanical orientation.
  • Preferred as the component (B) of the present invention are OP-56, NF-350 and BOP-K manufactured by DOWA Electronics Co., Ltd.
  • Component (B) is added in an amount of 10 to 100 parts by weight, preferably 10 to 70 parts by weight, based on 100 parts by weight of the curable resin composition.
  • the component (C) used in the present invention is preferably silver powder and / or nickel powder in consideration of price and variety of particle shapes. Basically, a powder having a small apparent density or tap density is preferred. These powders are preferably powders having an aggregated structure while having a structurally appropriate space.
  • Silver powder has a tap density of less than 1.5 g / cm 3 , preferably 0.1 g / cm 3 to 1.5 g / cm 3 , more preferably 0.5 g / cm 3 to 1.2 g / cm 3 , and nickel powder Then, the apparent density is less than 1.0 g / cm 3 , preferably 0.1 g / cm 3 to 1.0 g / cm 3 , more preferably 0.4 g / cm 3 to 1.0 g / cm 3 . Since silver powder and nickel powder have different densities, tap density is used for silver powder and apparent density is used for nickel powder. This is because nickel has a lighter density than silver, and therefore, when tap density is measured on nickel powder, there is a tendency that the numerical value does not easily differ.
  • the tap density test method conforms to JISZ2512, and the apparent density test method conforms to JISZ2504.
  • Conductivity is exhibited when the amount of component (C) added is 25% by weight or more based on the total weight (solid content (excluding volatile components)) of the resin composition of the present invention.
  • the amount is preferably 25 to 70% by weight, more preferably 25 to 60% by weight.
  • Specific examples of silver powder include 3010 (tap density: 1.0 g / cm 3 ) manufactured by Mitsui Mining & Smelting Co., Ltd., G-14 (tap density: 0.8 g / cm 3 ) manufactured by DOWA Hightech Co., Ltd. There is Sylbest E-20 (tap density: 0.8 g / cm 3 ) manufactured by Chemical Research Laboratory.
  • nickel powder examples include NickelType210 (apparent density: 0.5 g / cm 3 ), NickelType255 (apparent density: 0.6 g / cm 3 ), NickelType287 (apparent density: manufactured by INCO Limited). 0.85 g / cm 3 ).
  • the conductivity becomes stable as the conductive resin composition.
  • Powders that are easily filled are often silver powders with a tap density of 2.0 g / cm 3 or more and nickel powders with an apparent density of 1.5 g / cm 3 or more, and spherical powders (including irregular shapes) Most of the scaly powder (flaky powder) applies to this. These powders have little secondary agglomeration and are close to primary particles, so they can be highly packed.However, since the particle network is disjoint, the conductivity is not good when conducting and is not highly charged. Does not stabilize.
  • the resin composition of the present invention can obtain better conductivity by improving the dispersibility of the component (B) and the component (C).
  • the dispersibility is improved so that the maximum particle size of each component is 50 ⁇ m or less during preparation.
  • the dispersion method include a Hoover-type Muller method and a paint conditioner type shaking method.
  • a homogenizer, a single-shaft small electric stirrer, a twin-shaft stirrer, a ball mill, a three-roll mill, or the like may be used during the production of the resin composition.
  • the dispersibility confirmation test can be performed using a grindometer or a grind gauge.
  • the mechanism by which the conductivity is developed by combining the (B) component and the (C) component has not been completely elucidated, but is considered as follows.
  • the primary particles of the magnet powder (B) have a force to attract each other by magnetic force.
  • the silver powder is interposed between the magnet powder and the magnet powder, and the particles of the silver powder are formed by the magnetic force of the component (B). It is considered that the distance between the powders of silver powder is reduced by being pressed. This means that the curable resin composition intervening between the powders of silver powder becomes a thin film, and it is considered that the dielectric breakdown easily occurs and the conductivity is developed.
  • the component (C) is presumed to be suitable for the present invention because it has a network suitable for conduction through secondary aggregation.
  • Example 1 to 7 In order to prepare the conductive resin composition, the following components were prepared.
  • Curing accelerator Epoxy resin amine adduct based curing accelerator (Amicure MY-24 manufactured by Ajinomoto Fine Techno Co., Ltd.) ⁇ Solvent: Xylene for industrial use (Xylol Japan Alcohol Sales Co., Ltd.)
  • the main agent, the curing agent and the solvent were added to a stirrer and stirred for 10 minutes. Thereafter, the component (B) was added and stirred for 10 minutes. The component (C) was added and further stirred for 30 minutes. Finally, the curing accelerator was added and stirred for 10 minutes.
  • Table 1 Detailed preparation amounts are in accordance with Table 1, and all numerical values are expressed in parts by weight.
  • the main agent, the curing agent and the solvent were added to a stirrer and stirred for 10 minutes. Thereafter, the component (C) or the component (C ′) was added and further stirred for 30 minutes. Finally, the curing accelerator was added and stirred for 10 minutes.
  • the detailed preparation amount follows Table 1.
  • the main agent, the curing agent and the solvent were added to a stirrer and stirred for 10 minutes. Thereafter, the component (B) was added and stirred for 10 minutes, and then the component (C ′) or the component (C ′′) was added and stirred for another 30 minutes. Finally, the curing accelerator was added. The mixture was stirred for 10 minutes.
  • Example 8 to 14 and Comparative Examples 5 to 8 a conductive resin composition in which the component (A) is a moisture curable resin composition containing silanol and a crosslinking agent was prepared to prepare a test piece. Allow to cure for 24 hours at °C ⁇ 50% RH.
  • the main agent and the crosslinking agent were added to a stirrer and stirred for 10 minutes while vacuum degassing. Thereafter, the additive and the component (B) were added and stirred for 10 minutes while vacuum degassing. The component (C) was added and stirred for 120 minutes while vacuum degassing. Finally, the catalyst was added and stirred for 5 minutes while vacuum degassing.
  • Table 2 Detailed preparation amounts are in accordance with Table 2, and all numerical values are expressed in parts by weight.
  • the main agent and the crosslinking agent were added to a stirrer and stirred for 10 minutes while vacuum degassing. Thereafter, the additive was added and stirred for 10 minutes while vacuum degassing. The component (C) or the component (C ′) was added and stirred for 120 minutes while vacuum degassing. Finally, the catalyst was added and stirred for 5 minutes while vacuum degassing.
  • the detailed preparation amount follows Table 2.
  • the main agent and the cross-linking agent were added to a stirrer and stirred for 10 minutes while vacuum degassing. Thereafter, the additive and the component (B) were added and stirred for 10 minutes while vacuum degassing. The component (C ′) or the component (C ′′) was added and stirred for 120 minutes while vacuum degassing. Finally, the catalyst was added and stirred for 5 minutes while vacuum degassing. According to Table 2.
  • ⁇ Volume resistivity ( ⁇ ⁇ m)
  • R Resistance value between electrodes (R: ⁇ ⁇ m)
  • A Cross-sectional area with respect to the current direction (width 10 mm ⁇ thickness t: mm)
  • L Length between electrodes (50 mm)

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L’invention concerne une composition de résine conductrice qui présente une conductivité stable et est peu coûteuse, même si la quantité de poudre conductrice ajoutée à une composition de résine durcissable est réduite. La composition de résine conductrice comprend les composants (A) à (C) suivants : composant (A) : composition de résine durcissable ; composant (B) : poudre ferromagnétique ; et composant (C) : poudre d’argent ayant une densité tassée de 0,1 à moins de 1,5 g/cm3 et/ou poudre de nickel ayant une densité apparente de 0,1 à moins de 1,0 g/cm3.
PCT/JP2009/002326 2008-05-31 2009-05-27 Composition de résine conductrice WO2009144925A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200980115570.2A CN102015906B (zh) 2008-05-31 2009-05-27 导电性树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008143987A JP5534127B2 (ja) 2008-05-31 2008-05-31 導電性樹脂組成物
JP2008-143987 2008-05-31

Publications (1)

Publication Number Publication Date
WO2009144925A1 true WO2009144925A1 (fr) 2009-12-03

Family

ID=41376815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/002326 WO2009144925A1 (fr) 2008-05-31 2009-05-27 Composition de résine conductrice

Country Status (3)

Country Link
JP (1) JP5534127B2 (fr)
CN (1) CN102015906B (fr)
WO (1) WO2009144925A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102841503A (zh) * 2012-09-18 2012-12-26 江苏科技大学 一种用于触摸屏的光刻电子银胶组合物及其制备方法
CN105377993A (zh) * 2013-07-11 2016-03-02 思美定株式会社 导电性固化物的制造方法以及导电性固化物和脉冲光固化性组合物的固化方法以及脉冲光固化性组合物
CN111417695A (zh) * 2018-02-02 2020-07-14 株式会社Lg化学 半导体用粘合膜
WO2023080028A1 (fr) * 2021-11-02 2023-05-11 昭栄化学工業株式会社 Composition de résine électroconductrice thermodurcissable, et procédé de production d'un composant électronique
WO2023080027A1 (fr) * 2021-11-02 2023-05-11 昭栄化学工業株式会社 Composition de résine conductrice thermodurcissable et procédé de production de composant électronique

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
CN104356801A (zh) * 2014-10-17 2015-02-18 苏州莱特复合材料有限公司 一种电磁屏蔽金属粉末复合涂料及其制备方法
JP6319530B1 (ja) * 2016-08-19 2018-05-09 住友ベークライト株式会社 ダイアタッチペーストおよび半導体装置
CN109251709A (zh) * 2018-08-28 2019-01-22 善仁（浙江）新材料科技有限公司 一种可室温储存的中低温固化导电胶及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492324B1 (fr) * 1970-12-29 1974-01-19
JPH09134814A (ja) * 1995-08-01 1997-05-20 Loctite Ireland Ltd 異方性のある導電路を有するフィルム及びコーティング
JP2001319523A (ja) * 2000-05-10 2001-11-16 Jsr Corp 導電性ペースト組成物
JP2002203428A (ja) * 2000-12-27 2002-07-19 Jsr Corp 導電性ペースト組成物
JP2005516357A (ja) * 2001-07-03 2005-06-02 トライボンド・インコーポレーテッド デュアルサセプタを用いる誘導加熱

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
CN1737072B (zh) * 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
JP4622705B2 (ja) * 2005-07-01 2011-02-02 パナソニック株式会社 パネルスイッチ用可動接点体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492324B1 (fr) * 1970-12-29 1974-01-19
JPH09134814A (ja) * 1995-08-01 1997-05-20 Loctite Ireland Ltd 異方性のある導電路を有するフィルム及びコーティング
JP2001319523A (ja) * 2000-05-10 2001-11-16 Jsr Corp 導電性ペースト組成物
JP2002203428A (ja) * 2000-12-27 2002-07-19 Jsr Corp 導電性ペースト組成物
JP2005516357A (ja) * 2001-07-03 2005-06-02 トライボンド・インコーポレーテッド デュアルサセプタを用いる誘導加熱

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102841503A (zh) * 2012-09-18 2012-12-26 江苏科技大学 一种用于触摸屏的光刻电子银胶组合物及其制备方法
CN105377993A (zh) * 2013-07-11 2016-03-02 思美定株式会社 导电性固化物的制造方法以及导电性固化物和脉冲光固化性组合物的固化方法以及脉冲光固化性组合物
CN105377993B (zh) * 2013-07-11 2019-03-22 思美定株式会社 导电性固化物的制造方法以及导电性固化物和脉冲光固化性组合物的固化方法以及脉冲光固化性组合物
CN111417695A (zh) * 2018-02-02 2020-07-14 株式会社Lg化学 半导体用粘合膜
EP3705547A4 (fr) * 2018-02-02 2021-03-03 Lg Chem, Ltd. Film adhésif pour semi-conducteur
CN111417695B (zh) * 2018-02-02 2022-06-17 株式会社Lg化学 半导体用粘合膜
CN111417695B9 (zh) * 2018-02-02 2022-07-08 株式会社Lg化学 半导体用粘合膜
US11479699B2 (en) 2018-02-02 2022-10-25 Lg Chem, Ltd. Adhesive film for semiconductor
WO2023080028A1 (fr) * 2021-11-02 2023-05-11 昭栄化学工業株式会社 Composition de résine électroconductrice thermodurcissable, et procédé de production d'un composant électronique
WO2023080027A1 (fr) * 2021-11-02 2023-05-11 昭栄化学工業株式会社 Composition de résine conductrice thermodurcissable et procédé de production de composant électronique

Also Published As

Publication number Publication date
JP5534127B2 (ja) 2014-06-25
CN102015906B (zh) 2013-04-17
CN102015906A (zh) 2011-04-13
JP2009286977A (ja) 2009-12-10

Similar Documents

Publication Publication Date Title
JP5534127B2 (ja) 導電性樹脂組成物
KR102396869B1 (ko) 열경화형 도전성 접착제
KR100787727B1 (ko) 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물
TWI526476B (zh) Silicone rubber composition
JP6405867B2 (ja) 樹脂ペースト組成物及び半導体装置
EP3333225A1 (fr) Composition électroconductrice, conducteur, et carte de circuit imprimé flexible
KR100673778B1 (ko) 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법
JP2015110745A (ja) 光硬化型導電性組成物
KR101138798B1 (ko) 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름
KR102196530B1 (ko) 전도성 입자 또는 강화 필러를 포함하는 신축성 기판의 제조방법 및 그를 포함하는 신축성 전자기기의 제조방법
TW200404866A (en) Conducting contact elements and electric connectors
WO2010107059A1 (fr) Composition pour remplissage d'entrefer de décharge et protecteur contre les décharges électrostatiques
KR100811430B1 (ko) 속경화형 이방성 도전 접착 필름용 조성물 및 이를 이용한이방성 도전 접착 필름
KR101131163B1 (ko) 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
JP2019185936A (ja) 銀被覆エラストマー粒子並びにこれを用いた柔軟導電材料及び導電ペースト
CN111886292B (zh) 导电性组合物以及使用其的导电性结构体
US11021626B2 (en) Conductive paste
KR100686612B1 (ko) 탄소나노튜브를 포함하는 도전성 실리콘 수지 조성물
JP5720576B2 (ja) 誘電体、誘電体フィルム、及び積層体
WO2019131311A1 (fr) Carte de câblage et son procédé de fabrication, et composition durcissable conductrice
KR102282829B1 (ko) 회로 접속 재료, 회로 부재의 접속 구조체 및 회로 부재의 접속 구조체의 제조 방법
JP2000077891A (ja) 可撓性金属層併設シリコーンゴム材料
JP2008156579A (ja) 導電性シリコーンゴム組成物
JP3785819B2 (ja) 半導電性樹脂組成物およびそれを使用した半導電性ローラ
JP2010031292A (ja) 導電性液状シリコーンゴム組成物

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980115570.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09754434

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09754434

Country of ref document: EP

Kind code of ref document: A1