WO2009144790A1 - 電子部品ハンドリング装置、電子部品試験装置および電子部品保持トレイ - Google Patents

電子部品ハンドリング装置、電子部品試験装置および電子部品保持トレイ Download PDF

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Publication number
WO2009144790A1
WO2009144790A1 PCT/JP2008/059829 JP2008059829W WO2009144790A1 WO 2009144790 A1 WO2009144790 A1 WO 2009144790A1 JP 2008059829 W JP2008059829 W JP 2008059829W WO 2009144790 A1 WO2009144790 A1 WO 2009144790A1
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WO
WIPO (PCT)
Prior art keywords
holding
electronic component
pitch
tray
electronic
Prior art date
Application number
PCT/JP2008/059829
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English (en)
French (fr)
Japanese (ja)
Inventor
明彦 伊藤
光範 相澤
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to PCT/JP2008/059829 priority Critical patent/WO2009144790A1/ja
Priority to TW098114005A priority patent/TW201000380A/zh
Publication of WO2009144790A1 publication Critical patent/WO2009144790A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to an electronic component handling apparatus capable of handling a holding tray capable of holding an electronic component (hereinafter also referred to as an IC device) such as a semiconductor integrated circuit element, and a test of the electronic component.
  • the present invention relates to an electronic component testing apparatus for performing the above and a holding tray capable of holding the electronic component.
  • an electronic component test apparatus is used to test the performance and function of the IC device in a packaged state.
  • a handler that constitutes the electronic component testing apparatus transfers IC devices from the customer tray to the test tray, conveys the test tray onto the test head, and places the IC device on the test tray.
  • the IC device is pressed against the provided socket.
  • a tester constituting the electronic component test apparatus performs a test of the IC device via the test head.
  • the handler transfers the IC device again from the test tray to the customer tray while classifying the IC device based on the test result.
  • the customer tray is a tray for storing IC devices before or after the test.
  • the IC device before the test is supplied from the previous process to the handler while being accommodated in the customer tray, and the tested IC device is sent from the handler to the subsequent process while being accommodated in the customer tray.
  • the test tray is a dedicated tray that is circulated and conveyed in the handler.
  • the pick-and-place apparatus can be simplified by eliminating the pitch conversion between the IC devices when the IC device is transferred between the customer tray and the test tray.
  • the pitch between the accommodating parts in the customer tray is relatively narrow. Therefore, for example, when a test using a high-frequency signal is supported, there is a case where a sufficient space for wiring around the socket cannot be secured on the test head.
  • the problem to be solved by the present invention is to provide an electronic component handling device, an electronic component test device, and an electronic component holding tray that can secure a wide wiring space on the test head.
  • an electronic component handling apparatus capable of handling a holding tray capable of holding an electronic component, wherein at least a part of the plurality of holding portions of the holding tray is provided between the holding portions.
  • an electronic component handling apparatus provided with a pitch changing means for changing the pitch of the electronic component (refer to claim 1).
  • the plurality of holding portions can be finely moved independently of each other (see claim 2).
  • the pitch changing means is configured such that the pitch between the holding portions is an integral multiple of the pitch between the electronic components arranged in a customer tray loaded into and out of the electronic component handling device, Alternatively, it is preferable to change the pitch between at least some of the plurality of holding portions so as to be the same as the pitch between the contact portions in the test head (see claim 3). .
  • the pitch changing unit changes a pitch between at least some of the holding groups, each of which is composed of a specific number of the holding units. (See claim 4).
  • the plurality of holding groups can be finely moved independently of each other (see claim 5).
  • the pitch changing means is configured such that the pitch between the holding portions is an integer of the pitch between the electronic components arranged in a customer tray that is loaded into and out of the electronic component handling device. It is preferable to change the pitch between the holding groups of at least a part of the plurality of holding groups so as to be doubled or the pitch between the contact portions in the test head (refer to claim 6). ).
  • the holding tray directly receives the electronic component from the customer tray (see claim 7).
  • an electronic component test apparatus for testing an electronic device under test, the above-described handling device, a test head having a contact portion that is in electrical contact with the electronic device under test, and the test A tester electrically connected to the head, and the handling device is provided with an electronic component testing device that presses the electronic device under test against the contact portion during the test (see claim 8).
  • the pitch changing means may be arranged such that the pitch between the holding portions is set so that the arrangement of the holding portions corresponds to the arrangement of the contact portions for testing the electronic device under test.
  • an electronic component handling apparatus capable of handling a holding tray having a plurality of holding portions capable of holding an electronic component, wherein the storage portion included in the storage means that stores the electronic component,
  • an electronic component handling apparatus provided with transfer means for thinning out electronic components and transferring them to the holding portion of the holding tray (refer to claim 10).
  • the plurality of holding units or the plurality of holding groups each constituted by a specific number of the holding units can be finely moved independently from each other. reference).
  • the apparatus further includes a plurality of conveying means for conveying the holding tray holding the electronic component to a position facing the test head, and the transfer means is provided for each of the conveying means. It is preferable that the electronic components to be tested housed in the housing means are thinned out and transferred to the supplied holding trays (see claim 12).
  • the accommodating means is a customer tray that is thrown into and out of the electronic component handling apparatus, and a pitch between the plurality of holding portions is a pitch between the accommodating portions in the customer tray.
  • the holding tray receives the electronic components from the customer tray in a state where the arrangement of the electronic components is maintained (see claim 13).
  • the holding tray directly receives the electronic component from the storage means (see claim 14).
  • a closing unit that closes the storage unit that stores the electronic component that remains in the storage unit when the electronic component is transferred from the storage unit to the holding tray. (See claim 15).
  • an electronic component test apparatus for testing an electronic device under test, the above-described handling device, a test head having a contact portion that is in electrical contact with the electronic device under test, and the test A tester electrically connected to the head, and the handling device is provided with an electronic component testing device that presses the electronic device under test against the contact portion during the test (see claim 16).
  • an electronic component holding tray provided with a plurality of first holding portions each capable of holding an electronic device under test, wherein the plurality of first holding portions are at least along a first direction.
  • the pitch between the first holding portions along the first direction includes a first pitch and a second pitch different from the first pitch.
  • a tray is provided (see claim 18).
  • the interval between the first holding portions arranged at the second pitch is five times the interval between the first holding portions arranged at the first pitch. The above is preferable (see claim 19).
  • variable mechanism includes a variable mechanism that varies the second pitch, and the variable mechanism is configured so that the second pitch is substantially the same as the first pitch.
  • the second pitch can be changed (see claim 20).
  • the plurality of first holding units or the holding group including the specific number of the first holding units can be finely moved independently of each other (See claim 21).
  • an electronic component handling apparatus capable of handling the above holding tray, in a state in which the arrangement of the electronic components in the customer tray put into and out of the electronic component handling apparatus is maintained.
  • An electronic component handling apparatus is provided that includes first transfer means for transferring the electronic component between the customer tray and the holding tray (see claim 22).
  • the customer tray has a plurality of accommodating portions capable of accommodating the electronic components, and the first pitch in the holding tray and the first in the customer tray
  • the pitch between the receiving portions along the direction is substantially the same, the pitch between the first holding portions along the second direction in the holding tray, and the second in the customer tray It is preferable that the pitch between the accommodating portions along the direction is substantially the same (see claim 23).
  • the first transfer means has a plurality of suction ports for sucking and holding the electronic component, and the pitch between the suction ports along the first direction is
  • the pitch between the suction ports along the second direction is substantially the same as the first pitch
  • the pitch between the suction ports along the second direction in the holding tray is between the first holding parts along the second direction. It is preferable that the pitch is substantially the same (see claim 24).
  • the electronic device is provided with pressing means for pressing the electronic component against the contact portion in a state where the electronic component is accommodated in the holding tray (see claim 25).
  • a second transfer for transferring the electronic component between the holding tray and a second holding tray having a plurality of second holding portions capable of holding the electronic component. It is preferable that the apparatus further includes a loading unit and a pressing unit that presses the electronic component against the contact portion of the test head in a state where the electronic component is held on the second holding tray (see claim 26).
  • an electronic component test apparatus for testing an electronic device under test, the above-described handling device, a test head having a contact portion that is in electrical contact with the electronic device under test, A tester electrically connected to the test head, and the handling device is provided with an electronic component testing device that presses the electronic device under test against the contact portion during testing (see claim 27). ).
  • the electronic device under test is pressed against the contact portion of the test head in a state where the electronic device under test is respectively held on the holding tray having a plurality of holding portions, and the electronic device under test is tested.
  • the contact part of the test head is in direct contact with the electronic device under test held by the holding part, and the electronic device under test is brought into contact with the contact part.
  • An electronic component testing apparatus having positioning means for positioning is provided (see claim 28).
  • the holding tray directly receives the electronic device under test from a customer tray carried into and out of the electronic device test apparatus (see claim 29).
  • the pitch change means changes the pitch between the holding portions and the holding group of the holding tray, or the transfer means thins out and transfers the electronic components to be tested from the storage means to the holding tray. For this reason, the pitch between the electronic components to be tested held on the holding tray is increased, and the pitch between the contact portions on the test head can be increased accordingly. A wide space can be secured.
  • the pitch between the electronic devices under test held on the holding tray can be partially widened. Accordingly, the pitch between the contact portions on the test head is also partially widened. It is possible to secure a wide space for wiring.
  • the positioning means directly contacts the electronic device under test held on the holding tray and positions the electronic device under test with respect to the contact portion, the electronic device under test is positioned with high accuracy. be able to.
  • FIG. 1 is a schematic plan view showing the overall configuration of the electronic component testing apparatus according to the first embodiment of the present invention.
  • FIG. 2 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG.
  • FIG. 3 is a perspective view showing a contact plate used in the electronic component testing apparatus of FIG.
  • FIG. 4 is a perspective view showing a state in which the contact plate of FIG. 3 is expanded.
  • FIG. 5 is a rear view of the contact plate of FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.
  • FIG. 7 is a plan view showing a carry-in portion of the electronic component test apparatus of FIG.
  • FIG. 8 is a plan view showing an application unit of the electronic component testing apparatus of FIG. FIG.
  • FIG. 9 is a front view of the application unit of the electronic device test apparatus of FIG. 1 as viewed along the X axis.
  • FIG. 10 is a top view of a test head of the electronic component test apparatus of FIG.
  • FIG. 11 is a schematic cross-sectional view showing the contact plate and the socket in the first embodiment of the present invention.
  • FIG. 12A is a schematic cross-sectional view showing another example of the contact plate and the socket in the first embodiment of the present invention.
  • 12B is a schematic cross-sectional view showing a state in which the IC device held by the contact plate of FIG. 12A is pressed against the socket.
  • FIG. 13A is a schematic cross-sectional view showing still another example of the contact plate and the socket in the first embodiment of the present invention.
  • FIG. 13B is a schematic cross-sectional view showing a state in which the IC device held by the contact plate of FIG. 13A is pressed against the socket.
  • FIG. 14 is a plan view showing the overall configuration of the electronic device test apparatus according to the second embodiment of the present invention.
  • FIG. 15 is a perspective view showing a first contact plate used in the electronic component testing apparatus of FIG.
  • FIG. 16 is a perspective view showing a second contact plate used in the electronic component testing apparatus of FIG.
  • FIG. 17 is a perspective view showing a first cover used in the electronic component testing apparatus of FIG.
  • FIG. 18 is a perspective view showing a second cover used in the electronic component testing apparatus of FIG.
  • FIG. 19 is a schematic plan view showing the overall configuration of the electronic device test apparatus according to the third embodiment of the present invention.
  • FIG. 15 is a perspective view showing a first contact plate used in the electronic component testing apparatus of FIG.
  • FIG. 16 is a perspective view showing a second contact plate used in the electronic component testing apparatus of FIG
  • FIG. 20 is a perspective view showing a contact plate used in the electronic component testing apparatus of FIG.
  • FIG. 21A is a cross-sectional view (No. 1) for explaining the operation of the electronic device test apparatus according to the third embodiment of the present invention.
  • FIG. 21B is a sectional view (No. 2) for explaining the operation of the electronic component testing apparatus in the third embodiment of the present invention.
  • FIG. 21C is a sectional view (No. 3) for explaining the operation of the electronic component testing apparatus in the third embodiment of the present invention.
  • FIG. 21D is a cross-sectional view (part 4) for explaining the operation of the electronic component testing apparatus according to the third embodiment of the present invention.
  • FIG. 22 is a schematic plan view showing the overall configuration of the electronic component testing apparatus in the fourth embodiment of the present invention.
  • FIG. 23 is a bottom view of the suction head of the transfer device of the electronic component test apparatus of FIG.
  • contact plate (intermediate plate) 81 to 84 first to fourth plates 81a to 84a ... first to fourth cam followers 85 ... shaft 87 ... holding unit 89 ... holding holes 9A, 9B ... first and second contact plates 92 ... holding unit 93 ... Holding holes 10A, 10B ... First and second covers 12 ... Contact plate 12b ... Holding unit 12c ... Holding hole
  • FIG. 1 is a schematic plan view showing the overall configuration of the electronic component test apparatus according to the first embodiment of the present invention.
  • the IC device is pressed against the socket 61 of the test head 6 by the handler 1A in a state where high or low temperature stress is applied to the IC device, and a tester (not (Shown) is an apparatus for testing (inspecting) whether or not the IC device operates properly by inputting and outputting a test signal to and from the IC device.
  • the handler 1A in the present embodiment includes a carry-in unit 100, an application unit 200A, a test unit 300A, a heat removal unit 400A, and a carry-out unit 500.
  • the customer trays 7 are carried one by one from the stacked body 70A supplied to the handler 1A to the application unit 200A.
  • the laminated body 70A is configured by laminating customer trays that store IC devices before testing.
  • the application unit 200A With the IC device being housed in the customer tray 7, a high or low temperature thermal stress is applied to the IC device, and then the contact plate 8 is overlaid on the customer tray 7 so as to be reversed. To the contact plate (holding tray) 8 from the IC device before the test at a time. Further, in the application unit 200A, the customer tray 7 is removed from the contact plate 8, and the contact plate 8 is carried into the test unit 300A. The customer tray 7 removed from the contact plate 8 is sent to the heat removal unit 400A.
  • the contact plate 8 is moved below the test head 6, and the IC device is pressed against the socket 61 of the test head 6 while the IC device is held (accommodated) in the contact plate 8. In this state, the tester transmits / receives a test signal to / from the IC device via the test head 6 and executes the test of the IC device.
  • the contact plate 8 is carried out from the test unit 300A to the heat removal unit 400A.
  • the customer tray 7 sent from the application unit 200A is placed on the contact plate 8, and then reversed, and the tested IC device is once applied from the contact plate 8 to the customer tray 7. And the contact plate 8 is removed from the customer tray 7.
  • the customer tray 7 is transported from the heat removal unit 400A to the carry-out unit 500.
  • the contact plate 8 removed from the customer tray 7 is returned to the application unit 200A.
  • the customer tray 7 carried out from 400 A of heat removal parts is laminated
  • the stacked body 70B is configured by stacking the customer trays 7 that have already been transported to the unloading unit 500, and IC devices that have been tested are accommodated in these customer trays.
  • the laminate 70B of the customer tray 7 is transported to a classification dedicated device (not shown) independent of the handler 1A by an automatic transport device such as an operator or ADV. IC devices are classified into categories according to the test results by this dedicated classification device.
  • FIG. 2 is a perspective view showing a customer tray used in the electronic component testing apparatus of FIG. 1
  • FIG. 3 is a perspective view showing a contact plate used in the electronic component testing apparatus of FIG. 1
  • FIG. 4 is an enlarged view of the contact plate of FIG.
  • FIG. 5 is a rear view of the contact plate of FIG. 3
  • FIG. 6 is a cross-sectional view taken along line VI-VI of FIG.
  • the customer tray 7 in the present embodiment is configured by forming a large number of concave accommodation holes 72 for accommodating IC devices on the upper surface of a flat tray main body 71.
  • 64 accommodation holes 72 are arranged in the tray body 71 in 8 rows and 8 columns.
  • the pitch between the receiving hole 72 along the Y-axis direction is a P 1
  • the pitch between the receiving hole 72 along the X-axis direction is a P 2.
  • the contact plate 8 in the present embodiment includes first to fourth plates 81 to 84 and a shaft 85 connecting them.
  • the shaft 85 is inserted into the insertion hole formed in each of the plates 81 to 84, and as the plates 81 to 84 slide along the shaft 85 in the Y-axis direction, as shown in FIG.
  • the interval between the first to fourth plates 81 to 84 can be increased.
  • the mechanism for movably connecting the plates 81 to 84 is not particularly limited to the shaft, and for example, a pantograph mechanism or a linear guide may be used.
  • pin-shaped cam followers 81a to 84a are provided so as to protrude from the approximate center of the back surface of each of the plates 81 to 84, respectively.
  • These first to fourth cam followers 81a to 84a move in cam grooves of pitch changing mechanisms 260A and 420A, which will be described later, thereby widening or narrowing the interval between the first to fourth plates 81 to 84. It is possible.
  • the mechanism for widening or narrowing the interval between the plates 81 to 84 is not particularly limited to a cam mechanism, and for example, an air cylinder or a ball screw mechanism connected to a motor may be used. Good.
  • each holding unit 87 is formed with a concave holding hole 89 for holding the IC device.
  • eight holding holes 89 are arranged in 2 rows and 4 columns.
  • the direction of the Y axis between the holding holes 89 formed in the holding unit 87 adjacent via the shaft 85 is increased. Is increased from P 3 to P 4 (P 3 ⁇ P 4 ).
  • the spacing S 2 between the holding holes 89 arranged at the wide pitch P 4 is preferably at least five times the spacing S 1 between the holding holes 89 arranged at the pitch P 3 (S 2 ⁇ S 1 ⁇ 5) More preferably 10 times or more (S 2 ⁇ S 1 ⁇ 10).
  • a first positioning hole 87a for positioning the IC device with respect to the socket 61 is formed in the test.
  • protruding pieces 87 c formed with second positioning holes 87 b protrude from the upper and lower side surfaces of each holding unit 87. Similar to the first positioning hole 87a, the second positioning hole 87b is used for positioning the IC device with respect to the socket 61 during the test.
  • insertion holes 87 d into which the opposing protruding pieces 87 c can be inserted are formed on the upper and lower side surfaces of the holding unit 87. As shown in FIG. 3, in the state where the distance between the first to fourth plates 81 to 84 is the narrowest, each protruding piece 87c is hidden in the insertion hole 87d.
  • the holding unit 87 is attached to each of the plates 81 to 84 by an attachment member 88 inserted into the attachment hole 86 of each of the plates 81 to 84.
  • the inner diameter of the small diameter portion 86 a of the mounting hole 86 is larger than the outer diameter of the screw portion 88 a of the mounting member 88
  • the inner diameter of the large diameter portion 86 b of the mounting hole 86 is the head of the mounting member 88. It is larger than the outer diameter of 88b. Therefore, each holding unit 87 is movable with respect to the first to fourth plates 81 to 84, respectively.
  • the outer diameter of the head 88 b of the mounting member 88 is larger than the small diameter portion 86 a of the mounting hole 86. Therefore, even if the contact plate 8 is reversed by the reversing devices 250A and 460A, the holding unit 87 is prevented from being detached from the first to fourth plates 81 to 84.
  • the holding units 87 can be finely moved independently of each other in each of the plates 81 to 84, so that it is possible to absorb the thermal expansion that occurs due to the application of thermal stress to the IC device. It has become.
  • FIG. 7 is a plan view showing a carry-in portion of the electronic component testing apparatus of FIG.
  • the carry-in unit 100 includes a first tray transfer device 110 that picks up the customer trays 7 one by one from the stacked body 70 ⁇ / b> A supplied from the previous process, and a first tray transfer device 110. And a loading device 120 for loading the loaded customer tray 7 into the application unit 200A.
  • the first tray transfer device 110 includes a Y-axis rail 111 installed on the main base (device substrate) of the handler 1 along the Y-axis direction, and the Y-axis rail 111.
  • a movable arm 112 movable along the Y-axis direction and a gripping head 113 provided at the tip of the movable arm 112 and capable of moving up and down by an actuator (not shown) are provided.
  • the gripping head 113 has an openable gripping claw 114 for holding the customer tray 7 downward.
  • the movable arm 112 is moved along the Y-axis rail 111 after the gripping head 113 grips and raises the customer tray 7 positioned at the uppermost stage of the stacked body 70 ⁇ / b> A by the gripping claws 114. And the customer tray 7 is placed on the carry-in device 120.
  • the customer tray that constitutes the stacked body 70A accommodates IC devices with the input / output terminals facing downward.
  • the carry-in device 120 is configured, for example, by arranging a large number of rotating rollers driven by a motor in two rows substantially in parallel, and moves the customer tray 7 along the Y-axis direction. Is possible.
  • the carry-in device 120 transfers the customer tray 7 transferred by the first tray transfer device 110 to the application unit 200A.
  • ⁇ Applying unit 200A> 8 and 9 are a plan view and a front view showing an application unit of the electronic component test apparatus of FIG.
  • the application unit 200A includes a thermostatic chamber that applies a desired high or low temperature thermal stress to the IC device accommodated in the customer tray 7.
  • a vertical conveyance device conceptually shown in FIG. 1, a first horizontal conveyance device 210 ⁇ / b> A that horizontally conveys the customer tray 7 and the contact plate 8, and a contact plate 8 on the customer tray 7.
  • a first pitch changing mechanism 260A that increases the pitch between .about.84.
  • the vertical transfer device can receive the customer tray 7 from the carry-in device 120, hold the customer tray 7 and sequentially lower it. Until the test unit 300A becomes empty, the customer tray 7 stands by in the application unit 200A while being held by the vertical conveyance device, so that a thermal stress of about ⁇ 55 to + 150 ° C. is applied to the IC device.
  • the vertical conveyance device delivers the customer tray 7 positioned at the lowest level to the first horizontal conveyance device 210A. In addition, you may raise the customer tray 7 sequentially by a vertical conveying apparatus.
  • the first horizontal conveying device 210A is configured, for example, by arranging a large number of rotating rollers driven by a motor in two rows substantially in parallel, and conveys the customer tray 7 from the vertical conveying device to the first reversing device 250A.
  • the contact plate 8 can be transported from the first reversing device 250A to the test unit 300A.
  • the first attachment / detachment device 220 ⁇ / b> A has a Y-axis rail 221 installed on the main base of the handler 1 ⁇ / b> A along the Y-axis direction, and moves to the Y-axis rail 221 along the Y-axis direction.
  • the first attachment / detachment device 220A is omitted in order to facilitate understanding of the structures of the first reversing device 250A, the forwarding device 270A, and the first return device 470A.
  • the first and second movable heads 230 and 240 respectively have gripping heads 231 and 241 that can be moved up and down by an actuator (not shown).
  • the gripping heads 231 and 241 have openable gripping claws 232 and 242 downward to grip the customer tray 7 and the contact plate 8, respectively.
  • the Y-axis rail 221 is bridged above the forwarding device 270A, the first reversing device 250A, and the first returning device 470A. Further, the first and second movable heads 230 and 240 can move independently of each other along the Y-axis rail 221.
  • the first movable head 230 conveys the customer tray 7 between the first reversing device 250A and the forwarding device 270A.
  • the second movable head 240 conveys the contact plate 8 between the first reversing device 250A and the first return device 470A.
  • the forwarding device 270A is configured by, for example, a belt conveyor, and can transport the customer tray 7 removed from the contact plate 8 by the first attaching / detaching device 220A to the heat removal unit 400A.
  • the customer tray 7 conveyed by the forwarding device 270A is put on the contact plate 8 by the second attachment / detachment device 430A in the heat removal section 400A.
  • the first return device 470A is configured by a belt conveyor, for example.
  • the first return device 470A can transport the contact plate 7 collected by the second attachment / detachment device 430A of the heat removal unit 400A to the application unit 200A.
  • the contact plate 8 returned by the first return device 470A is put on the customer tray 7 by the first attachment / detachment device 220A.
  • the first reversing device 250 ⁇ / b> A includes a pair of rotating parts 251 provided on the main base of the handler 1 ⁇ / b> A, and an extension part attached to each rotating part 251 so as to face each other. 252 and a chuck 254 attached to the tip of each expansion / contraction part 252.
  • Each rotating part 251 is composed of, for example, a rotating motor and a gear mechanism (not shown) connected to the driving shaft thereof, and can rotate the extendable part 252 around the Y-axis direction. Yes.
  • Each expansion / contraction part 252 is composed of, for example, an air cylinder, and the rod 253 can be moved along the Y-axis direction.
  • the two stretchable portions 252 are arranged so that the tips of the rods 253 are opposed to each other. For this reason, the distance between the tips of the rods 253 is reduced when the extendable portions 252 are extended, and the distance between the tips of the rods 253 is increased when the extendable portions 252 are shortened.
  • a chuck 254 is attached to the tip of the rod 253 of each expansion / contraction part 252.
  • Each chuck 254 is capable of gripping the overlapping customer tray 7 and contact plate 8 by opening and closing by air pressure or the like.
  • the first reversing device 250A rotates them 180 degrees. At this time, since the arrangement of the holding holes 89 of the contact plate 8 and the arrangement of the accommodation holes 72 of the customer tray 7 are substantially the same, all the IC devices accommodated in the accommodation holes 72 of the customer tray 7 are used. Can be directly transferred to the holding hole 89 of the contact plate 8.
  • the retracting direction of the first horizontal transfer device 210A may be a lateral direction.
  • the first pitch changing mechanism 260A is composed of a plate member in which four cam grooves 261 to 264 are formed.
  • the first to fourth cam grooves 261 to 264 correspond to the first to fourth cam followers 81a to 81d of the contact plate 8 shown in FIG.
  • the first pitch changing mechanism 260A is provided between the first reversing device 250A and the test unit 300A. Then, when the first horizontal transfer device 210A moves the contact plate 8 toward the test unit 300A, the first to fourth cam followers 81a to 84a of the contact plate 8 are moved to the first pitch changing mechanism 260A. The fourth cam grooves 261 to 264 move to increase the pitch between the first to fourth plates 81 to 84 of the contact plate 8.
  • the first horizontal transfer device 210A moves the customer tray 7 to the first reversing device 250A. Then, the second movable head 240 of the first attachment / detachment device 220 ⁇ / b> A covers the customer tray 7 with the contact plate 8 conveyed from the heat removal unit 400 ⁇ / b> A by the first return device 470 ⁇ / b> A.
  • the first reversing device 250A grips the customer tray 7 and the contact plate 8 and rotates them 180 degrees. As a result, all the IC devices accommodated in the customer tray 7 are transferred to the holding holes 89 of the contact plate 8 at a time.
  • the reversing device 250A During the reversal by the first reversing device 250A, a part of the first horizontal transfer device 210A is lowered, but when the reversal by the first reversing device 250A is completed, the lowered portion is raised. When the first reversing device 250A releases the grip, the contact plate 8 and the customer tray 7 are held again by the first horizontal transport device 210A.
  • the first movable head 230 of the first attachment / detachment device 220A removes the customer tray 7 from the contact plate 8, and moves the customer tray 7 to the forwarding device 270A.
  • the customer tray 7 is conveyed to the heat removal unit 400A by the forwarding device 270A.
  • the first horizontal transfer device 210A moves the contact plate 8 toward the test unit 300A. During this movement, the pitch between the plates 81 to 84 in the contact plate 8 is widened by the first pitch changing mechanism 260A, and is carried into the test section 300A in this state.
  • FIG. 10 is a top view of a test head of the electronic component testing apparatus of FIG. 1, and FIG. 11 is a schematic cross-sectional view showing a contact plate and a socket in this embodiment.
  • the test section 300A has a test chamber for maintaining the thermal stress applied to the IC device when the IC device held on the contact plate 8 is pressed against the socket 61 of the test head 6.
  • test head 6 Inside the test chamber, an upper portion of the test head 6 enters through an opening formed in the upper portion of the handler A1, and a Z-axis driving device (pressing device) 310 (for pressing the IC device against the socket 61). 11) is provided.
  • a plurality of sockets 61 are mounted on the top of the test head 6, and these sockets 61 face the inside of the test chamber.
  • 64 sockets 61 are arranged in 8 rows and 8 columns.
  • the arrangement of the sockets 61 on the test head 6 is substantially the same as the arrangement of the holding holes 89 in the contact plate 8 in which the pitch between the plates 61 to 64 is widened by the first pitch changing mechanism 260A.
  • a relatively wide space 65 is formed between some of the sockets 61 as shown in FIG.
  • This space 65 can be used as a wiring area around the socket 61.
  • Examples of wiring around the socket 61 include wiring on a socket board (not shown) on which the socket 61 is mounted. Further, electronic components mounted around the socket 61 may be disposed in the space 65.
  • each socket 61 includes a contact pin 62 that is in electrical contact with the input / output terminal HB of the IC device, and a housing 63 that holds the contact pin 62.
  • a positioning pin 64 for positioning the holding unit 87 of the contact plate 8 is provided around the socket 61.
  • the protruding piece 87c protrudes laterally from the holding unit 87, the positioning pin facing the second positioning hole 87b of the holding unit 87 is disposed in the space 65 shown in FIG. ing.
  • the IC device When the contact plate 8 is transported below the test head 6 by the first horizontal transport device 210A, the IC device is pressed against the socket 61 by the Z-axis drive device 310 while the IC device is held on the contact plate 8. . At this time, the positioning pins 64 of the socket 61 are inserted into the first and second positioning hole holes 87 a and 87 b of the holding unit 87, whereby the IC device is positioned with respect to the socket 61.
  • the tester exchanges test signals with the IC device via the test head 6 and executes the test of the IC device. To do.
  • This test result is given to each customer tray 7 itself as identification information such as a barcode, or transferred as data from the handler 1A to the dedicated classification apparatus.
  • the contact plate 8 is carried out to the heat removal unit 400A while holding the tested IC device.
  • 12A and 12B are schematic cross-sectional views showing other examples of contact plates and sockets in the first embodiment of the present invention.
  • the positioning pin 64 is brought into contact with the side surface of the holding unit 87, thereby You may position with respect to the socket 61.
  • FIG. In this case, the positioning pin 61 is disposed in the space 65 shown in FIG.
  • FIGS 13A and 13B are schematic cross-sectional views showing still another example of the contact plate and the socket in the first embodiment of the present invention.
  • the positioning pin 64 is brought into direct contact with the side surface of the IC device, so that the IC device is connected to the socket 61. You may position with respect to.
  • the surface of the contact plate 8 ' is smoothed and the IC device is held by suction so that the IC device can be moved minutely on the contact plate 8' during positioning. Thereby, the IC device can be positioned with high accuracy with respect to the socket 61.
  • the positioning pin 64 may be an L-shaped guide that surrounds the four corners of the IC device.
  • the heat removal unit 400A has a heat removal tank for removing the applied thermal stress from the tested IC device, and as shown in FIG.
  • a second horizontal transfer device 410A for horizontally transferring the contact plate 7, a second pitch changing mechanism 420A for narrowing the pitch between the plates 81 to 84 in the contact plate 8, and the contact plate 8 covering the customer tray 7;
  • a second attachment / detachment device 430A for removing the contact plate 8 from the customer tray 7, a second reversing device 460A for reversing the contact plate 8 and the customer tray 7 in an overlapped state, and the vertical conveyance conceptually shown in FIG.
  • a device is provided.
  • the second horizontal transfer device 410A is configured, for example, by arranging a large number of rotating rollers that can be driven by a motor in two rows substantially in parallel, and the contact plate 8 extends from the test unit 300A to the second reversing device 460A.
  • the customer tray 7 can be conveyed from the second reversing device 460A to the vertical conveying device.
  • the second pitch conversion mechanism 420A has four cam grooves that are in a line-symmetric relationship with the first to fourth cam grooves 261 to 264 of the first pitch conversion mechanism 260A. ing.
  • the second horizontal transfer device 410A moves the contact plate 8 toward the second reversing device 460A, the pitch between the first to fourth plates 81 to 84 of the contact plate 8 is reduced, and the customer tray 7 Substantially match the pitch between the receiving holes 72.
  • the second attachment / detachment device 430A has a Y-axis rail 431 and two movable heads 440 and 450, as in the first attachment / detachment device 220A.
  • the first movable head 440 conveys the customer tray 7 between the second reversing device 460A and the forwarding device 270A.
  • the second movable head 450 conveys the contact plate 8 between the second reversing device 460A and the first return device 470A.
  • the second reversing device 460A is similar to the first reversing device 250A described above, and includes a pair of rotating units, a telescopic unit attached to the rotating unit so as to face each other, and the respective telescopic units. And a chuck attached to the tip of the head.
  • the second detaching device 430A covers the customer tray 7 on the contact plate 8 carried out from the test unit 300A by the second horizontal conveying device 410A
  • the second reversing device 460A rotates them 180 degrees. Then, all the IC devices held in the holding holes 89 of the contact plate 8 are directly transferred to the receiving holes 72 of the customer tray 7.
  • a part of the second horizontal transfer device 410A may be lowered during reversal by the second reversing device 460A in order to avoid interference with the customer tray 7 and the contact plate 8. It is possible.
  • the vertical transfer device can receive the customer tray 7 from the second horizontal transfer device 410A, hold the customer tray 7 and sequentially raise it.
  • the heat removal unit 400A when a high temperature is applied to the IC device by the application unit 200A, the IC device is cooled to the room temperature by blowing air and then carried out to the carry-out unit 500.
  • the IC device when a low temperature is applied to the IC device by the application unit 200A, the IC device is heated with warm air or a heater or the like to return to a temperature at which condensation does not occur, and then is carried out to the carry-out unit 500.
  • the customer tray 7 is sequentially raised by the vertical conveyance device in the application unit 200A, the customer tray 7 is sequentially lowered by the vertical conveyance device in the heat removal unit 400A.
  • the contact plate 8 holding the IC device for which the test has been completed is carried out from the test unit 300A to the heat removal unit 400A by the second horizontal transfer device 410A.
  • the second horizontal transfer device 410A moves the contact plate 8 to the second reversing device 460A.
  • the first movable head 440 of the second attachment / detachment device 430A covers the customer tray 7 conveyed from the application unit 200A by the forwarding device 270A on the contact plate 8.
  • the second reversing device 460A holds the contact plate 8 and the customer tray 7 and rotates them 180 degrees. As a result, all IC devices held in the holding holes 89 of the contact plate 8 are transferred to the receiving holes 72 of the customer tray 7 at a time.
  • the second reversing device 460A During the reversal by the second reversing device 460A, a part of the second horizontal transfer device 410A is lowered, but when the reversal by the second reversing device 460A is completed, the lowered portion is raised.
  • the second reversing device 460A releases the grip, the customer tray 7 and the contact plate 8 are held by the second horizontal transport device 410A.
  • the second movable head 450 of the second attachment / detachment device 430A removes the contact plate 8 from the customer tray 7, and moves the contact plate 8 to the first return device 470A.
  • the contact plate 8 is conveyed to the application unit 200A by the first return device 470A.
  • the second horizontal transfer device 410A moves the customer tray 7 to the vertical transfer device.
  • the vertical transport device raises the customer tray 7 and then delivers the customer tray 7 to the carry-out unit 500.
  • the unloading unit 500 includes an unloading device 510 for unloading the customer tray 7 from the heat removal unit 400A, and a second tray for stacking the customer trays 7 one by one from the unloading device 510 to the stacked body 70B.
  • a transfer device 520 As shown in FIG. 1, the unloading unit 500 includes an unloading device 510 for unloading the customer tray 7 from the heat removal unit 400A, and a second tray for stacking the customer trays 7 one by one from the unloading device 510 to the stacked body 70B.
  • the carry-out device 510 is configured by, for example, a large number of rotating rollers driven by a motor arranged in two rows substantially in parallel, and moves the customer tray 7 along the Y-axis direction, like the carry-in device 120 described above. It is possible to make it.
  • the carry-out device 510 receives the customer tray 7 located at the uppermost stage of the vertical conveyance device of the heat removal unit 400 ⁇ / b> A from the vertical conveyance device and carries it out to the carry-out unit 500.
  • the second tray transfer device 520 includes a Y-axis rail, a movable arm, a gripping head, and a gripping claw, like the first tray transfer device 110 of the carry-in unit 100. Yes.
  • the second tray transfer device 520 stacks the customer tray 7 conveyed by the carry-out device 510 on the uppermost stage of the stacked body 70B.
  • the pitch between the holding units 87 in the contact plate 8 is changed by the first pitch changing mechanism 260A. For this reason, the pitch between the IC devices held in the holding holes 89 of the contact plate 8 is partially widened, and accordingly, the pitch between the sockets 61 on the test head 6 can also be partially widened. A large space 65 for wiring can be secured on the test head 6.
  • pitches P 3 and P 4 are set as the pitch between the holding holes 87 in the contact plate 8. For this reason, the pitch between the IC devices held by the contact plate 12 can be partially widened. Accordingly, the pitch between the sockets 61 on the test head 6 is also partially widened. In addition, a large space 65 for wiring can be secured.
  • FIG. 14 is a plan view showing the entire configuration of the electronic component testing apparatus according to the second embodiment of the present invention
  • FIGS. 15 and 16 show first and second contact plates used in the electronic component testing apparatus of FIG.
  • FIG. 17 and FIG. 18 are perspective views showing first and second covers used in the electronic component testing apparatus of FIG.
  • the shape of the contact plate and the configurations of the application unit, the test unit, and the heat removal unit are different from those of the first embodiment. This is the same as the embodiment. In the following, only the differences from the first embodiment of the electronic component testing apparatus according to the second embodiment will be described, and the same components as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.
  • the holding unit 92 is formed with holding holes 93 for holding IC devices, and the holding unit 92 can hold the IC devices one by one.
  • Each holding unit 92 is formed with a positioning hole 94 into which a positioning pin provided on the socket 61 side can be inserted.
  • Each of the contact plates 9A, 9B has 32 holding units 92, but the arrangement of the holding units 92 is different.
  • the holding unit 92 is disposed at the other position, and the holding unit 92 is not disposed at any other position.
  • the holding unit 92 is disposed only at the corresponding position, and the holding unit 92 is not disposed at any other position.
  • the arrangement matches the arrangement of the receiving holes 72 in the customer tray 7 shown in FIG. It is like that.
  • plate-like covers 10A and 10B as shown in FIGS. 17 and 18 are used when IC devices are transshipped between the customer tray 7 and the contact plates 9A and 9B, respectively.
  • a plurality of window portions 11 are opened in any of the covers 10A and 10B.
  • the first cover 10A is a cover used when the IC device is transferred from the customer tray 7 to the first contact plate 9A in the application unit 200B.
  • 32 window portions 11 are arranged so as to correspond to the arrangement of the holding units 92 in the first contact plate 9A.
  • the second cover 10B is a cover used when the customer tray 7 is reversed in the heat removal section 400B.
  • 32 windows 11 are arranged so as to correspond to the arrangement of the holding unit 92 in the second contact plate 9B.
  • the handler 1B includes a carry-in unit 100, an application unit 200B, a test unit 300B, a heat removal unit 400B, and a carry-out unit 500.
  • the application unit 200B includes a thermostatic chamber as with the application unit 200A according to the first embodiment. Inside the thermostatic chamber, there are a vertical conveyance device conceptually shown in FIG. 14, a first horizontal conveyance device 210B, a first attachment / detachment device 220B, a first reversing device 250B, and a third reversing device 280B. And a third horizontal transfer device 290.
  • the application unit 200B in the present embodiment does not include the first pitch changing mechanism, and the application unit in the first embodiment is that a third reversing device 280B and a third horizontal transfer device 290 are added. Different from 200A.
  • the vertical transport device, the first horizontal transport device 210B, the first attaching / detaching device 220B, and the first reversing device 250B included in the application unit 200B are the same as those in the first embodiment unless otherwise specified. This is the same configuration as the vertical transfer device in FIG. 1, the first horizontal transfer device 210A, the first attachment / detachment device 220A, and the first reversing device 250A in the first embodiment.
  • the third reversing device 280B has the same configuration as that of the first reversing device 250B, and is arranged between the first reversing device 250B and the forwarding device 270B. Along with this, the Y-axis rail 221 of the first attachment / detachment device 220B is bridged above the forwarding device 270B, the third and first reversing devices 280B, 250B, and the first return device 470B. .
  • the forwarding device 270B and the first return device 470B in the present embodiment have the same configuration as the forwarding device 270A and the first return device 470A in the first embodiment.
  • the third horizontal transfer device 290 includes, for example, a large number of rotating rollers driven by a motor, and the contact plate is transferred from the third reversing device 280B to the test unit 300B. It can be transported.
  • the heat removal unit 400B in the present embodiment includes a heat removal tank, similarly to the heat removal unit 400A in the first embodiment. Inside the heat removal tank, there are a second horizontal transfer device 410B, a second attachment / detachment device 430B, a second reversing device 460B, a fourth horizontal transfer device 480, a fourth reversing device 490B, and FIG. Is provided with a vertical conveying device conceptually shown in FIG.
  • the heat removal unit 400B in the present embodiment does not include the second pitch changing mechanism, and the heat removal unit 400B in the first embodiment is provided with a fourth horizontal transfer device 480 and a fourth reversing device 490B. It is different from the heat part 400A.
  • the second horizontal transfer device 410B, the second attachment / detachment device 430B, the second reversing device 460B, and the vertical transfer device included in the heat removal unit 400B are the first implementation unless otherwise specified.
  • the configuration is the same as that of the second horizontal transfer device 410A, the second attachment / detachment device 430A, the second reversing device 460B, and the vertical transfer device.
  • the fourth horizontal transfer device 480 is composed of, for example, a large number of rotating rollers driven by a motor, and the contact plate extends from the test unit 300B to the fourth reversing device 490B.
  • the customer tray 7 can be transported from the fourth reversing device 490B to the vertical transport device.
  • the second horizontal transfer device 410B is provided only from the test unit 300B to the second reversing device 460B.
  • the fourth reversing device 490B has the same configuration as the second reversing device 460B, and is disposed between the second reversing device 460B and the forwarding device 270B. Along with this, the Y-axis rail 431 of the second attachment / detachment device 430B is bridged above the forwarding device 270B, the fourth and second reversing devices 490B, 460B, and the first return device 470B. .
  • the vertical conveyance device lowers the customer tray 7 and puts the customer tray 7 on the first horizontal conveyance device 210B. Deliver.
  • the first horizontal transfer device 210B moves the customer tray 7 to the first reversing device 250B.
  • the first movable head 230 of the first attachment / detachment device 220B covers the first cover 10A held on the customer tray 7.
  • the second movable head 240 moves to the first return device 470B, grips and moves the first contact plate 9A conveyed from the heat removal unit 400B, and moves the customer tray 7 and the first Cover the cover 10A.
  • the first reversing device 250B grips the customer tray 7, the first cover 10A, and the first contact plate 9A and rotates it 180 degrees.
  • the IC devices accommodated in the accommodation holes 72 located in the odd-numbered rows in the customer tray 7 pass through the window 11 of the first cover 10A to the holding unit 92 of the first contact plate 9A at a time. It is transferred.
  • the accommodation holes 72 located in the even-numbered rows in the customer tray 7 are closed by the first cover 10A, the IC device does not move to the first contact plate 9A.
  • the first horizontal transfer device 210B During the reversal by the first reversing device 250B, a part of the first horizontal transfer device 210B is lowered, but when the reversal by the first reversing device 250B is completed, the lowered portion is raised. When the first reversing device 250B releases the grip, the first contact plate 9A, the first cover 10A, and the customer tray 7 are held again by the first horizontal transfer device 210B.
  • the first movable head 230 of the first attachment / detachment device 220B grips the first cover 10A and the customer tray 7, lifts them from the first contact plate 9A, and the third horizontal transport device 290. Move to. On the other hand, the first horizontal transfer device 210B carries the first contact plate 9A into the test unit 300B.
  • the third reversing device 280B holds the first cover 10A and the customer tray 7 and rotates them 180 degrees. During the reversal by the third reversing device 280B, a part of the third horizontal transfer device 290 is lowered, but when the reversal by the third reversing device 280B is completed, the lowered portion is raised. To do. When the third reversing device 280B releases the grip, the customer tray 7 and the first cover 10A are held again by the third horizontal transport device 290.
  • the first movable head 230 of the first attachment / detachment device 220 ⁇ / b> B removes the first cover 10 ⁇ / b> A from the customer tray 7.
  • the second movable head 240 of the first attachment / detachment device 220B covers the second contact plate 9B conveyed from the heat removal unit 400B by the first return device 470B on the customer tray 7.
  • the third reversing device 280B grips the customer tray 7 and the second contact plate 9B and rotates it 180 degrees. As a result, the IC devices left in the receiving holes 72 located in the even-numbered rows in the customer tray 7 are transferred at once to the holding unit 92 of the second contact plate 9B.
  • all the IC devices accommodated in the customer tray 7 are transferred to the first and second contact plates 9A and 9B by the reversing operation three times.
  • the second movable head 240 of the first attachment / detachment device 220B removes the customer tray 7 from the second contact plate 9B, and moves the customer tray 7 to the forwarding device 270B.
  • the third horizontal transfer device 290 carries the second contact plate 9B into the test unit 300B.
  • Y-axis rails 221 and 431 are extended downward in the attachment / detachment devices 220B and 430B. .
  • the first and second contact plates 9A and 9B are carried out to the heat removal unit 400B.
  • the second movable head 450 of the second attachment / detachment device 430B is moved by the forwarding device 270B.
  • the customer tray 7 conveyed from the application unit 200B is placed on the first contact plate 9A.
  • the second reversing device 460B grips the first contact plate 9A and the customer tray 7 and rotates them 180 degrees. As a result, all the IC devices held on the first contact plate 9 ⁇ / b> A are transferred at once to the accommodation holes 72 located in the odd-numbered rows in the customer tray 7.
  • the second movable head 450 of the second attachment / detachment device 430B removes the first contact plate 9A from above the customer tray 7, and moves the first contact plate 9A to the first return device 470B.
  • the first movable head 440 of the second attachment / detachment device 430B covers the gripped second cover 10B on the customer tray 7 positioned on the second horizontal transport device 410B.
  • the second reversing device 460B grips the customer tray 7 and the second cover 10B and rotates them 180 degrees. During this rotation, the accommodation holes 72 located in odd rows in the customer tray 7 are closed by the second cover 10 ⁇ / b> B, so that the IC device does not jump out of the accommodation holes 72.
  • the first movable head 440 of the second attachment / detachment device 430B has transported the second cover 10B and the customer tray 7 to the fourth reversing device 490B by the fourth horizontal transport device 480. Cover the plate 9B.
  • the fourth reversing device 490B grips the second contact plate 9B, the second cover 10B, and the customer tray 7 and rotates them 180 degrees. As a result, all the IC devices held on the second contact plate 9B are transferred at once to the receiving holes 72 located in the even-numbered rows in the customer tray 7.
  • the second movable head 450 of the second attachment / detachment device 430B removes the second contact plate 9B from the second cover 10B and the customer tray 7, and removes the second contact plate 9B from the first contact plate 9B to the first contact plate 9B. Move to return device 470B.
  • the first movable head 440 of the second attachment / detachment device 430B removes the second cover 10B from above the customer tray 7.
  • the customer tray 7 is transferred from the fourth horizontal conveyance device 480 to the vertical conveyance device, and is lowered to the carry-out unit 500 after being lowered by the vertical conveyance device.
  • the IC device is thinned out and transferred from the customer tray 7 to the contact plates 9A and 9B by the first and third reversing devices 250B and 280B. For this reason, the pitch between the IC devices held by the contact plates 9A and 9B is partially widened, and accordingly, the pitch between the sockets 61 on the test head 6 can be widened. A large space 65 for wiring can be secured.
  • FIG. 19 is a schematic plan view showing the overall configuration of the electronic component testing apparatus according to the third embodiment of the present invention
  • FIG. 20 is a perspective view showing a contact plate used in the electronic component testing apparatus of FIG. 19, and FIGS. It is sectional drawing for demonstrating operation
  • the electronic component testing apparatus in the present embodiment is different from the first embodiment in the configuration of the application unit and the heat removal unit.
  • the plate 8 shown in FIGS. 3 and 4 used as the contact plate in the first embodiment is used as an intermediate plate
  • the plate 12 shown in FIG. 20 is used as a contact plate. That is, in this embodiment, the IC device is temporarily transferred from the customer tray 7 to the intermediate plate (holding tray) 8, and then the IC device is transferred again from the intermediate plate 8 to the contact plate (holding tray) 12.
  • the contact plate 12 includes a base plate 12a and eight holding units 12b held by the base plate 12a.
  • the contact plate 12 is greatly different from the contact plate 8 in the first embodiment in that each holding unit 12b is not slidable with respect to the base plate 12a.
  • the holding unit 12b has the same configuration as the holding unit 87 of the contact plate 8 in the first embodiment.
  • a first positioning hole 12d and eight holding holes 12c are formed on the surface of each holding unit 12b.
  • a protruding piece 12f in which a second positioning hole 12e is formed protrudes from the side surface of the holding unit 12b, and an insertion hole 12g into which the protruding piece 12f can be inserted is formed.
  • each holding unit 12b is held so as to be finely movable independently from the base plate 12a in the same manner as the contact plate 8 of the first embodiment.
  • the first pitch is relatively narrow as the pitch between the holding holes 12 c along the Y-axis direction.
  • Spacing S 4 between the holding holes 12c arranged in the second pitch P 7 is preferably at least 5 times the spacing S 3 between the sequences retention holes 12c of the first pitch P 6 (S 4 ⁇ S 3 ⁇ 5), more preferably 10 times or more (S 4 ⁇ S 3 ⁇ 10).
  • the handler 1 ⁇ / b> C includes a carry-in unit 100, an application unit 200 ⁇ / b> C, a test unit 300 ⁇ / b> C, a heat removal unit 400 ⁇ / b> C, and a carry-out unit 500.
  • the test unit 300C in the present embodiment has the same configuration as the test unit 300A in the first embodiment.
  • the application unit 200C in the present embodiment includes a thermostatic chamber, similar to the application unit 200A in the first embodiment.
  • a thermostatic chamber there are a vertical conveyance device conceptually shown in FIG. 19, a first horizontal conveyance device 210C, a first attachment / detachment device 220C, a third attachment / detachment device 225, and a first inversion device.
  • 250C, the 1st pitch change mechanism 260C, the 3rd pitch change mechanism 265, the 2nd inversion apparatus 280B, and the 2nd return apparatus 295 are provided.
  • the application unit 200C in the present embodiment is a first implementation in that a third attachment / detachment device 225, a third pitch change mechanism 265, a second reversing device 280B, and a second return device 295 are added. This is different from the application unit 200A in the embodiment.
  • the vertical conveying device, the first horizontal conveying device 210C, the first attaching / detaching device 220C, the first reversing device 250C, and the first pitch changing mechanism 260C included in the applying unit 200C are specifically described below. Unless otherwise, the configuration is the same as that of the vertical transfer device, the first horizontal transfer device 210A, the first attaching / detaching device 220A, the first reversing device 250A, and the first pitch changing mechanism 260A in the first embodiment. .
  • the first attachment / detachment device 220C is bridged above the forwarding device 270C, the first horizontal transport device 210C, and the second return device 295. Then, the first movable head 230 of the first attachment / detachment device 220C conveys the intermediate plate 8 from the second return device 295 to the first horizontal conveyance device 210C. In contrast, the second movable head 240 conveys the customer tray 7 from the first horizontal conveyance device 210C to the forwarding device 270C.
  • the second reversing device 280C is disposed between the first pitch changing mechanism 260C and the test unit 300C.
  • the second inverting device 280C has the same configuration as the second inverting device 280B in the second embodiment.
  • the third attachment / detachment device 225 includes a Y-axis rail 226 installed along the Y-axis direction on the main base of the handler 1C, and a first movably supported by the Y-axis rail 226 along the Y-axis direction. And second movable heads 227 and 228.
  • the third attachment / detachment device 225 is bridged above the first return device 470C, the second reversing device 280C, and the second return device 295.
  • the first movable head 227 of the third attachment / detachment device 225 conveys the intermediate plate 8 from the first horizontal conveyance device 210C to the second return device 295.
  • the second movable head 228 conveys the contact plate 12 from the first return device 470C to the first horizontal conveyance device 210C.
  • the second return device 295 is configured, for example, by arranging a large number of rotating rollers driven by a motor in two rows substantially in parallel, and can move the intermediate plate 8 along the X-axis direction. Yes. Further, the second return device 295 is provided with a third pitch changing mechanism 265 having the same structure as the first pitch changing mechanism 260C, and the second transport device 295 moves the intermediate plate 8 to the third pitch changing mechanism 265. The interval between the first to fourth plates 81 to 84 in the intermediate plate 8 can be narrowed while being transported from the attachment / detachment device 225 to the first attachment / detachment device 220C.
  • the forwarding device 270C in the present embodiment has the same configuration as the forwarding device 270A in the first embodiment.
  • the first return device 470C in the present embodiment is the first return device in the first embodiment except that the first return device 470C is provided between the fourth attachment / detachment device 435 and the second attachment / detachment device 225. This is the same configuration as 470A.
  • the heat removal unit 400C in the present embodiment includes a heat removal tank, similar to the heat removal unit 400A in the first embodiment. Inside the heat removal tank, a second horizontal transfer device 410C, a second pitch changing mechanism 420C, a fourth pitch changing mechanism 425, a second attaching / detaching device 430C, a fourth attaching / detaching device 435, a second The reversing device 460C, the third returning device 475, the fourth reversing device 490C, and the vertical conveying device conceptually shown in FIG. 19 are provided.
  • the heat removal unit 400C in the present embodiment is the first in that a fourth pitch changing mechanism 425, a fourth attachment / detachment device 435, a third return device 475, and a fourth reversing device 490C are added. It is different from the heat removal unit 400A in the embodiment.
  • the second horizontal transfer device 410C, the second pitch changing mechanism 420C, the second attachment / detachment device 430C, the second reversing device 460C, and the vertical transfer device included in the heat removal unit 400C are as follows.
  • 2nd horizontal conveyance apparatus 410A As long as there is no description, it is the same structure as 2nd horizontal conveyance apparatus 410A, 2nd pitch change mechanism 420A, 2nd attachment / detachment apparatus 430A, 2nd inversion apparatus 460A, and vertical conveyance apparatus in 1st Embodiment. is there.
  • the second attachment / detachment device 430C is bridged above the forwarding device 270C, the second reversing device 460C, and the fourth return device 475. Then, the second movable head 440 of the second attachment / detachment device 430C conveys the intermediate plate 8 from the second horizontal conveyance device 410C to the third return device 475. On the other hand, the second movable head 450 conveys the customer tray 7 from the forwarding device 270C to the second horizontal conveying device 410C.
  • the fourth reversing device 490C is disposed between the test unit 300C and the second pitch changing mechanism 420C.
  • the fourth inverting device 490C has the same configuration as the fourth inverting device 490B in the second embodiment.
  • the fourth attachment / detachment device 435 includes a Y-axis rail 436 installed along the Y-axis direction on the main base of the handler 1C, and a first movably supported by the Y-axis rail 436 along the Y-axis direction. And second movable heads 437 and 438.
  • the fourth attachment / detachment device 435 is bridged above the first return device 470C, the fourth reversing device 490C, and the third return device 475.
  • the first movable head 437 of the fourth attachment / detachment device 435 conveys the intermediate plate 8 from the third return device 475 to the second horizontal conveyance device 410C.
  • the second movable head 438 transports the contact plate 12 from the second horizontal transport device 410C to the first return device 470C.
  • the third return device 475 is configured by, for example, a large number of rotating rollers driven by a motor arranged in two rows substantially in parallel, and can move the intermediate plate 8 along the X-axis direction. Yes. Further, the third return device 475 is provided with a fourth pitch change mechanism 425 having the same configuration as the second pitch change mechanism 420C, and the third return device 475 transfers the intermediate plate 8 to the second pitch change mechanism 475. While being transferred from the attachment / detachment device 430C to the fourth attachment / detachment device 435, the interval between the first to fourth plates 81 to 84 in the intermediate plate 8 can be increased.
  • the vertical conveyance device lowers the customer tray 7 and puts the customer tray 7 on the first horizontal conveyance device 210C. Deliver.
  • the first horizontal transfer device 210C moves the customer tray 7 to the first reversing device 250C.
  • the IC device is accommodated in the customer tray 7 with the input / output terminals facing upward.
  • the first movable head 221 of the first attachment / detachment device 220C moves the intermediate plate 8 from the second return device 295, and covers the intermediate plate 8 on the customer tray 7, as shown in FIG. 21A. .
  • the first reversing device 250C grips the customer tray 7 and the intermediate plate 8 and rotates them 180 degrees. By this rotation, all IC devices accommodated in the customer tray 7 are transferred at once to the holding holes 89 of the intermediate plate 8. During this reversal, a part of the first horizontal transfer device 210C is lowered, but when the reversal by the first reversing device 250C is completed, the lowered portion is raised. When the first reversing device 250C releases the grip, the intermediate plate 8 and the customer tray 7 are held again by the first horizontal transport device 210C.
  • the second movable head 240 of the first attachment / detachment device 220C grips the customer tray 7 covering the intermediate plate 8 and moves it to the forwarding device 270C (see FIG. 21B).
  • the customer tray 7 is conveyed to the heat removal unit 400C by the forwarding device 270C.
  • the first horizontal transfer device 210C moves the intermediate plate 8 toward the third reversing device 280C. During this movement, the pitch between the plates 81 to 84 in the intermediate plate 8 is widened by the first pitch changing mechanism 260C.
  • the first horizontal transfer device 210 ⁇ / b> C further moves the intermediate plate 8 and stops it below the third attachment / detachment device 225.
  • the second movable head 228 of the third attachment / detachment device 225 moves the contact plate 12 from the first return device 470C and puts the contact plate 12 on the intermediate plate 8.
  • the second reversing device 280C holds the intermediate plate 8 and the contact plate 12 and rotates them 180 degrees (see FIG. 21C). By this rotation, all IC devices accommodated in the intermediate plate 8 are transferred to the holding holes 12c of the contact plate 12 at a time. During this reversal, a part of the first horizontal transfer device 210C is lowered, but when the reversal by the third reversing device 280C is completed, the lowered portion is raised. When the third reversing device 280C releases the grip, the contact plate 12 and the intermediate plate 8 are again held by the first horizontal transfer device 210C.
  • all the IC devices accommodated in the customer tray 7 are transferred to the contact plate 12 by two reversing operations.
  • the IC device is accommodated in the customer tray 7 with the input / output terminals facing downward, another contact plate 12 is added and the reversing operation is performed three times.
  • the first movable head 227 of the third attachment / detachment device 225 grips the intermediate plate 8 covering the contact plate 12 and moves it to the second return device 295.
  • the intermediate plate 8 is returned to the first attachment / detachment device 220C by the second return device 295.
  • the pitch of the first to fourth plates 81 to 84 of the intermediate plate 8 is narrowed by the third pitch changing mechanism 265.
  • the first horizontal transfer device 210C carries the contact plate 12 into the test unit 300C, and the IC device is tested in the test unit 300C as shown in FIG. 21D. When the test is completed, the contact plate 12 is carried out to the heat removal unit 400C.
  • the second horizontal transfer device 410C moves the contact plate 12 to the fourth reversing device 490C. Then, the first movable head 437 of the fourth attachment / detachment device 435 moves the intermediate plate 8 from the third return device 475 and covers the contact plate 12 on the intermediate plate 8.
  • the fourth reversing device 490C grips the contact plate 12 and the intermediate plate 8 and rotates them 180 degrees. By this rotation, all the IC devices housed in the contact plate 12 are transferred at once to the holding holes 89 of the intermediate plate 8. During this reversal, a part of the second horizontal transfer device 410C is lowered, but when the reversal by the fourth reversing device 490C is completed, the lowered portion is raised. When the fourth reversing device 490C releases the grip, the intermediate plate 8 and the contact plate 12 are again held by the second horizontal transport device 410C.
  • the second movable head 438 of the fourth attachment / detachment device 435 grips the contact plate 12 covering the intermediate plate 8 and moves it to the first return device 470C.
  • the contact plate 12 is conveyed to the application unit 200C by the first return device 470C.
  • the second horizontal transfer device 410C moves the intermediate plate 8 toward the second reversing device 460C. During this movement, the pitch between the plates 81 to 84 in the intermediate plate 8 is narrowed by the second pitch changing mechanism 420C. The second horizontal transfer device 410C further moves the intermediate plate 8 and stops it below the second attachment / detachment device 430C.
  • the second movable head 450 of the second attachment / detachment device 430C moves the customer tray 7 from the forwarding device 270C and puts the customer tray 7 on the intermediate plate 8.
  • the second reversing device 460C grips the intermediate plate 8 and the customer tray 7 and rotates it 180 degrees. By this rotation, all the IC devices that have been accommodated in the intermediate plate 8 are transshipped to the accommodation 72 of the customer tray 7 at a time. During this reversal, a part of the second horizontal transfer device 410C is lowered, but when the reversal of the second reversing device 460C is completed, the lowered portion is raised. When the second reversing device 460C releases the grip, the customer tray 7 and the intermediate plate 8 are held again by the second horizontal transport device 410C.
  • the first movable head 440 of the second attachment / detachment device 430 ⁇ / b> C grips the intermediate plate 8 covering the customer tray 7 and moves it to the third return device 475.
  • the third return device 475 returns the intermediate plate 8 to the fourth attachment / detachment device 435.
  • the pitch of the first to fourth plates 81 to 84 of the intermediate plate 8 is changed to the fourth. It spreads by the pitch change mechanism 425.
  • the customer tray 7 is transferred from the second horizontal transfer device 410C to the vertical transfer device, and is lifted by the vertical transfer device and then transferred to the carry-out unit 500.
  • the pitch between the holding units 89 in the intermediate plate 8 is changed by the first pitch changing mechanism 260C, and the intermediate plate 8 is transferred in a state in which the arrangement is maintained. Instead, the IC device is tested while mounted on the contact plate 12. For this reason, the pitch between the IC devices held in the holding holes 89 of the contact plate 12 is partially widened, and accordingly, the pitch between the sockets 61 on the test head 6 can also be partially widened. A large space 65 for wiring can be secured on the test head 6.
  • pitches P 6 and P 7 are set as the pitch between the holding holes 12 c in the contact plate 12. For this reason, the pitch between the IC devices held by the contact plate 12 can be partially widened. Accordingly, the pitch between the sockets 61 on the test head 6 is also partially widened. A large space 65 for wiring can be secured.
  • FIG. 22 is a schematic plan view showing the overall configuration of the electronic component testing apparatus according to the fourth embodiment of the present invention
  • FIG. 23 is a bottom view of the suction head of the transfer device of the electronic component testing apparatus of FIG.
  • the electronic component test apparatus in the present embodiment is different from the first embodiment in the configuration of the application unit and the heat removal unit.
  • the present embodiment is also different from the first embodiment in that a contact plate (holding tray) 12 shown in FIG. 20 is used instead of the contact plate 8 shown in FIGS.
  • a contact plate (holding tray) 12 shown in FIG. 20 is used instead of the contact plate 8 shown in FIGS.
  • an IC device is attached from the customer tray 7 shown in FIG. 2 to the contact plate 12 shown in FIG. 20 without using the intermediate plate 8 shown in FIGS. Transfer directly.
  • the handler 1D includes a carry-in unit 100, an application unit 200D, a test unit 300D, a heat removal unit 400D, and a carry-out unit 500, as shown in FIG.
  • the test unit 300D in the present embodiment has the same configuration as the test unit 300A in the first embodiment.
  • the application unit 200D in the present embodiment includes a thermostatic chamber as in the application unit 200A of the first embodiment. Inside the thermostatic chamber, a vertical transfer device conceptually shown in FIG. 22, a first horizontal transfer device 210D, a first attachment / detachment device 220D, and a first transfer device 205 are provided. .
  • the application unit 200D in the present embodiment does not include the first reversing device and the first pitch changing mechanism, and the application unit 200A in the first embodiment is added in that a first transfer device 205 is added. Is different.
  • the vertical transfer device, the first horizontal transfer device 210D, and the first attachment / detachment device 220D included in the application 200D are the vertical transfer device, the first transfer device in the first embodiment, unless otherwise specified.
  • the configuration is the same as that of the horizontal transfer device 210A and the first attachment / detachment device 220A.
  • the vertical conveying device of the applying unit 200D is different from the vertical conveying device of the applying unit 200A in the first embodiment to raise the customer tray 7 sequentially.
  • the first movable head 230 is cantilevered by the Y-axis rail 221 and does not include the second movable head 240.
  • the first attachment / detachment device 220D is spanned only above the first horizontal transfer device 210D and the first return device 470D.
  • the first attachment / detachment device 220D conveys the contact plate 12 from the first return device 470D to the first horizontal conveyance device 210D.
  • the first return device 470D is configured by, for example, a belt conveyor or the like, similar to the first return device 470A in the first embodiment, and returns the contact plate 12 from the heat removal unit 400D to the application unit 200D. .
  • the first transfer device 205 includes a Y-axis rail 206 that is installed on the main base of the handler 1D along the Y-axis direction, and the Y-axis rail 206 along the Y-axis direction. And a suction head 207 supported so as to be movable.
  • the first transfer device 205 can transfer the IC device from the customer tray 7 located at the top of the vertical transfer device to the contact plate 12 held by the first horizontal transfer device 210D. It has become.
  • the first transfer device 205 can transfer 16 IC devices from the customer tray 7 to the contact plate 12 without performing pitch conversion.
  • the number and arrangement of the suction pads 208 attached to the suction head 207 are not particularly limited as long as pitch conversion is not required.
  • eight suction pads 208 are set to 2 at pitches P 6 and P 8 . It may be arranged in 4 rows.
  • the forwarding device 270D in the present embodiment is configured by, for example, a large number of rotating rollers driven by a motor being arranged in two rows substantially in parallel, and the customer tray 7 can be moved along the X-axis direction. ing.
  • the heat removal unit 400D in the present embodiment includes a heat removal tank, similar to the heat removal unit 400D in the first embodiment. Inside this heat removal tank, a second horizontal transfer device 410D, a second attachment / detachment device 430D, a second transfer device 405, and a vertical transfer device conceptually shown in FIG. 22 are provided.
  • the heat removal unit 400D in the present embodiment does not include the second pitch changing mechanism and the second reversing device, and the heat removal in the first embodiment is added in that a second transfer device 405 is added. This is different from the part 400A.
  • the second horizontal transfer device 410D, the second attachment / detachment device 430D, and the vertical transfer device included in the heat removal unit 400D are the second horizontal transfer in the first embodiment unless otherwise specified.
  • the configuration is the same as that of the device 410A, the second attachment / detachment device 430A, and the vertical transfer device.
  • the first movable head 440 is cantilevered by the Y-axis rail 431 and does not include the second movable head 450.
  • the second attachment / detachment device 430D is spanned only above the second horizontal transfer device 410D and the first return device 470D.
  • the first attachment / detachment device 430D conveys the contact plate 12 from the second horizontal conveyance device 410D to the first return device 470D.
  • the second transfer device 405 has the same configuration as the first transfer device 205 described above, and the customer transferred by the transfer device 270D from the contact plate 12 held by the second horizontal transfer device 410D.
  • the IC device can be transferred to the tray 7.
  • the vertical conveyance device of the heat removal unit 400D sequentially lowers the customer tray 7.
  • the vertical conveyance device raises the customer tray 7.
  • the first transfer device 205 transfers the IC device before the test from the customer tray 7 located at the uppermost stage of the vertical transfer device to the contact plate 12 held by the first horizontal transfer device 210D. .
  • the contact plate 12 loaded with IC devices is carried into the test unit 300D by the first horizontal transfer device 210D.
  • the contact plate 12 is carried out to the heat removal unit 400D.
  • the customer tray 7 in which the IC device is empty is forwarded to the heat removal unit 400D by the forwarding device 270D.
  • the first horizontal transfer device 410D moves the contact plate 12 into the operation area of the second attachment / detachment device 430D and the second transfer device 405. Then, the second transfer device 405 is tested from the contact plate 12 held by the second horizontal transfer device 410D to the customer tray 7 that has been forwarded from the application unit 200D by the forwarding device 270D. Move.
  • the customer tray 7 loaded with the tested IC devices is lowered by the vertical transfer device and then carried to the carry-out section 500.
  • pitches P 6 and P 7 are set as the pitch between the holding holes 87 in the contact plate 12. For this reason, the pitch between the IC devices held by the contact plate 12 can be partially widened. Accordingly, the pitch between the sockets 61 on the test head 6 is also partially widened. A large space 65 for wiring can be secured.
  • the pitches P 1 and P 2 between the receiving holes 72 in the customer tray 7 and the pitches P 6 and P 8 between the holding holes 12 c in the contact plate 12 substantially match.
  • the IC device can be transferred by the first transfer device 205 without changing the pitch between the IC devices.
  • the pitch between the holding groups constituted by a specific number of holding holes has been described, but the present invention is not particularly limited thereto.
  • the pitch between all the holding holes is widened. May be.
  • the IC device is thinned out and transferred from the customer tray to the contact plate every other line.
  • the present invention is not particularly limited to this.
  • the IC device is transferred from the customer tray to the contact plate every two rows, or the IC device is transferred from the customer tray to the contact plate except for a specific row. Also good.
  • a transfer means for transferring the IC device between the customer tray and the contact plate for example, a pick and place device or the like may be used instead of the reversing device.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2008/059829 2008-05-28 2008-05-28 電子部品ハンドリング装置、電子部品試験装置および電子部品保持トレイ WO2009144790A1 (ja)

Priority Applications (2)

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PCT/JP2008/059829 WO2009144790A1 (ja) 2008-05-28 2008-05-28 電子部品ハンドリング装置、電子部品試験装置および電子部品保持トレイ
TW098114005A TW201000380A (en) 2008-05-28 2009-04-28 Electronic component handling apparatus, electronic component test apparatus and electronic component holding tray

Applications Claiming Priority (1)

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PCT/JP2008/059829 WO2009144790A1 (ja) 2008-05-28 2008-05-28 電子部品ハンドリング装置、電子部品試験装置および電子部品保持トレイ

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WO2014102856A1 (ja) * 2012-12-25 2014-07-03 平田機工株式会社 搬送システム
JP2015062036A (ja) * 2015-01-06 2015-04-02 株式会社アドバンテスト 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP6039425B2 (ja) * 2010-12-22 2016-12-07 日本発條株式会社 検査システム
US9586760B2 (en) 2011-12-28 2017-03-07 Advantest Corporation Electronic component transfer shuttle
TWI667482B (zh) * 2017-01-11 2019-08-01 韓商泰克元有限公司 測試分選機用加壓裝置
CN114955541A (zh) * 2022-06-30 2022-08-30 歌尔科技有限公司 电池转移模组和电池测试设备

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TWI416137B (zh) * 2010-10-15 2013-11-21 Well Handle Technology Co Ltd 電子零件之轉接式測試設備
KR101968984B1 (ko) * 2012-03-16 2019-08-26 (주)테크윙 사이드도킹식 테스트핸들러
KR102072390B1 (ko) * 2013-06-18 2020-02-04 (주)테크윙 테스트핸들러
CN114148712A (zh) * 2021-11-05 2022-03-08 扬州京柏自动化科技有限公司 用于电池触摸板的自动摆盘机

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Publication number Priority date Publication date Assignee Title
JP6039425B2 (ja) * 2010-12-22 2016-12-07 日本発條株式会社 検査システム
US9586760B2 (en) 2011-12-28 2017-03-07 Advantest Corporation Electronic component transfer shuttle
WO2014102856A1 (ja) * 2012-12-25 2014-07-03 平田機工株式会社 搬送システム
JP5926403B2 (ja) * 2012-12-25 2016-05-25 平田機工株式会社 搬送システム
US10106336B2 (en) 2012-12-25 2018-10-23 Hirata Corporation Transport system
JP2015062036A (ja) * 2015-01-06 2015-04-02 株式会社アドバンテスト 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
TWI667482B (zh) * 2017-01-11 2019-08-01 韓商泰克元有限公司 測試分選機用加壓裝置
CN114955541A (zh) * 2022-06-30 2022-08-30 歌尔科技有限公司 电池转移模组和电池测试设备
CN114955541B (zh) * 2022-06-30 2024-04-09 歌尔科技有限公司 电池测试设备

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