WO2009142413A2 - 콘덴서 마이크로폰용 스페이서 일체형 다이어프램 - Google Patents

콘덴서 마이크로폰용 스페이서 일체형 다이어프램 Download PDF

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Publication number
WO2009142413A2
WO2009142413A2 PCT/KR2009/002528 KR2009002528W WO2009142413A2 WO 2009142413 A2 WO2009142413 A2 WO 2009142413A2 KR 2009002528 W KR2009002528 W KR 2009002528W WO 2009142413 A2 WO2009142413 A2 WO 2009142413A2
Authority
WO
WIPO (PCT)
Prior art keywords
diaphragm
spacer
integrated
present
spacers
Prior art date
Application number
PCT/KR2009/002528
Other languages
English (en)
French (fr)
Korean (ko)
Other versions
WO2009142413A3 (ko
Inventor
이원택
김창원
김정민
김형주
Original Assignee
주식회사 비에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이 filed Critical 주식회사 비에스이
Priority to US12/993,315 priority Critical patent/US20110182448A1/en
Priority to JP2011510417A priority patent/JP2011521586A/ja
Publication of WO2009142413A2 publication Critical patent/WO2009142413A2/ko
Publication of WO2009142413A3 publication Critical patent/WO2009142413A3/ko

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
    • A61P35/00—Antineoplastic agents
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025—Diaphragms comprising polymeric materials

Definitions

  • the present invention relates to a condenser microphone, and more particularly, to a spacer-integrated diaphragm in which a spacer and a diaphragm are integrated to reduce the number of parts and processes, thereby reducing the manufacturing cost of the microphone and removing parasitic capacitance.
  • a typical condenser microphone 10 is, as shown in Fig. 1, a case 11 made of a cylindrical metal with a sound hole 11a formed in the front plate, a polarizing ring 12 made of a conductor, a diaphragm 13, a spacer ( 14) a ring-shaped first base made of an insulator (also called an insulated base 15), a fixed electrode 16 which faces the diaphragm 13 and the spacer 14 therebetween, and a second base made of a conductor (conductive base) Also referred to as 17), it consists of a PCB 18 having circuit components mounted thereon and a connecting terminal formed thereon, which is typically laminated in the case 11 and then curled (11b) the ends of the case 11. Are manufactured.
  • the polar ring 12 and the diaphragm 13 may be bonded to each other to be integrated.
  • the fixed electrode 16 has a structure in which a polymer film is attached to a metal plate to form an electret. .
  • a typical condenser microphone has a separate structure in which the diaphragm and the spacer are separated, and the spacer is usually made of an insulating polymer film.
  • the spacer is formed of a polymer film
  • the polymer film since the polymer film has its own dielectric constant, parasitic capacitance is generated and acts as an unnecessary capacity, thereby lowering the sensitivity of the microphone.
  • the present invention has been proposed to solve the above problems, and an object of the present invention is to provide a spacer-integrated diaphragm which can reduce the assembly process by being integrated with the spacer and the diaphragm.
  • Another object of the present invention is to provide a spacer-integrated diaphragm having a structure in which parasitic capacitance is not generated by screen printing a PSR (Photo Solder Resist) on the diaphragm to implement a spacer.
  • PSR Photo Solder Resist
  • the spacer-integrated diaphragm of the present invention includes an insulating spacer made of a diaphragm made of a flat conductive film and a photo solder resist (PSR) protruding with a plurality of holes formed therein. It is characterized in that it is integrally configured to remove the parasitic capacity.
  • PSR photo solder resist
  • the diaphragm has a rectangular plate shape with rounded corners, and the spacer is formed near four sides of the rectangular plate shape.
  • the spacer integrated diaphragm of the present invention includes a diaphragm made of a flat conductive film, and an insulating spacer made of a polymer film having a plurality of holes formed integrally with a peripheral portion of the diaphragm. Characterized in that the dose is removed.
  • the spacer is formed of a PSR (Photo Solder Resist) material and a plurality of holes are formed to remove unnecessary parasitic capacitance, thereby improving sound quality, and the diaphragm and the spacer are integrated to assemble a condenser microphone. This reduces the number of processes in the process and reduces manufacturing costs by reducing the number of parts.
  • PSR Photo Solder Resist
  • FIG. 1 is a side cross-sectional view of a typical condenser microphone to which the present invention can be applied;
  • Figure 2 is a perspective view showing a spacer integrated diaphragm according to an embodiment of the present invention
  • FIG. 3 is a plan view of the spacer integrated diaphragm shown in FIG.
  • FIG. 4 is a flow chart showing a manufacturing process of the spacer-integrated diaphragm according to an embodiment of the present invention
  • FIG. 5 is a perspective view of a spacer-integrated diaphragm according to the present invention.
  • FIG. 2 is a perspective view showing the spacer integrated diaphragm 20 according to an embodiment of the present invention
  • FIG. 3 is a plan view of the spacer integrated diaphragm 20 shown in FIG.
  • the spacer-integrated diaphragm 20 has a rectangular flat diaphragm 22 having rounded corners and a PSR near four sides above the diaphragm 22. (Photo Solder Resist) It is composed of a spacer 24 protruding through a printing process.
  • the diaphragm 22 is a conductive vibrating membrane vibrating by the sound pressure introduced from the outside through the sound hole in the condenser microphone, and the spacer 22 is rectangular in shape to form the 4 of the diaphragm 22. It protrudes from the side to maintain distance from the backplate.
  • the spacer 24 according to the present invention is made of a PSR (Photo Solder Resist) material printed on the diaphragm 22, and a plurality of holes 24a are formed to remove parasitic capacitance.
  • PSR Photo Solder Resist
  • FIG. 4 is a flowchart illustrating a manufacturing process of the spacer-integrated diaphragm according to the embodiment of the present invention.
  • the raw material is washed and dried in the second step S2 to prepare PSR printing.
  • the third step S3 a hole is formed and a mask is placed on four sides of the diaphragm, and then PSR ink is printed on the prepared raw material (S4).
  • the spacer-integrated diaphragm 20 of the present invention completed as described above has a spacer 24 formed of a PSR material, and a plurality of holes are formed, thus reducing the area compared to a conventional spacer, and eliminating parasitic capacitance. This reduces the process of assembling condenser microphones and reduces manufacturing costs by reducing the number of parts.
  • FIG. 5 illustrates an example of a spacer-integrated diaphragm according to another embodiment of the present invention, in which a polymer film having a plurality of holes is used as a spacer.
  • the spacer integrated diaphragm 30 is integrated by attaching a spacer 34 made of a polymer film having a plurality of holes 34a to the diaphragm 32 as shown in FIG. 5.
  • the hole 34a is formed by mechanical processing (punching, etc.) on the polymer film, thereby reducing the area of the polymer film constituting the spacer 34, thereby causing parasitics due to the dielectric constant of the polymer film. The capacity is removed.
  • a plurality of holes may be used after the formation of the plurality of holes in the ring-shaped polymer film. In this case, it can be separated into four pieces and attached to each of the four sides of the diaphragm.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
PCT/KR2009/002528 2008-05-19 2009-05-13 콘덴서 마이크로폰용 스페이서 일체형 다이어프램 WO2009142413A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/993,315 US20110182448A1 (en) 2008-05-19 2009-05-13 Spacer-integrated diaphragm for condenser microphone
JP2011510417A JP2011521586A (ja) 2008-05-19 2009-05-13 コンデンサマイクロフォン用スペーサ一体型ダイヤフラム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20-2008-0006471 2008-05-19
KR2020080006471U KR200449885Y1 (ko) 2008-05-19 2008-05-19 콘덴서 마이크로폰용 스페이서 일체형 다이어프램

Publications (2)

Publication Number Publication Date
WO2009142413A2 true WO2009142413A2 (ko) 2009-11-26
WO2009142413A3 WO2009142413A3 (ko) 2010-02-25

Family

ID=41340662

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002528 WO2009142413A2 (ko) 2008-05-19 2009-05-13 콘덴서 마이크로폰용 스페이서 일체형 다이어프램

Country Status (6)

Country Link
US (1) US20110182448A1 (zh)
JP (1) JP2011521586A (zh)
KR (1) KR200449885Y1 (zh)
CN (1) CN201403190Y (zh)
TW (1) TWM368992U (zh)
WO (1) WO2009142413A2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449436B (zh) * 2009-12-25 2014-08-11 Merry Electronics Shenzhen Co Ltd 易組裝之電容式麥克風
CN111866695A (zh) * 2019-04-30 2020-10-30 讯芯电子科技（中山）有限公司 麦克风装置制造方法以及麦克风装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200286533Y1 (ko) * 2002-05-15 2002-08-21 (주)비에이텔레콤 반도체 일렉트릭 콘덴서 마이크로폰 조립체
KR20020087204A (ko) * 2001-05-14 2002-11-22 주식회사 삼부커뮤닉스 금속 코팅된 이소불화비닐 필름을 진동판으로 사용한초소형 마이크로폰
KR100406257B1 (ko) * 2001-05-30 2003-11-14 주식회사 삼부커뮤닉스 콘덴서 마이크로폰의 제조방법
KR20040052700A (ko) * 2004-04-28 2004-06-23 혜성 테크빅 주식회사 스페이서 일체형 콘텐서 마이크로폰의 진동판과 콘택트링일체형 콘덴서 마이크로폰의 배극판과 그의 제조방법그리고 상기 부품으로 구성되는 콘덴서 마이크로폰

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5596799A (en) * 1979-01-16 1980-07-23 Matsushita Electric Ind Co Ltd Production of electrostatic electroacustic transducer
JPH0726887B2 (ja) * 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
JP2001339794A (ja) * 2000-05-30 2001-12-07 Star Micronics Co Ltd エレクトレットコンデンサマイクロホン及びその組立方法
JP2004032019A (ja) * 2002-06-21 2004-01-29 Star Micronics Co Ltd コンデンサマイクロホン
KR20050025840A (ko) * 2003-09-08 2005-03-14 주식회사 삼부커뮤닉스 공간 활용이 용이한 타원형 콘덴서 마이크로폰

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020087204A (ko) * 2001-05-14 2002-11-22 주식회사 삼부커뮤닉스 금속 코팅된 이소불화비닐 필름을 진동판으로 사용한초소형 마이크로폰
KR100406257B1 (ko) * 2001-05-30 2003-11-14 주식회사 삼부커뮤닉스 콘덴서 마이크로폰의 제조방법
KR200286533Y1 (ko) * 2002-05-15 2002-08-21 (주)비에이텔레콤 반도체 일렉트릭 콘덴서 마이크로폰 조립체
KR20040052700A (ko) * 2004-04-28 2004-06-23 혜성 테크빅 주식회사 스페이서 일체형 콘텐서 마이크로폰의 진동판과 콘택트링일체형 콘덴서 마이크로폰의 배극판과 그의 제조방법그리고 상기 부품으로 구성되는 콘덴서 마이크로폰

Also Published As

Publication number Publication date
WO2009142413A3 (ko) 2010-02-25
KR200449885Y1 (ko) 2010-08-17
US20110182448A1 (en) 2011-07-28
TWM368992U (en) 2009-11-11
KR20090011860U (ko) 2009-11-24
CN201403190Y (zh) 2010-02-10
JP2011521586A (ja) 2011-07-21

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