WO2009136721A2 - Prise de vérification et procédé de fabrication correspondant - Google Patents

Prise de vérification et procédé de fabrication correspondant Download PDF

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Publication number
WO2009136721A2
WO2009136721A2 PCT/KR2009/002360 KR2009002360W WO2009136721A2 WO 2009136721 A2 WO2009136721 A2 WO 2009136721A2 KR 2009002360 W KR2009002360 W KR 2009002360W WO 2009136721 A2 WO2009136721 A2 WO 2009136721A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
test socket
film
manufacturing
housing
Prior art date
Application number
PCT/KR2009/002360
Other languages
English (en)
Korean (ko)
Other versions
WO2009136721A3 (fr
Inventor
이재학
Original Assignee
(주)아이에스시테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이에스시테크놀러지 filed Critical (주)아이에스시테크놀러지
Publication of WO2009136721A2 publication Critical patent/WO2009136721A2/fr
Publication of WO2009136721A3 publication Critical patent/WO2009136721A3/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces

Definitions

  • the present invention relates to a test socket and a method for manufacturing the test socket, and more particularly, to a test socket and a method for manufacturing the test socket for easy manufacturing and easy contact with the terminal of the electrical component.
  • test socket determines whether a short circuit of a completed electrical component is performed to determine a failure of the electrical component.
  • a test socket is used to electrically connect the terminals of the electrical component and the pad of the test apparatus to determine whether there is a short circuit.
  • the test socket is installed between the electrical component and the test apparatus, and is designed to be in contact with the terminal and the pad, respectively.
  • Test socket 100 the housing 120 consisting of the upper housing 121 and the lower housing 122, and disposed within the housing 120, the electrical component 140 It consists of a conductive member 110 for electrically connecting the terminal 130 of the) and the pad 151 of the test device 150.
  • the upper housing 121 and the lower housing 122 are formed with through holes 121a and 122a penetrating in the vertical direction, and predetermined protruding projections 121b and 122b are formed on the inner circumferential surfaces of the through holes 121a and 122a. Is formed.
  • the conductive member 110 is composed of a conductive pin 111 formed on the upper side, and a spring 112 disposed below the conductive pin.
  • the conductive pin 111 is inserted into the through hole 121a of the upper housing 121, and a locking jaw 111a that is caught by the protruding jaw 121b is formed on an outer circumferential surface of the conductive pin 111.
  • the locking jaw 111a does not escape to the outside of the through hole 121a as the locking jaw 111a is caught by the protruding jaw 121b.
  • the spring 112 has a locking jaw portion (112a) corresponding to the projecting jaw (122b) of the lower lower portion 122 is formed, the spring 112 is lowered through the through hole (122a) Can't get out
  • the test socket according to the related art is connected to the electrical component 140 carried by the handler 130 in a state where it is mounted in the test apparatus. Specifically, when the electrical component 140 carried by the handler 130 descends and the terminal 141 of the electrical component 140 comes into contact with the upper end of the conductive pin 111, the electrical component ( When the electrical component 140 is pressed downward by a pressing means (not shown) for pressing the 140, the conductive pin 111, the spring 112, and the pad 151 of the test apparatus 150 are electrically connected to each other. .
  • the test socket according to the prior art is configured to separate the housing into an upper housing and a lower housing so that the conducting member provided in the through hole of the housing does not escape to the outside, and protruding jaws are formed in the upper housing and the lower housing.
  • Complex machining was required, such as through holes. This complex machining causes the overall cost of the test socket to increase.
  • FIG. 2 is a view of a test socket according to the prior art different from Figure 1
  • Figure 3 is an operation of FIG.
  • the test socket described in FIG. 2 and FIG. 3 has a housing 120 including an upper housing 121 and a lower housing 122, and the electrical component 140 and the test device 150 electrically connected to each other.
  • the conductive member 110 is disposed on the upper side of the housing 120 and connected to each other by the film 113 and the spring 115 disposed below the first conductive portion 114. Is done.
  • Through holes 121a and 122a are formed in the upper housing 121 and the lower housing 122 at positions corresponding to the terminals 141 of the electrical component 140, respectively.
  • the conductive part 114 may be in contact with the terminal 141 of the electrical component 140
  • the lower end of the spring 115 may be in contact with the pad 151 of the test apparatus 150.
  • test socket according to FIG. 2 since conductive parts contacting the terminals of the electrical component are connected to each other by the film, there is no fear that foreign substances adsorbed on the terminals of the electrical components may enter the housing or through-holes.
  • the position is kept constant, and if the cross-sectional area of the conductive portion to be connected to the terminal of the electrical component is increased, the surface area to be in contact with the terminal of the electrical component is increased, thereby making it easy to make an electrical connection.
  • the test socket in which such a film is formed may cause the lower end of the handler to contact the film as shown in FIG. 3 when the thickness of the handler for carrying the electrical component is increased.
  • the housing is made of the upper housing and the lower housing in the test socket shown in FIG. 2, the cost for processing the housing is increased, which is a major cause of the increase in the cost of the overall test socket.
  • FIG. 1 is a view showing a test socket according to the prior art.
  • Figure 2 shows another test socket according to the prior art.
  • FIG. 3 is an operational view of FIG.
  • FIG. 4 is a view showing a test socket according to a preferred embodiment of the present invention.
  • FIG. 5 is an operational view of FIG.
  • FIG. 6 and 7 show the steps of manufacturing the test socket according to FIG.
  • the present invention has been created to solve the above-described problems, more specifically, it is effective to use a variety of types of handlers, and a test socket and a test socket for reducing the cost of manufacturing a housing used for the test socket It is an object to provide a method of manufacturing a socket.
  • Test socket according to the present invention for solving the above object is a test socket for electrically connecting the terminal of the electrical component and the pad of the test apparatus,
  • a housing having a plurality of through holes formed in a vertical direction at a position corresponding to the terminal of the electrical component; And a conductive member coupled to the housing and electrically connected to the terminal of the electrical component and the pad of the test apparatus.
  • the conductive member may include: a plurality of first conductive parts arranged at a position corresponding to the through hole at an upper side of the housing and having a constant position between each other by a first film; A plurality of second conductive parts are arranged in a position corresponding to the through hole in the lower side of the housing, the plurality of second conductive parts are maintained constant between each other by a second film coupled to the housing; And a conductive member inserted into the through hole, the upper end of which is in contact with a lower surface of the first conductive part, and the lower end of which is in contact with an upper surface of the second conductive part, wherein the first conductive part and the conductive member are soldered and joined. The second conductive portion and the conductive member are also soldered together.
  • diamond powder is formed on the surfaces of the first conductive portion and the second conductive portion.
  • the conductive member is preferably a spring.
  • the through hole preferably has the same diameter in the vertical direction.
  • the second film is preferably bonded and bonded to the lower surface of the housing by an adhesive.
  • the first conductive portion and the second conductive portion are preferably made of a circular cross section having a diameter larger than the inner diameter of the through hole.
  • a method of manufacturing a test socket according to the present invention for achieving the above object in the method of manufacturing a test socket for electrically connecting the terminal of the electrical component and the pad of the test apparatus, corresponding to the terminal of the electrical component Manufacturing a first film having a plurality of first conductive parts formed at positions; And disposing the first conductive part on an upper side of the conductive member. Soldering the first conductive part and the conductive member to each other; Manufacturing a second film having a plurality of second conductive parts formed at positions corresponding to terminals of the electrical component; Disposing the second conductive portion under the conductive member; And soldering the conductive member and the second conductive part to each other.
  • a method of manufacturing a test socket according to the present invention for achieving the above object in the method of manufacturing a test socket for electrically connecting the terminal of the electrical component and the pad of the test apparatus, corresponding to the terminal of the electrical component Manufacturing a second film having a plurality of second conductive parts formed at a predetermined position, and manufacturing a first film having a plurality of first conductive parts formed at a position corresponding to a terminal of the electrical component; Disposing the second conductive portion below the conductive member and simultaneously placing the first conductive portion above the conductive member; And soldering and bonding the first conductive part and the conductive member, and the second conductive member and the conductive member to each other.
  • the step of applying a solder paste on the surface of the second conductive portion is preferable that the step of applying a solder paste on the surface of the second conductive portion.
  • the disposing step It is preferable to include the step of attaching the edge portion of the second film except the connecting portion of the second film connecting the second conductive portion to the housing by an adhesive or adhesive tape.
  • the soldering step the step of heating the solder paste to form a molten state, so that one end of the conductive member is embedded in the molten solder paste; And cooling the solder paste.
  • the solder paste filled in the exposed hole is preferably made of an alloy material of tin, silver, copper.
  • test socket and the manufacturing method according to the present invention having the above-described configuration, there is an effect that the terminal of the electrical component can be electrically connected to the test apparatus irrespective of the shape of the handler for carrying the electrical component.
  • test socket the manufacturing cost of the test socket is reduced because it is not necessary to make a complicated hole in the housing of the test socket.
  • FIG. 4 is a view showing a test socket according to a preferred embodiment of the present invention
  • Figure 5 is an operation of FIG.
  • Test socket 10 according to an embodiment of the present invention, as shown in Figure 4 is disposed between the electrical component 140 and the test device 150, the terminal 141 of the electrical component 140 And the pad 151 of the test apparatus 150 are electrically connected to each other, and are formed of a housing 40 and a conductive member 20.
  • the housing 40 is a through-hole 41 penetrating the upper and lower surfaces in a position corresponding to the terminal 141 of the electrical component 140, the material forming the housing 40 FR4, FR5, Bakelite can be used, and of course, synthetic resin materials such as PCB fabrication materials and heat-resistant engineering plastics can be used. Since the through hole 41 has the same diameter in the vertical direction, it can be easily made using a general drill.
  • the conductive member 20 includes a first conductive portion 21, a second conductive portion 23, and a conductive member 22.
  • the first conductive part 21 is disposed on the upper side of the housing 40, and specifically, a plurality of first conductive parts 21 are arranged in an upper position corresponding to the through hole 41, and each first conductive part ( 21 are connected to each other by the first film 211.
  • the first film 211 not only serves to maintain the left and right positions between the first conductive parts 21 uniformly, and foreign matter falling from the terminal 141 of the electrical component 140 may have a housing 40. It serves to prevent falling into the through hole 41 in).
  • the first film 211 is preferably a polyamide-imide (PAI) material having heat resistance to withstand the high temperature heat generated when soldering, but various heat resistance if it can withstand high temperature It is possible to use special synthetic resin sheets.
  • PAI polyamide-imide
  • Diamond powder (not shown) is preferably disposed on the surface of the first conductive portion 21.
  • the diamond powder when the diamond powder is disposed on the surface of the first conductive portion 21, even when a foreign material film (not shown) is formed on the terminal 141 of the electrical component 140, the diamond powder is formed on the terminal ( 141) can break the foreign matter film. Accordingly, the surface of the foreign matter film and the surface of the first conductive portion 21 are not in contact with each other, so that the electrical resistance does not increase, and the terminal 141 of the electrical component 140 having the foreign matter film removed by the diamond powder passes through the diamond powder. The electrical resistance can be greatly reduced by contacting the surface of the one conductive portion 21.
  • the first conductive portion 21 has a circular cross section as a whole, and specifically, the diameter of the first conductive portion 21 is preferably larger than the inner diameter of the through hole 41.
  • the second conductive portion 23 has a form in which a plurality of the second conductive portion 23 is arranged in a lower position corresponding to the through hole 41 in the lower side of the housing 40, each of the second conductive portion 23 is a second It is connected to each other by the film 231.
  • the second film 231 serves to keep the position of the second conductive portion 23 constant like the first film 211, and the conductive member 20 has the housing 40. It also plays a role in being able to be fixedly coupled to the system. That is, as the edge portion of the second film 231 is fixedly coupled to the lower surface of the housing 40 by the adhesive 30, the conductive member 20 may be maintained at a constant position without being separated from the housing 40. have.
  • diamond powder is also formed on the surface of the second conductive portion 23, and the second conductive portion 23 preferably has a circular cross section having a larger diameter than the inner diameter of the through hole 41. .
  • the conductive member 22 is a spring, and the upper end and the lower end of the spring are preferably soldered to the first conductive part 21 and the second conductive part 23, respectively. Most of the conducting member 22 has a form inserted into the through hole 41 of the housing 40, the upper side may be exposed to the outside of the through hole 41.
  • the spring used as the conducting member 22 may be a metal material such as iron and nickel having excellent conductivity, and the surface of the spring is preferably plated in order of copper and gold, and various precious metals such as silver in addition to gold. Of course, it can be used as a plating material.
  • test socket according to the present embodiment can be manufactured as shown in FIG.
  • a second film 231 having a second conductive portion 23 formed at a position corresponding to the terminal 141 of the electrical component 140 is manufactured.
  • the second conductive part 23 has a structure in which the via hole is completely blocked by copper or nickel plating after the second conductive part 23 is formed on the second film 231 with the via hole in the center. (The reason for blocking the via hole as described above is to prevent the solder paste from melting and penetrating into the top of the conducting member 22 to be used later.)
  • the second conductive part ( A mask frame 50 having a plurality of exposure holes 51 formed at a position corresponding to 23 is disposed above the second film 231, so that the exposure hole 51 and the second conductive part 23 are disposed. Should be placed up and down.
  • the solder paste 60 is applied to each second conductive portion 23. Specifically, as shown in FIG. 6B, the solder paste 60 is filled in the exposed hole 51, and the solder paste 60 is filled in the exposed hole 51. 2 so that it can be located above the conductive portion (23).
  • the solder paste 60 is preferably made of tin, silver, and copper, each of which excludes heavy metals, or an alloy composed of at least two of them, but is not limited thereto. Various materials may be used.
  • the mask frame 50 is removed from the second film 231.
  • the solder paste 60 is heated and melted as shown in FIG. Specifically, the solder paste 60 is placed in the oven by placing the second conductive part 23 and the second film 231 on which the solder paste 60 is placed, or by applying hot air to the solder paste 60. Dissolve. Specifically, the solder paste is melted to have a hemispherical shape and then cooled to maintain the hemisphere shape. Subsequently, as shown in FIG. 6E, the edge portion of the second film except for the connection portion of the second film connecting the second conductive portion is attached to the housing by a contact agent or an adhesive tape. Thereafter, as shown in FIG.
  • a spring which is an energizing member 22, is inserted through the through hole 41 so that one end of the spring contacts the surface of the hemispherical solder paste 60. do.
  • the solder paste 60 is heated to form a molten state, and one end of the conductive member is embedded in the molten solder paste, and then the solder paste is cooled.
  • the conductive member 22 and the second conductive portion 23 are soldered to each other.
  • the housing 40 is turned upside down as shown in FIG. 7 (h), and then the first conductive portion 21 coated with the solder paste 60 is disposed as shown in FIG. 7 (i). do.
  • a plurality of first conductive parts 21 are disposed, and each of the first conductive parts 21 is connected to each other by a film.
  • one end of the spring is placed in contact with the solder paste.
  • the solder paste 60 is heated and melted so that the first conductive portion 21 and the spring are soldered to each other, thereby completing the preparation of the test socket 10 according to the present embodiment.
  • test socket according to this embodiment has the following effects.
  • the test socket according to this embodiment has the following advantages.
  • a complex through hole having a protruding jaw is formed in order to couple the conductive portion or the spring to the housing, and the housing has an upper housing and a lower portion for inserting the conductive portion or the spring into the through hole.
  • the housing had to form a complex form, such as a housing.
  • the first conductive part and the second conductive part are soldered and joined by a spring, the first conductive part, the spring, and the second conductive part are fixed by fixing the film connecting the second conductive part to the housing. Allows the additional housing to be locked in position. That is, in this embodiment, since only the through holes having the same diameter need to be formed, there is an advantage that the processing cost of the housing can be significantly reduced.
  • test socket according to the present invention described above may be modified as follows.
  • the second conductive portion is soldered and joined to one surface of the spring, which is the conductive member, and then the opposite surface of the spring, which is the conductive member, is soldered and bonded to the first conductive portion, is described.
  • the first conductive part and the second conductive part may be soldered to the upper and lower surfaces of the spring, which may be soldered to the spring, and then the second conductive part may be soldered to the spring.
  • a method of assembling a spring which is a conducting member, and then heating and reattaching the solder paste is applied after the solder paste is applied, heated to melt in a hemispherical shape, and then cooled. Thereafter, a method of joining both by heating is also possible.
  • first conductive part and the second conductive part have been described as having a circular cross section, but it is also possible to have various polygonal cross sections as necessary.
  • inner diameters of the first conductive part and the second conductive part are mentioned to be larger than the through holes, the present invention is not limited thereto and may be smaller than the through holes.
  • the second film is attached to the lower surface of the housing by an adhesive, but in addition, the adhesive sheet or bolt fastening can be fixed to the housing by various means.
  • the first conductive part and the terminal of the electrical component are shown in direct contact, but in addition, the elastic sheet may be disposed above the first conductive part.
  • the elastic sheet includes an elastic conductive portion disposed at a position corresponding to the first conductive portion, and an insulating portion supporting the elastic conductive portion and disposed at a position corresponding to the first film.
  • the elastic conductive part has a form in which a plurality of conductive particles are distributed in an elastic material such as silicone rubber. When the terminal of the electrical component presses the elastic conductive portion, the plurality of conductive particles may be in contact with each other to achieve an electrically conductive state. On the other hand, such an elastic sheet may be disposed below the second conductive portion.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne une prise de vérification et un procédé de fabrication correspondant. Elle concerne, plus particulièrement, une prise de vérification destinée à relier électriquement des terminaux pour un composant électrique et un tampon d'un dispositif de vérification, et un procédé de fabrication correspondant, la prise de vérification comprenant: un boîtier dans lequel plusieurs trous traversants s'étendant longitudinalement sont ménagés dans des positions de compteurs de terminaux destinés au composant électronique; et un élément conducteur couplé au boîtier et relié électriquement aux terminaux destinés au composant électronique et au tampon du dispositif de vérification, l'élément conducteur comprenant: plusieurs premiers conducteurs disposés, sur la partie supérieure du boîtier, dans des positions de compteurs des trous traversants, tout en restant dans des positions fixes entre eux au moyen d'un premier film; plusieurs seconds conducteurs disposés, sur la partie inférieure du boîtier, dans des positions de compteurs des trous traversants, tout en en restant dans des positions fixes entre eux au moyen d'un second film collé sur le boîtier; et des éléments reliés électriquement qui sont introduits dans les trous traversants, chacun possédant une extrémité supérieure entrant en contact avec la surface inférieure du premier conducteur et une extrémité inférieure entrant en contact avec la surface supérieure du second conducteur. Les premiers conducteurs et les éléments reliés électriquement sont couplés entre eux par soudage, et les seconds conducteurs et les éléments reliés électriquement sont également couplés entre eux par soudage.
PCT/KR2009/002360 2008-05-06 2009-05-06 Prise de vérification et procédé de fabrication correspondant WO2009136721A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080041874A KR100926776B1 (ko) 2008-05-06 2008-05-06 테스트용 소켓의 제작방법
KR10-2008-0041874 2008-05-06

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WO2009136721A2 true WO2009136721A2 (fr) 2009-11-12
WO2009136721A3 WO2009136721A3 (fr) 2010-02-25

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WO (1) WO2009136721A2 (fr)

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Publication number Priority date Publication date Assignee Title
KR100968622B1 (ko) 2008-02-25 2010-07-08 주식회사 아이에스시테크놀러지 테스트용 소켓 및 그 소켓의 제작방법
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084047A (ja) * 2001-06-29 2003-03-19 Sony Corp 半導体装置の測定用治具
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151550A (ja) 2000-11-15 2002-05-24 Nec Corp 半導体装置、その製造方法並びに製造に使用するコイルスプリング切断治具及びコイルスプリング供給治具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084047A (ja) * 2001-06-29 2003-03-19 Sony Corp 半導体装置の測定用治具
KR20060062824A (ko) * 2004-12-06 2006-06-12 주식회사 아이에스시테크놀러지 반도체 패키지 테스트용 실리콘 커넥터
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体

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WO2009136721A3 (fr) 2010-02-25
KR20090116136A (ko) 2009-11-11
KR100926776B1 (ko) 2009-11-16

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