WO2009134041A2 - Évaporateur et appareil de dépôt sous vide muni de celui-ci - Google Patents

Évaporateur et appareil de dépôt sous vide muni de celui-ci Download PDF

Info

Publication number
WO2009134041A2
WO2009134041A2 PCT/KR2009/002185 KR2009002185W WO2009134041A2 WO 2009134041 A2 WO2009134041 A2 WO 2009134041A2 KR 2009002185 W KR2009002185 W KR 2009002185W WO 2009134041 A2 WO2009134041 A2 WO 2009134041A2
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
pot
evaporation
outlets
substrate
Prior art date
Application number
PCT/KR2009/002185
Other languages
English (en)
Other versions
WO2009134041A3 (fr
Inventor
Jong Woon Kim
Jae Seung Lee
Dong Il Cha
Sun Hyuk Kim
In Ho Hwang
Original Assignee
Sunic System. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080039841A external-priority patent/KR100994454B1/ko
Priority claimed from KR1020090026559A external-priority patent/KR20100108086A/ko
Application filed by Sunic System. Ltd. filed Critical Sunic System. Ltd.
Publication of WO2009134041A2 publication Critical patent/WO2009134041A2/fr
Publication of WO2009134041A3 publication Critical patent/WO2009134041A3/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present disclosure relates to a vacuum deposition apparatus, and more particularly, to an evaporator and a vacuum deposition apparatus including the evaporator, which are configured to improve the uniformity of a thin film deposited on a substrate.
  • the most popular thin film forming methods for fabricating organic light emitting devices include evaporating organic matter and depositing the evaporated organic matter on a surface of a substrate.
  • the depositing of the evaporated organic matter includes disposing a substrate, such as a glass, in a chamber, and facing an evaporation source, such as a point source containing organic matter, a surface of the substrate. After that, the evaporation source containing the organic matter is heated to evaporate the organic matter, and the evaporated organic matter is deposited on the surface of the substrate to form an organic thin film.
  • linear-type evaporation sources are widely used to secure the uniformity of a thin film having a large area, instead of evaporation sources known as point sources.
  • Such a linear-type evaporation source includes a plurality of evaporation outlets having the same diameter and the same distances in an upper portion of a parallelepiped pot to evaporate organic matter uniformly on a substrate having a large area.
  • organic matter evaporated from the evaporation outlets having the same diameter and the same distance is concentrated on the center of the substrate, so that the center of the substrate is thicker than the edge thereof.
  • the organic matter evaporated from the evaporation outlets and corresponding to the edge of the substrate is just partially deposited on the substrate, so that a large amount of the organic matter is lost.
  • heat of the heated evaporation source is radiated through the evaporation outlets to the substrate, and the transferred heat increases the temperature of the substrate.
  • thin films deposited on the substrate may be damaged.
  • the present disclosure provides an evaporator and a vacuum deposition apparatus including the evaporator, which are configured to improve the uniformity of a thin film deposited on a substrate and reduce the loss of organic matter.
  • the present disclosure also provides an evaporator and a vacuum deposition apparatus including the evaporator, which are configured to prevent heat radistion from an evaporation source to a substrate and the temperature increase of the substrate.
  • an evaporator includes: a pot storing organic matter therein; a pot cover covering an opening of the pot; and a plurality of evaporation outlets spaced apart from each other to evaporate the organic matter evaporated from the pot.
  • the evaporation outlets may be different from each other in at least one of length and diameter.
  • the evaporation outlets each may have a vertically penetrated container shape and be coupled to the pot cover.
  • the evaporation outlets may be coupled in a manner where the evaporation outlets protrude toward at least one of an outside and an inside of the pot.
  • the evaporation outlets, protruding toward the outside of the pot, may be bent.
  • the evaporation outlets may increase in length from a center of the pot toward an edge of the pot. Distances between the evaporation outlets may be different from each other. The distances between the evaporation outlets may decrease from the center toward the edge.
  • the evaporation outlets may decrease in diameter from a center of the pot toward an edge of the pot. Distances between the evaporation outlets are different from each other. The distances between the evaporation outlets may decrease from the center toward the edge.
  • the evaporator may further include a shield plate disposed over the pot cover and preventing heat radiation.
  • the evaporation outlets each may have a vertically penetrated container shape and be coupled to the pot cover and the shield plate.
  • the evaporator may further include a heating member disposed between the pot cover and the shield plate.
  • the heating member may surround the respective evaporation outlets.
  • a vacuum deposition apparatus includes: a chamber; a substrate-supporting unit disposed in the chamber and supporting a substrate a pot facing the substrate-supporting unit in the chamber and storing organic matter therein; a pot cover covering an opening of the pot; and a plurality of evaporation outlets spaced apart from each other to evaporate the organic matter evaporated from the pot.
  • the evaporation outlets may be different from each other in at least one of length and diameter.
  • the vacuum deposition apparatus may further include a shield plate disposed over the pot cover and preventing heat radiation, and a heating member for heating the evaporation outlets.
  • the evaporation outlets evaporating evaporated organic matter have pipe shapes including a penetrated center, and different lengths and diameters, thereby improving the uniformity of a thin film deposited on a substrate.
  • the lengths of the evaporation outlets corresponding to the edge of a substrate are increased or the diameters of the evaporation outlets are decreased to minimize the loss of organic matter evaporated from the evaporation outlets.
  • the shield plate is disposed over the pot cover of the evaporation source to prevent heat radiation from the evaporation source to a substrate, thereby protecting the substrate or a film deposited on the substrate from thermal damage.
  • the heating member is disposed around the evaporation outlets to prevent the uniformity of a thin film from being deteriorated by the clogging of the evaporation outlets.
  • FIG. 1 is a cross-sectional view of a vacuum deposition apparatus including an evaporator in accordance with an exemplary embodiment
  • FIG. 2 is an exploded perspective view of an evaporator in accordance with an exemplary embodiment
  • FIG. 3 is a cross-sectional view illustrating operation of a related art evaporator
  • FIG. 4 is a cross-sectional view illustrating operation of an evaporator in accordance with an exemplary embodiment
  • FIG. 5 is a cross-sectional view of a vacuum deposition apparatus including an evaporator in accordance with another exemplary embodiment
  • FIG. 6 is an exploded perspective view of an evaporator in accordance with another exemplary embodiment
  • FIG. 7 is a cross-sectional view of an evaporator in accordance with an exemplary embodiment.
  • FIG. 8 is an exploded perspective view of an evaporator in accordance with still another exemplary embodiment.
  • FIG. 1 is a cross-sectional view of a vacuum deposition apparatus including an evaporator 300 in accordance with an exemplary embodiment.
  • FIG. 2 is an exploded perspective view of the evaporator 300 in accordance with the current exemplary embodiment.
  • FIG. 3 is a cross-sectional view illustrating operation of a related art evaporator.
  • FIG. 4 is a cross-sectional view illustrating operation of the evaporator 300 in accordance with the current exemplary embodiment.
  • the vacuum deposition apparatus in accordance with the current embodiment includes a chamber 100, a substrate-supporting unit 200, and the evaporator 300 facing the substrate-supporting unit 200.
  • the substrate-supporting unit 200 is disposed in an inner upper portion of the chamber 100 and supports a substrate S.
  • the chamber 100 has a cylindrical or parallelepiped shape, and is provided with a predetermined inner space to treat the substrate S.
  • the shape of the chamber 100 may correspond to the shape of the substrate S, and is not limited to the cylindrical or parallelepiped shape.
  • a first sidewall of the chamber 100 is provided with a substrate opening 110 for loading and unloading the substrate S, and the substrate opening 110 may be also provided to a second sidewall of the chamber 100.
  • the second sidewall of the chamber 100 is provided with an exhausting part 120 for exhausting materials out of the chamber 100, and an exhausting member 130 such as a high vacuum pump is connected to the exhausting part 120.
  • the exhausting member 130 may be connected to a lower wall of the chamber 100.
  • the exhausting member 130 may simultaneously include a high vacuum pump and a low vacuum pump such that a low vacuum condition is formed in the chamber 100 and then a high vacuum condition is maintained in the chamber 100.
  • the chamber 100 may be formed in a single body, or may include a lower chamber having an open top portion and a chamber lid covering the open top portion.
  • the substrate-supporting unit 200 disposed in the inner upper portion of the chamber 100, supports and moves the substrate S loaded into the chamber 100.
  • the substrate-supporting unit 200 includes a support 210 supporting the substrate S on a lower surface thereof, and a driving part 220 moving the support 210.
  • the support 210 has the corresponding shape to the substrate S.
  • the support 210 may be circular to correspond to the substrate S, and when the substrate S is polygonal, the support 210 may be polygonal to correspond to the substrate S.
  • the support 210 may be further provided with a heating member (not shown) to improve a deposition efficiency for depositing a thin film on the substrate S during a deposition process, and thus a temperature required in the deposition process can be maintained.
  • the driving part 220 is connected to an upper portion of the support 210 and moves the support 210 supporting the substrate S.
  • the driving part 220 is provided with a driving member such as a motor 230 to provide a driving force to the driving part 220.
  • the driving part 220 can rotate the support 210 simultaneously with moving the support 210.
  • the evaporator 300 is disposed in an inner lower portion of the chamber 100 and evaporates organic matter in a solid or powder state stored in the evaporator 300 and provides the evaporated organic matter to a surface of the substrate S.
  • the evaporator 300 includes a pot 310, a pot cover 320 covering an upper portion of the pot 310, and a plurality of evaporation outlets 330 coupled to the pot cover 320.
  • the evaporation outlets 330 improve the uniformity of a thin film deposited on the substrate S.
  • the evaporator 300 will be described later in more detail.
  • a shutter 400 which may be disposed between the substrate-supporting unit 200 and the evaporator 300, controls the movement route of the evaporated organic matter.
  • An inner surface of the chamber 100 may be provided with a protrusion 140 to support the shutter 400, and the shutter 400 may be disposed on the protrusion 140 and fixed to the protrusion 140.
  • a thickness-measuring device (not shown) may be disposed in the chamber 100 to measure the amount of the organic matter evaporated by the evaporator 300.
  • the evaporator 300 includes the pot 310, the pot cover 320 covering the upper portion of the pot 310, and the evaporation outlets 330 passing through the pot cover 320.
  • the pot 310 is a hollow parallelepiped container having an open top portion, and organic matter in a solid or powder state is stored in the inner space of the pot 310.
  • the pot 310 may have one of a longitudinally extended parallelepiped shape, a polyhedron shape, and an oval shape.
  • the pot 310 may be further provided with a heating member such as a heater (not shown) to evaporate organic matter in a powder state stored in the pot 310.
  • the organic matter evaporated by the heating member is evaporated in a vapor state to the substrate S to form a uniform thin film on one surface of the substrate S.
  • the pot cover 320 covers an opening provided to the top portion or a side surface of the pot 310 to close the pot 310, and has the corresponding shape to the pot 310.
  • the pot cover 320 is provided with a plurality of through holes 322 that are spaced a predetermined distance from each other.
  • the through holes 322 may be arranged in at least one line in the longitudinal direction of the evaporator 300, or arranged in two dimensional format.
  • the evaporation outlets 330 which may have different diameters and lengths from each other, are coupled to the through holes 322 of the pot cover 320, respectively.
  • the evaporation outlets 330 may have cylindrical pipe shapes having predetermined diameters and lengths.
  • the evaporation outlets 330 may increase in length or may decrease in diameter from the center of the evaporator 300 toward the edge thereof. That is, the evaporation outlets 330 disposed in the edge of the evaporator 300 may be greater in length or less in diameter than the evaporation outlets 330 disposed in the center, so as to improve the linearity of organic vapor evaporated toward the edge of the substrate S.
  • the amounts of organic matter arriving at the substrate S are different in accordance with the evaporation outlets 330 through which the organic matter passes.
  • the distances between the evaporation outlets 330 are decreased from the center of the evaporator 300 toward the edge thereof to increase the densities of the evaporation outlets 330 toward the edge.
  • the diameters of the evaporation outlets 330 may range from approximately 1mm to approximately 20mm, and the lengths of the evaporation outlets 330 may range from approximately 1mm to approximately 100mm, to maximize the uniformity of a thin film.
  • the pot 310 and the pot cover 320 are discrete parts as described above, the pot 310 may be formed integrally with the pot cover 320.
  • the cross-section of the evaporation outlets 330 is circular, the cross-section may be oval or polygonal such as triangular and tetragonal.
  • the evaporation outlets 330 may be discrete parts to be coupled to the pot cover 320 and a shield plate 340 illustrated in FIG. 5, or formed integrally with the pot cover 320 or the shield plate 340.
  • the organic matter since organic matter is evaporated through holes having the same length and the same diameter, the organic matter has the same evaporation angle.
  • the amount of the organic matter deposited on the center of a substrate is greater than the amount of the organic matter deposited on the edge thereof, thereby deteriorating the uniformity of a thin film and increasing the loss of the organic matter.
  • the heat of an evaporation source is directly radiated to the substrate, thereby damaging the substrate or the film deposited on the substrate.
  • the evaporated organic matter in a solid or powder state stored in the pot 310 is heated and evaporated, the evaporated organic matter is uniformly evaporated in a vapor state through the evaporation outlets 330 to the substrate S. That is, referring to FIG. 4, since the center of the evaporator 300 is provided with the evaporation outlet 330 having a short length or a large diameter, the organic matter evaporated and evaporated from the center of the evaporator 300 are widely evaporated with a large angle.
  • the evaporation outlets 330 increase in length or decrease in diameter toward the edge, the organic matter evaporated from the evaporation outlets 330 decrease in evaporation angle toward the edge, so that the organic matter is evaporated more narrowly and the linearity of the organic matter is increased toward the edge.
  • the evaporation outlets 330 disposed on the most outside corresponding to the edge of the substrate S, have the largest length or the smallest diameter, the evaporated organic matter has the greatest linearity on the most outside.
  • the evaporator is configured to make the thickness of a thin film deposited on the whole of the substrate S uniform, and minimize the amount of organic matter evaporated away from the substrate S, thereby reducing the loss of the organic matter.
  • FIG. 5 is a cross-sectional view of a vacuum deposition apparatus including an evaporator301 in accordance with another exemplary embodiment.
  • FIG. 6 is an exploded perspective view of the evaporator 301 in accordance with the current embodiment.
  • the vacuum deposition apparatus in accordance with the current exemplary embodiment includes the chamber 100, the substrate-supporting unit 200, and the evaporator 301 facing the substrate-supporting unit 200.
  • the substrate-supporting unit 200 is disposed in the inner upper portion of the chamber 100 and supports the substrate S.
  • the evaporator 301 includes the pot 310, the pot cover 320 covering the upper portion of the pot 310, the shield plate 340 disposed over the pot cover 320, and the evaporation outlets 330 coupled to the pot cover 320 and the shield plate 340. That is, the evaporator 301 further includes the shield plate 340 over the pot cover 320, unlike the evaporator 300.
  • the shield plate 340 disposed over the pot cover 320, prevents heat generated in the pot 310 or the evaporation outlets 330 from radiating to the substrate S.
  • the outer surface or the inside of the shield plate 340 may be provided with a cooling member including a cooling water passage (not shown) to improve thermal insulation efficiency.
  • the shield plate 340 is provided with a plurality of through holes 342 spaced a predetermined distance from each other, and the positions of the through holes 342 may correspond to those of the through holes 322 provided to the pot cover 320.
  • the evaporation outlets 330 are coupled to the through holes 322 of the pot cover 320 and the through holes 342 of the shield plate 340.
  • the shield plate 340 may be in contact with the pot cover 320, or spaced apart from the pot cover 320.
  • the shield plate 340 may have the same shape as the pot cover 320.
  • the evaporation outlets 330 of the evaporator 301 improve the uniformity of a thin film deposited on the substrate S, and the shield plate 340 of the evaporator 301 prevents heat radiation from an evaporation source to the substrate S.
  • FIG. 7 is a cross-sectional view of an evaporator 302 in accordance with another exemplary embodiment.
  • the evaporator 302 includes the pot 310, the pot cover 320 covering the upper portion of the pot 310, the shield plate 340 disposed over the pot cover 320, the evaporation outlets 330 passing through the pot cover 320 and the shield plate 340, and a heating member 350 disposed around the evaporation outlets 330. That is, the evaporator 302 further includes the heating member 350 disposed around the evaporation outlets 330, unlike the evaporator 301.
  • the heating member 350 heats the evaporation outlets 330.
  • the heating member 350 may be disposed between the pot cover 320 and the shield plate 340, and surround the respective evaporation outlets 330.
  • the heating member 350 heats the evaporation outlets 330, thereby preventing the evaporation outlets 330 from being clogged. That is, when organic matter is continually evaporated through the evaporation outlets 330 to substrates, the evaporation outlets 330 may be clogged with the continually evaporated organic matter. Particularly, the evaporation outlets 330 having a long length or a small diameter in the edge of the evaporator 302 may be more frequently clogged.
  • the evaporation outlets 330 are heated such that the evaporation outlets 330 are at a predetermined temperature or more, the evaporation outlets 330 are prevented from being clogged with organic matter, and the organic matter attached to the inside of the evaporation outlets 330 are evaporated to prevent the clogging of the evaporation outlets 330.
  • the evaporation outlets 330 may be disposed on the outside of the pot 310 and the pot cover 320 may cover the pot 310 in a manner where the evaporation outlets 330 are toward the substrate S.
  • the straight pipe-shaped evaporation outlets 330 may be bent. That is, when the evaporation outlets 330 of the evaporator 300 have straight pipe shapes including penetrated upper and lower portions, the evaporator 300 deposits evaporated organic matter on the bottom surface of the substrate S with the top surface of the substrate S being supported. However, when the straight pipe-shaped evaporation outlets 330 are bent, the substrate S is disposed vertically, and then evaporated organic matter is evaporated to one surface of the substrate S to form a uniform thin film on the substrate S.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un évaporateur destiné à façonner un dispositif électroluminescent organique, ainsi qu’un appareil de dépôt sous vide comprenant ledit évaporateur. L’évaporateur comprend un bac renfermant de la matière organique, un couvercle de bac recouvrant une ouverture du bac, et des sorties d’évaporation espacées les unes par rapport aux autres et servant à faire s’évaporer la matière organique. L’évaporateur comprend en outre une plaque-écran disposée au-dessus du couvercle du bac et bloquant  le rayonnement thermique, ainsi qu’un élément chauffant empêchant l’encrassement des sorties d’évaporation entre le couvercle du bac et la plaque-écran. Les sorties d’évaporation, par lesquelles s’évapore de la matière organique, diffèrent les unes des autres par leur longueur afin d’améliorer l’uniformité d’un film mince déposé et d’empêcher la perte de matière organique. La plaque-écran, bloquant le rayonnement thermique vers un substrat, protège celui-ci ou un film mince placé sur le substrat de dégâts dus à la chaleur.
PCT/KR2009/002185 2008-04-29 2009-04-27 Évaporateur et appareil de dépôt sous vide muni de celui-ci WO2009134041A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020080039841A KR100994454B1 (ko) 2008-04-29 2008-04-29 증발 장치 및 이를 구비하는 진공 증착 장치
KR10-2008-0039841 2008-04-29
KR10-2009-0026559 2009-03-27
KR1020090026559A KR20100108086A (ko) 2009-03-27 2009-03-27 증발 장치 및 이를 구비하는 진공 증착 장치

Publications (2)

Publication Number Publication Date
WO2009134041A2 true WO2009134041A2 (fr) 2009-11-05
WO2009134041A3 WO2009134041A3 (fr) 2010-02-04

Family

ID=41255536

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002185 WO2009134041A2 (fr) 2008-04-29 2009-04-27 Évaporateur et appareil de dépôt sous vide muni de celui-ci

Country Status (2)

Country Link
TW (1) TWI408242B (fr)
WO (1) WO2009134041A2 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686765A (zh) * 2009-11-30 2012-09-19 维易科精密仪器国际贸易(上海)有限公司 直线淀积源
CN103866240A (zh) * 2012-12-18 2014-06-18 圆益Ips股份有限公司 薄膜沉积装置
FR3036710A1 (fr) * 2015-05-27 2016-12-02 China Triumph Int Eng Co Ltd Diaphragme a comportement d'emission thermique optimise
CN108237119A (zh) * 2018-01-02 2018-07-03 京东方科技集团股份有限公司 有机源蒸发孔清理设备、系统及其清理方法
US10366908B2 (en) 2014-03-28 2019-07-30 SCREEN Holdings Co., Ltd. Substrate processing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8555809B2 (en) * 2010-01-14 2013-10-15 Rohm And Haas Electronic Materials, Llc Method for constant concentration evaporation and a device using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691437A (en) * 1979-12-26 1981-07-24 Nippon Hoso Kyokai <Nhk> Preparation of metallized element
US6258170B1 (en) * 1997-09-11 2001-07-10 Applied Materials, Inc. Vaporization and deposition apparatus
US6596085B1 (en) * 2000-02-01 2003-07-22 Applied Materials, Inc. Methods and apparatus for improved vaporization of deposition material in a substrate processing system
JP4704605B2 (ja) * 2001-05-23 2011-06-15 淳二 城戸 連続蒸着装置、蒸着装置及び蒸着方法
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
KR20060060994A (ko) * 2004-12-01 2006-06-07 삼성에스디아이 주식회사 증착 소스 및 이를 구비한 증착 장치
DE102004063703A1 (de) * 2004-12-28 2006-07-06 Schott Ag Vakuumbeschichtungssystem
KR100635496B1 (ko) * 2005-02-25 2006-10-17 삼성에스디아이 주식회사 격벽을 구비하는 측면 분사형 선형 증발원 및 그 증발원을구비하는 증착장치
KR101196562B1 (ko) * 2005-07-15 2012-11-01 김명희 유기물 소모량 향상용 유기소자 양산 제작용 증발원
KR100712217B1 (ko) * 2005-09-30 2007-04-27 삼성에스디아이 주식회사 증발원 및 이를 이용한 진공증착기
KR20070097633A (ko) * 2006-03-28 2007-10-05 문대규 증착 장치
KR100784953B1 (ko) * 2006-05-23 2007-12-11 세메스 주식회사 다수의 도가니를 이용한 유기발광소자 박막 제작을 위한선형증발원

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686765A (zh) * 2009-11-30 2012-09-19 维易科精密仪器国际贸易(上海)有限公司 直线淀积源
CN102712993A (zh) * 2009-11-30 2012-10-03 维易科精密仪器国际贸易(上海)有限公司 直线淀积源
EP2507403A1 (fr) * 2009-11-30 2012-10-10 Veeco Instruments Inc. Source de déposition linéaire
EP2507403A4 (fr) * 2009-11-30 2013-10-23 Veeco Instr Inc Source de déposition linéaire
CN103866240A (zh) * 2012-12-18 2014-06-18 圆益Ips股份有限公司 薄膜沉积装置
CN103866240B (zh) * 2012-12-18 2018-05-29 圆益Ips股份有限公司 薄膜沉积装置
US10366908B2 (en) 2014-03-28 2019-07-30 SCREEN Holdings Co., Ltd. Substrate processing apparatus
FR3036710A1 (fr) * 2015-05-27 2016-12-02 China Triumph Int Eng Co Ltd Diaphragme a comportement d'emission thermique optimise
CN108237119A (zh) * 2018-01-02 2018-07-03 京东方科技集团股份有限公司 有机源蒸发孔清理设备、系统及其清理方法

Also Published As

Publication number Publication date
TWI408242B (zh) 2013-09-11
WO2009134041A3 (fr) 2010-02-04
TW200948993A (en) 2009-12-01

Similar Documents

Publication Publication Date Title
WO2009134041A2 (fr) Évaporateur et appareil de dépôt sous vide muni de celui-ci
US7905961B2 (en) Linear type deposition source
US8025735B2 (en) Multiple vacuum evaporation coating device and method for controlling the same
JP4440837B2 (ja) 蒸発源及びこれを採用した蒸着装置
EP1560467B1 (fr) Source pour dépôt thermique physique en phase vapeur de couches organiques électroluminescentes
KR100703427B1 (ko) 증발원 및 이를 채용한 증착장치
WO2010056057A2 (fr) Dispositif de distribution de materiau de depôt et appareil de traitement de substrat equipe de ce dispositif
TWI415191B (zh) 基板處理設備
WO2006046998A1 (fr) Source de depot par evaporation sous vide pourvue de plusieurs ouvertures
JP2017509796A5 (fr)
US8815016B2 (en) Heating unit and substrate processing apparatus having the same
KR20020095096A (ko) 에어리얼 기판 코팅 장치
WO2010110615A2 (fr) Unité d&#39;alimentation de source, procédé d&#39;alimentation de la source et appareil de dépôt de couche mince
JP4916385B2 (ja) 有機発光素子の製造方法及び蒸着装置
JP2009299115A (ja) 蒸着装置
KR20100108086A (ko) 증발 장치 및 이를 구비하는 진공 증착 장치
KR100730172B1 (ko) 유기박막 증착장치
JP2001234335A (ja) 蒸着装置
KR102616353B1 (ko) 증착 장치
KR101173603B1 (ko) 유기 전계 발광층의 증착 장치
US20100313811A1 (en) Evaporation source and film-forming device
CN219731042U (zh) 一种真空蒸镀设备
KR101413610B1 (ko) 대면적 균일 박막 형성용 진공 증발원
WO2016028012A1 (fr) Dispositif d&#39;apport de précurseur pour la formation d&#39;un film mince et dispositif de formation de film mince le comprenant
WO2015182977A1 (fr) Source de dépôt physique en phase vapeur activé par plasma et appareil de dépôt utilisant cette dernière

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09738947

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09738947

Country of ref document: EP

Kind code of ref document: A2