WO2009119260A1 - 撮像モジュール - Google Patents
撮像モジュール Download PDFInfo
- Publication number
- WO2009119260A1 WO2009119260A1 PCT/JP2009/053971 JP2009053971W WO2009119260A1 WO 2009119260 A1 WO2009119260 A1 WO 2009119260A1 JP 2009053971 W JP2009053971 W JP 2009053971W WO 2009119260 A1 WO2009119260 A1 WO 2009119260A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- imaging
- holder
- holding plate
- image pickup
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 208
- 238000003384 imaging method Methods 0.000 claims description 152
- 239000000463 material Substances 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 23
- 239000011521 glass Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000004744 fabric Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Definitions
- the present invention relates to an imaging module using an imaging element such as a semiconductor image sensor.
- a semiconductor image sensor such as a CCD image sensor or a CMOS image sensor is used as an imaging device that converts subject light into an electrical signal, and an imaging substrate on which the imaging device is mounted;
- An imaging module is disclosed that includes a holder provided with a lens support tube portion that supports a lens that collects subject light.
- the imaging substrate and the holder are fixed by screwing. Specifically, a through hole through which the screw passes through the imaging board and a screw fixing hole are provided in the holder, and the screw is inserted into the through hole of the imaging board from the opposite side to the subject, and then the holder is screwed.
- the image pickup board is fixed to the holder by being inserted into the hole and tightening the image pickup board with the holder and the screw head.
- a printed circuit board using a resin material such as an epoxy resin that can withstand screw tightening is used as the imaging substrate.
- the distance between the lens and the imaging element is likely to change during long-term use, and it is difficult to obtain a high-accuracy image because the subject light is out of focus. It was.
- the present invention has been devised to solve the above-described problems in the prior art, and its purpose is to obtain a highly accurate image by reducing the deformation of the imaging substrate on which the imaging device is mounted.
- An object of the present invention is to provide an imaging module that enables the above.
- An imaging module includes a rectangular imaging board on which an imaging element that converts subject light into an electrical signal is mounted, and a rectangular plate, and one main surface is mounted with the imaging element of the imaging board.
- a substrate holding plate provided with holder fixing portions positioned on the outside in the longitudinal direction with respect to the four substrate fixing portions, and an object on the image sensor.
- the substrate holding plate material It is characterized in that the plate fixing unit of the holder fixing portion at a position opposite to the da fixing portion for fixing each of which includes a holder provided.
- the imaging module of the present invention is characterized in that, in the above-described configuration, the opening opens to a region between the substrate fixing portions facing in the longitudinal direction of the imaging substrate.
- the imaging module of the present invention is characterized in that, in the above configuration, the imaging element is housed in a space formed by the imaging substrate, the opening of the substrate holding plate, and the holder. To do.
- the substrate fixing portions for fixing the imaging substrate are provided at positions facing the four corners of the imaging substrate, respectively, and the openings surrounded by the four substrate fixing portions are opened. Therefore, when fixing the imaging substrate to the substrate holding plate material, stress is applied to each substrate fixing portion so that the imaging substrate extends and widens. Since the portion is provided, the substrate holding plate is extended in accordance with the extension of the imaging substrate, so that the reaction force that the imaging substrate receives from the substrate fixing portion is reduced and the compressive stress is reduced. And the holder fixing
- plate material is located in the outer side of a longitudinal direction with respect to four board
- the substrate holding plate material extends and spreads so as to relieve the residual stress accompanying the extension of the imaging substrate, so that the compressive stress remaining on the imaging substrate is reduced. It has become. That is, according to the imaging module of the present invention, since the compressive stress remaining on the imaging substrate is small, even if the holder is thermally expanded due to a change in ambient temperature, the deformation of the imaging substrate on which the imaging element is mounted is reduced. Since the change in the distance between the lens and the image sensor and the angle between the direction in which the lens condenses and the image sensor is reduced, high-accuracy images can be obtained even in long-term use.
- the imaging module of the present invention when the opening is open to the region between the substrate fixing portions opposed to the longitudinal direction of the imaging substrate, the substrate holding plate is more easily extended. Residual compressive stress is reduced, and more accurate images can be obtained in long-term use.
- the imaging module of the present invention when the imaging device is housed in a space formed by the imaging substrate, the opening of the substrate holding plate and the holder, the protective member for protecting the imaging device. Since it is not necessary to separately prepare the image pickup module, the image pickup module can be reduced in size.
- FIG. 2 is a sectional view taken along line AA in FIG. 1.
- FIG. 2 is a perspective plan view of the camera module of FIG. 1 viewed from the subject side with the holder removed.
- the imaging module of the present invention will be described in detail with reference to the accompanying drawings.
- the side opposite to the subject side of the imaging module is referred to as the back side.
- FIG. 1 is an external perspective view of a camera module as an example of an embodiment of an imaging module according to the present invention as viewed from the subject side
- FIG. 2 is an exploded perspective view of the camera module shown in FIG. 1
- FIG. 1 is a cross-sectional view taken along line AA in FIG.
- the camera module 10 shown in these drawings includes a lens holding cylinder portion 3, a holder 4, a substrate holding plate member 5, an imaging substrate 6 and the like as a basic configuration.
- Such a camera module 10 is, for example, a camera module 10 used for in-vehicle use, and has a function of imaging a white line on a road or imaging a blind spot of a driver who drives a vehicle, and controls driving of an automobile.
- the operation is controlled by an ECU (Electronic Control Unit) (not shown).
- the electrical signal output from the camera module 10 is converted into an image signal by the ECU and displayed on a display (not shown) installed in front of the driver's seat, for example.
- the imaging substrate 2 is a substrate on which an imaging element 8 that converts subject light into an electrical signal is mounted on one main surface (main surface on the subject side).
- a print formed by adding a glass filler to an epoxy resin It consists of a wiring board or a printed wiring board formed by impregnating a glass cloth with an epoxy resin. Below, an example of the manufacturing method of a printed wiring board is shown.
- a glass cloth is produced by weaving a glass fiber made of alkali-free glass, quartz glass or the like with a binder made of a resin such as a sizing agent or a sizing agent for protecting the glass fiber. .
- the glass cloth from which the binder has been removed is dipped in a solution containing a silane coupling agent and dried to perform a coupling treatment to ensure wettability and adhesion with the resin on the surface of the glass cloth. Apply.
- a glass cloth that has been subjected to a coupling treatment is impregnated with a thermosetting resin to produce a prepreg that becomes an insulating layer.
- a copper foil is deposited on the surface of the prepreg serving as the insulating layer and etched to form a wiring conductor having a predetermined pattern.
- thermosetting resin interposed therebetween to thermally cure the thermosetting resin
- insulating layers and wiring conductors are alternately provided.
- a laminated substrate is formed.
- the printed wiring board is manufactured by depositing copper plating on the inner surface of the through hole to form a through-hole conductor that electrically connects the wiring conductors located above and below.
- the image pickup device 7 mounted on the image pickup substrate 6 is obtained by housing a semiconductor image sensor device such as a CCD image sensor or a CMOS image sensor in a semiconductor package.
- the semiconductor package is a highly airtight package member such as a ceramic wiring substrate mainly composed of alumina, and the semiconductor image sensor element is accommodated in a cavity (not shown) formed on the subject side. This cavity is sealed with a light-transmitting lid (not shown) made of glass or the like.
- a plurality of terminals extend from the side surface or the lower surface of the semiconductor package, and the imaging element 7 is electrically connected to the imaging substrate 6 by a bonding material such as solder through the plurality of terminals. And a fixed configuration.
- the amount of glass cloth or glass filler used for the imaging substrate 6 is such that the thermal expansion coefficient of the semiconductor package and the thermal expansion coefficient of the imaging substrate 6 are equal to reduce the thermal stress generated between them. It is preferable to set to.
- a wiring conductor (not shown), which is electrically connected to a terminal of a semiconductor package or a terminal of another component to be mounted, or these terminals are fixed, and A ground wiring (not shown) for grounding is formed.
- Such wiring conductors and ground wirings are made of a metal such as copper or gold, and are formed by a plating method, a method in which a metal foil previously formed in a wiring pattern shape is bonded, or a metal foil is covered on the entire surface. By using, for example, a method in which unnecessary portions are removed by etching from the attached substrate, the surface of the printed circuit board constituting the imaging substrate 6 is formed.
- Such an image pickup substrate 6 is prepared, for example, by preparing a commercially available copper-clad substrate having copper foils deposited on the entire front and back surfaces, cutting the substrate into a desired size, and using the copper foil deposited on the surface such as dilute hydrochloric acid. It is manufactured by etching a desired wiring pattern with an acidic solution. If necessary, a through hole is formed using a laser or a drill, and the through hole is filled with a metal paste to embed the through conductor, thereby electrically connecting the wiring patterns on the front and back of the board. Is possible.
- an IC 8 for processing an electric signal from the image pickup device 7 or the image pickup substrate Components such as a connector 9 for connecting a wiring cable (not shown) for electrically connecting the wiring conductor 6 and an ECU (not shown) are mounted.
- the lens unit 1 that collects subject light on the image sensor 7 normally has a first lens 1a having a convex shape on the subject side in order to collect the subject light at a wide angle, and light that has passed through the first lens 1a.
- a first lens 1a having a convex shape on the subject side in order to collect the subject light at a wide angle, and light that has passed through the first lens 1a.
- the lens unit 1 includes the above-described three lenses, for example, the first lens 1a, the second lens 1b, and the third lens 1c are overlapped on the optical axis in this order from the subject side toward the imaging element 7. Placed in.
- the lens unit 1 is fixed by being pressed from the subject side to a step provided on the inner wall of the inner space of the lens barrel 2a by a retainer 2b as a pressing jig.
- the retainer 2b and the lens barrel 2a are, for example, processed using a mold while heating an anodized aluminum plate.
- the lens barrel 2 a has a screw groove on the outer wall, and the screw groove is fitted with a screw groove provided on the inner wall of the lens support tube portion 3. The position on the optical axis can be freely moved.
- the lens unit 1 is indirectly supported inside the lens supporting cylinder 3 via the lens barrel 2a.
- the holder 4 is provided integrally with the lens supporting tube 3 on the back side of the lens supporting tube 3.
- the holder 4 holds the imaging substrate 6 via a substrate holding plate 5 to be described later.
- the aluminum melted in a mold produced in accordance with a shape provided integrally with the lens supporting cylinder 3.
- a metal material such as stainless steel can be used in addition to aluminum.
- FIG. 4 is a perspective view of the camera module 10 of FIG. 1 viewed from the subject side with the holder 4 removed.
- the substrate holding plate 5 is made of a rectangular plate, and one main surface is arranged to face the main surface of the image pickup substrate 6 on the side where the image pickup device 7 is mounted.
- the board fixing portions 5b for fixing the imaging board 6 are provided at positions facing the four corners of the imaging board 6, respectively.
- through holes are provided at four corners of the imaging substrate 6, and screw fixing holes are provided in each of the substrate fixing portions 5 b of the substrate holding plate 5.
- the plate 5 is fixed by screwing with screws 11.
- screws 11 are inserted into the through-holes at the four corners of the imaging substrate 6 from the back side, and subsequently inserted into the screw fixing holes of the substrate fixing portion 5b of the substrate holding plate 5 to hold the substrate.
- the imaging substrate 6 is fixed to the substrate holding plate 5 by clamping the imaging substrate 6 between the plate material 5 and the head of the screw 11.
- the substrate holding plate 5 can be produced as a casting using a metal material such as aluminum, for example, in the same manner as the holder 4.
- the screw 11 is preferably one that can withstand the stress received during screw tightening and that does not easily generate rust and the like.
- a metal material such as stainless steel is used as the material.
- the substrate holding plate 5 has an opening 5a in which an area M (shown by a hatched area from the upper right to the lower left in FIG. 4) surrounded by the four substrate fixing portions 5b is opened. Is provided.
- the imaging element 7 and the IC 8 are arranged in a region M surrounded by the four substrate fixing portions 5 b.
- the substrate holding plate 5 is provided with holder fixing portions 5c positioned on the outer sides in the longitudinal direction with respect to the four substrate fixing portions 5b.
- the holder 4 is disposed so as to face the other main surface of the substrate holding plate 5 and fixes the holder fixing portions 5c at positions facing the holder fixing portions 5c of the substrate holding plate 5 respectively.
- a fixing portion 4a is provided.
- through holes are provided in the holder fixing portions 5 c of the substrate holding plate 5, and screw fixing holes are provided in the plate fixing portions 4 a of the holder 4.
- the holder 4 is fixed by screwing with screws 12. Specifically, the screws 12 are inserted into the through holes of the holder fixing portion 5c of the substrate holding plate material 5 from the back side, and subsequently inserted into the screw fixing holes of the plate material fixing portion 4a of the holder 4, and the screws 12 are inserted.
- the substrate holding plate 5 is fixed to the holder 4 by clamping the substrate holding plate 5 between the head and the holder 4.
- the imaging board 6 is fixed to the main surface of the board holding plate 5 on the side where the imaging element 7 is mounted using screws 11.
- the other main surface of the substrate holding plate 5 can be brought into contact with and fixed to the main surface on the back side of the holder 4 using screws 12.
- the lens unit 1 and the image sensor 7 are aligned when the substrate holding plate 5 is fixed to the holder 4. Specifically, first, when the screw 12 is inserted into the through hole of the holder fixing portion 5c of the substrate holding plate material 5 and is inserted into the screw fixing hole of the plate material fixing portion 4a of the holder 4, the screw 12 is temporarily fixed. A lens barrel 2 a that supports the lens unit 1 is inserted into the tube portion 3. Next, when the main surface on the subject side of the substrate holding plate 5 is brought into contact with and fixed to the main surface on the back side of the holder 4, a subject for image adjustment is arranged on the subject side and the connector 9 is used for adjustment.
- a wiring cable is connected, and this adjustment wiring cable is connected to the image analysis apparatus, and while confirming an electric signal obtained by the imaging device 7, the holder 4 is moved with respect to the imaging device 7 to move the lens unit 1 Adjust the position of. Then, after tightening the screw 12, the lens barrel 2 a is moved with respect to the image sensor 7 to adjust the distance from the lens unit 1. Note that if the inner diameter of the through hole of the holder fixing portion 5c of the substrate holding plate 5 is set larger in view of the positional deviation when the image pickup device 7 is mounted, the width of the alignment is widened and the alignment is easy. Become. Further, after the holder 4, the board holding plate 5 and the imaging board 6 are connected using such a method, the connection between the adjustment wiring cable and the connector 9 is released.
- substrate fixing portions 5b for fixing the imaging substrate 6 are provided at positions facing the four corners of the imaging substrate 6, respectively, and regions M surrounded by the four substrate fixing portions 5b are opened. Since the substrate holding plate 5 provided with the opening 5a is used, when the imaging substrate 6 is fixed to the substrate holding plate 5, stress due to screw tightening is applied in the vicinity of each substrate fixing portion 5b. If the image pickup substrate 6 extends and widens, the substrate holding plate 5 extends in accordance with the extension of the image pickup substrate 6 because the opening 5a is provided. The reaction force received from 5b is reduced and the compressive stress is reduced.
- the cross-sectional areas of the planes perpendicular to the longitudinal direction of the regions M between the four corners facing the longitudinal direction of the imaging substrate 6 in the substrate holding plate 5 and the imaging substrate 6 are respectively X [m 2 ] (substrate holding plate 5), Y [m 2 ] (cross-sectional area of the imaging substrate 6), and when Young's modulus is A [Pa], B [Pa], when X ⁇ A ⁇ Y ⁇ B is satisfied, the imaging substrate Since the rigidity of the substrate holding plate 5 is weak with respect to the elongation in the longitudinal direction of the substrate 6, the substrate holding plate 5 extends in the longitudinal direction of the imaging substrate 6. Therefore, the compressive stress remaining on the imaging substrate 6 is effectively reduced. can do.
- fixed part 5c which fixes the holder 4 provided integrally in the lens support cylinder part 3 provided in the board
- plate material 5 is the outer side of a longitudinal direction with respect to four board
- the imaging substrate 6 on which the imaging element 7 is mounted even if the holder 4 is thermally expanded due to a change in ambient temperature or the like. And the change in the distance between the lens unit 1 and the image sensor 7 and the angle between the direction in which the lens unit 1 condenses and the image sensor 7 are reduced, so that a highly accurate image can be acquired. .
- a washer (not shown) is passed through the screw 11, and the head of the screw 11 is attached. It is preferable to fasten the screw 11 so as to contact the imaging substrate 6 through a washer.
- the area to which the load applied to the imaging board 6 caused by the fastening of the screw 11 is increased, Since the stress due to screw tightening is reduced, the force with which the imaging substrate 6 extends and spreads is reduced, and the stress remaining on the imaging substrate 6 can be further reduced.
- the opening 5a opens to the region S between the substrate fixing portions 5b opposed to the longitudinal direction of the imaging substrate 6, the substrate holding plate 5 further extends. Since it becomes easy, the compressive stress which remains on the imaging board
- the opening 5a opens to a region O between the substrate fixing portions 5b opposed to each other in the direction perpendicular to the longitudinal direction of the imaging substrate 6 shown in FIG. Although the effect of reducing the deformation of the imaging substrate 6 is not greatly improved, the weight of the substrate holding plate material 5 is thereby reduced.
- the image pickup device 7 is housed in a space formed by the image pickup substrate 6, the opening 5 a of the substrate holding plate 5 and the holder 4. Since a protective member for protecting the camera does not need to be prepared separately, the camera module 10 can be downsized.
- the thickness of the substrate holding plate material 5 may be made thicker than the thickest components such as the imaging element 7 and the IC 8 mounted on the imaging substrate 6.
- the main surface on the subject side of the image pickup substrate 6 to which the image pickup device 7 and the IC 8 are attached is previously provided with a recess so as to conform to the shape of the electronic component having a relatively large thickness other than the image pickup device 7 and the IC8. It may be provided.
- the image pickup substrate 6 is pushed into the main surface on the back side of the substrate holding plate 5 while preventing electronic components such as the image pickup element 7 and the IC 8 from interfering with the main surface on the back side of the substrate holding plate 5.
- the camera module 10 can be downsized because the camera module 10 can be brought into contact with each other.
- the contact portion between the image pickup substrate 6 and the substrate holding plate material 5 and the contact portion between the substrate holding plate material 5 and the holder 4 are filled with an adhesive, these members are simply brought into contact with each other. Compared with the case where the image sensor 7 is simply placed, the airtightness in the space in which the image sensor 7 is accommodated can be increased, and the reliability of the camera module 10 can be improved.
- filling the adhesive in the contact portion between the imaging substrate 6 and the substrate holding plate 5 means that there is no gap between the contact surface of the imaging substrate 6 and the contact surface of the substrate holding plate 5 via the adhesive. It means to be glued.
- electrode pads (not shown) connected to the ground wiring are provided around the openings on the back side of the through holes at the four corners of the imaging substrate 6, and this electrode pad is provided. If the heads of the screws 11 are in contact with each other, the holder 4 and the substrate holding plate 5 are made of a metal material, so that the ground wiring of the imaging substrate 6 is electrically connected to the substrate holding plate 5 via the screws 11. And further electrically connected to the holder 4 via the screw 12, so that the component group mounted on the surface of the imaging substrate 6 on which the image sensor 7 is mounted is from the subject side. Therefore, it is possible to acquire a highly accurate image.
- the lens unit 1 is composed of three lenses in the lens unit 1 has been described as an example.
- the lens unit 1 may be composed of one lens.
- the case where the lens unit 1 consists of two lenses may be used, and the present invention can be applied to the case where the lens unit 1 is composed of four or more lenses.
- the imaging substrate 6 does not need to be completely straight with respect to the short side, and may be provided with an extending portion that extends outward in the longitudinal direction. An effect similar to that of the camera module 10 can be obtained.
- the following imaging module of the present invention was produced.
- a rectangular imaging substrate 6 made of a glass cloth base epoxy resin having through holes at four corners, 20 mm in length, 40 mm in width, and 1.6 mm in thickness is prepared on the main surface on the front side.
- the image sensor 7 and the IC 8 were mounted, and the connector 9 was mounted on the main surface on the back side.
- a rectangular substrate holding plate 5 made of anodized aluminum having a length of 20 mm, a width of 55 mm, and a thickness of 2.5 mm is provided for each of the four substrate fixing portions 5b and the four holder fixing portions 5c.
- the through-holes were processed and processed so as to provide openings 5a in which the regions M surrounded by the four substrate fixing portions 5b were opened.
- one main surface of the substrate holding plate member 5 is brought into contact with the imaging substrate 6 so that the imaging element 7 and the IC 8 are positioned in the opening 5a, and each of the through holes at the four corners of the imaging substrate 6 is provided.
- Screws 11 made of stainless steel are inserted from the back side, and the screws 11 are inserted into the through holes of the four substrate fixing portions 5b and tightened to fix the imaging substrate 6 to the substrate holding plate 5. Fixed to.
- a rectangular holder 4 was prepared by processing through four plate material fixing portions 4a so as to provide through holes.
- a lens barrel 2a having a thread groove formed on the outer periphery with a diameter of 13 mm is prepared, and a lens unit 1 composed of three lens groups is provided on the inner wall of the inner space of the lens barrel 2a from the subject side by a retainer 2b.
- the lens barrel 2a was inserted into and supported by the lens support cylinder portion 3 so that the screw grooves were fitted to each other.
- a camera module 10 as an imaging module of the present invention was produced.
- the imaging module of the present invention the openings surrounded by the four substrate fixing portions facing the four corners of the imaging substrate are provided, and the four openings are provided. Since the board holding plate is provided with a holder fixing part located on the outside in the longitudinal direction with respect to the board fixing part, it becomes difficult to generate compressive stress remaining on the imaging board, and it is used for a long time It was also confirmed that the image pickup module was able to acquire a highly accurate image.
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
1a・・・第1レンズ
1b・・・第2レンズ
1c・・・第3レンズ
2a・・・鏡筒
2b・・・リテーナ
3・・・レンズ支持用筒部
4・・・ホルダ
4a・・・板材固定部
5・・・基板保持用板材
5a・・・開口部
5b・・・基板固定部
5c・・・ホルダ固定部
6・・・撮像基板
7・・・撮像素子
8・・・IC
9・・・コネクタ
10・・・カメラモジュール(撮像モジュール)
11,12・・・ネジ
Claims (5)
- 被写体光を電気信号に変換する撮像素子が搭載された長方形状の撮像基板と、
長方形状の板材からなり、一方の主面が前記撮像基板の前記撮像素子が搭載されている側の主面に対向して配置され、前記撮像基板の4隅に対向する位置に前記撮像基板を固定する基板固定部がそれぞれ設けられ、4箇所の前記基板固定部に囲まれた領域が開口している開口部が設けられているとともに、4箇所の前記基板固定部に対してそれぞれ長手方向の外側に位置するホルダ固定部が設けられた基板保持用板材と、
前記撮像素子に被写体光を集光するレンズを内部で支持するレンズ支持用筒部と、
該レンズ支持用筒部に一体的に設けられた、前記基板保持用板材の他方の主面に対向して配置され、前記基板保持用板材の前記ホルダ固定部と対向する位置に前記ホルダ固定部をそれぞれ固定する板材固定部が設けられたホルダと
を具備することを特徴とする撮像モジュール。 - 前記開口部が、前記撮像基板の長手方向に対向する前記基板固定部間の領域まで開口していることを特徴とする請求項1に記載の撮像モジュール。
- 前記撮像素子が、前記撮像基板と前記基板保持用板材の前記開口部と前記ホルダとにより形成される空間内に収納されていることを特徴とする請求項1に記載の撮像モジュール。
- 前記撮像基板と前記基板保持用板材との当接部および前記基板保持用板材と前記ホルダとの当接部に、接着剤が充填されていることを特徴とする請求項1に記載の撮像モジュール。
- 前記撮像基板は4隅に貫通孔を有しており、前記撮像素子が搭載されていない側の主面の前記貫通孔の開口部周辺に電極パッドを有する前記撮像基板および前記基板保持用板材は、前記貫通孔を貫通するネジと前記基板固定部とによって固定され、前記ネジの一部が前記電極パッドに接触していることを特徴とする請求項1に記載の撮像モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010505486A JP5020375B2 (ja) | 2008-03-26 | 2009-03-03 | 撮像モジュール |
CN200980110539.XA CN101981499B (zh) | 2008-03-26 | 2009-03-03 | 摄像模块 |
EP09724633.4A EP2267525B1 (en) | 2008-03-26 | 2009-03-03 | Image module |
US12/934,260 US8259223B2 (en) | 2008-03-26 | 2009-03-03 | Imaging module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008080818 | 2008-03-26 | ||
JP2008-080818 | 2008-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009119260A1 true WO2009119260A1 (ja) | 2009-10-01 |
Family
ID=41113466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/053971 WO2009119260A1 (ja) | 2008-03-26 | 2009-03-03 | 撮像モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US8259223B2 (ja) |
EP (1) | EP2267525B1 (ja) |
JP (1) | JP5020375B2 (ja) |
CN (1) | CN101981499B (ja) |
WO (1) | WO2009119260A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016047350A1 (ja) * | 2014-09-25 | 2016-03-31 | 日本電産コパル株式会社 | 撮像装置、光学機器、電子機器、車両および撮像装置の製造方法 |
JP2022511552A (ja) * | 2018-12-21 | 2022-01-31 | ウェイモ エルエルシー | 自動運転車両カメラのセンサクランプ設計 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100013984A1 (en) * | 2008-07-16 | 2010-01-21 | Honeywell International Inc. | Noncondensing security camera housing window assembly |
KR20110135757A (ko) * | 2010-06-11 | 2011-12-19 | 삼성전자주식회사 | 이미지 센서 칩 및 이를 포함하는 카메라 모듈 |
TWI468766B (zh) * | 2010-12-10 | 2015-01-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
JP6459961B2 (ja) * | 2013-03-15 | 2019-01-30 | 株式会社ニコン | 受光装置 |
USD737363S1 (en) * | 2014-02-26 | 2015-08-25 | Robert Russell | Smartphone lens mount |
JP1527052S (ja) * | 2014-05-15 | 2018-06-11 | ||
CN104994259A (zh) * | 2015-06-26 | 2015-10-21 | 宁波舜宇光电信息有限公司 | 基于金属粉末成型的摄像模组支架及其制造方法和应用 |
WO2016206595A1 (zh) * | 2015-06-26 | 2016-12-29 | 宁波舜宇光电信息有限公司 | 基于金属粉末成型的摄像模组支架及其制造方法和应用 |
US9769361B2 (en) * | 2015-08-31 | 2017-09-19 | Adlink Technology Inc. | Assembly structure for industrial cameras |
ES2953886T3 (es) * | 2016-06-30 | 2023-11-16 | Braun Gmbh | Dispositivo de depilación que mide la fuerza de contacto y que comprende una unidad de retroalimentación |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004272196A (ja) | 2003-08-11 | 2004-09-30 | Kyocera Corp | 撮像装置 |
JP2005094637A (ja) * | 2003-09-19 | 2005-04-07 | Fuji Photo Film Co Ltd | 撮像モジュール及び撮像モジュールを用いた携帯電話 |
JP2007116510A (ja) * | 2005-10-21 | 2007-05-10 | Kyocera Corp | カメラモジュール |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5221964A (en) * | 1991-08-05 | 1993-06-22 | Dalsa Inc | Electronically expandable modular ccd camera |
US5731834A (en) * | 1995-06-07 | 1998-03-24 | Eastman Kodak Company | Replaceable CCD array and method of assembly |
US6351288B1 (en) * | 1997-06-27 | 2002-02-26 | Eastman Kodak Company | Sensor tilt control for a digital camera |
JP4167564B2 (ja) * | 2003-07-29 | 2008-10-15 | Hoya株式会社 | カメラ |
DE102004010957A1 (de) * | 2004-03-03 | 2005-09-22 | Robert Bosch Gmbh | Kamera |
US7391466B2 (en) * | 2004-05-04 | 2008-06-24 | Micron Technology, Inc. | Camera module with dust trap |
JP5252770B2 (ja) * | 2004-06-10 | 2013-07-31 | 三星電子株式会社 | イメージセンサーパッケージの組立方法 |
DE102005028144B4 (de) * | 2005-06-17 | 2022-01-13 | Robert Bosch Gmbh | Kameraanordnung mit Bildsensorabdichtung gegen Umwelteinflüsse |
TWI268627B (en) * | 2005-07-27 | 2006-12-11 | Impac Technology Co Ltd | Image sensing module and method for packing the same |
JP5055756B2 (ja) * | 2005-09-21 | 2012-10-24 | 東京エレクトロン株式会社 | 熱処理装置及び記憶媒体 |
JP2007329714A (ja) * | 2006-06-08 | 2007-12-20 | Funai Electric Co Ltd | 複眼撮像装置 |
USD605680S1 (en) * | 2008-02-18 | 2009-12-08 | Kyocera Corporation | Camera module |
CN101620304A (zh) * | 2008-06-30 | 2010-01-06 | 鸿富锦精密工业(深圳)有限公司 | 影像撷取模组 |
JP4560121B2 (ja) * | 2008-12-17 | 2010-10-13 | 株式会社東芝 | センサー固定装置およびカメラモジュール |
CN102346351A (zh) * | 2010-08-04 | 2012-02-08 | 鸿富锦精密工业(深圳)有限公司 | 后焦调整结构 |
-
2009
- 2009-03-03 CN CN200980110539.XA patent/CN101981499B/zh not_active Expired - Fee Related
- 2009-03-03 EP EP09724633.4A patent/EP2267525B1/en not_active Not-in-force
- 2009-03-03 US US12/934,260 patent/US8259223B2/en not_active Expired - Fee Related
- 2009-03-03 WO PCT/JP2009/053971 patent/WO2009119260A1/ja active Application Filing
- 2009-03-03 JP JP2010505486A patent/JP5020375B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004272196A (ja) | 2003-08-11 | 2004-09-30 | Kyocera Corp | 撮像装置 |
JP2005094637A (ja) * | 2003-09-19 | 2005-04-07 | Fuji Photo Film Co Ltd | 撮像モジュール及び撮像モジュールを用いた携帯電話 |
JP2007116510A (ja) * | 2005-10-21 | 2007-05-10 | Kyocera Corp | カメラモジュール |
Non-Patent Citations (1)
Title |
---|
See also references of EP2267525A4 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016047350A1 (ja) * | 2014-09-25 | 2016-03-31 | 日本電産コパル株式会社 | 撮像装置、光学機器、電子機器、車両および撮像装置の製造方法 |
JPWO2016047350A1 (ja) * | 2014-09-25 | 2017-07-06 | 日本電産コパル株式会社 | 撮像装置、光学機器、電子機器、車両および撮像装置の製造方法 |
US10288985B2 (en) | 2014-09-25 | 2019-05-14 | Nidec Copal Corporation | Imaging device, optical device, electronic device, vehicle, and production method for imaging device |
JP2022511552A (ja) * | 2018-12-21 | 2022-01-31 | ウェイモ エルエルシー | 自動運転車両カメラのセンサクランプ設計 |
Also Published As
Publication number | Publication date |
---|---|
CN101981499A (zh) | 2011-02-23 |
JPWO2009119260A1 (ja) | 2011-07-21 |
US8259223B2 (en) | 2012-09-04 |
CN101981499B (zh) | 2014-06-18 |
EP2267525A1 (en) | 2010-12-29 |
EP2267525B1 (en) | 2014-05-07 |
US20110013077A1 (en) | 2011-01-20 |
EP2267525A4 (en) | 2012-11-28 |
JP5020375B2 (ja) | 2012-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5020375B2 (ja) | 撮像モジュール | |
JP5094965B2 (ja) | 撮像モジュール | |
US8379333B2 (en) | Imaging module | |
EP2722711B1 (en) | Imaging module | |
JP4889660B2 (ja) | 撮像モジュール | |
JP2015012211A (ja) | 撮像ユニット及び撮像装置 | |
JP2010050771A (ja) | 撮像装置モジュール | |
JP4761956B2 (ja) | 撮像モジュールおよび撮像装置 | |
JP2015146380A (ja) | 撮像ユニット及び撮像装置 | |
JP6149442B2 (ja) | 撮像ユニット及び撮像装置 | |
JP2010109550A (ja) | 撮像モジュールおよびその製造方法 | |
JP2009200987A (ja) | 撮像モジュール | |
JP2009182381A (ja) | 撮像モジュール | |
JP6756357B2 (ja) | 撮像装置 | |
JP2014170819A (ja) | 撮像ユニットおよび撮像装置 | |
JP6443494B2 (ja) | 撮像ユニット及び撮像装置 | |
JP5289096B2 (ja) | 撮像モジュール | |
JP2010041373A (ja) | カメラモジュールおよびステレオカメラ | |
WO2009119261A1 (ja) | 撮像モジュール | |
WO2009116367A1 (ja) | 撮像モジュール | |
JP7078151B2 (ja) | 撮像ユニットおよび撮像装置 | |
JP2018121367A (ja) | 撮像ユニットおよび撮像装置 | |
JP2018139455A (ja) | 撮像ユニット及び撮像装置 | |
JP2020025332A (ja) | 撮像ユニットおよび撮像装置 | |
JP2010081136A (ja) | 撮像モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980110539.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09724633 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010505486 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12934260 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009724633 Country of ref document: EP |