WO2009107272A1 - 薄刃砥石 - Google Patents
薄刃砥石 Download PDFInfo
- Publication number
- WO2009107272A1 WO2009107272A1 PCT/JP2008/068712 JP2008068712W WO2009107272A1 WO 2009107272 A1 WO2009107272 A1 WO 2009107272A1 JP 2008068712 W JP2008068712 W JP 2008068712W WO 2009107272 A1 WO2009107272 A1 WO 2009107272A1
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- WIPO (PCT)
- Prior art keywords
- plating layer
- layer
- grindstone
- abrasive grains
- thin
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
Definitions
- the present invention relates to a thin blade grindstone suitable for cutting a workpiece such as ceramics or single crystal material.
- a thin ring-shaped electroformed thin blade grindstone is known as a thin blade grindstone (dicing blade) for cutting a workpiece such as silicon, GaAs, and ferrite with high accuracy.
- This electroformed thin-blade grindstone is formed by dispersing abrasive grains such as diamond and cBN in a metal binder, and is formed into a thin plate ring shape with a thickness of about several tens to several hundreds of ⁇ m.
- the thin-blade grindstone can hold the inner peripheral region thereof on the grindstone shaft and rotate the grindstone shaft, thereby cutting or grooving the workpiece in the outer peripheral region.
- Patent Document 1 discloses that the surface of the cutting edge portion of a metal binding material made of Ni, Co or an alloy thereof has a thickness that does not exceed the protruding amount of abrasive grains from the metal binding material.
- An electroformed thin blade grindstone in which an Sn plating layer is formed has been proposed.
- the Sn plating layer covers the surface of the metal binding material to improve the slidability, and the Sn plating layer softer than the metal binding material constitutes a buffer layer, and damages to the work piece It is said that chipping can be reduced and reduced.
- FIG. 6A shows a thin blade whetstone 10 before processing
- FIG. 6B shows a thin blade whetstone 10 during cutting.
- An Sn plating layer 12 having a thickness that does not exceed the protruding amount of the abrasive grains is formed on the surface of the metal binding material 11 made of Ni.
- the abrasive grains are omitted.
- the outer peripheral portion of the thin-blade grindstone 10 is worn by cutting the workpiece 13, wear in the thickness direction, particularly wear on both side surfaces provided with the Sn plating layer 12 is larger than wear in the radial direction.
- the metal binder 11 appears on both side surfaces in a short time.
- the thickness of the Sn plating layer is, for example, 10 to 15 ⁇ m.
- the thickness of the Sn plating layer is, for example, 10 to 15 ⁇ m.
- an object of a preferred embodiment of the present invention is to provide a thin blade grindstone that has a long life and can maintain good cutting performance for a long period of time.
- the present invention relates to a thin blade grindstone in which abrasive grains are dispersed and arranged in a metal binder made of Ni or an alloy mainly composed of Ni, and the amount of abrasive grains protruding from the metal binder on the surface of the metal binder.
- a thin-blade grindstone in which a Cu plating layer or an alloy plating layer mainly composed of Cu is formed.
- Mohs hardness is a measure of wear resistance. Sn has a Mohs hardness of 1.8, Cu has a Mohs hardness of 3.0, and Ni has a Mohs hardness of 3.5.
- the Mohs hardness of Cu is close to the Mohs hardness of Ni, when the outer peripheral part of a thin blade grindstone is worn with cutting, the wear rate in the radial direction and the wear rate in the thickness direction can be balanced. Therefore, even if the thin-blade grindstone is worn, both sides can be maintained without excessive wear, and the same performance as the initial cutting performance (suppression of chipping) can be maintained, and a long-life thin-blade grindstone can be realized. Furthermore, in the sharpening work performed prior to the actual cutting process, the Cu plating layer is not easily worn, so that the buffering effect of the Cu plating layer can be sufficiently exhibited during the cutting process. In addition, since Cu plating layer has high adhesiveness with Ni metal binder, Cu plating layer does not peel from Ni metal binder during cutting.
- the thickness of the Cu plating layer or the alloy plating layer mainly composed of Cu is preferably 1 to 10 ⁇ m. As described above, since the Cu plating layer is not easily worn away, even a thin film having a thickness of 10 ⁇ m or less can exhibit a sufficient buffering effect. In other words, the grain size of the abrasive grains can be reduced accordingly, and high-precision cutting can be performed.
- the thickness of the Cu plating layer or the alloy plating layer mainly composed of Cu is set according to the grain size of the abrasive grains, but is 1 to 10 ⁇ m, preferably 1 to 5 ⁇ m when the grain size of the abrasive grains is 5 to 10 ⁇ m. Is good.
- an electrodeposited thin blade whetstone or an electroformed thin blade whetstone can be used.
- a metal blade made of Ni or an alloy mainly composed of Ni is formed by electrodeposition on a base metal such as stainless steel as a cathode, thereby creating a thin blade whetstone. it can.
- an electroformed thin blade grindstone an extremely thin thin blade grindstone can also be created by peeling the metal binder from the cathode.
- the alloy plating layer mainly composed of Cu refers to an alloy containing at least 50% by weight of Cu.
- Such an alloy plating layer has a Young's modulus smaller than that of the metal constituting the metal binder, and has a Mohs hardness of 2.5 according to the Mohs hardness evaluation method described in BS6430-13: 1986, EN101: 1991. It is desirable to use a larger material. This is because when the Mohs hardness is 2.5 or less (for example, Au, Sn, etc.), the wear resistance is low and the wear is caused early, and the original cutting performance cannot be maintained.
- the metal constituting the metal binder may be an alloy of Ni as a main component and another metal (for example, Co).
- the alloy mainly composed of Ni refers to an alloy containing at least 50% by weight of Ni. Any alloy having mechanical strength and wear resistance equivalent to Ni may be used.
- Workpieces that can be cut with the thin-blade grindstone of the present invention include silicon, GaAs, ferrite and the like, as well as high-hardness materials such as piezoelectric ceramics such as PZT, quartz, LiTaO 3 single crystal, and dielectric.
- the Cu plating layer or the alloy plating layer mainly composed of Cu is formed on the surface of the metal binding material made of Ni or an alloy mainly composed of Ni, the Cu plating layer softer than Ni.
- the Cu plating layer softer than Ni.
- the Cu plating layer is excellent in wear resistance, the wear rate on both side surfaces provided with the Cu plating layer can be reduced. Therefore, when the outer peripheral portion of the thin-blade grindstone is worn with cutting, the radial wear rate and the thickness wear rate can be balanced, and the same performance as the initial cutting performance can be maintained.
- FIG. 1A and 1B show a first embodiment of a thin-blade grindstone according to the present invention, in which FIG. 1A is a front view of the thin-blade grindstone, and FIG.
- the thin blade grindstone 1 of the present embodiment is a thin ring-shaped electroformed thin blade grindstone in which abrasive grains 2 such as diamond and cBN are dispersedly arranged in a metal binder 3, and the thickness thereof is several tens of ⁇ m. It is set to about several hundred ⁇ m, desirably 50 ⁇ m or less.
- the metal binding material 3 is made of a Ni plating layer or an alloy plating layer mainly composed of Ni. Examples of the Ni alloy include a Ni—Co alloy, a Ni—W alloy, and a Ni—B alloy.
- a Cu plating layer 4 having a thickness not exceeding the protruding amount of the abrasive grains 2 from the metal binding material 3 is formed on the surface of the metal binding material 3.
- the thickness of the Cu plating layer 4 does not have to exceed the protruding amount of the abrasive grains 2, but when the grain diameter of the abrasive grains 2 is 5 to 10 ⁇ m, it is about 1 to 10 ⁇ m, preferably about 1 to 5 ⁇ m. 15% to 100% of the abrasive grain size is desirable.
- 1B shows an example in which all the abrasive grains 2 in the surface layer portion protrude from the Cu plating layer 4 to the surface, but some of the abrasive grains 2 are buried in the Cu plating layer 4. It may be.
- an alloy plating layer mainly composed of Cu may be used.
- the alloy plating layer include CuZn, CuZnSn, and CuSn.
- the Young's modulus is smaller than the Young's modulus (210 GPa) of Ni constituting the metal binder 3, and the Mohs hardness (BS6430-13: 1986, EN101: It is desirable that the material be larger than 2.5 (Mohs hardness according to the Mohs hardness evaluation method described in 1991).
- the Cu plating layer 4 is formed at least on the blade edge portion 1a of the thin blade grinding stone 1, but the Cu plating layer 4 may be formed not only on the blade edge portion 1a but also on the entire thin blade grinding stone 1.
- an example of the manufacturing method of the thin blade whetstone 1 which consists of the said structure is demonstrated with reference to FIG.
- an electrolytic plating solution containing Ni in which abrasive grains 2 such as diamond are dispersed is prepared, a substrate such as stainless steel and an anode plate are disposed facing each other in this plating solution, and the substrate is connected to the cathode.
- a current is applied between the cathode and the anode, a Ni alloy plating layer is deposited on the substrate, and the metal binder 3 in which the abrasive grains 2 are uniformly dispersed is formed.
- the plating is finished, the substrate on which the metal bonding material 3 is formed is taken out of the plating solution, and the metal bonding material 3 is peeled from the substrate.
- the peeled metal binder 3 is formed into a ring shape to obtain a single-layer grindstone 1A shown in FIG.
- the surface of the metal binding material 3 of the single-layer grindstone 1A is removed by etching or the like to obtain a single-layer grindstone 1B in which the protruding amount of the abrasive grains 2 is increased as shown in FIG.
- the single-layer grindstone 1B is immersed in a plating solution containing Cu ions, the single-layer grindstone 1B is used as a cathode, an anode plate is disposed opposite to the cathode, and energization is performed between the cathode and the anode.
- the Cu plating layer 4 is formed. Cu plating does not deposit on the non-conductive abrasive grains 2 but only on the metal binder 3.
- the thin blade grindstone 1 shown in FIG. 2C is obtained. Prior to actual cutting, it is preferable to dress the blade edge of the thin blade 1 by dressing.
- the Young's modulus (120 GPa) of the Cu plating layer 4 is lower than the Young's modulus (210 GPa) of the metal binder 3 made of Ni. That is, since the Cu plating layer 4 is softer than the metal binder 3, it exerts a buffering effect when the abrasive grains 2 collide with the work piece, can reduce damage to the work piece, and can suppress chipping.
- the Mohs hardness which is a measure of wear resistance, is 3.0 for Cu and 3.5 for Ni. Since the Mohs hardness of Cu is close to the Mohs hardness of Ni, the outer periphery of the thin-blade grindstone is accompanied by cutting.
- the wear rate in the radial direction and the wear rate in the thickness direction can be balanced.
- the middle part of the abrasive grains 2 is held by the soft Cu plating layer 4, but the bottom part of the abrasive grains 2 is held by the hard metal binder 3, so that the abrasive grains 2 can be prevented from easily falling off. .
- FIG. 3 shows an initial state (a) of the thin-blade grindstone 1 in the present embodiment and a state (b) after performing several cutting processes.
- abrasive grains are omitted.
- the outer peripheral portion of the thin-blade grindstone 1 is worn by cutting the workpiece 5, since Cu and Ni are close to Mohs hardness, the outer peripheral portion of the metal binder 3 is worn in an arc shape, and the Cu plating layer 4 The tip part also wears, and wear progresses while maintaining this form.
- the hardness of both side surfaces of the outer peripheral portion of the thin blade grindstone 1 greatly affects the occurrence of chipping, in the case of the thin blade grindstone 1 in the present embodiment, as shown in FIG.
- the buffering effect by the Cu plating layer 4 can be maintained, and good cutting performance (chipping suppression) and processing accuracy can be maintained. Therefore, the life of the thin blade grindstone 1 is extended.
- the thin blade whetstone (1) is a single layer whetstone made only of Ni metal binder with dispersed abrasive grains
- the thin blade whetstone (2) is formed with a Sn plating layer on a Ni metal binder with dispersed abrasive grains.
- thin-blade grindstone (3) is a three-layer grindstone (product of the present invention) in which a Cu plating layer is formed on a Ni metal binding material in which abrasive grains are dispersed, thin blade
- the grindstone (4) is a three-layer grindstone (comparative example) in which an Au plating layer is formed on a Ni metal binder in which abrasive grains are dispersed.
- Metal binder Ni (Mohs hardness: 3.5, Young's modulus: 210 [GPa]) Abrasive grain size: 5 / 10 ⁇ m Shape: outer diameter 52 x thickness 0.04 x inner diameter 40 [mm]
- Metal binding material Ni Outer layer material: Sn (Mohs hardness: 1.5, Young's modulus: 55 [GPa]) Outer layer thickness: 1.2 ⁇ m
- Metal binding material Ni Outer layer material: Cu (Mohs hardness: 3.0, Young's modulus: 120 [GPa])
- Processing machine Dicer DAD522 (manufactured by DISCO Corporation) Spindle speed: 30000rpm
- Workpiece Single crystal material (LiTaO 3 )
- Work shape Strip shape (20 ⁇ 80mm) Feeding speed: 20mm / s Number of cuts: 5 Cut length: 20 mm x 5 Total 100 mm
- FIG. 4 shows the chipping results when machining with the above-mentioned thin blade grinding wheels (1) to (4).
- This figure shows the amount of chipping that appears on the cut surface when a flat workpiece is cut. The maximum chipping on each cut surface is tabulated, and the maximum value, minimum value, and average value are calculated. It is shown.
- the Ni metal binder has a high hardness, so chipping is large.
- the Sn three-layer grindstone and the Au three-layer grindstone should serve as a buffer layer for the Sn plating layer and Au plating layer, which are the outer layers, but the wear resistance is low, and the Sn plating layer and Au plating layer are formed by sharpening work.
- the chipping result in the actual cutting process is almost the same as that of the Ni single-layer grindstone.
- the Cu plating layer does not wear due to the sharpening operation, so that the chipping result in the cutting process is greatly reduced compared to the Ni single-layer grindstone, the Sn three-layer grindstone, and the Au three-layer grindstone, and its variation. It can also be seen that it is getting smaller. Thus, it can be seen that the Cu three-layer grindstone has better cutting performance than other grindstones.
- Processing machine DAD3350 (manufactured by DISCO Corporation) Spindle speed: 30000rpm Machining speed: 20mm / s Cutting water flow rate: 1.0 liter / min Workpiece: PFLT substrate (XY pyroelectric product) ⁇ 100mm Machining pitch: 0.9mm Number of processing: 100 Number of processing: 2
- FIG. 5 shows the total processing length of the grindstone on the horizontal axis, and the vertical axis represents the back surface chipping amount of the Sn three-layer whetstone and Cu three-layer whetstone, and the chipping amount when the Ni single-layer whetstone is machined is 1. It is shown in the ratio when doing. From the results shown in Fig.
- the effect of reducing chipping by about 20% compared to the Ni single-layer grindstone can be confirmed up to a cut length of 10,000 mm, but from the cut length exceeding 13000 mm (1.5 wafers)
- the chipping suppression effect is reduced, and in the region where the cut length exceeds 15000 mm (for two wafers), the chipping amount is deteriorated to a level equivalent to that of a Ni single layer grindstone.
- the Cu three-layer grindstone maintains a chipping suppression effect of about 20 to 30% from the beginning to the end.
- the present invention is not limited to the above embodiment.
- the electroformed thin blade grindstone has been described as an example.
- a Ni plating layer is provided by electrodeposition on a base metal such as stainless steel to form a metal bonding material, and Cu plating layers are formed on both sides of the metal bonding material. It may be formed.
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Abstract
Description
まず、ダイヤモンド等の砥粒2を分散させたNiを含む電解めっき液を準備し、このめっき液中にステンレス等の基板と陽極板とを対向して配置し、基板を陰極に接続する。陰極と陽極間に通電すると、基板上にNi合金めっき層が析出し、砥粒2が均一に分散された金属結合材3が形成される。金属結合材3が数十μm~数百μmとなった時点でめっきを終了し、この金属結合材3を形成した基板をめっき液から取り出し、基板から金属結合材3を剥離する。剥離した金属結合材3をリング状に成形して図2の(a)に示す単層砥石1Aを得る。
次に、単層砥石1Aの金属結合材3の表面をエッチング等により除去し、図2の(b)のように砥粒2の突き出し量を大きくした単層砥石1Bを得る。
次に、単層砥石1BをCuイオンを含むめっき液に浸漬し、単層砥石1Bを陰極とし、この陰極に対向して陽極板を配置し、陰極と陽極間に通電すると、Cuが単層砥石1B上に析出し、Cuめっき層4が形成される。Cuめっきは非導電性の砥粒2上には析出せず、金属結合材3上にのみ析出する。こうして、図2の(c)に示す薄刃砥石1が得られる。なお、実際の切削加工に先立って、薄刃砥石1の刃先部をドレッシングすることにより、目立てを行うのがよい。
(1)Ni電鋳単層砥石(従来技術品)
金属結合材:Ni(モース硬度:3.5 、ヤング率:210[GPa] )
砥粒径:5/10μm
形状:外径52×厚さ0.04×内径40 [mm]
(2)Sn三層砥石(先行技術品)
金属結合材:Ni
外側層材質:Sn(モース硬度:1.5 、ヤング率:55[GPa])
外側層厚 :1.2 μm
(3)Cu三層砥石(本発明品)
金属結合材:Ni
外側層材質:Cu(モース硬度:3.0 、ヤング率:120[GPa] )
外側層厚 :1.2 μm
(4)Au三層砥石(比較例)
金属結合材:Ni
外側層材質:Au(モース硬度:2.5 、ヤング率:78[GPa])
外側層厚 :1.2 μm
加工機 :ダイサーDAD522(株式会社ディスコ製)
主軸回転数:30000rpm
被加工物 :単結晶材料(LiTaO3)
ワーク形状:短冊形状(20×80mm)
送り速度 :20mm/s
カット本数:5本
カット長さ:20mm×5本 計100 mm
(1)Ni単層砥石
砥粒径:5/10μm
形状:外径52×厚さ0.04×内径40 [mm]
(2)Cu三層砥石
基材:Ni単層砥石
エッチング処理
エッチング液 :35%塩酸:60%硝酸:純水=1:1:3(vol%) 混合液
エッチング液量:400ml
エッチング厚 :1.7μm
めっき処理
めっき液 :硫酸銅めっき液
電流 :0.2A
めっき時間 :340s
浴温度 :25℃
Cuめっき厚 :1.1μm
(3)Sn三層砥石
基材:Ni単層砥石
エッチング処理 :Cu三層砥石と同一条件
めっき処理
めっき液 :スズめっき 酸性浴
電流 :0.04A
めっき時間 :780s
浴温度 :25℃
Snめっき厚 :1.1μm
加工機:DAD3350(株式会社ディスコ製)
スピンドル回転数:30000rpm
加工速度:20mm/s
切削水流量:1.0リットル/min
加工ワーク:PFLT基板(X-Y焦電処理品)φ100mm
加工ピッチ:0.9mm
加工本数:100本
加工枚数:2枚
2 砥粒
3 金属結合材(Niめっき層)
4 Cuめっき層
5 被加工物
Claims (4)
- 砥粒をNi又はNiを主体とする合金からなる金属結合材中に分散配置してなる薄刃砥石において、
前記金属結合材の表面に、前記金属結合材からの砥粒の突き出し量を越えない厚みのCuめっき層又はCuを主体とする合金めっき層が形成されていることを特徴とする薄刃砥石。 - 前記Cuめっき層又はCuを主体とする合金めっき層の厚みは 1~10μmであることを特徴とする請求項1に記載の薄刃砥石。
- 前記薄刃砥石は電鋳薄刃砥石であることを特徴とする請求項1又は2に記載の薄刃砥石。
- 前記Cuめっき層又はCuを主体とする合金めっき層は、そのヤング率が前記金属結合材を構成する金属のヤング率より小さく、かつBS6430-13:1986,EN101:1991に記されたモース硬度評価方法によるモース硬度が2.5より大きな材質であることを特徴とする請求項1乃至3のいずれか1項に記載の薄刃砥石。
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Cited By (3)
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JP2012086304A (ja) * | 2010-10-19 | 2012-05-10 | Allied Material Corp | 超砥粒ホイールならびに成形体およびその加工方法 |
CN105252447A (zh) * | 2015-08-24 | 2016-01-20 | 镇江丰成特种工具有限公司 | 一种高效磨轮 |
EP2647470B1 (en) * | 2010-11-29 | 2020-06-10 | Shin-Etsu Chemical Co., Ltd. | Cemented carbide base outer-diameter blade cutting wheel and manufacturing method thereof |
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GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
US20150105006A1 (en) * | 2013-10-11 | 2015-04-16 | HGST Netherlands B.V. | Method to sustain minimum required aspect ratios of diamond grinding blades throughout service lifetime |
CN105252446B (zh) * | 2015-08-24 | 2017-11-03 | 镇江丰成特种工具有限公司 | 一种高效耐磨的磨轮制备工艺 |
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- 2008-10-16 KR KR1020107018322A patent/KR101151051B1/ko active IP Right Grant
- 2008-10-16 CN CN200880127233.0A patent/CN101945733B/zh active Active
- 2008-10-16 WO PCT/JP2008/068712 patent/WO2009107272A1/ja active Application Filing
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JP2012086304A (ja) * | 2010-10-19 | 2012-05-10 | Allied Material Corp | 超砥粒ホイールならびに成形体およびその加工方法 |
EP2647470B1 (en) * | 2010-11-29 | 2020-06-10 | Shin-Etsu Chemical Co., Ltd. | Cemented carbide base outer-diameter blade cutting wheel and manufacturing method thereof |
CN105252447A (zh) * | 2015-08-24 | 2016-01-20 | 镇江丰成特种工具有限公司 | 一种高效磨轮 |
Also Published As
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KR20100113578A (ko) | 2010-10-21 |
JP2009196056A (ja) | 2009-09-03 |
CN101945733A (zh) | 2011-01-12 |
KR101151051B1 (ko) | 2012-06-01 |
CN101945733B (zh) | 2013-06-05 |
JP4400677B2 (ja) | 2010-01-20 |
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