WO2009104294A1 - Alliage à souder sans plomb et dispositif à semi-conducteurs - Google Patents

Alliage à souder sans plomb et dispositif à semi-conducteurs Download PDF

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Publication number
WO2009104294A1
WO2009104294A1 PCT/JP2008/066018 JP2008066018W WO2009104294A1 WO 2009104294 A1 WO2009104294 A1 WO 2009104294A1 JP 2008066018 W JP2008066018 W JP 2008066018W WO 2009104294 A1 WO2009104294 A1 WO 2009104294A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
free solder
solder alloy
weight
tin
Prior art date
Application number
PCT/JP2008/066018
Other languages
English (en)
Japanese (ja)
Inventor
石川　久雄
Original Assignee
日本ジョイント株式会社
ホライゾン技術研究所株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ジョイント株式会社, ホライゾン技術研究所株式会社 filed Critical 日本ジョイント株式会社
Publication of WO2009104294A1 publication Critical patent/WO2009104294A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B25/00—Obtaining tin
    • C22B25/08—Refining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to circuit formation of a mounting member such as a semiconductor package or an electronic element on a printed circuit board.
  • a lead-free solder alloy that is soldered via solder between the copper land of the printed circuit board and the lead terminals of semiconductor packages, electronic devices, etc. More specifically, it relates to semiconductor devices that are soldered using the solder. More specifically, it is much more flexible and stretchable than the current lead-free solder alloy. Solder joints with low viscosity in the state, good wetting and spreadability, less likely to become a per volume, difficult to leak into adjacent leads at narrow intervals, and high joint reliability of soldered micro joints In addition, the present invention relates to a lead-free solder alloy that can be used, a semiconductor device soldered using the lead-free solder alloy of the present invention, and a technology.
  • solder joints are also miniaturized and increasingly higher Quality reliability is required.
  • extremely strict reliability is required for the quality of fine solder joints between printed circuit boards and electronic component parts.
  • the solder alloy side used for solder joints is also required to have high solder joint strength, in particular, high reliability of the solder joints as the electronic element and electronic component lead joint area and pitch become smaller. .
  • solder-free solder alloys that do not contain lead have been developed especially in the field of electronic components. It is widely used for soldering processing. Especially, it is possible to use tin or silver solder alloy, and solder alloy with antimony added (Patent Document 1), or tin or silver solder alloy. Solder alloys with added germanium (Patent Document 2) etc. have been proposed It has become. In addition, a number of various solder alloys have been proposed, such as a tin 'zinc' nickel-based solder alloy and a solder alloy further added with silver, copper, bismuth, etc. (Patent Document 3).
  • solder joints since these lead-free solder alloys do not have good wettability at the time of melting, when the solder joint area becomes finer, the solder rises in the joint at a capacity higher than necessary. In circuits where the volume j and the pitch between leads are narrow, there is a difficulty that bridges over adjacent leads and leaks easily, and the elongation, which is one of the physical and mechanical characteristics of the solder during solidification, occurs. Because of its small size, it tends to cause poor continuity due to fatigue fracture of solder joints due to repeated heat cycles when energization is turned on and off, and often impairs the connection reliability of miniaturized electronic devices.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-0 2 8 6 (Patent 3 0 2 7 4 4 1)
  • Patent Document 2 JP-A-11 1 7 7 3 6 6 (Patent 3 2 9 6 2 8 9)
  • Patent Document 3 Japanese Patent Laid-Open No. 9-9 4 6 8 8 (Patent 3 2 9 9 0 9 1)
  • the present invention relates to the problem of the above-mentioned overvolume, which is a difficulty in soldering a small part of a lead-free solder alloy that is currently in practical use, and a small part of a very narrow lead-pitch circuit.
  • the reliability of the joints of micro electronic parts is improved.
  • the present invention provides a lead-free solder alloy that dramatically improves, and a semiconductor device in which the solder joint reliability of minute parts is dramatically improved by using the lead-free solder alloy.
  • the present invention is currently widely used in a solution having a liquid temperature of 180 to 30 consisting of an oil containing 5 to 80% by weight of an organic fatty acid having 13 to 20 carbon atoms.
  • a normal lead-free solder alloy that is, a molten lead-free solder alloy containing tin as the main component and one or more metals selected from silver, copper, zinc, bismuth, antimony, nickel and germanium added thereto.
  • the organic fatty acid used in the present invention can be used even with a carbon number of 12 or less, it has a water absorption property, which is not preferable because it is used at a high temperature.
  • organic fatty acids having 21 or more carbon atoms have a high melting point and poor permeability and are difficult to handle, and the lead-free solder alloy after the treatment has an insufficient antifungal effect.
  • palmitic acid having 16 carbon atoms and stearic acid having 18 carbon atoms are optimal, and one of them is 10 to 70% by weight, and the liquid temperature is composed of the remaining ester synthetic oil 1 80 to 30
  • the oxides and impure metals present inside the lead-free solder alloy are removed, and unprecedented physical, mechanical and chemical properties, especially flexible, stretchable, tough, and melted. It has a low viscosity at the time (the apparent sensation is clearly “smooth” compared to conventional lead pre-solder) and provides a clean, lead-free solder alloy with good solder wettability.
  • the organic fatty acid concentration is effective even if it is 10% by weight or less, but complicated, such as replenishment management, and if it is 70% by weight or more, the liquid viscosity increases, and the stirring resistance with the lead-free solder alloy In order to cause a problem in the mixed permeability, it is preferably 10 to 70% by weight.
  • the liquid temperature is determined by the melting point of the lead-free solder alloy to be used, and it is necessary to vigorously stir and contact the organic fatty acid solution and the molten lead-free solder at least in a temperature range above the melting point.
  • the upper limit temperature is about 300 ° from the viewpoint of smoke generation and energy saving, and is desirably a temperature not lower than the melting point of the lead-free solder to be used up to 27 ° C.
  • the reason for mixing the ester synthetic oil is to reduce the viscosity of the liquid and perform uniform processing and to suppress high-temperature smoke generation of organic fatty acids.
  • the concentration is determined by the concentration of organic fatty acids.
  • the stirring method is a method in which the above-mentioned organic fatty acid and ester synthetic oil are put in a stainless steel container equipped with a heating device and heated to a predetermined temperature while stirring using a normal patch-type stainless steel impeller stirrer.
  • the lead-free solder alloy solution which has been made into a solution and previously melted in a separate tank, is poured into the solution with vigorous stirring little by little. Stirring can efficiently remove oxides and impurities in the sharp free solder in a short time by using a static mixer.
  • solder alloys are actually tin 'silver' copper-based and commercial alloys with nickel and germanium added, and tin 'zinc-based alloys with nickel and silver added.
  • the effects of the immersion stirring treatment were conducted with the above-described organic fatty acid and ester synthetic oil of the present invention centering on the alloy, and the effect was verified. It can be inferred that
  • a lead-free solder alloy that is widely used at present that is, tin as a main component, and silver, copper, zinc, bismuth, antimony, nickel, germanium, or more
  • molten lead-free solder alloy added with metal is injected and immersed and stirred, oxidation of tin oxide, copper oxide, silver oxide, or other added metals present in the molten lead-free solder alloy is performed.
  • Oxidized impurities such as iron, lead, silicon, potassium, etc. that are mixed in the product and react with organic fatty acid ruponyl groups to be saponified and separated and removed from the lead-free solder alloy.
  • the stirring time depends on the amount of the lead-free solder alloy used, the structure of the stirrer, and the stirring conditions, but generally strong stirring for about 10 to 60 minutes is sufficient. Then, using the difference in specific gravity, the lead oxide solder alloy, which has been separated and removed from the bottom of the reaction vessel by the specific gravity difference, has been cleaned and taken out in a molten form, solidified, and solidified. It can be put into a normal soldering device and soldered.
  • Comparative Example 1 a commercially available lead-free solder alloy consisting of 2.5% by weight of silver, 0.5% by weight of copper, and the balance tin was used.
  • Example 1 of the present invention a lead-free solder alloy composed of 2.5% by weight of silver, 0.5% by weight of copper, and the remaining tin having the same composition as Comparative Example 1 was previously melted. Stir vigorously with a rotary stirrer with a stainless impeller installed in two stages while dripping a small amount into a solution at a liquid temperature of 260% consisting of 50% by weight of stearic acid and the remaining ester synthesis. However, after 30 minutes, the cleaned lead-free solder was taken out from the lowermost part of the treatment tank and subjected to an evaluation test.
  • Comparative Example 2 a lead-free solder alloy comprising 2.5% by weight of silver, 0.5% by weight of copper, 0.1% by weight of nickel, 0.05% by weight of germanium, and the balance tin used.
  • Example 2 2.5% by weight of silver and 0.5% of copper having the same composition as Comparative Example 2 were used.
  • Comparative Example 3 a lead-free solder alloy consisting of 8.0 wt% zinc, 0.05 wt% nickel, 1.0 wt% silver and the balance tin was used.
  • Example 3 lead having the same composition as Comparative Example 3 above, consisting of 8.0% by weight of zinc, 0.05% by weight of nickel, 1.0% by weight of silver, and the balance tin Free solder alloy is melted in advance and palmitic acid is 40 weight.
  • a rotary stirrer with stainless steel impeller installed in two stages while dripping a small amount into the solution at a liquid temperature of 2 80, consisting of / 0 , stearic acid, 20% by weight and the remaining ester synthesis.
  • the cleaned lead-free solder was taken out from the lowermost part of the treatment tank and subjected to an evaluation test.
  • the physical-mechanical evaluation method is based on the lead-free solder joints of Comparative Examples 1 to 3 and Examples 1 to 3.
  • a stainless steel (SUS 304) forged mold JIS No. 6
  • the zero crossing time was measured in 5). At that time, a pure copper wire of 0.4 mm ⁇ was used as the measurement pin.
  • the tensile strength of the examples was not much different from that of the comparative example with respect to the magnitude of the elongation, and therefore it was confirmed that the toughness was strong and fatigue failure due to expansion and contraction in the long-term heat cycle test did not easily occur.
  • FIG. 1 is an example of a cross-sectional crystal structure of a lead-free solder alloy (Example 2) according to the present invention.
  • FIG. 2 This is an example of the internal cross-sectional crystal structure of a conventional lead-free solder alloy (Comparative Example 2).
  • the technology of the present invention clearly has high elongation and toughness not found in conventional lead-free solder alloys, especially electronic devices that have small joint breakage risk due to repeated heat cycle fatigue of small area joints, and are therefore miniaturized.
  • This is a technology that is industrially valuable as a lead-free solder alloy that can ensure long-term high-reliability solder joints.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

La présente invention concerne un alliage à souder fondu sans plomb comprenant de l'étain comme composant principal et au moins un métal choisi parmi l'argent, le cuivre, le zinc, le bismuth, l'antimoine, le nickel, et le germanium ajouté à l'étain, ledit alliage étant immergé dans une solution d'une huile contenant 5 à 80 % en poids d'un acide gras organique ayant 13 à 20 atomes de carbone à une température de solution allant de 180 à 300 °C. La solution est mélangée pour éliminer les oxydes et les impuretés contenus dans l'alliage à souder sans plomb. Conformément à la constitution ci-dessus, l'alliage à souder sans plomb traité est avantageux en ce qu'il est souple et présente un excellent allongement et une excellente résistance et, par comparaison avec l'alliage à souder sans plomb conventionnel, l'alliage à souder sans plomb traité présente une viscosité inférieure à l'état fondu, possède de meilleures propriétés d'étalement par voie humide, et permet de réaliser un assemblage de soudure qui donne un joint de soudure, particulièrement un microjoint, ayant une fiabilité élevée ne pouvant pas être obtenue par la technique de l'art antérieur.
PCT/JP2008/066018 2008-02-22 2008-08-29 Alliage à souder sans plomb et dispositif à semi-conducteurs WO2009104294A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008072364A JP4375485B2 (ja) 2008-02-22 2008-02-22 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
JP2008-72364 2008-02-22

Publications (1)

Publication Number Publication Date
WO2009104294A1 true WO2009104294A1 (fr) 2009-08-27

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PCT/JP2008/066018 WO2009104294A1 (fr) 2008-02-22 2008-08-29 Alliage à souder sans plomb et dispositif à semi-conducteurs
PCT/JP2008/073145 WO2009104338A1 (fr) 2008-02-22 2008-12-12 Etain, alliage à souder, et dispositif à semi-conducteurs

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PCT/JP2008/073145 WO2009104338A1 (fr) 2008-02-22 2008-12-12 Etain, alliage à souder, et dispositif à semi-conducteurs

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WO (2) WO2009104294A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150115020A1 (en) * 2012-04-17 2015-04-30 Tanigurogumi Corporation Solder bump, method for forming a solder bump, substrate provided with solder bump, and method for manufacturing substrate

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018189154A1 (fr) * 2017-04-10 2018-10-18 Metallo Belgium Procédé amélioré de production de brasure brute
CN107245602B (zh) * 2017-06-09 2019-03-22 升贸科技股份有限公司 无铅锡合金及使用其的镀锡铜线
JP7026907B2 (ja) * 2020-04-08 2022-03-01 石川技研株式会社 はんだ製品の製造方法、プリント回路板、線材、フレキシブルプリント基板および電子部品
WO2020209330A1 (fr) 2019-04-09 2020-10-15 石川技研株式会社 Procédé de fabrication de produit de soudure, soudure, composant soudé, produit de soudure, carte de circuit imprimé, tableau de connexions imprimé, fil, produit soudé, carte de circuit imprimé souple, composant électronique, procédé de fabrication d'article moulé en étain, procédé de fabrication de produit intermédiaire en étain, article moulé en étain, produit intermédiaire en étain et élément conducteur
CN111009798B (zh) * 2019-12-20 2022-07-01 中国科学院电工研究所 一种多芯铁基超导接头及其制备方法
TWI799696B (zh) * 2020-03-12 2023-04-21 石川久雄 焊料製品之製造方法、焊料、焊接部件、焊料製品、印刷線路板、印刷電路板、線材、焊接製品、可撓印刷電路板、電子部件、錫成品之製造方法、錫半成品之製造方法、錫成品、錫半成品及導電構件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040103B1 (fr) * 1969-10-08 1975-12-22
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
JP2006045676A (ja) * 2004-08-03 2006-02-16 Wc Heraeus Gmbh 微細ろう粉末を製造する際に、合金成分を精製しそして均一分布させ並びに軟ろうから不所望の反応生成物およびスラッジを除く方法
JP2007532321A (ja) * 2004-04-16 2007-11-15 ピー．ケイ メタル，インコーポレイティド はんだ付け方法および装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2555715B2 (ja) * 1988-10-26 1996-11-20 三菱マテリアル株式会社 はんだ合金微粉末の製造方法
JP3090733B2 (ja) * 1991-09-04 2000-09-25 ソニー株式会社 噴流半田槽

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040103B1 (fr) * 1969-10-08 1975-12-22
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
JP2007532321A (ja) * 2004-04-16 2007-11-15 ピー．ケイ メタル，インコーポレイティド はんだ付け方法および装置
JP2006045676A (ja) * 2004-08-03 2006-02-16 Wc Heraeus Gmbh 微細ろう粉末を製造する際に、合金成分を精製しそして均一分布させ並びに軟ろうから不所望の反応生成物およびスラッジを除く方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150115020A1 (en) * 2012-04-17 2015-04-30 Tanigurogumi Corporation Solder bump, method for forming a solder bump, substrate provided with solder bump, and method for manufacturing substrate

Also Published As

Publication number Publication date
JP4375485B2 (ja) 2009-12-02
JP2009197315A (ja) 2009-09-03
WO2009104338A1 (fr) 2009-08-27

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