WO2009087872A1 - 部品実装システム及び部品実装方法 - Google Patents
部品実装システム及び部品実装方法 Download PDFInfo
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- WO2009087872A1 WO2009087872A1 PCT/JP2008/072918 JP2008072918W WO2009087872A1 WO 2009087872 A1 WO2009087872 A1 WO 2009087872A1 JP 2008072918 W JP2008072918 W JP 2008072918W WO 2009087872 A1 WO2009087872 A1 WO 2009087872A1
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- mounting machine
- feeder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
Definitions
- the present invention provides a component mounting system in which a plurality of mounting machines are aligned and arranged along a circuit board transport direction, and a plurality of types of components are sequentially mounted on the transported circuit board by the plurality of mounting machines. And a component mounting method.
- the luminance class may be slightly different for each feeder (for each tape reel).
- the variation of the luminance class of the LED for each feeder can be adjusted by the resistance value of the resistance component connected to the LED. Therefore, when mounting the LED on the circuit board, the resistance component having a resistance value suitable for the luminance class of the LED is required. I am trying to implement it.
- the smaller component is used. They are implemented in order.
- the resistor component is smaller than the LED, so the resistor component is mounted on the upstream mounting machine, and then the LED is mounted on the downstream mounting machine. However, the LED is mounted on the upstream mounting machine. In some cases, after mounting, the resistance component is mounted by a downstream mounting machine.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-283199
- a luminance class LED (component) suitable for a resistor component mounted on an upstream mounting machine is provided.
- a warning is issued and the operator replaces the LED feeder.
- the present invention has been made in consideration of such circumstances, and therefore the object of the present invention is to mount a component that can prevent the production of a defective board when the component mounted on the downstream mounting machine is out of components.
- a system and a component mounting method are provided.
- a plurality of mounting machines are aligned and arranged along the conveyance direction of the circuit board, and each mounting machine is provided with a feeder that supplies a component of the assigned type.
- the components mounted on the upstream mounting machine are mounted on the mounting machine on the downstream side.
- the downstream side mounted parts The remaining number of parts of the feeder that supplies the parts to be mounted by the mounting machine (hereinafter referred to as “downstream side mounted parts”) is counted by the remaining part counting means, and when the remaining number of parts counted becomes a predetermined number or less Judging out of stock and upstream The loading of the circuit board to the mounting machine in which was stopped. In this way, when a component to be mounted on the downstream mounting machine runs out of parts, no new component is mounted on the upstream mounting machine, thereby preventing the production of defective substrates. .
- the component remaining number counted by the component remaining number counting means is necessary for mounting the downstream mounting component on all circuit boards carried from the upstream mounting device to the downstream mounting device.
- the number of components is less than or equal to the number of components, it may be determined that the components are out of stock, and the carrying of the circuit board to the upstream mounting machine may be stopped. In this way, even when a plurality of circuit boards are carried from the upstream mounting machine to the downstream mounting machine, the plurality of circuit boards are prevented from becoming defective boards. it can.
- the mounting machine on the downstream side there is a case where a component pick-up error occurs or the number of components in the feeder is smaller than the management number from the beginning.
- the number of remaining parts counted by the remaining part number counting means becomes larger than the actual remaining number of parts, and the parts run out earlier than the detection of running out of parts.
- the remaining part counted by the remaining part counting means is reduced by a predetermined safety margin number to determine whether the part has run out.
- the component error in the downstream mounting machine occurs, or the remaining component count error that occurs when the number of components in the feeder is less than the management number from the beginning is a safety margin. It is possible to cancel by the number of times, and it is possible to prevent the parts from running out earlier than the detection of parts running out.
- the feeder for supplying the downstream mounting component when the feeder for supplying the downstream mounting component is removed from the downstream mounting machine, the loading of the circuit board into the upstream mounting machine may be stopped. In this way, it is possible to prevent the occurrence of a defective substrate due to the operator removing the downstream side mounting component for some reason.
- the feeder for supplying the downstream mounting components having the same characteristics as before the stop after the circuit board is brought into the upstream mounting machine is set in the downstream mounting machine, It is preferable to resume the circuit board loading into the mounting machine. In this way, as soon as the feeder that supplies the downstream mounting components with the same characteristics as before the stop is set in the downstream mounting machine, the circuit board is automatically resumed immediately into the upstream mounting machine. Thus, feeder replacement and parts replacement can be performed efficiently.
- a feeder that supplies the next component corresponding to the downstream mounting component is set in the downstream mounting machine, and information on the next component is input.
- splicing is performed by splicing a component supply tape containing a component having the same characteristics as that of the downstream mounting component to supply the component by splicing the component supply tape of the feeder that supplies the downstream mounting component.
- the feeder that supplies the downstream mounting component is set in the downstream mounting machine and If the component information of the next component is input and the characteristics of the next component match the characteristics of the downstream mounting component, even when the feeder is removed from the downstream mounting device, It is preferable to continue production without stopping the circuit board loading. In this way, when the feeder is removed from the downstream mounting machine, it is possible to continue production without stopping the delivery of the circuit board to the upstream mounting machine without using the splicing method. It is possible to improve the productivity by reducing the number of times of board carry-in stop and to prevent the parts from being damaged by splicing.
- FIG. 1 is a perspective view which shows the structure of the module type component mounting system used in Example 1, 2 of this invention. It is a figure explaining the method of mounting a resistive component and LED on a circuit board in order with the some mounting machine module of a module type component mounting system.
- 3 is a flowchart illustrating a flow of processing of a component mounting control program according to the first embodiment.
- 12 is a flowchart illustrating a flow of processing of a component mounting control program according to the second embodiment.
- a first embodiment of the present invention will be described with reference to FIGS.
- a plurality of mounting machine modules 12 are arranged on the base table 11 of the modular component mounting system so as to be adjacent to each other in the conveyance direction of the circuit board.
- Each mounting machine module 12 is configured by mounting a feeder 14, a circuit board transport device 15, a component imaging device 16, a component mounting device 17, etc. on a main body bed 13, and an operation panel is provided on the front surface of the upper frame 18.
- a part 19 is provided.
- Each mounter module 12 is set with a feeder 14 that supplies components of each assigned type.
- the circuit board transport device 15 of each mounter module 12 sequentially transports the circuit boards, and the component mounting device 17 performs circuit board transport. Multiple types of parts are mounted in order.
- the component adsorbed by the adsorption nozzle (not shown) of the component mounting device 17 interferes with other components previously mounted. In order to avoid this, the smaller components are mounted in order.
- the resistance component is smaller than the LED, the resistance component is mounted on the upstream mounting machine module 12 and then the LED is mounted on the downstream mounting machine module 12. Even if the LED manufacturers are the same, the luminance class is slightly different for each feeder 14 (for each tape reel). Since the variation in the luminance class of the LED for each feeder 14 can be adjusted by the resistance value of the resistance component connected to the LED, when the LED is mounted on the circuit board, the resistance component having a resistance value suitable for the luminance class of the LED Is implemented.
- the feeder 14 that supplies the matching brightness class LED is removed from the downstream mounting machine module 12.
- a defective board may be produced. This is because even if the LED manufacturer is the same, the brightness class of the LED is slightly different for each feeder 14 (for each tape reel), so the brightness class of the LED of the feeder 14 replaced by the operator is the previous one. This is because they may be different.
- the number of remaining parts of the feeder 14 that supplies the LEDs to the downstream mounting machine module 12 is counted, and it is determined that the parts are out of stock when the counted number of remaining parts is equal to or less than a predetermined number. Then, the carrying-in of the circuit board to the upstream mounting machine module 12 on which the resistance component corresponding to the LED is mounted is stopped. Further, when the feeder 14 for supplying the LED is removed from the downstream mounting machine module 12, the circuit board is stopped from being carried into the upstream mounting machine module 12 on which the resistance component corresponding to the LED is mounted.
- a resistor component is mounted by the Kth mounter module 12 from the top (most upstream), and an LED corresponding to the resistor component is mounted by the Nth mounter module 12 from the top (most upstream).
- the control device (computer) of the modular component mounting system counts the number of LEDs actually mounted on the circuit board by the downstream (Nth) mounting machine module 12, and presents the current components of the feeder 14 that supplies the LEDs.
- the remaining number is managed (this function corresponds to the component remaining number counting means).
- Current number of remaining parts initial number of remaining parts in feeder 14-number of mounted parts
- substrate buffer the number of circuit boards carried from the upstream (K-th) mounting machine module 12 on which the resistor component is mounted to the downstream (N-th) mounting machine module 12 on which the LED is mounted.
- the LED It is determined whether or not the part is out of stock.
- “(current number of remaining parts ⁇ number of safety margins) / number of LEDs mounted per board” corresponds to the number of boards scheduled to run out of LED parts.
- the number of boards out of parts of the LED is the number of circuit boards on which the LEDs can be mounted by the remaining number of LED parts in the feeder 14, and the difference between the number of boards out of parts and the number of board buffers (NK)
- NK number of board buffers
- step 101 information on the combination of the luminance class of the LED and the resistance value of the resistive component is acquired.
- the combination information acquisition method stores the combination information created in advance in a storage device, reads the combination information from the storage device, or stores it on a recording medium such as a barcode or an electronic tag attached to the feeder 14.
- the recorded combination information may be read by a reading device, or the operator may input combination information using an input device such as a keyboard or a mouse.
- step 102 an LED replenishment instruction is displayed on the display device or is instructed by voice.
- step 103 the ID (identification information) of the LED type, brightness class, etc. of the feeder 14 set in the downstream (Nth) mounting machine module 12 is recognized.
- This ID recognition method is, for example, transmitting the ID stored in the memory of the control unit of the feeder 14 to the control device of the module type component mounting system, or recording it on a recording medium such as a barcode attached to the feeder 14 or an electronic tag.
- the recorded ID may be read by a reading device, or an operator may input an ID using an input device such as a keyboard or a mouse.
- step 104 the process proceeds to step 104, and the remaining number of LED components in the feeder 14 is input using the input device.
- step 105 an instruction to supply resistance parts having resistance values corresponding to the luminance class of the LED is displayed on the display device or instructed by voice.
- step 106 the ID (identification information) such as the resistance value of the resistance component of the feeder 14 set in the upstream (Kth) mounting machine module 12 is recognized by the same method as in step 103.
- step 107 it is determined whether or not the LED feeder 14 and the resistor component feeder 14 corresponding to the LED are set together. Steps 102 to 106 are repeated.
- step 107 when it is determined in step 107 that the LED feeder 14 and the resistor component feeder 14 corresponding to the LED have been set together, the process proceeds to step 108, where the number of LED component-scheduled substrates (in the feeder 14) is reached.
- the number of circuit boards on which the LED can be mounted with the remaining number of LED components is calculated by the following formula in consideration of a predetermined safety margin number.
- Planned number of boards out of parts (Current number of remaining parts-Number of safety margins) / Number of LEDs mounted per board
- step 109 it is determined whether or not the LED is out of component depending on whether or not the difference between the number of components scheduled to be out and the number of substrate buffers (N ⁇ K) has become one or less.
- step 109 If the difference between the number of parts planned to be cut off and the number of board buffers (NK) is 1 or more, it is determined in step 109 that the LED is not out of parts, and the process proceeds to step 111 to perform normal component mounting.
- step 112 it is determined whether or not the LED feeder 14 has been removed from the downstream (Nth) mounting machine module 12. This determination method may determine, for example, whether or not the connector of the signal line that connects the control unit of the feeder 14 and the control unit of the mounting machine module 12 is disconnected. If it is determined in step 112 that the LED feeder 14 has not been removed, the process returns to step 108 described above.
- step 112 If it is determined in step 112 that the LED feeder 14 has been removed from the downstream (Nth) mounting machine module 12, the process proceeds to step 110, and the upstream (Kth) mounting machine module 12 is connected. Stop loading the circuit board. This is because an operator may set an LED feeder 14 of a different luminance class in the downstream (Nth) mounting machine module 12. After this, the other mounting machine modules 12 continue the component mounting work.
- step 109 if the difference between the number of parts to be cut out and the number of board buffers (N ⁇ K) is 1 or less, it is determined in step 109 that the LED parts are out of parts, and the process proceeds to step 110, upstream (Kth). The loading of the circuit board into the mounting machine module 12 is stopped. After this, the other mounting machine modules 12 continue the component mounting work.
- the upstream (Kth) mounting machine module 12 is moved to. If the feeder 14 for supplying the LED of the same brightness class as before the stop is set in the downstream (Nth) mounting machine module 12 after the circuit board is stopped, the upstream side ( The loading of the circuit board into the (Kth) mounting machine module 12 is resumed. This function corresponds to the substrate carry-in restarting means.
- the upstream (K-th) side when the LED component mounted on the downstream (N-th) mounting machine module 12 is out of service, or when the LED feeder 14 is removed, the upstream (K-th) side. Since the loading of the circuit board into the mounter module 12 is stopped, the production of a defective board can be prevented in advance.
- the number of remaining LED components is estimated by a predetermined number of safety margins to determine whether or not the component has run out, so the downstream (Nth) mounting machine module 12
- the counting error of the remaining number of parts that occurs when an LED adsorption error occurs or the number of parts in the feeder 14 is less than the management number from the beginning can be canceled by the number of safety margins. It is possible to prevent the parts from running out earlier than the detection of the parts running out.
- the feeder 14 that supplies the LEDs of the same luminance class as before the stop is the downstream (N-th) mounting machine module 12. Since the circuit board is immediately brought into the upstream (K-th) mounting machine module 12 at the time of being set, the setup change and the parts exchange can be performed efficiently.
- downstream mounting component (LED) feeder 14 when the downstream mounting component cannot be sucked (for example, when an image processing error or a suction error occurs), the upstream side ( The loading of the circuit board into the (Kth) mounting machine module 12 may be stopped.
- the feeder 14 that supplies the downstream mounting component is removed from the downstream mounting machine module 12
- the feeder 14 that supplies the next component corresponding to the downstream mounting component is connected to the downstream mounting machine module 12.
- step 201 normal component mounting work is performed, and in the next step 202, an LED component outage notice (replenishment instruction) to be mounted on the downstream mounting machine module 12 is displayed on the display device. Display or instruct by voice.
- step 203 the identifier (serial number, product number, characteristics, etc.) of the next LED to be supplied is read with an input terminal (handy terminal, barcode scanner, keyboard, etc.) or manually input and then supplied. Recognize the LED characteristics (luminance class). Then, in the next step 204, it is determined whether or not the next LED to be supplied has the same characteristic (luminance class) as the LED of the current feeder 14 (hereinafter referred to as “previous LED”). If it is not the same characteristic (luminance class), read or manually input the identifier of the next LED to be supplied until the characteristic (luminance class) of the next LED to be supplied is the same characteristic (luminance class) as the previous LED. Then, the process of recognizing the characteristics (luminance class) of the next LED to be supplied is repeated.
- the process proceeds to step 205, and this LED is reserved as the “next LED”.
- step 206 the same number of LEDs as the component mounting control program shown in FIG.
- the number of possible circuit boards is calculated in consideration of a predetermined safety margin number.
- Planned number of boards out of parts (Current number of remaining parts-Number of safety margins) / Number of LEDs mounted per board
- step 207 whether or not the board loading stop condition is satisfied for the upstream mounting machine module 12 on which the resistance component is mounted is determined by either of the following two conditions (1) and (2) Judgment is made based on whether one of the conditions is satisfied.
- the difference between the number of parts scheduled to be cut out and the number of board buffers (NK) is 1 or less. Number of boards scheduled to be cut out-number of board buffers (NK) ⁇ 1 (2)
- the feeder 14 for supplying the LED is removed from the mounting machine module 12 on the downstream side.
- the board loading stop condition is satisfied. If both of the two conditions (1) and (2) are not satisfied, the board loading stop condition is not satisfied. It becomes. If the board carry-in stop condition is not satisfied, the process returns to step 201 to perform normal component mounting work.
- step 207 if it is determined in step 207 that the substrate carry-in stop condition is satisfied, the process proceeds to step 208, where it is determined whether or not the next LED has been reserved by the processing in step 205, and the reservation is still performed. If not, the process proceeds to step 211, and the loading of the circuit board into the upstream mounting machine module 12 is stopped.
- step 208 determines whether the next LED has been reserved. If it is determined in the above step 208 that the next LED has been reserved, the process proceeds to step 209 and the production is continued without stopping the loading of the circuit board into the upstream mounting machine module 12. .
- the processes in these steps 208 and 209 serve as production continuation means.
- next step 210 it is determined whether or not the feeder 14 that supplies the current LED has run out of parts, and the upstream mounting machine module 12 continues until the feeder 14 that supplies the current LED runs out of parts. Continue to carry the circuit board into the LED and mount the LED on the circuit board.
- step 210 when it is determined in step 210 that the feeder 14 that supplies the current LED has run out of parts, the process proceeds to step 212, and the feeder 14 that supplies the next LED is set in the mounting machine module 12 on the downstream side. Let the work to do. Thereafter, the process proceeds to step 213, where it is determined whether or not the LED of the feeder 14 set this time is a reserved LED. If it is a reserved LED, the process proceeds to step 214 and the LED from the feeder 14 set this time is displayed. Is allowed to return to step 201 to perform normal component mounting work.
- step 213 if it is determined in step 213 that the LED of the feeder 14 set this time is not a reserved LED, the process returns to step 212 and the feeder 14 that supplies the next LED is changed to the downstream mounting machine module 12. The work to set to is performed again.
- the process proceeds to step 214, the supply of the LED is permitted, and the process returns to step 201 to perform normal component mounting work.
- the downstream side A feeder 14 that supplies the next component corresponding to the mounted component is set in the downstream mounting machine module 12 and information on the next component is input, and the characteristic of the next component becomes the component out of the downstream side. Even if it is determined that the downstream mounting component is out of components, or when the feeder 14 for supplying the downstream mounting component is removed from the downstream mounting machine module 12 when the characteristics of the mounting component coincide with each other.
- the production is continued without stopping the delivery of the circuit board to the upstream mounting machine module 12, when it is determined that the downstream mounting component is out of components, or the feeder 1 Can be continued without stopping the delivery of the circuit board to the upstream mounting machine module 12 without using the splicing method when the mounting board module 12 is removed from the downstream mounting machine module 12.
- productivity can be improved by reducing the number of times of board loading stoppage, and damage to parts due to splicing can be prevented.
- the feeder 14 for supplying the next component corresponding to the downstream mounting component is set in the downstream mounting machine module 12 before it is determined that the downstream mounting component is out of components. If the next component information is input and the characteristics of the next component match the characteristics of the downstream mounted component that is out of components, even if it is determined that the downstream mounted component is out of components, Production is continued without stopping the delivery of the circuit board to the mounting machine module 12 on the side, but before it is determined that the downstream mounting component is out of components, the feeder 14 that supplies the downstream mounting component Information on the next component is input by splicing the component supply tape to replenish the component by splicing a component supply tape containing a component having the same characteristics as the component mounted on the downstream side, and the next part If the characteristic of the circuit board coincides with the characteristic of the downstream mounting component that is out of the component, even when it is determined that the component of the downstream mounting component is out of the circuit board, the circuit board is stopped from being loaded into the upstream mounting machine module 12. You may make it continue production without doing.
- the LED and the resistor component for adjusting the luminance class of the LED are mounted has been described.
- a crystal oscillator, a resistor component for adjusting the oscillation frequency, and the like The present invention can also be applied to the case where the component is mounted.
- the component mounted on the upstream mounting machine module 12 adjusts the characteristics of the component mounted on the downstream mounting machine module 12.
- the present invention is applied when the component is a component, or when the component mounted on the downstream mounter module 12 is a component that adjusts the characteristics of the component mounted on the upstream mounter module 12. Can be implemented.
- the present invention is not limited to the module-type component mounting system having the configuration shown in FIG. 1, and is a component mounting system that sequentially mounts a plurality of types of components with a plurality of mounting machines on a conveyed circuit board. It can be implemented with various changes, such as application.
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Abstract
Description
前述したように、LEDは製造元が同じであっても、輝度クラスがフィーダ毎(テープリール毎)に少しずつ異なるため、部品切れの警告を受けて作業者が取り替えたフィーダのLEDの輝度クラスがそれまでのものと異なる場合があるが、この場合は、LEDが部品切れになった後に上流側の実装機で実装した抵抗部品の抵抗値と、取り替えたフィーダのLEDの輝度クラスとが適合しなくなってしまい、不良基板を生産してしまう結果となる。
まず、図1に基づいてモジュール型部品実装システムの構成を説明する。
モジュール型部品実装システムのベース台11上に、回路基板の搬送方向に隣接して複数台の実装機モジュール12(実装機)が入れ替え可能に整列配置されている。各実装機モジュール12は、本体ベッド13上に、フィーダ14、回路基板搬送装置15、部品撮像装置16、部品装着装置17等を搭載して構成され、上部フレーム18の前面部には、操作パネル部19が設けられている。各実装機モジュール12には、それぞれ割り当てられた種類の部品を供給するフィーダ14がセットされ、各実装機モジュール12の回路基板搬送装置15によって回路基板を順次搬送して部品装着装置17によって回路基板に複数種類の部品を順番に実装する。
現在の部品残数=フィーダ14内の当初の部品残数-実装個数
現在の部品残数-安全余裕度個数<(1+N-K)×基板1枚当りのLED実装個数
=(現在の部品残数-安全余裕度個数)/基板1枚当りのLED実装個数
部品切れ予定基板枚数-基板バッファ数(N-K)<1
=(現在の部品残数-安全余裕度個数)/基板1枚当りのLED実装個数
部品切れ予定基板枚数-基板バッファ数(N-K)<1
(2) LEDを供給するフィーダ14が下流側の実装機モジュール12から取り外されたこと
Claims (13)
- 回路基板の搬送方向に沿って複数台の実装機を整列配置すると共に、各実装機には、それぞれ割り当てられた種類の部品を供給するフィーダを配置し、搬送されてくる回路基板に対して前記複数台の実装機で複数種類の部品を順番に実装する部品実装システムにおいて、
上流側の実装機で実装する部品がそれよりも下流側の実装機で実装する部品の特性を調整する部品である場合、又は、下流側の実装機で実装する部品がそれよりも上流側の実装機で実装する部品の特性を調整する部品である場合に、前記下流側の実装機で実装する部品(以下「下流側実装部品」という)を供給するフィーダの部品残数を計数する部品残数計数手段と、
前記部品残数計数手段で計数した部品残数が所定個数以下になったときに前記下流側実装部品の部品切れと判断して前記上流側の実装機への回路基板の搬入を停止する基板搬入停止手段と
を備えていることを特徴とする部品実装システム。 - 請求項1に記載の部品実装システムにおいて、
前記基板搬入停止手段は、前記部品残数計数手段で計数した部品残数が前記上流側の実装機から前記下流側の実装機までに搬入されている全ての回路基板に前記下流側実装部品を実装するのに必要な部品数以下になったときに当該下流側実装部品の部品切れと判断して前記上流側の実装機への回路基板の搬入を停止することを特徴とする部品実装システム。 - 請求項1に記載の部品実装システムにおいて、
前記基板搬入停止手段は、前記部品残数計数手段で計数した部品残数を所定の安全余裕度個数分だけ少なく見積もって前記下流側実装部品の部品切れか否かを判断することを特徴とする部品実装システム。 - 請求項1に記載の部品実装システムにおいて、
前記基板搬入停止手段は、前記下流側実装部品を供給するフィーダが前記下流側の実装機から取り外されたときに前記上流側の実装機への回路基板の搬入を停止する手段を備えていることを特徴とする部品実装システム。 - 請求項1に記載の部品実装システムにおいて、
前記基板搬入停止手段により前記上流側の実装機への回路基板の搬入が停止された後に停止前と同じ特性の下流側実装部品を供給するフィーダが前記下流側の実装機にセットされたときに前記上流側の実装機への回路基板の搬入を再開する基板搬入再開手段を備えていることを特徴とする部品実装システム。 - 請求項1に記載の部品実装システムにおいて、
前記基板搬入停止手段により前記下流側実装部品の部品切れと判断される前に、当該下流側実装部品に対応する次の部品を供給するフィーダが前記下流側の実装機にセットされて当該次の部品の情報が入力され、又は、当該下流側実装部品を供給するフィーダの部品供給テープに、当該下流側実装部品と同一の特性の部品を収容した部品供給テープを継ぎ合わせて部品を補給するスプライシングを行って当該次の部品の情報が入力され、且つ、当該次の部品の特性が前記部品切れとなる下流側実装部品の特性と一致する場合は、前記下流側実装部品の部品切れと判断されたときでも、前記上流側の実装機への回路基板の搬入を停止しないで生産を継続する生産継続手段を備えていることを特徴とする部品実装システム。 - 回路基板の搬送方向に沿って複数台の実装機を整列配置すると共に、各実装機には、それぞれ割り当てられた種類の部品を供給するフィーダを配置し、搬送されてくる回路基板に対して前記複数台の実装機で複数種類の部品を順番に実装する部品実装システムにおいて、
上流側の実装機で実装する部品がそれよりも下流側の実装機で実装する部品の特性を調整する部品である場合、又は、下流側の実装機で実装する部品がそれよりも上流側の実装機で実装する部品の特性を調整する部品である場合に、前記下流側の実装機で実装する部品(以下「下流側実装部品」という)を供給するフィーダが前記下流側の実装機から取り外されたときに前記上流側の実装機への回路基板の搬入を停止する基板搬入停止手段を備えていることを特徴とする部品実装システム。 - 請求項7に記載の部品実装システムにおいて、
前記基板搬入停止手段により前記上流側の実装機への回路基板の搬入が停止された後に停止前と同じ特性の下流側実装部品を供給するフィーダが前記下流側の実装機にセットされたときに前記上流側の実装機への回路基板の搬入を再開する基板搬入再開手段を備えていることを特徴とする部品実装システム。 - 請求項7に記載の部品実装システムにおいて、
前記下流側実装部品を供給するフィーダが前記下流側の実装機から取り外される前に、当該下流側実装部品に対応する次の部品を供給するフィーダが前記下流側の実装機にセットされて当該次の部品の情報が入力され、且つ、当該次の部品の特性が前記下流側実装部品の特性と一致する場合は、前記フィーダが前記下流側の実装機から取り外されたときでも、前記上流側の実装機への回路基板の搬入を停止しないで生産を継続する生産継続手段を備えていることを特徴とする部品実装システム。 - 回路基板の搬送方向に沿って複数台の実装機を整列配置すると共に、各実装機には、それぞれ割り当てられた種類の部品を供給するフィーダを配置し、搬送されてくる回路基板に対して前記複数台の実装機で複数種類の部品を順番に実装する部品実装方法において、 上流側の実装機で実装する部品がそれよりも下流側の実装機で実装する部品の特性を調整する部品である場合、又は、下流側の実装機で実装する部品がそれよりも上流側の実装機で実装する部品の特性を調整する部品である場合に、前記下流側実装部品を供給するフィーダの部品残数を部品残数計数手段で計数し、計数した部品残数が所定個数以下になったときに部品切れと判断して前記上流側の実装機への回路基板の搬入を停止することを特徴とする部品実装方法。
- 請求項10に記載の部品実装方法において、
前記下流側実装部品の部品切れと判断される前に、当該下流側実装部品に対応する次の部品を供給するフィーダが前記下流側の実装機にセットされて当該次の部品の情報が入力され、又は、当該下流側実装部品を供給するフィーダの部品供給テープに、当該下流側実装部品と同一の特性の部品を収容した部品供給テープを継ぎ合わせて部品を補給するスプライシングを行って当該次の部品の情報が入力され、且つ、当該次の部品の特性が前記部品切れとなる下流側実装部品の特性と一致する場合は、前記下流側実装部品の部品切れと判断されたときでも、前記上流側の実装機への回路基板の搬入を停止しないで生産を継続することを特徴とする部品実装方法。 - 回路基板の搬送方向に沿って複数台の実装機を整列配置すると共に、各実装機には、それぞれ割り当てられた種類の部品を供給するフィーダを配置し、搬送されてくる回路基板に対して前記複数台の実装機で複数種類の部品を順番に実装する部品実装方法において、 上流側の実装機で実装する部品がそれよりも下流側の実装機で実装する部品の特性を調整する部品である場合、又は、下流側の実装機で実装する部品がそれよりも上流側の実装機で実装する部品の特性を調整する部品である場合に、前記下流側の実装機で実装する部品を供給するフィーダが前記下流側の実装機から取り外されたときに前記上流側の実装機への回路基板の搬入を停止することを特徴とする部品実装方法。
- 請求項12に記載の部品実装方法において、
前記下流側実装部品を供給するフィーダが前記下流側の実装機から取り外される前に、当該下流側実装部品に対応する次の部品を供給するフィーダが前記下流側の実装機にセットされて当該次の部品の情報が入力され、且つ、当該次の部品の特性が前記下流側実装部品の特性と一致する場合は、前記フィーダが前記下流側の実装機から取り外されたときでも、前記上流側の実装機への回路基板の搬入を停止しないで生産を継続することを特徴とする部品実装方法。
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CN106664820B (zh) * | 2014-09-02 | 2019-04-19 | 株式会社富士 | 元件安装系统以及元件安装方法 |
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