WO2009082047A1 - Composition à base d'un copolymère styrénique, son procédé de polymérisation et copolymère styrénique obtenu avec ce procédé - Google Patents

Composition à base d'un copolymère styrénique, son procédé de polymérisation et copolymère styrénique obtenu avec ce procédé Download PDF

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Publication number
WO2009082047A1
WO2009082047A1 PCT/KR2007/006866 KR2007006866W WO2009082047A1 WO 2009082047 A1 WO2009082047 A1 WO 2009082047A1 KR 2007006866 W KR2007006866 W KR 2007006866W WO 2009082047 A1 WO2009082047 A1 WO 2009082047A1
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Prior art keywords
styrene
weight
copolymer resin
based copolymer
parts
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PCT/KR2007/006866
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English (en)
Inventor
Youn Chul Kim
Dong Kwon Jung
Kyung Bae Park
Chan Moon Park
Sung Jin Kim
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Dongbu Hitek Co., Ltd.
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Priority to CN2007801020227A priority Critical patent/CN101903461B/zh
Publication of WO2009082047A1 publication Critical patent/WO2009082047A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

Definitions

  • the present invention relates to a styrene-based copolymer resin composition, a polymerization method of the same composition, and a styrene-based copolymer resin prepared therefrom. More specifically, the present invention relates to a styrene-based copolymer resin composition which is capable of achieving excellent appearance quality, heat resistance and light resistance, a polymerization method of the same composition, and a styrene-based copolymer prepared therefrom.
  • Japanese Unexamined Patent Publication No. Hei 11-124461 discloses a method for preparing a copolymer of styrene with alpha- methylstyrene.
  • this method suffers from disadvantages such as coloration problems, low degree of polymerization due to poor reactivity, and insufficient mechanical properties due to low molecular weight.
  • Japanese Unexamined Patent Publication No. Sho 61-278510 discloses a method of improving heat resistance of a styrene resin via preparation of a styrene-methacrylic acid copolymer.
  • 2005-248003 proposes preparation of a terpolymer of styrene, methacrylic acid and alpha-methylstyrene to improve heat resistance, thus preparing a copolymer with excellent strength, transparency, and heat resistance.
  • this method still suffers from disadvantages associated with coloration and light-induced discoloration of the product.
  • Japanese Unexamined Patent Publication No. Japanese Unexamined Patent Publication No.
  • Hei 9-87332 proposes to use 2-ethyl hexanol (iso-octanol), and Japanese Unexamined Patent Publication No. 2006-282962 proposes to use n-octanol.
  • these Japanese patents still have problems as follows.
  • Octanol has a low boiling temperature and therefore is readily volatile upon use of two continuous de- volatilization equipment during a conventional continuous bulk polymerization process. As a result, it is impossible to sufficiently and satisfactorily exert intrinsic functions thereof.
  • PCT WO 2007-034789 attempts to overcome problems associated with acid condensation, via the use of an ethylene glycol plasticizer having a specific structure. This method has shortcomings as follows.
  • the ethylene glycol plasticizer used is not easily volatile in a devolatilization process, but exhibits low reactivity with the anhydride, and non-readily volatile property and consequent incorporation thereof into the final products.
  • the incorporation of the ethylene glycol will cause additional discoloration problems in subsequent processes.
  • the above patent publication suggests incorporation of a UV stabilizer into the resulting styrene-based copolymer resin composition, such a method is not suitable for a large-scale production system because it requires another extrusion process after preparation of the copolymer, and suffers from problems of increased production costs associated with additional manufacturing processes. Disclosure of Invention Technical Problem
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide a composition for preparing a styrene- based copolymer resin having excellent appearance, heat resistance and light resistance while retaining desired moldability, transparency and strength. [5] It is another object of the present invention to provide a method for preparing a styrene -based copolymer resin via polymerization of the same composition. [6] It is a further object of the present invention to provide a styrene-based copolymer resin which is obtained by the above polymerization process, and has excellent appearance quality, heat resistance and light resistance.
  • a styrene-based copolymer resin composition comprising: [8] 100 parts by weight of a monomer composition consisting of 80 to 99.5% by weight of a styrene compound and 0.5 to 20% by weight of a vinyl compound which is copolymerizable with styrene;
  • the plasticizer may be a combination of at least one compound of formula (I) below and at least one compound of formula
  • R represents C -C substituted or unsubstituted alkyl
  • n is an integer of
  • R represents C -C substituted or unsubstituted alkyl, C -C substituted or
  • composition may further comprise
  • the UV stabilizer may be preferably a dimethyl ester-based UV stabilizer.
  • the composition may further comprise 50 to 2,000 ppm of an initiator, based on 100 parts by weight of the monomer composition.
  • a method for preparing a styrene-based copolymer resin comprising: [20] introducing and polymerizing a styrene-based copolymer resin composition in a continuous stirred tank reactor; and [21] transferring the resulting polymerization product to a devolatilizer to remove unreacted monomers and an organic solvent.
  • a recycling solution which was volatilized and condensed from the devolatilizer, is preferably discharged and removed to an external tank.
  • a styrene-based copolymer resin composition in accordance with the present invention is prepared by mixing a monomer composition consisting of a styrene compound and a vinyl compound copolymerizable therewith, and a plasticizer in an organic solvent, and may further comprise a UV stabilizer and an initiator.
  • a copolymer resin composition can improve external appearance quality, heat resistance and light resistance while retaining desired moldability, transparency and strength. Therefore, it is possible to solve problems and disadvantages of a conventional art, particularly associated with poor external appearance of the product encountered with the formation of anhydrides upon copolymerization of a styrene compound with a vinyl compound.
  • a heat-resistant styrene-based copolymer resin composition having excellent light resistance from a commercial point of view. Therefore, a styrene-based copolymer resin, which is obtained from the heat-resistant styrene-based copolymer resin composition of the present invention, exhibits excellent appearance and light resistance, and therefore can be very suitably used for various applications including electric/electronic materials and optical materials.
  • styrene compound used in the resin composition may include, but are not limited to, styrene, o-methylstyrene, p-methylstyrene, t-butylstyrene, a
  • examples of the vinyl compound which is copolymerizable with the styrene compound may include at least one selected from the group consisting of acrylic acid, methacrylic acid and maleic acid, but are not limited thereto. Preferred is methacrylic acid.
  • the styrene compound and the vinyl compound may be used in a ratio of 80 to 99.5% by weight: 0.5 to 20% by weight, preferably 90 to 99% by weight: 1 to 10% by weight. If the content of the vinyl compound in the monomer composition is lower than 0.5% by weight, it is difficult to obtain the desired heat resistance. On the other hand, if the content of the vinyl compound is higher than 20% by weight, the heat resistance is improved, but there are disadvantages associated with increased moisture-absorption property, molding difficulty due to significantly increased viscosity, and discoloration over time.
  • Examples of the organic solvent used in the resin composition may include, but are not limited to, ethylbenzene, toluene and xylene. These organic solvents may be used alone or in any combination thereof. Preferred is ethylbenzene. There is no particular limit to an amount of the organic solvent to be used. For example, 5 to 30 parts by weight of the solvent is preferably used based on 100 parts by weight of the monomer composition. If a content of the organic solvent is lower than 5 parts by weight, it is difficult to obtain a homogeneous mixture of individual components. On the other hand, if a content of the organic solvent is higher than 30 parts by weight, this may dis- advantageously result in a decrease of the reactivity.
  • the resin composition may comprise a combination of at least one plasticizer compound of formula (I) below and at least one plasticizer compound of formula (II) below:
  • R represents C -C substituted or unsubstituted alkyl
  • n is an integer of
  • R represents C -C substituted or unsubstituted alkyl, C -C substituted or
  • the plasticizer having a structure of formula (I) has advantages distinctly different from conventional anhydride-control compounds. That is, the plasticizer of formula (I) is not readily volatilized during the copolymer manufacturing process and has an ability to sufficiently control formation of the anhydride. Further, such a plasticizer compound exhibits no adverse side effects on post-processing, because it remains at a very low level in the resulting copolymer resin.
  • the compound of formula (I) may include, but are not limited to, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, and the like.
  • n has a value of 1 to 3. If the value of n is 4 or higher, a large amount of the plasticizer remains in the resin after preparation of the resin, which may probably result in deterioration of the heat resistance and discoloration of the copolymer during extrusion and injection processes.
  • plasticizer compound of formula (II) may include, but are not limited to, octyl alcohol, decyl alcohol, stearyl alcohol, lauryl alcohol.
  • the plasticizer of formula (II) if the number of carbon atoms is less than 8, the plasticizer compound may be very easily volatilized during the resin manufacturing process. If the number of carbon atoms is more than 30, a large portion of the added plasticizer compound remains in the resulting copolymer resin, which may cause problems in subsequent processes.
  • a content of the plasticizer may be in a range of preferably 0.2 to 5 parts by weight, more preferably 0.5 to 3 parts by weight, based on 100 parts by weight of the monomer composition. If a content of the plasticizer is lower than 0.2 parts by weight, this may lead to deterioration of anhydride control effects. On the other hand, if a content of the plasticizer is higher than 5 parts by weight, the residual plasticizer in the resulting copolymer resin may undesirably cause discoloration of the resin, in conjunction with deterioration of the heat resistance.
  • a content of the plasticizer of formula (I) and a content of the plasticizer of formula (II) may be in a ratio of preferably 5 to 50% by weight:95 to 50% by weight, most preferably 10 to 30% by weight:90 to 70% by weight. If a content of the plasticizer of formula (I) is lower than 5% by weight, this may lead to deterioration of anhydride control effects. On the other hand, if a content of the plasticizer of formula (I) is higher than 50% by weight, this may undesirably lead to deterioration of extrusion properties, in conjunction with some problems associated with discoloration of the resin.
  • the UV stabilizer used in the resin composition may be directly added to a reactor during a continuous bulk polymerization process.
  • benzotriazole- and benzophenone-based stabilizers are widely employed.
  • direct introduction of these UV stabilizer compounds to the reactor during the polymerization process may lead to decreased thermal stability of the UV stabilizer, thus causing additional discoloration of the resin, or problems associated with coloration of the resin due to intrinsic colors of the UV stabilizer, even when the desired thermal stability is secured.
  • the UV stabilizer in combination with the prepared resin pellet has been introduced into a separate compound extrusion process.
  • dimethyl ester-based UV stabilizers exhibit no problems which may occur due to intrinsic colors of the stabilizer, and has excellent light resistance with no additional discoloration even under a continuous bulk polymerization process, due to superior thermal stability.
  • An example of such a UV stabilizer is propanedioic acid [(4-methoxyphenyl)-methylene]dimethyl ester) (Hostavin PR-25 manufactured by Clariant).
  • a content of the UV stabilizer is in a range of preferably 200 to 3,000 ppm (weight/weight), more preferably 500 to 1,500 ppm, based on 100 parts by weight of the monomer composition. If a content of the UV stabilizer is lower than 200 ppm, addition effects of the UV stabilizer are insignificant. On the other hand, if a content of the UV stabilizer is higher than 3,000 ppm, this may lead to decreased heat resistance of the resulting copolymer composition and increased production costs.
  • the resin composition may further comprise an initiator, based on 100 parts by weight of the monomer composition.
  • any conventional initiator may be used without particular limitation.
  • a content of the initiator is in a range of preferably 50 to 2,000 ppm
  • weight/weight more preferably 100 to 1,000 ppm, based on 100 parts by weight of the monomer composition. If the content of the initiator is lower than 50 ppm, addition effects of the initiator are insufficient. On the other hand, if the content of the initiator is higher than 2,000 ppm, this may lead to a decrease of the molecular weight.
  • the copolymer resin can be prepared as follows.
  • plasticizer Even though a total amount of 0.2 to 5 parts by weight of the plasticizer may be added to the first reactor, based on 100 parts by weight of the monomer composition, a portion of the plasticizer may also be directly added to the devolatilizer so as to control formation of anhydrides during the devolatilization process. Even though a total amount of 200 ppm to 3,000 ppm of the UV stabilizer may be added to the first reactor, based on 100 parts by weight of the monomer composition, it is preferred to add the plasticizer directly to the devolatilizer so as to avoid thermal history if possible.
  • a polymerization temperature of the first reactor is in a range of 100 0 C to 14O 0 C, and a polymerization temperature of the second reactor is preferably 0 to 15 0 C higher than that of the first reactor. This is because it is possible to improve a conversion rate of the monomer composition into a polymer. If the polymerization temperature of the first reactor is less than 100 0 C, this may lead to a significant decrease in a conversion rate of the monomer composition into a polymer. Further, irrespective of first and second reactors, the polymerization temperature of the reactor should not exceed 155 0 C. If the polymerization temperature of the reactor is higher than 155 0 C, this may lead to rapid reaction which makes it difficult to control physical properties of the reaction product. Under such reaction conditions, a 50 to 70% conversion of the monomer into the polymer may be achieved in the reactor.
  • the thus-polymerized polymer is then transferred to two devolatilizers which are connected in series, and the unreacted monomer and the organic solvent are volatilized from the reaction solution to thereby separate polymers.
  • This step minimizes a residual content of the monomer and oligomer in the final copolymer resin product to thereby improve the heat resistance and rigidity of the resin.
  • the de volatilization process of the resulting polymer is preferably carried out at a high temperature of 200 to 25O 0 C under vacuum of about 20 Torr. If the devolatilization process is carried out below 200 0 C, insufficient separation of the unreacted monomer may be responsible for deterioration of the heat resistance, and coloration of the product.
  • the added plasticizer and UV stabilizer are readily degradable and volatile, so it is impossible to obtain the desired copolymer resin composition, and the polymer degradation and unwanted additional reactions may lead to poor appearance of the resulting polymer in conjunction with decreased heat resistance and rigidity.
  • the composition of the recycling solution which is volatilized in the devolatilizer and is then condensed and re-introduced into the reactor, is comprised of styrene, vinyl compound copolymerizable therewith, organic solvent, plasticizer, and other impurities.
  • the recycling solution is comprised of more than 95% by weight of determinable components such as styrene, vinyl compound copolymerizable therewith, organic solvent and plasticizer, and less than 5% by weight of other impurities.
  • the impurities are composed largely of components such as oligomer, hi- boiler, cumene, and alpha-MS.
  • the present invention it is possible to prevent deterioration of light resistance of the polymerization product, i.e. styrene-based copolymer resin by discharge of the recycling solution to an external tank, without re-introduction thereof to the reactor.
  • the polymerization product i.e. styrene-based copolymer resin
  • the styrene-based copolymer resin of the present invention as obtained by the above-mentioned process can improve appearance quality, heat resistance and light resistance of a product while retaining the moldability, transparency and strength which are exhibited by conventional styrene copolymer resins. Accordingly, the resin of the present invention can be usefully used for a variety of applications including extruded sheets and injection-molded articles.
  • the present invention provides a styrene-based copolymer resin composition and a method for preparing the same, which are capable of simply overcoming problems associated with deterioration of light resistance due to UV exposure and poor external appearance of the resin composition due to formation of anhydrides, which were commonly suffered by conventional heat-resistant styrene- based copolymer resin compositions, without the need for a complicated process.
  • the heat-resistant styrene-based copolymer resin of the present invention which is obtained by the aforesaid composition and method, has improved appearance and light resistance based on excellent heat resistance. Therefore, the styrene-based copolymer of the present invention can be widely used for various applications including electric/ electronic products and optical products. Best Mode for Carrying Out the Invention
  • MAA monomer composition
  • ethylbenzene 14 parts by weight of ethylbenzene
  • 2-ethylhexanol 1 part by weight of diethylene glycol monobutylether
  • 200 ppm of propanedioic acid [(4-methoxyphenyl)-methylene]-dimethyl ester (Hostavin PR-25 manufactured by Clariant)
  • 100 ppm of propanedioic acid [(4-methoxyphenyl)-methylene]-dimethyl ester (Hostavin PR-25 manufactured by Clariant)
  • a pellet- like copolymer resin was prepared in the same manner as in Example 1, except that 2 parts by weight of 2-ethylhexanol and 3 parts by weight of diethylene glycol monobutylether as plasticizers were added.
  • a pellet- like copolymer resin was prepared in the same manner as in Example 1 , except that 1.5 parts by weight of 2-ethylhexanol and 0.5 parts by weight of diethylene glycol monobutylether as plasticizers were added.
  • MAA monomer composition
  • ethylbenzene 20 parts by weight of ethylbenzene
  • 2-ethylhexanol 1 part by weight of diethylene glycol monobutylether
  • 200 ppm of propanedioic acid [(4-methoxyphenyl)-methylene] -dimethyl ester 200 ppm of propanedioic acid [(4-methoxyphenyl)-methylene] -dimethyl ester (Hostavin PR-25 manufactured by Clariant).
  • the thus-prepared reaction mixture was introduced into a reactor which is serially connected, and a pellet-like copolymer resin was prepared in the same manner as in Example 1.
  • MAA monomer composition
  • ethylbenzene 12 parts by weight of ethylbenzene
  • 2-ethylhexanol 2 parts by weight of 2-ethylhexanol
  • diethylene glycol monobutylether 200 ppm of propanedioic acid [(4-methoxyphenyl)-methylene]-dimethyl ester
  • Example 6 a pellet- like copolymer resin was prepared using the thus-prepared reaction mixture.
  • a pellet- like copolymer resin was prepared in the same manner as in Example 2, except that 700 ppm of propanedioic acid [(4-methoxyphenyl)-methylene]-dimethyl ester (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer for a copolymer resin composition was added.
  • Example 7 propanedioic acid [(4-methoxyphenyl)-methylene]-dimethyl ester (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer for a copolymer resin composition was added.
  • a pellet- like copolymer resin was prepared in the same manner as in Example 2, except that 1500 ppm of propanedioic acid [(4-methoxyphenyl) -methylene] -dimethyl ester (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer for a copolymer resin composition was added.
  • Comparative Example 1 Comparative Example 1
  • a pellet- like copolymer resin was prepared in the same manner as in Example 1 , except that 75 parts by weight of styrene (SM) and 25 parts by weight of methacrylic acid (MAA) were mixed to prepare a monomer composition, and 20 parts by weight of ethylbenzene and 4 parts by weight of 2-ethylhexanol were added to 100 parts by weight of the monomer composition.
  • SM styrene
  • MAA methacrylic acid
  • Comparative Example 2 A pellet- like copolymer resin was prepared in the same manner as in Example 1, except that 0.2 parts by weight of 2-ethylhexanol and 0.2 parts by weight of diethylene glycol monobutylether as a plasticizer for a copolymer resin composition were added, and 2,2-bis(4,4-di-t-butylperoxycyclohexyl)propane (Pertetra-A, available from NOF
  • a pellet- like copolymer resin was prepared in the same manner as in Example 1 , except that 4 parts by weight of 2-ethylhexanol as a plasticizer for a copolymer resin composition were used alone.
  • Comparative Example 4 Comparative Example 4
  • a pellet- like copolymer resin was prepared in the same manner as in Example 1, except that 3 parts by weight of diethylene glycol monobutylether as a plasticizer for a copolymer resin composition were used alone.
  • Comparative Example 5 Comparative Example 5
  • a pellet-like copolymer resin was prepared in the same manner as in Example 2, except that propanedioic acid (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer was not added to a copolymer resin composition.
  • propanedioic acid Hostavin PR-25 manufactured by Clariant
  • a pellet-like copolymer resin was prepared in the same manner as in Example 2, except that 100 ppm of propanedioic acid (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer was added to a copolymer resin composition.
  • propanedioic acid Hostavin PR-25 manufactured by Clariant
  • a pellet-like copolymer resin was prepared in the same manner as in Example 2, except that 50% of a recycling solution volatilized from a devolatilizer was recovered and used by a solution preparation apparatus.
  • a pellet-like copolymer resin was prepared in the same manner as in Example 2, except that 100% of a recycling solution volatilized from a devolatilizer was recovered and used by a solution preparation apparatus. Comparative Example 9
  • a pellet-like copolymer resin was prepared in the same manner as in Example 2, except that 100% of a recycling solution volatilized from a devolatilizer was recovered and recycled to a reactor, and propanedioic acid (Hostavin PR-25 manufactured by Clariant) as a UV stabilizer was not added to a copolymer resin composition.
  • propanedioic acid Hostavin PR-25 manufactured by Clariant
  • the light resistance was evaluated in terms of color difference ( ⁇ YI).
  • ⁇ YI color difference
  • pellets obtained in Examples 1 to 7 and Comparative Examples 1 to 9 were processed into injection-molded specimens having a thickness of 2 mm at 23O 0 C. Then, the specimens were subjected to UV-con (QUV, Q-Lab Corp., USA) using a color difference meter (ZE 2000, Nippon Denshoku, Japan) at 230 0 C for 500 hours.
  • YI ( ⁇ YI) difference was determined before and after the specimens were subjected to the test for 500 hours.
  • Amount of a recycling solution used percentage (%) of the recovered recycling solution recycled to the reactor.
  • a composition ratio of the recycling solution was controlled within a range containing 58 to 60 parts by weight of styrene, 0.5 to 1.5 parts by weight of methacrylic acid, 34 to 36 parts by weight of ethylbenzene, 0.5 to 1 part by weight of a plasticizer, and 3 to 4 parts by weight of impurities.
  • UV stabilizer Propanedioic acid [(4-methoxyphenyl) -methylene] -dimethyl ester
  • composition ratio of the recycling solution was controlled within a range containing 58 to 60 parts by weight of styrene, 0.5 to 1.5 parts by weight of methacrylic acid, 34 to 36 parts by weight of ethylbenzene, 0.5 to 1 part by weight of a plasticizer, and 3 to 4 parts by weight of impurities.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

La présente invention concerne une composition de résine à base d'un copolymère styrénique, son procédé de polymérisation et un copolymère styrénique préparé à partir dudit procédé. De manière spécifique, la présente invention concerne une composition de résine à base d'un copolymère styrénique capable d'obtenir une excellente qualité esthétique, une excellente résistance thermique ainsi qu'une excellente résistance à la lumière. L'invention concerne également le procédé de polymérisation de ladite composition et un copolymère styrénique préparé avec ce procédé.
PCT/KR2007/006866 2007-12-21 2007-12-27 Composition à base d'un copolymère styrénique, son procédé de polymérisation et copolymère styrénique obtenu avec ce procédé WO2009082047A1 (fr)

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CN2007801020227A CN101903461B (zh) 2007-12-21 2007-12-27 苯乙烯系共聚物的组合物、该组合物的聚合方法以及由该方法得到的苯乙烯系共聚物

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KR1020070135428A KR100896946B1 (ko) 2007-12-21 2007-12-21 스티렌계 공중합 수지 조성물, 이 조성물의 중합방법 및이로부터 얻어진 스티렌계 공중합 수지
KR10-2007-0135428 2007-12-21

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JP2018145309A (ja) * 2017-03-06 2018-09-20 東洋スチレン株式会社 光学用スチレン系樹脂組成物、成形品および導光体
CN113072777A (zh) * 2021-04-02 2021-07-06 惠州仁信新材料股份有限公司 一种具有良好强度的透明聚苯乙烯树脂及其制备方法

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JP7064827B2 (ja) 2017-03-06 2022-05-11 東洋スチレン株式会社 光学用スチレン系樹脂組成物、成形品および導光体
CN113072777A (zh) * 2021-04-02 2021-07-06 惠州仁信新材料股份有限公司 一种具有良好强度的透明聚苯乙烯树脂及其制备方法

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