WO2009075196A1 - Ruban adhésif double face pour traitement de semi-conducteur et ruban pour traitement de semi-conducteur - Google Patents

Ruban adhésif double face pour traitement de semi-conducteur et ruban pour traitement de semi-conducteur Download PDF

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Publication number
WO2009075196A1
WO2009075196A1 PCT/JP2008/071711 JP2008071711W WO2009075196A1 WO 2009075196 A1 WO2009075196 A1 WO 2009075196A1 JP 2008071711 W JP2008071711 W JP 2008071711W WO 2009075196 A1 WO2009075196 A1 WO 2009075196A1
Authority
WO
WIPO (PCT)
Prior art keywords
supporting plate
semiconductor processing
tape
sided adhesive
semiconductor wafer
Prior art date
Application number
PCT/JP2008/071711
Other languages
English (en)
Japanese (ja)
Inventor
Yangsoo Lee
Daihei Sugita
Yuichi Sumii
Yasuhiko Oyama
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008088236A external-priority patent/JP2009001773A/ja
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to JP2008555545A priority Critical patent/JP5001955B2/ja
Priority to KR1020107010414A priority patent/KR101386367B1/ko
Publication of WO2009075196A1 publication Critical patent/WO2009075196A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention porte sur un ruban adhésif double face pour traitement de semi-conducteur qui est utilisé dans le but de renforcer une tranche de semi-conducteur durant une fabrication de puce de circuit intégré (CI) par fourniture d'une adhésion entre la tranche de semi-conducteur et une plaque de support, une séparation entre le ruban adhésif double face et la plaque de support étant assurée de façon aisée et sûre par application d'une stimulation donnée. Un ruban adhésif double face pour traitement de semi-conducteur, qui est utilisé dans le but de renforcer une tranche de semi-conducteur durant une fabrication de puce CI par fourniture d'une adhésion entre la tranche de semi-conducteur et une plaque de support, comprend un matériau de base et des couches d'adhésif formées sur les deux côtés du matériau de base, l'une des couches d'adhésif placées du côté qui adhère à la plaque de support contenant un agent de formation de gaz qui génère un gaz par stimulation, en même temps, le matériau de base du côté en contact avec la couche d'adhésif placée du côté adhérant à la plaque de support est soumis par points à un traitement de décollement, et si « x » est le diamètre des points de traitement de décollement, et « y » est le nombre de points par cm2, « x » et « y » sont inclus dans l'intervalle entouré par des lignes brisées A, B et C sur la figure 4.
PCT/JP2008/071711 2007-12-12 2008-11-28 Ruban adhésif double face pour traitement de semi-conducteur et ruban pour traitement de semi-conducteur WO2009075196A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008555545A JP5001955B2 (ja) 2007-12-12 2008-11-28 半導体加工用両面粘着テープ
KR1020107010414A KR101386367B1 (ko) 2007-12-12 2008-11-28 반도체 가공용 양면 점착 테이프 및 반도체 가공용 테이프

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-320587 2007-12-12
JP2007320587 2007-12-12
JP2008-088236 2008-03-28
JP2008088236A JP2009001773A (ja) 2007-05-21 2008-03-28 半導体加工用テープ

Publications (1)

Publication Number Publication Date
WO2009075196A1 true WO2009075196A1 (fr) 2009-06-18

Family

ID=40755439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071711 WO2009075196A1 (fr) 2007-12-12 2008-11-28 Ruban adhésif double face pour traitement de semi-conducteur et ruban pour traitement de semi-conducteur

Country Status (3)

Country Link
JP (2) JP5001955B2 (fr)
KR (1) KR101386367B1 (fr)
WO (1) WO2009075196A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012062368A (ja) * 2010-09-14 2012-03-29 Sekisui Chem Co Ltd 硬化性接着剤組成物及び部材の加工方法
JP2012151459A (ja) * 2010-12-28 2012-08-09 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
JP2013231159A (ja) * 2012-04-06 2013-11-14 Sekisui Chem Co Ltd 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
JP2014107314A (ja) * 2012-11-26 2014-06-09 Dainippon Screen Mfg Co Ltd 剥離補助方法および剥離補助装置
JP2015093972A (ja) * 2013-11-14 2015-05-18 パナック株式会社 工程用保護フィルム
WO2016140176A1 (fr) * 2015-03-02 2016-09-09 古河電気工業株式会社 Ruban adhésif pour protéger une surface de plaquette de semi-conducteur, et procédé de traitement d'une plaquette de semi-conducteur
JP2017082094A (ja) * 2015-10-28 2017-05-18 積水化学工業株式会社 半導体加工用両面粘着テープ
JP2017101139A (ja) * 2015-12-01 2017-06-08 積水化学工業株式会社 半導体加工用両面粘着テープ
WO2019221065A1 (fr) * 2018-05-18 2019-11-21 積水化学工業株式会社 Bande adhésive et procédé de fabrication d'un composant électronique
JP2020080411A (ja) * 2020-01-31 2020-05-28 積水化学工業株式会社 半導体加工用両面粘着テープ
WO2020129987A1 (fr) * 2018-12-20 2020-06-25 積水化学工業株式会社 Ruban adhésif et procédé de fabrication d'un composant électronique
CN113272399A (zh) * 2019-04-26 2021-08-17 积水化学工业株式会社 粘合带
TWI817585B (zh) * 2022-06-28 2023-10-01 山太士股份有限公司 光固化保護膠帶及加工方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5639280B2 (ja) * 2012-08-10 2014-12-10 積水化学工業株式会社 ウエハの処理方法
JP6014455B2 (ja) * 2012-10-19 2016-10-25 富士フイルム株式会社 半導体装置の製造方法
JP6068279B2 (ja) * 2012-12-27 2017-01-25 富士フイルム株式会社 半導体装置製造用仮接合層、積層体、及び、半導体装置の製造方法
JP6751312B2 (ja) * 2016-06-02 2020-09-02 日東電工株式会社 真空プロセス用粘着テープ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321886A (ja) * 1997-05-21 1998-12-04 Shibata Ind Co Ltd 太陽電池モジュールの製造方法
JP2003231872A (ja) * 2001-08-03 2003-08-19 Sekisui Chem Co Ltd 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP2004277530A (ja) * 2003-03-14 2004-10-07 Lintec Corp 粘着シート及び粘着シートの製造方法
JP2004277534A (ja) * 2003-03-14 2004-10-07 Lintec Corp 粘着シート及びその製造方法
JP2006070122A (ja) * 2004-09-01 2006-03-16 Shindo Seni Kogyo Kk 多孔質シート用エマルション型シリコーン粘着剤組成物および再剥離性粘着シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4404526B2 (ja) * 2002-07-11 2010-01-27 積水化学工業株式会社 接着性物質、片面粘着テープ及び両面粘着テープ
JP2004193237A (ja) * 2002-12-10 2004-07-08 Disco Abrasive Syst Ltd 粘着シートを具備するウェハー保持部材，及び粘着シートの剥離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321886A (ja) * 1997-05-21 1998-12-04 Shibata Ind Co Ltd 太陽電池モジュールの製造方法
JP2003231872A (ja) * 2001-08-03 2003-08-19 Sekisui Chem Co Ltd 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP2004277530A (ja) * 2003-03-14 2004-10-07 Lintec Corp 粘着シート及び粘着シートの製造方法
JP2004277534A (ja) * 2003-03-14 2004-10-07 Lintec Corp 粘着シート及びその製造方法
JP2006070122A (ja) * 2004-09-01 2006-03-16 Shindo Seni Kogyo Kk 多孔質シート用エマルション型シリコーン粘着剤組成物および再剥離性粘着シート

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012062368A (ja) * 2010-09-14 2012-03-29 Sekisui Chem Co Ltd 硬化性接着剤組成物及び部材の加工方法
JP2012151459A (ja) * 2010-12-28 2012-08-09 Sekisui Chem Co Ltd ダイシングテープ及び半導体チップの製造方法
JP2013231159A (ja) * 2012-04-06 2013-11-14 Sekisui Chem Co Ltd 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
JP2014107314A (ja) * 2012-11-26 2014-06-09 Dainippon Screen Mfg Co Ltd 剥離補助方法および剥離補助装置
JP2015093972A (ja) * 2013-11-14 2015-05-18 パナック株式会社 工程用保護フィルム
WO2016140176A1 (fr) * 2015-03-02 2016-09-09 古河電気工業株式会社 Ruban adhésif pour protéger une surface de plaquette de semi-conducteur, et procédé de traitement d'une plaquette de semi-conducteur
JP2017082094A (ja) * 2015-10-28 2017-05-18 積水化学工業株式会社 半導体加工用両面粘着テープ
JP2017101139A (ja) * 2015-12-01 2017-06-08 積水化学工業株式会社 半導体加工用両面粘着テープ
WO2019221065A1 (fr) * 2018-05-18 2019-11-21 積水化学工業株式会社 Bande adhésive et procédé de fabrication d'un composant électronique
WO2020129987A1 (fr) * 2018-12-20 2020-06-25 積水化学工業株式会社 Ruban adhésif et procédé de fabrication d'un composant électronique
CN113272399A (zh) * 2019-04-26 2021-08-17 积水化学工业株式会社 粘合带
JP2020080411A (ja) * 2020-01-31 2020-05-28 積水化学工業株式会社 半導体加工用両面粘着テープ
TWI817585B (zh) * 2022-06-28 2023-10-01 山太士股份有限公司 光固化保護膠帶及加工方法

Also Published As

Publication number Publication date
KR101386367B1 (ko) 2014-04-16
JP2012109585A (ja) 2012-06-07
JP5001955B2 (ja) 2012-08-15
JP5039232B2 (ja) 2012-10-03
KR20100098601A (ko) 2010-09-08
JPWO2009075196A1 (ja) 2011-04-28

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