WO2009072341A1 - プローブ装置 - Google Patents

プローブ装置 Download PDF

Info

Publication number
WO2009072341A1
WO2009072341A1 PCT/JP2008/067272 JP2008067272W WO2009072341A1 WO 2009072341 A1 WO2009072341 A1 WO 2009072341A1 JP 2008067272 W JP2008067272 W JP 2008067272W WO 2009072341 A1 WO2009072341 A1 WO 2009072341A1
Authority
WO
WIPO (PCT)
Prior art keywords
elastic sheet
intermediate body
contact structure
inspection
probe apparatus
Prior art date
Application number
PCT/JP2008/067272
Other languages
English (en)
French (fr)
Other versions
WO2009072341A9 (ja
Inventor
Shigekazu Komatsu
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to JP2009544609A priority Critical patent/JPWO2009072341A1/ja
Publication of WO2009072341A1 publication Critical patent/WO2009072341A1/ja
Publication of WO2009072341A9 publication Critical patent/WO2009072341A9/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

　プローブ装置に設けられたプローブカードの回路基板の下面側に、検査用接触構造体が取り付けられる。検査用接触構造体は、中間体と、当該中間体の上面に取り付けられた上面弾性シートと、中間体の下面に取り付けられた下面弾性シートを備えた３層構造を有している。回路基板と検査用接触構造体の間には、ピッチ変換基板が設けられている。ピッチ変換基板の上面には、下面弾性シートの導電部と被検査体との接触圧力を一定の圧力に維持するアクチュエータが設けられている。
PCT/JP2008/067272 2007-12-04 2008-09-25 プローブ装置 WO2009072341A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009544609A JPWO2009072341A1 (ja) 2007-12-04 2008-09-25 プローブ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007313524 2007-12-04
JP2007-313524 2007-12-04

Publications (2)

Publication Number Publication Date
WO2009072341A1 true WO2009072341A1 (ja) 2009-06-11
WO2009072341A9 WO2009072341A9 (ja) 2009-12-03

Family

ID=40717523

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067272 WO2009072341A1 (ja) 2007-12-04 2008-09-25 プローブ装置

Country Status (3)

Country Link
JP (1) JPWO2009072341A1 (ja)
TW (1) TW200937021A (ja)
WO (1) WO2009072341A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043223A1 (ja) * 2009-10-09 2011-04-14 東京エレクトロン株式会社 アクチュエータ素子およびシート状アクチュエータ
KR101358788B1 (ko) 2012-09-27 2014-02-24 (주)티에스이 고밀도 프로브 카드 및 그 제조방법
KR101434067B1 (ko) * 2009-10-01 2014-08-25 도쿄엘렉트론가부시키가이샤 프로브 카드
JP2017063104A (ja) * 2015-09-24 2017-03-30 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
EP3258279A1 (en) * 2016-06-16 2017-12-20 Multitest elektronische Systeme GmbH Pressing device and method of pressing a carrier against an electrical contact unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5690321B2 (ja) * 2012-11-29 2015-03-25 株式会社アドバンテスト プローブ装置および試験装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293934A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 半導体素子検査装置
JPH01235344A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体検査装置及び半導体ウェハの検査方法
JPH0677295A (ja) * 1992-05-20 1994-03-18 Nec Corp プローブカード
JPH08327690A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウエハ検査装置および半導体ウエハ検査方法
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
WO2006095759A1 (ja) * 2005-03-08 2006-09-14 Tokyo Electron Limited 接続ピンの形成方法，プローブ，接続ピン，プローブカード及びプローブカードの製造方法
JP2007235031A (ja) * 2006-03-03 2007-09-13 Advantest Corp 半導体試験装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293934A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 半導体素子検査装置
JPH01235344A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体検査装置及び半導体ウェハの検査方法
JPH0677295A (ja) * 1992-05-20 1994-03-18 Nec Corp プローブカード
JPH08327690A (ja) * 1995-05-31 1996-12-13 Nec Yamagata Ltd 半導体ウエハ検査装置および半導体ウエハ検査方法
JP2006194620A (ja) * 2005-01-11 2006-07-27 Tokyo Electron Ltd プローブカード及び検査用接触構造体
WO2006095759A1 (ja) * 2005-03-08 2006-09-14 Tokyo Electron Limited 接続ピンの形成方法，プローブ，接続ピン，プローブカード及びプローブカードの製造方法
JP2007235031A (ja) * 2006-03-03 2007-09-13 Advantest Corp 半導体試験装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101434067B1 (ko) * 2009-10-01 2014-08-25 도쿄엘렉트론가부시키가이샤 프로브 카드
WO2011043223A1 (ja) * 2009-10-09 2011-04-14 東京エレクトロン株式会社 アクチュエータ素子およびシート状アクチュエータ
KR101358788B1 (ko) 2012-09-27 2014-02-24 (주)티에스이 고밀도 프로브 카드 및 그 제조방법
JP2017063104A (ja) * 2015-09-24 2017-03-30 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
WO2017051625A1 (ja) * 2015-09-24 2017-03-30 東京エレクトロン株式会社 インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
KR20180040687A (ko) * 2015-09-24 2018-04-20 도쿄엘렉트론가부시키가이샤 인터페이스 장치, 인터페이스 유닛, 프로브 장치 및 접속 방법
KR102001351B1 (ko) 2015-09-24 2019-07-17 도쿄엘렉트론가부시키가이샤 인터페이스 장치, 인터페이스 유닛, 프로브 장치 및 접속 방법
TWI688023B (zh) * 2015-09-24 2020-03-11 日商東京威力科創股份有限公司 介面裝置、介面單元、探針裝置及連接方法
EP3258279A1 (en) * 2016-06-16 2017-12-20 Multitest elektronische Systeme GmbH Pressing device and method of pressing a carrier against an electrical contact unit

Also Published As

Publication number Publication date
JPWO2009072341A1 (ja) 2011-04-21
WO2009072341A9 (ja) 2009-12-03
TW200937021A (en) 2009-09-01

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