200937021 - 六、發明說明： . 【發明所屬之技術領域】 [0001] 本發明係關於檢查受檢查體之電特性之探針裝置。 【先前技術】 [0002] ❹ 例如形成在半導體晶圓上之積體電路 電路之電特性檢查，係使用探針I置進行。探電子 2，例如具電路基板或多數探針銷;以及載3置相 [0003] 然而，近年來電子電路之圖案微細化進展， ，取亟墊之間隔愈來愈窄’因此要求與電極塾 窄 ❿ 器及安裝在其上下面之彈性片所構成。該等“性片中： 二”彈性之多數導電部從成為絕緣部之片體的 ^ 電部以極微細且窄間距形成。又，彈性片為 膠製體之凹凸吸收性或衝擊吸收性等，使關如具彈性之橡 [0004] 並且，藉由使該彈性片接觸晶圓之電極墊，而進 通㈣酬㈣度，而達成 [專利文獻1]日本特開2006—194620號公報 200937021 【發明内容】 (發明欲解決之問題） [0005] 性』構造體反複進行電子電路之電特 極墊接觸時’有時彈性片劣化前與劣化後，强 ^片/、電極墊之接願力會相異。其結果，树 墊之間會產生接觸不良。 片/、電極 [0006] ❹ 鲁 使檢測檢查用接觸構造體與電極墊間之接觸壓力並且 該，壓力’控制彈性片與電極频之接觸，亦難以 測接賴力’树會發生與上辆樣接觸不良。 前端t:且造f而言，使用為懸臂樑構造且 複檢查’職觸件前端耗。如此， 異。复別；土ί時接觸件與電極墊間的接觸壓力會相 [0008] 、、°果，有時接觸件與電極墊之間會發生接觸不良。 睡，明有鑑於該點而纟’目的在於使受檢查體之電特性檢查 &，私查用接觸構造體與受檢查體穩定地接觸。 (解決問題之方式） [0009] 之電實述目的’本發明係—種探針裝置’触受檢查體 式把，匕3 ·電路基板；檢查用接觸構造體，設置於該電路 檢查卵，職辦達成該受檢查體與該基板之間 ㈣，，支持構件，設置於該電路基板與該檢查用 之間，支持該檢查用接觸構造體； 查用固 200937021 [0010] 生固is用，係利峨或電力等使在固定方向產 力：壓力之作用點位置而產生該固定壓 抑r 在檢知接觸構賴之支持構件頂面設置 以杳Li觸Ξ 2進行受檢查體檢查，檢查用接觸構造體與 3 利用致動11使受檢查體於停止在任意位置之 。於此情形，不會由於受檢查體之停止 ^置(檢查用接觸構造體之位置)而造成接觸壓力變化。依此方式， 由於對於檢查用接觸構造體施加之壓力能時常為固定，因此，例200937021 - VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a probe device for inspecting electrical characteristics of a test object. [Prior Art] [0002] For example, electrical characteristic inspection of an integrated circuit formed on a semiconductor wafer is performed using a probe I. Electroscope 2, for example, with a circuit board or a plurality of probe pins; and a load-carrying phase [0003] However, in recent years, the pattern refinement of electronic circuits has progressed, and the spacing between the mats has become narrower and narrower. The narrow jaw is composed of an elastic piece mounted on the upper and lower sides thereof. In the "sex sheet", most of the conductive portions of the elastic portion are formed at a very fine and narrow pitch from the electric portion of the sheet which is the insulating portion. Further, the elastic sheet is a concave-convex absorbing property or an impact absorbing property of the rubber body, and is made of an elastic rubber. [0004] And, by bringing the elastic sheet into contact with the electrode pad of the wafer, the opening (four) is paid (four degrees). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-194620 No. 200937021 [Description of the Invention] (Problems to be Solved by the Invention) [0005] When a structure repeatedly contacts an electric pole of an electronic circuit, it is sometimes elastic. Before and after the deterioration of the sheet, the force of the strong film/electrode pad will be different. As a result, contact failure occurs between the mats. Sheet/, electrode [0006] 鲁 Lu makes the contact pressure between the contact structure and the electrode pad for inspection and inspection, and the pressure 'controls the contact between the elastic piece and the electrode frequency, and it is also difficult to measure the relationship between the tree and the vehicle. Poor contact. For the front end t: and the f is used, the cantilever beam structure is used and the front end of the contact is used. So, different. The contact pressure between the contact piece and the electrode pad will be [0008], and the contact between the contact piece and the electrode pad may be poor. Sleeping, in view of this point, the purpose is to make the electrical property inspection of the test object & the contact structure for private inspection and the test object stably contact. (Means for Solving the Problem) [0009] The purpose of the present invention is 'the present invention is a type of probe device' that is in contact with a test body, a circuit board, a contact structure for inspection, and a test object installed in the circuit. Between the test object and the substrate (4), a support member is provided between the circuit board and the inspection, and the inspection contact structure is supported; the inspection solid is used 200937021 [0010] The fixed pressure is generated by the force in the fixed direction: the position of the action point of the pressure, and the top surface of the support member that is in contact with the contact is set to check the object to be inspected, and the contact for inspection is used. The structure and the 3 use the actuation 11 to stop the object to be in any position. In this case, the contact pressure does not change due to the stop of the object to be inspected (the position of the contact structure for inspection). In this way, since the pressure applied to the contact structure for inspection is often fixed, the example is
檢ifΐΐ構造，之底面設置彈性片而使彈性片接觸受;^查 體夺，Ρ使反複進行受檢查體檢查而彈性片劣化，亦能使檢查 接?構造體穩定地接觸受檢查體。又，例如驗查用接觸構&體 而e ’使用懸臂樑構造之探針並使探針之接觸件接觸受檢查體 時’即使反複進行受檢查體檢查而使接觸件磨耗，亦能使&查用 接觸構造體穩定地接觸受檢查體。 [0011] /亦可具備控制部，該控制部控制前述檢查用接觸構造體與前 述受檢查體接觸時為固定壓力，且前述控制部控制前述致動器内 之壓力，使得前述檢查用接觸構造體之電阻値成為既定値。 [0012] 亦可更具備電阻測定器，該電阻測定器測定前述檢查用接觸 構造體之電阻値，且前述控制部依據由前述電阻測定器測定之前 述檢查用接觸構造體之電阻値，控制前述致動器内之壓力，使得 該經測定之電阻値成為前述既定値。 [0013] 於剷述檢查用接觸構造體之至少底面，可設置於檢查時接觸 前述受檢查體之彈性片。又，該檢查用接觸構造體可具有3層構 造，該3層構造包含：平板狀中間體，及安裝在該中間體上下兩 面之彈性片。再者，於前述電路基板設置電子電路之多數連接端 子，前述支持構件可為變更前述電路基板之多數連接端子之間隔 200937021 的間距變換基板。 [0014] 前述檢查用接觸構造體，亦可具有：標部，受懸样 述支，構件；及，件’從前述樑部之自由端部往前述=杳^ 側延伸，並於檢查時接觸前述受檢查體。 檢—體 [0015] 可於前述電路基板之上方，設置有岐 =述賴剛__顺構 ㈣主ί照觀點之本發明，為—種探針裝置，檢查受檢杳體之 ;ίΐ檢=於檢查時達成該受檢查體與該電路基= 2導通，固持構件，固持受檢查體使得對向於該檢查用接觸構造 於固述支持構件之底面，言史置有致動器，該致 觸構造體無受檢查體之接繼力為©定壓力°。、…w <前述檢查用接觸構造體之至少底面，可設 i双=之彈性片。x，該前述檢查用接觸構造體了可且3 ^ 二彈以構造包含平板狀申間體，及安裝在該中間= [0018] 如述檢查用接觸構造體，亦可具有： 由端支持於該支持構件；及接觸件，從該樑部之自 ⑹她查體側延伸，並於檢查時接觸該受檢查』:之自 前述致動器，可設多個。 [0020] 下方 向之;====數致動器各自於上 200937021 * [0021] 時之部亦可控繼檢㈣觸構频與該錯查體接觸 (發明之效果） [0022] 造體受s檢查體之電特性檢查，使檢查用接觸構 【實施方式】 ❹ ❹ (實施發明之最佳形態） [0025] 能之f佳實施形態加以説明。圖1顯示本實施形 心之私針裝置1構成概略縱剖面圖。 [0026] 於探針裝置1上’設置例如：探針卡2 ;及載置a 3 查體之晶圓W。探針卡2，配置於載置台3之^方。 之晶例如：電路基板1〇，用於對於載置於載置台3 電路細查狀電訊號；及檢查用侧構造體11，安裝在 板κΓ與日:與晶圓w之電極塾u接_達成電路基 .J 置有間距變換基板12，該間距變換基板12 古 體11之支持構件。於間距變換==持 觸ίίϊίΛ該致動11 14經由推壓構件13而維持檢5接 ^體與晶，之電極墊U之接觸壓力為查用接 固定電^^且^^^外周部之作為固定構件的支心 ^ ^tr：^ ^ 基板10 ’與未圖示之職機電連接，從測試機能將檢查用之^ 200937021 號對於下方之檢查用連接構造體η收發訊 iiTfri0 10 ? t；；i =0之底面，形成該電子電路之多數連接端子i〇r電路 間距變換基板12,由設置在其頂盥 支持構件16所支持。於間距變換 板1G底面之間的 之上部端子丨 Φ 鲁 土板〇之連接端子10a，兩者之間設詈右溫純 ，s亥彈,_ 17用於達成該上部端子12a、l〇a門之雷心 設置有™子既。巨 Ϊίΐϊ個上部端子⑽對應之底面之下部 n π ^ «· ,c 10 .,, , 饥1υ (遷接知子l〇a之間距。又’間距轡 [oo^f #械為方形，例如由陶£基板等所構成。 写HU變H12之頂面中央，隔著推壓構件13設置致動 fo之通電路基板1G並且固定於設置在電路基板 3d 。致動器14連接於未圖示之壓力控制部。 圖示活塞桿能於上下方向義，致動11 14内，^ =ΐίΓί供給之空氣流量或電力量，不依存於活塞桿之^ 止位置’满常維持在固定壓力。並且，於例如檢查時，檢查 11接觸晶圓W之電極㈣時，其接觸壓力亦能^持 、止雜馆又，固定的接觸壓力，亦可依據後述檢查用接觸構 ί m 彈性片21及底面彈性片22材質及厚度、導電部3〇 ，直徑及個數等，於致動器14所連接之控制部謂控制。該控制 «Ρ 1〇〇即”使於反複進行晶圓w之電極墊u檢查造成頂面彈性片 i If底^彈性片22劣化’而例如圖2所示接觸壓力降低之情形(圖 之)，亦忐藉由調整來自於壓力控制部之空氣流量或電力 200937021 : 二?控制接觸壓力成為固定⑽2中之實線)。 檢查用接觸構造體u，如圖3 造例如具備：作為令間體之平板狀中門3層構 20頂面之頂面彈性片21 ;以===，女=中間基板 性片22。 文衣於中間基板20底面之底面彈 [0032] 如橡膠片所形成。如全體由具彈性之絕緣材例 ❿ 30。導電部30，係將導電性粒’mm之多數導電部 導電部30，形成為射〜上“果充真於橡膠片之—部分形成。 之配置。各導電部$=應於受檢查體晶》W之電極墊U 彈性片22之上下雨⑥歹1 °糸將彈性片22於上下方向貫通並且從 之導凸=具四角柱形狀。底面彈性片21 為僅由橡㈣==_刚纽衡部分，成 [0033] 上述ΐ 全體由具彈性之絕緣材例如與 ❹ 導電性之多數成，面彈性片2!，形成具 橡膠片之-部分形成。夕盤=0，係將導電性粒子密集充填於 内無分布偏倚。導部4G ’均勻配置使得在片材面 12底面之下部端子12U成=得對應於例如間距變換基板 21於上下方向* 之配置。各導電部40，例如使頂面彈性片 狀。頂H片貝;彈性片21之上下兩面突出成凸 本實施形態之中，頂面 =度同’。設定為與例如地面_㈣電 [0034] 厚之形交項面彈性片21及底面彈性片22為 y中間基板20，由例如硬基板或麵基板等所 200937021 Ϊϋί晶圓W為同程度之熱膨脹率。又，中板20，相較 * $頂^及底面彈性片22，具較高的剛性。於中間基板 ..ςΛ y所不，形成有從底面通往頂面之多數通電路50。通電 Ϊ朝著中瞻反2〇之厚度方向之垂直方向以直線狀形 ί却電路50之上端部，形成上部端子5〇a，於通電路50之下 二2ΪΙ部端子5Gb °中間基板20之通電路5G，形成在例如 掛雁夕办^ 2 ^導電部30及頂面彈性片21之導電部40以1對1 之ΐ雪邮如。藉此，通電路5〇之下部端子5〇b與底面彈性片22 2^2對應。又’通電路％之上部端子5Ga與頂面彈性片 21之導電部40對應。 [0035] 60, 生片《22，固定於包圍其外周部之金屬框60。金屬框 來忐晶圓W具相同熱膨脹率之例如鐵-錄合金的视合金) [=]金屬框60’具有沿著底面彈性片22之外周部的四角框形狀。) 某板ίο屬袁由例如具彈性之矽酮製黏著劑61，黏著於中間 Ϊ門美杯3 面。藉此’底面彈性片22之各導電部30接觸 板2〇之通電路50之下部端子50b。 Ο 70 ^面彈性片21 ’固定於包圍其外周部之金屬框7〇。金屬框 [0038] 基板==著於中間 中間基板2G之通電路5〇之上部^片。21之各導電部40接觸 [0039] 响丁 能 [0040] 200937021 曰曰 Γ ίίίίυ接觸底面彈性片22之各導電部％並且 ^ 此’底面彈性片22之導電部3〇，由於 且推壓。精 於上下方向受到壓縮。又，對於底面彈 之力，而 «^20 21 40,1^ [0042] m到頂面彈性片21之導電部4〇之作用於 片22之力’經由間距變換基板12及推壓構件13，傳遞到致= J。並t，不歧動器14内之活塞桿位置，藉由以發生於致動° 内之壓力將間距變換基板12推壓到檢查用接觸構造體 : 此使底轉性片22之導電部3G與晶圓w之電極墊u之接觸^力 保，為固定壓力。此時，致動H 14内之活塞桿於上下方向之移 为里，例如由間距變換基板12之撓曲或彈性鎖〗7於上 Q 伸縮所吸收。 ran之 [0043] 並且’於晶圓w抵緊到檢查用接觸構造體η之狀態，來自 於電路基板10之檢查用之電訊號，依序通過彈性銷17、間距變換 基板12之上部端子12a與下部端子12b、檢查用接觸構造體11之 頂面彈性片21之導電部40、中間基板20之通電路50及底面彈性 片22之導電部30，而送往晶圓W上之各電極墊υ，進行晶圓W 上之電路之電特性檢查。 [0044] 依照以上實施形態，由於在支持檢查用接觸構造體n之間距 變換基板12頂面設置致動器14，因此，檢查時，當檢查用接觸構 11 200937021 彈^片22接觸電極塾υ，其接觸壓力能維持在固 . 性# 21 S Λ 時常維持對於檢查用接觸構造體11之頂面彈In the case of the ifΐΐ structure, the elastic sheet is placed on the bottom surface to allow the elastic sheet to be contacted, and the elastic sheet is repeatedly inspected and the elastic sheet is deteriorated, so that the inspection structure can be stably contacted with the object to be inspected. Further, for example, when the probe for the contact structure and the body is used and the probe of the cantilever structure is used and the contact of the probe is brought into contact with the object to be inspected, the contact can be worn even if the test object is repeatedly inspected. & Check the contact structure to stably contact the test object. [0011] The control unit may be configured to control a fixed pressure when the inspection contact structure is in contact with the object to be inspected, and the control unit controls the pressure in the actuator to make the inspection contact structure The resistance of the body becomes a predetermined flaw. Further, a resistance measuring device that measures the resistance 値 of the inspection contact structure, and the control unit controls the resistance according to the resistance 値 of the inspection contact structure measured by the resistance measuring device. The pressure in the actuator is such that the measured resistance 値 becomes the aforementioned predetermined enthalpy. [0013] At least the bottom surface of the contact structure for inspection may be provided so as to be in contact with the elastic piece of the object to be inspected during inspection. Further, the inspection contact structure may have a three-layer structure including a flat intermediate body and an elastic sheet attached to the upper and lower sides of the intermediate body. Further, a plurality of connection terminals of the electronic circuit are provided on the circuit board, and the support member may be a pitch conversion substrate that changes the interval of a plurality of connection terminals of the circuit board of 200937021. [0014] The inspection contact structure may further include: a target portion that is supported by the suspension member; and the member 'extends from the free end portion of the beam portion toward the side of the 杳^, and contacts during inspection The aforementioned test object. Detecting the body [0015] The present invention can be disposed above the circuit board, and is provided with a 探针= 述 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ At the time of inspection, the object to be inspected and the circuit substrate are turned on, and the holding member holds the object to be inspected so that the inspection contact structure is formed on the bottom surface of the solid supporting member, and the actuator is placed in the history. The contact force of the contact structure without the object to be inspected is © constant pressure °. , w < at least the bottom surface of the contact structure for inspection, and an elastic sheet of i double = can be provided. x, the contact structure for inspection described above may be configured to include a flat-shaped body, and is mounted in the middle. [0018] The contact structure for inspection may also have: The support member; and the contact member may extend from the (6) her body side of the beam portion and contact the inspection during inspection: a plurality of the actuators may be provided. [0020] The lower direction; ==== number of actuators each of the above 200937021 * [0021] can also control the subsequent inspection (four) contact frequency and the wrong body contact (the effect of the invention) [0022] The body is inspected for the electrical characteristics of the object to be inspected, and the contact structure for inspection is used. [Embodiment] 最佳 ❹ (Best mode for carrying out the invention) [0025] A preferred embodiment of the invention will be described. Fig. 1 is a schematic longitudinal cross-sectional view showing the configuration of the private needle device 1 of the present embodiment. [0026] The probe device 1 is provided with, for example, a probe card 2; and a wafer W on which the a3 is placed. The probe card 2 is disposed on the mounting table 3. The crystal substrate is, for example, a circuit board 1A for carefully checking the electric signal placed on the mounting table 3; and the inspection side structure 11 is mounted on the board κΓ and the day: the electrode w of the wafer w is connected _ The circuit board is provided with a pitch conversion substrate 12 which is a support member for the substrate 11 of the pitch conversion substrate 12. In the pitch change==touching ίίϊίΛ, the actuation 11 14 maintains the detection of the body and the crystal via the pressing member 13, and the contact pressure of the electrode pad U is used to check the connection voltage and the outer circumference of the ^^^ The support member ^^tr: ^ ^ The substrate 10' is electrically and electrically connected to the unillustrated position, and the test function is used for the inspection connection structure ηTfri0 10? t; The bottom surface of i = 0 forms a plurality of connection terminals i 〇 r circuit pitch conversion substrate 12 of the electronic circuit, which is supported by the top support member 16 provided thereon. The upper terminal 丨Φ of the ground plate Between the bottom surface of the pitch conversion plate 1G is connected to the connection terminal 10a of the ruthenium plate, and the right temperature is pure between the two, and s 17 is used to achieve the upper terminal 12a, l〇a. The thunder of the door is set with TM. Giant Ϊ ΐϊ 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 上部 oo oo oo oo oo oo oo oo oo oo oo oo oo oo oo oo The base of the top surface of the HU-H12 is placed, and the circuit board 1G for actuating the fo is provided via the pressing member 13 and fixed to the circuit board 3d. The actuator 14 is connected to the unillustrated The pressure control unit is shown in the figure. The piston rod can be actuated in the up and down direction, and the air flow or electric quantity supplied by ^=ΐίΓί is not maintained in the fixed position of the piston rod. For example, when inspecting, when the electrode (4) contacting the wafer W is inspected, the contact pressure can also be maintained, and the contact pressure can be fixed, and the contact pressure can be adjusted according to the contact structure and the bottom surface elasticity of the inspection structure described later. The material and thickness of the sheet 22, the conductive portion 3〇, the diameter and the number, etc. are controlled by the control unit to which the actuator 14 is connected. This control «Ρ 1〇〇" is repeated for the electrode pad of the wafer w. The inspection causes the top elastic sheet i If the bottom elastic sheet 22 is deteriorated', for example, the contact shown in FIG. In the case of pressure reduction (figure), also by adjusting the air flow or power from the pressure control unit 200937021: 2. Control the contact pressure to become the solid line in fixed (10) 2.) Check the contact structure u, as shown in Figure 3. For example, it is provided with a top surface elastic sheet 21 which is a top surface of a flat-shaped center door 3 layer structure 20 as a reaming body; and ===, female = intermediate substrate sheet 22. The blouse is elastically blown on the bottom surface of the bottom surface of the intermediate substrate 20 [ 0032] Formed as a rubber sheet. For example, the whole is made of an elastic insulating material. 30. The conductive portion 30 is formed by a conductive portion granules of a plurality of conductive portions 30, which are formed to be shots. The film is formed in part. Configuration. Each of the conductive portions $= is to be rained by 6 歹 1 ° on the electrode pad U elastic piece 22 of the examined body crystal, and the elastic piece 22 is penetrated in the up-and-down direction and guided from the convex shape to have a quadrangular prism shape. The bottom elastic piece 21 is made of only the rubber (four) == _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ - Partial formation. Evening disk = 0, the conductive particles are densely packed inside without distribution bias. The guide portion 4G' is uniformly disposed such that the terminal 12U below the bottom surface of the sheet surface 12 is disposed to correspond to, for example, the pitch conversion substrate 21 in the up and down direction*. Each of the conductive portions 40 has, for example, a top surface elastic sheet shape. The top H piece; the upper and lower sides of the elastic piece 21 protrude into a convex shape. In the embodiment, the top surface = the same degree. The interfacial elastic sheet 21 and the bottom elastic sheet 22 which are thicker than, for example, the ground_(four) electric [0034] are set as the y intermediate substrate 20, and the thermal expansion of the wafer W of the same degree is performed by, for example, a hard substrate or a surface substrate. rate. Moreover, the intermediate plate 20 has a higher rigidity than the *$ top and bottom elastic sheets 22. A plurality of pass circuits 50 are formed from the bottom surface to the top surface of the intermediate substrate . . . When the power is turned on, the upper end of the circuit 50 is formed in a straight line in the direction perpendicular to the thickness direction of the center, and the upper terminal 5〇a is formed under the pass circuit 50, and the second terminal 5Gb of the intermediate substrate 20 is under the pass circuit 50. The through-circuit 5G is formed, for example, by the conductive portion 40 of the conductive portion 30 and the top elastic sheet 21 of the hanging geese. Thereby, the lower terminal 5〇b of the through circuit 5〇 corresponds to the bottom elastic plate 22 2 2 . Further, the upper portion terminal 5Ga of the upper circuit portion corresponds to the conductive portion 40 of the top surface elastic sheet 21. [0035] 60, the green sheet "22, fixed to the metal frame 60 surrounding the outer peripheral portion thereof. The metal frame 忐 忐 wafer W has the same thermal expansion rate as an alloy of an iron-recording alloy. [=] The metal frame 60' has a quadrangular frame shape along the outer peripheral portion of the bottom surface elastic piece 22. A plate ίο belongs to Yuan, for example, an elastic ketone-based adhesive 61, which is adhered to the middle side of the Tuen Mun Mei Cup. Thereby, the respective conductive portions 30 of the bottom surface elastic piece 22 contact the lower terminal 50b of the pass circuit 50 of the board 2''. The Ο 70 ^ surface elastic sheet 21 ' is fixed to a metal frame 7 包围 surrounding the outer peripheral portion thereof. Metal frame [0038] The substrate == is placed on the upper portion of the intermediate circuit 2G. Each of the conductive portions 40 of the 21 contacts [0039] 200937021 370 Γ ί υ υ υ υ υ υ υ υ υ υ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Finely compressed in the up and down direction. Moreover, for the force of the bottom surface, the force of the conductive portion 4 of the top elastic sheet 21 of the top surface elastic sheet 21 acts on the sheet 22 via the pitch conversion substrate 12 and the pressing member 13, Pass to == J. And t, the position of the piston rod in the non-transporter 14 is pressed against the inspection contact structure by the pressure generated in the actuation °: the conductive portion 3G of the bottom plate 22 Contact with the electrode pad u of the wafer w is a fixed pressure. At this time, the piston rod in the actuation H 14 is moved in the up and down direction, for example, by the deflection or elastic lock of the pitch conversion substrate 12 and absorbed by the upper Q expansion and contraction. [0043] In the state in which the wafer w is pressed against the inspection contact structure η, the electric signal for inspection from the circuit board 10 sequentially passes through the elastic pin 17, and the pitch is changed to the upper terminal 12a of the substrate 12. And the lower terminal 12b, the conductive portion 40 of the top surface elastic sheet 21 of the inspection contact structure 11, the conductive circuit 50 of the intermediate substrate 20, and the conductive portion 30 of the bottom elastic sheet 22, and are supplied to the electrode pads on the wafer W. υ, the electrical characteristics of the circuit on the wafer W are checked. According to the above embodiment, since the actuator 14 is provided between the support inspection contact structure n from the top surface of the conversion substrate 12, when the inspection is performed, the inspection contact structure 11 200937021 is in contact with the electrode 塾υ The contact pressure can be maintained at the solid state. # 21 S Λ often maintains the top surface of the contact structure 11 for inspection.
Ldt ii22施加之勤為狀’因此，即使反複晶 能使底面電彈性片面彈性片21及底面彈性片22劣化，亦 ιϊ果導電部3G穩定地接觸晶圓〜之電極塾u。 觸忒體=檢的查頻用度接觸構造體丨1之壽命，亦能減少檢查用接 [0045] 換基設置於探針卡2之間距變 載置台3之晶圓W動器8〇，設置在例如吸附 雷極執ΤΤ垃錨呆日日圓W之水平度。之後檢查時，當使 Ϊ”?面彈性片22之導電部30時，對娜：二 8〇Ϊ去ΐ曰曰圓W、夹頭如而傳遞到致動器80。並且，致動乍器 ί二f闕之働3。與峨之電極 Ο [0046] 又，此時，由於設置多個致動器8〇， 性片22之導電部30與晶圓W 使由於底面舞 之兩方向(水平方向)發生接觸，使得晶圓w ^ SO 100 W平行於底面彈性片22，例如 =持晶圓 置差異為ι各致動器80内之空氣懕，妒祖姓曰 並能使晶圓W之電極塾1；與底面彈為^平， 力於水平方向均勻分散。 ㈣片22之導電部30之接〗 [0047] 12 200937021 又，在晶圓W之載置台3設置致動器80時，亦可省 2所具有之間距變換基板12，將檢查用接 上亩技 固定在電路基板10。 骚U直接 [0048] ^以上實施形態之中，係將致動器14或致動器80其中之—女 於探針卡2或概台3，但亦可如®1 5所示，將致動器14、 :又置在探針卡2與载置台3兩者。於此情形，能將晶圓w 與底面彈性片22之導電部3G的接觸壓力以更佳精度^ [0049] 於二杏ΐίΐ陳經過調查得知，如上述實施形態所述，即使 接觸構造體11與電極独接觸時接觸壓力為固定t 曰由，反複進行電極藝U檢查而使底面彈性片22之導電部如工 匕，+列如圖6所示，導電部30之電阻値增高（圖6中之 劣 此，右導電部3〇之電阻値增高，電路基板1〇與晶圓w之 導通會降低，因此維持導電部3G之電阻値為既定 B ’ [0050] ❹ 咖，若如圖7所示可知’提高檢㈣接觸構造體11盘 電墊接觸時之接觸壓力，則導電部30電 ’、 [0051] 由々ΐί、’ Ϊ可以轉導電部3G之電阻値為既缝之方式(圖6 Λ ’控制檢查賴觸構造體11與電極㈣_接觸壓力。 班、ΐΐί开知對於上述實施形態之探針裝置1，如圖8所示，設 貝之電阻値的電阻測定器勘。當使用電阻測定器 杯、目ίί 3〇之電阻値時’例如使用由銅(CU)構成之檢查用 板卩疋器200，連接於導電部30及檢查用板T。並且， 載置於載置台3上而使導電部3G與檢查用板T接 巧之，、’利用電阻啦器測料電部3G之電阻値。如此方 式以電阻測定器綱測定之導電部3G之電阻値，輸出到控制部 13 200937021 100。 [0053] 於控制部100，首先依據從電阻測定器2〇〇輸出之導電部邓 之電阻値測定結果，計算檢查用接觸構造體u與電極間之 ，，力之修正値，以使得導電部30之電阻値成為既定値。並且， 從算出之修正輯算致動II 14 Θ之壓力之修疏，並依據該修正 j^制從壓力控制部對於致動器14内供給之空氣流量或電力 量。藉由以此方式控制致動器14内之壓力，如圖6所示，能 導電部30之電阻値為既定俊(圖6中之實線）。 、·'、 [0054] 依照以上實施形態，控制致動器14内之壓力，能維持檢查 接觸構造體11與電極墊U接觸之接觸壓力為固定，同時，能 導電部30之電阻值為既纽。如此，以後當進行晶圓w之電極 墊u之檢查時，由於能適當維持電路基板1〇與晶圓w間之 通，，此即使反複檢查而導電部30劣化，亦能適當進行該檢查。 又，藉此能延長檢查用接觸構造體丨丨的壽命。 — [0055] 又The Ldt ii22 is applied as a divergence. Therefore, even if the repetitive crystal causes the bottom electro-elastic sheet-surface elastic sheet 21 and the bottom surface elastic sheet 22 to deteriorate, the ITO-like conductive portion 3G stably contacts the wafer-to-electrode 塾u. Touching the body = checking the frequency of the contact structure of the structure 丨1, can also reduce the inspection connection [0045] The substrate is placed between the probe card 2 and the wafer W of the variable stage 3 is set to 8 For example, the degree of sensation of the daytime circle W is determined by the absorbing rake. At the time of inspection, when the conductive portion 30 of the elastic sheet 22 is made, the yoke is transferred to the actuator 80, and the chuck is transferred to the actuator 80. Further, at this time, since a plurality of actuators 8A are provided, the conductive portion 30 of the sheet 22 and the wafer W are caused by the two directions of the bottom dance ( The contact occurs in the horizontal direction, so that the wafer w ^ SO 100 W is parallel to the bottom elastic sheet 22, for example, the wafer holding difference is ι, the air inside the actuator 80, and the wafer W The electrode 塾1; and the bottom surface is flat, and the force is uniformly dispersed in the horizontal direction. (4) The conductive portion 30 of the sheet 22 is connected. [0047] 12 200937021 Moreover, when the actuator 80 is disposed on the mounting table 3 of the wafer W In addition, in the above embodiment, the actuator 14 or the actuator 80 may be used to fix the two substrates with the distance between the conversion substrate 12 and the inspection technology. Among them, the probe card 2 or the table 3 can be placed, but the actuator 14 can be placed on both the probe card 2 and the mounting table 3. As shown in the above, in this case, Crystal The contact pressure of the w with the conductive portion 3G of the bottom elastic piece 22 is more excellent. [0049] According to the investigation, as described in the above embodiment, the contact pressure is contacted even when the contact structure 11 is in contact with the electrode alone. In order to fix the t 曰, the electrode U is repeatedly inspected so that the conductive portion of the bottom elastic piece 22 is as a workpiece, and the + column is as shown in FIG. 6, and the electric resistance of the conductive portion 30 is increased (inferior to FIG. 6 , right conductive) When the resistance of the portion 3〇 is increased, the conduction between the circuit board 1〇 and the wafer w is lowered, so that the resistance of the conductive portion 3G is maintained as a predetermined B' [0050] ,, as shown in Fig. 7, the detection is improved (4) When the contact structure 11 contacts the contact pressure of the disk pad, the conductive portion 30 is electrically ', [0051] 々ΐ 、, ' Ϊ can turn the resistance of the conductive portion 3G into a seam (Fig. 6 控制 'Control check The contact structure 11 and the electrode (four)_contact pressure. For the probe device 1 of the above embodiment, as shown in Fig. 8, a resistance measuring device of the resistance of the shell is used. When using a resistance measuring cup, When the resistance of the device is ', for example, it is made of copper (CU). The inspection platen 200 is connected to the conductive portion 30 and the inspection plate T. The semiconductor plate 3 is placed on the mounting table 3 to electrically connect the conductive portion 3G and the inspection plate T, and the material is measured by a resistor. In this way, the resistance 値 of the conductive portion 3G measured by the resistance measuring device is output to the control unit 13 200937021 100. [0053] The control unit 100 first outputs the output from the resistance measuring device 2 The result of the measurement of the resistance of the conductive portion Deng was calculated, and the force between the contact structure u for inspection and the electrode was corrected so that the resistance 导电 of the conductive portion 30 became a predetermined value. Then, the pressure of the actuation II 14 Θ is corrected from the calculated correction, and the air flow rate or the amount of electric power supplied from the pressure control unit to the actuator 14 is determined based on the correction. By controlling the pressure in the actuator 14 in this manner, as shown in Fig. 6, the electric resistance of the conductive portion 30 is predetermined (solid line in Fig. 6). According to the above embodiment, the pressure in the actuator 14 is controlled, and the contact pressure between the contact structure 11 and the electrode pad U can be maintained constant, and the resistance value of the conductive portion 30 can be maintained. New Zealand. In the case where the electrode pad u of the wafer w is inspected in the future, since the circuit board 1〇 and the wafer w can be properly maintained, the inspection can be appropriately performed even if the conductive portion 30 is deteriorated by repeated inspection. Moreover, the life of the inspection contact structure body can be extended by this. — [0055] Again
，於以上實施形態’係使用由銅(Cu)構成之檢查用板丁，但 再者亦能使用由金(Au)構成之檢查用板。於該情形，首先於 一 電部30接觸由Au構成之檢查用板之狀態，以電阻測定器2〇〇 定導電部30之電阻値，並檢查導電部3〇之污染等。並且，者剌 斷導電部30有污染時，清潔導電部3〇。之後，使用檢查用^丁 測定導電部30之電阻値，並且利用控制部丨〇〇控制致動器μ内 之壓力，使得該導電部30之電阻値成為既定値。藉此，能 確地測定導電部30之電阻値，能將該導電部3〇之電阻値 確地維持既定値。 I- 匈平 [0056] 以上實施形態之中，係使用檢查用板τ而將導電部3〇之電阻 値控制在既疋値，但是如圖9所示，亦可在例如底面彈性片2八 置與導電部30相同構成之檢查用導電部210，並且在晶圓w上= 14 200937021 . 置由銅(Cu)構成之板P。檢查用導電部210，形#六认* + P的位置。並且，當進行晶圓w之電 二ϋ檢查時接觸板 ’接㈣極墊υ，同時，使檢查用導檢查時，使導電部30 於使檢查用導電部210接觸^ ρ之狀^ ^觸板Ρ °依此方式， 檢查用導電部細之電=板2獅測定 電部21。之電阻値’控制致動器14之壓H雷I，，，用， 値。在此，所測定之檢查用導電部21〇之 ^ ^直^為既定 電部30之電阻値，因此，藉由㈣ 上可視為相於導 祕雷邱30夕常阳制述致動器14之壓力，能維 持導電4 30之電阻値為既定値。藉此 二 時，能適當控制致動器14内之壓力。阳了級㈣檢查的同 ❿[0057] 以上實施形態之中，係控制成使得底面彈性片22之 維持蚊値，但是’亦可—併控制頂面彈性片21之i電 ^ 40之電阻値。於此情形，將電阻測定器·In the above embodiment, a test sheet made of copper (Cu) is used, but an inspection sheet made of gold (Au) can also be used. In this case, first, the state of the inspection plate made of Au is contacted with the electric portion 30, the resistance 値 of the conductive portion 30 is determined by the resistance measuring device 2, and the contamination of the conductive portion 3 is checked. Further, when the conductive portion 30 is contaminated, the conductive portion 3 is cleaned. Thereafter, the resistance 値 of the conductive portion 30 is measured using the inspection, and the pressure in the actuator μ is controlled by the control unit , so that the resistance 该 of the conductive portion 30 becomes a predetermined value. Thereby, the resistance 値 of the conductive portion 30 can be accurately measured, and the resistance of the conductive portion 3 can be accurately maintained at a predetermined level. I- Hungarian [0056] In the above embodiment, the resistance 値 of the conductive portion 3 is controlled by using the inspection plate τ. However, as shown in FIG. 9, for example, the bottom elastic sheet 2 may be used. The inspection conductive portion 210 having the same configuration as that of the conductive portion 30 is disposed on the wafer w = 14 200937021. A plate P made of copper (Cu) is placed. Check the position of the conductive portion 210, the shape of the six-member * + P. Further, when the electric inspection of the wafer w is performed, the contact plate is connected to the (four) pole pad, and at the same time, when the inspection guide is inspected, the conductive portion 30 is brought into contact with the inspection conductive portion 210. Plate Ρ ° In this way, the electric portion 21 of the conductive portion is inspected. The resistance 値' controls the pressure of the actuator 14 by H, I, and 値. Here, the measured conductive portion 21 is the resistance 既 of the predetermined electric portion 30, and therefore, the actuator 14 can be regarded as a guide by the fourth member of the guide. The pressure can maintain the resistance of the conductive 430 to a predetermined enthalpy. At this time, the pressure in the actuator 14 can be appropriately controlled. The same level is used to control the bottom elastic sheet 22 to maintain the mosquito, but it is also possible to control the resistance of the top elastic sheet 21 . In this case, the resistance tester·
Si連?、;=將導電部40、導電部3〇與 :ΪΓ 電阻測定器200。並且，於使導電部3〇接觸 t查1板狀態，利用電阻測定器200測定導電部30及導電部 40之電阻値，並藉由控制部1〇〇控制致動器' ΐ4 β之壓力，使得其 電阻値成為既定値。以此方式’由於能將導電部3G以及導電部^ ❹之電阻値同時維持在既定値，因此，即使反複晶圓電極塾u 檢查而導電部30及導電部40劣化，亦能更適當進行檢杳。 [0058] 一 以上實施形態之中，係依據電阻測定器2〇〇對於導電部3〇之 電阻彳^測定結果控制致動器14内之壓力，但是，亦可不使用電 阻測定器200，依據檢查次數來控制致動器14内之壓力。例如， 如圖6,不，當事先知道導電部3〇之電阻値相對於檢查次數之特 性時，能夠依據檢查次數，控制致動器14内之壓力，使得導電部 30之電阻値維持在既定値。 [0059] 以上實施形態之中，檢查用接觸構造體η具中間基板2〇、頂 15 200937021 ，t · 了圖1G所示’使㈣臂樑構造之探針3G0。於此 3〇Γ。支ί底面侧’設置支持探針3〇0之支持構件 i支座15a之底面，各設有多數板彈簧3〇2， ttoUf件30藉由板彈簧302，其外周部受到支持。 紐1G之連接端子- 而盥雷㈣ΐ 子連接端子303，藉由接觸銷304 ❹ 土，之連接端子10a電連接。接觸銷304 ,且彈性及 路ϊ = 妾之例如錄形成。接觸銷304，能維持對於電 歡㈣，於上下左右自由移動。 置，ΐΐίf t面’在對應於晶圓W上之_塾U之位 未、’十 文到支持。探針300，盘設置在支持禮杜 頂面之連接端子303以電連接。 …又置在支持構件301 [0062] ❿ 如圖金屬之導電性材料形成。探針， 面突出之！接邦又ίο持持構件3〇1，具從該支持構件301之底 311，相對於支°持構件3⑴持士部310之下端，設有樑部31卜樑部 到懸臂支持'。於摔a卩311自^支持部31G *具既定間隔，且受 方向下二=二t自由端部’設置有往樑部311之直角 [0063] 時，進行晶圓w之電極塾11之電特性檢查 控制，能利用控制部則使致動器14之壓力受 並且，依電極塾υ間之接觸壓力為固定廢力。 基板力制定之雜，將來自於電路 —用虎依序通過接觸銷304、支持構件3〇1之連 200937021 ',ί端子則及探針而送往鶴u，並檢她塾u之電特 ' [0064] 紅觸^2 如反複μ而將接觸件312之前端磨耗， ί 3丨2上下動，雜賴蝴 之移動範圍有界限，因此，有時血半 由於接觸件312Si is connected to the conductive portion 40 and the conductive portion 3 to: 电阻 the resistance measuring device 200. Then, the conductive portion 3 is contacted to check the state of the first plate, and the resistance 値 of the conductive portion 30 and the conductive portion 40 is measured by the resistance measuring device 200, and the pressure of the actuator ' ΐ 4 β is controlled by the control unit 1 ,. Make its resistance 既 become a predetermined 値. In this way, since the electric resistance of the conductive portion 3G and the conductive portion can be maintained at a predetermined time, even if the wafer electrode 塾u inspection is repeated and the conductive portion 30 and the conductive portion 40 are deteriorated, the inspection can be performed more appropriately. dark and quiet. [0058] In one or more embodiments, the pressure in the actuator 14 is controlled based on the resistance measurement result of the electric resistance measuring device 2, but the resistance measuring device 200 may not be used. The number of times controls the pressure within the actuator 14. For example, as shown in Fig. 6, when the characteristics of the resistance 値 of the conductive portion 3〇 relative to the number of inspections are known in advance, the pressure in the actuator 14 can be controlled in accordance with the number of inspections so that the resistance 导电 of the conductive portion 30 is maintained at a predetermined value. value. In the above embodiment, the inspection contact structure η has the intermediate substrate 2〇, the top 15 200937021, and the probe 4G0 of the (four) arm beam structure shown in FIG. 1G. Here 3 〇Γ. The bottom surface side of the support ’ is provided with a supporting member for supporting the probe 3〇0. The bottom surface of the holder 15a is provided with a plurality of leaf springs 3〇2, and the ttoUf member 30 is supported by the outer peripheral portion of the leaf spring 302. The connection terminal of the New 1G - and the connection terminal 303 of the 盥 (4) ,, is electrically connected to the connection terminal 10a by the contact pin 304. The contact pin 304 is contacted, and the elasticity and the path = 妾 are recorded, for example. The contact pin 304 can be freely moved up, down, left, and right for the motor (4). The position of ΐΐ f f 在 在 在 在 在 在 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应 对应The probe 300 is disposed on the connection terminal 303 supporting the top surface of the ceremony to be electrically connected. ...and placed on the support member 301 [0062] 形成 formed of a conductive material as shown in the metal. Probe, face out! The receiving member 〇1 holds the member 3〇1 from the bottom 311 of the supporting member 301, and is provided with a beam portion 31 to the cantilever support ' with respect to the lower end of the holding member 3(1). When the support portion 31G* has a predetermined interval and is disposed at a right angle [0063] to the beam portion 311 by the lower two=two t free end portions, the electrode 塾11 of the wafer w is performed. The characteristic inspection control can utilize the control portion to subject the pressure of the actuator 14 to a fixed waste force depending on the contact pressure between the electrodes. The maturity of the substrate force will come from the circuit - the tiger will pass through the contact pin 304, the support member 3〇1, 200937021 ', ί terminal and the probe to the crane u, and check her [0064] Red touch ^2, if the μ is repeated, the front end of the contact 312 is worn, and the ί 3丨2 is moved up and down, and the movement range of the butterfly is limited. Therefore, sometimes the blood is half due to the contact 312.
If施报錐，π Ο· g /有無法將接觸壓力維持固定。依照 本實滅4、即使於此情形，能利用 (例如圖2表示之實線）。 職觸壓力為固疋 Φ [0065] 構造ίρϊΐίΐίΓ人等調查得知’即使如上所述，使懸臂標 構k之探針300與電極塾u接觸時接觸愿 J U , 312 6 由於反複檢查，使接觸件312之前端磨耗、或在接 觸件312之别端附著電極墊u上之銘氧化膜，造成接觸件312之 電阻値增高。 [0066] 於是，亦可對於上述探針裝置丨，如圖12所示，設置測定接 φ 觸件312之電阻値的電阻測定器320。關於該電阻測定器32〇之構 成、及使用檢查用板T之電阻値之測定方法，因為與上述實施形 態之電阻測定器200相同，故省略説明。於此情形亦為，藉由依 據電1^·測定器320所測定之接觸件312之電阻値，控制致動器14 内之麗力’能維持接觸件312之電阻値為既定値(例如圖6所示實 線）。 [0067] 又’如上所述，使用懸臂樑構造之探針300作為檢查用接觸 構造體時’亦可在晶圓W之載置台3設置致動器330。關於該致 動器330之構成及作用，與上述實施形態之致動器8〇相同，故省 略説明。亦可將致動器330如圖13所示，取代致動器14設置。 17 200937021 於該情形，藉由控制致動器330内之壓力，能維持探針3〇〇之接 觸件312與晶圓W之電極墊U間之接觸壓力為固定，同時能維持 晶圓W為水平，能夠使接觸件312與電極墊u之接觸壓力在水平 方向均勻分散。又，致動器330，亦可如圖14所示，與致動器14 同時設置。於此情形，能以更佳精度維持接觸件312盥 & 間之接觸壓力為岭。 [0068] 政n以上，已參照附圖將本發明之較佳實施形態加以説明，但太 二。Ϊ為該技術領域中具通常知識者，明顯能在申 ❹ 於本發明之技術範圍。本發明不限於該例，5 裔）、光罩用之防護膠膜等其他基板。 （千面顯不 (產業利用性） [0069] 本發明，有用於檢查例如半導體晶圓等受檢查體 【圖式簡單說明】 [0023] 圖1顯 之電特性 ΐ; Ϊ示力;忿略縱剖面圖 圖5顯示其他形態 縱。1 丨面圖。 =示電阻値與檢縱剖面圖。 ::示:阻織接峨力間之關係圖。 圖10顯示其他形態之探針農 圖9:其Sit”剖面圖。 置構成概略縱刮面圖。 200937021 ，11顯示探針構成概略側面圖 園12 一 圖13 之晴置構成概略縱剖面圖。ί^ί巧針裝置構成概略縱剖面圖。 縱剖面説明圖 Ο 顯7F 圖14顯示其他形態之探 【主要元件符號說明】 Ρ 板 U 電極墊 Τ 檢查用板 W 晶圓 1 探針裴置 2 探針卡 3 栽置台 3a 失頭 3b 基台 10 電路基板 10a 連接端子 11 檢查用連接構 12 間距變換基板 12a 上部端子 12b 下部端子 13 推壓構件 14 致動器 15 支座 15a 外周支座 15b 加強件 16 支持構件 17 彈性銷 20 中間基板 21 頂面彈性片 19 200937021 - 22 30 . 31 40 41 50 50a 50b 60 61 ❹ 70 71 80 100 200 210 300 301 302 D 303 304 310 311 312 320 330 底面彈性片 導電部 絕緣部 導電部 絕緣部 通電路 上部端子 下部端子 金屬框 黏著劑 金屬框 黏著劑 致動器 控制部 電阻測定器 檢查用導電部 探針 支持構件 板彈簧 連接端子 接觸鎖 支持部 樑部 接觸件 電阻測定器 致動器If the report cone, π Ο·g / can not maintain the contact pressure fixed. According to this fact, 4, even in this case, can be utilized (for example, the solid line shown in Fig. 2). The occupational contact pressure is 疋Φ [0065] ί 等 等 等 等 等 等 等 等 等 ' ' 等 等 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 探针 探针 探针 探针 探针 探针The front end of the member 312 is worn, or the etched film on the electrode pad u is attached to the other end of the contact member 312, resulting in an increase in the resistance 接触 of the contact member 312. Then, as shown in FIG. 12, the above-described probe device 设置 can also be provided with a resistance measuring device 320 that measures the resistance 接 of the φ contact 312. The measurement method of the resistance measuring device 32A and the method of measuring the resistance 使用 using the inspection plate T are the same as those of the resistance measuring device 200 of the above-described embodiment, and thus the description thereof will be omitted. In this case, by controlling the resistance 値 of the contact 312 measured by the electric measuring device 320, the control force in the actuator 14 can maintain the resistance 接触 of the contact member 312 as a predetermined 値 (for example, 6 shows the solid line). Further, when the probe 300 of the cantilever structure is used as the contact structure for inspection as described above, the actuator 330 may be provided on the stage 3 of the wafer W. The configuration and operation of the actuator 330 are the same as those of the actuator 8A of the above embodiment, and therefore will not be described. Actuator 330 can also be provided in place of actuator 14 as shown in FIG. 17 200937021 In this case, by controlling the pressure in the actuator 330, the contact pressure between the contact 312 of the probe 3 and the electrode pad U of the wafer W can be maintained, and the wafer W can be maintained. Horizontally, the contact pressure between the contact member 312 and the electrode pad u can be uniformly dispersed in the horizontal direction. Further, the actuator 330 may be provided simultaneously with the actuator 14 as shown in FIG. In this case, the contact pressure between the contacts 312 amp & can be maintained with better precision. [0068] The above embodiments of the present invention have been described with reference to the accompanying drawings, but it is too. It is obvious to those skilled in the art that it can be applied to the technical scope of the present invention. The present invention is not limited to this example, and other substrates such as a protective film for a photomask are used. (Thousands of Aspects (Industrial Applicability) [0069] The present invention is useful for inspecting a test object such as a semiconductor wafer [Simplified Description of the Drawings] [0023] FIG. 1 shows the electrical characteristics ΐ; Longitudinal section view Figure 5 shows the other forms of vertical. 1 丨 图 = = = = = :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :: :Sit" sectional view. It is a schematic longitudinal plan view. 200937021,11 shows the schematic configuration of the probe. Figure 12 is a schematic view of the vertical arrangement of the vertical arrangement. Longitudinal section illustration Ο 7 7F Figure 14 shows other forms of exploration [main component symbol description] Ρ plate U electrode pad Τ inspection plate W wafer 1 probe device 2 probe card 3 planting table 3a head loss 3b base Table 10 Circuit board 10a Connection terminal 11 Inspection connection structure 12 Pitch conversion substrate 12a Upper terminal 12b Lower terminal 13 Pushing member 14 Actuator 15 Support 15a Peripheral support 15b Reinforcement member 16 Support member 17 Elastic pin 20 Intermediate substrate 21Face elastic sheet 19 200937021 - 22 30 . 31 40 41 50 50a 50b 60 61 ❹ 70 71 80 100 200 210 300 301 302 D 303 304 310 311 312 320 330 bottom surface elastic sheet conductive portion insulating portion conductive portion insulating portion through circuit upper terminal Lower terminal metal frame adhesive metal frame adhesive actuator control part resistance measuring device inspection conductive part probe support member plate spring connection terminal contact lock support beam contact resistance measuring device actuator