WO2009069601A1 - はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 - Google Patents
はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 Download PDFInfo
- Publication number
- WO2009069601A1 WO2009069601A1 PCT/JP2008/071357 JP2008071357W WO2009069601A1 WO 2009069601 A1 WO2009069601 A1 WO 2009069601A1 JP 2008071357 W JP2008071357 W JP 2008071357W WO 2009069601 A1 WO2009069601 A1 WO 2009069601A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- soldering
- flux
- koh
- paste composition
- temperatures
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801031315A CN101784365B (zh) | 2007-11-27 | 2008-11-25 | 钎焊用焊剂、钎焊膏组合物及钎焊方法 |
EP08854783.1A EP2221140B1 (en) | 2007-11-27 | 2008-11-25 | Flux for soldering, soldering paste composition, and method of soldering |
US12/744,206 US20100243717A1 (en) | 2007-11-27 | 2008-11-25 | Soldering flux, solder paste composition and soldering method |
KR1020107001211A KR101142811B1 (ko) | 2007-11-27 | 2008-11-25 | 납땜용 플럭스, 땜납 페이스트 조성물 및 납땜 방법 |
JP2009543799A JP5150912B2 (ja) | 2007-11-27 | 2008-11-25 | はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-305637 | 2007-11-27 | ||
JP2007305637 | 2007-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009069601A1 true WO2009069601A1 (ja) | 2009-06-04 |
Family
ID=40678496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/071357 WO2009069601A1 (ja) | 2007-11-27 | 2008-11-25 | はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100243717A1 (ja) |
EP (1) | EP2221140B1 (ja) |
JP (1) | JP5150912B2 (ja) |
KR (1) | KR101142811B1 (ja) |
CN (1) | CN101784365B (ja) |
TW (1) | TW200932413A (ja) |
WO (1) | WO2009069601A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011124190A2 (en) | 2010-04-06 | 2011-10-13 | Zentiva, K.S. | Method of producing 4-(2-(substituted)-1-(1-hydroxycyclohexyl)ethyl)phenols by o- demethylation of their methylethers by means of inodorous aromatic thiols |
JP2016179496A (ja) * | 2015-03-25 | 2016-10-13 | ハリマ化成株式会社 | はんだ付け用フラックスおよびはんだペースト組成物 |
JP6337349B1 (ja) * | 2017-08-28 | 2018-06-06 | 株式会社弘輝 | フラックス、ソルダペースト及び電子回路基板の製造方法 |
WO2020031693A1 (ja) * | 2018-08-10 | 2020-02-13 | 株式会社弘輝 | フラックス及びソルダペースト |
KR102690728B1 (ko) * | 2021-03-12 | 2024-08-05 | 센주긴조쿠고교 가부시키가이샤 | 플럭스 및 전자 디바이스의 제조 방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103212918A (zh) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | 一种无铅焊料助焊混合物 |
JP6079375B2 (ja) * | 2013-03-29 | 2017-02-15 | 三菱マテリアル株式会社 | ハンダ粉末及びその製造方法並びにこの粉末を用いたハンダ用ペースト |
EP2985112B1 (en) * | 2013-04-09 | 2018-08-22 | Harima Chemicals, Inc. | Aqueous composition for aluminum brazing |
CN103862198B (zh) * | 2014-03-24 | 2016-08-17 | 吉安谊盛电子材料有限公司 | 一种太阳能自动焊接专用助焊剂 |
EP3225351B1 (en) * | 2016-03-30 | 2020-05-06 | General Electric Company | Brazing compositions for ductile braze structures, and related processes and devices |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63289991A (ja) * | 1987-05-22 | 1988-11-28 | Uchihashi Estec Co Ltd | チップ型電子部品の固着方法 |
JPS6485985A (en) | 1987-07-06 | 1989-03-30 | Norwich Eaton Pharma | Synthesis of aminomethylenephosphonoalkylphosphinates |
JPH08132282A (ja) * | 1994-11-01 | 1996-05-28 | Sanei Kagaku Kk | 半田付け用フラックス |
JPH09192883A (ja) * | 1996-01-17 | 1997-07-29 | Asahi Chem Res Lab Ltd | フラックス組成物 |
JPH1034383A (ja) * | 1996-03-29 | 1998-02-10 | Sophia Syst:Kk | はんだを本来の位置でカプセル状に包むための重合性フラックス組成物 |
JP2001114747A (ja) * | 1999-10-18 | 2001-04-24 | Fujifilm Olin Co Ltd | 水溶性半田フラックス組成物 |
JP2002514973A (ja) * | 1995-05-24 | 2002-05-21 | フライズ・メタルズ・インコーポレーテッド | エポキシ系voc非含有はんだ付け用フラックス |
JP2007144446A (ja) | 2005-11-25 | 2007-06-14 | Arakawa Chem Ind Co Ltd | ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3448512A (en) * | 1968-08-26 | 1969-06-10 | Electronic Eng Co California | Method of soldering |
DE2846809A1 (de) * | 1978-10-27 | 1980-05-08 | Bayer Ag | Verfahren zur herstellung von polyurethankunststoffen |
US4324713A (en) * | 1979-02-09 | 1982-04-13 | Nippon Zeon Co. Ltd. | Two-package solventless rust preventive material |
US5904785A (en) * | 1994-07-12 | 1999-05-18 | Henkel Corporation | Process for forming a phosphate conversion coating |
TWI228132B (en) * | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
WO2004108345A1 (ja) * | 2003-06-09 | 2004-12-16 | Senju Metal Industry Co., Ltd. | ソルダペースト |
JP2008062253A (ja) * | 2006-09-05 | 2008-03-21 | Denso Corp | はんだ付け用フラックスおよびはんだペースト組成物 |
-
2008
- 2008-11-25 CN CN2008801031315A patent/CN101784365B/zh active Active
- 2008-11-25 JP JP2009543799A patent/JP5150912B2/ja active Active
- 2008-11-25 EP EP08854783.1A patent/EP2221140B1/en active Active
- 2008-11-25 WO PCT/JP2008/071357 patent/WO2009069601A1/ja active Application Filing
- 2008-11-25 US US12/744,206 patent/US20100243717A1/en not_active Abandoned
- 2008-11-25 KR KR1020107001211A patent/KR101142811B1/ko active IP Right Grant
- 2008-11-27 TW TW097145870A patent/TW200932413A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63289991A (ja) * | 1987-05-22 | 1988-11-28 | Uchihashi Estec Co Ltd | チップ型電子部品の固着方法 |
JPS6485985A (en) | 1987-07-06 | 1989-03-30 | Norwich Eaton Pharma | Synthesis of aminomethylenephosphonoalkylphosphinates |
JPH08132282A (ja) * | 1994-11-01 | 1996-05-28 | Sanei Kagaku Kk | 半田付け用フラックス |
JP2002514973A (ja) * | 1995-05-24 | 2002-05-21 | フライズ・メタルズ・インコーポレーテッド | エポキシ系voc非含有はんだ付け用フラックス |
JPH09192883A (ja) * | 1996-01-17 | 1997-07-29 | Asahi Chem Res Lab Ltd | フラックス組成物 |
JPH1034383A (ja) * | 1996-03-29 | 1998-02-10 | Sophia Syst:Kk | はんだを本来の位置でカプセル状に包むための重合性フラックス組成物 |
JP2001114747A (ja) * | 1999-10-18 | 2001-04-24 | Fujifilm Olin Co Ltd | 水溶性半田フラックス組成物 |
JP2007144446A (ja) | 2005-11-25 | 2007-06-14 | Arakawa Chem Ind Co Ltd | ハンダ付けフラックス用樹脂エマルジョン、その製造法およびハンダ付けフラックス |
Non-Patent Citations (1)
Title |
---|
See also references of EP2221140A4 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011124190A2 (en) | 2010-04-06 | 2011-10-13 | Zentiva, K.S. | Method of producing 4-(2-(substituted)-1-(1-hydroxycyclohexyl)ethyl)phenols by o- demethylation of their methylethers by means of inodorous aromatic thiols |
JP2016179496A (ja) * | 2015-03-25 | 2016-10-13 | ハリマ化成株式会社 | はんだ付け用フラックスおよびはんだペースト組成物 |
JP6337349B1 (ja) * | 2017-08-28 | 2018-06-06 | 株式会社弘輝 | フラックス、ソルダペースト及び電子回路基板の製造方法 |
JP2019038026A (ja) * | 2017-08-28 | 2019-03-14 | 株式会社弘輝 | フラックス、ソルダペースト及び電子回路基板の製造方法 |
KR20190112848A (ko) * | 2017-08-28 | 2019-10-07 | 가부시키가이샤 코키 | 플럭스, 솔더 페이스트 및 전자 회로 기판의 제조 방법 |
KR102103966B1 (ko) | 2017-08-28 | 2020-04-23 | 가부시키가이샤 코키 | 플럭스, 솔더 페이스트 및 전자 회로 기판의 제조 방법 |
US11825612B2 (en) | 2017-08-28 | 2023-11-21 | Koki Company Limited | Flux, solder paste, and method for producing electric circuit board |
WO2020031693A1 (ja) * | 2018-08-10 | 2020-02-13 | 株式会社弘輝 | フラックス及びソルダペースト |
US11833622B2 (en) | 2018-08-10 | 2023-12-05 | Koki Company Limited | Flux and solder paste |
KR102690728B1 (ko) * | 2021-03-12 | 2024-08-05 | 센주긴조쿠고교 가부시키가이샤 | 플럭스 및 전자 디바이스의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
EP2221140A4 (en) | 2011-08-03 |
KR101142811B1 (ko) | 2012-05-08 |
EP2221140B1 (en) | 2013-09-25 |
TW200932413A (en) | 2009-08-01 |
EP2221140A1 (en) | 2010-08-25 |
US20100243717A1 (en) | 2010-09-30 |
KR20100034751A (ko) | 2010-04-01 |
CN101784365A (zh) | 2010-07-21 |
TWI370037B (ja) | 2012-08-11 |
JP5150912B2 (ja) | 2013-02-27 |
JPWO2009069601A1 (ja) | 2011-04-14 |
CN101784365B (zh) | 2012-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009069601A1 (ja) | はんだ付け用フラックス、はんだペースト組成物およびはんだ付け方法 | |
JP6191896B2 (ja) | 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト | |
WO2011076770A3 (en) | A solder paste composition, a solder paste and a soldering flux | |
WO2009069600A1 (ja) | はんだ付け用フラックスおよびはんだペースト組成物 | |
CN101966632B (zh) | 一种无铅低温焊膏用免洗型助焊剂及其制备方法 | |
CN100528462C (zh) | 用于SnAgCu系无铅焊膏的低松香免清洗助焊剂及其制备方法 | |
CN100479975C (zh) | 一种用于锡铅焊膏的低松香免清洗助焊剂及其制备方法 | |
WO2005091771A3 (en) | Solvent compositions for removing petroleum residue from a substrate and methods of use thereof | |
CN102703256B (zh) | 多功能水基清洗剂 | |
TW200633810A (en) | Lead-free solder flux and solder paste | |
EP2123636A4 (en) | PROCESS FOR THE PREPARATION OF AN AMINOACETYLPYRROLIDINECARBONITRILE DERIVATIVE | |
WO2006052664A3 (en) | Processes for preparation of oil compositions | |
WO2003072215A3 (en) | Methods and compositions for removing residues and substances from substrates using environmentally friendly solvents | |
TW200712267A (en) | Tin electroplating solution and tin electroplating method | |
MY159179A (en) | Epoxy resin composition and semiconductor device. | |
WO2009031663A1 (ja) | バインダー樹脂、ビヒクル組成物及び無機微粒子分散ペースト組成物 | |
TW200600975A (en) | Bilayer laminated film for bump formation and method of bump formation | |
TW200617116A (en) | Water-based, resin-free and solvent-free eradicable ball-pen inks | |
CN105127616A (zh) | 一种免洗助焊剂 | |
CN103122288A (zh) | 一种异性导电胶去除剂及其制备方法 | |
WO2009012058A3 (en) | Water-glycol hydraulic fluid compositions | |
CN102909493A (zh) | 一种助焊剂 | |
CN107363434A (zh) | 一种电路板贴片用助焊剂及其制备方法 | |
WO2009041592A1 (ja) | エポキシ化用酸化剤組成物及びその酸化方法 | |
CN104673538B (zh) | 一种含有副产萜烯的组件焊接后线路板清洗剂 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880103131.5 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08854783 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009543799 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20107001211 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12744206 Country of ref document: US Ref document number: 2008854783 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |