WO2009063906A1 - 貼合せ基板製造装置および貼合せ基板製造方法 - Google Patents

貼合せ基板製造装置および貼合せ基板製造方法 Download PDF

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Publication number
WO2009063906A1
WO2009063906A1 PCT/JP2008/070589 JP2008070589W WO2009063906A1 WO 2009063906 A1 WO2009063906 A1 WO 2009063906A1 JP 2008070589 W JP2008070589 W JP 2008070589W WO 2009063906 A1 WO2009063906 A1 WO 2009063906A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate manufacturing
bonding substrate
bonding
chamber
Prior art date
Application number
PCT/JP2008/070589
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Seiichi Sato
Mitsuru Yahagi
Hirofumi Minami
Kazuhiro Musha
Junpei Yuyama
Masao Murata
Takahiro Miyata
Kyuzo Nakamura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to KR1020107008156A priority Critical patent/KR101192683B1/ko
Priority to CN200880107159.6A priority patent/CN101801645B/zh
Priority to JP2009541155A priority patent/JP4955071B2/ja
Publication of WO2009063906A1 publication Critical patent/WO2009063906A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/JP2008/070589 2007-11-16 2008-11-12 貼合せ基板製造装置および貼合せ基板製造方法 WO2009063906A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107008156A KR101192683B1 (ko) 2007-11-16 2008-11-12 접합 기판 제조 장치 및 접합 기판 제조 방법
CN200880107159.6A CN101801645B (zh) 2007-11-16 2008-11-12 粘合基板制造装置和粘合基板制造方法
JP2009541155A JP4955071B2 (ja) 2007-11-16 2008-11-12 貼合せ基板製造装置および貼合せ基板製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007297704 2007-11-16
JP2007-297704 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063906A1 true WO2009063906A1 (ja) 2009-05-22

Family

ID=40638755

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070589 WO2009063906A1 (ja) 2007-11-16 2008-11-12 貼合せ基板製造装置および貼合せ基板製造方法

Country Status (5)

Country Link
JP (1) JP4955071B2 (zh)
KR (1) KR101192683B1 (zh)
CN (1) CN101801645B (zh)
TW (1) TW200941616A (zh)
WO (1) WO2009063906A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432011A1 (de) * 2010-09-15 2012-03-21 Uwe Beier Vorrichtung zur Behandlung und/oder Bearbeitung von Substraten
JP2013163592A (ja) * 2012-02-10 2013-08-22 Mm Tech Co Ltd 湿式処理装置
CN110036465A (zh) * 2016-11-30 2019-07-19 龙云株式会社 贴合装置
WO2022210857A1 (ja) * 2021-03-31 2022-10-06 ボンドテック株式会社 接合装置、接合システムおよび接合方法
WO2024009770A1 (ja) * 2022-07-04 2024-01-11 日本メクトロン株式会社 ワーク仮接着装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5852864B2 (ja) * 2011-11-28 2016-02-03 東芝機械株式会社 ワーク保持体、ワーク設置装置およびワーク設置方法
JP5961366B2 (ja) * 2011-11-28 2016-08-02 東芝機械株式会社 ワーク設置装置およびワーク設置方法
JP5798020B2 (ja) * 2011-12-01 2015-10-21 東芝機械株式会社 ワーク設置装置およびワーク設置方法
KR101380978B1 (ko) * 2011-12-09 2014-04-02 주식회사 탑 엔지니어링 합착장치
CN104128413B (zh) * 2014-08-04 2019-04-05 广德竹昌电子科技有限公司 一种热压治具
TWI699582B (zh) * 2015-07-01 2020-07-21 日商信越工程股份有限公司 貼合器件的製造裝置及製造方法
KR102307294B1 (ko) * 2017-07-21 2021-09-30 주식회사 엘지화학 원통형 셀 조립체의 프레스 및 비전 검사 통합 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2007212572A (ja) * 2006-02-07 2007-08-23 Ulvac Japan Ltd 貼合せ基板の製造方法、及び貼合せ基板製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (ja) * 1992-07-20 1994-02-08 Hitachi Ltd ホットプレス
JP2007212572A (ja) * 2006-02-07 2007-08-23 Ulvac Japan Ltd 貼合せ基板の製造方法、及び貼合せ基板製造装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432011A1 (de) * 2010-09-15 2012-03-21 Uwe Beier Vorrichtung zur Behandlung und/oder Bearbeitung von Substraten
JP2013163592A (ja) * 2012-02-10 2013-08-22 Mm Tech Co Ltd 湿式処理装置
CN110036465A (zh) * 2016-11-30 2019-07-19 龙云株式会社 贴合装置
WO2022210857A1 (ja) * 2021-03-31 2022-10-06 ボンドテック株式会社 接合装置、接合システムおよび接合方法
JP7156753B1 (ja) * 2021-03-31 2022-10-19 ボンドテック株式会社 接合装置、接合システムおよび接合方法
WO2024009770A1 (ja) * 2022-07-04 2024-01-11 日本メクトロン株式会社 ワーク仮接着装置

Also Published As

Publication number Publication date
KR101192683B1 (ko) 2012-10-19
CN101801645B (zh) 2013-04-10
JP4955071B2 (ja) 2012-06-20
TW200941616A (en) 2009-10-01
CN101801645A (zh) 2010-08-11
KR20100077165A (ko) 2010-07-07
JPWO2009063906A1 (ja) 2011-03-31

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