WO2009060934A1 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- WO2009060934A1 WO2009060934A1 PCT/JP2008/070283 JP2008070283W WO2009060934A1 WO 2009060934 A1 WO2009060934 A1 WO 2009060934A1 JP 2008070283 W JP2008070283 W JP 2008070283W WO 2009060934 A1 WO2009060934 A1 WO 2009060934A1
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- WO
- WIPO (PCT)
- Prior art keywords
- source
- drain
- section
- transistor
- semiconductor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
- H01L29/42392—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
- H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
複数のトランジスタを含むセルを複数備えた半導体装置であって、前記の各トランジスタは、基板上に設けられ当該基板の表面に対して垂直方向に電流が流れるチャネル部と、このチャネル部の下端側にあってソース及びドレインの一方となる下側ソース・ドレイン部と、前記チャネル部の上端側にあって前記ソース及びドレインの他方となる上側ソース・ドレイン部と、前記チャネル部上にゲート絶縁膜を介して設けられたゲート電極とを有し、前記上側ソース・ドレイン部は、当該トランジスタの上方に設けられた配線に接続され、前記下側ソース・ドレイン部は、当該トランジスタが含まれるセル内の他のトランジスタの下側ソース・ドレイン部に接続されている、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009540095A JP5503971B2 (ja) | 2007-11-07 | 2008-11-07 | 半導体装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007289933 | 2007-11-07 | ||
JP2007-289933 | 2007-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009060934A1 true WO2009060934A1 (ja) | 2009-05-14 |
Family
ID=40625820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070283 WO2009060934A1 (ja) | 2007-11-07 | 2008-11-07 | 半導体装置及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5503971B2 (ja) |
WO (1) | WO2009060934A1 (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009128450A1 (ja) * | 2008-04-16 | 2009-10-22 | 日本電気株式会社 | 半導体記憶装置 |
JP2010272874A (ja) * | 2010-06-29 | 2010-12-02 | Unisantis Electronics Japan Ltd | 半導体記憶装置 |
CN101908544A (zh) * | 2009-06-05 | 2010-12-08 | 日本优尼山帝斯电子株式会社 | 半导体器件 |
JP2010283351A (ja) * | 2010-06-04 | 2010-12-16 | Unisantis Electronics Japan Ltd | 半導体装置及びその製造方法 |
WO2011043402A1 (ja) * | 2009-10-06 | 2011-04-14 | 国立大学法人東北大学 | 半導体装置 |
WO2012098637A1 (ja) * | 2011-01-18 | 2012-07-26 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置とその製造方法 |
US8373235B2 (en) | 2009-05-22 | 2013-02-12 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor memory device and production method therefor |
WO2013057785A1 (ja) * | 2011-10-18 | 2013-04-25 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置 |
US8513717B2 (en) | 2011-01-18 | 2013-08-20 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device and method for manufacturing the same |
US8558317B2 (en) | 2009-08-11 | 2013-10-15 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method |
US8581333B2 (en) | 2008-04-16 | 2013-11-12 | Renesas Electronics Corporation | Semiconductor device and method for manufacturing the same |
US8642426B2 (en) | 2009-03-25 | 2014-02-04 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method therefor |
US8754481B2 (en) | 2011-10-18 | 2014-06-17 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device |
CN105023605A (zh) * | 2014-04-18 | 2015-11-04 | 台湾积体电路制造股份有限公司 | 绝缘体上半导体(soi)衬底上的垂直全环栅(vgaa)器件的连接结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02254752A (ja) * | 1989-03-29 | 1990-10-15 | Sony Corp | 半導体メモリ |
JPH0799311A (ja) * | 1993-05-12 | 1995-04-11 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH1079482A (ja) * | 1996-08-09 | 1998-03-24 | Rai Hai | 超高密度集積回路 |
US20010053089A1 (en) * | 1998-02-24 | 2001-12-20 | Micron Technology, Inc. | Circuits and methods for a static random access memory using vertical transistors |
JP2008205168A (ja) * | 2007-02-20 | 2008-09-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4064607B2 (ja) * | 2000-09-08 | 2008-03-19 | 株式会社東芝 | 半導体メモリ装置 |
JP2006310651A (ja) * | 2005-04-28 | 2006-11-09 | Toshiba Corp | 半導体装置の製造方法 |
-
2008
- 2008-11-07 WO PCT/JP2008/070283 patent/WO2009060934A1/ja active Application Filing
- 2008-11-07 JP JP2009540095A patent/JP5503971B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02254752A (ja) * | 1989-03-29 | 1990-10-15 | Sony Corp | 半導体メモリ |
JPH0799311A (ja) * | 1993-05-12 | 1995-04-11 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH1079482A (ja) * | 1996-08-09 | 1998-03-24 | Rai Hai | 超高密度集積回路 |
US20010053089A1 (en) * | 1998-02-24 | 2001-12-20 | Micron Technology, Inc. | Circuits and methods for a static random access memory using vertical transistors |
JP2008205168A (ja) * | 2007-02-20 | 2008-09-04 | Fujitsu Ltd | 半導体装置及びその製造方法 |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009128450A1 (ja) * | 2008-04-16 | 2009-10-22 | 日本電気株式会社 | 半導体記憶装置 |
US8692317B2 (en) | 2008-04-16 | 2014-04-08 | Nec Corporation | Semiconductor storage device |
US8581333B2 (en) | 2008-04-16 | 2013-11-12 | Renesas Electronics Corporation | Semiconductor device and method for manufacturing the same |
US8642426B2 (en) | 2009-03-25 | 2014-02-04 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method therefor |
US8373235B2 (en) | 2009-05-22 | 2013-02-12 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor memory device and production method therefor |
CN101908544A (zh) * | 2009-06-05 | 2010-12-08 | 日本优尼山帝斯电子株式会社 | 半导体器件 |
JP2010283181A (ja) * | 2009-06-05 | 2010-12-16 | Unisantis Electronics Japan Ltd | 半導体装置及びその製造方法 |
US8772881B2 (en) | 2009-06-05 | 2014-07-08 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device |
US8558317B2 (en) | 2009-08-11 | 2013-10-15 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method |
US9484268B2 (en) | 2009-08-11 | 2016-11-01 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method |
US9059309B2 (en) | 2009-08-11 | 2015-06-16 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor device and production method |
WO2011043402A1 (ja) * | 2009-10-06 | 2011-04-14 | 国立大学法人東北大学 | 半導体装置 |
JP2010283351A (ja) * | 2010-06-04 | 2010-12-16 | Unisantis Electronics Japan Ltd | 半導体装置及びその製造方法 |
JP2010272874A (ja) * | 2010-06-29 | 2010-12-02 | Unisantis Electronics Japan Ltd | 半導体記憶装置 |
US8513717B2 (en) | 2011-01-18 | 2013-08-20 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device and method for manufacturing the same |
CN102714182A (zh) * | 2011-01-18 | 2012-10-03 | 新加坡优尼山帝斯电子私人有限公司 | 半导体器件及其制造方法 |
WO2012098637A1 (ja) * | 2011-01-18 | 2012-07-26 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置とその製造方法 |
CN103250239A (zh) * | 2011-10-18 | 2013-08-14 | 新加坡优尼山帝斯电子私人有限公司 | 半导体器件 |
WO2013057785A1 (ja) * | 2011-10-18 | 2013-04-25 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置 |
JP5486735B2 (ja) * | 2011-10-18 | 2014-05-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置 |
US8754481B2 (en) | 2011-10-18 | 2014-06-17 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device |
CN105023605A (zh) * | 2014-04-18 | 2015-11-04 | 台湾积体电路制造股份有限公司 | 绝缘体上半导体(soi)衬底上的垂直全环栅(vgaa)器件的连接结构 |
Also Published As
Publication number | Publication date |
---|---|
JP5503971B2 (ja) | 2014-05-28 |
JPWO2009060934A1 (ja) | 2011-03-24 |
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