WO2009054705A3 - Matériau de transfert de type film - Google Patents

Matériau de transfert de type film Download PDF

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Publication number
WO2009054705A3
WO2009054705A3 PCT/KR2008/006318 KR2008006318W WO2009054705A3 WO 2009054705 A3 WO2009054705 A3 WO 2009054705A3 KR 2008006318 W KR2008006318 W KR 2008006318W WO 2009054705 A3 WO2009054705 A3 WO 2009054705A3
Authority
WO
WIPO (PCT)
Prior art keywords
transfer material
film type
film
exposure process
type photosensitive
Prior art date
Application number
PCT/KR2008/006318
Other languages
English (en)
Other versions
WO2009054705A2 (fr
Inventor
Hee Wan Moon
Seung Je Jho
Byeong Il Lee
Original Assignee
Kolon Inc
Hee Wan Moon
Seung Je Jho
Byeong Il Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc, Hee Wan Moon, Seung Je Jho, Byeong Il Lee filed Critical Kolon Inc
Priority to CN2008801126086A priority Critical patent/CN101836162B/zh
Priority to JP2010530935A priority patent/JP5483734B2/ja
Priority claimed from KR1020080104904A external-priority patent/KR101115162B1/ko
Publication of WO2009054705A2 publication Critical patent/WO2009054705A2/fr
Publication of WO2009054705A3 publication Critical patent/WO2009054705A3/fr
Priority to HK11100873.9A priority patent/HK1146751A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)

Abstract

L'invention concerne un matériau de transfert photosensible de type film comprenant un film de base, une couche protectrice de résine, une couche de résine photosensible et un film de revêtement, la couche protectrice de résine présentant une adhérence de 0,005 kgf /cm2 ou moins. Lorsqu'on applique le matériau de transfert photosensible sur une carte de circuit imprimé, on peut exécuter un processus d'exposition selon un état permettant de retirer le film de base et donc de réduire l'intervalle entre un masque et la couche de résine photosensible, ce qui permet d'améliorer la résolution d'un motif. Le matériau de transfert photosensible de type film permet de retirer le film de base avant l'exécution du processus d'exposition, peut être traité sous forme de feuilles et appliqué selon un procédé rouleau à rouleau.
PCT/KR2008/006318 2007-10-25 2008-10-24 Matériau de transfert de type film WO2009054705A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801126086A CN101836162B (zh) 2007-10-25 2008-10-24 薄膜型转印材料
JP2010530935A JP5483734B2 (ja) 2007-10-25 2008-10-24 フィルム型感光性転写材料
HK11100873.9A HK1146751A1 (en) 2007-10-25 2011-01-27 Film type transfer material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070107798 2007-10-25
KR10-2007-0107798 2007-10-25
KR1020080104904A KR101115162B1 (ko) 2007-10-25 2008-10-24 필름형 감광성 전사재료
KR10-2008-0104904 2008-10-24

Publications (2)

Publication Number Publication Date
WO2009054705A2 WO2009054705A2 (fr) 2009-04-30
WO2009054705A3 true WO2009054705A3 (fr) 2009-07-30

Family

ID=40580262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/006318 WO2009054705A2 (fr) 2007-10-25 2008-10-24 Matériau de transfert de type film

Country Status (1)

Country Link
WO (1) WO2009054705A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5551255B2 (ja) * 2009-09-28 2014-07-16 コーロン インダストリーズ インク ドライフィルムフォトレジスト
CN102549499B (zh) * 2009-09-30 2013-09-11 可隆工业株式会社 干膜光致抗蚀剂
CN110534647B (zh) * 2019-08-28 2023-12-26 云谷（固安）科技有限公司 柔性衬底、显示基板和显示面板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110010A (en) * 1976-03-12 1977-09-14 Unitika Ltd Method of preventing adhesion of photosensitive resin
EP0267807A2 (fr) * 1986-11-14 1988-05-18 Morton International, Inc. Laminé photosensible
JPH04371957A (ja) * 1991-06-21 1992-12-24 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム
JPH06242611A (ja) * 1993-02-19 1994-09-02 Hitachi Chem Co Ltd 感光性樹脂組成物積層体、レジストパターンの製造法、基板、プリント配線板の製造法、プリント配線板及び機器
JP2890770B2 (ja) * 1990-09-20 1999-05-17 東洋紡績株式会社 フレキソ印刷版用粘着防止層組成物
JP2001159817A (ja) * 1999-12-03 2001-06-12 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
WO2007125992A1 (fr) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation Stratifie de resine photosensible

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110010A (en) * 1976-03-12 1977-09-14 Unitika Ltd Method of preventing adhesion of photosensitive resin
EP0267807A2 (fr) * 1986-11-14 1988-05-18 Morton International, Inc. Laminé photosensible
JP2890770B2 (ja) * 1990-09-20 1999-05-17 東洋紡績株式会社 フレキソ印刷版用粘着防止層組成物
JPH04371957A (ja) * 1991-06-21 1992-12-24 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム
JPH06242611A (ja) * 1993-02-19 1994-09-02 Hitachi Chem Co Ltd 感光性樹脂組成物積層体、レジストパターンの製造法、基板、プリント配線板の製造法、プリント配線板及び機器
JP2001159817A (ja) * 1999-12-03 2001-06-12 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
WO2007125992A1 (fr) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation Stratifie de resine photosensible

Also Published As

Publication number Publication date
WO2009054705A2 (fr) 2009-04-30

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