JP2007150279A5 - - Google Patents

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Publication number
JP2007150279A5
JP2007150279A5 JP2006292296A JP2006292296A JP2007150279A5 JP 2007150279 A5 JP2007150279 A5 JP 2007150279A5 JP 2006292296 A JP2006292296 A JP 2006292296A JP 2006292296 A JP2006292296 A JP 2006292296A JP 2007150279 A5 JP2007150279 A5 JP 2007150279A5
Authority
JP
Japan
Prior art keywords
flexible film
reinforcing plate
circuit board
less
organic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006292296A
Other languages
English (en)
Japanese (ja)
Other versions
JP4973122B2 (ja
JP2007150279A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006292296A priority Critical patent/JP4973122B2/ja
Priority claimed from JP2006292296A external-priority patent/JP4973122B2/ja
Publication of JP2007150279A publication Critical patent/JP2007150279A/ja
Publication of JP2007150279A5 publication Critical patent/JP2007150279A5/ja
Application granted granted Critical
Publication of JP4973122B2 publication Critical patent/JP4973122B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006292296A 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法 Expired - Fee Related JP4973122B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006292296A JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005312473 2005-10-27
JP2005312473 2005-10-27
JP2006292296A JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2007150279A JP2007150279A (ja) 2007-06-14
JP2007150279A5 true JP2007150279A5 (fr) 2009-12-10
JP4973122B2 JP4973122B2 (ja) 2012-07-11

Family

ID=38211241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006292296A Expired - Fee Related JP4973122B2 (ja) 2005-10-27 2006-10-27 回路基板用部材および回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP4973122B2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6181984B2 (ja) * 2013-06-07 2017-08-16 東洋紡株式会社 高分子フィルム積層基板
CN103716995B (zh) * 2013-12-06 2017-01-04 深圳市东旭发自动化有限公司 一种补强板贴合机
JP2017518638A (ja) * 2014-05-13 2017-07-06 アリゾナ・ボード・オブ・リージェンツ・フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステイト・ユニバーシティＡｒｉｚｏｎａ Ｂｏａｒｄ Ｏｆ Ｒｅｇｅｎｔｓ Ｆｏｒ Ａｎｄ Ｏｎ Ｂｅｈａｌｆ Ｏｆ Ａｒｉｚｏｎａ Ｓｔａｔｅ Ｕｎｉｖｅｒｓｉｔｙ 電子デバイスを提供する方法およびその電子デバイス
CN112652242B (zh) * 2020-12-09 2022-08-23 深圳一鑫新材料有限公司 柔性曲面显示屏贴合工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58147713A (ja) * 1982-02-26 1983-09-02 Sharp Corp 液晶表示装置の製造方法
JPH0799379A (ja) * 1993-08-05 1995-04-11 Fujikura Ltd フレキシブル印刷配線板の製造方法
JP2002043253A (ja) * 2000-07-26 2002-02-08 Nec Corp 半導体素子のダイシング方法
JP4178869B2 (ja) * 2002-08-06 2008-11-12 東レ株式会社 回路基板用部材および回路基板の製造方法
JP3945341B2 (ja) * 2002-08-06 2007-07-18 東レ株式会社 回路基板用部材
JP2004319869A (ja) * 2003-04-18 2004-11-11 Toray Ind Inc 回路基板の製造方法
JP2007251080A (ja) * 2006-03-20 2007-09-27 Fujifilm Corp プラスチック基板の固定方法、回路基板およびその製造方法

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