JP2007157787A5 - - Google Patents
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- Publication number
- JP2007157787A5 JP2007157787A5 JP2005347120A JP2005347120A JP2007157787A5 JP 2007157787 A5 JP2007157787 A5 JP 2007157787A5 JP 2005347120 A JP2005347120 A JP 2005347120A JP 2005347120 A JP2005347120 A JP 2005347120A JP 2007157787 A5 JP2007157787 A5 JP 2007157787A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- adhesive member
- flexible substrate
- element forming
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 30
- 230000001070 adhesive Effects 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 27
- 230000015572 biosynthetic process Effects 0.000 claims 13
- 238000005755 formation reaction Methods 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005347120A JP5008299B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置の作製方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005347120A JP5008299B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007157787A JP2007157787A (ja) | 2007-06-21 |
JP2007157787A5 true JP2007157787A5 (fr) | 2008-12-18 |
JP5008299B2 JP5008299B2 (ja) | 2012-08-22 |
Family
ID=38241811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005347120A Expired - Fee Related JP5008299B2 (ja) | 2005-11-30 | 2005-11-30 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5008299B2 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8094027B2 (en) * | 2007-12-19 | 2012-01-10 | Abbott Laboratories | Method for molding an object containing a radio frequency identification tag |
WO2010035627A1 (fr) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteurs |
KR101357143B1 (ko) * | 2012-04-26 | 2014-02-04 | 하나 마이크론(주) | 집적회로 소자 패키지 제조를 위한 집적회로 소자의 전사 장치 및 방법 |
WO2014129519A1 (fr) | 2013-02-20 | 2014-08-28 | Semiconductor Energy Laboratory Co., Ltd. | Procédé de décollement, dispositif semi-conducteur, et appareil de décollement |
KR101449250B1 (ko) * | 2013-03-04 | 2014-10-10 | 한국과학기술원 | 롤러를 이용한 플렉서블 vlsi 제조방법 및 이에 의하여 제조된 플렉서블 vlsi |
US10586817B2 (en) | 2016-03-24 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and separation apparatus |
TWI669177B (zh) * | 2018-02-22 | 2019-08-21 | 東捷科技股份有限公司 | Wheel-to-wheel rolling welding equipment |
WO2020026878A1 (fr) * | 2018-07-31 | 2020-02-06 | 株式会社ハリーズ | Dispositif de montage de composant électronique et procédé de fabrication de corps avec composant électronique monté |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002236896A (ja) * | 2001-02-07 | 2002-08-23 | Toppan Printing Co Ltd | ヒートシール性を有するicタグ |
JP3956697B2 (ja) * | 2001-12-28 | 2007-08-08 | セイコーエプソン株式会社 | 半導体集積回路の製造方法 |
JP4215998B2 (ja) * | 2002-04-30 | 2009-01-28 | リンテック株式会社 | 半導体ウエハの処理方法およびそのための半導体ウエハの転写装置 |
JP4310685B2 (ja) * | 2003-09-03 | 2009-08-12 | セイコーエプソン株式会社 | 転写装置 |
JP5030388B2 (ja) * | 2004-03-22 | 2012-09-19 | 株式会社半導体エネルギー研究所 | 薄膜集積回路の作製方法 |
-
2005
- 2005-11-30 JP JP2005347120A patent/JP5008299B2/ja not_active Expired - Fee Related
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