WO2009051209A1 - Composition de résine - Google Patents

Composition de résine Download PDF

Info

Publication number
WO2009051209A1
WO2009051209A1 PCT/JP2008/068820 JP2008068820W WO2009051209A1 WO 2009051209 A1 WO2009051209 A1 WO 2009051209A1 JP 2008068820 W JP2008068820 W JP 2008068820W WO 2009051209 A1 WO2009051209 A1 WO 2009051209A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
printed wiring
flexible printed
wiring boards
disclosed
Prior art date
Application number
PCT/JP2008/068820
Other languages
English (en)
Japanese (ja)
Inventor
Osamu Yamabe
Mineo Nouchi
Junji Ohashi
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to CN200880112087.4A priority Critical patent/CN101827876B/zh
Priority to JP2009538155A priority patent/JP5392088B2/ja
Publication of WO2009051209A1 publication Critical patent/WO2009051209A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C08G18/581—Reaction products of epoxy resins with less than equivalent amounts of compounds containing active hydrogen added before or during the reaction with the isocyanate component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C08G18/698—Mixtures with compounds of group C08G18/40
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

Cette invention concerne une composition de résine qui est excellente en termes de résistance aux solvants, flexibilité (aptitude au cintrage), basse propriété de gauchissement, et isolation électrique. Elle est utile à titre d'agent de revêtement de protection pour cartes de circuits imprimés souples. L'invention concerne, plus spécifiquement, une composition de résine pour revêtements de protection de cartes de circuits imprimés souples, qui contient une résine polyuréthane (A) contenant un groupe époxy et une structure uréthanne, et un agent de durcissement époxy (B).
PCT/JP2008/068820 2007-10-18 2008-10-17 Composition de résine WO2009051209A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880112087.4A CN101827876B (zh) 2007-10-18 2008-10-17 树脂组合物
JP2009538155A JP5392088B2 (ja) 2007-10-18 2008-10-17 樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271600 2007-10-18
JP2007271600 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051209A1 true WO2009051209A1 (fr) 2009-04-23

Family

ID=40567470

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068820 WO2009051209A1 (fr) 2007-10-18 2008-10-17 Composition de résine

Country Status (5)

Country Link
JP (1) JP5392088B2 (fr)
KR (1) KR101473208B1 (fr)
CN (1) CN101827876B (fr)
TW (1) TWI453253B (fr)
WO (1) WO2009051209A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102344A (ja) * 2009-11-10 2011-05-26 Three M Innovative Properties Co 一液型エポキシ樹脂組成物及びそれを用いた接着方法
JPWO2011004756A1 (ja) * 2009-07-06 2012-12-20 昭和電工株式会社 配線板の保護膜用熱硬化性組成物
JP2013224373A (ja) * 2012-04-23 2013-10-31 Ajinomoto Co Inc 樹脂組成物
JP2017226717A (ja) * 2016-06-20 2017-12-28 Dic株式会社 ポリカーボネート変性エポキシ樹脂及び接着剤
WO2019163577A1 (fr) * 2018-02-20 2019-08-29 Dic株式会社 Composition durcissable et matériau composite renforcé par des fibres
WO2021024893A1 (fr) * 2019-08-06 2021-02-11 Dic株式会社 Composition durcissable, objet durci, matériau composite renforcé par des fibres, et article moulé
CN114341220A (zh) * 2019-08-30 2022-04-12 光学转变有限公司 具有多元醇和聚(酸酐)的光致变色组合物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014194303A1 (fr) * 2013-05-31 2014-12-04 Cytec Industries, Inc. Compositions de résine de polyuréthanne formulée pour le vernissage en pleine surface d'ensembles de circuits électroniques

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05155982A (ja) * 1991-02-28 1993-06-22 Japan Synthetic Rubber Co Ltd 導電性エラストマー用組成物
JPH1161037A (ja) * 1997-08-14 1999-03-05 Ajinomoto Co Inc フレキシブル回路オーバーコート用樹脂組成物
JPH1171551A (ja) * 1997-08-29 1999-03-16 Ajinomoto Co Inc フレキシブル回路オーバーコート用樹脂組成物
JP2000186248A (ja) * 1998-10-15 2000-07-04 Ajinomoto Co Inc フレキシブル回路オ―バ―コ―ト用樹脂組成物
JP2006137943A (ja) * 2004-10-15 2006-06-01 Ajinomoto Co Inc 樹脂組成物
JP2007084652A (ja) * 2005-09-21 2007-04-05 Showa Denko Kk オーバーコート用樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06100806A (ja) * 1992-09-21 1994-04-12 Kansai Paint Co Ltd 電着塗料組成物
CN1087758C (zh) * 1997-05-11 2002-07-17 化学工业部海洋涂料研究所 防空泡腐蚀涂料
US20020061970A1 (en) * 2000-09-14 2002-05-23 Hidenori Sawada Resin composition for coating material
KR101271989B1 (ko) * 2005-03-28 2013-06-05 우베 고산 가부시키가이샤 폴리이미드 수지 및 경화성 수지 조성물
KR20080038238A (ko) * 2005-08-24 2008-05-02 다이셀 가가꾸 고교 가부시끼가이샤 폴리에스테르 폴리올 및 폴리우레탄계 수지

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05155982A (ja) * 1991-02-28 1993-06-22 Japan Synthetic Rubber Co Ltd 導電性エラストマー用組成物
JPH1161037A (ja) * 1997-08-14 1999-03-05 Ajinomoto Co Inc フレキシブル回路オーバーコート用樹脂組成物
JPH1171551A (ja) * 1997-08-29 1999-03-16 Ajinomoto Co Inc フレキシブル回路オーバーコート用樹脂組成物
JP2000186248A (ja) * 1998-10-15 2000-07-04 Ajinomoto Co Inc フレキシブル回路オ―バ―コ―ト用樹脂組成物
JP2006137943A (ja) * 2004-10-15 2006-06-01 Ajinomoto Co Inc 樹脂組成物
JP2007084652A (ja) * 2005-09-21 2007-04-05 Showa Denko Kk オーバーコート用樹脂組成物

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011004756A1 (ja) * 2009-07-06 2012-12-20 昭和電工株式会社 配線板の保護膜用熱硬化性組成物
JP2011102344A (ja) * 2009-11-10 2011-05-26 Three M Innovative Properties Co 一液型エポキシ樹脂組成物及びそれを用いた接着方法
CN102666722A (zh) * 2009-11-10 2012-09-12 3M创新有限公司 单组分型液态环氧树脂组合物及使用其的粘合方法
JP2013224373A (ja) * 2012-04-23 2013-10-31 Ajinomoto Co Inc 樹脂組成物
JP2017226717A (ja) * 2016-06-20 2017-12-28 Dic株式会社 ポリカーボネート変性エポキシ樹脂及び接着剤
WO2019163577A1 (fr) * 2018-02-20 2019-08-29 Dic株式会社 Composition durcissable et matériau composite renforcé par des fibres
JP6593573B1 (ja) * 2018-02-20 2019-10-23 Ｄｉｃ株式会社 硬化性組成物及び繊維強化複合材料
WO2021024893A1 (fr) * 2019-08-06 2021-02-11 Dic株式会社 Composition durcissable, objet durci, matériau composite renforcé par des fibres, et article moulé
JPWO2021024893A1 (ja) * 2019-08-06 2021-09-13 Dic株式会社 硬化性組成物、硬化物、繊維強化複合材料及び成形品
CN114341220A (zh) * 2019-08-30 2022-04-12 光学转变有限公司 具有多元醇和聚(酸酐)的光致变色组合物
JP2022552072A (ja) * 2019-08-30 2022-12-15 トランジションズ オプティカル リミテッド ポリオールとポリ（無水物）とを含むフォトクロミック組成物
JP7466629B2 (ja) 2019-08-30 2024-04-12 トランジションズ オプティカル リミテッド ポリオールとポリ（無水物）とを含むフォトクロミック組成物

Also Published As

Publication number Publication date
JPWO2009051209A1 (ja) 2011-03-03
JP5392088B2 (ja) 2014-01-22
TWI453253B (zh) 2014-09-21
CN101827876B (zh) 2012-12-05
TW200932830A (en) 2009-08-01
KR101473208B1 (ko) 2014-12-16
KR20100076016A (ko) 2010-07-05
CN101827876A (zh) 2010-09-08

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