WO2009051209A1 - Resin composition - Google Patents

Resin composition Download PDF

Info

Publication number
WO2009051209A1
WO2009051209A1 PCT/JP2008/068820 JP2008068820W WO2009051209A1 WO 2009051209 A1 WO2009051209 A1 WO 2009051209A1 JP 2008068820 W JP2008068820 W JP 2008068820W WO 2009051209 A1 WO2009051209 A1 WO 2009051209A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
printed wiring
flexible printed
wiring boards
disclosed
Prior art date
Application number
PCT/JP2008/068820
Other languages
French (fr)
Japanese (ja)
Inventor
Osamu Yamabe
Mineo Nouchi
Junji Ohashi
Original Assignee
Ajinomoto Co., Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co., Inc. filed Critical Ajinomoto Co., Inc.
Priority to JP2009538155A priority Critical patent/JP5392088B2/en
Priority to CN200880112087.4A priority patent/CN101827876B/en
Publication of WO2009051209A1 publication Critical patent/WO2009051209A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C08G18/581—Reaction products of epoxy resins with less than equivalent amounts of compounds containing active hydrogen added before or during the reaction with the isocyanate component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C08G18/698—Mixtures with compounds of group C08G18/40
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Abstract

Disclosed is a resin composition which is excellent in solvent resistance, flexibility (bendability), low warping property, and electrical insulation. This resin composition is useful as an overcoating agent for flexible printed wiring boards. Specifically disclosed is a resin composition for overcoats of flexible printed wiring boards, which contains a polyurethane resin (A) having an epoxy group and a urethane structure, and an epoxy curing agent (B).
PCT/JP2008/068820 2007-10-18 2008-10-17 Resin composition WO2009051209A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009538155A JP5392088B2 (en) 2007-10-18 2008-10-17 Resin composition
CN200880112087.4A CN101827876B (en) 2007-10-18 2008-10-17 Resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271600 2007-10-18
JP2007271600 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051209A1 true WO2009051209A1 (en) 2009-04-23

Family

ID=40567470

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068820 WO2009051209A1 (en) 2007-10-18 2008-10-17 Resin composition

Country Status (5)

Country Link
JP (1) JP5392088B2 (en)
KR (1) KR101473208B1 (en)
CN (1) CN101827876B (en)
TW (1) TWI453253B (en)
WO (1) WO2009051209A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011102344A (en) * 2009-11-10 2011-05-26 Three M Innovative Properties Co One-pack type liquid epoxy resin composition and adhesion method using the same
JPWO2011004756A1 (en) * 2009-07-06 2012-12-20 昭和電工株式会社 Thermosetting composition for protective film of wiring board
JP2013224373A (en) * 2012-04-23 2013-10-31 Ajinomoto Co Inc Resin composition
JP2017226717A (en) * 2016-06-20 2017-12-28 Dic株式会社 Polycarbonate-modified epoxy resin and adhesive
WO2019163577A1 (en) * 2018-02-20 2019-08-29 Dic株式会社 Curable composition and fiber reinforced composite material
WO2021024893A1 (en) * 2019-08-06 2021-02-11 Dic株式会社 Curable composition, cured product, fiber-reinforced composite material, and molded article
CN114341220A (en) * 2019-08-30 2022-04-12 光学转变有限公司 Photochromic compositions with polyols and poly (anhydrides)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2015016482A (en) * 2013-05-31 2016-06-21 Cytec Ind Inc Formulated polyurethane resin compositions for flood coating electronic circuit assemblies.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05155982A (en) * 1991-02-28 1993-06-22 Japan Synthetic Rubber Co Ltd Conductive elastomer composition
JPH1161037A (en) * 1997-08-14 1999-03-05 Ajinomoto Co Inc Resin composition for flexible circuit overcoat
JPH1171551A (en) * 1997-08-29 1999-03-16 Ajinomoto Co Inc Resin composition for flexible circuit overcoating
JP2000186248A (en) * 1998-10-15 2000-07-04 Ajinomoto Co Inc Resin composition for flexible circuit over-coating
JP2006137943A (en) * 2004-10-15 2006-06-01 Ajinomoto Co Inc Resin composition
JP2007084652A (en) * 2005-09-21 2007-04-05 Showa Denko Kk Resin composition for overcoating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06100806A (en) * 1992-09-21 1994-04-12 Kansai Paint Co Ltd Electrodeposition coating composition
CN1087758C (en) * 1997-05-11 2002-07-17 化学工业部海洋涂料研究所 Cavitation erosion preventing paint
US20020061970A1 (en) * 2000-09-14 2002-05-23 Hidenori Sawada Resin composition for coating material
JP5135698B2 (en) * 2005-03-28 2013-02-06 宇部興産株式会社 Modified polyimide resin containing polycarbonate, composition thereof and cured insulating film
EP1921101A4 (en) * 2005-08-24 2010-08-25 Daicel Chem Polyester polyol and polyurethane resin

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05155982A (en) * 1991-02-28 1993-06-22 Japan Synthetic Rubber Co Ltd Conductive elastomer composition
JPH1161037A (en) * 1997-08-14 1999-03-05 Ajinomoto Co Inc Resin composition for flexible circuit overcoat
JPH1171551A (en) * 1997-08-29 1999-03-16 Ajinomoto Co Inc Resin composition for flexible circuit overcoating
JP2000186248A (en) * 1998-10-15 2000-07-04 Ajinomoto Co Inc Resin composition for flexible circuit over-coating
JP2006137943A (en) * 2004-10-15 2006-06-01 Ajinomoto Co Inc Resin composition
JP2007084652A (en) * 2005-09-21 2007-04-05 Showa Denko Kk Resin composition for overcoating

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011004756A1 (en) * 2009-07-06 2012-12-20 昭和電工株式会社 Thermosetting composition for protective film of wiring board
JP2011102344A (en) * 2009-11-10 2011-05-26 Three M Innovative Properties Co One-pack type liquid epoxy resin composition and adhesion method using the same
CN102666722A (en) * 2009-11-10 2012-09-12 3M创新有限公司 One-pack type liquid epoxy resin composition and adhesion method using same
JP2013224373A (en) * 2012-04-23 2013-10-31 Ajinomoto Co Inc Resin composition
JP2017226717A (en) * 2016-06-20 2017-12-28 Dic株式会社 Polycarbonate-modified epoxy resin and adhesive
WO2019163577A1 (en) * 2018-02-20 2019-08-29 Dic株式会社 Curable composition and fiber reinforced composite material
JP6593573B1 (en) * 2018-02-20 2019-10-23 Ｄｉｃ株式会社 Curable composition and fiber reinforced composite material
WO2021024893A1 (en) * 2019-08-06 2021-02-11 Dic株式会社 Curable composition, cured product, fiber-reinforced composite material, and molded article
JPWO2021024893A1 (en) * 2019-08-06 2021-09-13 Dic株式会社 Curable composition, cured product, fiber reinforced composite material and molded product
CN114341220A (en) * 2019-08-30 2022-04-12 光学转变有限公司 Photochromic compositions with polyols and poly (anhydrides)
JP2022552072A (en) * 2019-08-30 2022-12-15 トランジションズ オプティカル リミテッド Photochromic composition comprising polyol and poly(anhydride)
JP7466629B2 (en) 2019-08-30 2024-04-12 トランジションズ オプティカル リミテッド Photochromic Compositions Comprising Polyols and Poly(anhydrides)

Also Published As

Publication number Publication date
KR20100076016A (en) 2010-07-05
TW200932830A (en) 2009-08-01
CN101827876A (en) 2010-09-08
TWI453253B (en) 2014-09-21
JP5392088B2 (en) 2014-01-22
KR101473208B1 (en) 2014-12-16
JPWO2009051209A1 (en) 2011-03-03
CN101827876B (en) 2012-12-05

Similar Documents

Publication Publication Date Title
WO2009051209A1 (en) Resin composition
TWI365886B (en) Epoxy resin composition, prepreg, laminate, and printed wiring board
EP2194098A4 (en) Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
AU2003211733A1 (en) Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
WO2008126411A1 (en) Epoxy resin composition, prepreg, laminate, multilayer printed wiring board, semiconductor device, insulating resin sheet, and method for manufacturing multilayer printed wiring board
TWI346127B (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board
HK1165816A1 (en) Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
HK1104755A1 (en) Flexible printed wiring board terminal part or flexible flat cable terminal part
EP1997843A4 (en) Heat curable resin composition, overcoating agent for flexible circuit board, and surface protective film
TWI350716B (en) High thermal conductivity, halogen-free flame-retardent resin composition and its pre-impregnated and coating materials for printed circuit boards
EP2554561A4 (en) Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
EP2343327A4 (en) Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same
HK1163725A1 (en) Thermosetting resin composition, and varnish, prepreg and metal clad laminated board using the same
TW200733824A (en) Wiring circuit board
EP2049612A4 (en) Two component solventless polyurethane laminating adhesives based on 1,4:3,6 dianhydrohexitols
EP2141198A4 (en) Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
EP2562195A4 (en) Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
TWI315658B (en) Warp-proof circuit board structure
WO2009019968A1 (en) Multilayer polyimide film, laminate and metal-clad laminate
EP2135885A4 (en) Resin composition for forming insulating layer of printed wiring board
EP1928218A4 (en) Flexible printed wiring board and method for manufacturing same
EP2046103A4 (en) Flexible printed board, electronic device mounted with this, and flexible printed board folding method
TWI351209B (en) Electronic apparatus and flexible printed circuit board thereof
WO2008143058A1 (en) Copper foil with resin layer
WO2008111489A1 (en) Fire-retardant adhesive resin composition, and adhesive film using the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880112087.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08839689

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009538155

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107010323

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08839689

Country of ref document: EP

Kind code of ref document: A1